Thermal optimization of OSFP optical transceiver module

Abstract

This application relates to thermal optimization of OSFP optical transceiver modules. Heat dissipation and electrical shielding techniques and devices are disclosed to enable OSFP modules to operate at higher bandwidths. OSFP-compatible techniques are discussed, including the use of water cooling, the addition of heat pipes, the use of intercoolers, air fins and air vanes, optimization of cooling fins, and the use of vapor chambers.

Description

[0001] Case Analysis

[0002] This application is a divisional application of Chinese invention patent application 202110393883.7, filed on April 13, 2021. Technical Field

[0003] This disclosure relates to thermal optimization of OSFP optical transceiver modules.

[0004] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 047,410, filed July 2, 2020, the disclosure of which is incorporated herein by reference. Background Technology

[0005] An eight-channel small form factor pluggable (OSFP) is a module and interconnect system with a pluggable form factor featuring eight high-speed electrical channels. OSFPs were originally designed to support 400 Gbps (8 channels x 50G per channel) optical data links. Compared to other form factors such as QSFPs, OSFPs are slightly wider and deeper, but each 1U front panel still supports 36 ports, allowing a theoretical 400Gbps bit rate via OSFP modules. OSFPs offer several advantages, including their reverse compatibility with QSFP formats through simple adapters. OSFPs are becoming increasingly prevalent in supporting optical technologies for data centers and other data delivery applications.

[0006] Current OSFP modules consume approximately 10-15 watts to achieve a 400G bit rate. However, as the throughput requirements of OSFP modules increase, so do the wattage requirements. This, in turn, increases the thermal load and electromagnetic interference of the OSFP. Under the current standard OSFP form factor, these thermal and electrical effects can lead to problems operating OSFP modules at higher bit rates or throughputs.

[0007] Furthermore, because the OSFP module specification defines specific mechanical form factors and electrical parameters for standard compliance, the aforementioned problems cannot be solved by changing the module's mechanical form factor. A solution is needed that allows OSFP modules to operate at higher bit rates while maintaining compliance with the OSFP module specification. Summary of the Invention

[0008] This disclosure provides methods, systems, and apparatus for thermal and electrical optimization of OSFP optical transceiver modules.

[0009] One aspect of this disclosure provides an assembly including an eight-channel small form factor pluggable (OSFP) module, the module comprising: a data connector; a first heat sink having a top surface and a opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering and thermally connected to the top surface of the first heat sink; and a plurality of fins extending away from the surface of the second heat sink.

[0010] An additional aspect of this disclosure provides an assembly comprising an eight-channel small form factor pluggable (OSFP) module, the module including: a data connector; a first heat sink having a top surface and an opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering and thermally connected to the top surface of the first heat sink; and a plurality of fins extending away from the surface of the second heat sink. A first space may exist between at least two adjacent fins in a first pair, different from a second pair of adjacent fins, to optimize the thermal performance characteristics of the module. The second heat sink may contact the top surface. A housing may be configured to receive the OSFP module therein and is located between the second heat sink and the surface. The housing may include an opening through which the OSFP module and the second heat sink are thermally interconnected. At least a portion of the module may be made of a diamond composite material. In some examples, the diamond composite material may be silver diamond. The diamond composite material may be aluminum diamond. At least a portion of the module may be made of a metallic composite material.

[0011] An additional aspect of this disclosure provides a system comprising: an outer housing having an opening; and an assembly disposed within the housing, wherein a second plurality of fins are configured to receive airflow from the opening. The assembly may include an eight-channel small form factor pluggable (OSFP) module, the module including: a data connector; a first heat sink having a top surface and an opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering and thermally connected to the top surface of the first heat sink; and a second plurality of fins extending away from the surface of the second heat sink.

[0012] An additional aspect of this disclosure provides a system comprising: an eight-channel Octal Small Formfactor Pluggable (OSFP) compatible module; an air duct having a first end and a second end, the first end of the air duct forming a closed connection with the rear side of the module; a blower having a first end and an exhaust port, the first end of the blower forming a closed connection with the second end of the air duct; and an air path formed from the front side of the module through at least the air duct to the exhaust port of the blower. The module may include a front side and a rear side opposite to the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; and a data connector formed on the front side. The air duct may be formed of a metallic composite material. The relative dimensions of the air duct may be based on the air pressure or air velocity at the rear side of the module. The geometry of the air duct may be arranged to prevent the formation of eddies within the system. The frequency of the blower may be based on the geometry of the module. The frequency of the blower may be based on the air pressure or air velocity at the rear side of the module. The air path may be optimized for module heat dissipation.

[0013] An additional aspect of this disclosure provides an assembly comprising an eight-channel Small Form Factor Pluggable (OSFP) compatible module including a front side and a rear side opposite to the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; a data connector disposed on the front side; and a plurality of stud-shaped fins formed in an array on the top surface, each stud-shaped fin being substantially non-linear in shape and closing an area formed by closed loops on the top surface, wherein the plurality of stud-shaped fins minimize the pressure gradient between the front and rear sides of the module. Each stud-shaped fin may be formed as a rhombus. The front side may include a substantially open air channel above the data connector. The plurality of stud-shaped fins may form rows offset from each other. The plurality of stud-shaped fins may cover at least 30% of the surface area of ​​the top surface. Each stud-shaped fin may form an air vane, the air vane providing a path for fluid movement on the top surface. The air vane may be configured to align with a spring-loaded chamfer formed in a housing for the module. The plurality of stud-shaped fins may be configured to attenuate electromagnetic interference. The plurality of spiked fins can be configured to attenuate radiation emitted from the front side of the module. Attached Figure Description

[0014] The accompanying drawings are not to scale. The same reference numerals and names in different drawings refer to the same elements. For clarity, not every component is labeled in every drawing. In the drawings:

[0015] Figure 1A This is an exploded perspective view of an example OSFP module based on aspects of this disclosure.

[0016] Figure 1B-1Cyes Figure 1A Different perspectives of the assembled OSFP module;

[0017] Figure 1D A front view of an example OSFP module with a finned heatsink is shown.

[0018] Figure 2A This is a top-down view of an OSFP module with example cooling holes and channels according to aspects of this disclosure.

[0019] Figure 2B-2D This is a top-down view of an example cooling stud fin arrangement in the OSFP according to aspects of this disclosure.

[0020] Figure 3A A cross-sectional view of an example OSFP module, housing, spiked fins, and air vanes according to aspects of this disclosure is shown.

[0021] Figure 3B A perspective view of an example OSFP module housing with air fins according to aspects of this disclosure is shown.

