Modular heat sink for satellite and artificial satellite

Abstract

The present invention relates to the field of satellite heat dissipation technology, and provides a modular heat dissipation device and an artificial satellite applied to a satellite. The modular heat dissipation device applied to a satellite includes a heat collecting plate, a plurality of heat pipes, an electromagnetic pump and a plurality of heat dissipation plates, one side of the heat collecting plate is used to contact with the heat source of the satellite; the plurality of heat pipes are arranged in an array, and each two adjacent heat pipes are detachably connected, each heat pipe has an evaporation end and a condensation end, the evaporation end is connected to the heat collecting plate, liquid metal is contained in the heat pipe, and an axially through steam flow channel and condensation flow channel are provided in the heat pipe, the liquid metal evaporates into gas at the evaporation end and reaches the condensation end along the steam flow channel, the liquid metal condenses into liquid at the condensation end and reaches the evaporation end along the condensation flow channel; the electromagnetic pump is connected to the heat pipe, and the electromagnetic pump is used to drive the liquid metal in the heat pipe to flow; the plurality of heat dissipation plates are connected to each other to enclose around the plurality of heat pipes. By freely increasing or decreasing the number of heat pipes to correspond to different satellite products, the adaptability is improved.

Description

Technical Field

[0001] The present invention relates to the field of satellite heat dissipation technology, and in particular to a modular heat dissipation device applied to a satellite and an artificial satellite. Background Art

[0002] With the rapid development of aerospace technology, the requirements for satellite functions and performance are constantly increasing. Satellites are developing in the direction of high functional density, high payload ratio, multi-task and multi-mode. Limited by size and weight, the integrated design of satellite payload and platform has become a development trend. In addition, in order to meet the needs of high-efficiency missions, satellites need to work continuously for a long time, which leads to increased power consumption of satellite equipment and more prominent heat dissipation problems, which brings challenges to the thermal design of satellite platforms.

[0003] Traditional satellite heat dissipation design mainly adopts a combination of passive heat dissipation and active temperature control. For example, thermal management is achieved by arranging heat dissipation surfaces, radiation panels, and temperature control loops. However, these traditional designs have significant limitations under different temperature conditions. Under high temperature conditions, although the satellite radiation panels can dissipate heat, the heat dissipation efficiency is limited, which often makes it difficult to control the temperature of the equipment within a safe range, resulting in overheating problems; under low temperature conditions, the traditional temperature control system needs to start the heating loop to maintain the temperature of the equipment, which not only increases power consumption, but also significantly reduces energy utilization efficiency. These problems directly affect the operational stability and mission execution capabilities of the satellite, especially in long-term high-power operation missions, where heat dissipation design becomes a key factor affecting the life and performance of the satellite.

[0004] In the related art, the heat dissipation surface areas of different satellite products vary greatly, and the adaptability of satellite radiators to different satellite products is poor. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the related art. To this end, the present invention proposes a modular heat dissipation device applied to a satellite, aiming to improve the adaptability of the heat dissipation device.

[0006] The invention also provides an artificial satellite.

[0007] A modular heat dissipation device for a satellite according to an embodiment of the first aspect of the present invention comprises:

[0008] A heat collecting plate, one side of which is used to contact with a heat source of the satellite;

[0009] A plurality of heat pipes, wherein the plurality of heat pipes are arranged in an array, and each two adjacent heat pipes are detachably connected, and each heat pipe has an evaporation end and a condensation end, wherein the evaporation end is connected to the heat collecting plate, and liquid metal is contained in the heat pipe, and an axially penetrating steam flow channel and condensation flow channel are provided in the heat pipe, wherein the liquid metal evaporates into a gaseous state at the evaporation end and reaches the condensation end along the steam flow channel, and wherein the liquid metal condenses into a liquid state at the condensation end and reaches the evaporation end along the condensation flow channel;

[0010] An electromagnetic pump, the electromagnetic pump is connected to the heat pipe, and the electromagnetic pump is used to drive the liquid metal in the heat pipe to flow;

[0011] A plurality of heat dissipation plates are connected to each other to surround the plurality of heat pipes.

[0012] According to the modular heat dissipation device applied to satellites according to the embodiment of the present invention, the heat emitted by the satellite is received through the heat collecting plate, and the heat is transferred to the surrounding multiple heat dissipation plates through multiple heat pipes for heat dissipation. The evaporation end of the heat pipe is connected to the heat collecting plate, and liquid metal flows in the heat pipe. When the liquid metal in the heat pipe evaporates into a gaseous state at the evaporation end, heat is absorbed by the heat collecting plate. The liquid metal in the gaseous state reaches the condensation end along the steam flow channel, and is condensed into a liquid state. The electromagnetic pump can drive the liquid metal to flow, so that the liquid metal is recycled. The heat pipe can dissipate heat to the surroundings through multiple heat dissipation plates to achieve a good heat dissipation effect. Multiple heat pipe arrays are arranged and detachably connected to form a modular heat dissipation device. The number of heat pipes can be freely increased or decreased to correspond to different satellite products, thereby improving adaptability.

