A vacuum transfer valve, control method, and semiconductor thin film device

Abstract

This invention discloses a vacuum transfer valve, a control method, and a semiconductor thin-film device. The vacuum transfer valve is applied to a semiconductor thin-film device. The vacuum transfer valve includes a sealed valve housing, with a first seal disposed between the sealed valve housing and the process chamber. It also includes a second seal disposed on the sealed valve housing, located between the first seal and the process chamber; and a connecting portion disposed on the sealed valve housing for fixing the second seal to the sealed valve housing. By providing a connecting portion and a second seal on the sealed valve housing of the vacuum transfer valve, and positioning the second seal between the first seal and the process chamber, this invention allows for easy replacement of the second seal even if it is corroded or leaks gas. This avoids disconnection between the sealed valve housing and the process chamber, thereby shortening equipment downtime and improving seal replacement efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process technology, and in particular to a vacuum transfer valve, control method, and semiconductor thin film equipment. Background Technology

[0002] Semiconductor thin-film equipment typically includes an EFEM (Equipment Front-End Module), LL (Vacuum and Atmosphere Switching Chamber), TM (Transfer Module), and PM (Process Module). Different modules are isolated by pneumatically or electrically controlled vacuum transfer valves. These valves generally consist of a drive mechanism, a sealing valve plate, and a sealing valve housing. The valve located between the transfer module (TM) and the process module (PM) is directly exposed to the process reaction and is therefore susceptible to corrosion from high temperatures, plasma, and certain special gases. This can easily lead to leaks in the valve plate seals and the valve housing seals on the PM side, resulting in wafer contamination, impacting final product yield, and even causing system downtime and damage to other vacuum components. Furthermore, the radial atmospheric pressure difference between the sealing rings of the transfer module (TM) and the process module (PM) affects the lifespan of the sealing rings, thus impacting the product manufacturing process.

[0003] To ensure normal equipment operation, the sealing valve plates (or rubber rings) and sealing rubber rings on the vacuum transfer valves and valve boxes need to be replaced periodically. While the sealing valve plates (or rubber rings) can be replaced by disassembling the drive mechanism or the valve box top cover, replacing the sealing rings on the valve box requires disconnecting the process module (PM) from the valve box. Before disconnecting the PM, the equipment needs to be cooled, purged, and the special gas pipeline disconnected, and the extraction pipeline will also be connected to other plant facilities. Furthermore, restoring the machine to normal operation after replacing the rubber rings also requires time. Therefore, in practical applications, this complete process takes at least 7-10 days, which severely impacts the machine's uptime and incurs significant costs. Furthermore, due to differences in the thickness of the deposited film, the cleaning time of the cavity, the type of reaction gas, and the temperature inside the cavity, the service life of the sealing rings on the sealing valve box varies, ranging from as short as 6 months to as long as 18 to 36 months. This makes it difficult for operators to accurately control the replacement cycle of the sealing rings, which further leads to leakage during equipment operation, causing wafer contamination and further affecting product yield. Summary of the Invention

[0004] This invention provides a vacuum transmission valve, a control method, and a semiconductor thin film device, aiming to solve the problem of equipment downtime when replacing seals and improve the efficiency of seal replacement.

[0005] In a first aspect, embodiments of the present invention provide a vacuum transfer valve applied to a semiconductor thin film apparatus, the semiconductor thin film apparatus including a process chamber and a transfer chamber, the vacuum transfer valve including a sealing valve box disposed between the process chamber and the transfer chamber, a first sealing element being disposed between the sealing valve box and the process chamber, and the vacuum transfer valve further including:

[0006] The second sealing element is disposed on the sealing valve box and is located between the first sealing element and the process chamber;

[0007] The adapter is detachably disposed on the sealing valve box and is used to fix the second sealing element to the sealing valve box.

[0008] Furthermore, the space between the first seal and the second seal is a sealed cavity.

[0009] Furthermore, it also includes a control valve, which is connected to the sealed cavity via a first gas pipeline and is used to control the gas state within the sealed cavity.

