Wafer lossless posture adjusting device

Abstract

The invention discloses a wafer lossless posture adjusting device, and relates to the technical field of wafer posture adjusting.The wafer lossless posture adjusting device comprises a vacuum suction cup, a limiting upper skirt hem, a limiting lower skirt hem, a two-dimensional moving platform and a controller, the vacuum suction cup is installed at the upper end of the limiting upper skirt hem, and a plurality of adsorption holes are formed in the upper surface of the vacuum suction cup; the vacuum chuck is used for adsorbing a wafer, the limiting upper skirt is arranged above the limiting lower skirt, a plurality of adjusting telescopic rods are arranged between the lower surface of the limiting upper skirt and the upper surface of the limiting upper skirt, and the adjusting telescopic rods are used for adjusting the position of the limiting upper skirt. The limiting lower skirt hemline is installed on the two-dimensional moving platform, the two-dimensional moving platform can drive the limiting lower skirt hemline to move in the horizontal direction, and the adjusting telescopic rod and the two-dimensional moving platform are both electrically connected with the controller. According to the invention, the position of the wafer can be mechanically adjusted without manual participation, and the crystal position is accurately adjusted.

Description

Technical Field

[0001] The invention relates to the technical field of wafer posture adjustment, and in particular to a wafer lossless posture adjustment device. Background Art

[0002] In the vast field of semiconductor manufacturing, wafers, as the basic material for semiconductor chip manufacturing, require extremely high precision and stability in their processing. During the manufacturing process, the movement, rotation, positioning and other operations of the wafer need to be precisely controlled to ensure the performance and quality of the final product. However, due to the material and shape characteristics of the wafer itself, it is easy to move or offset during the processing, which affects the processing accuracy and consistency. The vacuum adsorption system uses adsorption force to firmly fix the wafer on the processing equipment, and achieves precise control of the wafer position and posture by precisely controlling the size and distribution of the adsorption force. During the processing process, the wafer adsorption system can ensure that the wafer remains stable and prevent it from moving or offsetting, thereby greatly improving the processing accuracy and consistency.

[0003] As the physical carrier for semiconductor preparation, wafers will be coated with silicon dioxide film on their surface during processing. The wafers coated with silicon dioxide film are also called silicon dioxide film thickness standard sheets. Accurate measurement of wafer thickness after silicon dioxide film coating is a crucial part of semiconductor manufacturing and research and development. Slight changes in wafer thickness after silicon dioxide film coating may cause significant changes in the performance of semiconductor devices, thereby affecting the performance and quality of the entire product.

[0004] The thickness of the existing wafer surface film is measured using an ellipsometer. During actual measurement, the wafer coated with silicon dioxide film needs to be placed on the support platform of the ellipsometer before its thickness is measured. However, the height and inclination of the existing support platform cannot be adjusted, and some support platforms can only be adjusted manually, which may cause the wafer to be unable to maintain a horizontal state, thereby seriously affecting the thickness measurement accuracy of the wafer.

[0005] Therefore, there is an urgent need in the art for a wafer non-destructive posture adjustment device to solve the above-mentioned problems. Summary of the invention

[0006] The purpose of the present invention is to provide a non-destructive wafer posture adjustment device to solve the problems existing in the above-mentioned prior art, which can mechanically adjust the wafer posture and improve the accuracy of the wafer posture.

[0007] To achieve the above object, the present invention provides the following solutions:

[0008] The present invention discloses a wafer lossless posture adjustment device, comprising a vacuum suction cup, a limiting upper skirt, a limiting lower skirt, a two-dimensional mobile platform and a controller, wherein the vacuum suction cup is installed at the upper end of the limiting upper skirt, the upper surface of the vacuum suction cup is provided with a plurality of adsorption holes, the vacuum suction cup is used to adsorb the wafer, the limiting upper skirt is arranged above the limiting lower skirt, a plurality of adjustment telescopic rods are arranged between the lower surface of the limiting upper skirt and the upper surface of the limiting upper skirt, the adjustment telescopic rods are used to adjust the position of the limiting upper skirt, the limiting lower skirt is installed on the two-dimensional mobile platform, the two-dimensional mobile platform can drive the limiting lower skirt to move in the horizontal direction, and the adjustment telescopic rods and the two-dimensional mobile platform are both electrically connected to the controller.

