TLVR coupling inductor and preparation method thereof

Abstract

The invention discloses a TLVR coupling inductor and a preparation method thereof. The TLVR coupling inductor comprises a first coil, a second coil and a magnetic core shell, the first coil comprises a first main body coil, a first pin and a second pin; the second coil comprises a second main body coil, a third pin and a fourth pin; the magnetic core shell comprises a first magnetic core, a second magnetic core and a containing cavity located between the first magnetic core and the second magnetic core. The end face, close to one side of the second magnetic core, of the first magnetic core makes direct contact with the end face, close to one side of the first magnetic core, of the second magnetic core. The first main body coil and the second main body coil are positioned in the accommodating cavity; wherein the first main body coil and the second main body coil are overlapped, and the second main body coil is located on the inner circumference of the first main body coil; the first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed. According to the TLVR coupling inductor, the first magnetic core and the second magnetic core are arranged to make direct contact, and the magnetic shielding effect of the TLVR coupling inductor can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of inductors, and in particular to a TLVR coupled inductor and a preparation method thereof. Background Art

[0002] As the demand for computing power in data centers continues to grow, the power consumption and current requirements of processors such as CPUs and GPUs in servers are also increasing. TLVR coupled inductors can provide fast transient response, help stabilize the power supply output voltage, and meet the power supply requirements of high-performance processors.

[0003] The existing method for preparing TLVR coupled inductors is to first place the first coil and the second coil in a receiving cavity formed by the first magnetic core and the second magnetic core, and then glue the first magnetic core and the second magnetic core together to form a TLVR coupled inductor. The above preparation method adopts an assembly production process. The first magnetic core and the second magnetic core in the TLVR coupled inductor produced by the assembly production process cannot be in direct contact, and there is a gap filled with glue between the first magnetic core and the second magnetic core, which will affect the magnetic shielding effect of the TLVR coupled inductor. Summary of the invention

[0004] The present invention provides a TLVR coupled inductor and a preparation method thereof, so as to solve the problem that the existing TLVR coupled inductor has a poor magnetic shielding effect.

[0005] In a first aspect, an embodiment of the present invention provides a TLVR coupled inductor, characterized in that it includes a first coil, a second coil and a magnetic core shell;

[0006] The first coil includes a first main body coil, a first pin and a second pin; one end of the first main body coil is connected to the first pin, and the other end of the first main body coil is connected to the second pin;

[0007] The second coil includes a second main body coil, a third pin and a fourth pin; one end of the second main body coil is connected to the third pin, and the other end of the second main body coil is connected to the fourth pin;

[0008] The magnetic core shell includes a first magnetic core, a second magnetic core, and a receiving cavity between the first magnetic core and the second magnetic core; an end surface of the first magnetic core close to the second magnetic core is in direct contact with an end surface of the second magnetic core close to the first magnetic core;

[0009] The first main body coil and the second main body coil are located in the accommodating cavity; wherein the first main body coil and the second main body coil are overlapped, and the second main body coil is located at the inner periphery of the first main body coil;

[0010] The first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed.

[0011] Optionally, a side of the first main body coil away from the second main body coil is in direct contact with the magnetic core shell.

[0012] Optionally, the TLVR coupled inductor further includes an insulating layer;

[0013] The insulating layer covers the exposed surface of the magnetic core shell and does not contact the exposed surfaces of the first pin, the second pin, the third pin and the fourth pin.

[0014] In a second aspect, an embodiment of the present invention provides a method for preparing a TLVR coupled inductor, which is used to prepare the TLVR coupled inductor as described in the first aspect, and the preparation method includes:

[0015] Prepare a first coil and a second coil; wherein the first coil includes a first main body coil, a first pin and a second pin; and the second coil includes a second main body coil, a third pin and a fourth pin;

[0016] preparing a first magnetic core;

[0017] Assembling the first coil, the second coil and the first magnetic core to obtain a first assembly;

[0018] placing the first assembly in a forming mold;

[0019] Prepare a second magnetic core, place the second magnetic core in the molding die, and crimp the second magnetic core onto the first magnetic core; wherein an end surface of the first magnetic core close to the second magnetic core is in direct contact with an end surface of the second magnetic core close to the first magnetic core;

[0020] The molding die is removed to obtain an initial TLVR coupled inductor; wherein the first main body coil and the second main body coil are located in a receiving cavity between the first magnetic core and the second magnetic core, and the first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed;

[0021] The initial TLVR coupled inductor is baked to obtain a TLVR coupled inductor.