[0010] Furthermore, the control valve includes a first diaphragm valve, which is connected to the first gas pipeline and is used to evacuate the sealed cavity.

[0011] Furthermore, the control valve includes a second diaphragm valve, which is connected to the first gas pipeline and is used to inflate the sealed cavity.

[0012] Furthermore, it also includes a gas detection device, which is connected to the sealed cavity via a second gas pipeline and is used to detect the gas state inside the sealed cavity.

[0013] Furthermore, the gas detection device is a residual gas analyzer.

[0014] Furthermore, the adapter is an adapter plate, which is detachably mounted on the sealing valve box via a fastener.

[0015] Secondly, embodiments of the present invention provide a control method for a vacuum transmission valve as described in the first aspect, wherein the space between the first sealing member and the second sealing member is a sealed cavity, and the vacuum transmission valve further includes a gas detection device, the gas detection device being connected to the sealed cavity via a second gas pipeline, and the control method includes:

[0016] The gas state of the sealed chamber between the first seal and the second seal is detected by a gas detection device;

[0017] The gas state of the sealed chamber is compared with a first preset threshold and a second preset threshold; wherein the first preset threshold is lower than the second preset threshold.

[0018] If the gas state in the sealed chamber does not reach the first preset threshold, the gas detection device continues to perform its detection action.

[0019] If the gas state in the sealed chamber reaches the first preset threshold but does not reach the second preset threshold, a level one alarm will be issued.

[0020] If the gas state in the sealed chamber reaches a second preset threshold, a level two alarm will be issued; wherein the alarm level of the level one alarm is lower than that of the level two alarm.

[0021] Thirdly, embodiments of the present invention provide a semiconductor thin film device, including the vacuum transfer valve as described in the first aspect.

[0022] This invention provides a vacuum transfer valve, a control method, and a semiconductor thin film device. The vacuum transfer valve is applied to a semiconductor thin film device, which includes a process chamber and a transfer chamber. The vacuum transfer valve includes a sealing valve box disposed between the process chamber and the transfer chamber. A first sealing element is disposed between the sealing valve box and the process chamber. The vacuum transfer valve further includes: a second sealing element disposed on the sealing valve box and located between the first sealing element and the process chamber; and a connecting portion detachably disposed on the sealing valve box for fixing the second sealing element to the sealing valve box. This invention provides an adapter on the sealing valve box of a vacuum transmission valve and a second seal based on the adapter. The second seal is positioned between the first seal and the process chamber, allowing it to contact the gas in the process chamber before the first seal. This means that even if the second seal is corroded or leaks, it can be replaced directly by disassembling the adapter. This avoids the need to disconnect the sealing valve box from the process chamber when replacing the seal, thus shortening or even preventing equipment downtime. It also improves the efficiency of seal replacement, saving significant time and manpower costs. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1This is a schematic diagram of the structure of a vacuum transmission valve provided in an embodiment of the present invention;

[0025] Figure 2 This is another structural schematic diagram of a vacuum transmission valve provided in an embodiment of the present invention;

[0026] Figure 3 An explosion diagram of a vacuum transmission valve provided in an embodiment of the present invention;

[0027] Figure 4 This is another structural schematic diagram of a vacuum transmission valve provided in an embodiment of the present invention;

[0028] Figure 5 A schematic diagram of the maintenance structure of a vacuum transmission valve provided in an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the gas pressure in a vacuum transmission valve provided in an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of gas detection in a vacuum transmission valve provided by an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of another gas detection in a vacuum transmission valve provided by an embodiment of the present invention;

[0032] Figure 9 This is a flowchart illustrating a control method for a vacuum transmission valve provided in an embodiment of the present invention. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0035] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0036] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0037] Please see below. Figure 1 and Figure 2 This invention provides a vacuum transfer valve 1 applied to a semiconductor thin film apparatus. The semiconductor thin film apparatus includes a process chamber 2 and a transfer chamber 3. The vacuum transfer valve 1 includes a sealing valve box 11 disposed between the process chamber 2 and the transfer chamber 3. A first sealing element 12 is disposed between the sealing valve box 11 and the process chamber 2. The vacuum transfer valve 1 further includes:

[0038] The second sealing element 13 is disposed on the sealing valve box 11 and is located between the first sealing element 12 and the process chamber 2;

[0039] The adapter 14 is detachably disposed on the sealing valve box 11 and is used to fix the second sealing element 13 to the sealing valve box 11.

