SAC lens lamination defect detection method, device, electronic device and storage medium

Abstract

The present application discloses a method, apparatus, electronic device, and storage medium for detecting SAC lens lamination defects. The method includes obtaining a device image of a device to be inspected after a lamination process, wherein the device to be inspected includes multiple SAC lenses; preprocessing the device image to obtain position information of each SAC lens in the device image; performing an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result; the target SAC lens is any one of the multiple SAC lenses; and determining defect information present in the target SAC lens based on the analysis result. The embodiments of the present invention not only enable comprehensive defect detection of the device to be inspected after the lamination process, but also effectively improve the efficiency of detecting SAC lens lamination defects.

Description

Technical Field

[0001] The present application relates to the field of fiber laser technology, and in particular to a method, device, electronic device and storage medium for detecting SAC lens bonding defects. Background Art

[0002] During the fiber laser production process, a SAC lens (slow axis collimating lens) needs to be attached to the laser. The SAC lens attachment process directly affects the output power of the fiber laser. Therefore, defect detection is required on the device after the SAC lens is attached to ensure that the final fiber laser can meet production requirements.

[0003] In the related art, defect detection of SAC lens-bonded devices is typically performed through manual visual inspection. However, manual visual inspection requires operators to inspect the devices through a microscope, which not only reduces inspection efficiency but also poses eye hazards during long-term microscope operation. Furthermore, SAC lens bonding production capacity is high, and if operators rely solely on manual visual inspection for defect detection, they can only conduct spot checks, which makes it impossible to prevent defective devices from flowing into the next process, ultimately affecting the pass rate of the produced fiber lasers.

[0004] Therefore, how to perform comprehensive defect detection on devices after SAC lens bonding while improving detection efficiency has become a technical problem that needs to be solved urgently. Summary of the Invention

[0005] The embodiments of the present application provide a method, device, electronic device and storage medium for detecting defects in SAC lens bonding to solve the technical problems of being unable to fully detect devices after SAC lens bonding and having low detection efficiency.

[0006] In order to solve the above technical problems, the present invention provides a method for detecting SAC lens lamination defects, including the following steps:

[0007] Acquiring a device image of a device to be inspected after a bonding process, wherein the device to be inspected includes a plurality of SAC lenses;

[0008] Preprocessing the device image to obtain position information of each SAC lens in the device image;

[0009] Based on the position information, an abnormality analysis is performed on a target SAC lens to obtain an analysis result, where the target SAC lens is any one of the multiple SAC lenses;

[0010] Based on the analysis result, defect information of the target SAC lens is determined.

[0011] In an embodiment of the present invention, the step of preprocessing the device image to obtain position information of each SAC lens in the device image includes:

[0012] constructing a rectangular coordinate system in the device image;

[0013] The coordinate point information of each SAC lens in the rectangular coordinate system is determined, and the coordinate point information is used as the position information of each SAC lens.

[0014] In an embodiment of the present invention, the step of performing abnormality analysis on the target SAC lens based on the position information to obtain an analysis result includes:

[0015] determining, according to first position information of a target SAC lens, a difference between two endpoints of a first side of the target SAC lens, where the first side is any side constituting the target SAC lens;

[0016] In a case where the difference does not satisfy a standard difference threshold corresponding to the first side, a first analysis result of abnormality analysis performed on the target SAC lens is determined.

[0017] In an embodiment of the present invention, the step of performing abnormality analysis on the target SAC lens based on the position information to obtain an analysis result further includes:

[0018] Determining, based on the position information, a standard line along which each SAC lens is arranged on the device to be inspected, wherein the standard line is a straight line on which at least half of the second sides of the SAC lenses are located, and the second sides are any sides constituting the SAC lenses;

[0019] In a case where the second side of the target SAC lens is not located on the standard line, a second analysis result of abnormality analysis performed on the target SAC lens is determined.

[0020] In an embodiment of the present invention, after the step of determining the coordinate point information of each SAC lens in the rectangular coordinate system and using the coordinate point information as the position information of each SAC lens, the method further includes:

[0021] Performing grayscale processing on the device image to obtain a grayscale image corresponding to the device image;

[0022] Second position information of the glue is determined in the grayscale image.

[0023] In an embodiment of the present invention, the step of performing abnormality analysis on the target SAC lens based on the position information to obtain an analysis result includes:

[0024] Based on the first position information of the target SAC lens and the second position information of the glue, determining a first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and a second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens;

[0025] When the first vertical distance is greater than a preset glue coating vertical threshold, determining a third analysis result of abnormality analysis on the target SAC lens;

[0026] In a case where the second vertical distance is less than the glue coating vertical threshold, a fourth analysis result of abnormality analysis performed on the target SAC lens is determined.

