A high-precision crystal bonding machine and its use method

Abstract

The present invention belongs to the technical field of crystal bonding machines, and specifically relates to a high-precision crystal bonding machine and a method for using the same. The crystal bonding machine includes a frame and a gantry assembly. The gantry assembly has a workbench, side panels arranged in the Y-axis direction on both sides of the workbench, a gantry Y-axis assembly arranged on the top of each side panel, two gantry X-axis assemblies slidably connected between the two gantry Y-axis assemblies, a crystal bonding module slidably connected to the first gantry X-axis assembly, and a glue dipping module slidably connected to the second gantry X-axis assembly. The crystal bonding module is used to move in three-dimensional space to pick up chips and place them in designated crystal bonding positions; the glue dipping module is used to move in three-dimensional space to apply glue to designated crystal bonding positions of a substrate placed on the workbench. The method for use detects the chip position on the wafer, picks up chips, caches chips, bonds chips, and performs product glue dipping and dispensing. The present invention improves the crystal bonding accuracy of chips.

Description

Technical Field

[0001] The present invention belongs to the technical field of crystal bonding machines, and in particular relates to a high-precision crystal bonding machine and a method for using the same. Background Art

[0002] A die bonder is a semiconductor device that is mainly used for back-end placement of semiconductor chips. Its working principle is to fix the chip and the electrical substrate together to form a reliable electrical connection between the chip and the substrate.

[0003] As chip sizes get smaller, the accuracy of traditional die bonding equipment can only meet the requirements for bonding large-sized chips. For smaller chips, higher accuracy is required. The positioning of the chip and the substrate is a key step in ensuring the accuracy of die bonding during chip placement.

[0004] Therefore, the present invention designs a new die bonding machine to solve the technical problem of improving the die bonding accuracy of chip mounting. Summary of the Invention

[0005] In order to solve the above technical problem, that is, how to improve the chip bonding accuracy, the present invention provides the following technical solutions:

[0006] On the one hand, the present invention provides a high-precision crystal bonding machine, comprising a frame and a gantry assembly arranged on the top of the frame, the gantry assembly having a work table, side panels arranged on both sides of the work table in the Y-axis direction, a gantry Y-axis assembly arranged on the top of each side panel, and two gantry X-axis assemblies slidably connected between the two gantry Y-axis assemblies, the gantry Y-axis assembly being used to move the gantry X-axis assembly in the Y-axis direction, the crystal bonding machine also comprising a crystal bonding module slidably connected to the first gantry X-axis assembly and a glue dipping module slidably connected to the second gantry X-axis assembly, the crystal bonding module being used to move in three-dimensional space to pick up chips and place them in designated crystal bonding positions; the glue dipping module being used to move in three-dimensional space to apply glue to designated crystal bonding positions of a substrate placed on the work table, and the crystal bonding module completing the fixation of the chip on the substrate after placing the chip in the crystal bonding position.

[0007] Furthermore, the crystal bonding module includes a crystal bonding component and a crystal bonding vision component connected to the crystal bonding component. The crystal bonding vision component is used to locate the chip position using CCD technology, and the crystal bonding component is used to perform chip absorption, movement and placement; the crystal bonding component includes a crystal bonding lifting mechanism slidably connected to the first gantry X-axis component and a bonding head mechanism installed on the crystal bonding lifting mechanism. The crystal bonding lifting mechanism is used to drive the bonding head mechanism to lift and lower in the Z-axis direction, and the bonding head mechanism is used to perform chip absorption, movement and placement; the bonding head mechanism includes a crystal bonding adjustment mechanism and a bonding head rotating component connected to the crystal bonding adjustment mechanism. The crystal bonding adjustment mechanism is used to accurately adjust the position of the bonding head rotating component in the horizontal direction; the bonding head rotating component absorbs the chip through rotational motion and places the chip to the specified position; the crystal bonding vision component includes a crystal bonding vision lifting mechanism and a first CCD camera component connected to the crystal bonding vision lifting mechanism. The crystal bonding vision lifting mechanism is responsible for driving the first CCD camera component to move up and down to capture the chip.

[0008] Furthermore, the die-bonding lifting mechanism of the die-bonding assembly includes a first motor base plate, a U-shaped linear motor disposed on the first motor base plate, a single-moving follower block disposed on the mover of the U-shaped linear motor, a lifting follower block disposed on the single-moving follower block, and a sliding mechanism connected to the inner side of the lifting follower block, wherein the lifting follower block is connected to a bonding head mechanism; driven by the U-shaped linear motor, the single-moving follower block slides with the lifting follower block, thereby driving the bonding head mechanism to perform lifting motion;

[0009] The ram rotating assembly includes a DD motor connected to the crystal bonding adjustment mechanism, a ram seat connected below the DD motor, a group of cylinders connected to the top of the ram seat, an air blowing block arranged between the cylinders, a voice coil motor arranged below the air blowing block, a ram nozzle rod arranged at the bottom of the air blowing block, a nozzle connected to the bottom of the ram nozzle rod, and a first spring passed through the ram nozzle rod; the top of the air blowing block is connected to the top of the ram seat, the top of the voice coil motor is connected to the top of the ram seat; the ram nozzle rod is slidably connected to the ram seat, and a spring is passed through the ram nozzle rod.

[0010] Furthermore, the glue dipping module includes a glue dipping component, a glue storage component connected to the glue dipping component, and a glue dipping vision component connected to the glue dipping component. The glue dipping component includes a glue dipping lifting mechanism slidably connected to the second gantry X-axis component, a glue dipping mechanism connected to the bottom of the glue dipping lifting mechanism, the glue dipping mechanism includes a glue dipping adjustment mechanism connected to the glue dipping lifting mechanism, a spring-type glue dipping mechanism connected to the glue dipping adjustment mechanism, and a glue dipping head connected to the end of the spring-type glue dipping mechanism; the glue storage component includes a glue storage motor component, a glue storage tray component connected to the bottom of the glue storage motor component, and the glue storage motor component is used to drive the glue storage tray component to rotate; the glue dipping vision component is used to use CCD technology to identify the specific position of the glue dipping on the substrate. The glue dipping component drives the glue dipping head to move vertically and rotationally, and drives the glue dipping head to move to the glue storage tray of the glue storage tray component to rotate and dip the glue. After the glue dipping is completed, the glue is applied to the designated solid crystal position of the substrate.

[0011] Furthermore, the spring-type dipping mechanism includes a dispensing head mounting plate, a dispensing sleeve mounting plate connected to the dispensing head mounting plate, a pressing plate connected to the dispensing head mounting plate and the bottom of the dispensing sleeve mounting plate, a spring pressure block connected to the dispensing head mounting plate and the top of the dispensing sleeve mounting plate, and a compression spring sleeved on the top of the spring pressure block, and the bottom of the dispensing sleeve mounting plate is connected to a dipping head.

[0012] Furthermore, the glue storage motor assembly includes a glue dipping mounting plate connected to the glue dipping lifting mechanism, a bearing mounting seat connected to the glue dipping mounting plate, a transmission shaft passing through the bearing mounting seat, a servo motor rotatably connected to the top of the transmission shaft, and a servo motor connected to the top of the bearing mounting seat; the glue storage disk assembly includes a glue storage disk connected to the bottom end of the transmission shaft, a micrometer connected to the top of the front side of the bearing mounting seat, a spring guide column connected to the bottom end of the front side of the bearing mounting seat, a spring passing through the spring guide column, and the bottom of the micrometer is connected to the top of the spring guide column.

[0013] Furthermore, the rubber storage tray assembly also includes an adjustment fixing seat passing through the middle of the bottom end of the front side of the bearing mounting seat, a scraper connected to the bottom of the adjustment fixing seat, the top of the adjustment fixing seat is connected to the top of the spring guide column, and the bottom of the scraper contacts the top of the rubber storage tray; it also includes a rubber storage guide seat set at the bottom end of the front side of the bearing mounting seat, and a rubber storage pressure block connected to the rubber storage guide seat. The adjustment fixing seat is enclosed in the rubber storage guide seat and the rubber storage pressure block, and the adjustment fixing seat is in close contact with the rubber storage guide seat and the rubber storage pressure block.

[0014] Furthermore, the crystal bonding machine also includes a wafer loading mechanism, a picking module, a cache module, a wafer-level camera module, and an upper vision module. The wafer loading mechanism is used to supply chips. The picking module is slidably connected to the end face of the workbench close to the wafer loading mechanism along the X-axis direction. The cache module is arranged on the inner wall of the side plate close to both sides of the picking module. The wafer-level camera module is located above the wafer loading mechanism. The wafer-level camera module is used to identify the position of the chip on the wafer in the wafer loading mechanism. The picking module is used to pick up the chip identified by the wafer-level camera module from the wafer and place the temporary cache chip on the cache module. The cache module waits for the crystal bonding module to pick up the cached chip.

