Wafer sticking phenomenon identification system and method, electronic equipment and storage medium

Abstract

The invention provides a wafer sticking phenomenon identification system and method, electronic equipment and a storage medium. The identification system comprises at least one strain sensing module arranged on the wafer transmission manipulator and used for acquiring a strain acquisition signal of the wafer transmission manipulator at a target position according to an acquisition instruction; the signal amplification module is used for receiving and amplifying the strain acquisition signal; the filtering module is used for filtering the amplified strain acquisition signal to obtain strain acquisition data; the data processing module is used for receiving the first strain acquisition data and the second strain acquisition data; and the data processing module generates a strain variable quantity based on the first strain acquisition data and the second strain acquisition data, and judges that a wafer sticking phenomenon occurs under the condition that the strain variable quantity of at least one strain sensing module is greater than a first preset threshold value.

Description

Technical Field

[0001] The present application relates to the technical field of wafer transmission, and in particular to a system and method for identifying wafer sticking, an electronic device and a storage medium. Background Art

[0002] In the semiconductor process, wafer transfer is a crucial link. For example, in semiconductor processes below 14nm, wafer transfer is often carried out by means of friction columns. After long-term use of friction columns, wafers may stick due to various factors. Therefore, it is necessary to detect the sticking phenomenon in time during wafer transfer to avoid wafer sticking and affect wafer production.

[0003] For example, the prior art generally detects the vibration frequency of the wafer on the wafer transfer robot at a fixed position to determine whether the wafer transfer robot has a sticking phenomenon. However, the inventor of the present application found that this method can only be implemented by a high-precision laser sensor, which has the problem of high cost; on the other hand, this method can only be detected at a fixed position, which has the problem of limited detection angle; and this method can only identify the sticking phenomenon of the wafer on the wafer transfer robot, and cannot identify the sticking phenomenon of the wafer inside the wafer transfer box (Foup).

[0004] For another example, the prior art also uses a visual sensor to detect the vibration frequency of the wafer to determine whether the wafer transfer robot has a sticking phenomenon. However, the inventors also found that this method requires a large installation space; the visual sensor's image processing calculation is too large, and there is a problem of high energy consumption; and this method can only identify the wafer sticking phenomenon on the wafer transfer robot, and cannot identify the wafer sticking phenomenon inside the Foup.

[0005] Based on this, how to provide an identification method that can identify the wafer sticking phenomenon on the wafer transfer robot and the wafer sticking phenomenon inside the Foup is a technical problem that needs to be solved urgently. Summary of the invention

[0006] The present application provides a wafer sticking phenomenon recognition system and method, electronic equipment and storage medium, which are used to provide a wafer sticking phenomenon recognition system and method that can recognize the wafer sticking phenomenon on a wafer transfer robot and the wafer sticking phenomenon inside a Foup.

[0007] One aspect of the present application provides a system for identifying wafer sticking phenomenon, including: at least one strain sensing module, which is arranged on a wafer transfer robot and collects a strain collection signal of the wafer transfer robot at a target position according to a collection instruction; a signal amplification module, which receives and amplifies the strain collection signal; a filtering module, which filters the amplified strain collection signal to obtain strain collection data; a data processing module, which receives first strain collection data and second strain collection data; wherein the first strain collection data is generated based on the strain collection signal of the wafer transfer robot at the first target position collected by at least one strain sensing module according to the first collection instruction, and the second strain collection data is generated based on the strain collection signal of the wafer transfer robot at the second target position collected by at least one strain sensing module according to the second collection instruction; the data processing module generates a strain variation based on the first strain collection data and the second strain collection data, and determines that the wafer sticking phenomenon occurs when the strain variation of at least one strain sensing module is greater than a first preset threshold.

[0008] According to some embodiments of the present application, the wafer transfer robot is a hand fork type robot, and at least one strain sensing module includes at least a first strain sensing module, a second strain sensing module and a third strain sensing module; the first strain sensing module is horizontally arranged at the bottom end of the hand fork portion of the hand fork type robot, and collects the strain signal of the hand fork type robot in the horizontal direction; the second strain sensing module is vertically arranged at the bottom end of the hand fork portion, and is set at a first preset distance from the first strain sensing module, and collects the strain signal of the hand fork type robot in the vertical direction; the third strain sensing module is vertically arranged at the bottom end of the hand fork portion, and is set at a second preset distance from the second strain sensing module, and collects the strain signal of the hand fork type robot in the vertical direction.