[0027] In an embodiment of the present invention, the step of determining defect information of the target SAC lens based on the analysis result includes:

[0028] When the analysis result is the first analysis result, it is determined that the target SAC lens has a warping defect;

[0029] When the analysis result is the second analysis result, it is determined that the target SAC lens has a skew or offset defect;

[0030] When the analysis result is the third analysis result, it is determined that the target SAC lens has a defect of excessive glue coating;

[0031] When the analysis result is the fourth analysis result, it is determined that the target SAC lens has a defect of insufficient glue coating.

[0032] Secondly, in order to solve the same technical problem, the embodiment of the present application further provides a SAC lens bonding defect detection device, comprising:

[0033] an acquisition module, configured to acquire a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses;

[0034] a preprocessing module, configured to preprocess the device image to obtain position information of each SAC lens in the device image;

[0035] an analysis module, configured to perform an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result, wherein the target SAC lens is any one of the plurality of SAC lenses;

[0036] A defect determination module is used to determine defect information of the target SAC lens based on the analysis result.

[0037] In a third aspect, an embodiment of the present invention provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of any one of the above-described methods for detecting SAC lens fitting defects when executing the computer program.

[0038] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any one of the above-mentioned SAC lens bonding defect detection methods are implemented.

[0039] The embodiments of the present application provide a SAC lens bonding defect detection method, apparatus, electronic device, and storage medium. By preprocessing the device image of the device to be detected after the bonding process, the position information of each SAC lens in the device image is obtained, so that each SAC lens can be directly analyzed for abnormalities based on the position information in the device image. Finally, the bonding defect detection of each SAC lens is determined based on the abnormality analysis results, avoiding the use of manual visual inspection for defect detection. This not only improves the bonding defect detection efficiency of the SAC lens, but also achieves the purpose of comprehensive defect detection of the device after the SAC lens is bonded. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 This is a flow chart of a method for detecting SAC lens lamination defects provided by an embodiment of the present invention;

[0042] Figure 2 This is a flow chart of an abnormality analysis method provided by an embodiment of the present invention;

[0043] Figure 3a is a schematic diagram of a device image provided by an embodiment of the present invention;

[0044] Figure 3b This is a second flow chart of the abnormality analysis method provided by an embodiment of the present invention;

[0045] Figure 4a is a schematic diagram of a device image provided by an embodiment of the present invention;

[0046] Figure 4bThis is a second flow chart of the abnormality analysis method provided by an embodiment of the present invention;

[0047] Figure 5 1 is a structural diagram of a SAC lens lamination defect detection device provided by an embodiment of the present invention;

[0048] Figure 6 This is a schematic structural diagram of an electronic device provided by an embodiment of the present invention;

[0049] Figure 7 This is another structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0051] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. In this application, " / " means "or".

[0052] Reference numerals and / or reference letters may be repeated in different examples in this application. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0053] In the embodiments of the present invention, during the fiber laser production process, a SAC lens (slow-axis collimating lens) must be attached to the laser. The SAC lens attachment process directly affects the fiber laser's output power. Therefore, defect detection is required on the device after the SAC lens is attached to ensure that the final fiber laser meets production requirements.

[0054] In the related art, defect detection of SAC lens-bonded devices is typically performed through manual visual inspection. However, manual visual inspection requires operators to inspect the devices through a microscope, which not only reduces inspection efficiency but also poses eye hazards during long-term microscope operation. Furthermore, SAC lens bonding production capacity is high, and if operators rely solely on manual visual inspection for defect detection, they can only conduct spot checks, which makes it impossible to prevent defective devices from flowing into the next process, ultimately affecting the pass rate of the produced fiber lasers.

[0055] Therefore, how to perform comprehensive defect detection on devices after SAC lens bonding while improving detection efficiency has become a technical problem that needs to be solved urgently.

[0056] In order to solve the above technical problems, the present application provides a method for detecting SAC lens lamination defects. Figure 1 , Figure 1 FIG. 1 is a flow chart of a method for detecting SAC lens lamination defects provided by an embodiment of the present invention. Figure 1 As shown, the SAC lens bonding defect detection method provided in this embodiment includes steps 101 to 104;

[0057] Step 101: Acquire a device image of a device to be inspected after a bonding process, wherein the device to be inspected includes a plurality of SAC lenses.

[0058] In this embodiment, in order to avoid the problems of low detection efficiency and harm to human eyes caused by manual visual inspection when detecting SAC lens fitting defects, this embodiment can use machine vision to detect SAC lens fitting defects instead of manual visual inspection. This not only avoids harm to human eyes, but also improves detection efficiency.