[0040] In this embodiment, the vacuum transfer valve 1 includes a sealing valve box 11 located between the process chamber 2 and the transfer chamber 3. A first sealing element 12 and a second sealing element 13 are disposed between the sealing valve box 11 and the process chamber 2. The second sealing element 13 is mounted on the sealing valve box 11 via a transition part 14. This embodiment provides a transition part 14 on the sealing valve box 11 of the vacuum transfer valve 1, and the second sealing element 13 is disposed based on the transition part 14. Furthermore, the second sealing element 13 is positioned between the first sealing element 12 and the process chamber 2, allowing the second sealing element 13 to contact the gas in the process chamber 2 before the first sealing element 12. This means that even if the second sealing element 13 is corroded or gas leakage occurs, it can be directly replaced by disassembling the transition part 14. This avoids the need to disconnect the sealing valve box 11 from the process chamber 2 when replacing the sealing element, thereby shortening equipment downtime or even preventing downtime altogether. It also improves the efficiency of sealing element replacement, saving significant time and labor costs.

[0041] In practical applications, the vacuum transfer valve 1, in addition to the sealing valve box 11, may also include a drive mechanism and a sealing valve plate 15. Furthermore, besides the seal between the sealing valve box 11 and the process chamber 2 on one side, a corresponding seal (such as a third seal 16) is also provided on the side near the transfer chamber 3. Since the transfer chamber 3 does not have potential risks such as corrosion, only one seal is required. The sealing valve box 11 also includes a top sealing ring 111, a top maintenance end cap 112, and top maintenance end cap fixing screws 113. Further, the adapter 14 is an adapter plate, which is detachably mounted to the sealing valve box 11 using fixing screws 114. Both the first seal 12 and the second seal 13 are sealing rings. Thus, when the second seal 13 needs to be replaced, such as... Figure 5 As shown, the fixing screws 114 of the adapter plate can be removed from the 3rd side of the transmission chamber with the help of auxiliary tools. Then, depending on the maintenance space, the adapter plate can be installed as follows: Figure 5 Method ① involves removing the top maintenance end cap fixing screws 113 to open the valve box top maintenance end cap 112, then removing the adapter plate on the sealing valve box 11, and replacing the new second seal 13, or as follows: Figure 5 As shown in method ②, the adapter plate is removed directly from the side of the transmission chamber 3.

[0042] It is evident that during the entire process of replacing the second seal 13, it is not necessary to disconnect the process chamber 2 from the sealing valve box 11. This can save downtime caused by disconnecting the process chamber 2, as well as additional plant maintenance costs incurred by disconnecting the process chamber 2 and restarting the machine. It can also save a significant amount of time, manpower, and other resource costs.

[0043] Combination Figure 3 In one embodiment, the space between the first seal 12 and the second seal 13 is a sealing cavity 17.

[0044] Furthermore, the vacuum transmission valve 1 also includes a control valve 18, which is connected to the sealed cavity 17 via a first gas pipeline 181 and is used to control the gas state within the sealed cavity 17. In practical applications, the sealed cavity 17 can have a through hole, and the through hole can be connected to the first gas pipeline 181 to achieve communication between the control valve 18 and the sealed cavity 17.

[0045] like Figure 6As shown, in this embodiment, based on the control valve 18, when the equipment is operating normally, the control valve 18 can be used to evacuate the sealing cavity 17 between the first seal 12 and the second seal 13, creating a vacuum state. This solves the problem of uneven stress on the first seal 12 and the second seal 13 affecting sealing performance and product lifespan, thereby improving the overall production efficiency of the equipment. When the second seal 13 needs to be replaced due to corrosion and leakage, the control valve 18 can be used to pressurize the sealing cavity 17 between the first seal 12 and the second seal 13, creating a non-vacuum atmospheric state to avoid affecting the first seal 12. Subsequently, the second seal 13 can be replaced by disassembling the adapter 14.

