Heat dissipation micro-channel and heat dissipation device

Abstract

The invention discloses a heat dissipation micro-channel and a heat dissipation device. The technical problem that stable operation of a cooled part is affected due to the fact that an existing micro-channel heat dissipation device has a large temperature gradient is solved. The micro-channel heat dissipation device comprises a micro-channel for circulation of a cooling working medium, the heat exchange area of the upstream of the micro-channel is smaller than that of the downstream of the micro-channel, and the micro-channel is arranged between a micro-channel bottom plate and a micro-channel cover plate to form the heat dissipation device. By carrying out material reduction treatment on the upstream of the micro-channel, the heat exchange area from the upstream of the micro-channel to the downstream of the micro-channel is increased in a gradient manner, the heat exchange performance of the downstream of the micro-channel is enhanced, the hot-spot temperature is reduced, the uniformity of the surface temperature of a cooled part is improved, and the deformation and warping risks of the cooled part are reduced; the reliability and the service life of a cooled part are improved; by increasing the upstream sectional area of the micro-channel, the resistance of the cooling working medium flowing along the micro-channel is reduced, the pressure drop and the pumping work required when the cooling working medium flows are reduced, and the energy consumption of the cooled part is further reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of microchannel heat dissipation, and in particular to a heat dissipation microchannel and a heat dissipation device. Background Art

[0002] With the rapid development of miniaturization and integration of electronic devices, the power density of electronic devices is getting higher and higher, and the heating problem of electronic devices is becoming more and more serious. At present, high-performance single chips represented by electronic devices such as GPU / CPU have a chip power consumption of more than 1000W and a heat flux density of more than 200W / cm 2 If effective heat dissipation methods are not adopted to solve the heat dissipation problem of chips, the temperature of electronic equipment will rise, the reliability will be greatly reduced, and even the electronic equipment will be damaged. Therefore, the heat dissipation problem has become one of the bottlenecks in the development of high-power electronic equipment technology.

[0003] Since the microchannel heat sink was proposed by Tuckerman et al. in 1981, it has been receiving great attention from the industry and the scientific community. Domestic and foreign researchers have invested a lot of research on conventional microchannels used as cold plates and chip embedded microchannel heat dissipation technology. In order to further improve the heat transfer performance of microchannels, domestic and foreign researchers have conducted a lot of structural designs on the shape of microchannels, such as needle ribs, sawtooth shapes, concave cavity shapes, and wavy shapes. However, there are still some technical problems, such as: the flow resistance of the microchannel is large, and the real-time temperature of the cooling medium will gradually increase with the flow process in the microchannel, resulting in uneven temperature distribution on the chip and other cooled parts, and then resulting in large temperature gradients at different positions of the chip and other cooled parts, which will not only produce local high-temperature hot spots and affect the stability of the operation of the chip and other cooled parts; the large temperature gradient will also produce thermal stress, resulting in reduced reliability of the chip and other cooled parts, and even deformation of the chip and other cooled parts.

[0004] In the prior art, there are also microchannel radiators that improve the heat dissipation effect through double-layer channels, such as the structure of a microchannel radiator and its preparation method disclosed in the Chinese invention patent with the authorization announcement date of 2024.01.02 and the authorization announcement number of CN 115529801 B, which includes a radiator body, which is composed of two copper sheets, and a water supply layer and a flow channel layer are formed between the two copper sheets. The water supply layer is located below the flow channel layer, and the contact parts between the water supply layer and the non-channel layer of the flow channel layer are staggered. The radiator body adopts an upper and lower layered structure, and the water supply layer is at the end away from the hot surface, and the heat reaching the lower layer is less. Therefore, the fluid in the water supply layer has a small temperature rise, which can be regarded as providing cooling water to the upper flow channel layer at the same time, and the temperature gradient is smooth. In addition, the contact parts between the upper and lower non-channel layers are staggered, which can increase the contact area between water and the copper surface during the liquid flow process, that is, increase the heat dissipation area and improve the heat dissipation efficiency. Although the flow channel layer is cooled by the cooling water of the water supply layer, as the cooling water flows along the water supply layer and the flow channel layer, the temperature of the cooling water flowing downstream of the water supply layer and the cooling water flowing downstream of the flow channel layer will gradually increase, reducing the cooling effect of the cooling water on the downstream of the cooled parts. It is easy to generate high-temperature hot spots in the cooled parts located downstream of the flow channel layer, affecting the stability of the operation of the cooled parts.