[0059] In this embodiment, a camera can be used to capture the device to be inspected after the bonding process in a direction perpendicular to the surface of the device to be inspected, to obtain a device image of the device to be inspected. It should be noted that this embodiment requires capturing a device image including multiple SAC lenses to be inspected. Specifically, the device image can include one SAC lens to be inspected, or multiple SAC lenses to be inspected. The number of SAC lenses included in the device image can be customized based on actual inspection requirements and is not specifically limited here.

[0060] Step 102: pre-process the device image to obtain position information of each SAC lens in the device image.

[0061] In this embodiment, in order to improve the detection efficiency of fitting defect detection of SAC lenses, this embodiment pre-processes the device image after obtaining the device image of the device to be detected to obtain the position information of each SAC lens in the device image, so as to facilitate subsequent fitting defect detection of the SAC lens based on the position information obtained by preprocessing.

[0062] As an optional embodiment, this embodiment can construct a coordinate system in the device image to determine the position information of each SAC lens in the device image by means of the coordinate system. Specifically, the step of pre-processing the device image to obtain the position information of each SAC lens in the device image provided in this embodiment can include: constructing a rectangular coordinate system in the device image; determining the coordinate point information of each SAC lens in the rectangular coordinate system, and using the coordinate point information as the position information of each SAC lens.

[0063] In this embodiment, any position in the device image can be used as the origin to construct a rectangular coordinate system, so that the coordinate point information of each SAC lens can be determined through the constructed rectangular coordinate system.

[0064] As another optional embodiment, this embodiment can also identify the SAC lens in the device image through image recognition, and then calculate the relative position information of the SAC lens in the device image, which is used as the position information of each SAC lens.

[0065] Step 103: Based on the position information, perform an abnormality analysis on the target SAC lens to obtain an analysis result, where the target SAC lens is any one of the multiple SAC lenses.

[0066] Among them, the abnormality analysis provided in this embodiment mainly analyzes the SAC lens after the bonding process to see whether there are abnormal problems in the position information. The position information where these abnormal problems occur can correspond to one of the bonding defects of the SAC lens, so that the specific bonding defects of the SAC lens can be determined based on the analysis results obtained by the abnormal analysis of the position information.

[0067] In some embodiments, see Figure 2 , Figure 2 FIG. 1 is a flow chart of an abnormality analysis method provided by an embodiment of the present invention. Figure 2 As shown, the abnormality analysis method provided in this embodiment may include steps 201 to 202;

[0068] Step 201 : determining a difference between two endpoints of a first side of a target SAC lens according to first position information of the target SAC lens, where the first side is any side constituting the target SAC lens.

[0069] After determining the position information of the SAC lens, this embodiment can select one of the SAC lenses as the target SAC lens and obtain the first position information of the target SAC lens, such as its coordinate point information or relative position information, and then determine the difference between the two endpoints of the first side of the target SAC lens in the first position information, that is, calculate the length of the first side of the target SAC lens.

[0070] Step 202 : When the difference does not meet the difference standard threshold corresponding to the first side, determine a first analysis result of abnormality analysis on the target SAC lens.

[0071] In this embodiment, to determine the specific lamination defect of the SAC lens, this embodiment may use the normal length range of the side length of the SAC lens after normal lamination, as specified in the lamination process standard corresponding to the SAC lens, as the standard difference threshold corresponding to the first side, to perform abnormality analysis on the first side of the target SAC lens. If the difference, i.e., the side length of the first side, does not meet the standard difference threshold corresponding to the first side, the abnormality analysis result of the target SAC lens is determined to be a first analysis result with an abnormality.

[0072] Optionally, when the difference, that is, the length of the first side, meets a standard difference threshold corresponding to the first side, it can be determined that there is no abnormality in the target SAC lens.

[0073] Among them, the first side provided in this embodiment is any side of the target SAC lens, but in order to improve the detection accuracy, this embodiment can determine the lengths of all sides of the target SAC lens to determine whether each side length meets the corresponding difference standard threshold, thereby judging whether there is any abnormality in the target SAC lens.

[0074] It should be noted that the SAC lens bonding process primarily uses glue to bond the SAC lens. If too much glue is applied to the bottom of the SAC lens, the bonded SAC lens will have a warped edge defect, thereby affecting the final product's pass rate. Therefore, this embodiment can determine whether the target SAC lens has an abnormality by determining whether the length of the first side of the target SAC lens does not meet the standard difference threshold corresponding to the first side. When the length of the first side of the target SAC lens is less than the standard difference threshold, it can be determined that the target SAC lens is warped due to excessive glue applied to the bottom of the target SAC lens, resulting in the first side length not meeting the standard difference threshold corresponding to the first side. The target SAC lens can then be determined to have an abnormality.