[0009] Preferably, the vacuum chuck is made of ceramic.

[0010] Preferably, the adjustable telescopic rod is an adjustable electric cylinder, three of which are provided, three hemispherical grooves are provided on the limit upper skirt, and a contact ball is provided at the telescopic end of the adjustable electric cylinder, which abuts against the hemispherical groove.

[0011] Preferably, the vacuum chuck includes a plurality of wafer retaining rings arranged in sequence from the inside to the outside, and each of the wafer retaining rings has a plurality of adsorption holes evenly distributed in the circumferential direction;

[0012] A level is provided at the center of the vacuum suction cup.

[0013] Preferably, a transfer slot is provided on the upper surface of the vacuum suction cup.

[0014] Preferably, three telescopic springs are connected between the position-limiting upper skirt hem and the position-limiting lower skirt hem.

[0015] Preferably, the upper limiting skirt and the lower limiting skirt are both cylindrical structures, and an annular air pressure groove is provided on the inner wall of the upper limiting skirt. An air blowing pipe is fixed in the air pressure groove, and a plurality of air blowing holes are evenly spaced on the air blowing pipe. One end of the air blowing pipe is connected to an air pump.

[0016] Preferably, the two-dimensional mobile platform comprises a mobile top plate, a mobile middle plate and a fixed bottom plate, the mobile top plate is slidably connected to the mobile middle plate, and the mobile middle plate is slidably connected to the fixed bottom plate;

[0017] A linear drive channel, a limit channel, a measuring channel and two guide channels are provided between the movable top plate and the movable middle plate, and between the movable middle plate and the fixed bottom plate;

[0018] A linear motor is fixed in the linear drive channel;

[0019] A photoelectric switch is provided in the limit channel;

[0020] A grating ruler is provided in the measuring channel;

[0021] A slide rail is arranged in the guide channel.

[0022] Preferably, a suction cup base is provided at the lower end of the vacuum suction cup, and the suction cup base is fixed to the upper end of the limit upper skirt by screws;

[0023] The upper surface of the suction cup base is provided with three electric telescopic brackets, and laser distance measuring sensors are installed on the telescopic ends of the electric telescopic brackets.

[0024] Preferably, the electric telescopic bracket is an L-shaped structure, the electric telescopic bracket comprises a fixed vertical rod and a transverse telescopic tube, the transverse telescopic tube comprises a telescopic outer tube and a telescopic inner tube, the telescopic inner tube is slidably connected to the inner wall of the telescopic outer tube, one end of the telescopic outer tube is fixed to the upper end of the fixed vertical rod, a telescopic electric cylinder is fixed in the telescopic outer tube, and the telescopic end of the telescopic electric cylinder is fixed to the telescopic inner tube

[0025] Compared with the prior art, the present invention has achieved the following technical effects:

[0026] The present invention uses three adjustable telescopic rods to adjust the lifting and pitching. The lifting operation can be achieved by adjusting the three adjustable telescopic rods at the same time. Specifically, the pitching operation can be achieved by adjusting one of the adjustable telescopic rods or adjusting the heights of the adjustable telescopic rods at different times.

[0027] Furthermore, the present invention realizes flexible movement of the wafer through the upper limiting skirt and the lower limiting skirt. Both the upper limiting skirt and the lower limiting skirt are hollow cylindrical shells. There is a 5mm gap between the two shells. At the same time, there is air pressure between the upper limiting skirt and the lower limiting skirt to ensure that the upper and lower shell side walls will not contact each other. A flexible telescopic spring is used inside, one end of which is fixed to the upper limiting skirt and the other end is fixed to the lower limiting skirt to ensure that the upper limiting skirt will not jump up and down excessively.