[0022] Figure 3C A cross-sectional side view of an example OSFP cooling system with optimized airflow according to aspects of this disclosure is shown.

[0023] Figures 4A-4C This is a side view of an example OSFP module according to aspects of this disclosure, which has heat flow optimized by the configuration of the heat sink and the position of the ASIC relative to the laser.

[0024] Figures 5A-5D This is a view of an example OSFP module according to aspects of this disclosure, which has improved heat dissipation by using a closed-loop water cooling technology.

[0025] Figures 6A-6C This is a side view of an example OSFP module based on aspects of this disclosure, which improves heat dissipation by using a thermal path with flat heat pipes.

[0026] Figure 7 This is an example OSFP module according to aspects of this disclosure and a side view showing improved heat dissipation through the use of bent heat pipes.

[0027] Figures 8A-8E These are examples of OSFP modules based on aspects of this disclosure and various views of improvements in heat dissipation achieved through the use of an external bottom heatsink.

[0028] Figure 9 These are graphs showing various power and thermal aspects of example OSFP modules under different configurations.

[0029] Figure 10A A side view of an example OSFP module 1000 is shown, which has a reference Figure 1A-8E One or more aspects of the discussion.

[0030] Figure 10B An example air path is shown in a side view of an example OSFP module. Specific Implementation

[0031] This disclosure generally relates to methods, systems, and apparatus for thermal and electrical optimization in eight-channel small form factor pluggable (OSFP) optical transceiver modules.

[0032] Figure 1A An exploded view of an OSFP module and improvements according to aspects of this disclosure is shown. 110 shows a block or group of OSFP modules, such as modules 111-114. The blocks of OSFP modules are configured to be compatible with cages such as cage 120. Cage 120 is a 1×4 cage, meaning it can accommodate four OSFP modules arranged in a row. Cage 120 has four openings, and each opening can be configured to accommodate a single OSFP module. Other configurations of the cage are also possible. In some examples, a 1×1 cage can accommodate a single OSFP module, while in other examples, any other M×N modules are possible. The OSFP module may include other components, such as optics, optical receivers, optical transceivers, lasers, and processors, to enable data transmission. Modules 111-114 and cage 120 may be part of or mounted within a larger enclosure. For example, the larger enclosure may have electronics, fans, cooling, or other systems to enable the OSFP module to operate. The retainer 120 may have a top surface 121, a bottom surface 122, vertical walls separating the OSFP modules, such as a separator 123, and a rear side or rear portion of the separator, and a rear edge 124.

[0033] Module 114 is, for example, an OSFP-compliant transceiver module that meets the OSFP form factor and / or parameters of the OSFP specification. Module 114 is also an OSFP transceiver module having a connector 115 on one side and a heatsink 117 on the top of the module. In some examples, the heatsink 117 may be the top surface of module 114. An inlet may be formed above or near connector 115. Module 114 is intended to be mounted in a rack or cage, as referenced below. Figure 1A-1DFurther discussion follows. Connector 115 may form one end of module 114 or be formed toward the end of module 114. Module 114 may have throughput on multiple channels. For example, the throughput of module 114 may be 400 Gbps or 50 Gbps per channel in 8 channels. In other examples, higher throughput of module 114 may exist, and correspondingly higher on the channels.

[0034] Module 114 can also communicate with a computing device. The computing device can be any type of computing device, such as a server, server cluster, virtual machine, laptop, desktop, mobile device, or custom-designed hardware. The computing device may include a processor, volatile memory, non-volatile memory, a user interface, a display, one or more communication interfaces, and instructions.

[0035] Although Figure 1A Not shown in the diagram, but modules 111-114 may contain a processor or application-specific integrated circuit (ASIC). The processor or ASIC of module 111 may be configured to enable signal transmission through the module. Module 111 may be configured in various modes to enable high-speed signals, such as those described in the electrical specifications of IEEE 802.3bs and IEEE 802.3cd, or to enable low-speed signals, such as those using I2C or 13C protocols, which may be used by a host for the configuration and control of module 111. The encoding or specific implementation of the signals may depend on the capabilities of the ASIC or processor within module 111. Similarly, although not shown in the diagram, Figure 1A As shown, module 111 may contain a laser.

[0036] Connector 115 can support various types of communication interfaces. In some examples, connector 115 can be a full-duplex LC connector, a type of fiber optic connector developed by Lucent Technologies. In some examples, connector 115 can be a multi-fiber push-out (MPO) type optical connector. In other examples, connector 115 can be any known or compatible communication interface capable of transmitting data.

[0037] Radiator 130 is also available Figure 1AAs shown in the diagram. The radiator 130 may be made of a base section such as base 131 and various fins such as fins 132-134. The absolute dimensions of the fins and their positions relative to each other are constrained by the size of the cage 120 and OSFP guidelines and limitations. Furthermore, the shape, relative positioning, or position or absolute position of the fins are optimized to achieve better airflow, which in turn allows the OSFP to remain operational, despite generating a greater amount of heat due to the higher wattage requirements associated with increased throughput. The radiator 130 may be mechanically attached to the cage 120 or contacted with modules 111-114 using springs, screws, clips, or other mechanisms to allow easy attachment of the radiator to the cage 120 and to form a secure connection. Although the radiator 130 is shown as a single unit, it may be formed or manufactured in various configurations or components.

[0038] Each module can have multiple openings or inlets that allow air to enter the module's internal volume. For example, Figure 1A The diagram shows inlet 119 of module 114 and inlet 116 of module 111, as well as a surface 117 covering inlet 119. Air entering the inlet can cool the module and exits from the rear of the module, outlet 114-B. Surface 117 can also cool heat generated within the module. Surface 117 can be coupled to the base 131 of a heat sink to create a thermal connection and allow further heat dissipation. In some examples, surface 117 can form part of a heat sink or vapor chamber. Thus, two air paths are formed for cooling the module.

[0039] Figure 1B An assembled OSFP module and an improved view according to aspects of this disclosure are shown. (As...) Figure 1B As shown, the base 131 can be directly adjacent to and in contact with the heat sink 130 to allow heat generated within the module to dissipate and be conducted away from the module. Fins 132-134 can transfer heat from OSFP modules 111-114 and allow cooling.

[0040] The fins may extend longitudinally across the length of the cage 120 between the edge of the adjacent separator 123 and the opposite rear edge 124 of the cage, parallel to or perpendicular to the top surface 121, or longitudinally across or parallel to the bottom surface 122 of the cage 120. Figure 1A In the example shown, fins 132-134 extend along most of the length of the cage. Any number of fins can be arranged across the width of the cage 120. In the example shown, 36 fins extend across the width of the cage, but the number of fins can vary considerably.