[0075] In other embodiments, see Figure 3a and Figure 3b , Figure 3a is a schematic diagram of a device image provided by an embodiment of the present invention, Figure 3b This is a second flow chart of the abnormality analysis method provided by the embodiment of the present invention. Figure 3a and Figure 3b As shown, the abnormality analysis method provided in this embodiment may include steps 301 to 302;

[0076] Step 301: Determine a standard line for arranging each SAC lens on the device to be inspected based on the position information. The standard line is a straight line where at least half of the second sides of the SAC lenses are located. The second side is any side constituting the SAC lenses.

[0077] It should be noted that when there are multiple SAC lenses on the device to be detected provided in this embodiment, the multiple SAC lenses are arranged and adjacent to each other in sequence (that is, two adjacent SAC lenses share a common edge, which is a side adjacent to the second side). Figure 3a The standard line provided in this embodiment is a straight line formed by connecting the second sides of most of the SAC lenses after multiple SAC lenses are arranged.

[0078] If a majority (more than half) of the SAC lenses in the device to be inspected have lamination defects, meaning that the second edges of most of the SAC lenses are not aligned, the second edges of the SAC lenses without lamination defects can be extended, with the second edges and their extensions serving as reference lines. Specifically, SAC lenses without defects can be identified based on corresponding lamination process standards or through manual visual inspection.

[0079] Step 302 : When the second side of the target SAC lens is not located on the standard line, determine a second analysis result of abnormality analysis on the target SAC lens.

[0080] In this embodiment, in order to detect whether the target SAC lens has a skew or offset bonding defect, this embodiment can directly detect whether the second side of the target SAC lens is on the standard line. If the second side of the target SAC lens does not coincide with the standard line, it can be determined that the analysis result of the abnormality analysis of the target SAC lens is a second analysis result of a skew or offset bonding defect, such as Figure 3a Otherwise, it can be determined that the target SAC lens does not have any skew or offset fitting defects, such as Figure 3a The SAC lens is shown on the right side of the figure.

[0081] Step 104: Determine defect information of the target SAC lens based on the analysis result.

[0082] In this embodiment, after obtaining different analysis results (a first analysis result and a second analysis result), this embodiment can determine specific defect information of the target SAC lens based on the obtained analysis results. Specifically, the step of determining the defect information of the target SAC lens based on the analysis results provided in this embodiment can include: if the analysis result is the first analysis result, determining that the target SAC lens has a warping defect; if the analysis result is the second analysis result, determining that the target SAC lens has a skew or offset defect.

[0083] In this way, by performing an abnormal analysis on the position information of each SAC lens in the device image, it is possible to determine whether the target SAC lens in the device image has a fitting defect and to determine the specific defect information. Therefore, compared with the manual visual inspection method, the embodiment of the present invention can not only achieve comprehensive fitting defect detection, but also effectively improve the detection efficiency of fitting defect detection. At the same time, it can also avoid damage to the human eye caused by long-term microscope operation, effectively ensuring the safety of the method provided by this embodiment.

[0084] In some embodiments, the output power of the final fiber laser is affected not only by lamination defects such as warping, skew, or offset of the SAC lens, but also by the glue applied around the SAC lens not exceeding the specified range during the lamination process. Therefore, this embodiment also requires testing to see if the glue applied around the SAC lens in the device under test meets the specified range.

[0085] In order to detect whether the glue coated around the SAC lens in the device to be inspected meets the requirements, this embodiment can, after the step of determining the coordinate point information of each SAC lens in the rectangular coordinate system and using the coordinate point information as the position information of each SAC lens, perform the following: grayscale processing on the device image to obtain a grayscale image corresponding to the device image; and determine the second position information of the glue in the grayscale image.

[0086] In this way, the grayscale image can effectively improve the accuracy of identifying the glue coating range, thereby ensuring the accuracy of SAC lens bonding defect detection. The grayscale processing method for the device image can be any grayscale processing method in the prior art, as long as it can highlight the specific glue coating range in the device image, and is not specifically limited here.

[0087] After obtaining a grayscale image that highlights the specific application range of the glue in the device image, the second position information of the glue in the grayscale image can be determined. The second position information of the glue can be determined by determining coordinate point information as described in the above embodiment, or by performing image recognition and determining the relative position information of the identified glue in the grayscale image. Any method that can determine the position information of the glue in the grayscale image is not specifically limited here.