[0022] Optionally, preparing the first coil and the second coil includes:

[0023] The first coil is prepared by stamping, casting or profile bending;

[0024] The second coil is prepared by stamping, casting or profile bending.

[0025] Optionally, preparing the first magnetic core includes:

[0026] A magnetic mixture is filled in a first magnetic core mold and pressed to obtain the first magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue.

[0027] Optionally, preparing a second magnetic core, placing the second magnetic core in the molding die, and crimping the second magnetic core onto the first magnetic core comprises:

[0028] Filling a magnetic mixture in a second magnetic core mold and pressing to obtain the second magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue;

[0029] placing the prepared second magnetic core in the molding die;

[0030] The second magnetic core and the first magnetic core are crimped together.

[0031] Optionally, preparing a second magnetic core, placing the second magnetic core in the molding die, and crimping the second magnetic core onto the first magnetic core comprises:

[0032] The forming mold is filled with a magnetic mixture, and the second magnetic core crimped onto the first magnetic core is obtained by pressing. The magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue.

[0033] Optionally, the TLVR coupled inductor further includes an insulating layer;

[0034] The preparation method further comprises:

[0035] Grinding the edges of the magnetic core shell;

[0036] The insulating layer is prepared on the exposed surface of the magnetic core shell; wherein the insulating layer is not in contact with the exposed surfaces of the first pin, the second pin, the third pin and the fourth pin.

[0037] Optionally, the preparation method further comprises:

[0038] A metal layer is prepared on the surfaces where the first pin, the second pin, the third pin and the fourth pin are exposed.

[0039] The technical solution of the embodiment of the present invention can avoid the situation where the magnetic shielding effect of the TLVR coupled inductor is poor due to the presence of a gap filled with glue between the first magnetic core and the second magnetic core by setting the first magnetic core and the second magnetic core in direct contact, which is beneficial to improving the magnetic shielding effect of the TLVR coupled inductor.

[0040] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 A schematic diagram of the structure of a TLVR coupled inductor provided in an embodiment of the present invention;

[0043] Figure 2 A three-dimensional assembly diagram of a TLVR coupled inductor provided in an embodiment of the present invention;

[0044] Figure 3 A cross-sectional schematic diagram of a TLVR coupled inductor provided in an embodiment of the present invention;

[0045] Figure 4 A schematic diagram of the structure of another TLVR coupled inductor provided in an embodiment of the present invention;

[0046] Figure 5 A flowchart of a method for preparing a TLVR coupled inductor provided in an embodiment of the present invention;

[0047] Figure 6 A schematic diagram of the structure of a first coil provided in an embodiment of the present invention;

[0048] Figure 7 A schematic diagram of the structure of a second coil provided by an embodiment of the present invention;

[0049] Figure 8 A schematic structural diagram of a first magnetic core provided by an embodiment of the present invention;

[0050] Fig. 9 A schematic structural diagram of a first assembly provided by an embodiment of the present invention;

[0051] Fig.10A schematic diagram of the structure of a two-core magnetic core provided by an embodiment of the present invention;

[0052] Fig.11 A flow chart of another method for preparing a TLVR coupled inductor provided in an embodiment of the present invention; DETAILED DESCRIPTION

[0053] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0054] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only used to illustrate the relative positional relationship between the components or components, and does not particularly limit the specific installation orientation of the components or components.