[0005] In the prior art, there are also manifold microchannel radiators that improve the heat dissipation effect through multi-stage manifolds, such as the manifold microchannel radiator for multi-hotspot heat dissipation of high-power density devices disclosed in the Chinese invention patent with an application publication date of 2023.08.22 and an application publication number of CN 116631964 A, which includes a direct current micro-groove channel etched on a radiator substrate, the back of the radiator substrate is a heat source contact area, and the surface of the upper cover plate is fixedly connected with a manifold structure, the manifold structure includes a working fluid inlet, a working fluid outlet, a manifold liquid outlet channel, and a manifold liquid inlet channel that is stepped along the inflow direction of the working fluid inlet, and the manifold liquid inlet channel is located directly above the hotspot heat source area. Through the manifold structure, more cooling working fluid is distributed to the direct current micro-groove channel above the hotspot heat source area, and less cooling working fluid is introduced into the direct current micro-groove channel above the background heat source area, so that the maximum temperature of the cooled part is greatly reduced, and the overall temperature distribution is more uniform. The above-mentioned manifold structure is arranged above the direct current microgroove channel, which not only increases the manufacturing difficulty, but also the manifold structure only plays the role of distributing the cooling medium. The temperature of the cooling medium will gradually increase along the flow of the manifold structure, resulting in a decrease in the cooling effect of the hot spot heat source area downstream of the manifold structure. Ultimately, a large temperature gradient is formed in the background heat source area and the hot spot heat source area, affecting the stability of the operation of the cooled parts. Summary of the invention

[0006] In view of the deficiencies in the above-mentioned background technology, the present invention proposes a microchannel heat sink, which solves the technical problem that the existing microchannel heat sink has a large temperature gradient and affects the stable operation of the cooled component.

[0007] The technical solution of this application is: A heat dissipation microchannel comprises a microchannel for cooling medium to flow, wherein the heat exchange area upstream of the microchannel is smaller than the heat exchange area downstream of the microchannel.

[0008] Preferably, one microchannel is formed by two adjacent ribs.

[0009] Preferably, the heat exchange area upstream of the microchannel is made smaller than the heat exchange area downstream of the microchannel by subtractive manufacturing of the upstream of the microchannel.

[0010] Preferably, the shape of the rib plate is composed of a right-angled trapezoid and a rectangle, the right-angled trapezoid corresponds to the upstream of the microchannel, and the rectangle corresponds to the downstream of the microchannel.

[0011] Preferably, the shape of the rib plate is composed of two rectangles of unequal heights, the rectangle with a smaller height corresponds to the upstream of the microchannel, and the rectangle with a larger height corresponds to the downstream of the microchannel.

[0012] Preferably, some of the ribs upstream of the microchannel are provided with notches, and the ribs with notches and the ribs without notches are arranged alternately.

[0013] Preferably, at least two ribs without notches are arranged between every two ribs with notches.

[0014] Preferably, the channel width of the microchannel is 0.01 mm to 5 mm.

[0015] A heat dissipation device comprises a microchannel cover plate and a microchannel bottom plate, wherein the microchannel is arranged between the microchannel bottom plate and the microchannel cover plate, and an inlet and an outlet are arranged on the microchannel bottom plate, wherein the inlet is connected to the upstream of the microchannel, and the outlet is connected to the downstream of the microchannel, and the heat exchange area of ​​the upstream of the microchannel is smaller than the heat exchange area of ​​the downstream of the microchannel.

[0016] A heat dissipation device comprises a microchannel cover plate and a microchannel bottom plate, wherein the microchannel is arranged between the microchannel bottom plate and the microchannel cover plate, and the microchannel cover plate is provided with an inlet and an outlet, wherein the inlet is connected to the upstream of the microchannel, and the outlet is connected to the downstream of the microchannel, and the heat exchange area of ​​the upstream of the microchannel is smaller than the heat exchange area of ​​the downstream of the microchannel.

[0017] The technical solution disclosed in the present invention has the following beneficial effects: 1. The present invention performs subtractive manufacturing on the ribs located upstream of the microchannel, that is, the material of the ribs located upstream of the microchannel is reduced, thereby increasing the flow cross-sectional area upstream of the microchannel, reducing the resistance of the cooling medium when flowing along the microchannel, helping to reduce the pressure drop, thereby reducing the pumping work required when the cooling medium flows, and reducing the energy consumption of the cooled parts such as chips.

[0018] 2. The present invention performs subtractive manufacturing on the ribs located upstream of the microchannel, that is, reduces the material of the ribs located upstream of the microchannel, thereby forming a gradient increase in the heat exchange area between the upstream and downstream of the microchannel, thereby enhancing the heat exchange performance downstream of the microchannel, reducing the hot spot temperature, improving the uniformity of the surface temperature of the chips and other cooled parts, reducing the thermal stress caused by the large temperature gradient, and the risk of deformation and warping of the chips and other cooled parts, thereby improving the reliability and service life of the chips and other cooled parts.