[0088] For details, see Figure 4a and Figure 4b , Figure 4a is a schematic diagram of a device image provided by an embodiment of the present invention, Figure 4b This is a second flow chart of the abnormality analysis method provided by the embodiment of the present invention. Figure 4a and Figure 4b As shown, the abnormality analysis method provided in this embodiment may include steps 401 to 402;

[0089] Step 401, based on the first position information of the target SAC lens and the second position information of the glue, determine the first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and the second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens.

[0090] In this embodiment, in order to detect whether the overflow range of the glue coated around the target SAC lens meets the requirements of the corresponding bonding process standards, this embodiment needs to first determine the farthest point in the glue coating range in terms of the vertical distance from the second side of the target SAC lens, and the first vertical distance from the second side of the target SAC lens, as well as determine the closest point in the glue coating range in terms of the vertical distance from the second side of the target SAC lens, and the second vertical distance from the second side of the target SAC lens, that is, determine the farthest point and the closest point in the glue coating range, and the distance from the edge of the target SAC lens.

[0091] Step 402 : When the first vertical distance is greater than a preset glue coating vertical threshold, determine a third analysis result of abnormality analysis on the target SAC lens.

[0092] Step 403 : When the second vertical distance is less than the glue coating vertical threshold, determine a fourth analysis result of abnormality analysis on the target SAC lens.

[0093] After determining the glue coating vertical threshold value specified in the bonding process standard corresponding to the target SAC lens, by judging whether the first vertical distance is greater than the glue coating vertical threshold value, if it is greater than the glue coating vertical threshold value, it can be determined that the analysis result of the abnormality analysis on the target SAC lens is a third analysis result indicating that there is a bonding defect of excessive glue coating, such as Figure 4a By judging whether the second vertical distance is less than the vertical threshold of glue coating, if it is less than the vertical threshold of glue coating, it can be determined that the analysis result of the abnormal analysis of the target SAC lens is a fourth analysis result of the bonding defect of insufficient glue coating, as shown in FIG. Figure 4a The SAC lens marked in the lower middle section is shown.

[0094] In this way, after determining the third analysis result and the fourth analysis result, the step of determining the defect information of the target SAC lens based on the analysis results provided in this embodiment may also include: when the analysis result is the third analysis result, determining that the target SAC lens has the defect of excessive glue coating; when the analysis result is the fourth analysis result, determining that the target SAC lens has the defect of too little glue coating.

[0095] In summary, an embodiment of the present invention provides a method for detecting SAC lens lamination defects, comprising obtaining a device image of a device to be inspected after a lamination process, wherein the device to be inspected includes multiple SAC lenses; preprocessing the device image to obtain position information of each SAC lens in the device image; performing an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result, wherein the target SAC lens is any one of the multiple SAC lenses; and determining defect information present in the target SAC lens based on the analysis result. Using this embodiment of the present invention, not only can comprehensive defect detection be performed on the device to be inspected after the lamination process, but it can also effectively improve the efficiency of detecting SAC lens lamination defects.

[0096] In order to solve the same technical problem, this embodiment also provides a SAC lens bonding defect detection device. For details, see Figure 5 , Figure 5 FIG. 1 is a structural diagram of a SAC lens lamination defect detection device provided by an embodiment of the present invention. Figure 5 As shown, the SAC lens bonding defect detection device 500 provided by the embodiment of the present invention includes: an acquisition module 501, a pre-processing module 502, an analysis module 503, and a defect determination module 504;

[0097] The acquisition module 501 is used to acquire a device image of the device to be inspected after the bonding process, where the device to be inspected includes a plurality of SAC lenses.

[0098] The pre-processing module 502 is configured to pre-process the device image to obtain position information of each SAC lens in the device image.

[0099] In this embodiment, the preprocessing module 502 provided in this embodiment is specifically used to: construct a rectangular coordinate system in the device image; determine the coordinate point information of each SAC lens in the rectangular coordinate system, and use the coordinate point information as the position information of each SAC lens.

[0100] The analysis module 503 is configured to perform an abnormality analysis on a target SAC lens based on the position information to obtain an analysis result, where the target SAC lens is any one of the multiple SAC lenses.

[0101] In some embodiments, the analysis module 503 provided in this embodiment is specifically used to: determine the difference between the two endpoints of the first side of the target SAC lens based on the first position information of the target SAC lens, where the first side is any side constituting the target SAC lens; and determine a first analysis result of abnormal analysis of the target SAC lens when the difference does not meet the difference standard threshold corresponding to the first side.

[0102] In other embodiments, the analysis module 503 provided in this embodiment is further specifically used to: determine, based on the position information, a standard line on which each SAC lens is arranged on the device to be inspected, wherein the standard line is a straight line on which at least half of the second sides of the SAC lenses are located, and the second side is any side constituting the SAC lens; and determine a second analysis result of abnormal analysis of the target SAC lens when the second side of the target SAC lens is not on the standard line.