[0041] In some examples, the fins can have a length range of up to 120 mm, such as a height of 71.0 mm, 9.9 mm, and a thickness of 0.5 mm. In other examples, the height range can be between 9.9 mm and 24.0 mm, the length range can be between 6.5 mm and 71.0 mm, and the thickness range can be between 0.4 mm and 0.7 mm. The fin spacing can range between 1.3 mm and 4.0 mm. However, in other examples, the fins can have a length less than 6.5 mm or greater than 71.0 mm.

[0042] The relationship between air velocity and air pressure drop is approximately quadratic. The power required to move the air is approximately a cubic function of the air velocity. The relationship between the fins, the fin length, thickness, and contact points with the heatsink 130 are optimized to maximize cooling while ensuring that the pressure drop from the front of the OSFP conformal module is not excessive.

[0043] Figure 1C An assembled OSFP module according to aspects of this disclosure and an improved additional view are shown. Figure 1C The outlets of various modules can be seen, such as outlet 114-B. These outlets allow airflow to move from one end of the module to the other. The airflow through the module also helps cool the module, as well as the heat sink and fins.

[0044] In some examples, refer to Figure 1A-1C One or more components shown may be made partly or entirely of diamond composite materials, such as silver-diamond, aluminum-diamond, or copper-diamond. In some examples, the diamond composite material may consist of a surface layer of pure metal surrounding an inner layer or core made of diamond or a diamond-metal mixture. The surface layer, with its higher conductivity, will allow heat to be transferred more quickly, whereas the core, made of diamond or diamond composite material, does not conduct heat in the same way. Through selective use of materials or engineering, heat can be dissipated from areas of the module more likely to overheat, such as lasers or ASICs. For example, silver diamond has a coefficient of thermal expansion of 6.5 ppm / K and a thermal conductivity of 900 W / (mK). The low coefficient of thermal expansion while maintaining high thermal conductivity allows the module to be cooled more effectively, while maintaining tight tolerances to maximize the dimensions of fins and other cooling components. In some examples, components may be made of any metal matrix composite material. A metal matrix composite material is a material in which at least one of these materials is a metal to allow for higher thermal conductivity while retaining the properties of the other material.

[0045] Figure 1DA side view of module 150 with heat sink 160 and fins 160-171 is shown. The fin spacing shows the varying gaps between fins 160-171, designed to optimize airflow and cooling above components or areas of module 150. For example, the larger gaps between fins 165 and 166, and between fins 166 and 167, allow a larger volume of air to flow closer to the center of module 150. Inlets 151-152 of module 150 allow air to enter the internal volume of module 150. Heat sink 160 can make thermal contact with module 150 via base 160-C. As can be seen from the side view, two air paths exist, allowing for additional cooling while maintaining compliance with OSFP specifications.

[0046] Although Figure 1A-1D Several example arrangements of cooling fins are provided, but it should be understood that further arrangements are possible. For example, the number, spacing, shape, or combination of fins can be modified. Furthermore, although in Figure 1A -D (not shown), the housing can accommodate the retainer 120. The openings in the housing can be optimized in terms of spacing, size, dimensions, or geometry to optimize system physical parameters such as heat dissipation, pressure drop, or average temperature drop. Since there is typically a fixed volume, airflow rate, or mass flow rate through the openings and across the housing, airflow can be separated inside the module 150 and on the heat sink 160. Because the total mass flow rate is typically constant, the division between the outer and inner housings can be determined by the openings in the housing.

[0047] Figure 2A-2D This shows a top-down view of a portion of the module. Figure 2A-2D Module components 210-240 are shown. Due to the length of modules such as module 111, there will be a pressure drop from one end of the module to the other, and airflow may also be confined within the module. Components 210-240 are designed to reduce excessive pressure drop along the length of each component and allow for less confinement of airflow. Module components may have top surfaces, such as surfaces 211, 221, 231, and 241.

[0048] Figure 2AThe diagram shows a component 210 with a surface 211. Holes, such as holes 212 and 213, can be formed on surface 211. Holes 212 and 213 are circular. Multiple ridges, including ridges 215 and 216, are formed on surface 211. These ridges minimize the volume occupied by air as it moves across surface 211 of component 210. Furthermore, the ridges help guide air in one direction or create air "tunnels." Ridges 215 and 216 can extend longitudinally along the length of the module, and the space between two adjacent ridges can form a "channel" that also extends along the length of the module. The ridges can be thermally conductive and act as heat sinks or form part of a heat transfer path away from module 210. This helps minimize the pressure difference between the two ends of the surface. Although not shown, additional holes can be formed along the length of surface 211 to further allow additional inlet air into the internal volume of component 210. These holes can be of any shape or shaped based on the exact shape or size of component 210 to maximize airflow within the component. In some examples, the holes can be 2-5 mm long and spaced 5-10 mm apart. In other examples, holes smaller than 2 mm and larger than 5 mm with arbitrary spacing can be formed. In other examples, the holes can be made in a zigzag pattern. The holes can be formed into various patterns on surface 211.

[0049] Figure 2B The diagram shows component 220. Multiple nail-shaped fins, such as nail-shaped fins 222, extend perpendicularly to the length of surface 221. These nail-shaped fins minimize the air pressure drop from one end of component 310 to the other. Furthermore, the nail-shaped fins 222 can be shaped to further have inlets or air fins, allowing air to enter the internal volume of the component. The height of any one of the nail-shaped fins is fixed by the OSFP form factor, but the width and length of the nail-shaped fins can be optimized for minimum pressure drop in the airflow.

[0050] Spike-shaped fins can take on a variety of geometries. In one example, such as... Figure 2B As shown, the nail-shaped fin has an elongated, rhomboid body with rounded edges. The width 228 of the central portion of the nail-shaped fin 222 can be greater than the width 229 at the outermost and opposite ends of the nail-shaped fin 222. In other examples, the nail-shaped fin has different shapes, such as circular, square, teardrop-shaped, sinusoidal, or any kind or combination of shapes. The top surface 227 of the nail-shaped fin 223 can be planar, but in other examples, the top surface of the nail-shaped fin 222 can be non-planar and have a curved surface. In some examples, the top surface of the nail-shaped fin can be planar, while in other examples, the top surface of the nail-shaped fin can be wavy.

[0051] The spike-shaped fins can be located at any part of surface 221. Figure 2B In one example, the spiked fin 222 is located within the front half of surface 221, adjacent to the front edge 221-F of member 220. Alternatively, the spiked fin may be located within the rear half of surface 221 adjacent to the rear edge of member 220. In another example, the spiked fin 222 may extend along the entire length L or most of the length L of surface 221. Several of these additional examples will be discussed further below.