[0046] Specifically, the control valve 18 includes a first diaphragm valve 182, which is connected to the first gas line 181 and is used to evacuate the sealed cavity 17. Furthermore, the control valve 18 includes a second diaphragm valve 183, which is connected to the first gas line 181 and is used to inflate the sealed cavity 17. In practical applications, the first diaphragm valve 182 is a manual diaphragm valve, and the second diaphragm valve 183 is a pneumatic diaphragm valve.

[0047] When the gas state inside the sealed cavity 17 is a vacuum state, the first diaphragm valve 182 is open and the second diaphragm valve 183 is closed; when the gas state inside the sealed cavity 17 is not a vacuum state, the first diaphragm valve 182 is closed and the second diaphragm valve 183 is open.

[0048] In other words, by opening the first diaphragm valve 182 and closing the second diaphragm valve 183, the sealing cavity 17 between the first seal 12 and the second seal 13 is evacuated; by opening the second diaphragm valve 183 and closing the first diaphragm valve 182, the sealing cavity 17 between the first seal 12 and the second seal 13 is inflated. The first diaphragm valve 182 can be a manual diaphragm valve, and the second diaphragm valve 183 can be a pneumatic diaphragm valve. When the equipment is running normally, the manual diaphragm valve is open, and the pneumatic diaphragm valve is closed. When the second seal 13 needs to be replaced, the manual diaphragm valve is closed, and the pneumatic diaphragm valve is open.

[0049] In some optional embodiments, a three-way valve 1811 can be provided on the first gas pipeline 181, with the through hole, the first diaphragm valve 182, and the second diaphragm valve 183 respectively connected to one end of the three-way valve 1811. Of course, corresponding sub-branches can also be provided for the first gas pipeline 181, so that the first diaphragm valve 182 and the second diaphragm valve 183 are located on different sub-branches.

[0050] Combination Figure 4 In one embodiment, the vacuum transmission valve 1 further includes a gas detection device 19, which is connected to the sealed cavity 17 via a second gas pipeline 191 and is used to detect the gas state within the sealed cavity 17. Here, the second gas pipeline 191 can be another pipeline independent of the first gas pipeline 181, or it can be a sub-branch extending from the first gas pipeline 181.

[0051] Specifically, the gas detection device 19 can be a residual gas analyzer (RGA). A residual gas analyzer (RGA) is a branch of mass spectrometry. It effectively monitors the conditions of vacuum environment processes by dynamically analyzing changes in the partial pressure of various gases in a vacuum system, ensuring that various vacuum processes achieve measurable, controllable, and repeatable results. The working principle of the RGA is that within the vacuum chamber, the RGA ionizer ionizes gas molecules, and the ionized charged particles enter the deflection electric field generated by the quadrupole. Because different particles have different mass numbers, the deflection radii formed under the action of a specific electric field are also different. By changing the electric field, the concentration of ions with different mass numbers can be detected, and an electric field scan can be performed to calculate the composition of the gas contained in the vacuum chamber.

[0052] This embodiment uses a gas detection device 19 to detect the gas state within the sealed cavity 17 between the first seal 12 and the second seal 13, thereby determining whether corrosion or leakage has occurred. When the equipment is operating normally, the sealed cavity 17 is in a vacuum state. However, when corrosion or leakage occurs in the second seal 13, the gas detection device 19 can detect abnormal leaking gas within the sealed cavity 17. In other words, by using the gas detection device 19 to detect the gas state within the sealed cavity 17, this embodiment can predict the service life of the second seal 13 and accurately control its replacement cycle, preventing wafer contamination, reduced product yield, or damage to other vacuum components caused by sudden leakage due to long-term corrosion of the second seal 13.