[0015] Furthermore, the cache module includes a cache lifting mechanism arranged on the inner wall of the side panel, a cache assembly connected to the cache lifting mechanism, the cache assembly includes a cache follower block connected to the cache lifting mechanism, a cache vacuum plate connected to the top of the cache follower block, a mirror suction cup mounting plate connected to the top of the cache vacuum plate, and a mirror suction cup arranged on the mirror suction cup mounting plate, a vacuum air duct ventilation is arranged inside the mirror suction cup mounting plate, and an air pipe joint for connecting to a vacuum source is arranged outside the mirror suction cup mounting plate.

[0016] Furthermore, the wafer loading mechanism includes a wafer Y-axis base connected to the top, a wafer middle base slidably connected to the top of the wafer Y-axis base, a wafer X-motion plate slidably connected to the top of the wafer middle base, a turntable connected to the top of the wafer X-motion plate, and a crystal plate connected to the top of the turntable. The turntable is connected to a driving mechanism through a belt transmission mechanism.

[0017] In one aspect, the present invention provides a method for using a die bonder, comprising the following steps:

[0018] Step S1: The wafer-level camera module identifies the wafer in the wafer loading mechanism and detects the specific position of each chip;

[0019] Step S2: The picking module moves to the corresponding chip position according to the detection result of the wafer-level camera module and picks up the chip from the wafer;

[0020] Step S3: The picking module places the picked chip on the cache module to temporarily fix the chip;

[0021] Step S4: The die-bonding vision component uses CCD technology to locate the cached chip to ensure the precise position of the chip;

[0022] Step S5: The die-bonding assembly absorbs the chip on the cache module through rotational motion;

[0023] Step S6: After the nozzle of the die-bonding assembly picks up the chip, the upper vision module checks the angle of the chip and adjusts the chip angle;

[0024] Step S8: The die-bonding vision component uses CCD technology again to locate the designated die-bonding position on the substrate;

[0025] Step S9: The die-bonding assembly places the chip precisely at a designated location on the substrate to complete the die-bonding operation;

[0026] The following steps are performed simultaneously with steps S4-S9:

[0027] Step S10: The glue storage motor assembly in the glue dipping module drives the glue storage tray to rotate so that the glue is evenly distributed on the glue storage tray;

[0028] Step S11: The glue dipping vision component uses CCD technology to identify the specific position on the substrate where glue dipping is required;

[0029] Step S12: The glue dipping mechanism is driven down by the glue dipping mechanism, and the spring-type glue dipping mechanism contacts the glue storage tray and takes up glue; the glue dipping mechanism then moves to a designated position on the substrate, and the glue is precisely applied to the die-bonding position through the glue dipping head, providing the necessary adhesive for chip fixation.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The crystal bonding module of the present invention moves precisely in three-dimensional space to pick up chips; synchronously, the glue dipping module moves in three-dimensional space, and after dipping in glue, moves to the position on the substrate where glue needs to be applied. The crystal bonding module places the chip at the glue application position, and automatically fixes the chip. The present invention improves the crystal bonding accuracy of the chip.

[0032] The stable connection and support between the various components of the wafer-level camera adjustment base of the present invention ensure the stability of the camera during operation and reduce the impact of vibration and interference on image capture. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 Schematic diagram of the three-dimensional structure of the crystal bonding machine of the present invention;

[0034] Figure 2 For the present invention Figure 1 The main view;

[0035] Figure 3 This is a schematic diagram of the three-dimensional structure of the crystal bonding machine of the present invention, omitting the frame and gantry assembly;

[0036] Figure 4 This is an exploded view of the die bonder of the present invention, omitting the frame;

[0037] Figure 5 It is a schematic diagram of the three-dimensional structure of the gantry assembly of the present invention;

[0038] Figure 6Schematic diagram of the three-dimensional structure of the die-bonding module of the present invention;

[0039] Figure 7 An exploded view of the die-bonding module of the present invention;

[0040] Figure 8 Schematic diagram of the three-dimensional structure of the die-bonding assembly of the present invention;

[0041] Figure 9 Schematic diagram of the three-dimensional structure of the die-fixing visual component of the present invention;

[0042] Figure 10 Schematic diagram of the three-dimensional structure of the wafer-level camera module of the present invention;

[0043] Figure 11 Schematic diagram of the three-dimensional structure of the upper visual module of the present invention;

[0044] Figure 12 It is a schematic diagram of the three-dimensional structure of the pickup module of the present invention;

[0045] Figure 13 Schematic diagram of the three-dimensional structure of the crystal extraction assembly of the present invention;

[0046] Figure 14 A schematic diagram of the three-dimensional structure of the cache module of the present invention;

[0047] Figure 15 Schematic diagram of the three-dimensional structure of the wafer loading mechanism of the present invention;

[0048] Figure 16 This is one of the three-dimensional structural schematic diagrams of the ejector mechanism of the present invention;

[0049] Figure 17 This is the second schematic diagram of the three-dimensional structure of the ejector mechanism of the present invention;

[0050] Figure 18 This is an exploded view of the dipping module of the present invention;

[0051] Figure 19 Schematic diagram of the three-dimensional structure of the dipping component of the present invention;

[0052] Figure 20 Schematic diagram of the three-dimensional structure of the spring-type glue dipping mechanism of the present invention;

[0053] Figure 21 Schematic diagram of the three-dimensional structure of the glue storage assembly of the present invention;

[0054] Figure 22 It is a schematic diagram of the three-dimensional structure of the dipped glue visual component of the present invention.

[0055] Reference numerals:

[0056] 100 is the die bonder; 1 is the gantry assembly; 2 is the die bond module; 3 is the wafer-level camera module; 4 is the upper vision module; 5 is the pickup module; 6 is the buffer module; 7 is the wafer loading mechanism; 8 is the ejector mechanism; 9 is the glue dipping module; 10 is the rack; 10-1 is the wafer loading base; 11 is the material removal assembly;

[0057] 1-1 is the work table; 1-2 is the side panel; 1-3 is the gantry Y-axis assembly; 1-31 is the gantry Y-axis; 1-32 is the first linear motor; 1-33 is the first slider; 1-34 is the first guide rail; 1-35 is the gantry Y-axis sliding seat; 1-4 is the gantry X-axis assembly; 1-41 is the gantry X-axis crossbeam; 1-42 is the second guide rail; 1-43 is the second slider; 1-44 is the second linear motor; 1-45 is the gantry X-axis sliding plate; 1-5 is the gantry connecting seat; 2-1 is the crystal bonding assembly; 2-11 is the first motor base plate; 2-12 is the U-shaped linear Linear motor; 2-13 is the single mover follower block; 2-14 is the lifting follower block; 2-15 is the third guide rail; 2-16 is the third slider; 2-17 is the first crystal bonding adjustment plate; 2-18 is the second crystal bonding adjustment plate; 2-19 is the first adjusting screw; 2-110 is the second adjusting screw; 2-111 is the DD motor; 2-112 is the bonding head seat; 2-113 is the cylinder; 2-114 is the blowing block; 2-115 is the voice coil motor; 2-116 is the bonding head nozzle rod; 2-117 is the nozzle; 2-118 is the first spring; 2-119 is the contact screw fixing seat;

[0058] 2-2 is the crystal-fixing vision assembly; 2-21 is the lifting base; 2-22 is the fourth guide rail; 2-23 is the fourth slider; 2-24 is the first ball screw; 2-25 is the nut follower block; 2-26 is the first servo motor; 2-27 is the support side; 2-28 is the fixed side; 2-29 is the lens holder; 2-210 is the first CCD camera assembly; 2-211 is the camera body; 2-212 is the lens; 2-213 is the light source holder; 2-214 is the coaxial light source; 2-215 is the annular light source;

[0059] 3 is the wafer-level camera module; 3-1 is the wafer-level camera adjustment base; 3-11 is the visual fixing base; 3-12 is the cross roller vertical plate; 3-13 is the wafer camera adjustment plate; 3-14 is the adjustment rod; 3-15 is the height fixing plate; 3-16 is the camera extension base; 3-17 is the camera extension upper plate; 3-18 is the camera fixing base; 3-19 is the lens height adjustment plate; 3-110 is the wafer ring light mounting plate; 3-111 is the adjustment fixing block; 3-2 is the second CCD camera assembly; 3-21 is the prism;