[0013] According to an embodiment of the present invention, every two adjacent heat pipes are connected to the steam flow channel via a connecting pipe, so as to realize the flow of steam by utilizing the pressure difference caused by the temperature difference between them.

[0014] According to one embodiment of the present invention, the modular heat dissipation device applied to a satellite includes a control unit and a plurality of first temperature sensors, the plurality of first temperature sensors are distributed in a plurality of steam flow channels and are communicatively connected to the control unit, the control unit is communicatively connected to the electromagnetic pump, and the control unit controls the start or stop of the electromagnetic pump according to signals from the plurality of first temperature sensors.

[0015] According to one embodiment of the present invention, the modular heat dissipation device applied to the satellite includes multiple second temperature sensors, and the multiple second temperature sensors are distributed at multiple positions of the thermal collector plate. The control unit receives signals from the second temperature sensors and adjusts the working state of the modular heat dissipation device applied to the satellite according to a preset temperature threshold.

[0016] According to one embodiment of the present invention, the plurality of heat dissipation plates include a base plate and a plurality of enclosures, the base plate being disposed at one end of the plurality of heat pipes away from the heat collecting plate, the plurality of enclosures being disposed around the periphery of the base plate, one side of each enclosure being rotatably connected to one side of the base plate via an unfolding mechanism, and the plurality of enclosures surround the plurality of heat pipes.

[0017] According to an embodiment of the present invention, a surface of the heat dissipation plate is coated with a heat dissipation coating.

[0018] According to one embodiment of the present invention, a liquid reservoir is provided in the steam flow channel adjacent to the condensation end.

[0019] According to one embodiment of the present invention, the liquid metal is sodium or sodium-potassium alloy;

[0020] And / or, the outer tube of the heat pipe is an aluminum tube or a copper tube.

[0021] According to one embodiment of the present invention, the heat pipe comprises: a tube shell and a liquid wick;

[0022] The wick and the liquid metal are arranged in the tube shell, the wick is formed with the steam flow channel penetrating along the axial direction of the tube shell, the wick comprises a first sintered wick, a micro-groove wick and a second sintered wick connected in sequence along the axial direction of the tube shell, and is formed with the condensation flow channel;

[0023] The first sintered liquid absorbent core and the second sintered liquid absorbent core both include a plurality of metal copper meshes sequentially sleeved from the inside to the outside; the micro-groove liquid absorbent core includes a plurality of liquid absorption channels extending along the axial direction of the tube shell, and the inner wall of the liquid absorption channel is provided with a groove structure extending along the axial direction of the tube shell;

[0024] The liquid metal can reach the evaporation end along the second sintered wick, the micro-groove wick and the first sintered wick in sequence.

[0025] According to an embodiment of the second aspect of the present invention, an artificial satellite comprises a satellite body and the above-mentioned modular heat dissipation device applied to the satellite, wherein the modular heat dissipation device applied to the satellite is arranged on the satellite body.

[0026] The artificial satellite according to the embodiment of the present invention includes the above-mentioned modular heat dissipation device applied to the satellite, and therefore has all the technical effects of the above-mentioned modular heat dissipation device applied to the satellite, which will not be repeated here.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a schematic diagram of the structure of a modular heat dissipation device applied to a satellite provided by an embodiment of the present invention.

[0030] Figure 2 It is a schematic diagram of the structure of multiple heat pipes provided in an embodiment of the present invention.

[0031] Figure 3 It is a schematic diagram of the flow direction of liquid metal in a heat pipe provided by an embodiment of the present invention.

[0032] Figure 4 It is a structural schematic diagram of the heat pipe provided by the present invention.

[0033] Figure 5 It is a schematic diagram of the cross-sectional structure of the liquid absorbent core provided by the present invention.

[0034] Figure 6 It is a schematic structural diagram of a single-piece metal copper mesh provided by the present invention.

[0035] Figure 7 It is a schematic structural diagram of a single liquid pipette provided by the present invention.

[0036] Reference numerals:

[0037] 1. Tube shell; 2. Liquid wick; 21. First sintered liquid wick; 22. Micro-groove liquid wick; 23. Second sintered liquid wick; 20. Steam flow channel; 201. Evaporation end; 202. Condensation end; 211. Metal copper mesh; 221. Liquid pipe; 2211. Liquid wick flow channel; 2212. Groove structure; 7. Heat collecting plate; 8. Heat dissipation plate; 9. Heat pipe; 94. Condensation flow channel. DETAILED DESCRIPTION

[0038] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0039] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0040] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0041] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0043] Heat dissipation solutions include liquid cooling systems, heat pipe systems, and phase change materials. However, as satellite power continues to increase, the limitations of these solutions are becoming increasingly apparent. For example, although the liquid cooling system improves heat dissipation efficiency to a certain extent, its complex pipeline design increases the weight and volume of the satellite system; although traditional heat pipes have high thermal conductivity, the heat dissipation effect is often not ideal when facing extreme high temperature conditions; although phase change materials can absorb heat within a specific temperature range, when the heat load continues to increase, the heat storage capacity of the material may quickly saturate, resulting in a decrease in the heat dissipation effect.