[0019] 3. Compared with the prior art in which a water supply layer and a flow layer are superimposed on the radiator, the multi-layer stacking structure of the heat dissipation channel is avoided, the structural change is small, the manufacturing difficulty is reduced, and the uniformity of the surface temperature of the chips and other cooled parts is improved; compared with the heat dissipation method of using a multi-stage manifold to redistribute the cooling medium in the prior art, the present invention directly improves the structure upstream of the microchannel, the manifold does not directly participate in the heat exchange, and the microchannel directly participates in the heat exchange, thereby improving the heat exchange performance of the heat dissipation device and improving the uniformity of the surface temperature of the chips and other cooled parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0021] Figure 1 is a three-dimensional diagram of the heat dissipation device of the present invention; Figure 2 is a stereoscopic view of a microchannel according to a first embodiment of the present invention; Figure 3 yes Figure 2 A partial enlarged view of middle A; Figure 4 is a stereoscopic view of a microchannel according to a second embodiment of the present invention; Figure 5 yes Figure 4 A partial enlarged view of B in the middle; Figure 6 is a stereoscopic view of a microchannel according to a third embodiment of the present invention; Figure 7 yes Figure 6 A partial enlarged view of C in the middle.

[0022] Description of Figure Numbers: 1 microchannel bottom plate, 2 microchannel cover plate, 3 inlet, 4 microchannel, 5 outlet, 6 ribs, 6-1 rib one, 6-1-1 rib one upstream, 6-1-2 rib one downstream, 6-2 rib two, 6-2-1 rib two upstream, 6-2-2 rib two downstream, 6-3 rib three, 6-3-1 rib three upstream, 6-3-2 rib three downstream, 6-4 rib four. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the core concept of the present invention and the following embodiments, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] Embodiment 1, a heat dissipation microchannel, includes a microchannel 4 for cooling medium to flow, and the heat exchange area upstream of the microchannel 4 is smaller than the heat exchange area downstream of the microchannel 4.

[0025] Specifically, the microchannel 4 can be set on the surface of a cooled part such as a chip or a liquid cooling plate. The microchannel 4 can be set on the chip by etching, and the microchannel 4 can be formed by grooving or 3D printing on the surface of the cooled part or the surface of the liquid cooling plate. The material upstream of the microchannel 4 can be reduced to increase the cross-sectional area upstream of the microchannel 4, or a flow channel branch can be added downstream of the microchannel 4 to increase the heat exchange area downstream of the microchannel 4.

[0026] Furthermore, by reducing the material upstream of the microchannel 4, the contact area between the upstream of the microchannel 4 and the cooling medium is reduced, thereby reducing the heat exchange between the cooling medium and the upstream of the microchannel 4, so that the cooling medium can enter the downstream of the microchannel 4 at a lower temperature; after the upstream of the microchannel 4 is subjected to the material reduction treatment, the flow cross-sectional area of ​​the cooling medium in the upstream of the microchannel 4 is increased, and the resistance of the cooling medium when flowing along the upstream of the microchannel 4 is reduced, which can effectively reduce the pressure drop of the cooling medium when flowing, thereby reducing the pumping work required when the cooling medium flows along the upstream of the microchannel 4, and reducing the overall energy consumption of the cooled parts such as the chip; Furthermore, by adding multiple flow channel branches downstream of the microchannel 4 to increase the contact area between the downstream of the microchannel 4 and the cooling medium, the heat exchange area of ​​the upstream and downstream of the microchannel 4 increases in a gradient, thereby enhancing the cooling effect of the cooling medium on the downstream of the microchannel 4, enhancing the heat exchange performance of the downstream of the microchannel 4, reducing the hot spot temperature, improving the uniformity of the surface temperature of the chip and other cooled parts, reducing the thermal stress caused by the large temperature gradient, and thus reducing the risk of deformation and warping of the chip and other cooled parts, thereby improving the reliability and service life of the chip and other cooled parts. After adding multiple flow channel branches downstream of the microchannel 4, the heat exchange area downstream of the microchannel 4 is increased, the cooling speed downstream of the microchannel 4 is accelerated, and the temperature of the cooling medium gradually increases as the flow time of the cooling medium along the microchannel 4 increases, resulting in the cooling effect of the cooling medium on the downstream of the microchannel 4 gradually weakening, thereby resulting in a large wall temperature gradient of the rib plate 6 upstream and downstream of the microchannel 4, and finally forming a hot spot downstream of the microchannel 4, causing the chip and other cooled parts to operate unstably.

[0027] When the microchannel 4 is etched on the chip, the specific process steps are as follows: (1) Silicon wafer preparation. Clean and dry the silicon wafer with acetone; (2) Spinning photoresist. Spin-coat photoresist on the silicon surface; (3) Exposure. Expose the photoresist to form a mask. Use the photolithography process to form a pattern of the microchannel array on the mask.

[0028] (4) Etching. In order to ensure the steepness of the etching channel and the etching accuracy, a passivation gas is first used to form a protective layer on the mask plate, and then fluorine-based free radical ions are used for etching. After etching to a certain depth, the passivation gas is used to passivate the sides of the groove, and then etching is continued to the required depth; (5) Removing the photoresist and mask. Remove the photoresist and mask, clean the silicon wafer, and obtain the microchannel structure.