[0060] 4 is the upper vision module; 4-1 is the upper vision fixed adjustment seat; 4-2 is the third CCD camera assembly;

[0061] 5 is the pickup module; 5-1 is the crystal retrieval X-axis motion assembly; 5-11 is the crystal retrieval X-axis crossbeam; 5-12 is the fifth guide rail; 5-13 is the fifth slider; 5-14 is the material retrieval slider plate; 5-15 is the first motor mounting plate; 5-16 is the third linear motor; 5-2 is the crystal retrieval assembly;

[0062] 6 is the cache module; 6-1 is the cache lifting mechanism; 6-11 is the cache module base plate; 6-12 is the second ball screw; 6-13 is the screw bearing seat; 6-14 is the active bearing seat; 6-15 is the synchronous pulley 1; 6-16 is the motor mounting seat; 6-17 is the second servo motor; 6-18 is the synchronous pulley 2; 6-19 is the sixth guide rail; 6-110 is the sixth slider; 6-111 is the conveyor belt 1; 6-112 is the driven bearing seat; 6-113 is the cache module nut seat; 6-2 is the cache assembly; 6-21 is the cache follower block; 6-22 is the cache vacuum plate; 6-23 is the mirror suction cup mounting plate; 6-24 is the mirror suction cup;

[0063] 7 is the wafer loading mechanism; 7-1 is the wafer Y-axis base; 7-2 is the wafer center seat; 7-3 is the wafer X-motion plate; 7-4 is the turntable; 7-5 is the wafer plate; 7-6 is the belt drive mechanism; 7-61 is the synchronous pulley three; 7-62 is the synchronous pulley four; 7-63 is the synchronous pulley five; 7-64 is the pulley mounting plate; 7-65 is the connecting shaft; 7-66 is the conveyor belt two; 7-67 is the conveyor belt three; 7-8 is the motor mounting plate; 7-9 is the third servo motor;

[0064] 8 is the ejector mechanism; 8-1 is the ejector adjustment seat assembly; 8-2 is the ejector assembly; 8-11 is the ejector base; 8-12 is the ejector adjustment plate 1; 8-13 is the ejector adjustment plate 2; 8-14 is the ejector intermediate plate; 8-15 is the waist hole connecting piece; 8-21 is the ejector mounting bracket; 8-23 is the ejector bearing seat; 8-24 is the ejector cap adjustment seat; 8-25 is the ejector cap; 8-26 is the U-shaped voice coil motor; 8-27 is the ejector shaft assembly;

[0065] 9 is the glue dipping module; 9-1 is the glue dipping assembly; 9-2 is the glue storage assembly; 9-3 is the glue dipping visual assembly; 9-11 is the glue dipping lifting mechanism; 9-12 is the glue dipping adjustment block; 9-13 is the glue dipping adjustment plate; 9-14 is the fourth servo motor; 9-15 is the glue dispensing sleeve bracket; 9-16 is the spring-type glue dipping mechanism; 9-161 is the glue dispensing head mounting plate; 9-162 is the glue dispensing sleeve mounting plate; 9-163 is the pressure piece; 9-164 is the spring pressure block; 9-165 is the compression spring; 9-17 is the glue dipping head;

[0066] 9-21 is the glue storage motor assembly; 9-22 is the glue dipping mounting plate; 9-23 is the bearing mounting seat; 9-24 is the transmission shaft; 9-25 is the fifth servo motor; 9-26 is the contour plate; 9-27 is the second motor mounting plate; 9-28 is the glue storage tray; 9-29 is the micrometer; 9-210 is the spring guide column; 9-211 is the second spring; 9-212 is the glue storage block; 9-213 is the adjustment fixing seat; 9-214 is the scraper; 9-215 is the glue storage guide seat. DETAILED DESCRIPTION

[0067] The technical solution of the present invention will be clearly described below in conjunction with the accompanying drawings. Obviously, the described embodiments are not all embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0068] It should be noted that the terms "center", "up", "down", "horizontal", "left", "right", "front", "back", "lateral", "longitudinal", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0069] Example 1

[0070] Combine Figures 1-4 As shown, the present invention provides a high-precision crystal bonding machine, including a frame 10, a gantry assembly 1 arranged on the top of the frame 10, a crystal bonding module 2 installed on the front side of the top of the gantry assembly 1, a dipping module 9 installed on the rear side of the top of the gantry assembly 1, a wafer loading mechanism 7 arranged on the top surface of the shell of the frame 10, a pin mechanism 8 arranged below the wafer loading mechanism 7, a material picking assembly 11 arranged in the middle of the workbench 1-1 in the gantry assembly 1, a wafer-level camera module 3 and an upper vision module 4 arranged at the front end of the workbench 1-1, a picking module 5 arranged on the front end surface of the workbench 1-1, and a cache module 6 arranged on both sides of the picking module 5.

[0071] The gantry assembly 1 is used to drive the die-bonding module 2 and the glue-dipping module 9 thereon to move in a two-dimensional space.

[0072] The wafer loading mechanism 7 is used to supply chips to the die bonding module 2. The material taking component 11 is used to place and push the substrate.

[0073] The wafer-level camera module 3 is used to detect the chip positions on the wafer in the wafer loading mechanism 7, and use the camera to take pictures of the chips on the wafer to identify the specific position of each chip.

[0074] The picking module 5 is used to pick up the chips identified by the wafer-level camera module 3 from the wafer and place them on the cache module 6 .

[0075] The cache module 6 is used to cache the chips picked up by the pickup module 5 by vacuum adsorption so that the die bonding module 2 can take away the chips.

[0076] The die bonding module 2 is used to locate the chip position in the cache using CCD technology, pick up the chip cached by the cache module 6, and place the chip on the designated die bonding position of the substrate.

[0077] The upper vision module 4 is used to perform visual analysis on the chip from bottom to top after the chip is picked up by the die bonding module 2. The die bonding module 2 adjusts the angle of the picked chip according to the recognition result to ensure that the chip is placed correctly.

[0078] The glue dipping module 9 is used to identify the specific glue dipping position on the substrate using CCD technology, and then apply the glue to the designated die-bonding position of the substrate after rotating the glue dipping module.

[0079] Combine Figure 1 、 Figure 4 、 Figure 5 As shown, the gantry assembly 1 includes a work table 1-1 and side panels 1-2 arranged on the left and right sides of the work table 1-1. Openings are provided on the two side panels 1-2. The two ends of the work table 1-1 are respectively arranged in the openings of the side panels 1-2. The substrate to be processed enters the material removal assembly 11 on the work table 1-1 from the opening on the left, and the substrate that has been processed leaves the work table 1-1 from the opening on the right.

[0080] The gantry assembly 1 further includes two gantry Y-axis assemblies 1 - 3 and two gantry X-axis assemblies 1 - 4 slidably connected to the gantry Y-axis assemblies 1 - 3 .

[0081] The gantry Y-axis assembly 1-3 includes a gantry Y-axis 1-31 mounted on top of each side panel 1-2, a linear drive mechanism mounted outside the gantry Y-axis 1-31, and a sliding mechanism mounted on top of the gantry Y-axis 1-31. The linear drive mechanism is a first linear motor 1-32 mounted on the side of the gantry Y-axis 1-31 away from the worktable 1-1. The sliding mechanism is a matching first guide rail 1-34 and first slider 1-33 mounted on top of the gantry Y-axis 1-31. The top of the first slider 1-33 is connected to the mover of the first linear motor 1-32 via a gantry Y-axis sliding seat 1-35. The gantry Y-axis sliding seat 1-35 is connected to the gantry X-axis assembly 1-4 via a gantry connecting seat 1-5. When the first linear motor 1-32 is in operation, the mover of the first linear motor 1-32 drives the first slider 1-33 along the first guide rail 1-34 in the Y-axis direction via the gantry Y-axis sliding seat 1-35, thereby driving the movement of the gantry X-axis assembly 1-4.

[0082] The gantry X-axis assembly 1-4 includes two gantry X-axis beams 1-41 connected between the two gantry Y-axis beams 1-31, a linear drive mechanism and a sliding mechanism disposed on the side of the gantry X-axis beams 1-41 near the worktable 1-1. The ends of the gantry X-axis beams 1-41 are connected to the gantry connector 1-5, enabling the gantry X-axis beams 1-41 to move between the gantry Y-axis beams 1-31. The sliding mechanism includes two matching second guide rails 1-42 and a second slider 1-43 disposed in the X-axis direction, positioned vertically inside the gantry X-axis beams 1-41. The linear drive mechanism is a second linear motor 1-44 disposed between the two second guide rails 1-42.