[0052] The studded fins can be arranged in many patterns. As shown, multiple rows of studs are staggered along length L, such that the second row of studded fins 226 is located between each of the studded fins in the first row 225. This pattern can continue along the length L of surface 221. In other examples, the studded fins can be arranged in a straight line or columns. Similarly, the studded fins can be arranged at any random point along surface 221.

[0053] Figure 2C The diagram shows component 230. Similar to component 220, spike-shaped fins 232 and 233 are present on surface 231 of component 230. This example shows spike-shaped fins extending along most of the length L of surface 231 and substantially covering the entire surface 231. In some examples, the spike-shaped fins may extend away from the surface, such as 2 mm away. In other examples, the spike-shaped fins may extend away from the surface less than 2 mm or more than 2 mm.

[0054] Spike fins can be formed into any geometry. In some examples, spike fins can be formed with a fixed or varying height. Spike fins can take on various shapes, and the geometry of the spikes can differ between spikes or between rows. In other examples, multiple geometries can be used for spike fins to create various pathways for airflow above surface 241. In some examples, the geometry of the spike fins can be selected based on the known throughput or thermal characteristics of the OFSP module. In other examples, the geometry and arrangement of the spike fins can be selected based on the thermal characteristics of modules such as ASICs or lasers contained therein. In some examples, multiple spike fins and blades can be arranged to form a partial array on the surface of the component and arranged to correspond to the location of heat sources within the component to achieve minimal pressure drop. For example, spike fins can cover only the central quarter of the surface in a relatively dense pattern, while other parts of the surface may not contain spike fins or may contain spike fins of relatively low density. In other examples, more complex geometries, such as Fibonacci spirals, can be arranged to optimize heat exchange, cooling, airflow, pressure, or other parameters. In some examples, stud fins can be formed in an array near the ASIC or laser within the module to allow for additional cooling in that area and improve overall thermal characteristics. The stud fins can further provide additional thermal connection to the cage that houses the OSFP module.

[0055] Figure 2D Component 240 is shown. Similar to component 220, nail-shaped fins 242 and 243 are present on surface 241 of component 240. Nail-shaped fins 242 and 243 have different dimensions.

[0056] Although Figure 2A-2D Several example arrangements of the studded fins are provided, but it should be understood that other arrangements are possible. For example, the number, spacing, shape, or combination of the studded fins can be modified. In some examples, the external heat sink can be modified, for example in... Figure 1A-1D The external radiator mentioned in the text is mechanically fitted or otherwise contacts the arrangement of the studded fins, thereby allowing for additional heat dissipation.

[0057] Figure 3A A cross-sectional view of the housing 350 of the OFSP module, assembled within the cage 360, is shown. Airflow is directed into the "entry" page, or along... Figure 3B The arrows 365-368 are shown in the direction. The housing 350 may have a surface 351 and a plurality of stud-like fins thereon, such as stud-like fins 352. The stud-like fins 352 may further include or form air vanes. Air vanes may be created from volumes enclosed by the surfaces of the stud-like fins. The stud-like fins may be shaped such that the inner portion of the stud-like fin is hollow and forms an inner cavity. The inner cavity can provide space for air to enter and fill its volume. The inner cavity can take various shapes and, in one example, may have a funnel shape, which is visible when viewed from above. In other examples, the outer surface of the stud-like fins may include slits or openings in the surface to allow air to flow into the inner volume of the air vane. For example, a portion of the surface 241 enclosed by the stud-like fins 242 may be removed, thereby creating a pathway for air to move on that surface. This can further enhance cooling from within the housing 350 and maximize airflow into the air vanes.

[0058] The cage 360 ​​may be chamfered to include recesses within its surface, such as at chamfers 361 and 362. Chamfers 361 and 362 may be spring-loaded, such that they are flush with the inner surface of the cage 360 ​​unless an external force is applied to them. When an external force is applied, chamfers 361-362 may press against the cage 360 ​​in the same direction of the applied force. The stud fins may be aligned within the recesses of the chamfers. For example, chamfer 362 may be aligned with stud fin 352. Therefore, when the housing 350 or a module such as module 231 is inserted into the cage, mechanical stress and damage can be minimized by aligning the chamfers and stud fins. Furthermore, the stud fins may push against chamfer 362, depress the spring of chamfer 362, and be tightly connected to chamfer 362. In this way, any microcurrents or induced currents within the system can be effectively grounded through the mechanical and electrical contact between stud fin 352 and chamfer 362.

[0059] Radiated emission, or radio frequency energy, can be emitted from the housing in the opposite direction of airflow. Radiation can be generated during module operation, such as by an ASIC or laser within the module. In some examples, the spiked fins can be utilized and optimized based on width and length to minimize pressure drop along the housing length while still attenuating the radiated emission source. In other examples, spiked fins arranged in rows offset from each other are used to attenuate radiation, as each spiked fin reflects or attenuates radiation back. In some examples, radiation can be attenuated to a greater extent by using multiple rows of spiked fins. Those skilled in the art will understand that various combinations and designs are possible for various uses of module 350.

[0060] Figure 3B A partial view of module 360 ​​is shown. Module 360 ​​may be similar to module 111 described above. Figure 3B The connection side of module 360 ​​to receiver 362 is shown. Receiver 362 can be any suitable receiver supported by the aforementioned OSFP specification. The module may also include an inlet above the receiver, which is designed to optimize airflow into module 360, such as inlet 369. The specific shape and design of the inlet may be based on the geometry of module 360 ​​and the operating conditions of the electrical housing contained within module 360. Parallel arrows labeled 366 and 367 indicate the airflow direction into module 360. For clarity, in Figure 3B No additional arrows are shown, but it should be understood that air flows into module 360 ​​at many locations of inlet 369.

[0061] In some examples, the inlet, such as inlet 369, can be replaced by a steam chamber. The steam chamber is a chamber filled with coolant. The coolant, after being heated, changes from a liquid phase to a gaseous phase. Once gaseous, the coolant circulates via convection and moves freely within the chamber. Gas molecules condense on cool surfaces, dissipating their heat load, and are then guided back to the coolant container. This process allows for cooling using a fixed or known amount of coolant. The coolant container can extend along a portion or the entire length of module 360.