[0055] Figure 1 A schematic diagram of the structure of a TLVR coupled inductor provided in an embodiment of the present invention, Figure 2 A three-dimensional assembly diagram of a TLVR coupled inductor provided in an embodiment of the present invention, referring to Figure 1 and Figure 2, the TLVR coupled inductor in the embodiment of the present invention includes a first coil 10, a second coil 20 and a magnetic core shell 30. The first coil 10 includes a first main body coil 11, a first pin 12 and a second pin 13. One end of the first main body coil 11 is connected to the first pin 12, and the other end of the first main body coil 11 is connected to the second pin 13. The second coil 20 includes a second main body coil 21, a third pin 22 and a fourth pin 23. One end of the second main body coil 21 is connected to the third pin 22, and the other end of the second main body coil 21 is connected to the fourth pin 23. The magnetic core shell 30 includes a first magnetic core 31, a second magnetic core 32 and a receiving cavity between the first magnetic core 31 and the second magnetic core 32. The end surface of the first magnetic core 31 close to the second magnetic core 32 is in direct contact with the end surface of the second magnetic core 32 close to the first magnetic core 31. The first main body coil 11 and the second main body coil 21 are located in the receiving cavity. Among them, the first main body coil 11 and the second main body coil 21 are overlapped, and the second main body coil 21 is located on the inner periphery of the first main body coil 11. The first pin 12 , the second pin 13 , the third pin 22 and the fourth pin 23 are located between the first magnetic core 31 and the second magnetic core 32 and are exposed.

[0056] Exemplarily, the first coil 10 including the first main body coil 11, the first pin 12 and the second pin 13 may be integrally formed. Specifically, the first main body coil 11 may be formed by bending a conductive metal sheet covered with insulation, and the first pin 12 and the second pin 13 may be formed by bending outwardly the two ends of the first main body coil 11. The second coil 20 including the second main body coil 21, the third pin 22 and the fourth pin 23 may also be integrally formed. Specifically, the second main body coil 21 may be formed by bending a conductive metal sheet covered with insulation, and the third pin 22 and the fourth pin 23 may be formed by bending inwardly the two ends of the second main body coil 21.

[0057] The first main body coil 11 is used to react with the magnetic core shell 30 to generate a first inductance when the first pin 12 and the second pin 13 are energized; the second main body coil 21 is used to react with the magnetic core shell 30 to generate a second inductance coupled with the first inductance when the third pin 22 and the fourth pin 23 are energized. After the TLVR coupled inductor is applied to the power supply circuit of the processor, the power supply demand of the processor can be met by controlling the power supply of the first pin 12, the second pin 13, the third pin 22 and the fourth pin 23 that are exposed to the outside. It should be noted that in order to prevent short circuits between the pins, the first pin 12, the second pin 13, the third pin 22 and the fourth pin 23 are set not to contact each other.

[0058] In the process of preparing the first magnetic core 31 and the second magnetic core 32 in the embodiment of the present invention, glue is added to the raw materials for preparing the first magnetic core 31 and the second magnetic core 32. Therefore, after the prepared first coil 10, the second coil 20, the first magnetic core 31 and the second magnetic core 32 are assembled as shown in the following figure, Figure 2 After the three-dimensional assembly diagram shown in the figure is assembled, the first magnetic core 31 and the second magnetic core 32 will be crimped and baked, and the first magnetic core 31 and the second magnetic core 32 can be fixedly connected without setting glue between the first magnetic core 31 and the second magnetic core 32. In this way, the first magnetic core 31 and the second magnetic core 32 in the embodiment of the present invention can be in direct contact, which is beneficial to improve the magnetic shielding effect of the TLVR coupled inductor.

[0059] The technical solution of the embodiment of the present invention can avoid the situation where the magnetic shielding effect of the TLVR coupled inductor is poor due to the presence of a gap filled with glue between the first magnetic core and the second magnetic core by setting the first magnetic core and the second magnetic core in direct contact, which is beneficial to improving the magnetic shielding effect of the TLVR coupled inductor.

[0060] Based on the above embodiments, Figure 3 A cross-sectional schematic diagram of a TLVR coupled inductor provided in an embodiment of the present invention, referring to Figure 3 , a side of the first main body coil 11 away from the second main body coil 21 is in direct contact with the magnetic core housing 30 .