[0029] Embodiment 2, based on embodiment 1, a heat dissipation microchannel, such as Figure 2 , Figure 4 , Figure 6As shown, one of the microchannels 4 is composed of two adjacent ribs 6. The sum of the heat exchange areas of all the ribs 6 upstream of the microchannel 4 is less than the sum of the heat exchange areas of all the ribs 6 downstream of the microchannel 4. Specifically, the ribs 6 are arranged between the cover plate and the bottom plate of the liquid cooling plate, and the plurality of microchannels 4 are composed of a plurality of spaced ribs 6. Preferably, the plurality of ribs 6 are arranged at equal intervals, and the rib width of the ribs 6 is between 0.01 mm and 5 mm, the rib length is between 0.01 mm and 20 mm, and the rib height is between 0.01 mm and 5 mm. The width, length and height of the ribs 6 should be set according to the size of the cooled parts such as the chips to be cooled, and the sum of the wall areas of all the ribs 6 located upstream of the microchannel 4 is less than the wall areas of all the ribs 6 located downstream of the microchannel 4. The rib length of the rib plate 6 is the length of the microchannel 4, the rib height of the rib plate 6 is the height of the microchannel 4, and the rib width of the rib plate 6 should be as small as possible while ensuring the strength, so as to form more microchannels 4, allow more cooling medium to enter, and make the heat exchange efficiency of the cooling medium higher, so as to achieve better heat dissipation effect on cooled parts such as chips.

[0030] Embodiment 3, based on embodiment 2, a heat dissipation microchannel, such as Figure 3 , Figure 5 , Figure 7 As shown, the heat exchange area upstream of the microchannel 4 is made smaller than the heat exchange area downstream of the microchannel 4 by subtractive manufacturing upstream of the microchannel 4, and the subtractive manufacturing is to reduce the material on the ribs 6 constituting the microchannel 4, and the subtractive manufacturing method is wire cutting, laser cutting, milling or etching. In this embodiment, wire cutting, laser cutting or milling is used to process ordinary liquid cooling plates, and etching is used to process chip substrates or cooling parts. In other embodiments, subtractive manufacturing can also be done by other methods, such as 3D printing, as long as the heat exchange area upstream of the microchannel 4 can be made smaller than the heat exchange area downstream of the microchannel 4. After removing a portion of material from the upstream of the microchannel 4, the heat exchange area between the upstream of the microchannel 4 and the cooling medium is reduced, thereby reducing the heat exchange between the cooling medium and the upstream of the microchannel 4, and enabling the cooling medium to enter the downstream of the microchannel 4 at a lower temperature; after the upstream of the microchannel 4 is subjected to material reduction treatment, the resistance of the cooling medium when flowing along the upstream of the microchannel 4 is reduced, which can effectively reduce the pressure drop when the cooling medium flows, thereby reducing the pumping work required when the cooling medium flows along the upstream of the microchannel 4, and reducing the overall energy consumption of cooled parts such as chips.

[0031] Embodiment 4, based on embodiment 3, a heat dissipation microchannel, such as Figure 2 and Figure 3As shown, the shape of the rib plate 6 is composed of a right-angled trapezoid and a rectangle, the right-angled trapezoid corresponds to the upstream of the microchannel 4, and the rectangle corresponds to the downstream of the microchannel 4. In this embodiment, the rib plate 6-1 is obtained by cutting off a triangle at the upper left corner of the entire rectangular plate. In other embodiments, the rib plate 6-1 can also be composed of a right-angled trapezoidal plate and a rectangular plate. The right-angled trapezoid corresponds to the upstream rib 6-1-1, and the rectangle corresponds to the downstream rib 6-1-2. The length of the upstream rib 6-1-1 is equal to the length of the downstream rib 6-1-2, and the height of the right-angled trapezoid is equal to the width of the rectangle; the heat exchange area between the upstream rib 6-1-1 and the cooling medium is small, and thus the heat exchange amount between the cooling medium and the upstream rib 6-1-1 is small, so that the cooling medium can enter the downstream rib 6-1-2 at a lower temperature; the heat exchange area between the upstream rib 6-1-1 and the downstream rib 6-1-2 increases gradually, thereby enhancing the cooling effect of the cooling medium on the downstream rib 6-1-2, enhancing the heat exchange performance of the downstream rib 6-1-2, reducing the hot spot temperature, improving the uniformity of the surface temperature of the cooled parts such as the chip, reducing the thermal stress caused by the large temperature gradient, and thus reducing the risk of deformation and warping of the cooled parts such as the chip, thereby improving the reliability and service life of the cooled parts such as the chip. In this embodiment, preferably, the channel width of the microchannel 4 is 0.5 mm, the rib width of the rib plate 6-1 is 0.5 mm, the rib height of the rib plate 6-1 is 1 mm, and the rib length of the rib plate 6-1 is 10 mm, wherein the right-angled trapezoid corresponds to the upstream of the microchannel 4, and the rectangle corresponds to the downstream of the microchannel 4, the upper base of the right-angled trapezoid is 0.5 mm, the lower base of the right-angled trapezoid and the width of the rectangle are both 1 mm, the height of the right-angled trapezoid is 5 mm, and the length of the rectangle is 5 mm.