[0062] Figure 3C A side view of the OSFP module within the cage 370 is shown. Figure 3C The diagram shows a module 371 with a connector 372, an air duct 373, and a blower 374. Air entering module 371 is indicated by solid line 376. The airflow allocated to blower 374 between connector 372 and air duct 373 is indicated by solid line 377. Air leaving blower 374 is indicated by solid line 378. The air temperature rises as it passes through the OSFP module from the left side of the data connector of the adjacent module within retainer 370 and through the right side of retainer 370. As the air moves out of retainer 370 and from left to right through membrane 373 and through the right side near blower 374, the air temperature may decrease or remain similar. Module 371 can be similar to the modules described above, such as module 111. Air duct 373 can have a first end and a second end and can be closed and fixed in volume. Air duct 373 can be made of any suitable material such as plastic, polymer, or metal. Air duct 373 is a conduit that allows air to exit from one end of module 371. Blower 374 can be attached to one end of air duct 373, while module 371 is attached to the other end. This attachment creates air path 375. Because the module has an independent path, the airflow within the module can be separated from the airflow of the tray or housing on which the module is placed, creating a high-pressure path for the module and separating it from the airflow requirements of the tray or housing.

[0063] Furthermore, the connection between module 371, air duct 373, and blower 374 can be formed by a rigid, flexible, or semi-flexible membrane. The membrane and openings between components can be selected based on the module's geometry, air pressure, and the specific hydrodynamics generated by the system. For example, by selecting the dimensions of the openings or connections between the module, air duct, and blower, eddies or other undesirable phenomena may be generated. Such eddies can disrupt the smooth airflow required above module 371. Additionally, when designing the 375 air path, vibration loads, frequencies, resonant frequencies, temperatures, and other parameters must be considered to ensure that the air path optimally cools the OSFP module. In some examples, air duct 373 may be several centimeters long and form an angle relative to the module. This angle can range, for example, from 5 to 35 degrees, but in other examples, it may be less than 5 degrees or greater than 35 degrees. The relative geometry of the air duct can be based on the module's physical or operational parameters, such as module length, air pressure in any part of the module, airflow through the module, or air temperature leaving the module.

[0064] Blower 374 can be any device capable of generating an air jet. The blower will create negative pressure, further increasing the airflow through module 371. This will, in turn, allow the module to be cooled more effectively. In some examples, blower 374 can operate at a frequency of 100-1000 revolutions per minute and move 5 cubic feet of air per minute. However, in other examples, the frequency can be less than 100 revolutions per minute or greater than 1000 revolutions per minute to move 5 cubic feet of air per minute. In other examples, the revolutions per minute can be modified to move less or more than 5 cubic feet per minute. Blowers can be selected to optimize cooling, airflow, pressure, or temperature drop within the module. Blowers can be selected based on their frequency, vibration characteristics, ability to generate pressure gradients, or other similar parameters.

[0065] In some examples, reference Figures 3A-3C The methods and apparatus described can be used alone or in combination with each other.

[0066] Figure 4A A schematic cross-sectional view of the OSFP module, module 400, is shown. Figure 4A The diagram shows the housing 411, laser 412, printed circuit board 413, and OSFP module; housing 414; thermal path 415; and heat sink 416. Figure 4A In the diagram, a dashed line also indicates the intended path or a path for heat dissipation. ASIC stands for Application-Specific Integrated Circuit. ASIC 411 is mounted at the bottom of the module. In some examples, laser 412 could be a 10-watt laser. Laser 412 typically has an upper operating temperature limit of approximately 70°C. However, ASIC 411 can operate at higher temperatures, and as... Figure 4A As shown, it is located below the laser. Excessive heat generated during normal ASIC operation can interfere with the laser's operation, especially when the ASIC is far from the heatsink 416. Indirect heat paths not only cause heat to tend to move towards the laser 412, but are also ineffective in guiding heat away from the ASIC.

[0067] Figure 4B A cross-sectional view of the OSFP module 450 is shown. Dashed and solid lines also indicate the heat dissipation paths from module 450. Similar to module 400, module 450 includes an ASIC 451, a laser 452, a printed circuit board 453, a housing 454 for the OSFP module, a thermal path 455, and a heat sink 456. By moving the ASIC 451 above the printed circuit board 453 and the laser 452 below the printed circuit board, heat is more easily dissipated from the hotter ASIC. Furthermore, the printed circuit board 453 can act as an insulator and prevent some of the heat generated by the ASIC 451 from reaching the laser 452.

[0068] Figure 4C A schematic cross-sectional view of the OSFP module 460 is shown. Figure 4A The diagram illustrates the housing 464 of the ASIC 461, laser 462, printed circuit board 463, and OSFP module, along with a thermal path 465 and a heatsink 466. An additional finned air cooler, heatsink 470, is also shown. Heatsink 470 is located below OSFP module 400 and contacts the module along a portion of its length. This allows the OSFP module to be mounted within a cage without obstructing insertion of module 400. Heatsink 470 may also include heat pipes, such as heat pipe 471. Heat pipe 471 can be made of any conductive material, such as metal or metal compounds. In some examples, heat pipes may be made of copper, gold composites, silver, or other metallic composites. The material of heat pipe 471 can be selected based on the thermal expansion coefficients of the heat-dissipating material and the heat pipe itself. By adding heatsink 470, the ASIC 461 can be cooled more efficiently than heatsink 466, and more heat can be dissipated via heatsink 466. In some examples, the surface area of ​​the heat sink 470 can be increased by using fractal geometry. In some examples, the heat dissipated by the heat sink 470 can be between 10 and 100 watts. Although the heat sink 470 is oriented in one direction, it should be understood that the heat sink can be oriented in a different direction relative to the module 460. Airflow can also be oriented in a different direction relative to the module 460 and the heat sink 470.

[0069] In some examples, the hot pipes can be replaced with steam chambers containing coolant to provide additional cooling. The coolant can be selected from materials with high thermal conductivity, materials undergoing phase change, or materials with high specific heat.

[0070] Figure 5A A rack 500 capable of accommodating several OSFP modules is shown in a top-down view. The rack 500 has a front and a rear side. The rack 500 is designed to accommodate and cool the OSFP modules when inserted at the front. The rack 500 may accommodate cages, such as cage 120. The rack 500 has multiple heat exchangers corresponding to the OSFP modules. For example, heat exchanger 501 corresponds to four OSFP modules. Heat exchanger 502 corresponds to a single OSFP module. The heat exchangers may contain a suitable liquid coolant that can absorb the heat generated by the OSFP. The liquid coolant will be directed to a network of pipes that directs the heat to the rear of the rack 500. At the rear of the rack 500, the heat carried away from the OSFP modules by the coolant can be removed from the coolant via a liquid-air heat exchanger, such as an intercooler 510. The intercooler 510 may be made of a material with high thermal conductivity and is designed to have a large surface area to remove as much heat as possible from the intercooler. In addition, to help maintain airflow through rack 500, a fan may be included at the rear of rack 500.