[0061] It is understandable that when the first magnetic core 31 and the second magnetic core 32 are crimped and baked, the first magnetic core 31 and the second magnetic core 32 will be compressed. During this process, the distance between the side of the first main coil 11 away from the second main coil 21 and the magnetic core shell 30 will continue to shrink until they are in contact.

[0062] In the embodiment of the present invention, by setting the side of the first main coil 11 away from the second main coil 21 to be in direct contact with the magnetic core shell 30, the heat generated by the first main coil 11 due to power-on can be quickly transferred to the outside through the magnetic core shell 30, which is beneficial to improving the heat dissipation efficiency of the TLVR coupled inductor.

[0063] Figure 4 A schematic diagram of the structure of another TLVR coupled inductor provided in an embodiment of the present invention, referring to Figure 4 The TLVR coupled inductor in the embodiment of the present invention further includes an insulating layer 40. The insulating layer 40 covers the exposed surface of the magnetic core housing 30 and does not contact the exposed surfaces of the first pin 12, the second pin 13, the third pin 22 and the fourth pin 23.

[0064] In order to protect the TLVR coupled inductor, extend the service life of the TLVR coupled inductor, and prevent the TLVR coupled inductor from short-circuiting with external metal parts, the embodiment of the present invention covers the exposed surface of the magnetic core housing 30 with an insulating layer 40. At the same time, in order to prevent the insulating layer 40 from affecting the power supply of the first pin 12, the second pin 13, the third pin 22, and the fourth pin 23, the embodiment of the present invention sets the insulating layer 40 to be non-contact with the exposed surface of the first pin 12, the second pin 13, the third pin 22, and the fourth pin 23.

[0065] The embodiment of the present invention provides a method for preparing a TLVR coupled inductor, which is used to prepare the TLVR coupled inductor described in any of the above embodiments of the present invention. Figure 5 A flowchart of a method for preparing a TLVR coupled inductor provided in an embodiment of the present invention, referring to Figure 5 , the preparation method of the TLVR coupled inductor in the embodiment of the present invention includes:

[0066] S110, preparing a first coil and a second coil, wherein the first coil includes a first main body coil, a first pin and a second pin, and the second coil includes a second main body coil, a third pin and a fourth pin.

[0067] As a feasible implementation manner, preparing the first coil includes: preparing the first coil by stamping, casting or profile bending.

[0068] For example, Figure 6 A schematic diagram of the structure of a first coil provided in an embodiment of the present invention, combined with Figure 6 The method of stamping and forming the first coil 10 specifically includes: preparing a copper sheet, placing the copper sheet on a mold corresponding to the first coil 10, and using a press machine and a mold to make the copper sheet into Figure 6 A first coil 10 is shown.

[0069] The first coil 10 is prepared by casting, which specifically includes: melting copper and pouring it into a mold of the first coil 10, and then cooling and solidifying to obtain a first coil 10. Figure 6 A first coil 10 is shown.

[0070] It should be noted that after the first coil 10 is prepared by stamping or casting, the first coil 10 needs to be ground and a layer of insulating layer is covered on the surface of the first main coil 11 of the first coil 10. The purpose of grinding is to remove burrs on the surface of the first coil 10 to prevent the burrs from damaging its own insulating layer and the insulating layer on the surface of the second main coil 21.

[0071] The first coil 10 is prepared by bending the profile, specifically comprising: bending the conductive metal sheet coated with insulation into a "U-shape" to obtain a Figure 6 The first main body coil 11 shown in FIG. 1 is bent outward at both ends of the first main body coil 11 to obtain a Figure 6 The first pin 12 and the second pin 13 are shown. The insulating layer on the first pin 12 and the second pin 13 can be removed in this step or in a subsequent step, which is not limited.

[0072] The preparation of the second coil includes: preparing the second coil by stamping, casting or profile bending.