[0103] The defect determination module 504 is configured to determine defect information of the target SAC lens based on the analysis result.

[0104] As an optional embodiment, the pre-processing module 502 provided in this embodiment is further configured to: perform grayscale processing on the device image to obtain a grayscale image corresponding to the device image; and determine the second position information of the glue in the grayscale image.

[0105] The analysis module 503 provided in this embodiment is also specifically used to: determine the first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and the second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens based on the first position information of the target SAC lens and the second position information of the glue; when the first vertical distance is greater than a preset vertical threshold of the glue coating, determine a third analysis result of abnormal analysis of the target SAC lens; when the second vertical distance is less than the vertical threshold of the glue coating, determine a fourth analysis result of abnormal analysis of the target SAC lens.

[0106] In this embodiment, the defect determination module 504 provided in this embodiment is specifically used to: when the analysis result is the first analysis result, determine that the target SAC lens has a warping defect; when the analysis result is the second analysis result, determine that the target SAC lens has a skew or offset defect; when the analysis result is the third analysis result, determine that the target SAC lens has an excessive glue coating defect; when the analysis result is the fourth analysis result, determine that the target SAC lens has an insufficient glue coating defect.

[0107] During specific implementation, the above modules and / or units can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities. The specific implementation of the above modules and / or units can refer to the previous method embodiments. The specific beneficial effects that can be achieved can also be found in the beneficial effects in the previous method embodiments, which will not be repeated here.

[0108] Also, see Figure 6 , Figure 6 This is a structural diagram of an electronic device provided by an embodiment of the present invention. The electronic device may be a mobile terminal such as a smart phone, a tablet computer, or the like. Figure 6 As shown, the electronic device 600 includes a processor 601 and a memory 602. The processor 601 is electrically connected to the memory 602.

[0109] The processor 601 is the control center of the electronic device 600. It uses various interfaces and lines to connect various parts of the entire electronic device. By running or loading applications stored in the memory 602 and calling data stored in the memory 602, it executes various functions of the electronic device 600 and processes data, thereby monitoring the electronic device 600 as a whole.

[0110] In this embodiment, the processor 601 in the electronic device 600 will load the instructions corresponding to the processes of one or more applications into the memory 602 according to the following steps, and the processor 601 will run the application stored in the memory 602, thereby implementing any step in the SAC lens fitting defect detection method provided in the above embodiment.

[0111] The electronic device 600 can implement the steps in any embodiment of the SAC lens fitting defect detection method provided in the embodiments of the present invention. Therefore, it can achieve the beneficial effects that can be achieved by any SAC lens fitting defect detection method provided in the embodiments of the present invention. Please refer to the previous embodiments for details and will not be repeated here.

[0112] See Figure 7 , Figure 7 is another structural diagram of an electronic device provided by an embodiment of the present invention, such as Figure 7 As shown, Figure 7 The electronic device 700 is a block diagram of a specific structure of an electronic device provided by an embodiment of the present invention, which can be used to implement the SAC lens bonding defect detection method provided in the above embodiment. The electronic device 700 can be a mobile terminal such as a smart phone or a laptop computer.

[0113] RF circuit 710 is used to receive and transmit electromagnetic waves, converting electromagnetic waves into electrical signals, thereby communicating with a communication network or other devices. RF circuit 710 may include various existing circuit components for performing these functions, such as an antenna, a radio frequency transceiver, a digital signal processor, an encryption / decryption chip, a subscriber identity module (SIM) card, memory, and the like. RF circuit 710 can communicate with various networks such as the Internet, an intranet, or a wireless network, or communicate with other devices via a wireless network. Such wireless networks may include cellular telephone networks, wireless local area networks, or metropolitan area networks. The wireless networks may utilize various communication standards, protocols, and technologies, including but not limited to Global System for Mobile Communication (GSM), Enhanced Data GSM Environment (EDGE), Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (such as Institute of Electrical and Electronics Engineers standards IEEE 802.11a, IEEE 802.11b, IEEE802.11g, and / or IEEE802.11n), Voice over Internet Protocol (VoIP), Worldwide Interoperability for Microwave Access (Wi-Max), other protocols for email, instant messaging, and short messaging, and any other suitable communication protocols, including those currently undeveloped.

[0114] The memory 720 can be used to store software programs and modules, such as the program instructions / modules corresponding to the SAC lens bonding defect detection method in the above-mentioned embodiment. The processor 780 executes various functional applications and performs SAC lens bonding defect detection by running the software programs and modules stored in the memory 720.