[0009] According to some embodiments of the present application, the wafer transfer robot is a circular robot, and at least one strain sensing module includes at least a first strain sensing module, a second strain sensing module and a third strain sensing module; the first strain sensing module is horizontally arranged at the top of the circular part of the circular robot to collect the horizontal strain signal of the circular robot; the second strain sensing module is vertically arranged at one side end of the circular part of the circular robot to collect the vertical strain signal of the circular robot; the third strain sensing module is vertically arranged at the bottom end of the circular part of the circular robot to collect the vertical strain signal of the circular robot.

[0010] According to some embodiments of the present application, the identification system further includes: a strain compensation sensing module and a temperature compensation sensing module. The strain compensation sensing module is arranged on the wafer transfer robot and is used to measure the strain measurement change value caused by environmental change factors; the temperature compensation sensing module is used to measure the temperature measurement change value caused by temperature change factors; wherein the strain measurement change value and the temperature measurement change value are used for compensation correction of the strain acquisition data.

[0011] According to some embodiments of the present application, a data processing module receives a preset number of strain changes from at least one strain sensing module; when an average strain change of the preset number of strain changes is greater than a second preset threshold, it is determined that there is a risk of wafer sticking in the wafer transfer robot.

[0012] Another aspect of the present application provides a method for identifying wafer sticking phenomenon, including: collecting a strain collection signal of a wafer transfer robot at a target position according to a collection instruction; receiving and amplifying the strain collection signal; filtering the amplified strain collection signal to obtain strain collection data; receiving first strain collection data and second strain collection data; wherein the first strain collection data is generated based on a strain collection signal of a wafer transfer robot at a first target position collected by at least one strain sensing module according to a first collection instruction, and the second strain collection data is generated based on a strain collection signal of a wafer transfer robot at a second target position collected by at least one strain sensing module according to a second collection instruction; generating a strain change based on the first strain collection data and the second strain collection data; and determining that a wafer sticking phenomenon occurs when the strain change of at least one strain sensing module is greater than a first preset threshold.

[0013] According to some embodiments of the present application, the identification method also includes: receiving a preset number of strain changes from at least one strain sensing module; when the average strain change of the preset number of strain changes is greater than a second preset threshold, determining that there is a risk of wafer sticking in the wafer transfer robot.

[0014] According to another aspect of the present application, the present application further provides an electronic device. The electronic device includes: one or more processors; a storage device for storing one or more programs, and when the one or more programs are executed by the one or more processors, the one or more processors can implement the identification method described above.

[0015] According to another aspect of the present application, the present application further provides a non-volatile computer-readable storage medium, wherein a computer program is stored on the storage medium, and when the computer program is executed by a processor, the identification method described above can be implemented.

[0016] The present application can obtain strain acquisition signals of the wafer transfer robot at different target positions by setting at least one strain sensing module on the wafer transfer robot; the strain change amount can be obtained according to the strain acquisition signals at different target positions, and based on the comparison between the strain change amount and the first preset threshold, it can be determined whether wafer sticking occurs on the wafer transfer robot or inside the Foup. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram showing an identification system according to an embodiment of the present application;

[0019] Figure 2 A schematic diagram showing a wafer transfer robot according to an embodiment of the present application;

[0020] Figure 3 Another schematic diagram showing the wafer transfer robot according to an embodiment of the present application;

[0021] Figure 4 A schematic diagram of an amplifying circuit of a signal amplifying module according to an embodiment of the present application is shown;

[0022] Figure 5 A schematic diagram of a filter circuit of a filter module according to an embodiment of the present application is shown;

[0023] Figure 6 A schematic diagram showing a process of identifying a wafer sticking phenomenon inside a Foup according to an embodiment of the present application;

[0024] Figure 7 A schematic diagram showing a process of identifying a wafer sticking phenomenon on a wafer transfer robot according to an embodiment of the present application;

[0025] Figure 8 A test data diagram of the third strain sensing module of the present application is shown;

[0026] Fig. 9 Another test data diagram of the third strain sensing module according to an embodiment of the present application is shown;

[0027] Fig.10 A flow chart showing a method for identifying wafer sticking according to an embodiment of the present application;

[0028] Fig.11Another flow chart of the wafer sticking phenomenon identification method according to the embodiment of the present application is shown.

[0029] Description of reference numerals:

[0030] Identification system 1; strain sensing module 10; signal amplification module 20; filtering module 30; data processing module 40; motion control module 50; strain compensation sensing module 60; temperature compensation sensing module 70.

[0031] A first strain sensing module 11 ; a second strain sensing module 12 ; and a third strain sensing module 13 .

[0032] Sensor signal acquisition module 41; data processing system 42; logic control module 43; communication module 44; data storage module 45; PC control module 46. DETAILED DESCRIPTION

[0033] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0034] The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of these specific details, or other modes, components, materials, devices, etc. may be adopted. In these cases, known structures, methods, devices, implementations, materials or operations will not be shown or described in detail.