[0044] In order to achieve a more efficient and stable thermal control system, new heat dissipation technologies are explored and developed, such as heat pipes, deployable modular heat dissipation devices, etc. The application of these technologies will effectively solve the problems of high and low temperature conditions in satellite thermal management, improve energy utilization efficiency, extend the service life of satellites, and provide stronger technical support for future space missions.

[0045] like Figure 1 and Figure 2 As shown, a modular heat dissipation device applied to a satellite according to an embodiment of the first aspect of the present invention includes a heat collecting plate 7, a plurality of heat pipes 9, an electromagnetic pump and a plurality of heat dissipation plates 8, one side of the heat collecting plate 7 is used to contact the heat source of the satellite; the plurality of heat pipes 9 are arranged in an array, and every two adjacent heat pipes 9 are detachably connected, each heat pipe 9 has an evaporation end 201 and a condensation end 202, the evaporation end 201 is connected to the heat collecting plate 7, liquid metal is contained in the heat pipe 9, and an axially through steam flow channel 20 and a condensation flow channel 94 are provided in the heat pipe 9, the liquid metal evaporates into a gaseous state at the evaporation end 201, and reaches the condensation end 202 along the steam flow channel 20, the liquid metal condenses into a liquid state at the condensation end 202, and reaches the evaporation end 201 along the condensation flow channel 94; the electromagnetic pump is connected to the heat pipe 9, and the electromagnetic pump is used to drive the liquid metal in the heat pipe 9 to flow; the plurality of heat dissipation plates 8 are connected to each other to enclose the plurality of heat pipes 9.

[0046] According to the modular heat dissipation device applied to the satellite of the embodiment of the present invention, the heat emitted by the satellite is received through the heat collecting plate 7, and the heat is transferred to the surrounding multiple heat dissipation plates 8 through multiple heat pipes 9 for heat dissipation. The evaporation end 201 of the heat pipe 9 is connected to the heat collecting plate 7, and liquid metal flows in the heat pipe 9. When the liquid metal in the heat pipe 9 evaporates into a gaseous state at the evaporation end 201, heat absorption of the heat collecting plate 7 is realized. The liquid metal in the gaseous state reaches the condensation end 202 along the steam flow channel 20, thereby condensing into a liquid state. The electromagnetic pump can drive the liquid metal to flow, so that the liquid metal is recycled. The heat pipe 9 can dissipate the heat to the surrounding through multiple heat dissipation plates 8 to achieve a good heat dissipation effect. Multiple heat pipes 9 are arranged in an array and can be detachably connected to form a modular heat dissipation device. The number of heat pipes 9 can be freely increased or decreased to correspond to different satellite products, thereby improving adaptability. The advantage of the modular heat dissipation device is that it can be customized and expanded according to different heat sources and heat dissipation requirements, and different heat dissipation requirements can be adapted by increasing or decreasing modules, thereby improving the flexibility and efficiency of the heat dissipation system. This design is particularly important in space-constrained environments such as satellites, as it allows for efficient thermal management while remaining within satellite size and weight limits.

[0047] In this embodiment, heat pipe technology has become a potential solution in the heat dissipation design of future high-power satellites because of its excellent thermal conductivity and wide operating temperature range. The high thermal conductivity of liquid metal enables it to quickly transfer heat from the device to the condenser, thereby achieving more efficient heat dissipation. In addition, modular and expandable heat dissipation structure designs are also gradually being applied to satellites to provide a larger heat dissipation surface without increasing the size and weight of the satellite, thereby improving the overall heat dissipation efficiency. Through the optimized design of different evaporator and condenser combinations, these new heat dissipation technologies are expected to play an important role in high-power, high-mission density satellites, ensuring the reliable operation of satellites under different working conditions.

[0048] It should be noted that a plurality of heat pipes 9 are parallel to each other and arranged to form an array structure, and their side walls can be detachably connected to each other by connectors, such as snap connections, bolt connections, etc., which are not limited here. In this way, the evaporation ends 201 of the plurality of heat pipes 9 are aligned so as to be simultaneously connected to the heat collecting plate 7. Exemplarily, a steam flow channel 20 and a condensation flow channel 94 extending in the axial direction are respectively provided in the heat pipe 9, and the two ends of the steam flow channel 20 and the condensation flow channel 94 are connected so that the liquid metal can circulate, and the condensation flow channel 94 can be arranged around the steam flow channel 20. In one embodiment, the heat pipe 9 adopts a porous core pore structure, and the condensation flow channel 94 is composed of a plurality of irregular pores, and the plurality of irregular pores penetrate the axial direction of the heat pipe 9, and a single layer of surrounding steam flow channel 20 or a plurality of layers of surrounding steam flow channel 20 can be formed. The heat pipe 9 can be cylindrical or hexagonal, which is not limited here, wherein the hexagonal prism type is convenient for distinguishing the orientation of the heat pipe 9, so as to facilitate installation at corresponding positions between two heat pipes 9.