[0083] The second linear motor 1-44 has a gantry X-axis sliding plate 1-45 mounted on its mover. Both ends of the gantry X-axis sliding plate 1-45 are connected to the second slider 1-43. The first gantry X-axis sliding plate 1-45 on the front side is connected to the die-bonding module 2. The movement of the second linear motor 1-44 drives the first gantry X-axis sliding plate 1-45, which in turn drives the die-bonding module 2 mounted on the gantry X-axis sliding plate 1-45.

[0084] Combine Figure 1 、 Figure 5 、 Figure 6 As shown, the die-bonding module 2 comprises a die-bonding assembly 2-1 connected to the front gantry X-axis slide plate 1-45 and a die-bonding vision assembly 2-2 positioned in the middle of the die-bonding assembly 2-1. The die-bonding assembly 2-1 is responsible for picking up, moving, and placing the chips, while the die-bonding vision assembly 2-2 accurately identifies and positions the chips, providing precise guidance and control for the die-bonding assembly 2-1.

[0085] The die bond assembly 2-1 includes a die bond lift mechanism mounted on the front X-axis slide plate 1-45 of the gantry, and a bonding head mechanism mounted on the die bond lift mechanism. The die bond lift mechanism is used to achieve Z-axis lifting and lowering motion of the bonding head mechanism. The bonding head mechanism is used to perform chip pickup and placement operations. The bonding head mechanism can move in three dimensions through the gantry assembly 1 and the lifting mechanism of the die bond assembly 2-1.

[0086] Combine Figure 6-Figure 8As shown, the die bonding lifting mechanism includes a first motor base plate 2-11, a U-shaped linear motor 2-12 mounted on the first motor base plate 2-11, a single-moving follower block 2-13 mounted on the mover of the U-shaped linear motor 2-12, a lifting follower block 2-14 mounted on the single-moving follower block 2-13, and a matching third slider 2-16 and third guide rail 2-15 connected to the inner side of the lifting follower block 2-14. The third guide rail 2-15 is mounted on the first motor base plate 2-11. The lifting follower block 2-14 is connected to the bonding mechanism. The mover of the U-shaped linear motor 2-12 drives the single-moving follower block 2-13, which in turn drives the lifting follower block 2-14, which in turn drives the third slider 2-16 to move up and down along the third guide rail 2-15, thereby driving the lifting mechanism to move up and down.

[0087] Combine Figure 6-Figure 8 As shown, the bonding mechanism includes a die-bonding adjustment mechanism and a bond-bonding rotating assembly connected to the die-bonding adjustment mechanism. The die-bonding adjustment mechanism is used to precisely adjust the bond-bonding rotating assembly's position in the X and Y axes to ensure that the chip is accurately placed in the specified position on the substrate. The bond-bonding rotating assembly is used to achieve chip rotation and precise placement.

[0088] Combine Figure 6-Figure 8 As shown, the die-bonding adjustment mechanism includes a die-bonding adjustment plate 2-17 for adjusting the X-axis position of the bond head rotating assembly, and a die-bonding adjustment plate 2-18 for adjusting the Y-axis position of the bond head rotating assembly. The die-bonding adjustment plate 2-17 is connected to the lifting follower block 2-14. An adjustment screw 2-19 is provided on the die-bonding adjustment plate 2-17. The adjustment plate 2-18 is connected to the adjustment plate 2-17 via an adjustment screw 2-110. The die-bonding adjustment plate 2-18 is connected to the top of the bond head rotating assembly. Rotating the adjustment screw 2-19 adjusts the offset of the bond head rotating assembly in the X-axis direction, while rotating the adjustment screw 2-110 adjusts the offset of the bond head rotating assembly in the Y-axis direction. The fine-tuning function of the die-bonding adjustment mechanism further ensures that the chip is accurately placed on the substrate.

[0089] Combine Figure 6-Figure 8As shown, the bang head rotating assembly includes a DD motor 2-111 connected to the top of the adjustment plate 2-18, a bang head seat 2-112 connected below the DD motor 2-111, a group of cylinders 2-113 connected to the top of the bang head seat 2-112, a blowing block 2-114 arranged between the cylinders 2-113, a voice coil motor 2-115 arranged below the blowing block 2-114, a bang head suction nozzle rod 2-116 arranged at the bottom of the blowing block 2-114, a suction nozzle 2-117 connected to the bottom of the bang head suction nozzle rod 2-116, and a first spring 2-118 passing through the bang head suction nozzle rod 2-116. Among them, the top of the blowing block 2-114 is connected to the top of the bang head seat 2-112, and the top of the voice coil motor 2-115 is connected to the top of the bang head seat 2-112. A vacuum air pipe joint is provided on the nozzle rod 2-116 of the poppet head. The top two ends of the nozzle rod 2-116 of the poppet head are respectively connected to the cylinder 2-113. The nozzle rod 2-116 of the poppet head is slidably connected to the poppet head seat 2-112 through a cross roller straight rail. The first spring 2-118 is sleeved on the screw rod. The top end of the first spring 2-118 is hung on the top of the screw rod. The bottom end of the first spring 2-118 is hung on the nozzle rod 2-116 of the poppet head. The bottom of the screw rod is fixed to the contact screw fixing seat 2-119. The contact screw fixing seat 2-119 is connected to the poppet head seat 2-112.

[0090] The bonding head mechanism moves to the cache module 6 in three-dimensional space, and the suction nozzle 2-117 sucks the chip under the action of vacuum; after the suction nozzle 2-117 takes the chip, the upper vision module 4 will perform a visual analysis of the chip on the suction nozzle 2-117 to determine whether the chip angle is appropriate, and the DD motor 2-111 operates to adjust the angle of the suction nozzle 2-117; after the angle is adjusted to be appropriate, the suction nozzle 2-117 carries the chip to the substrate, and after the chip is placed on the substrate bonding position, the chip will not be subjected to a large force due to the action of the voice coil motor 2-115; the bonding adjustment mechanism fine-tunes the suction nozzle 2-117 in the horizontal direction, and the cylinder 2-113 drives the bonding head suction nozzle rod 2-116 to slide to give the chip a preset pressure, so that the chip is tightly attached to the substrate, completing a bonding action; after bonding, the cylinder 2-113 returns to its position, and the bonding head suction nozzle rod 2-116 also returns to its position upward at the same time under the action of the first spring 2-118. Air blow block 2-114 is used to clean the chip before die bonding, removing dust and impurities from the chip surface. It also removes dust and impurities from the substrate before chip placement. The combined operation of the die bonding adjustment mechanism and the bonding head rotation assembly ensures extremely high chip placement accuracy and reliability during packaging and similar processes.

[0091] Combine Figure 6 、 Figure 7 、 Figure 9As shown, the die bonding vision assembly 2-2 includes a die bonding vision lifting mechanism and a first CCD camera assembly 2-210 connected to the die bonding vision lifting mechanism. The die bonding vision lifting mechanism includes a lifting base plate 2-21 positioned in the middle of the front gantry X-axis slide plate 1-45, fourth Z-axis guide rails 2-22 and fourth sliders 2-23 positioned on the left and right sides of the lifting base plate 2-21, and a screw drive mechanism positioned between the two fourth guide rails 2-22. The die bonding vision lifting mechanism is responsible for driving the first CCD camera assembly 2-210 up and down to capture images of the target chip.

[0092] Combine Figure 6 、 Figure 7 、 Figure 9 As shown, the screw drive mechanism includes a first ball screw 2-24, a nut follower 2-25 threaded through the first ball screw 2-24, and a first servo motor 2-26. The bottom end of the first ball screw 2-24 is connected to the bottom of the lifting base plate 2-21 via a support side 2-27, and the top end of the first ball screw 2-24 is connected to the top of the lifting base plate 2-21 via a fixed side 2-28. The nut follower 2-25 is connected to the fourth slider 2-23. The nut follower 2-25 is connected to the first CCD camera assembly 2-210. The first servo motor 2-26 is connected to the top of the lifting base plate 2-21. The output shaft of the first servo motor 2-26 is connected to the first ball screw 2-24 via a coupling. When the first ball screw 2-24 rotates, the nut follower 2-25 moves along the first ball screw 2-24, thereby driving the first CCD camera assembly 2-210 to move up and down. The nut follower block 2-25 is connected to a lens fixing seat 2-29, and a first CCD camera assembly 2-210 is installed in the lens fixing seat 2-29.