[0028] Furthermore, the present invention uses three laser ranging sensors to monitor the wafer, and determines whether there is a gap between the sample and the vacuum chuck by measuring the distance between the wafer and the laser ranging sensor, thereby realizing closed-loop feedback of posture adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a schematic structural diagram of a wafer non-destructive posture adjustment device according to an embodiment of the present invention;

[0031] Figure 2 It is a schematic diagram of the structure between the upper limit skirt and the lower limit skirt in the wafer lossless posture adjustment device according to an embodiment of the present invention;

[0032] Figure 3 A top view of a wafer non-destructive posture adjustment device according to an embodiment of the present invention;

[0033] Figure 4 It is a front cross-sectional view of a position-limiting upper skirt and a position-limiting lower skirt in the wafer lossless posture adjustment device according to an embodiment of the present invention;

[0034] Figure 5 It is a front view of adjusting the level of the silicon dioxide film thickness standard sheet in the wafer non-destructive posture adjustment device according to an embodiment of the present invention;

[0035] Figure 6 A schematic diagram of a light spot for adjusting the level of a silicon dioxide film thickness standard sheet in a wafer non-destructive posture adjustment device according to an embodiment of the present invention;

[0036] Figure 7 It is a front view of the silicon dioxide film thickness standard sheet in the wafer non-destructive posture adjustment device according to the embodiment of the present invention when the level is not adjusted;

[0037] Figure 8 Schematic diagram of a light spot when the silicon dioxide film thickness standard sheet is not adjusted horizontally in the wafer non-destructive posture adjustment device according to an embodiment of the present invention;

[0038] Fig. 9 Schematic diagram of the position distribution of three adjusting telescopic rods in the wafer lossless posture adjustment device according to an embodiment of the present invention;

[0039] In the figure: 1-vacuum suction cup; 101-suction cup base; 102-wafer clamping ring; 103-adsorption hole; 104-transfer card slot; 2-limit upper skirt; 201-air pressure groove; 3-limit lower skirt; 4-two-dimensional moving platform; 401-moving top plate; 402-moving middle plate; 403-fixed bottom plate; 404-linear drive channel; 405-limit channel; 406-measurement channel; 407-guide channel; 5-electric telescopic bracket; 6-telescopic spring; 7-adjustable telescopic rod; 8-autocollimator; 9-wafer. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The purpose of the present invention is to provide a non-destructive wafer posture adjustment device to solve the problems existing in the above-mentioned prior art, which can mechanically adjust the wafer posture and improve the accuracy of the wafer posture.

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] like Figure 1-Figure 9 As shown, the present invention provides a wafer non-destructive posture adjustment device, including a vacuum suction cup 1, a limit upper skirt 2, a limit lower skirt 3, a two-dimensional mobile platform 4 and a controller. Specifically, the vacuum suction cup 1 is installed at the upper end of the limit upper skirt 2, and a plurality of adsorption holes 103 are provided on the upper surface of the vacuum suction cup 1, and the vacuum suction cup 1 is used to adsorb the wafer 9. The limit upper skirt 2 is arranged above the limit lower skirt 3, and the limit upper skirt 2 and the limit lower skirt 3 are arranged relative to each other, and there is an activity space between the two, and a plurality of adjustment telescopic rods 7 are provided in the activity space between the lower surface of the limit upper skirt 2 and the upper surface of the limit upper skirt 2, and the extension or shortening of the adjustment telescopic rod 7 can be used to adjust the position of the limit upper skirt 2. The limit lower skirt 3 is installed on the two-dimensional mobile platform 4, and the two-dimensional mobile platform 4 can drive the limit lower skirt 3 to move in the X and Y axes in the horizontal direction. The adjustable telescopic rod 7 and the two-dimensional mobile platform 4 are both electrically connected to the controller, and the operation of the adjustable telescopic rod 7 and the two-dimensional mobile platform 4 is remotely controlled by the controller. As for the controller, an existing PLC controller, a single-chip microcomputer controller or a control computer that can perform remote electrical control can be used.