[0053] Furthermore, the gas detection device 19 can also be connected to a computer system 20, so that the gas detection device 19 can upload the detection results to the computer system 20, and the computer system 20 can determine whether to activate alarm functions based on the uploaded detection results, thereby achieving the effect of timely termination of machine operation and reducing product loss.

[0054] In a practical application scenario, the sealing cavity 17 between the first seal 12 and the second seal 13 is detected using an RGA (Rapid Detection and Ranging) system, and the detection results are uploaded to a computer system 20. Upon receiving the detection results, the computer system 20 determines whether the detection results reach a first preset threshold. If the detection results reach the first preset threshold, a Level 1 alarm (Warning) is issued; if the detection results reach a second preset threshold, a Level 2 alarm (Alarm) is issued. The first preset threshold is lower than the second preset threshold, and the alarm intensity of the Level 1 alarm (Warning) is lower than that of the Level 2 alarm (Alarm). Furthermore, the first and second preset thresholds can be set based on historical experience or historical data. When the detection results reach the first preset threshold, based on past experience, it is believed that the detected value will not affect the product yield, so the equipment can continue to operate. However, when the detection results reach the second preset threshold, it is determined that the detected value will affect the product yield, and therefore a Level 2 alarm (Alarm) is issued to prompt maintenance personnel to perform a shutdown replacement of the second seal 13 and subsequent restart procedures.

[0055] In another practical application scenario, such as Figure 7 As shown, after the equipment has been running normally for a period of time, the gas signal intensity detected by the RGA tends to stabilize, such as 10. -11 ~10 -15 When the sealing of the chamber is broken, and one or more gases enter the sealed cavity 17 between the first seal 12 and the second seal 13, such as... Figure 8 As shown, the signal strength corresponding to these gases will suddenly increase, such as >10. -8 At this point, it can be determined that the sealed chamber is leaking, so as to replace the sealing parts at the chamber connection in advance, thereby avoiding the second sealing part 13 from failing due to corrosion, affecting the product yield or causing machine damage, and improving the product yield.

[0056] like Figure 9 As shown, this embodiment of the invention provides a control method for a vacuum transmission valve 1. The space between the first sealing member 12 and the second sealing member 13 is a sealing cavity 17. The vacuum transmission valve 1 also includes a gas detection device 19, which is connected to the sealing cavity 17 through a second gas pipeline. The control method includes steps S101 to S105.

[0057] Step S101: Detect the gas state of the sealed chamber 17 between the first seal 12 and the second seal 13 using the gas detection device 19;

[0058] Step S102: Compare the gas state of the sealed chamber 17 with a first preset threshold and a second preset threshold; wherein the first preset threshold is lower than the second preset threshold;

[0059] Step S103: If the gas state in the sealed chamber 17 does not reach the first preset threshold, the detection action of the gas detection device continues.

[0060] Step S104: If the gas state in the sealed chamber 17 reaches the first preset threshold but does not reach the second preset threshold, a level one alarm is issued.

[0061] Step S105: If the gas state in the sealed chamber 17 reaches the second preset threshold, a level two alarm is issued; wherein the alarm level of the level one alarm is lower than that of the level two alarm.

[0062] In this embodiment, the gas state in the space between the first seal 12 and the second seal 13 (i.e., the sealed cavity 17) can be detected by the gas detection device 19 to determine whether corrosion leakage has occurred. When the equipment is operating normally, the space between the first seal 12 and the second seal 13 is in a vacuum state. However, when the second seal 13 experiences corrosion leakage, abnormal leaking gas will be present in the space between the first seal 12 and the second seal 13. In other words, by using the gas detection device 19 to detect the gas state in the sealed cavity 17 between the first seal 12 and the second seal 13, this embodiment can predict the service life of the second seal 13 and accurately control its replacement cycle, preventing wafer contamination, product yield issues, or damage to other vacuum components caused by sudden leakage due to long-term corrosion of the second seal 13. Furthermore, when it is determined that the second seal 13 does not need to be replaced, the control valve 18 can be controlled to continue to maintain the current vacuum state. When it is determined that the second seal 13 needs to be replaced, the sealing cavity 17 can be filled with gas through the control valve 18 to change it from a vacuum state to a non-vacuum atmospheric state.