[0049] Optionally, an evaporator is provided at the evaporation end 201, a condenser is provided at the condensation end 202, and a liquid reservoir is provided. The heat absorbed by the evaporator provides a starting heat source for the heat pipe 9. After absorbing the heat, the liquid metal flows into the condenser. After the condenser discharges the heat, the liquid metal flows back to the liquid reservoir, completing a cycle, and the cycle starts again under the promotion of the evaporator, thereby realizing the collection and dissipation of heat from the heat source.

[0050] Please refer to Figure 2 and Figure 3 According to one embodiment of the present invention, every two adjacent heat pipes 9 are connected to the steam flow channel 20 through a connecting pipe, so as to realize the flow of steam by utilizing the pressure difference caused by the temperature difference between them. It can be understood that the connecting pipe runs through the heat pipe 9 and is connected to the steam flow channel 20, so that the liquid metal in the gaseous state in the steam flow channel 20 can be transferred to other heat pipes 9, so that the power for the liquid metal to flow in the heat pipe 9 can be provided. When the heat dissipation required by the satellite is not large or the heat is not continuously generated in large quantities, there is no need to start the electromagnetic pump to drive the liquid metal to flow. The liquid metal can also circulate in the heat pipe 9 to achieve heat exchange, so as to achieve energy saving effect. For example, when the heat generation of the satellite is small, there is a temperature difference between the multiple heat pipes 9 when they are just dissipating heat. When the satellite continues to heat, the temperatures in the multiple heat pipes 9 gradually approach each other. At this time, the electromagnetic pump can be used to drive the liquid metal to flow in the heat pipe 9.

[0051] According to one embodiment of the present invention, a modular heat dissipation device applied to a satellite includes a control unit and multiple first temperature sensors. The multiple first temperature sensors are distributed in multiple steam flow channels 20 and are communicatively connected to the control unit. The control unit is communicatively connected to an electromagnetic pump. The control unit controls the electromagnetic pump to start or stop according to signals from the multiple first temperature sensors.

[0052] It can be understood that the multiple first temperature sensors can transmit the temperature signal in each steam flow channel 20 to the control unit. If the temperature difference between the multiple first temperature sensors is greater than or equal to the set threshold, the electromagnetic pump is controlled to stop. At this time, the flow of steam is achieved through the pressure difference caused by the temperature difference, that is, the flow of liquid metal in the gaseous state. If the temperature difference between the multiple first temperature sensors is less than the set threshold, the control unit can determine that the pressure difference caused at this time cannot achieve the flow of steam, and then start the electromagnetic pump.

[0053] According to one embodiment of the present invention, a modular heat dissipation device applied to a satellite includes a plurality of second temperature sensors, which are distributed at a plurality of positions of a heat collecting plate 7. A control unit receives a signal from the second temperature sensor and adjusts the working state of the modular heat dissipation device applied to the satellite according to a preset temperature threshold. The second temperature sensor is used to monitor the temperature change of the heat source in real time. The control unit receives a signal from the second temperature sensor and adjusts the working state of the heat dissipation device according to a preset temperature threshold to achieve more intelligent temperature control.

[0054] According to one embodiment of the present invention, the plurality of heat sinks 8 include a base plate and a plurality of enclosures. The base plate is disposed at one end of the plurality of heat pipes 9 away from the heat collecting plate 7. The plurality of enclosures are disposed around the periphery of the base plate. One side of each enclosure is rotatably connected to one side of the base plate through an unfolding mechanism. The plurality of enclosures surround the plurality of heat pipes 9.

[0055] Exemplarily, the bottom plate and the plurality of enclosures and the heat collecting plate 7 enclose a square structure to wrap the plurality of heat pipes 9 therein, which can play a protective role. A heat dissipation fin can be provided on the side of the bottom plate and the enclosure away from the heat pipe 9 to increase the heat dissipation area and improve the heat dissipation efficiency. It can be understood that the bottom plate is located at the condensation end 202, which is convenient for dissipating heat to the side away from the heat source. At the same time, the bottom plate can be used to support and connect multiple enclosures to ensure installation stability.