[0035] In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0036] The terms "first", "second" and the like in the specification and claims of this application and the above drawings are used to distinguish different objects rather than to describe a specific order.

[0037] The following is a clear and complete description of the technical solution of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0038] According to one aspect of the present application, the present application provides a wafer sticking phenomenon recognition system for identifying the wafer sticking phenomenon on a wafer transfer robot and the wafer sticking phenomenon inside a Foup.

[0039] Figure 1 A schematic diagram showing an identification system according to an embodiment of the present application.

[0040] According to an example embodiment, Figure 1 As shown, the identification system 1 includes at least one strain sensing module 10 , a signal amplification module 20 , a filtering module 30 and a data processing module 40 .

[0041] According to an exemplary embodiment, the strain sensing module 10 is disposed on a wafer transfer robot, and different installation methods of the strain sensing module 10 may be set according to different types of wafer transfer robots.

[0042] Figure 2 A schematic diagram showing a wafer transfer robot according to an embodiment of the present application; Figure 3 Another schematic diagram of the wafer transfer robot according to an embodiment of the present application is shown.

[0043] Alternatively, if Figure 2 As shown, the wafer transfer robot is a hand fork type robot, and the strain sensing module 10 includes a first strain sensing module 11 , a second strain sensing module 12 and a third strain sensing module 13 .

[0044] The first strain sensing module 11 is horizontally arranged at the bottom of the hand fork of the hand fork manipulator to collect the strain signal of the hand fork manipulator in the horizontal direction. The second strain sensing module 12 is vertically arranged at the bottom of the hand fork and is set at a first preset distance from the first strain sensing module 11 to collect the strain signal of the hand fork manipulator in the vertical direction. The third strain sensing module 13 is vertically arranged at the bottom of the hand fork and is set at a second preset distance from the second strain sensing module 12 to collect the strain signal of the hand fork manipulator in the vertical direction.

[0045] For example, Figure 2As shown, the first strain sensing module 11 is horizontally installed at the bottom of the hand fork of the hand fork manipulator to measure the strain in the X direction; the second strain sensing module 12 and the third strain sensing module 13 are installed at the bottom of the hand fork of the hand fork manipulator perpendicular to the direction of the first strain sensing module 11 to measure the strain in the Y direction. And there is a certain preset distance between the first strain sensing module 11, the second strain sensing module 12 and the third strain sensing module 13. The first preset distance and the second preset distance can be customized according to user needs.

[0046] Exemplarily, the first strain sensing module 11, the second strain sensing module 12 and the third strain sensing module 13 may be strain measurement sensors. For example, the strain measurement sensor may be a strain gauge, and the form of the strain gauge includes but is not limited to a single-bridge strain gauge or a full-bridge strain gauge, which is not limited in the present application.

[0047] Exemplarily, the first strain sensing module 11, the second strain sensing module 12 and the third strain sensing module 13 can be pasted and set on the hand-fork type manipulator.

[0048] It can be understood here that the bottom end of the hand fork of the hand fork type manipulator is the position where the deformation amount changes greatly when the manipulator is deformed. By setting the first strain sensing module 11, the second strain sensing module 12 and the third strain sensing module 13 at the position where the deformation amount of the hand fork type manipulator changes greatly, a more accurate strain signal can be obtained to ensure the accuracy of the measurement.

[0049] Alternatively, if Figure 3 As shown, the wafer transfer robot is a circular robot, and the strain sensing module 10 includes a first strain sensing module 11 , a second strain sensing module 12 and a third strain sensing module 13 .

[0050] The first strain sensing module 11 is horizontally arranged at the top of the circular part of the circular manipulator to collect the horizontal strain signal of the circular manipulator. The second strain sensing module 12 is vertically arranged at the side end of the circular part of the circular manipulator to collect the vertical strain signal of the circular manipulator. The third strain sensing module 13 is vertically arranged at the bottom end of the circular part of the circular manipulator to collect the vertical strain signal of the circular manipulator.

[0051] For example, Figure 3 As shown, the first strain sensing module 11 is horizontally installed at the top of the circular part of the circular manipulator to measure the strain in the X direction; the second strain sensing module 12 is installed at a side end of the circular part perpendicular to the direction of the first strain sensing module 11 to measure the strain in the Y direction, and the third strain sensing module 13 is installed at the bottom end of the circular part perpendicular to the direction of the first strain sensing module 11 to measure the strain in the Y direction.

[0052] Exemplarily, the first strain sensing module 11, the second strain sensing module 12 and the third strain sensing module 13 may be strain measurement sensors. For example, the strain measurement sensor may be a strain gauge, and the form of the strain gauge includes but is not limited to a single-bridge strain gauge or a full-bridge strain gauge, which is not limited in the present application.