[0032] Embodiment 5, based on embodiment 3, a heat dissipation microchannel, such as Figure 4 and Figure 5As shown, the shape of the rib plate 6 is composed of two rectangles of unequal heights, the rectangle with a smaller height corresponds to the upstream of the microchannel 4, and the rectangle with a larger height corresponds to the downstream of the microchannel 4. In this embodiment, the rib plate 2 6-2 is obtained by cutting off a smaller rectangle at the upper left corner of the entire rectangular plate. In other embodiments, the rib plate 2 6-2 may also be composed of two rectangular plates of unequal heights. The rectangle with a smaller height corresponds to the upstream of the rib plate 2 6-2-1, and the rectangle with a larger height corresponds to the downstream of the rib plate 2 6-2-2. The upstream of the rib plate 2 6-2-1 constitutes the upstream of the microchannel 4, and the downstream of the rib plate 2 6-2-2 constitutes the downstream of the microchannel 4. Preferably, the two rectangles have the same length, and the rectangular area of ​​the upstream rib 6-2-1 of the second upstream rib is smaller, so the heat exchange area between the upstream rib 6-2-1 of the second upstream rib and the cooling medium is smaller, and thus the heat exchange amount between the cooling medium and the upstream rib 6-2-1 of the second upstream rib is smaller, which can enable the cooling medium to enter the downstream rib 6-2-2 at a lower temperature; the heat exchange area between the upstream rib 6-2-1 of the second upstream rib and the downstream rib 6-2-2 of the second downstream rib increases gradually, thereby enhancing the cooling effect of the cooling medium on the downstream rib 6-2-2 of the second downstream rib, enhancing the heat exchange performance of the downstream rib 6-2-2 of the second downstream rib, reducing the hot spot temperature, improving the uniformity of the surface temperature of the chip and other cooled parts, reducing the thermal stress caused by the large temperature gradient, and thus the risk of deformation and warping of the chip and other cooled parts, thereby improving the reliability and service life of the chip and other cooled parts. In this embodiment, preferably, the channel width of the microchannel 4 is 0.5mm, the rib width of the rib plate 2 6-2 is 0.5mm, the rib height of the rib plate 2 6-2 is 1mm, and the rib length of the rib plate 2 6-2 is 10mm, wherein the length of the upstream rib plate 2 6-2-1 is 5mm, the width of the upstream rib plate 2 6-2-1 is 0.8mm, the length of the downstream rib plate 2 6-2-2 is 5mm, and the width of the downstream rib plate 2 6-2-2 is 1mm.

[0033] Embodiment 6, based on any one of Embodiments 2-5, a heat dissipation microchannel, wherein some ribs 6 upstream of the microchannel 4 are provided with notches, and the ribs 6 with notches and the ribs 6 without notches are arranged alternately. In this embodiment, the notch located upstream of the microchannel 4 can be rectangular, circular, elliptical or any other shape.

[0034] When the rib 6 is a rib 6-1 composed of a right-angled trapezoidal plate and a rectangular plate, a notch is cut out on the right-angled trapezoidal plate of the rib 6-1 for every at least one rib 6-1, so that the heat exchange area of ​​the rib 6-1 located upstream of the microchannel 4 is further reduced, and a wider flow cross section is formed between two ribs 6-1 without notches, so as to further reduce the flow resistance of the cooling medium, further reduce the pressure drop when the cooling medium flows, and thus reduce the pumping work required when the cooling medium flows along the upstream of the microchannel 4, thereby reducing the overall energy consumption of the cooled parts such as chips.

[0035] When the rib plate 6 is a rib plate 2 6-2 composed of two rectangular plates of unequal heights, a notch is cut out on the rectangular plate with a smaller height to further reduce the heat exchange area of ​​the rib plate 2 6-2 located upstream of the microchannel 4, and a wider flow cross section is formed between the two rib plates 2 6-2 without notches, thereby further reducing the flow resistance of the cooling medium, further reducing the pressure drop when the cooling medium flows, and thereby reducing the pumping work required when the cooling medium flows along the upstream of the microchannel 4, thereby reducing the overall energy consumption of the cooled parts such as chips.