[0071] Figure 5B A top-down view of a rack capable of accommodating multiple OSFP modules is shown. Rack 530 may be similar to rack 500. Rack 530 has multiple heat exchangers corresponding to the OSFP modules. For example, heat exchanger 531 corresponds to four OSFP modules. Heat exchanger 532 corresponds to a single OSFP module. The heat exchangers may contain a suitable liquid coolant that can absorb the heat generated by the OSFP. The liquid coolant will be directed to a piping network that extends through the front of the rack and connects to an external coolant distribution unit (CDU), such as CDU 540. CDU 540 can be selected based on the size of the OSFP system or rack and thermal requirements. For example, in a rack less than 1 m², CDU 540 may be selected based on the size of the OSFP system or rack and thermal requirements. 2 A CDU system that provides cooling of 200 kilowatts or more within the space can be selected for certain OSFP applications where a large amount of heat may be generated.

[0072] Figure 5C and 5DA top-down view and a side view of an OSFP module 550 with direct water cooling are shown. Similar to the module described above, module 550 has a front and rear side that can accommodate connectors. The module also has a top surface, surface 551. The module may also include a cold plate, such as cold plate 560. The cold plate can be a container capable of holding liquid. In other examples, cold plate 560 may be a network of pipes extending several times along the length of module 550 or looping within module 550. In some examples, the cold plate may collect around hot spots on module 550. The rear side of module 550 may include an input port 561 for colder water and an output port 562 for warm water returning from cold plate 560. Input port 561 may be in fluid communication with cold plate 560, which in turn may be in fluid communication with output port 562. In general, this forms a closed loop that can be cooled externally before returning to the interior of module 550. The addition of input port 561 and output port 562 still allows for the preservation of the OSFP form factor and ensures compatibility with existing OSFP racks. Input port 561 and output port 562 can be made of thermally conductive materials with a low coefficient of thermal expansion and can be between approximately 1 mm and 5 cm in diameter. Furthermore, depending on cooling requirements, the ports are capable of supporting any suitable flow rate and pressure.

[0073] Figure 6A A schematic cross-sectional view of the OSFP module 600 is shown. Module 600 may be similar to module 400 and its components. Figure 6A The diagram shows the ASIC 611, laser 612, printed circuit board 613, and the OSFP module housing 614, thermal path 615, and heat sink 616. The ASIC is an application-specific integrated circuit. The ASIC 611 is mounted on the bottom of the module. Additionally, the OSFP module 600 may include flat heat pipes, such as heat pipes 618 and 619, integrated towards the bottom of the module 600. These flat heat pipes may be made of a highly conductive material. Maintaining the relatively flatness of the heat pipes helps maintain OSFP module specifications.

[0074] Figure 6B A schematic cross-sectional view of the OSFP module 650 is shown. Module 650 may be similar to module 400 and its components. Figure 6BThe diagram shows the ASIC 611, laser 662, printed circuit board 663, and the housing 664, thermal path 665, and heat sink 669 of the OSFP module. The ASIC is an application-specific integrated circuit. The ASIC 661 is mounted on the bottom of the module. Additionally, the OSFP module 600 may include flat heat pipes, such as heat pipe 668, integrated towards the bottom of the module 600. These flat heat pipes may be made of a highly conductive material. Keeping the heat pipes relatively flat will allow the OSFP module specifications to be maintained while still allowing for improved cooling. Furthermore, fins can be added to the bottom of the module to provide additional cooling. In some examples, the housing 664 may be recessed or otherwise modified to allow space for additional cooling fins to be incorporated without affecting the size of the module 650 or preventing its integration into a rack.

[0075] Figure 6C It is a reference Figure 6B Another side view of the OSFP module 650, which has similar features to those described.

[0076] Figure 7 A schematic cross-sectional view of the OSFP module 700 is shown. Module 700 may be similar to module 400 and its components. Figure 7 The diagram shows an ASIC 711, a laser 712, a printed circuit board 713, and the housing 714, thermal path 715, and fins 716 of the OSFP module. The fins 716 can also be a heat sink. The ASIC is an application-specific integrated circuit. The ASIC 711 is mounted at the bottom of the module. Additionally, the OSFP module 700 may include flat heat pipes, such as heat pipes 718, integrated towards the bottom of the module 700. These flat heat pipes can be made of a highly conductive material. Keeping the heat pipes relatively flat will allow the OSFP module specifications to be maintained. In some examples, the heat pipe 718 can be a vapor chamber.

[0077] Figures 8A-8E Various views of the OSFP module 800 are shown.

[0078] Figure 8AAn exploded view of an OSFP-compatible module 800 is shown. An internal cooling member 810 with a surface 811 and an inlet 812 is shown. A first intermediate member 820 includes a heat dissipation device 821. The heat dissipation device 821 may be a radiator, heat pipe, or heat dissipation apparatus. The heat dissipation device 821 may be a vapor chamber with an evaporator and a condenser. The heat dissipation device 821 may be made of a material with high thermal conductivity, or may be made of a material with a much higher thermal conductivity than other materials of the module 800. For example, the heat dissipation device 821 may be made of metal or a metal compound. The heat dissipation device 821 may be in thermal contact with the cooling member 810. In some examples, the heat dissipation device 821 and the cooling member 810 may be a continuous member. In these examples, additional thermal cooling can be achieved as the number of thermal interfaces decreases. The heat dissipation device 821 may be as thick as a portion of the intermediate member 820 and in thermal contact with a heat source. One side of the heat dissipation device 821 may be in thermal contact with the cooling member 810, while the opposite side of the heat dissipation device 821 may be in contact with a heat source. The second intermediate member 830 may include a front side with a data connector 831. In some examples, the data connector 831 may include a layer of material with low thermal conductivity to prevent heat sources in contact with the heat sink 821 from transferring or conducting heat to the bottom of the module 800. The intermediate member 830 may be configured to house electronics that are heat sources, such as lasers or ASICs. The bottom member 840 may include a heat sink 841. The heat sink 841 may be a heat sink or a thermally conductive surface in thermal contact with a heat source, such as an electronics, ASIC, or laser. In some examples, the heat sink 841 may extend beyond the bottom surface of the module 800 and into a larger system. In some examples, the heat sink 841 may form an external heat sink. In some examples, the heat sink 841 may be a vapor chamber. In some examples, the heat sink 841 may contact an external heat sink or cooling component. The heat sink 821, the heat sink 841, the thin vapor chamber, or the flat heat pipe may be incorporated into the top or bottom of the module 800 to improve heat dissipation. In some examples, the external contact surfaces of heat dissipation devices 821 and 841 may be steam chambers or heat pipes, which may be flush with or slightly below the outer surface of module 800.