[0056] In this embodiment, the connection design between the base plate and the enclosure is expandable, and the base plate and multiple enclosures are connected by an expansion mechanism, such as a spring, a telescopic arm or a movable hinge, so as to improve the convenience of assembly and disassembly, and facilitate increasing or decreasing the number of heat pipes 9 to adapt to different heat dissipation requirements, thereby improving the flexibility and efficiency of the heat dissipation system.

[0057] According to an embodiment of the present invention, the surface of the heat dissipation plate 8 is coated with a heat dissipation coating, and the heat dissipation coating is a coating with high emissivity to enhance radiation heat dissipation.

[0058] According to one embodiment of the present invention, a liquid reservoir is provided in the steam flow channel 20 adjacent to the condensation end 202. This design does not require an additional liquid reservoir, reduces the complexity of the structure, and is conducive to modular preparation of the overall structure of the steam chamber.

[0059] According to one embodiment of the present invention, the liquid metal is sodium or sodium-potassium alloy. It should be noted that the melting point and boiling point of sodium-potassium alloys with different ratios will vary, but are generally lower than the melting point and boiling point of pure sodium and pure potassium. Different types of sodium-potassium alloys are filled according to the actual environment of the satellite to meet the requirements of low-temperature condensation and high-temperature evaporation in the heat pipe 9.

[0060] Optionally, the outer tube of the heat pipe 9 is an aluminum tube or a copper tube. It can be understood that the aluminum tube or the copper tube has the properties of high thermal conductivity and low density to improve the heat dissipation effect and reduce the weight.

[0061] Please refer to Figure 4 and Figure 5 According to one embodiment of the present invention, the heat pipe 9 comprises: a tube shell 1 and a liquid wick 2;

[0062] The wick 2 and the liquid metal are arranged in the tube shell 1, and a steam flow channel 20 is formed in the wick 2 along the axial direction of the tube shell 1. The wick 2 includes a first sintered wick 21, a micro-groove wick 22, and a second sintered wick 23 connected in sequence along the axial direction of the tube shell 1, and a condensation flow channel 94 is formed; it can be understood that the first sintered wick 21, the micro-groove wick 22, and the second sintered wick 23 are connected and a condensation flow channel 94 is formed inside, and the condensation flow channel 94 is arranged around the steam flow channel 20.

[0063] The first sintered liquid wick and the second sintered liquid wick both include a plurality of metal copper meshes sequentially sleeved from the inside to the outside; the micro-groove liquid wick includes a plurality of liquid wicking channels extending along the axial direction of the tube shell, and the inner wall of the liquid wicking channel is provided with a groove structure extending along the axial direction of the tube shell, and the liquid metal can sequentially reach the evaporation end along the second sintered liquid wick, the micro-groove liquid wick and the first sintered liquid wick. Figure 5 Different arrows are used to illustrate the flow directions of gaseous liquid metal and liquid liquid metal along the liquid wick 2 respectively.

[0064] It is understandable that the first end of the tube shell 1 serves as the evaporation end 201 of the heat pipe and is configured to be connected to a heat source in the satellite device, and the second end of the tube shell 1 serves as the condensation end 202 of the heat pipe.

[0065] The tube shell 1 can be extended along a straight line or a curve, which is not specifically limited. In practical applications, the tube shell 1 is usually configured in a straight line.

[0066] At the same time, a first cavity for storing liquid metal is provided between the first end of the tube shell 1 and one end of the first sintered liquid wick 21 away from the micro-groove liquid wick 22, and a second cavity for storing liquid metal is provided between the second end of the tube shell 1 and one end of the second sintered liquid wick 23 away from the micro-groove liquid wick 22. The liquid metal may be sodium, potassium, lithium, etc.

[0067] Since the absorbent core 2 is provided with a steam flow channel 20, the absorbent core 2 can be specifically configured as a cylinder; accordingly, the steam flow channel 20 sequentially passes through the first sintered absorbent core 21, the micro-groove absorbent core 22 and the second sintered absorbent core 23, and the first sintered absorbent core 21, the micro-groove absorbent core 22 and the second sintered absorbent core 23 can all be configured as a cylinder.

[0068] in, Figure 6 The structure of a single metal copper mesh 211 is illustrated. The single metal copper mesh 211 is constructed into a cylindrical shape, and then a plurality of cylindrical metal copper meshes 211 are arranged in sequence from the inside to the outside, and sintered and rolled to prepare a first sintered liquid absorbent core 21 or a second sintered liquid absorbent core 23.

[0069] When the heat pipe is working, the evaporation end 201 absorbs heat from the heat source, and the liquid metal absorbs heat and evaporates, so that the gaseous liquid metal enters the steam flow channel 20. Due to the condensation of the steam at the condensation end 202, the gaseous liquid metal condenses into liquid and releases heat, which forms a pressure difference between the evaporation end 201 and the condensation end 202. Under the action of the pressure difference, the gaseous liquid metal reaches the condensation end 202 from the evaporation end 201 along the steam flow channel 20; under the capillary action of the liquid absorbent core 2, the liquid liquid metal returns to the evaporation end 201 along the gap in the second sintered liquid absorbent core 23, along the liquid absorbent flow channel 2211 in the micro-groove liquid absorbent core 22, and along the gap in the first sintered liquid absorbent core 21, and is heated and evaporated again under the action of the heat source, thereby completing a phase change process of the liquid metal, and can flow back and forth along this circulation path. The above cycle realizes the heat transfer from the evaporation end 201 to the condensation end 202 of the heat pipe.