[0044] In actual use, it is necessary to install the non-destructive attitude adjustment device of wafer 9 as a whole on the ellipsometer, and place wafer 9 on the vacuum suction cup 1. Generally, the surface of wafer 9 is located at the intersection of the incident and exit directions of the polarizing arm and the analyzing arm. At this time, the telescopic rod 7 is controlled to move downward to adjust the surface of wafer 9 downward. When the surface of wafer 9 is 5mm below the intersection level, the movement is stopped, and then the attitude of wafer 9 can be adjusted. The horizontal distance of wafer 9 is adjusted by two-dimensional mobile platform 4, so that the center of wafer 9 and the intersection of the incident and exit directions of the polarizing arm and the analyzing arm are collinear in the vertical direction. If it is found that wafer 9 is tilted, each adjusting telescopic rod 7 can be controlled to extend and retract according to the tilt condition to keep wafer 9 in a horizontal state. When the attitude of wafer 9 is adjusted, wafer 9 is driven to rise to the intersection of the incident and exit directions of the polarizing arm and the analyzing arm, and the ellipsometer performs thickness measurement.

[0045] In this embodiment, the vacuum suction cup 1 is made of ceramic, which has excellent static electricity diffusion properties and can effectively eliminate static electricity.

[0046] In this embodiment, the adjustable telescopic rod 7 is an adjustable electric cylinder. There are three adjustable electric cylinders, which are distributed in a triangle. The three adjustable electric cylinders are respectively located at the three vertices of an equilateral triangle. Fig. 9 As shown, the distance between each adjusting electric cylinder and the center of the circle is 100mm to achieve uniform movement. The adjusting electric cylinder is an existing micro servo electric cylinder for lifting and lowering movement, the adjusting electric cylinder stroke is 10mm, and the push-pull force is 70N. When the three adjusting electric cylinders move at the same time, the upper skirt 2 can be lifted and lowered by 10mm in the vertical direction. When one of the adjusting electric cylinders is adjusted and the other two adjusting electric cylinders are not moved, ±2° pitch adjustment can be achieved.

[0047] Opposite to the adjusting electric cylinder, three hemispherical grooves are provided on the limiting upper skirt 2, and the positions of the three hemispherical grooves correspond one by one to the positions of the three adjusting electric cylinders. A contact ball is provided at the telescopic end of the adjusting electric cylinder, and the contact ball can enter the hemispherical groove and abut against the hemispherical groove.

[0048] In the actual process of adjusting the tilt angle of the wafer 9, Figure 5-Figure 8 As shown, this embodiment adjusts the horizontal state of the surface of the wafer 9, specifically by using a high-precision autocollimator 8 to cooperate with the surface of the wafer 9. When the light emitted by the autocollimator 8 passes through the surface of the wafer 9, it is received by the autocollimator 8. Figure 6 When the received light spot is located at the center of the display interface of the autocollimator 8, it can be determined that the surface of the wafer 9 is in a horizontal state (e.g. Figure 5 In particular, Figure 8 As shown, when the light spot is located on the right side of the display interface of the autocollimator 8, it is necessary to adjust Fig. 9 The two adjusting telescopic rods 7 on the right side are raised, or the one adjusting telescopic rod 7 on the left side is lowered, and the light spot of the display interface is adjusted back to the center position. After adjusting the level, the surface of the wafer 9 is raised to the height of the measurement intersection of the polarization arm and the analysis arm of the ellipsometer.