[0063] Specifically, when the gas detection device 19 obtains the detection result within the sealed cavity 17 between the first seal 12 and the second seal 13, it determines whether the detection result reaches a first preset threshold. If the detection result reaches the first preset threshold, a Level 1 alarm (Warning) is issued; if the detection result reaches a second preset threshold, a Level 2 alarm (Alarm) is issued. The first preset threshold is lower than the second preset threshold, and the alarm level of the Level 1 alarm (Warning) is lower than that of the Level 2 alarm (Alarm). Furthermore, the first and second preset thresholds can be set based on historical experience or data. When the detection result reaches the first preset threshold, based on past experience, it is believed that the detected value will not affect the product yield, so the equipment can continue to operate. However, when the detection result reaches the second preset threshold, it is determined that the detected value will affect the product yield, and therefore a Level 2 alarm (Alarm) is issued to prompt maintenance personnel to perform a shutdown replacement of the second seal 13 and subsequent restart procedures.

[0064] This invention provides a semiconductor thin film device, including the vacuum transfer valve 1 as described above.

[0065] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to in the method section. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

[0066] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A vacuum transfer valve, applied in a semiconductor thin film apparatus, the semiconductor thin film apparatus including a process chamber and a transfer chamber, the vacuum transfer valve including a sealing valve box disposed between the process chamber and the transfer chamber, a first seal being disposed between the sealing valve box and the process chamber, characterized in that, The vacuum transfer valve also includes: The second sealing element is disposed on the sealing valve box and is located between the first sealing element and the process chamber; The adapter is detachably disposed on the sealing valve box and is used to fix the second sealing element to the sealing valve box.

2. The vacuum transmission valve according to claim 1, characterized in that, The space between the first seal and the second seal is a sealed cavity.

3. The vacuum transmission valve according to claim 2, characterized in that, It also includes a control valve, which is connected to the sealed cavity through a first gas pipeline and is used to control the gas state inside the sealed cavity.

4. The vacuum transmission valve according to claim 3, characterized in that, The control valve includes a first diaphragm valve, which is connected to the first gas pipeline and is used to evacuate the sealed cavity.

5. The vacuum transmission valve according to claim 3, characterized in that, The control valve includes a second diaphragm valve, which is connected to the first gas pipeline and is used to inflate the sealed cavity.

6. The vacuum transmission valve according to claim 2, characterized in that, It also includes a gas detection device, which is connected to the sealed cavity through a second gas pipeline and is used to detect the gas state inside the sealed cavity.

7. The vacuum transmission valve according to claim 6, characterized in that, The gas detection device is a residual gas analyzer.

8. The vacuum transmission valve according to claim 1, characterized in that, The adapter is an adapter plate, which is detachably mounted on the sealing valve box via a fastener.

9. A control method for a vacuum transmission valve as described in claim 1, wherein the space between the first sealing element and the second sealing element is a sealed cavity, and the vacuum transmission valve further includes a gas detection device, the gas detection device being connected to the sealed cavity via a second gas pipeline, characterized in that... The control method includes: The gas state of the sealed chamber between the first seal and the second seal is detected by a gas detection device; The gas state of the sealed chamber is compared with a first preset threshold and a second preset threshold; wherein the first preset threshold is lower than the second preset threshold. If the gas state in the sealed chamber does not reach the first preset threshold, the gas detection device continues to perform its detection action. If the gas state in the sealed chamber reaches the first preset threshold but does not reach the second preset threshold, a level one alarm will be issued. If the gas state in the sealed chamber reaches a second preset threshold, a level two alarm will be issued; wherein the alarm level of the level one alarm is lower than that of the level two alarm.

10. A semiconductor thin film device, characterized in that, Includes the vacuum transfer valve as described in any one of claims 1-8.

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