[0115] The memory 720 may include a high-speed random access memory (RAM) and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 720 may further include a memory remotely located relative to the processor 780, and such remote memory may be connected to the electronic device 700 via a network. Examples of such networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0116] The input unit 730 can be used to receive digital or character input and generate keyboard, mouse, joystick, optical, or trackball signal input related to user settings and function control. Specifically, the input unit 730 may include a touch-sensitive surface 731 and other input devices 732. The touch-sensitive surface 731, also known as a touch display or touchpad, can detect user touch operations on or near it (for example, operations performed by a user using a finger, stylus, or any other suitable object or accessory on or near the touch-sensitive surface 731) and drive corresponding connected devices according to a pre-set program. Optionally, the touch-sensitive surface 731 may include a touch detection device and a touch controller. The touch detection device detects the user's touch position and detects signals generated by the touch operation, transmitting the signals to the touch controller. The touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 780. It can also receive and execute commands from the processor 780. In addition, the touch-sensitive surface 731 can be implemented using various types of touch devices, including resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch-sensitive surface 731, the input unit 730 may further include other input devices 732. Specifically, the other input devices 732 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, power keys, etc.), a trackball, a mouse, and a joystick.

[0117] The display unit 740 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the electronic device 700. These graphical user interfaces can be composed of graphics, text, icons, videos, or any combination thereof. The display unit 740 may include a display panel 741. Optionally, the display panel 741 can be configured in the form of an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or the like. Furthermore, the touch-sensitive surface 731 can cover the display panel 741. When the touch-sensitive surface 731 detects a touch operation on or near it, it transmits the information to the processor 780 to determine the type of touch event. The processor 780 then provides a corresponding visual output on the display panel 741 based on the type of touch event. Although the touch-sensitive surface 731 and the display panel 741 are shown in the figure as two independent components to implement input and output functions, in some embodiments, the touch-sensitive surface 731 and the display panel 741 can be integrated to implement input and output functions.

[0118] The electronic device 700 may also include at least one sensor 750, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 741 according to the brightness of the ambient light, and the proximity sensor may generate an interrupt when the flip cover is closed or closed. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that recognize the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that the electronic device 700 may also be configured with, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be described here.

[0119] Audio circuit 760, speaker 761, and microphone 762 provide an audio interface between the user and electronic device 700. Audio circuit 760 can convert received audio data into electrical signals and transmit them to speaker 761, which then converts them into sound signals for output. Microphone 762, on the other hand, converts collected sound signals into electrical signals, which are then received by audio circuit 760 and converted into audio data. The audio data is then processed by processor 780 and transmitted via RF circuit 710 to, for example, another terminal. Alternatively, the audio data can be output to memory 720 for further processing. Audio circuit 760 may also include an earphone jack to allow communication between external headphones and electronic device 700.

[0120] Electronic device 700 can help users receive requests, send information, etc. through a transmission module 770 (e.g., a Wi-Fi module), providing users with wireless broadband Internet access. Although transmission module 770 is shown in the figure, it is understandable that it is not a required component of electronic device 700 and can be omitted as needed without changing the essence of the invention.

[0121] Processor 780 is the control center of electronic device 700. It connects all components of the phone using various interfaces and circuits. By running or executing software programs and / or modules stored in memory 720 and accessing data stored in memory 720, it executes various functions of electronic device 700 and processes data, thereby providing overall monitoring of the electronic device. Optionally, processor 780 may include one or more processing cores. In some embodiments, processor 780 may integrate an application processor and a modem processor. The application processor primarily handles the operating system, user interface, and application programs, while the modem processor primarily handles wireless communications. It is understood that the modem processor may not be integrated into processor 780.

[0122] The electronic device 700 also includes a power supply 790 (e.g., a battery) for supplying power to various components. In some embodiments, the power supply can be logically connected to the processor 780 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. The power supply 790 can also include any components such as one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, and a power status indicator.

[0123] Although not shown, the electronic device 700 also includes a camera (e.g., a front-facing camera, a rear-facing camera), a Bluetooth module, etc., which will not be described in detail here. Specifically, in this embodiment, the display unit of the electronic device is a touch screen display, and the mobile terminal also includes a memory and one or more programs, wherein the one or more programs are stored in the memory and are configured such that one or more processors execute the one or more programs to implement any step of the SAC lens bonding defect detection method provided in the above embodiment.

[0124] In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can be found in the previous method embodiments and will not be repeated here.

[0125] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above-described embodiments can be accomplished through instructions, or by controlling related hardware through instructions. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor. To this end, an embodiment of the present invention provides a storage medium storing a plurality of instructions that, when executed by a processor, can implement any step in the SAC lens bonding defect detection method provided in the above-described embodiments.