[0053] Exemplarily, the first strain sensing module 11 , the second strain sensing module 12 and the third strain sensing module 13 may be pasted and arranged on a circular manipulator.

[0054] It can be understood here that the top, bottom and side ends of the circular part of the circular manipulator are the positions where the deformation amount changes greatly when the manipulator is deformed. By setting the first strain sensing module 11, the second strain sensing module 12 and the third strain sensing module 13 at the positions where the deformation amount of the circular manipulator changes greatly, a more accurate strain signal can be obtained to ensure the accuracy of the measurement.

[0055] Alternatively, if Figure 1 As shown, the identification system 1 further includes a strain compensation sensing module 60 and a temperature compensation sensing module 70 .

[0056] The strain compensation sensor module 60 is disposed on the wafer transfer robot and is used to measure the strain measurement change value caused by environmental change factors.

[0057] For example, Figure 2 or Figure 3 As shown, the strain compensation sensor module 60 is set at the end of the wafer transfer robot to obtain the change of the measurement value of the strain sensor module 10 caused by the material deformation caused by temperature, the air pressure in the environment, etc., and use the strain measurement change value as a compensation parameter to correct the measurement value of the strain sensor module 10.

[0058] The temperature compensation sensor module 70 is used to measure the temperature measurement change value caused by temperature change factors.

[0059] For example, the temperature compensation sensor module 70 is set in the equipment to measure the change of temperature value in the movement environment of the wafer transfer robot, and according to the coefficient of temperature change of different materials, the temperature measurement change value is used as a compensation parameter and applied to the correction of the measurement value of the strain sensor module 10.

[0060] Through the above embodiments, the present application compensates and corrects the measurement value of the strain sensor module 10 based on the strain compensation sensor module 60 and the temperature compensation sensor module 70, so that the measurement value of the strain sensor module 10 can be more accurate and reduce the measurement error caused by changes in the external environment.

[0061] According to an example embodiment, the signal amplification module 20 receives and amplifies the strain acquisition signal.

[0062] For example, Figure 1 As shown, the signal amplification module 20 receives the strain acquisition signals acquired by the plurality of strain sensing modules 10 and performs amplification processing. The amplification factor A of the signal amplification module 20 can be customized according to user needs.

[0063] Figure 4 FIG. 1 is a schematic diagram of an amplification circuit of a signal amplification module of an embodiment of the present application. For example, Figure 4 As shown, the amplification factor A of the signal amplification module 20 can be achieved by adjusting the resistance value of resistor R1. For example:

[0064]

[0065] According to an exemplary embodiment, the filtering module 30 performs filtering processing on the amplified strain acquisition signal to obtain strain acquisition data.

[0066] For example, Figure 1 As shown, the filtering module 30 receives the amplified strain acquisition signal and performs filtering processing on the strain acquisition signal.

[0067] Figure 5 FIG. 1 is a schematic diagram of a filter circuit of a filter module of an embodiment of the present application. For example, Figure 5 As shown, the filter module 30 includes a filter circuit, and the filter circuit uses a low-pass filter. Since the vibration frequency of the wafer is below 100 Hz during the identification process of the wafer sticking phenomenon, the cut-off frequency resistor and capacitor can be configured to 100 Hz through the filter circuit, and the configuration formula can be:

[0068]

[0069] Among them, Fp is the cut-off frequency, R2 is the resistor, and C3 is the capacitor.

[0070] According to an example embodiment, Figure 1 As shown, the data processing module 40 also includes a sensor signal acquisition module 41 , a data processing system 42 , a logic control module 43 , a communication module 44 and a data storage module 45 .

[0071] For example, the sensor signal acquisition module 41 is used for signal acquisition of the strain sensing module 10, the strain compensation sensing module 60 and the temperature compensation module 70; the data processing system 42 and the logic control module 43 are used for processing, compensation and logic analysis of sensor signals; the communication module 44 is used for communication connection with the external PC control module 46; the data storage module 45 is used for storing historical strain measurement data for data analysis of wafer sticking phenomenon.

[0072] Alternatively, if Figure 1 As shown, the identification system 1 further includes a strain compensation sensing module 60 and a temperature compensation sensing module 70 .

[0073] According to an example embodiment, the data processing module 40 receives first strain acquisition data and second strain acquisition data, wherein the first strain acquisition data is generated based on a strain acquisition signal of a wafer transfer robot at a first target position acquired by at least one strain sensing module according to a first acquisition instruction, and the second strain acquisition data is generated based on a strain acquisition signal of a wafer transfer robot at a second target position acquired by at least one strain sensing module according to a second acquisition instruction.