[0073] For example, Figure 7 A schematic diagram of the structure of a second coil provided in an embodiment of the present invention, combined with Figure 7 The method of stamping and forming the second coil 20 specifically includes: preparing a copper sheet, placing the copper sheet on a mold corresponding to the second coil 20, and using a press machine and a mold to make the copper sheet into Figure 7 The second coil 20 is shown.

[0074] The method of casting to prepare the second coil 20 specifically includes: melting copper and pouring it into a mold of the second coil 20, and after cooling and solidification, a second coil 20 can be obtained. Figure 7 The second coil 20 is shown.

[0075] It should be noted that after the second coil 20 is prepared by stamping or casting, the second coil 20 needs to be ground and an insulating layer is covered on the surface of the second main coil 21 of the second coil 20. The purpose of grinding is to remove burrs on the surface of the second coil 20 to prevent the burrs from damaging its own insulating layer and the insulating layer on the surface of the first main coil 11.

[0076] The second coil 20 is prepared by bending the profile, which specifically includes: bending the conductive metal sheet coated with insulation into a "U-shape" to obtain a Figure 7 The second main body coil 21 shown in FIG. 1 is bent inward at both ends of the second main body coil 21 to obtain a Figure 7 The third pin 22 and the fourth pin 23 are shown. The insulating layer on the third pin 22 and the fourth pin 23 can be removed in this step or in a subsequent step, which is not limited.

[0077] S120, preparing a first magnetic core.

[0078] As a feasible implementation mode, preparing the first magnetic core includes: filling a first magnetic core mold with a magnetic mixture, and pressing to obtain the first magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue.

[0079] For example, Figure 8A schematic diagram of the structure of a first magnetic core provided in an embodiment of the present invention, referring to Figure 8 The preparation of the first magnetic core 31 specifically includes: placing magnetic core powder (at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder) mixed with glue (such as epoxy resin) into a mold corresponding to the first magnetic core 31 and pressing it to obtain a magnetic core powder such as Figure 8 The first magnetic core 31 shown. It should be noted that the first magnetic core 31 is not heated during the pressing process, and the presence of glue can ensure that the first magnetic core 31 can be pressed into shape. The specific parameters of the pressing are as follows: the pressure is controlled at 1t / cm 2 -4t / cm 2 In order to facilitate the subsequent movement and assembly, the first magnetic core 31 after pressing needs to be baked at a low temperature to extend the molding time of the first magnetic core 31 and avoid damage to the first magnetic core 31 during the subsequent movement and assembly process. The specific parameter requirements of low temperature baking are as follows: the temperature is controlled between 60℃-260℃, and the time is controlled between 10min-120min.

[0080] S130, assembling the first coil, the second coil and the first magnetic core to obtain a first assembly.

[0081] Fig. 9 The schematic diagram of the structure of a first assembly provided by an embodiment of the present invention is as follows: the first coil 10, the second coil 20 and the first magnetic core 31 are assembled as follows: Fig. 9 The first assembly can be obtained by placing the first coil 10 and the second coil 20 in the relative positions shown. Specifically, the first coil 10 and the second coil 20 are placed in the groove surrounded by the three sides of the first magnetic core 31, the second main coil 21 of the second coil 20 is located at the inner periphery of the first main coil 11 of the first coil 10, and the first pin 12 and the second pin 13 of the first coil 10 and the third pin 22 and the fourth pin 23 of the second coil 20 are arranged on the unarranged side of the first magnetic core 31.

[0082] S140, placing the first assembly in a molding mold.

[0083] Exemplary, reference Figure 1 , the molding die can be Figure 1 The TLVR coupled inductor shown is matched to a rectangular parallelepiped tube.

[0084] S150, prepare a second magnetic core, place the second magnetic core in a molding die, and crimp the second magnetic core onto the first magnetic core, wherein an end face of the first magnetic core close to the second magnetic core is in direct contact with an end face of the second magnetic core close to the first magnetic core.

[0085] As a feasible implementation method, preparing a second magnetic core, placing the second magnetic core in a molding mold, and crimping the second magnetic core on the first magnetic core includes: filling a magnetic mixture in the second magnetic core mold and pressing to obtain the second magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder and glue; placing the prepared second magnetic core in a molding mold; and crimping the second magnetic core and the first magnetic core.