[0093] Combine Figure 6 、 Figure 7 、 Figure 9 As shown, the first CCD camera assembly 2-210 includes a camera body 2-211, a lens 2-212, a light source holder 2-213, a coaxial light source 2-214, and an annular light source 2-215. The lens 2-212 of the first CCD camera assembly 2-210 is disposed within the lens holder 2-29 along the Z-axis direction. The coaxial light source 2-214 of the downward-looking camera 2-210 is mounted on the lens 2-212 of the downward-looking camera via the light source holder 2-213, and the annular light source 2-215 is mounted on one side of the lens 2-212.

[0094] Combine Figure 3 、 Figure 4 、 Figure 10As shown, the wafer-level camera module 3 includes a wafer-level camera adjustment base 3-1 and a second CCD camera assembly 3-2 mounted on the wafer-level camera adjustment base 3-1. The wafer-level camera adjustment base 3-1 is responsible for supporting and adjusting the position and height of the second CCD camera assembly 3-2 to ensure that the second CCD camera assembly 3-2 can capture images of the wafer surface below.

[0095] Combine Figure 3 、 Figure 4 、 Figure 10 As shown, the wafer-level camera adjustment base 3-1 includes a vision fixing base 3-11 connected to the worktable 1-1, a cross roller plate 3-12 slidably connected to the top of the vision fixing base 3-11, a wafer camera adjustment plate 3-13 straddling the rear sides of the vision fixing base 3-11 and the cross roller plate 3-12, an adjustment rod 3-14 passing through the wafer camera adjustment plate 3-13 and the cross roller plate 3-12, and an adjustment fixing block 3-111 connected to both ends of the vision fixing base 3-11. The adjustment fixing block 3-111 is provided with a waist hole. The vision fixing base 3-11 and the cross roller plate 3-12 are slidably connected via a cross roller linear guide. By rotating the adjustment rod 3-14, the cross roller plate 3-12 can be driven to move horizontally, thereby achieving horizontal adjustment of the second CCD camera assembly 3-2.

[0096] Combine Figure 3 、 Figure 4 、 Figure 10 As shown, the wafer-level camera adjustment base 3-1 also includes height fixing plates 3-15 provided on both sides of the cross roller plate 3-12 in the Z-axis direction, a camera extension base 3-16 to which the cross roller plate 3-12 is slidably connected in the Z-axis direction, a camera fixing base 3-18 connected to the camera extension base 3-16, a camera extension upper plate 3-17 connected between the two sides of the top front end of the camera extension base 3-16, a lens height adjustment plate 3-19 connected to the front end of the camera extension upper plate 3-17 through a waist hole, and a wafer ring light mounting plate 3-110 connected to the bottom of the lens height adjustment plate 3-19. The cross roller plate 3-12 and the camera extension base 3-16 are connected by cross roller linear guides, and the height fixing plate 3-15 is connected to the camera extension base 3-16. The height fixing plate 3-15 is provided with a waist hole.

[0097] Height fixing plate 3-15 further secures and supports camera extension mount 3-16, facilitating adjustment and fixation of its position. Camera extension mount 3-16 supports the second CCD camera assembly 3-2 and is connected to cross-roller plate 3-12 via a cross-roller linear guide, enabling height adjustment along the Z axis. The design of camera extension mount 3-16 allows for a wider range of camera height adjustments to accommodate wafers of varying sizes and inspection requirements.

[0098] The camera mounting base 3-18 is used to support and fix the wafer-level phase 3-2 to prevent it from moving or vibrating during operation. The camera extension upper plate 3-17 is used to provide additional support and stability for the wafer-level phase 3-2. The lens height adjustment plate 3-19 is used to fine-tune the height of the lens of the wafer-level phase 3-2 within a certain range. The second CCD camera assembly 3-2 is arranged between the camera extension base 3-16 and the camera mounting base 3-18. The second CCD camera assembly 3-2 is similar to the first CCD camera assembly 2-210 and will not be described in detail. The prism 3-21 of the second CCD camera assembly 3-2 is located above the wafer ring light mounting plate 3-110.

[0099] Combine Figure 3 、 Figure 4 、 Figure 11 As shown, the upper vision module 4 is located to the right of the wafer-level camera module 3 and includes an upper vision fixed adjustment base 4-1 and a third CCD camera assembly 4-2 mounted on the upper vision fixed adjustment base 4-1. The upper vision fixed adjustment base 4-1 is responsible for supporting and adjusting the position and angle of the third CCD camera assembly 4-2, which is responsible for capturing images of the target chip from above.

[0100] Combine Figure 3 、 Figure 4 、 Figure 12 As shown, the picking module 5 includes a crystal picking X-axis motion component 5-1 and a crystal picking component 5-2 slidably connected to the crystal picking X-axis motion component 5-1.

[0101] Combine Figure 3 、 Figure 4 、 Figure 11 As shown, the crystal retrieval X-axis motion assembly 5-1 includes a crystal retrieval X-axis crossbeam 5-11 disposed on the front end surface of the work table 1-1, two matching fifth guide rails 5-12 and a fifth slider 5-13 disposed along the X-axis direction of the crystal retrieval X-axis crossbeam 5-11, a material retrieval slider plate 5-14 connected to the top of the fifth slider 5-13, a material retrieval motor mounting plate 5-15 disposed on the bottom front end of the work table 1-1, and a third linear motor 5-16 disposed at the bottom of the material retrieval motor mounting plate 5-15. The bottom of the crystal retrieval X-axis crossbeam 5-11 is connected to the front end of the material retrieval motor mounting plate 5-15, and the inner side of the material retrieval slider plate 5-14 is connected to the mover of the third linear motor 5-16. The outer side of the material retrieval slider plate 5-14 is connected to the crystal retrieval assembly 5-2.

[0102] Combine Figure 8 、 Figure 13 As shown, the chip retrieval assembly 5 - 2 is similar in structure to the chip bonding assembly 2 - 1 of the chip bonding module 2 , except that it does not have a cylinder and does not need to perform a chip bonding operation. It only needs to pick up the chip and place it on the cache module 6 .

[0103] Combine Figure 5 、 Figure 14 As shown, the buffer module 6 comprises a buffer lift mechanism 6-1 mounted on the inner walls of the two side panels 1-2, and a buffer assembly 6-2 connected to the buffer lift mechanism 6-1, comprising a left buffer module and a right buffer module. The buffer module 6 is used to temporarily store chips. The pickup module 5 places chips retrieved from the wafer loading mechanism 7 onto the buffer module 6, awaiting removal by the die bonder module 2.

[0104] Combine Figure 5 、 Figure 14 As shown, the cache lifting mechanism 6-1 includes a cache module bottom plate 6-11 arranged on the inner wall of the side plate 1-2, and a screw belt transmission drive mechanism connected to the cache module bottom plate 6-11.

[0105] like Figure 14 As shown, the screw belt transmission drive mechanism includes a second ball screw 6-12 installed on the cache module base plate 6-11 in the Z-axis direction. The top end of the second ball screw 6-12 is connected to the top of the cache module base plate 6-11 through a driven bearing seat 6-112. The bottom end of the second ball screw 6-12 is inserted through the screw bearing seat 6-13 and connected to the bottom of the cache module base plate 6-11. The screw belt transmission drive mechanism also includes an active bearing seat 6-14 disposed within the screw bearing seat 6-13 and a synchronous pulley 6-15 disposed below the bottom of the active bearing seat 6-14. The bottom end of the second ball screw 6-12 is inserted through the active bearing seat 6-14, and the synchronous pulley 6-15 is sleeved on the bottom end of the second ball screw 6-12.

[0106] like Figure 14 As shown, the screw belt transmission drive mechanism also includes a motor mounting seat 6-16 arranged on the outer side of the bottom of the screw bearing seat 6-13, a second servo motor 6-17 arranged on the top of the motor mounting seat 6-16, and a synchronous wheel 2 6-18 is sleeved on the end of the output shaft of the second servo motor 6-17. The output shaft of the second servo motor 6-17 is passed through the motor mounting seat 6-16, and the synchronous wheel 2 6-18 is located at the bottom of the motor mounting seat 6-16. The synchronous wheel 1 6-15 and the synchronous wheel 2 6-18 are connected through the conveyor belt 1 6-111. The cache lifting mechanism 6-1 also includes a cache module nut seat 6-113 mounted on the middle part of the second ball screw 6-12, a sixth guide rail 6-19 and a matching sixth slider 6-110 arranged on the cache module base plate 6-11 close to the workbench 1-1. The right side of the cache module nut seat 6-113 is connected to the sixth slider 6-110, and the cache module nut seat 6-113 is connected to the cache assembly 6-2.

[0107] When the second servo motor 6-17 is started, its output shaft drives the second synchronous wheel 6-18 to rotate. The rotation of the second synchronous wheel 6-18 is transmitted to the first synchronous wheel 6-15 through the conveyor belt 1 6-111, which in turn drives the second ball screw 6-12 to rotate. The rotation of the second ball screw 6-12 is converted into the up and down movement of the cache module nut seat 6-113.