[0079] Figure 8B A top-down view of an assembled OSFP-compatible module 800 is shown, which has a surface 811, an inlet 812, a heat sink 821, and a heat sink 841. Figure 8BThe diagram also shows a printed circuit board 832. This printed circuit board can interface with internal and external electronic devices within the module 800. Furthermore, the printed circuit board can be made of a material with low thermal conductivity. In some examples, the laser can be mounted on top of the module 800 and in thermal contact with the heat sink 821, while the ASIC is mounted below the printed circuit board 832 and in thermal contact with the heat sink 841. The laser will be able to dissipate heat through the heat sink 821, while the ASIC will dissipate heat through the heat sink 841. Thus, overall cooling of the module is increased in this way.

[0080] Figure 8C A bottom-up view of an assembled OSFP-compliant module 800 is shown, in which a heat sink 841 and a data connector 831 are visible. In some examples, cutouts may be made in the module 800 to allow the heat sink 841 to contact an external heat sink. In other examples, the heat sink 841 may form part of or be flush with the outer surface of the module 800. In some examples, the heat sink 841 may contact an external cooler. In some examples, the external cooler or heat sink may be a liquid heat exchanger, a Peltier heat pump, or additional heat pipes.

[0081] Figure 8D A module 800 is shown within a retainer 860. The retainer 860 can be mounted onto a printed circuit board 851. The retainer 860 may include several openings, such as openings 861 and 862 for receiving modules such as module 800. The printed circuit board 851 may be mounted within a larger enclosure. The printed circuit board 851 may interface with electronics within one or more modules. As previously discussed, the retainer 860 and the printed circuit board 851 may be configured to allow a heat sink 852 to make thermal contact with the module 800 via a heat dissipation device 841. For example, the printed circuit board and the retainer may have cutouts that mate with external heat sinks. In some examples, the retainer 860 may be spring-loaded to allow for easier compatibility with mechanical fittings of components. In other examples, the retainer 860 may be springless.

[0082] Figure 8E A schematic cross-sectional view of module 800, external heat sink 852, and printed circuit board 851 is shown. (Except for reference...) Figures 8A-8D In addition to the various components discussed, Figure 8E Laser 890 and ASIC 891 are shown.

[0083] Figure 9The diagram illustrates the thermal and electrical aspects of example OSFP transceiver modules at various operating temperatures. The horizontal axis of graph 900, axis 905, indicates the throughput of the OSFP module. The vertical axis of graph 900, axis 910, indicates the thermal performance required for a given throughput. Three data points, 921–923, are plotted, corresponding to throughputs of 400 Gbps, 800 Gbps, and 1.6 Tbps, respectively. For example, an 800 Gbps bit rate is expected to require 19 W of power, while a 1.6 Tbps bit rate will require 25 W of power. Current OSFP form factors cannot support the latter bit rate because OSFP modules generate too much heat for proper operation. At higher temperatures, the internal air pressure drop of the module may be too high, making it impossible to effectively cool the module under both ambient and static conditions.

[0084] Figure 10A A side view of the OSFP module 1000 is shown, which has the above reference. Figure 1A-8E One or more of the configurations discussed. Figure 10 shows a housing 1010 that may have an inlet 1050. Module 1000 has a front side with an inlet 1040, a rear side with an air outlet 1080, and a top surface 1030 formed between the front and rear sides. Module 1000 may have an external heat sink 1020 attached to the top surface 1030. Module 1000 may also have an inner surface 1041, which, as explained previously, in some examples, may include holes to allow air to drain into the interior portion of module 1000. Module 1000 may have a surface 1060. In some examples, surface 1060 may be configured to allow an external bottom heat sink to contact surface 1060. Housing 1010 may have a bottom portion, portion 1070. In some examples, portion 1070 may be cut to create an opening for the bottom heat sink.

[0085] Figure 10B The diagram shows the air path in a side view of an OSFP module, with the reference above. Figure 1A-8EOne or more of the configurations 1081-1085 are discussed. Air path 1085 may enter through inlet 1050 of housing 1010 and flow over OSFP module 1000. Air path 1081 may enter through inlet 1050 of housing 1010 and flow over external heat sink 1020, which is thermally connected to the top surface 1030 of module 1000. Air path 1082 may enter through inlet 1040, travel along the length of OSFP module 1000, and exit through air outlet 1080. As discussed above, air path 1082 may encounter stud-like fins, such as stud-like fin 222. Air path 1083 may pass through holes, such as hole 212, within the inner surface and through the internal portion of module 1000 before exiting through the rear end. Air path 1084 may extend parallel to the bottom portion of module 1000. Air path 1084 may intersect with external heat sinks attached to the bottom of the module to provide additional cooling.

[0086] While this disclosure contains numerous specific implementation details, these should not be construed as limiting the scope of the claims, but rather as descriptions of specific features of particular embodiments. Certain features described in the context of individual embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, although features may be described above as functioning in certain combinations, and even initially claimed in this way, in some cases one or more features from the claimed combination may be removed from that combination, and the claimed combination may be for sub-combinations or variations thereof.

[0087] Similarly, although the operations are described in a specific order in the accompanying drawings, this should not be construed as requiring these operations to be performed in the specific order or sequence shown, or requiring all the operations shown to obtain the desired result. In some cases, multitasking and parallel processing may be advantageous.

[0088] References to "or" can be interpreted as inclusive, so any term described using "or" can refer to a single term, more than one term, or any one of all the terms described. Labels such as "first," "second," "third," etc., do not necessarily indicate order and are generally used only to distinguish similar or analogous items or elements.

[0089] An aspect of the technology may include a component comprising:

[0090] An eight-channel small form factor pluggable (OSFP) module includes a data connector and an inlet port configured to enable airflow between the internal and external portions of the OSFP module.

[0091] The first heat sink has a top surface and a bottom surface facing the OSFP module;

[0092] The first plurality of hollow channels are formed between the OSFP module and the bottom surface;

[0093] A second radiator has a surface that covers the top surface of the first radiator and is thermally connected to the top surface; and / or

[0094] Multiple fins extending away from the surface of the second heat sink; and / or wherein a first space between at least a first pair of two adjacent fins of the multiple fins differs from a second space between a second pair of adjacent fins, thereby optimizing the thermal performance characteristics of the module; and / or

[0095] Wherein, the second radiator contacts the top surface; and / or

[0096] A housing for receiving the OSFP module therein, and located between the second heat sink and the surface; and / or

[0097] The housing includes an opening through which the OSFP module and a second heatsink are thermally interconnected; and / or

[0098] At least a portion of the module comprises a diamond composite material; and / or

[0099] The diamond composite material is aluminum diamond; and / or

[0100] At least a portion of the module is made of a metal composite material; and / or

[0101] Includes external or internal water-cooling components; and / or

[0102] Includes a steam chamber; and / or

[0103] Includes a bottom heatsink.