[0049] In this embodiment, if Figure 1-Figure 3 As shown, the vacuum chuck 1 includes a plurality of wafer retaining rings 102 arranged in sequence from the inside to the outside, specifically three, and the three wafer retaining rings 102 are all circular ring structures. In addition, the center of the wafer retaining ring 102 located in the center is also slidably connected to a sliding support column, and the lower end of the sliding support column is connected to a lifting electric cylinder, which is electrically connected to the controller, and the sliding support column can be driven to move up and down through the lifting electric cylinder. The sliding support column located in the center and the three wafer retaining rings 102 outside thereof gradually increase in diameter from the inside to the outside, and generally the height also increases accordingly (if there is a special need, the sliding support column can be raised), and the outer side of the wafer retaining ring 102 located on the outermost side is also provided with a vertical outer edge to clamp the position of the wafer 9. The diameters of the sliding support column located in the center and the three wafer retaining rings 102 outside thereof are 100mm, 150mm, 200mm and 300mm from the inside to the outside, respectively, and wafers 9 of different sizes are placed on wafer retaining rings 102 or sliding support columns of different sizes.

[0050] Each wafer retaining ring 102 has a plurality of adsorption holes 103 evenly distributed in the circumferential direction, and the specific number can be adjusted according to actual needs.

[0051] Each wafer retaining ring 102 and sliding support column is provided with a negative pressure cavity corresponding to its shape and size. The sliding support column located on the innermost side is a cylindrical cavity, and the negative pressure cavities of the three wafer retaining rings 102 on the outside are all annular cavities, and each negative pressure cavity is connected to a negative pressure main pipe through a negative pressure branch pipe. The end of the negative pressure main pipe away from the negative pressure branch pipe is connected to a negative pressure pump, and an electric control valve is arranged on each negative pressure branch pipe. The negative pressure pump and the electric control valve are electrically connected to the controller, and the controller controls the switching of each electric control valve.

[0052] In actual use, if the wafer 9 is placed on the sliding support column, it is only necessary to open the electric control valve on the negative pressure branch pipe connected to the smallest negative pressure chamber and the negative pressure pump. If the wafer 9 is placed at the 300mm, 200mm or 150mm wafer retaining ring 102, the electric control valve on the negative pressure branch pipe of the corresponding negative pressure chamber can be opened. Of course, in order to enhance the adsorption capacity, the electric control valve on the negative pressure branch pipe of the negative pressure chamber of the sliding support column can also be opened. In order to ensure the support of the center of the wafer 9, the sliding support column can be driven to move upward by the lifting electric cylinder, and the sliding support column can be used to support the center of the wafer 9.

[0053] In addition, a level is provided at the center of the vacuum chuck 1 (i.e., the upper end of the sliding support column), and the level makes a preliminary judgment on the horizontal state of the surface of the wafer 9. When the droplet inside the level is at the center position, it can be preliminarily judged that the wafer 9 is in a horizontal state. The horizontal state needs to be accurately judged by the autocollimator 8 in the next step. Furthermore, a mounting groove is specially added at the center position of the vacuum chuck 1 for installing the level, and the depth of the mounting groove of the vacuum chuck 1 is greater than the height of the level, so as to avoid the influence of the posture of the wafer 9 when the level is placed.

[0054] In this embodiment, a transfer slot 104 is provided on the upper surface of the vacuum suction cup 1. The depth of the transfer slot 104 is 5 mm. The purpose of providing the transfer slot 104 is to facilitate the robot to transfer the wafer 9 on the vacuum suction cup 1. The robot can use the existing Bernoulli mechanical fingers.

[0055] In this embodiment, three telescopic springs 6 are connected between the upper limit skirt 2 and the lower limit skirt 3. Specifically, the lower surface of the upper limit skirt 2 and the upper surface of the lower limit skirt 3 are provided with three corresponding spring grooves for installing springs. The three telescopic springs 6 are also located at the three vertices of an equilateral triangle, and the distance from the telescopic spring 6 to the center of the circle is 100 mm. The three telescopic springs 6 are staggered with the three adjustment telescopic rods 7 to ensure the vertical limitation of the upper limit skirt 2 and the lower limit skirt 3.