[0108] like Figure 14 As shown, the cache assembly 6-2 includes a cache follower block 6-21 connected to the cache module nut seat 6-113, a cache vacuum plate 6-22 connected to the top of the cache follower block 6-21, two mirror suction cup mounting plates 6-23 connected to the top of the cache vacuum plate 6-22, and a mirror suction cup 6-24 mounted on the mirror suction cup mounting plate 6-23. The mirror suction cup 6-24 is provided with numerous small air holes. The mounting plate 6-23 for the mirror suction cup 6-24 is internally provided with a vacuum air duct for ventilation, and the mirror suction cup mounting plate 6-23 is externally provided with an air pipe connector for connecting to a vacuum source. A sealing ring is provided between the contact surface between the mirror suction cup mounting plate 6-23 and the mirror suction cup 6-24 to achieve a seal without disrupting the vacuum environment. The cache vacuum plate 6-22 moves up and down under the action of the cache module nut seat 6-113, allowing for flexible adjustment of the height of the cached chip. The chip is adsorbed on the mirror suction cup 6-24 by the negative vacuum pressure, achieving the purpose of chip storage.

[0109] Combine Figure 1 、 Figure 3 、 Figure 15 As shown, the wafer loading mechanism 7 is installed on the top of the frame 10 through the wafer loading base 10-1, and the top of the wafer loading mechanism 7 is located below the wafer-level camera module 3, which facilitates the wafer-level camera module 3 to visually locate and detect the wafer.

[0110] Combine Figure 1 、 Figure 3 、 Figure 15 As shown, the wafer loading mechanism 7 includes a wafer Y-axis base 7-1 connected to the top of the wafer loading base 10-1, a wafer center base 7-2 slidably connected to the top of the wafer Y-axis base 7-1, a wafer X-motion plate 7-3 slidably connected to the top of the wafer center base 7-2, a turntable 7-4 connected to the top of the wafer X-motion plate 7-3, and a wafer plate 7-5 connected to the top of the turntable 7-4 for supporting and securing the wafer. The wafer center base 7-2 slides along the Y-axis on the wafer Y-axis base 7-1, providing Y-axis movement for the wafer. The wafer X-motion plate 7-3 slides along the X-axis on the wafer center base 7-2, providing X-axis movement for the wafer. The turntable 7-4 is used to rotate the wafer to adjust its position.

[0111] like Figure 15As shown, the turntable 7-4 is connected to a drive mechanism via a belt drive mechanism 7-6. The belt drive mechanism 7-6 includes a third synchronous pulley 7-61 mounted on the wafer X motion plate 7-3, a second conveyor belt 7-66 connecting the third synchronous pulley 7-61 to the outer side of the turntable 7-4, a fourth synchronous pulley 7-62 coaxially mounted with the third synchronous pulley 7-61, and the fourth synchronous pulley 7-62 connected to the fifth synchronous pulley 7-63 via a third conveyor belt 7-67. A pulley mounting plate 7-64 is mounted on a connecting shaft 7-65 between the third synchronous pulley 7-61 and the fourth synchronous pulley 7-62. The bottom of the pulley mounting plate 7-64 is connected to the wafer X motion plate 7-3.

[0112] like Figure 15 As shown, the top of the pulley mounting plate 7-64 is connected to the motor mounting plate 7-8. The driving mechanism is a third servo motor 7-9 connected below the synchronous wheel 5 7-63. The synchronous wheel 5 7-63 is sleeved on the output shaft of the third servo motor 7-9, and the third servo motor 7-9 is connected to the motor mounting plate 7-8.

[0113] Working principle of wafer loading mechanism 7:

[0114] When the third servo motor 7-9 is activated, its output shaft rotates synchronous pulley five 7-63, which is then transmitted to synchronous pulley four 7-62 and synchronous pulley three 7-61 via conveyor belt three 7-67. This rotation is then transmitted to turntable 7-4 via conveyor belt two 7-66, which in turn rotates the wafer plate 7-5 on turntable 7-4, adjusting the position of the wafer. Simultaneously, the wafer center seat 7-2 and wafer X motion plate 7-3 work together to move the wafer in the X- and Y-axis directions. This allows the wafer to be precisely moved below the wafer-level camera module 3 for visual positioning and inspection, and then picked up by the pickup module 5.

[0115] Combine Figure 15-17 As shown, ejector mechanism 8, located below wafer loading mechanism 7, comprises an ejector adjustment base assembly 8-1 and an ejector assembly 8-2 mounted on top of the ejector adjustment base assembly 8-1. These two components work together to ensure that the wafer is lifted and positioned smoothly and accurately. The ejector adjustment base assembly 8-1 provides a mounting and adjustment platform for the ejector assembly 8-2, allowing precise position adjustment of the ejector assembly 8-2 in the X- and Y-axis directions. This allows the ejector mechanism 8 to adapt to wafers of varying sizes and different process requirements, allowing the wafer to be lifted via the ejector assembly 8-2.

[0116] Combine Figure 16-17As shown, the ejector adjustment seat assembly 8-1 includes an ejector base 8-11, an ejector adjustment plate 1 8-12 slidably connected to the top of the ejector base 8-11, an ejector adjustment plate 2 8-13 slidably connected to the top of the ejector adjustment plate 1 8-12, and an ejector intermediate plate 8-14 connected to the top of the ejector adjustment plate 2 8-13. The ejector adjustment plate 1 8-12 is connected to the ejector intermediate plate 8-14 via a waist hole connecting piece 8-15. The ejector adjustment plate 1 8-12 is connected to the ejector base 8-11 by an adjusting screw, and the ejector adjustment plate 2 8-13 is connected to the ejector base 8-11 by an adjusting screw. By rotating the adjusting screw, the horizontal position of the ejector mechanism 8 can be fine-tuned.

[0117] Combine Figure 16-17 As shown, the ejector assembly 8-2 includes an ejector mounting frame 8-21 mounted on an ejector intermediate plate 8-14, an ejector bearing seat 8-23 connected to the top of the ejector mounting frame 8-21, an ejector cap adjustment seat 8-24 connected to the top of the ejector bearing seat 8-23, an ejector cap 8-25 connected to the top of the ejector cap adjustment seat 8-24, a U-shaped voice coil motor 8-26 mounted within the ejector mounting frame 8-21, an ejector shaft assembly 8-27 mounted on the top of the U-shaped voice coil motor 8-26, and an ejector located within the ejector cap 8-25 connected to the ejector shaft assembly 8-27. In the ejector mechanism 8, the U-shaped voice coil motor 8-26 provides power, which is transmitted to the ejector via the ejector shaft assembly 8-27, thereby achieving wafer lifting and positioning.

[0118] Combine Figure 1 、 Figure 18 As shown, the glue dipping module 9 includes two glue dipping components 9-1 slidably connected to the second gantry X-axis sliding plate 1-45 on the rear side, a glue storage component 9-2 connected to the glue dipping component 9-1, and a glue dipping vision component 9-3 arranged between the two glue dipping components 9-1. The glue dipping component 9-1 is responsible for the actual glue dipping and dispensing operations; the glue storage component 9-2 is used to store and supply glue; the glue dipping vision component 9-3 is used to identify the glue dipping position on the positioning substrate; these components work together to achieve precise application of glue.

[0119] Combine Figure 18 、 Figure 19 As shown, the glue dipping assembly 9-1 includes a glue dipping lifting mechanism 9-11 slidably connected to the rear side of the gantry X-axis sliding plate 1-45 and a glue dipping mechanism connected to the bottom of the glue dipping lifting mechanism 9-11. The glue dipping lifting mechanism 9-11 is used to drive the glue dipping mechanism to perform lifting motion.

[0120] The structure of the glue dipping and lifting mechanism 9-11 is consistent with that of the die-bonding lifting mechanism of the die-bonding assembly 2-1 and will not be analyzed further.