[0074] The data processing module 40 generates a strain variation based on the first strain acquisition data and the second strain acquisition data, and determines that a wafer sticking phenomenon occurs when the strain variation of at least one strain sensing module is greater than a first preset threshold.

[0075] For example, the data processing module 40 collects the collected signals of each strain sensing module 10 in real time when the wafer transfer robot is performing a wafer pick-up and placement action in the aligner or foam (i.e., the moment the wafer contacts the strain sensing module) to determine the deformation amount of the wafer transfer robot in the XY direction. The deformation caused by the wafer transfer robot and the force conditions of each wafer contact point can be analyzed, so as to further determine whether wafer sticking occurs at the wafer contact point.

[0076] For example, when the wafer transfer robot performs a normal pick-up and place operation in the Aligner or Foup, the strain sensing module 10 will also obtain a certain strain acquisition signal and obtain a certain strain change. Therefore, the strain change under normal conditions is used as the first preset threshold. The first preset threshold can be obtained by simulation calculation or based on empirical test calculation, and this application is not limited here.

[0077] According to the example embodiment, when the strain variation of at least one strain sensing module 10 is greater than the first preset threshold, it indicates that the strain sensing module 10 has detected abnormal deformation, and the data processing module 40 can determine that wafer sticking has occurred and then issue an alarm.

[0078] Figure 6 A schematic diagram showing a process of identifying a wafer sticking phenomenon inside a Foup according to an embodiment of the present application; Figure 7 A schematic diagram of a process for identifying a wafer sticking phenomenon on a wafer transfer robot according to an embodiment of the present application is shown.

[0079] As an example, Figure 6As shown, the process of the recognition system 1 recognizing the wafer sticking phenomenon inside the Foup is as follows:

[0080] S11: The recognition system 1 is initialized.

[0081] S12: The strain sensing module 10 collects a first strain collection signal of the wafer transfer robot at the wafer picking position according to the first collection instruction.

[0082] For example, when the host computer sends a wafer fetching instruction to the motion control module 50, the motion control module 50 controls the wafer transfer robot to move to the inside of the Foup to perform wafer fetching. When the wafer transfer robot moves to the fetching position and rises to a distance of 2-4 mm from the lower surface of the wafer, the strain sensing module 10 receives the first acquisition instruction and collects the first strain acquisition signal.

[0083] S13: The strain sensing module 10 collects a second strain collection signal of the wafer transfer robot at the wafer taking completion position according to the second collection instruction.

[0084] For example, when the motion control module 50 controls the wafer transfer robot to rise to the wafer taking completion position, the strain sensing module 10 receives the second acquisition instruction and acquires the second strain acquisition signal.

[0085] S14: The data processing module 40 obtains the strain variation of the strain sensing module 10 according to two strain collection data obtained from the strain collection signals collected twice.

[0086] For example, the strain changes of the first strain sensing module 11 , the second strain sensing module 12 , and the third strain sensing module 13 are Δε1, Δε2, and Δε3, respectively.

[0087] For example, taking the first strain sensing module 11 as an example, Δε1=abs(ε1001−ε2001), ε1001 is the first strain acquisition signal acquired by the first strain sensing module 11, and ε2001 is the second strain acquisition signal acquired by the first strain sensing module 11.

[0088] S15: The data processing module 40 determines the magnitude of the strain variation of each strain sensing module 10 and the first preset threshold.

[0089] S16: When the strain variation of at least one strain sensing module is greater than a first preset threshold, the data processing module 40 issues an alarm indicating that a wafer sticking phenomenon occurs inside the Foup.

[0090] S17 : the data processing module 40 stores the strain variation of each strain sensing module 10 in the data storage module 45 .

[0091] As another example, Figure 7 As shown, the recognition system 1 recognizes the wafer sticking phenomenon on the wafer transfer robot in the following embodiments:

[0092] S21: The recognition system 1 is initialized.

[0093] S22: The strain sensing module 10 collects a first strain collection signal of the wafer transfer robot at the wafer placing position according to the first collection instruction.

[0094] For example, when the host computer sends a wafer manipulator placement instruction to the motion control module 50, the motion control module 50 controls the wafer transfer manipulator to move to the inside of the Foup or other stations to place the wafer. When the wafer transfer manipulator moves to the placement position and rises to a distance of 2-4 mm between the lower surface of the wafer and the inside of the Foup or other stations wafer bearing contact surface, the strain sensing module 10 receives the first acquisition instruction and collects the first strain acquisition signal.

[0095] S23: The strain sensing module 10 collects a second strain collection signal of the wafer transfer robot at the wafer placement completion position according to the second collection instruction.

[0096] For example, when the motion control module 50 controls the wafer transfer robot to descend to the wafer placement completion position, the strain sensing module 10 receives the second acquisition instruction and acquires the second strain acquisition signal.