[0056] In this embodiment, the limiting upper skirt hem 2 and the limiting lower skirt hem 3 are both cylindrical structures, and sealing cover plates are provided at the upper end of the limiting upper skirt hem 2 and the lower end center of the limiting lower skirt hem 3, so that the limiting upper skirt hem 2 and the limiting lower skirt hem 3 are both cover-shaped and relatively arranged, and the inner diameter of the limiting upper skirt hem 2 is larger than the outer diameter of the limiting lower skirt hem 3, so that the limiting lower skirt hem 3 can be inserted into the interior of the limiting upper skirt hem 2.

[0057] An annular air pressure groove 201 is provided on the inner wall of the upper limit skirt 2, and the air pressure groove 201 is set at half the height of the upper limit skirt 2. An air blowing pipe is fixed in the air pressure groove 201, and a plurality of air blowing holes are evenly spaced on the air blowing pipe. Specifically, 12 air blowing holes are set, and one is set every 30°. An air pump is connected to one end of the air blowing pipe, and the air pump blows air to the outer wall of the lower limit skirt 3 through the air blowing pipe, so that there is a sufficiently uniform air pressure between the upper limit skirt 2 and the lower limit skirt 3, ensuring that the upper limit skirt 2 and the lower limit skirt 3 are in a stable state, and the relative position in the horizontal direction is not easily affected by the outside world.

[0058] In this embodiment, if Figure 1As shown, the two-dimensional mobile platform 4 includes a mobile top plate 401, a mobile middle plate 402 and a fixed bottom plate 403 which are arranged in sequence from top to bottom, wherein the mobile top plate 401 is slidably connected to the mobile middle plate 402, the mobile middle plate 402 is slidably connected to the fixed bottom plate 403, and the sliding direction of the mobile top plate 401 relative to the mobile middle plate 402 is perpendicular to the sliding direction of the mobile middle plate 402 relative to the fixed bottom plate 403, and the fixed bottom plate 403 is used for being installed on the ellipsometer.

[0059] Furthermore, a linear drive channel 404, a limit channel 405, a measuring channel 406 and two guide channels 407 are provided between the movable top plate 401 and the movable middle plate 402, and between the movable middle plate 402 and the fixed bottom plate 403, and the linear drive channel 404, the limit channel 405, the measuring channel 406 and the two guide channels 407 between the movable top plate 401 and the movable middle plate 402, or between the movable middle plate 402 and the fixed bottom plate 403 are perpendicular to each other, and the linear drive channel 404 between the movable top plate 401 and the movable middle plate 402 and the linear drive channel 404 between the movable middle plate 402 and the fixed bottom plate 403 are arranged perpendicular to each other. Since the linear drive channel 404, the limit channel 405, the measuring channel 406 and the two guide channels 407 between the movable top plate 401 and the movable middle plate 402 and between the movable middle plate 402 and the fixed bottom plate 403 have the same structure, the linear drive channel 404, the limit channel 405, the measuring channel 406 and the two guide channels 407 between the movable middle plate 402 and the fixed bottom plate 403 are described in detail below as an example:

[0060] First of all, it should be explained that no matter it is the linear drive channel 404, the limit channel 405, the measuring channel 406 or the two guide channels 407, they are all a complete rectangular channel formed by docking the half rectangular channel at the lower end of the movable middle plate 402 and the half rectangular channel at the upper end of the fixed bottom plate 403.

[0061] The linear drive channel 404 is located at the center, and a linear motor is fixed in the linear drive channel 404. The linear motor is an existing mature technology. The main body of the linear motor is fixed on the lower half of the rectangular channel of the linear drive channel 404, and the sliding block on the linear motor is fixed on the upper half of the rectangular channel of the linear drive channel 404. The linear motor is remotely controlled by a controller. When the linear motor is running, the sliding block moves along a straight line, thereby driving the upper moving middle plate 402 to run along a straight line.