[0086] For example, Fig.10 A schematic diagram of a structure of two magnetic cores provided in an embodiment of the present invention, referring to Fig.10 The preparation of the second magnetic core 32 specifically includes: placing magnetic core powder (at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder) mixed with glue (such as epoxy resin) into a mold corresponding to the second magnetic core 32 and pressing the mold to obtain a magnetic core powder such as Fig.10 The second magnetic core 32 shown. It should be noted that the second magnetic core 32 is not heated during the pressing process, and the presence of glue can ensure that the second magnetic core 32 can be pressed and formed. The specific parameters of the pressing are as follows: the pressure is controlled at 1t / cm 2 -4t / cm 2 To facilitate the subsequent movement, the pressed second magnetic core 32 needs to be baked at a low temperature to extend the molding time of the second magnetic core 32 and prevent the second magnetic core 32 from being damaged during the subsequent movement. The specific parameter requirements of the low temperature baking are as follows: the temperature is controlled between 60°C and 260°C, and the time is controlled between 10min and 120min.

[0087] The prepared second magnetic core 32 is placed in the molding die, and the first magnetic core 31 is pressed downward to achieve a fixed connection between the first magnetic core 31 and the second magnetic core 32. In the process of pressing the first magnetic core 31 downward, the contact area between the first magnetic core 31 and the second magnetic core 32 fuses and is then connected together. It should be noted that heating is performed during the crimping process of the first magnetic core 31 and the second magnetic core 32. The specific parameters of the crimping are as follows: the temperature is controlled between 60°C and 200°C, and the pressure is controlled at 2t / cm 2 -7t / cm 2 between.

[0088] As another feasible implementation, preparing a second magnetic core, placing the second magnetic core in a molding die, and crimping the second magnetic core onto the first magnetic core includes: filling a magnetic mixture in the molding die, pressing to obtain a second magnetic core crimped onto the first magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue.

[0089] Exemplarily, the preparation of the second magnetic core 32 specifically includes: placing magnetic core powder (at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder) mixed with glue (such as epoxy resin) into a molding die for pressing, so that not only can the magnetic core 32 be obtained, but also the magnetic core powder (at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder) can be obtained. Fig.10 The second magnetic core 32 shown can also realize the crimping of the first magnetic core 31 and the second magnetic core 32, which is conducive to simplifying the steps, and can make the first main body coil 11 and the second main body coil 21 fully contact with the magnetic core shell 30, which can further improve the heat dissipation efficiency of the TLVR coupled inductor. It should be noted that in this embodiment, heating will be performed during the preparation of the second magnetic core 32 and the crimping of the first magnetic core 31 and the second magnetic core 32. The specific parameter requirements of the crimping are as follows: the temperature is controlled between 60℃-200℃, and the pressure is controlled at 2t / cm 2 -7t / cm 2 between.

[0090] S160, removing the molding mold to obtain an initial TLVR coupled inductor, wherein the first main body coil and the second main body coil are located in the accommodating cavity between the first magnetic core and the second magnetic core, and the first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed.

[0091] S170 , baking the initial TLVR coupled inductor to obtain a TLVR coupled inductor.

[0092] For example, in an environment containing nitrogen, the initial TLVR coupled inductor obtained by removing the molding die is baked to obtain the following Figure 1 The TLVR coupled inductor shown in FIG. The purpose of baking is to solidify the glue in the first magnetic core 31 and the second magnetic core 32 and enhance the strength of the TLVR coupled inductor. The specific parameter requirements for baking are as follows: the temperature is controlled between 100°C and 200°C. Baking is performed in an environment containing nitrogen, and the oxygen content in the environment is controlled below 200ppm, which can prevent the TLVR coupled inductor from yellowing and insulation failure.