[0097] S24: The data processing module 40 obtains the strain variation of the strain sensing module according to the two strain collection data obtained from the strain collection signals collected twice.

[0098] For example, the strain changes of the first strain sensing module 11 , the second strain sensing module 12 , and the third strain sensing module 13 are Δε1, Δε2, and Δε3, respectively.

[0099] For example, taking the first strain sensing module 11 as an example, Δε1=abs(ε1001−ε2001), ε1001 is the first strain acquisition signal acquired by the first strain sensing module 11, and ε2001 is the second strain acquisition signal acquired by the first strain sensing module 11.

[0100] S25: The data processing module 40 determines the magnitude of the strain variation of each strain sensing module 10 and the first preset threshold.

[0101] S26: When the strain variation of at least one strain sensing module is greater than a first preset threshold, the data processing module 40 issues an alarm indicating that the wafer is sticking on the wafer transfer robot.

[0102] S27 : the data processing module 40 stores the strain variation of each strain sensing module 10 in the data storage module 45 .

[0103] Figure 8 A test data graph of the third strain sensing module of the present application is shown.

[0104] For example, Figure 8 As shown, taking the third strain sensing module 13 as an example, the third strain sensing module 13 tests the strain variation of 100 wafers during the wafer removal process inside the Foup. Figure 8 As shown, the strain change of the 97th wafer exceeded the preset threshold, indicating that the 97th wafer had wafer sticking during the wafer removal process.

[0105] Optionally, the data processing module 40 receives a preset number of strain changes from at least one strain sensing module 10. When an average strain change of the preset number of strain changes is greater than a second preset threshold, it is determined that the wafer transfer robot has a risk of wafer sticking.

[0106] For example, taking the first strain sensing module 11 as an example, the data processing module 40 acquires the strain acquisition signal of the first strain sensing module 11 in real time. When the motion control module 50 controls the wafer transfer robot to move to the wafer placement station for wafer placement, the first strain sensing module 11 acquires the first strain acquisition signal ε1001 when the wafer transfer robot reaches the wafer placement position. When the motion control module 50 controls the wafer transfer robot to place the wafer at the wafer placement completion position, the first strain sensing module 11 acquires the second strain acquisition signal ε2001 when the wafer transfer robot reaches the wafer placement completion position.

[0107] The data processing module 40 calculates the strain variation Δε1=abs(ε1001−ε2001) of the first strain sensing module 11 . Similarly, the strain variation Δε2 of the second strain sensing module 12 and the strain variation Δε3 of the third strain sensing module 13 can be obtained.

[0108] The data processing module 40 determines the difference between the average value of the strain variation of 50 consecutive points of each strain sensing module 10 or the average strain variation of 100 consecutive wafers and a second preset threshold value, where the second preset threshold value is customized by the user according to the needs.

[0109] When the average strain variation of at least one strain sensing module 10 satisfies the second preset threshold ≤ average strain variation ≤ first preset threshold, the data processing module 40 determines that there is a risk of wafer sticking in the wafer transfer robot and issues an alarm.

[0110] For example, Fig. 9As shown, taking the third strain sensing module 13 as an example, within the range of 1200-1500, the average strain variation of the third strain sensing module 13 exceeds the second preset threshold value, indicating that the wafer transfer robot has a risk of wafer sticking.

[0111] With this setting, the sticking phenomenon during wafer transfer can be predicted, so that the risk of sticking can be foreseen in advance, thereby reducing the probability of wafer damage.

[0112] Through the above embodiments, the present application can obtain the strain acquisition signal of the wafer transfer robot at different target positions by setting at least one strain sensing module on the wafer transfer robot; the strain change amount can be obtained according to the strain acquisition signal at different target positions, and based on the comparison between the strain change amount and the first preset threshold, it can be determined whether the wafer sticking phenomenon occurs on the wafer transfer robot or inside the Foup.

[0113] According to another aspect of the present application, the present application provides a method for identifying wafer sticking phenomenon, which is used to identify wafer sticking phenomenon on a wafer transfer robot and wafer sticking phenomenon inside a Foup.

[0114] Fig.10 A flow chart showing a method for identifying wafer sticking according to an embodiment of the present application; Fig.11 Another flow chart of the wafer sticking phenomenon identification method according to the embodiment of the present application is shown.

[0115] like Fig.10 As shown, the recognition method may include steps S100 to S600. Exemplarily, the recognition method may be executed by a recognition system with computing capabilities.

[0116] According to an example embodiment, in step S100 , the recognition system collects strain collection signals of the wafer transfer robot at a target position according to a collection instruction.

[0117] For example, the identification system includes a strain sensing module, which is disposed on a wafer transport robot to collect strain collection signals of the wafer transport robot.