[0070] Since the liquid absorbent core 2 of the heat pipe is composed of the first sintered liquid absorbent core 21, the micro-groove liquid absorbent core 22 and the second sintered liquid absorbent core 23, the first sintered liquid absorbent core 21 and the second sintered liquid absorbent core 23 both have the characteristics of high capillary pumping pressure but relatively low liquid permeability, and the micro-groove liquid absorbent core 22 has the characteristics of low capillary pumping pressure but relatively high liquid permeability, this enables the liquid absorbent core 2 to better balance the contradiction between high capillary capacity and high permeability, and can simultaneously obtain relatively high capillary suction force and evaporation efficiency, while achieving low flow resistance and radial thermal conductivity. When this design is used in a heat pipe, it can ensure that the heat pipe can perform heat dissipation work normally in a space microgravity environment, and has good anti-gravity heat transfer performance, which helps to improve the heat dissipation efficiency of satellite equipment and enhance its reliability and stability in a space environment.

[0071] In some embodiments, Figure 5 As shown, the first sintered liquid absorbent core 21 and the second sintered liquid absorbent core 23 each include a plurality of liquid absorbent sections connected in sequence;

[0072] Along the direction from the evaporation end 201 to the condensation end 202 , the porosity of the multiple liquid absorbing sections corresponding to the first sintered liquid absorbing core 21 gradually increases, and the porosity of the multiple liquid absorbing sections corresponding to the second sintered liquid absorbing core 23 gradually decreases.

[0073] It is understandable that, for the first sintered liquid absorbent core 21 or the second sintered liquid absorbent core 23, each liquid absorbent section is sequentially connected along the axial direction of the tube shell 1, and each liquid absorbent section is composed of a plurality of cylindrical metal copper meshes 211 sequentially arranged from the inside to the outside. The first sintered liquid absorbent core 21 and the second sintered liquid absorbent core 23 required by the present invention can be prepared by selecting metal copper meshes 211 with different weaving densities for different liquid absorbent sections.

[0074] By setting the porosity of each liquid absorption section corresponding to the first sintered liquid absorption core 21 and the second sintered liquid absorption core 23, it is ensured that the gaseous liquid metal at the evaporation end 201 flows along the steam flow channel 20 from the evaporation end 201 to the condensation end 202, and the contradiction between the high capillary capacity and the high permeability of the liquid absorption core 2 is better balanced, ensuring that the liquid metal at the condensation end 202 can better utilize the capillary suction force along the liquid absorption core 2 from the condensation end 202 to the evaporation end 201, and there will be no significant mutual interference between the two flow directions of the liquid metal, thereby optimizing the anti-gravity heat transfer performance of the heat pipe and improving the ultimate power of the heat transfer of the heat pipe.

[0075] Optionally, the first sintered liquid absorbent core 21 and the second sintered liquid absorbent core 23 each include two liquid absorbent segments connected in sequence, and the porosity range of one of the two liquid absorbent segments close to the micro-groove liquid absorbent core 22 is 87%-97%, for example, the porosity can be specifically 87%, 90%, 92%, 95%, 97%, etc.; at the same time, the porosity range of one of the two liquid absorbent segments away from the micro-groove liquid absorbent core 22 is 75%-85%, for example, the porosity can be specifically 75%, 78%, 80%, 83%, 85%, etc.

[0076] In some embodiments, Figure 5 and Figure 7 As shown, the micro-groove liquid wick 22 includes a plurality of liquid wicks 221 , which are arranged in a cylindrical shape, and a liquid wicking channel 2211 is formed in each of the liquid wicks 221 .

[0077] Specifically, the pipette 221 includes a first half tube and a second half tube; the first half tube and the second half tube can be assembled to form the pipette 221, and a pipette channel 2211 is formed between the first half tube and the second half tube. The inner walls of the first half tube and the second half tube are provided with a plurality of groove structures 2212 extending along the axial direction of the tube shell 1. The groove structures 2212 can better guide the liquid metal to flow along the pipette channel 2211 and provide capillary force for the flow of the liquid metal.

[0078] Exemplarily, the cross-section of the pipette 221 is rectangular, the first half tube and the second half tube are both groove-shaped structures, and the two groove edges of the first half tube and the two groove edges of the second half tube are connected one by one, so that the first half tube and the second half tube are assembled to form the pipette 221.