[0093] refer to Figure 4 , the TLVR coupled inductor also includes an insulation 40, Fig.11 A flowchart of another method for preparing a TLVR coupled inductor provided in an embodiment of the present invention, Fig.11 The embodiment shown enriches the process of the method for preparing the TLVR coupled inductor based on the above embodiment. Fig.11 , the preparation method of the TLVR coupled inductor in the embodiment of the present invention includes:

[0094] S210, preparing a first coil and a second coil, wherein the first coil includes a first main body coil, a first pin and a second pin, and the second coil includes a second main body coil, a third pin and a fourth pin.

[0095] S220, preparing a first magnetic core.

[0096] S230, assembling the first coil, the second coil and the first magnetic core to obtain a first assembly.

[0097] S240, placing the first assembly in a molding mold.

[0098] S250, prepare a second magnetic core, place the second magnetic core in a molding die, and crimp the second magnetic core onto the first magnetic core, wherein an end face of the first magnetic core close to the second magnetic core is in direct contact with an end face of the second magnetic core close to the first magnetic core.

[0099] S260, removing the molding mold to obtain an initial TLVR coupled inductor, wherein the first main coil and the second main coil are located in the accommodating cavity between the first magnetic core and the second magnetic core, and the first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed.

[0100] S270 , baking the initial TLVR coupled inductor to obtain a TLVR coupled inductor.

[0101] S280, grinding the edges of the magnetic core shell.

[0102] Exemplary, combined Figure 4 The TLVR coupled inductor prepared in steps S210-S270 is placed in a chamfering machine for grinding to grind all edges (a total of 12) of the magnetic core shell 30, and the magnetic core shell includes a first magnetic core 31 and a second magnetic core 32. The edges of the magnetic core shell are ground to facilitate the preparation of the insulating layer and prevent the edges of the magnetic core shell 30 from affecting the coating of the insulating layer.

[0103] S290. Prepare an insulating layer on the exposed surface of the magnetic core shell, wherein the insulating layer does not contact the exposed surfaces of the first pin, the second pin, the third pin, and the fourth pin.

[0104] Exemplary, combined Figure 4 First, the ground TLVR coupled inductor is placed in a roller spraying machine for roller spraying coating, and then the paint on the exposed surface of each pin (first pin 12, second pin 13, third pin 22 and fourth pin 23) is cleaned by laser stripping or grinding until the pin is exposed from the copper surface. It should be noted that the embodiment of the present invention does not limit the material constituting the insulating layer 40, and those skilled in the art can set it by themselves.

[0105] Optionally, after preparing the insulating layer on the exposed surface of the magnetic core shell, the method for preparing the TLVR coupled inductor in the embodiment of the present invention further includes: preparing a metal layer on the exposed surfaces of the first pin, the second pin, the third pin and the fourth pin.

[0106] Exemplarily, a layer of copper-nickel-tin alloy is electroplated on the exposed copper surface of each pin. Preparing a metal layer on the exposed surface of each pin is beneficial to improving the conductivity of each pin.

[0107] Optionally, the final TLVR coupled inductors need to be sorted by appearance and tested for electrical properties to select the TLVR coupled inductors that meet the specification requirements. The electrical test mainly includes the measurement of inductance value, impedance value and inductance coupling coefficient. Only when the inductance value, impedance value and coupling coefficient of the TLVR coupled inductor meet the requirements, the prepared TLVR coupled inductor will be determined to be qualified. Exemplarily, the coupling coefficient needs to be greater than 90%, that is, 0.90.

[0108] Table 1

[0109]

[0110] It should be noted that LS@1M in Table 1 refers to the inductance value of the TLVR coupled inductor measured at a frequency of 1 MHz, DCR in Table 1 refers to the impedance value of the TLVR coupled inductor, and LS@60A in Table 1 refers to the saturated inductance value when a saturated current of 60 A is input to the TLVR coupled inductor. It can be seen from Table 1 that the various performances (inductance value, impedance value, power consumption and coupling coefficient) of the TLVR coupled inductor in the embodiment of the present invention are better than those of the TLVR coupled inductor in the prior art.