[0062] The limit channel 405 is located on one side of the linear drive channel 404. A photoelectric switch (also called a photoelectric limit switch or a photoelectric sensor) is provided in the limit channel 405. An existing through-beam type photoelectric switch is preferably used. The photoelectric switch can be fixed on any one of the upper or lower half rectangular channels in the limit channel 405, and a shielding plate is provided on the other half rectangular channel. The photoelectric switch is electrically connected to the controller. With the operation of the linear motor, the movable middle plate 402 moves along a straight line until the shielding plate moves to the middle of the photoelectric switch to shield the through-beam light. At this time, the photoelectric switch transmits a detection signal to the controller, and the controller controls the linear motor to stop running.

[0063] The measuring channel 406 is located on the side of the linear drive channel 404 away from the limit channel 405, and a grating ruler is provided in the measuring channel 406. The scale grating and grating reading head in the grating ruler are respectively fixed in the upper and lower half rectangular channels of the measuring channel 406. The grating ruler is used to measure the exact moving distance of the moving middle plate 402, and its data is transmitted to the controller, so as to realize the precise control of the linear motor. Further, in this embodiment, two grating rulers are used for positioning, which are responsible for the movement position of the X-axis and the Y-axis respectively. The total distance from the origin can be obtained by calculating the square sum of the radius of the X-axis and the Y-axis under the square root, and the inverse tangent of the ratio of the X-axis to the Y-axis, that is, y / x=arctan (angle), can be calculated to obtain the angle value from the far point. The physical quantities of distance and angle can more accurately determine the position of the detection wafer 9.

[0064] The two guide channels 407 are respectively arranged at the outermost sides, and a slide rail is arranged in the guide channel 407. Specifically, the slide rail is arranged in the lower half of the rectangular channel of the guide channel 407, and the upper half of the rectangular channel can be provided with a slider or a slide groove matching the slide rail, so as to realize the guiding effect on the movable middle plate 402.

[0065] The linear drive channel 404 , the limit channel 405 , the measuring channel 406 and the two guide channels 407 in the movable top plate 401 and the movable middle plate 402 are the same as the above-mentioned structures, so they will not be described in detail here.

[0066] In practical applications, this embodiment can realize comprehensive inspection of wafers 9 with a maximum diameter of 300 mm. By using a two-dimensional mobile platform 4 with a motion range of 300 mm×300 mm and a stepping distance of 0.2 μm, inspection can be performed every 0.2 μm in the XY axis directions.

[0067] In this embodiment, a suction cup base 101 is provided at the lower end of the vacuum suction cup 1. The suction cup base 101 is a circular disc structure. A plurality of threaded holes are evenly distributed in the circumferential direction of the edge of the suction cup base 101. A plurality of connecting holes are provided on the upper surface of the limiting upper skirt 2. The suction cup base 101 is fixed to the upper end of the limiting upper skirt 2 by screws.

[0068] Three electric telescopic brackets 5 are provided on the upper surface of the suction cup base 101, and the central angle between two adjacent electric telescopic brackets 5 is 120°. A laser ranging sensor is installed on the telescopic end of the electric telescopic bracket 5, and the laser ranging sensor is electrically connected to the controller. The laser ranging sensor is used to measure the distance between the wafers 9. When the detected value does not match the expected data, it indicates that there is a gap between the wafer 9 and the vacuum suction cup 1.

[0069] In this embodiment, the electric telescopic bracket 5 is an L-shaped structure, and the electric telescopic bracket 5 includes a fixed vertical rod and a transverse telescopic tube, the fixed vertical rod is vertically arranged, and the transverse telescopic tube is horizontally arranged. The transverse telescopic tube includes a telescopic outer tube and a telescopic inner tube, the telescopic inner tube is slidably connected to the inner wall of the telescopic outer tube, one end of the telescopic outer tube is fixed to the upper end of the fixed vertical rod, a telescopic electric cylinder is fixed in the telescopic outer tube, the telescopic end of the telescopic electric cylinder is fixed to the telescopic inner tube, the telescopic electric cylinder is electrically connected to the controller, when the controller controls the telescopic electric cylinder to extend and retract, the telescopic inner tube can be controlled to extend and retract, and a laser ranging sensor is fixed on the extended end of the telescopic inner tube, so as to adjust the position of the laser ranging sensor, thereby performing ranging detection on various positions of the wafer 9 to ensure that there is no gap between the wafer 9 and the vacuum suction cup 1.