[0104] The disclosed technology may include any combination of the following features:

[0105] ¶1. A component comprising:

[0106] An eight-channel small form factor pluggable (OSFP) module includes a data connector and an inlet port configured to enable airflow between the interior and exterior of the OSFP module;

[0107] The first heat sink has a top surface and a bottom surface facing the OSFP module;

[0108] The first plurality of hollow channels are formed between the OSFP module and the bottom surface;

[0109] The second radiator has a surface that covers the top surface of the first radiator and is thermally connected to the top surface; and

[0110] Multiple fins extend away from the surface of the second radiator.

[0111] ¶2. According to the assembly of ¶1, wherein the first space between at least a first pair of two adjacent fins in the plurality of fins is different from the second space between a second pair of adjacent fins, thereby optimizing the thermal performance characteristics of the module.

[0112] ¶3. The assembly according to ¶¶ 1–2, wherein the second heat sink contacts the top surface.

[0113] ¶4. According to any of the components in ¶1–3, it further includes a housing for receiving the OSFP module therein, the housing being located between the second heat sink and the surface.

[0114] ¶5. According to the components in ¶¶ 1–4, the housing includes an opening through which the OSFP module and the second heat sink are thermally interconnected.

[0115] ¶6. The components according to ¶¶ 1–4, wherein at least a portion of the module comprises a diamond composite material.

[0116] ¶7. According to the components of ¶¶ 1–6, wherein the diamond composite material is aluminum diamond.

[0117] ¶8. The components according to ¶¶ 1–6, wherein at least a portion of the module is made of a metal composite material.

[0118] ¶9. A system comprising:

[0119] An outer casing with an opening; and

[0120] According to component ¶ 1, it is disposed within the housing, wherein the plurality of fins are configured to receive airflow from the opening.

[0121] ¶10. A system comprising:

[0122] An eight-channel small form factor pluggable (OSFP) module, comprising:

[0123] The front side and the rear side opposite to the front side;

[0124] A substantially continuous top surface extending from a portion of the front side to a portion of the rear side;

[0125] A data connector is formed on the front side;

[0126] An air duct has a first end and a second end, the first end of which forms a closed connection with the rear side of the module;

[0127] A blower having a first end and an exhaust port, the first end of the blower forming a closed connection with the second end of an air duct; and

[0128] An air path is formed from the front of the module through at least an air duct to the exhaust end of the blower.

[0129] ¶11. The system according to ¶10 also includes an air duct formed of a metal composite material.

[0130] ¶12. According to ¶¶ 10–12, the relative dimensions of the air ducts are based on the air pressure or air velocity at the rear of the module.

[0131] ¶13. According to ¶¶ 10–12, the geometry of the air duct is arranged to prevent the formation of vortices within the system.

[0132] ¶14. According to ¶¶ 10–13, the frequency of the blower is based on the geometry of the module.

[0133] ¶15. According to ¶¶ 10–13, the frequency of the blower is based on the air pressure or air velocity at the rear of the module.

[0134] ¶16. The system according to ¶¶ 10–15, wherein the air path is optimized for heat dissipation from the module, and / or the system is connected or thermally coupled to a water source, and / or the module contains a steam chamber.

[0135] 17. An eight-channel small form factor pluggable (OSFP) module, comprising:

[0136] The front side and the rear side opposite to the front side;

[0137] A substantially continuous top surface extending from a portion of the front side to a portion of the rear side;

[0138] The data connector is located on the front side; and

[0139] Multiple nail-shaped fins are formed in an array on the top surface. Each nail-shaped fin is substantially non-linear in shape and closes the area formed by the closed loop on the top surface. The multiple nail-shaped fins minimize the pressure gradient between the front and rear sides of the module.

[0140] ¶18. According to the module of ¶17, each nail-shaped fin is formed as a rhombus.

[0141] ¶19. The module according to ¶¶ 17–18, wherein the front side includes a generally open air channel above the data connector.

[0142] ¶20. According to the module of ¶¶ 17–19, wherein the plurality of nail-shaped fins are arranged in rows, the rows being offset from each other.

[0143] ¶21. According to the module of ¶19, wherein the plurality of spike-shaped fins cover at least 30% of the surface area of ​​the top surface.

[0144] ¶22. According to the module of ¶¶ 17–19, each nail-shaped fin forms an air vane that provides a path for fluid to move on the top surface.

[0145] ¶23. The module according to ¶¶ 17–20, wherein the air vane is configured to align with a spring-loaded chamfer formed in the housing of the module.

[0146] ¶24. According to the module of ¶23, the plurality of nail-shaped fins are configured to attenuate electromagnetic interference.

[0147] ¶25. According to the module of ¶23, the plurality of spiked fins are configured to attenuate radiation emitted from the front side of the module.

[0148] ¶26. The module according to ¶17, wherein the module is connected or thermally coupled to a water source and / or a bottom radiator and / or a steam chamber and / or an inlet and / or an orifice and / or a blower.

[0149] Various modifications to the embodiments described in this disclosure will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments without departing from the spirit or scope of this disclosure. Therefore, the claims are not intended to be limited to the embodiments shown herein, but are accorded the widest scope consistent with the content, principles, and novel features disclosed herein.

Claims

1. A system comprising: An eight-channel small form factor pluggable (OSFP) module, the OSFP module comprising: The front side and the rear side opposite to the front side; A substantially continuous top surface extending from a portion of the front side to a portion of the rear side; A data connector is formed on the front side; An air duct having a first end and a second end, wherein the first end of the air duct forms a closed connection with the rear side of the OSFP module; A blower having a first end and an exhaust end, the first end of the blower forming a closed connection with the second end of the air duct; and An air path is formed from the front side of the OSFP module through at least the air duct to the exhaust end of the blower.

2. The system according to claim 1, wherein, The air duct is made of a metal composite material.

3. The system according to claim 1, wherein, The relative dimensions of the air duct are based on the air pressure or air velocity at the rear side of the OSFP module.

4. The system according to claim 1, wherein, The geometry of the air duct is arranged to prevent the formation of eddies within the system.

5. The system according to claim 4, wherein, The frequency of the blower is based on the geometry of the OSFP module.

6. The system according to claim 1, wherein, The frequency of the blower is based on the air pressure or air velocity at the rear of the OSFP module.

7. The system according to claim 1, wherein, The air path is optimized for heat dissipation from the OSFP module.

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