[0079] The bottom of the groove of the first half tube and the bottom of the groove of the second half tube are both provided with a plurality of protrusions arranged side by side, each protrusion extends along the length direction of the liquid pipette 221, and a groove structure 2212 is formed between two adjacent protrusions.

[0080] In some embodiments, the tube shell 1 is a metal shell, for example, the metal shell can be a copper shell, and the inner wall of the metal shell is provided with a nanoporous copper powder layer prepared by sintering nanoporous copper powder, and the inner wall of the nanoporous copper powder layer is in contact with the peripheral wall of the liquid-absorbing core 2.

[0081] It is understandable that nanoporous copper powder is a material with a unique microstructure, which is characterized by a large number of micropores. The porosity of nanoporous copper powder is usually between 20% and 80%.

[0082] Since the nanoporous copper powder has a porous structure, the nanoporous copper powder layer prepared from the nanoporous copper powder has good thermal conductivity, so the nanoporous copper powder layer can be used to ensure the radial thermal conductivity and heat dissipation effect of the heat pipe.

[0083] In some embodiments, the metal copper mesh 211 is prepared by sintering irregular copper powder.

[0084] It can be understood that irregular copper powder is a kind of copper powder with irregular shape, whose particles are irregular in shape and size. The particle size distribution of irregular copper powder is wide, usually ranging from a few microns to hundreds of microns. The density of irregular copper powder is close to the density of pure copper, which is about 8.96g / cm³.

[0085] In this way, the metal copper mesh 211 is prepared by sintering irregular copper powder, so that the thermal conductivity of the metal copper mesh 211 can be ensured, thereby optimizing the anti-gravity heat transfer performance of the heat pipe.

[0086] In some embodiments, the liquid metal is a bismuth-based metal.

[0087] It is understandable that heat pipes use the phase change of liquid metal to transfer heat. Since bismuth-based metals have the characteristics of high electrical conductivity, high thermal conductivity, low viscosity and a wide liquid temperature range, by selecting bismuth-based metals as liquid metals, efficient convective heat transfer and solid-liquid phase change thermal control effects can be achieved in the microgravity environment of space.

[0088] It is understandable that both the heat collecting plate and the heat dissipating plate can be made of metal with good thermal conductivity. The heat collecting plate is configured to be connected to the heat source in the sanitary equipment, and the heat dissipating plate is connected to the cold source corresponding to the satellite equipment. For example, the heat dissipating plate can be directly exposed to the space environment facing away from the sun.

[0089] By transferring heat between the collector plate and the heat sink plate through heat pipes, the heat generated by the heat source in the satellite equipment can be effectively managed and dispersed, and the temperature stability in the satellite equipment can be maintained under extreme temperature conditions, thereby reducing equipment failures due to overheating, reducing the maintenance cost and frequency of satellite equipment, and improving the reliability and service life of satellite equipment, which is conducive to further reducing the operating costs of space missions.

[0090] In some embodiments, Figure 4 As shown, the central axis of the heat pipe is arranged obliquely relative to the plate surface of the heat sink.

[0091] Specifically, the angle between the central axis of the heat pipe and the surface of the heat sink is α, and the value range of α is , for example, the specific value of α is , , This design not only ensures that the heat pipe can adapt to the internal structure of the satellite equipment for spatial layout, but also facilitates the reflux of liquid metal from the condensation end 202 to the evaporation end 201 along the liquid wick 2, so as to achieve a heat transfer limit power of up to 90W under completely anti-gravity conditions (inclination angle of 90°).

[0092] In some embodiments, the heat dissipation device also includes a circulation channel and an electromagnetic pump; the circulation channel is connected between the evaporation end 201 and the condensation end 202 of the heat pipe; the electromagnetic pump is used to drive the liquid metal to flow from the condensation end 202 along the circulation channel to the evaporation end 201.

[0093] It is understandable that in practical applications, the use of an electromagnetic pump can effectively drive the flow of liquid metal in a microgravity environment, ensuring that it can flow quickly and fill the heat pipe at startup, thereby achieving rapid startup of the heat pipe from a frozen state to a normal working state.

[0094] During the operation of the heat pipe, the electromagnetic pump drives the liquid metal to flow back from the condensation end 202 along the circulation channel toward the evaporation end 201, and the flow and phase change process of the liquid metal can also be accurately controlled to achieve control of the working state of the heat pipe.

[0095] Furthermore, in order to finely control the working state of the heat pipe, the heat dissipation device further includes a temperature sensor and a control module; the temperature sensor and the control module are electrically connected, and the control module and the electromagnetic pump are electrically connected;

[0096] The temperature sensor is arranged on the heat collecting plate and is used to detect the temperature information of the heat collecting plate. The control module is used to control the working state of the electromagnetic pump according to the temperature information fed back by the temperature sensor.