[0036] The heat exchange wall area downstream of microchannel 4 remains unchanged, while the heat exchange wall area upstream of microchannel 4 is reduced, which helps to flow the cooling medium to the downstream of microchannel 4 at a lower temperature, enhances the heat exchange performance downstream of microchannel 4, reduces the temperature of the cooled part corresponding to the downstream of microchannel 4, reduces the hot spot temperature, improves the uniformity of the surface temperature of the cooled parts such as chips, reduces the thermal stress caused by the large temperature gradient, and the risk of deformation and warping of the cooled parts such as chips, thereby improving the reliability and service life of the cooled parts such as chips.

[0037] In this embodiment, if Figure 6 and Figure 7 As shown, the rib 6 can also be set in two shapes, the upstream rib 6 with a notch is recorded as rib three 6-3, the upstream rib 6 without a notch and in a rectangular shape is recorded as rib four 6-4, and the rib three 6-3 and the rib four 6-4 are alternately arranged. Specifically, the length of the rib four 6-4 is equal to the length of the microchannel 4, the height of the rib four 6-4 is equal to the height of the microchannel 4, and the shape of the rib three 6-3 is formed after the upstream of the rib four 6-4 is cut out in any shape, the upstream of the rib three 6-3 corresponds to the upstream of the microchannel 4, and the downstream of the rib three 6-3 corresponds to the downstream of the microchannel 4. Further, one or more rib four 6-4 can be set between every two rib three 6-3, preferably, the shape of the notch is a rectangle, and the number of rib four 6-4 is any number from one to five. Specifically, the number of rib four 6-4 should be set according to the width, height and length of the rib 6, and the larger the width, height and length of the rib 6, the smaller the number of rib four 6-4. For example, the shape of the notch is rectangular, and the number of the ribs 6-4 is one; or the shape of the notch is semicircular, and the number of the ribs 6-4 is two.

[0038] In short, the cross-sectional area of ​​the cooling medium upstream of the rib three 6-3 increases, and the resistance of the cooling medium when flowing along the upstream of the rib three 6-3 decreases, which can effectively reduce the pressure drop of the cooling medium when flowing, thereby reducing the pumping work required when the cooling medium flows along the upstream of the rib three 6-3, thereby reducing the overall energy consumption of the cooled parts such as chips.

[0039] In addition, the contact area between the upstream of rib three 6-3 and the cooling medium is reduced, so the heat exchange area between the upstream of rib three 6-3 and the cooling medium is smaller, and thus the heat exchange amount between the cooling medium and the upstream of rib three 6-3 is smaller, which can enable the cooling medium to enter the downstream of rib three 6-3-2 at a lower temperature; the heat exchange area between the upstream of rib three 6-3 and the downstream of rib three 6-3-2 increases gradually, thereby enhancing the cooling effect of the cooling medium on the downstream of rib three 6-3-2, enhancing the heat exchange performance of the downstream of rib three 6-3-2, reducing the hot spot temperature, improving the uniformity of the surface temperature of the cooled parts such as chips, reducing the thermal stress caused by the large temperature gradient, and thus the risk of deformation and warping of the cooled parts such as chips, thereby improving the reliability and service life of the cooled parts such as chips.

[0040] Embodiment 7, based on embodiment 6, a heat dissipation microchannel, wherein at least two ribs 6 without notches are arranged between every two ribs 6 with notches. Figure 6 and Figure 7 As shown, the rib 6 includes two shapes, the rib 6 with a notch is marked as rib three 6-3, and the rib 6 without a notch is marked as rib four 6-4, two rib fours 6-4 are arranged between the two rib threes 6-3, a channel one is formed between a rib three 6-3 and a rib four 6-4, and a channel two is formed between two adjacent rib fours 6-4, and a microchannel 4 is composed of the channel two and the two adjacent channel ones. The contact area between the upstream rib plate three 6-3-1 and the cooling medium is small, so the heat exchange area between the upstream rib plate three 6-3-1 and the cooling medium is small, and then the heat exchange between the cooling medium and the upstream rib plate three 6-3-1 is small, which can make the cooling medium enter the downstream rib plate three 6-3-2 at a lower temperature; the heat exchange area between the upstream rib plate three 6-3-1 and the downstream rib plate three 6-3-2 forms a gradient increase, which enhances the cooling effect of the cooling medium on the downstream rib plate three 6-3-2, enhances the heat exchange performance of the downstream rib plate three 6-3-2, reduces the hot spot temperature, improves the uniformity of the surface temperature of the cooled parts such as chips, reduces the thermal stress caused by the large temperature gradient, and then causes the risk of deformation and warping of the cooled parts such as chips, thereby improving the reliability and service life of the cooled parts such as chips.