[0121] like Figure 19As shown, the glue dipping mechanism includes a glue dipping adjustment mechanism connected to the glue dipping lifting mechanism 9-11, the glue dipping adjustment mechanism includes a glue dipping adjustment block 9-12, a glue dipping adjustment plate 9-13 connected to the glue dipping adjustment block 9-12, and the glue dipping mechanism also includes a fourth servo motor 9-14 arranged on the top of the glue dipping adjustment plate 9-13, a glue dispensing sleeve bracket 9-15 connected to the fourth servo motor 9-14, a spring-type glue dipping mechanism 9-16 connected to the bottom of the glue dispensing sleeve bracket 9-15, and a glue dipping head 9-17 connected to the end of the spring-type glue dipping mechanism 9-16. The glue dipping adjustment plate 9-13 connected to the glue dipping adjustment block 9-12 is provided with a pin hole and an adjustable slotted screw hole, which can respectively adjust the horizontality of the glue dipping head 9-17 in the horizontal and vertical directions, so that the glue applied by the glue dipping head 9-17 and the glue dispensing are evenly distributed. The fourth servo motor 9-14 drives the glue dipping head 9-17 to rotate, swing to the glue storage tray 9-28 to dip in glue, and then swing back after dipping in glue, and move downward to dispense glue on the substrate.

[0122] like Figure 20 As shown, the spring-type glue dipping mechanism 9-16 includes a glue dispensing head mounting plate 9-161 connected to the glue dispensing sleeve bracket 9-15, a glue dispensing sleeve mounting plate 9-162 connected to the glue dispensing head mounting plate 9-161, a pressing piece 9-163 connected to the bottom of the glue dispensing head mounting plate 9-161 and the glue dispensing sleeve mounting plate 9-162, a spring pressure block 9-164 connected to the top of the glue dispensing head mounting plate 9-161 and the glue dispensing sleeve mounting plate 9-162, and a compression spring 9-165 mounted on the top of the spring pressure block 9-164. The glue dispensing sleeve mounting plate 9-162 is connected to the glue dipping head 9-17 at the bottom.

[0123] Combine Figure 18 、 Figure 21 As shown, the glue storage assembly 9-2 includes a glue storage motor assembly 9-21 and a glue storage tray assembly connected to the bottom of the glue storage motor assembly 9-21. The glue storage motor assembly provides power and control, while the glue storage tray assembly is responsible for actually storing glue.

[0124] Combine Figure 18 、 Figure 21 As shown, the glue storage motor assembly 9-21 includes a glue dipping mounting plate 9-22 connected to the glue dipping lifting mechanism 9-11, a bearing mounting seat 9-23 connected to the glue dipping mounting plate 9-22, a transmission shaft 9-24 passing through the bearing mounting seat 9-23, a fifth servo motor 9-25 connected to the top of the transmission shaft 9-24 via a coupling, contour plates 9-26 connected to both sides of the top of the bearing mounting seat 9-23, and a second motor mounting plate 9-27 laid on the top of the contour plates 9-26. The fifth servo motor 9-25 is connected to the second motor mounting plate 9-27, and the end of the connecting shaft 9-24 is connected to a glue storage tray 9-28. The fifth servo motor 9-25 drives the glue storage tray 9-28 to rotate.

[0125] like Figure 21 As shown, the glue storage tray assembly includes a glue storage tray 9-28 for storing glue connected to the bottom end of the transmission shaft 9-24, a micrometer 9-29 connected to the top end of the front side of the bearing mounting seat 9-23, a spring guide column 9-210 connected to the bottom end of the front side of the bearing mounting seat 9-23, and a second spring 9-211 passed through the spring guide column 9-210. The bottom of the micrometer 9-29 is connected to the top of the spring guide column 9-210; the glue storage tray assembly also includes an adjustment fixing seat 9-213 passed through the middle of the bottom end of the front side of the bearing mounting seat 9-23, and the bottom of the adjustment fixing seat 9-213. The top of the adjusting fixed seat 9-213 is connected to the top of the spring guide column 9-210, and the bottom of the scraper 9-214 contacts the top of the glue storage tray 9-28; it also includes a glue storage guide seat 9-215 set at the bottom end of the front side of the bearing mounting seat 9-23, and a glue storage pressure block 9-212 connected to the glue storage guide seat 9-215, the adjusting fixed seat 9-213 is enclosed in the glue storage guide seat 9-215 and the glue storage pressure block 9-212, and the adjusting fixed seat 9-213 is in close contact with the glue storage guide seat 9-215 and the glue storage pressure block 9-212.

[0126] The fourth servo motor 9-14 rotates the glue storage tray 9-28, driving the scraper 9-214 to cyclically scrape the glue on the glue storage tray 9-28, ensuring uniform glue distribution within the glue storage tray 9-28. The glue storage guide seat 9-215 and the glue storage pressure block 9-212 guide and prevent the adjustment bracket 9-213 from shaking, maintaining the scraper 9-214 stable. The second spring 9-211 pushes the adjustment bracket 9-213 upward, while the micrometer 9-29 presses down on the adjustment bracket 9-213. Turning the micrometer 9-29 adjusts the height of the scraper 9-214, thereby adjusting the appropriate glue scraping position. The glue storage tray assembly ensures a stable and uniform glue supply. The glue dipping assembly 9-1 drives the glue dipping head 9-17 to move vertically and rotationally, driving the glue dipping head 9-17 to move into the glue storage tray 9-28 for dipping. After dipping, the glue is applied to the substrate, completing the glue dispensing process.

[0127] like Figure 22 As shown, the glue-dipping vision component 9-3 has a similar structure to the die-bonding vision component 2-2 and will not be analyzed here. The glue-dipping vision component 9-3 is used to visually locate the glue-dipping position of the substrate during the glue-dipping process. The glue-dipping vision component 9-3 includes a lifting mechanism and a CCD camera assembly connected to the lifting mechanism. The lifting mechanism drives the CCD camera assembly to move precisely up and down in the Z-axis direction to facilitate focusing and imaging. The CCD camera assembly is the visual perception part of the glue-dipping vision component 9-3, used to capture the substrate and perform visual imaging to determine the glue dispensing position and the final chip bonding position.

[0128] Workflow:

[0129] Phase 1: Chip preparation and picking:

[0130] 1. Detect the chip position on the wafer: The wafer-level camera module identifies the wafer in the wafer loading mechanism and detects the specific position of each chip.

[0131] 2. Picking up chips: The picking module moves to the corresponding chip position according to the detection results of the wafer-level camera module, and picks up the chip from the wafer through vacuum adsorption and other methods.

[0132] 3. Cache Chip: The pickup module places the picked chip onto the cache module. The cache module temporarily secures the chip through vacuum suction or other means for subsequent operation.

[0133] The second stage: chip bonding:

[0134] 4. CCD positioning cache chip position: On the cache module, the solid crystal vision component positions the cache chip to ensure the precise position of the chip.

[0135] 5. The bonding head mechanism picks up the chip: The bonding head lifting mechanism in the bonding module drives the bonding head mechanism to descend, and the bonding head rotating assembly absorbs the chip on the buffer module through rotational motion.

[0136] 6. Adjust the chip angle: After the nozzle of the die-bonding component picks up the chip, the upper vision module checks the angle of the chip and adjusts the chip angle.

[0137] 7. Identify the die bonding position: The die bonding vision component again uses CCD technology to locate the designated die bonding position on the substrate.

[0138] 8. Complete die bonding: The bonding mechanism places the chip precisely at the designated position on the substrate to complete the die bonding operation.

[0139] The dipping module is operated synchronously. While the chip is being bonded, the dipping module is also performing the following operations:

[0140] The following steps are performed simultaneously:

[0141] 1. Rotary dipping: The glue storage motor assembly in the dipping module drives the glue storage tray to rotate, so that the glue is evenly distributed on the glue storage tray.

[0142] 2.CCD identifies the glue dipping position: The glue dipping vision component uses CCD technology to identify the specific position on the substrate where glue needs to be dipped.

[0143] 3. Product Glue Dipping and Dispensing: The glue dipping mechanism descends, and the spring-loaded dipping mechanism contacts the glue reservoir and picks up glue. The dipping mechanism then moves to a designated location on the substrate, where the dipping head precisely deposits glue around the die-bonding position, providing the necessary adhesive for chip fixation.

[0144] The above technical features constitute the best embodiment of the present invention, which has strong adaptability and best implementation effect. Non-essential technical features can be added or removed according to actual needs to meet the needs of different situations.

[0145] Finally, it should be noted that the above content is only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Simple modifications or equivalent substitutions of the technical solution of the present invention by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the present invention.