[0070] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A wafer non-destructive posture adjustment device, characterized in that: It includes a vacuum suction cup, a limiting upper skirt, a limiting lower skirt, a two-dimensional moving platform and a controller, wherein the vacuum suction cup is installed at the upper end of the limiting upper skirt, the upper surface of the vacuum suction cup is provided with a plurality of adsorption holes, the vacuum suction cup is used to adsorb wafers, the limiting upper skirt is arranged above the limiting lower skirt, a plurality of adjusting telescopic rods are arranged between the lower surface of the limiting upper skirt and the upper surface of the limiting upper skirt, the adjusting telescopic rods are used to adjust the position of the limiting upper skirt, the limiting lower skirt is installed on the two-dimensional moving platform, the two-dimensional moving platform can drive the limiting lower skirt to move in the horizontal direction, and the adjusting telescopic rods and the two-dimensional moving platform are both electrically connected to the controller.

2. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: The vacuum chuck is made of ceramic.

3. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: The adjustable telescopic rod is an adjustable electric cylinder, three of which are provided, three hemispherical grooves are provided on the limit upper skirt, and a contact ball is provided at the telescopic end of the adjustable electric cylinder, which abuts against the hemispherical groove.

4. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: The vacuum suction cup includes a plurality of wafer retaining rings arranged in sequence from the inside to the outside, the center of the innermost wafer retaining ring is slidably connected to a sliding support column, the lower end of the sliding support column is provided with a lifting electric cylinder, and the sliding support column and each of the wafer retaining rings are evenly distributed with a plurality of adsorption holes in the circumferential direction; A level is provided at the center of the vacuum suction cup.

5. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: The upper surface of the vacuum suction cup is provided with a transfer slot.

6. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: Three telescopic springs are connected between the position-limiting upper skirt hem and the position-limiting lower skirt hem.

7. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: The limiting upper skirt and the limiting lower skirt are both cylindrical structures. An annular air pressure groove is provided on the inner wall of the limiting upper skirt. An air blowing pipe is fixed in the air pressure groove. A plurality of air blowing holes are evenly spaced on the air blowing pipe. One end of the air blowing pipe is connected to an air pump.

8. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: The two-dimensional mobile platform comprises a mobile top plate, a mobile middle plate and a fixed bottom plate, wherein the mobile top plate is slidably connected to the mobile middle plate, and the mobile middle plate is slidably connected to the fixed bottom plate; A linear drive channel, a limit channel, a measuring channel and two guide channels are provided between the movable top plate and the movable middle plate, and between the movable middle plate and the fixed bottom plate; A linear motor is fixed in the linear drive channel; A photoelectric switch is provided in the limit channel; A grating ruler is provided in the measuring channel; A slide rail is arranged in the guide channel.

9. The wafer non-destructive posture adjustment device according to claim 1, characterized in that: A suction cup base is provided at the lower end of the vacuum suction cup, and the suction cup base is fixed to the upper end of the limit upper skirt by screws; The upper surface of the suction cup base is provided with three electric telescopic brackets, and the telescopic ends of the electric telescopic brackets are installed with laser distance measuring sensors.

10. The wafer non-destructive posture adjustment device according to claim 9, characterized in that: The electric telescopic bracket is an L-shaped structure, comprising a fixed vertical rod and a transverse telescopic tube, wherein the transverse telescopic tube comprises a telescopic outer tube and a telescopic inner tube, wherein the telescopic inner tube is slidably connected to the inner wall of the telescopic outer tube, wherein one end of the telescopic outer tube is fixed to the upper end of the fixed vertical rod, wherein a telescopic electric cylinder is fixed inside the telescopic outer tube, and the telescopic end of the telescopic electric cylinder is fixed to the telescopic inner tube.

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