[0118] In step S200 , the recognition system receives and amplifies the strain acquisition signal.

[0119] For example, the recognition system includes an amplifying circuit, which receives strain acquisition signals acquired by multiple strain sensing modules and performs amplification processing. The amplification factor A can be customized according to user needs.

[0120] In step S300, the recognition system performs filtering processing on the amplified strain acquisition signal to obtain strain acquisition data.

[0121] For example, the recognition system receives the amplified strain acquisition signal and performs filtering on the strain acquisition signal. The recognition system includes a filtering circuit, which uses a low-pass filter. Since the vibration frequency of the wafer is below 100Hz during the wafer sticking phenomenon recognition process, the cutoff frequency resistor and capacitor can be configured to 100Hz through the filtering circuit. The configuration formula can be:

[0122]

[0123] Among them, Fp is the cut-off frequency, R2 is the resistor, and C3 is the capacitor.

[0124] In step S400, the identification system receives first strain acquisition data and second strain acquisition data; wherein the first strain acquisition data is generated based on a strain acquisition signal of a wafer transfer robot at a first target position acquired by at least one strain sensing module according to a first acquisition instruction, and the second strain acquisition data is generated based on a strain acquisition signal of a wafer transfer robot at a second target position acquired by at least one strain sensing module according to a second acquisition instruction.

[0125] In step S500 , the recognition system generates a strain variation based on the first strain acquisition data and the second strain acquisition data.

[0126] In step S600 , the recognition system determines that wafer sticking occurs when the strain variation of at least one strain sensing module is greater than a first preset threshold.

[0127] For example, the recognition system collects signals from each strain sensing module in real time when the wafer transfer robot is performing wafer pick-up and placement operations in the aligner or foam (i.e., the moment the wafer contacts the strain sensing module) to determine the deformation of the wafer transfer robot in the XY direction. It can analyze the deformation caused by the wafer transfer robot and the force conditions of each wafer contact point, thereby further determining whether wafer sticking occurs at the wafer contact point.

[0128] For example, when the wafer transfer robot performs a normal pick-up and placement operation in the Aligner or Foup, the recognition system will also obtain a certain strain acquisition signal and obtain a certain strain change. Therefore, the strain change under normal conditions is used as the first preset threshold. The first preset threshold can be obtained by simulation calculation or based on empirical test calculation, and this application is not limited here.

[0129] According to the example embodiment, when the strain variation of at least one strain sensing module is greater than the first preset threshold, it indicates that the strain sensing module has detected abnormal deformation, and the recognition system can determine that wafer sticking occurs, and then issue an alarm prompt.

[0130] Alternatively, if Fig.11 As shown, the identification method may further include steps S700 - S800 .

[0131] In step S700 , the identification system receives a preset number of strain changes of at least one strain sensing module.

[0132] In step S800, the recognition system determines that there is a risk of wafer sticking in the wafer transfer robot when the average strain variation of a preset number of strain variations is greater than a second preset threshold.

[0133] For example, the recognition system acquires the strain acquisition signal of the strain sensing module in real time. When the motion control module controls the wafer transfer robot to move to the wafer placement station to place the wafer, the strain sensing module collects the first strain acquisition signal ε1001 when the wafer transfer robot reaches the wafer placement position. When the motion control module controls the wafer transfer robot to place the wafer at the wafer placement completion position, the strain sensing module collects the second strain acquisition signal ε2001 when the wafer transfer robot reaches the wafer placement completion position.

[0134] The recognition system calculates the strain change of the strain sensing module:

[0135] Δε1=abs(ε1001-ε2001)

[0136] The recognition system determines the difference between the average value of the strain changes of 50 consecutive points of each strain sensing module or the average strain changes of 100 consecutive wafers and a second preset threshold value, where the second preset threshold value is customized by the user according to the needs.

[0137] When the average strain change of at least one strain sensing module satisfies: the second preset threshold ≤ average strain change ≤ first preset threshold, the recognition system determines that there is a risk of wafer sticking in the wafer transfer robot, and then issues an alarm.

[0138] With this setting, the sticking phenomenon during wafer transfer can be predicted, so that the risk of sticking can be foreseen in advance, thereby reducing the probability of wafer damage.

[0139] Through the above embodiments, the present application can obtain the strain acquisition signal of the wafer transfer robot at different target positions by setting at least one strain sensing module on the wafer transfer robot; the strain change amount can be obtained according to the strain acquisition signal at different target positions, and based on the comparison between the strain change amount and the first preset threshold, it can be determined whether the wafer sticking phenomenon occurs on the wafer transfer robot or inside the Foup.

[0140] According to another aspect of the present application, an electronic device is provided, which includes: one or more processors; and a storage device for storing one or more programs, which, when executed by the one or more processors, enables the one or more processors to implement the identification method described above.