Claims

1. A high-precision die bonder, comprising a frame, characterized in that: The machine also includes a gantry assembly provided on the top of the frame, the gantry assembly having a work table, side panels provided on both sides of the work table in the Y-axis direction, a gantry Y-axis assembly provided on the top of each side panel, and two gantry X-axis assemblies slidably connected between the two gantry Y-axis assemblies. The gantry Y-axis assembly is used to move the gantry X-axis assembly in the Y-axis direction. The crystal bonder also includes a crystal bond module slidably connected to the first gantry X-axis assembly and a glue dipping module slidably connected to the second gantry X-axis assembly. The crystal bond module is used to move in three-dimensional space to pick up the chip and place it in a designated crystal bond position; the glue dipping module is used to move in three-dimensional space to apply glue to the designated crystal bond position of the substrate placed on the work table. After the crystal bond module places the chip in the crystal bond position, the chip is fixed to the substrate. The die bonding module includes a die bonding assembly, which is used to absorb, move, and place chips. The die bonding assembly includes a die bonding lift mechanism slidably connected to the first gantry X-axis assembly, and a bonding head mechanism installed on the die bonding lift mechanism. The die bonding lift mechanism is used to drive the bonding head mechanism to move up and down in the Z-axis direction. The bonding head mechanism is used to absorb, move, and place chips. The bonding head mechanism includes a die bonding adjustment mechanism and a bonding head rotating assembly connected to the die bonding adjustment mechanism. The die bonding adjustment mechanism is used to accurately adjust the horizontal position of the bonding head rotating assembly. The bonding head rotating assembly absorbs the chip through rotation and places it in the specified position. The ram rotating assembly includes a DD motor connected to the crystal bonding adjustment mechanism, a ram seat connected below the DD motor, a group of cylinders connected to the top of the ram seat, an air blowing block arranged between the cylinders, a voice coil motor arranged below the air blowing block, a ram nozzle rod arranged at the bottom of the air blowing block, a nozzle connected to the bottom of the ram nozzle rod, and a first spring passed through the ram nozzle rod; the top of the air blowing block is connected to the top of the ram seat, the top of the voice coil motor is connected to the top of the ram seat; the ram nozzle rod is slidably connected to the ram seat, and a spring is passed through the ram nozzle rod.

2. The high-precision die bonder according to claim 1, characterized in that: The die-bonding module includes a die-bonding vision component connected to the die-bonding assembly, which is used to locate the chip position using CCD technology; the die-bonding vision component includes a die-bonding vision lifting mechanism and a first CCD camera component connected to the die-bonding vision lifting mechanism, which is responsible for driving the first CCD camera component to move up and down to capture the chip.

3. The high-precision die bonding machine according to claim 2, characterized in that: The crystal bonding lifting mechanism of the crystal bonding assembly includes a first motor base plate, a U-shaped linear motor arranged on the first motor base plate, a single mover follower block arranged on the mover of the U-shaped linear motor, a lifting follower block arranged on the single mover follower block, a sliding mechanism connected to the inner side of the lifting follower block, and a binding head mechanism connected to the lifting follower block; under the drive of the U-shaped linear motor, the single mover follower block slides with the lifting follower block, thereby driving the binding head mechanism to perform lifting and lowering movements.

4. The high-precision die bonder according to claim 1, characterized in that: The glue dipping module includes a glue dipping component, a glue storage component connected to the glue dipping component, and a glue dipping vision component connected to the glue dipping component. The glue dipping component includes a glue dipping lifting mechanism slidably connected to the second gantry X-axis component, a glue dipping mechanism connected to the bottom of the glue dipping lifting mechanism, the glue dipping mechanism includes a glue dipping adjustment mechanism connected to the glue dipping lifting mechanism, a spring-type glue dipping mechanism connected to the glue dipping adjustment mechanism, and a glue dipping head connected to the end of the spring-type glue dipping mechanism; the glue storage component includes a glue storage motor component, a glue storage tray component connected to the bottom of the glue storage motor component, and the glue storage motor component is used to drive the glue storage tray component to rotate; the glue dipping vision component is used to use CCD technology to identify the specific position of the glue dipping on the substrate. The glue dipping component drives the glue dipping head to move vertically and rotationally, and drives the glue dipping head to move to the glue storage tray of the glue storage tray component to rotate and dip the glue. After the glue dipping is completed, the glue is applied to the designated solid crystal position of the substrate.

5. The high-precision die bonding machine according to claim 4, characterized in that: The shrapnel-type glue dipping mechanism includes a glue dispensing head mounting plate, a glue dispensing sleeve mounting plate connected to the glue dispensing head mounting plate, a pressing piece connected to the glue dispensing head mounting plate and the bottom of the glue dispensing sleeve mounting plate, a spring pressure block connected to the glue dispensing head mounting plate and the top of the glue dispensing sleeve mounting plate, and a compression spring sleeved on the top of the spring pressure block. The bottom of the glue dispensing sleeve mounting plate is connected to a glue dipping head.

6. The high-precision die bonder according to claim 4, characterized in that: The glue storage motor assembly includes a glue dipping mounting plate connected to the glue dipping lifting mechanism, a bearing mounting seat connected to the glue dipping mounting plate, a transmission shaft passing through the bearing mounting seat, a servo motor connected to the top of the transmission shaft for rotation, and a servo motor connected to the top of the bearing mounting seat; the glue storage tray assembly includes a glue storage tray connected to the bottom end of the transmission shaft, a micrometer connected to the top of the front side of the bearing mounting seat, a spring guide column connected to the bottom end of the front side of the bearing mounting seat, a spring passing through the spring guide column, and the bottom of the micrometer is connected to the top of the spring guide column.

7. The high-precision die bonder according to claim 6, characterized in that: The rubber storage tray assembly also includes an adjustment fixing seat passing through the middle of the bottom end of the front side of the bearing mounting seat, a scraper connected to the bottom of the adjustment fixing seat, the top of the adjustment fixing seat is connected to the top of the spring guide column, and the bottom of the scraper contacts the top of the rubber storage tray; it also includes a rubber storage guide seat set at the bottom end of the front side of the bearing mounting seat, and a rubber storage pressure block connected to the rubber storage guide seat. The adjustment fixing seat is enclosed in the rubber storage guide seat and the rubber storage pressure block, and the adjustment fixing seat is in close contact with the rubber storage guide seat and the rubber storage pressure block.

8. The high-precision die bonder according to claim 1, characterized in that: The crystal bonding machine also includes a wafer loading mechanism, a picking module, a cache module, a wafer-level camera module, and an upper vision module. The wafer loading mechanism is used to supply chips. The picking module is connected to the end face of the workbench close to the wafer loading mechanism by sliding along the X-axis direction. The cache module is arranged on the inner wall of the side plate close to both sides of the picking module. The wafer-level camera module is located above the wafer loading mechanism. The wafer-level camera module is used to identify the position of the chip on the wafer in the wafer loading mechanism. The picking module is used to pick up the chip identified by the wafer-level camera module from the wafer and place the temporary cache chip on the cache module. The cache module waits for the crystal bonding module to pick up the cached chip.

9. The high-precision die bonding machine according to claim 8, characterized in that: The cache module includes a cache lifting mechanism arranged on the inner wall of the side panel, a cache assembly connected to the cache lifting mechanism, the cache assembly includes a cache follower block connected to the cache lifting mechanism, a cache vacuum plate connected to the top of the cache follower block, a mirror suction cup mounting plate connected to the top of the cache vacuum plate, and a mirror suction cup arranged on the mirror suction cup mounting plate. The mirror suction cup mounting plate is provided with a vacuum air duct ventilation inside, and an air pipe joint for connecting to a vacuum source is provided outside the mirror suction cup mounting plate.

10. A method for using a die bonder, characterized in that: The steps include: Step S1: The wafer-level camera module identifies the wafer in the wafer loading mechanism and detects the specific position of each chip; Step S2: The picking module moves to the corresponding chip position according to the detection result of the wafer-level camera module and picks up the chip from the wafer; Step S3: The picking module places the picked chip on the cache module to temporarily fix the chip; Step S4: The die-bonding vision component uses CCD technology to locate the cached chip to ensure the precise position of the chip; Step S5: The die-bonding assembly absorbs the chip on the cache module through rotational motion; Step S6: After the nozzle of the die-bonding assembly picks up the chip, the upper vision module checks the angle of the chip and adjusts the chip angle; Step S7: The die-bonding vision component uses CCD technology again to locate the designated die-bonding position on the substrate; Step S8: The die-bonding assembly places the chip precisely at a designated location on the substrate to complete the die-bonding operation; The following steps are performed simultaneously with steps S4-S8: Step S9: The glue storage motor assembly in the glue dipping module drives the glue storage tray to rotate so that the glue is evenly distributed on the glue storage tray; Step S10: The glue dipping vision component uses CCD technology to identify the specific position on the substrate where glue dipping is required; Step S11: The glue dipping mechanism is driven down by the glue dipping mechanism, and the spring-type glue dipping mechanism contacts the glue storage tray and dips the glue; the glue dipping mechanism then moves to a designated position on the substrate, and the glue is precisely applied around the die bonding position through the glue dipping head.

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