[0097] Specifically, the control module can be a PLC controller or a central processing unit, and multiple temperature sensors can be set, and multiple temperature sensors are arranged in different areas of the collector plate; this design can detect the temperature change of the heat source in real time based on multiple temperature sensors, and the control module can accurately calculate the temperature of the heat source according to the information fed back by the multiple temperature sensors, and adaptively control the working state of the electromagnetic pump according to the temperature of the heat source, thereby realizing intelligent regulation of the working state of the heat pipe.

[0098] According to an embodiment of the second aspect of the present invention, an artificial satellite comprises a satellite body and the above-mentioned modular heat dissipation device applied to the satellite, wherein the modular heat dissipation device applied to the satellite is arranged on the satellite body.

[0099] The artificial satellite according to the embodiment of the present invention includes the above-mentioned modular heat dissipation device applied to the satellite, and therefore has all the technical effects of the above-mentioned modular heat dissipation device applied to the satellite, which will not be repeated here.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and should be included in the scope of the claims of the present invention.

Claims

1. A modular heat dissipation device for satellite, characterized in that: include: A heat collecting plate, one side of which is used to contact with a heat source of the satellite; A plurality of heat pipes, wherein the plurality of heat pipes are arranged in an array, and each two adjacent heat pipes are detachably connected, and each heat pipe has an evaporation end and a condensation end, wherein the evaporation end is connected to the heat collecting plate, and liquid metal is contained in the heat pipe, and an axially penetrating steam flow channel and condensation flow channel are provided in the heat pipe, wherein the liquid metal evaporates into a gaseous state at the evaporation end and reaches the condensation end along the steam flow channel, and wherein the liquid metal condenses into a liquid state at the condensation end and reaches the evaporation end along the condensation flow channel; An electromagnetic pump, the electromagnetic pump is connected to the heat pipe, and the electromagnetic pump is used to drive the liquid metal in the heat pipe to flow; A plurality of heat dissipation plates, wherein the plurality of heat dissipation plates are connected to each other so as to surround the plurality of heat pipes; Every two adjacent heat pipes are connected to the steam flow channel through a connecting pipe, so as to realize the flow of steam by utilizing the pressure difference caused by the temperature difference between them; The modular heat dissipation device applied to the satellite includes a control unit and multiple first temperature sensors. The multiple first temperature sensors are distributed in the multiple steam flow channels and are communicatively connected to the control unit. The control unit is communicatively connected to the electromagnetic pump. The control unit controls the start or stop of the electromagnetic pump according to the signals of the multiple first temperature sensors.

2. The modular heat dissipation device for satellite according to claim 1, characterized in that: The modular heat dissipation device applied to the satellite includes multiple second temperature sensors, which are distributed at multiple positions of the thermal collector plate. The control unit receives signals from the second temperature sensors and adjusts the working state of the modular heat dissipation device applied to the satellite according to a preset temperature threshold.

3. The modular heat dissipation device for satellite according to claim 1, characterized in that: The multiple heat dissipation plates include a base plate and multiple enclosures. The base plate is arranged at one end of the multiple heat pipes away from the heat collecting plate. The multiple enclosures are arranged around the periphery of the base plate. One side of each enclosure is rotatably connected to one side of the base plate through an unfolding mechanism. The multiple enclosures surround the multiple heat pipes.

4. The modular heat dissipation device for satellite according to claim 1, characterized in that: The surface of the heat dissipation plate is coated with a heat dissipation coating.

5. The modular heat dissipation device for satellite according to claim 1, characterized in that: A liquid reservoir is provided in the steam flow channel adjacent to the condensation end.

6. The modular heat dissipation device for satellite according to claim 1, characterized in that: The liquid metal is sodium or sodium-potassium alloy; And / or, the outer tube of the heat pipe is an aluminum tube or a copper tube.

7. The modular heat dissipation device for satellite according to any one of claims 1 to 6, characterized in that: The heat pipe comprises: a tube shell and a liquid wick; The wick and the liquid metal are arranged in the tube shell, the wick is formed with the steam flow channel penetrating along the axial direction of the tube shell, the wick comprises a first sintered wick, a micro-groove wick and a second sintered wick connected in sequence along the axial direction of the tube shell, and is formed with the condensation flow channel; The first sintered liquid absorbent core and the second sintered liquid absorbent core both include a plurality of metal copper meshes sequentially sleeved from the inside to the outside; the micro-groove liquid absorbent core includes a plurality of liquid absorption channels extending along the axial direction of the tube shell, and the inner wall of the liquid absorption channel is provided with a groove structure extending along the axial direction of the tube shell; The liquid metal can reach the evaporation end along the second sintered wick, the micro-groove wick and the first sintered wick in sequence.

8. An artificial satellite, characterized in that: It comprises a satellite body and a modular heat dissipation device applied to a satellite as claimed in any one of claims 1 to 7, wherein the modular heat dissipation device applied to a satellite is arranged on the satellite body.

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