[0141] According to another aspect of the present application, a non-volatile computer-readable storage medium is provided, wherein a computer program is stored on the storage medium, and when the computer program is executed by a processor, the identification method described above can be implemented.

[0142] Finally, it should be noted that the above is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions of the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer sticking phenomenon recognition system, characterized in that: include: At least one strain sensing module is arranged on the wafer transfer robot and collects the strain collection signal of the wafer transfer robot at the target position according to the collection instruction; A signal amplification module receives and amplifies the strain acquisition signal; A filtering module performs filtering processing on the amplified strain acquisition signal to obtain strain acquisition data; A data processing module receives first strain acquisition data and second strain acquisition data; wherein the first strain acquisition data is generated based on a strain acquisition signal of the wafer transfer robot at a first target position acquired by the at least one strain sensing module according to a first acquisition instruction, and the second strain acquisition data is generated based on a strain acquisition signal of the wafer transfer robot at a second target position acquired by the at least one strain sensing module according to a second acquisition instruction; The data processing module generates a strain variation based on the first strain acquisition data and the second strain acquisition data, and determines that a wafer sticking phenomenon occurs when the strain variation of at least one strain sensing module is greater than a first preset threshold.

2. The identification system according to claim 1, characterized in that: The wafer transfer robot is a hand fork type robot, and the at least one strain sensing module at least includes a first strain sensing module, a second strain sensing module and a third strain sensing module; The first strain sensing module is horizontally arranged at the bottom of the hand fork of the hand fork manipulator to collect the horizontal strain signal of the hand fork manipulator; The second strain sensing module is vertically arranged at the bottom of the hand fork portion and is arranged at a first preset distance from the first strain sensing module to collect strain signals in the vertical direction of the hand fork type manipulator; The third strain sensing module is vertically arranged at the bottom of the hand fork portion and is arranged at a second preset distance from the second strain sensing module to collect strain signals of the hand fork type manipulator in the vertical direction.

3. The identification system according to claim 1, characterized in that: The wafer transfer robot is a circular robot, and the at least one strain sensing module includes at least a first strain sensing module, a second strain sensing module and a third strain sensing module; The first strain sensing module is horizontally arranged at the top of the circular portion of the circular manipulator to collect the horizontal strain signal of the circular manipulator; The second strain sensing module is vertically arranged at one side end of the circular portion of the circular manipulator to collect strain signals in the vertical direction of the circular manipulator; The third strain sensing module is vertically arranged at the bottom of the circular portion of the circular manipulator to collect strain signals of the circular manipulator in the vertical direction.

4. The identification system according to claim 2 or 3, characterized in that: The identification system further comprises: A strain compensation sensor module is arranged on the wafer transfer robot and is used to measure the strain measurement change value caused by environmental change factors; The temperature compensation sensor module is used to measure the temperature measurement change value caused by temperature change factors; The strain measurement change value and the temperature measurement change value are used for compensation and correction of the strain acquisition data.

5. The identification system according to claim 1, characterized in that: The data processing module receives a preset number of strain changes of the at least one strain sensing module; When the average strain variation of the preset number of strain variations is greater than a second preset threshold, it is determined that the wafer transfer robot has a risk of wafer sticking.

6. A method for identifying wafer sticking phenomenon, characterized in that: The identification method is performed by the identification system according to any one of claims 1 to 5, and the identification method includes: Collecting a strain acquisition signal of the wafer transfer robot at a target position according to an acquisition instruction; receiving and amplifying the strain acquisition signal; Performing filtering processing on the amplified strain acquisition signal to obtain strain acquisition data; Receive first strain acquisition data and second strain acquisition data; wherein the first strain acquisition data is generated based on a strain acquisition signal of the wafer transfer robot at a first target position acquired by the at least one strain sensing module according to a first acquisition instruction, and the second strain acquisition data is generated based on a strain acquisition signal of the wafer transfer robot at a second target position acquired by the at least one strain sensing module according to a second acquisition instruction; generating a strain variation based on the first strain acquisition data and the second strain acquisition data; When the strain variation of at least one strain sensing module is greater than a first preset threshold, it is determined that wafer sticking occurs.

7. The identification method according to claim 6, characterized in that: The identification method further comprises: receiving a preset number of strain changes of the at least one strain sensing module; When the average strain variation of the preset number of strain variations is greater than a second preset threshold, it is determined that the wafer transfer robot has a risk of wafer sticking.

8. An electronic device, characterized in that: include: one or more processors; A storage device for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the identification method as described in any one of claims 6 or 7.

9. A non-volatile computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the identification method according to claim 6 or 7 is implemented.

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