[0041] Embodiment 8, based on any one of embodiments 1-5 and 7, a heat dissipation microchannel, wherein the channel width of the microchannel 4 is 0.01 mm to 5 mm. Specifically, the channel width of the microchannel 4 ranges from 0.01 mm to 5 mm. Preferably, the ratio of the channel width of the microchannel 4 to the rib width of the rib plate 6 is 1:1 or 1:1.2 or 1:0.8. On the basis of ensuring the smooth flow of the cooling medium, as many microchannels 4 as possible should be set, so that more cooling medium can enter, so that the heat exchange efficiency of the cooling medium is higher, and thus the heat dissipation effect of the chip is better.

[0042] Embodiment 9, a heat dissipation device, such as Figure 1 As shown, it includes a microchannel cover plate 2 and a microchannel bottom plate 1. The microchannel 4 described in Example 1 is arranged between the microchannel bottom plate 1 and the microchannel cover plate 2. The microchannel bottom plate 1 is provided with an inlet 3 and an outlet 5. The inlet 3 is connected to the upstream of the microchannel 4, and the outlet 5 is connected to the downstream of the microchannel 4. The heat exchange area upstream of the microchannel 4 is smaller than the heat exchange area downstream of the microchannel 4.

[0043] Specifically, the microchannel base plate 1 and the microchannel cover plate 2 are sealed and connected by bonding. Preferably, the microchannel cover plate 2 and the microchannel base plate 1 are connected up and down; the rib plate 6 in Example 8 is sealed between the microchannel base plate 1 and the microchannel cover plate 2, and a plurality of rib plates 6 are provided, and a microchannel 4 for the circulation of the cooling medium is formed between every two adjacent rib plates 6. The microchannel 4 of the present invention is arranged on the upper surface of the microchannel base plate 1 or on the lower surface of the microchannel cover plate 2.

[0044] The microchannel heat dissipation device of the present invention can be used as a conventional microchannel cold plate. When the microchannel 4 is arranged on the upper surface of the microchannel bottom plate 1, the chip packaging shell or the cooled part is connected to the lower surface of the microchannel bottom plate 1; when the microchannel 4 is arranged on the lower surface of the microchannel cover plate 2, the chip packaging shell or the cooled part is connected to the upper surface of the microchannel cover plate 2. When the cooled parts such as the chip are in a high-power working state, the temperature of the cooled parts such as the chip will rise rapidly. The cooling medium is used to exchange heat with the cooled parts such as the chip and then quickly dissipate heat from the cooled parts such as the chip. The cooling medium is transported from the upstream of the microchannel 4 to the downstream of the microchannel 4 by a pump to achieve heat exchange between the cooling medium and the cooled parts such as the chip, thereby achieving a heat dissipation effect for the cooled parts such as the chip. Among them, the cooling medium should have a high thermal conductivity. Preferably, the cooling medium is water. The cooling medium can also be other liquids or gases.

[0045] Specifically, the inlet 3 and the outlet 5 are arranged on the microchannel bottom plate 1, the inlet 3 is used to transport the cooling medium into the microchannel 4, the inlet 3 is connected to the upstream of the microchannel 4, the outlet 5 is used to flow out the cooling medium after the heat exchange, and the outlet 5 is connected to the downstream of the microchannel 4. A circulation device is also connected between the inlet 3 and the outlet 5 to allow the cooling medium to circulate in and out of the microchannel 4, so as to facilitate the multiple use of the cooling medium. When the cooling medium flows into the inlet 3, the temperature is relatively low, and when it flows out of the outlet 5 after heat exchange, the temperature is relatively high. After passing through the circulation device, the temperature of the cooling medium is restored to the temperature when it first enters the microchannel 4. In this cycle, the present invention realizes the continuous heat dissipation of the cooled parts such as chips.

[0046] Embodiment 10, a heat dissipation device, such as Figure 1As shown, it includes a microchannel cover plate 2 and a microchannel bottom plate 1. The microchannel 4 described in Example 8 is arranged between the microchannel bottom plate 1 and the microchannel cover plate 2. The microchannel cover plate 2 is provided with an inlet 3 and an outlet 5. The inlet 3 is connected to the upstream of the microchannel 4, and the outlet 5 is connected to the downstream of the microchannel 4. The heat exchange area upstream of the microchannel 4 is smaller than the heat exchange area downstream of the microchannel 4.

[0047] Specifically, the microchannel cover plate 2 and the microchannel bottom plate 1 are connected up and down, the rib plate 6 in Example 8 is sealed between the microchannel bottom plate 1 and the microchannel cover plate 2, a plurality of rib plates 6 are provided, and a microchannel 4 for the circulation of the cooling medium is formed between every two adjacent rib plates 6. The microchannel 4 of the present invention is arranged on the upper surface of the microchannel bottom plate 1 or on the lower surface of the microchannel cover plate 2.