[0111] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A TLVR coupled inductor, characterized in that: It includes a first coil, a second coil and a magnetic core shell; The first coil includes a first main body coil, a first pin and a second pin; one end of the first main body coil is connected to the first pin, and the other end of the first main body coil is connected to the second pin; The second coil includes a second main body coil, a third pin and a fourth pin; one end of the second main body coil is connected to the third pin, and the other end of the second main body coil is connected to the fourth pin; The magnetic core shell includes a first magnetic core, a second magnetic core, and a receiving cavity between the first magnetic core and the second magnetic core; an end surface of the first magnetic core close to the second magnetic core is in direct contact with an end surface of the second magnetic core close to the first magnetic core; The first main body coil and the second main body coil are located in the accommodating cavity; wherein the first main body coil and the second main body coil are overlapped, and the second main body coil is located at the inner periphery of the first main body coil; The first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed.

2. The TLVR coupled inductor according to claim 1, characterized in that: A side of the first main body coil away from the second main body coil is in direct contact with the magnetic core housing.

3. The TLVR coupled inductor according to claim 1, characterized in that: The TLVR coupled inductor further comprises an insulating layer; The insulating layer covers the exposed surface of the magnetic core shell and does not contact the exposed surfaces of the first pin, the second pin, the third pin and the fourth pin.

4. A method for preparing a TLVR coupled inductor, for preparing the TLVR coupled inductor according to any one of claims 1 to 3, characterized in that: The preparation method comprises: Prepare a first coil and a second coil; wherein the first coil includes a first main body coil, a first pin and a second pin; and the second coil includes a second main body coil, a third pin and a fourth pin; preparing a first magnetic core; Assembling the first coil, the second coil and the first magnetic core to obtain a first assembly; placing the first assembly in a forming mold; Prepare a second magnetic core, place the second magnetic core in the molding die, and crimp the second magnetic core onto the first magnetic core; wherein an end surface of the first magnetic core close to the second magnetic core is in direct contact with an end surface of the second magnetic core close to the first magnetic core; The molding die is removed to obtain an initial TLVR coupled inductor; wherein the first main body coil and the second main body coil are located in a receiving cavity between the first magnetic core and the second magnetic core, and the first pin, the second pin, the third pin and the fourth pin are located between the first magnetic core and the second magnetic core and are exposed; The initial TLVR coupled inductor is baked to obtain a TLVR coupled inductor.

5. The preparation method according to claim 4, characterized in that: Preparing the first coil and the second coil includes: The first coil is prepared by stamping, casting or profile bending; The second coil is prepared by stamping, casting or profile bending.

6. The preparation method according to claim 4, characterized in that: Preparing the first magnetic core includes: A magnetic mixture is filled in a first magnetic core mold and pressed to obtain the first magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue.

7. The preparation method according to claim 4, characterized in that: Preparing a second magnetic core, placing the second magnetic core in the molding die, and crimping the second magnetic core onto the first magnetic core comprises: Filling a magnetic mixture in a second magnetic core mold and pressing to obtain the second magnetic core, wherein the magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue; placing the prepared second magnetic core in the molding die; The second magnetic core and the first magnetic core are crimped together.

8. The preparation method according to claim 4, characterized in that: Preparing a second magnetic core, placing the second magnetic core in the molding die, and crimping the second magnetic core onto the first magnetic core comprises: The forming mold is filled with a magnetic mixture, and the second magnetic core crimped onto the first magnetic core is obtained by pressing. The magnetic mixture includes at least one of iron-nickel powder, sendustine powder, amorphous powder and nanocrystalline powder, and glue.

9. The preparation method according to claim 4, characterized in that: The TLVR coupled inductor further comprises an insulating layer; The preparation method further comprises: Grinding the edges of the magnetic core shell; The insulating layer is prepared on the exposed surface of the magnetic core shell; wherein the insulating layer is not in contact with the exposed surfaces of the first pin, the second pin, the third pin and the fourth pin.

10. The preparation method according to claim 4, characterized in that: The preparation method further comprises: A metal layer is prepared on the surfaces where the first pin, the second pin, the third pin and the fourth pin are exposed.

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