[0126] The storage medium may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0127] Since the instructions stored in the storage medium can execute the steps in any embodiment of the SAC lens fitting defect detection method provided in the embodiments of the present invention, the beneficial effects that can be achieved by any SAC lens fitting defect detection method provided in the embodiments of the present invention can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0128] The above describes in detail the SAC lens lamination defect detection method, device, electronic device, and storage medium provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to help understand the method and core concept of the present application. Furthermore, those skilled in the art will appreciate that, based on the concepts of the present application, variations in the specific implementation methods and scope of application may occur. In summary, the contents of this specification should not be construed as limiting the present application. Furthermore, those skilled in the art may make improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also considered within the scope of protection of the present invention.

Claims

1. A method for detecting SAC lens lamination defects, characterized in that: The following steps are involved: Acquiring a device image of a device to be inspected after a bonding process, wherein the device to be inspected includes a plurality of SAC lenses; Preprocessing the device image to obtain position information of each SAC lens in the device image; determining, according to first position information of a target SAC lens, a difference between two endpoints of a first side of the target SAC lens, where the first side is any side constituting the target SAC lens; When the difference does not satisfy a standard difference threshold corresponding to the first side, determining a first analysis result of abnormality analysis on the target SAC lens, the target SAC lens being any one of the plurality of SAC lenses; Based on the first analysis result, defect information of the target SAC lens is determined.

2. The SAC lens lamination defect detection method according to claim 1, characterized in that: The step of preprocessing the device image to obtain position information of each SAC lens in the device image includes: constructing a rectangular coordinate system in the device image; The coordinate point information of each SAC lens in the rectangular coordinate system is determined, and the coordinate point information is used as the position information of each SAC lens.

3. The SAC lens lamination defect detection method according to claim 2, characterized in that: The method further comprises: Determining, based on the position information, a standard line along which each SAC lens is arranged on the device to be inspected, wherein the standard line is a straight line on which at least half of the second sides of the SAC lenses are located, and the second sides are any sides constituting the SAC lenses; In a case where the second side of the target SAC lens is not located on the standard line, a second analysis result of abnormality analysis performed on the target SAC lens is determined.

4. The SAC lens lamination defect detection method according to claim 3, characterized in that: After the step of determining the coordinate point information of each SAC lens in the rectangular coordinate system and using the coordinate point information as the position information of each SAC lens, the method further includes: Performing grayscale processing on the device image to obtain a grayscale image corresponding to the device image; Second position information of the glue is determined in the grayscale image.

5. The SAC lens lamination defect detection method according to claim 4, characterized in that: The method further comprises: Based on the first position information of the target SAC lens and the second position information of the glue, determining a first vertical distance between the farthest point in the glue from the second side of the target SAC lens and the SAC lens, and a second vertical distance between the closest point in the glue from the second side of the target SAC lens and the SAC lens; When the first vertical distance is greater than a preset glue coating vertical threshold, determining a third analysis result of abnormality analysis on the target SAC lens; In a case where the second vertical distance is less than the glue coating vertical threshold, a fourth analysis result of abnormality analysis performed on the target SAC lens is determined.

6. The SAC lens lamination defect detection method according to claim 5, characterized in that: The step of determining defect information of the target SAC lens based on the first analysis result includes: When the analysis result is the first analysis result, it is determined that the target SAC lens has a warping defect; The method further comprises: When the analysis result is the second analysis result, it is determined that the target SAC lens has a skew or offset defect; When the analysis result is the third analysis result, it is determined that the target SAC lens has a defect of excessive glue coating; When the analysis result is the fourth analysis result, it is determined that the target SAC lens has a defect of insufficient glue coating.

7. A SAC lens bonding defect detection device, characterized in that: include: an acquisition module, configured to acquire a device image of the device to be inspected after the bonding process, wherein the device to be inspected includes a plurality of SAC lenses; a preprocessing module, configured to preprocess the device image to obtain position information of each SAC lens in the device image; an analysis module, configured to determine, based on first position information of a target SAC lens, a difference between two endpoints of a first side of the target SAC lens, where the first side is any side constituting the target SAC lens; and, if the difference does not satisfy a standard difference threshold corresponding to the first side, determine a first analysis result of an abnormality analysis of the target SAC lens, where the target SAC lens is any one of the plurality of SAC lenses; A defect determination module is used to determine defect information of the target SAC lens based on the first analysis result.

8. An electronic device, characterized in that: The electronic device includes a processor, a memory, and a computer program stored in the memory and executable on the processor, and the processor implements the steps of the method according to any one of claims 1 to 6 when executing the computer program.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the method according to any one of claims 1 to 6 are implemented.

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