[0048] The microchannel heat dissipation device of the present invention can be used as a conventional microchannel cold plate. When the microchannel 4 is arranged on the upper surface of the microchannel bottom plate 1, the chip packaging shell or the cooled part is connected to the lower surface of the microchannel bottom plate 1; when the microchannel 4 is arranged on the lower surface of the microchannel cover plate 2, the chip packaging shell or the cooled part is connected to the upper surface of the microchannel cover plate 2. When the cooled parts such as the chip are in a high-power working state, the temperature of the cooled parts such as the chip will rise rapidly. The cooling medium is used to exchange heat with the cooled parts such as the chip and then quickly dissipate heat from the cooled parts such as the chip. The cooling medium is transported from the upstream of the microchannel 4 to the downstream of the microchannel 4 by a pump to achieve heat exchange between the cooling medium and the cooled parts such as the chip, thereby achieving a heat dissipation effect for the cooled parts such as the chip. Among them, the cooling medium should have a high thermal conductivity. Preferably, the cooling medium is water. The cooling medium can also be other liquids or gases.

[0049] Specifically, the inlet 3 and the outlet 5 are arranged on the microchannel cover plate 2, the inlet 3 is used to transport the cooling medium into the microchannel 4, the inlet 3 is connected to the upstream of the microchannel 4, the outlet 5 is used to flow out the cooling medium after the heat exchange, and the outlet 5 is connected to the downstream of the microchannel 4. A circulation device is also connected between the inlet 3 and the outlet 5 to allow the cooling medium to circulate in and out of the microchannel 4, so as to facilitate the multiple use of the cooling medium. When the cooling medium flows into the inlet 3, the temperature is relatively low, and when it flows out of the outlet 5 after heat exchange, the temperature is relatively high. After passing through the circulation device, the temperature of the cooling medium is restored to the temperature when it first enters the microchannel 4. In this cycle, the present invention realizes the continuous heat dissipation of the cooled parts such as chips.

[0050] It should be noted that the processing technology of the microchannel adopts the general processing technology in the prior art.

[0051] The details not described in detail in the present invention are all conventional technical means known to those skilled in the art.

[0052] The above content shows and describes the basic principles, main features and beneficial effects of the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation microchannel, characterized in that: It comprises a microchannel (4) for circulating a cooling medium, wherein the heat exchange area upstream of the microchannel (4) is smaller than the heat exchange area downstream of the microchannel (4).

2. The heat dissipation microchannel according to claim 1, characterized in that: One of the microchannels (4) is formed by two adjacent ribs (6).

3. The heat dissipation microchannel according to claim 2, characterized in that: By performing subtractive manufacturing on the upstream of the microchannel (4), the heat exchange area upstream of the microchannel (4) is made smaller than the heat exchange area downstream of the microchannel (4).

4. The heat dissipation microchannel according to claim 3, characterized in that: The shape of the rib plate (6) is composed of a right-angled trapezoid and a rectangle, the right-angled trapezoid corresponds to the upstream of the microchannel (4), and the rectangle corresponds to the downstream of the microchannel (4).

5. The heat dissipation microchannel according to claim 3, characterized in that: The shape of the rib plate (6) is composed of two rectangles of unequal heights, wherein the rectangle with a smaller height corresponds to the upstream of the microchannel (4), and the rectangle with a larger height corresponds to the downstream of the microchannel (4).

6. The heat dissipation microchannel according to any one of claims 2 to 5, characterized in that: Some of the ribs (6) upstream of the microchannel (4) are provided with notches, and the ribs (6) with notches and the ribs (6) without notches are arranged alternately.

7. The heat dissipation microchannel according to claim 6, characterized in that: At least two ribs (6) without notches are arranged between every two ribs (6) with notches.

8. The heat dissipation microchannel according to any one of claims 1 to 5 and 7, characterized in that: The channel width of the microchannel (4) is 0.01 mm to 5 mm.

9. A heat dissipation device, characterized in that: The invention comprises a microchannel cover plate (2) and a microchannel bottom plate (1), wherein the microchannel (4) described in claim 1 is arranged between the microchannel bottom plate (1) and the microchannel cover plate (2), and an inlet (3) and an outlet (5) are arranged on the microchannel bottom plate (1), wherein the inlet (3) is connected to the upstream of the microchannel (4), and the outlet (5) is connected to the downstream of the microchannel (4), and the heat exchange area of ​​the upstream of the microchannel (4) is smaller than the heat exchange area of ​​the downstream of the microchannel (4).

10. A heat dissipation device, characterized in that: The invention comprises a microchannel cover plate (2) and a microchannel bottom plate (1), wherein the microchannel (4) described in claim 8 is arranged between the microchannel bottom plate (1) and the microchannel cover plate (2), and an inlet (3) and an outlet (5) are arranged on the microchannel cover plate (2), wherein the inlet (3) is connected to the upstream of the microchannel (4), and the outlet (5) is connected to the downstream of the microchannel (4), and the heat exchange area of ​​the upstream of the microchannel (4) is smaller than the heat exchange area of ​​the downstream of the microchannel (4).

Images