Heat dissipation shielding cover, circuit board assembly and intelligent terminal

Abstract

The invention provides a heat dissipation shielding cover, a circuit board assembly and an intelligent terminal, the heat dissipation shielding cover comprises a cover body, a metal fiber and a cooling liquid, a sealing cavity is formed in the cover body, the metal fiber is arranged in the sealing cavity, the cooling liquid is adsorbed in the metal fiber, and a containing groove for containing a chip is formed in the bottom of the cover body. The heat dissipation shielding case can realize directional heat dissipation and diversion effects, and is high in heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a heat dissipation shielding cover, a circuit board assembly and a smart terminal. Background Art

[0002] With the development of science and technology, the functions of intelligent electronic devices are becoming more and more powerful. At the same time, the power of the main control chip and the high-frequency chip is gradually increasing, and the heat energy they generate is also increasing sharply. In order to shield the electromagnetic interference to the chip and dissipate the heat of the chip, a metal shielding cover needs to be covered on the chip.

[0003] In the process of conceiving and implementing this application, the inventors found that there are at least the following problems: the existing metal shield has low thermal conductivity and is difficult to meet the heat dissipation requirements of the chip. Moreover, for chips of different thicknesses, the existing metal shield cannot meet the heat dissipation requirements of multiple chips of different thicknesses. For example, for chips with smaller thicknesses, the gap between the upper surface of the chip and the metal shield is larger, resulting in increased heat transfer resistance, which is not conducive to chip heat dissipation.

[0004] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Summary of the invention

[0005] The purpose of the present application is to provide a heat dissipation shielding cover that can achieve a directional heat dissipation and flow diversion effect with high heat dissipation efficiency.

[0006] In order to solve the above technical problems, the present application provides a heat dissipation shielding cover, including a cover body, metal fibers and coolant, a sealed cavity is formed in the cover body, the metal fibers are arranged in the sealed cavity, the coolant is absorbed in the metal fibers, and a accommodating groove for accommodating the chip is formed at the bottom of the cover body.

[0007] Optionally, the sealed cavity comprises an upper cavity wall and a lower cavity wall which are arranged opposite to each other, the lower cavity wall is arranged close to the accommodating groove, the metal fiber is arranged on the lower cavity wall, and a gas-liquid convection space is formed between the metal fiber and the upper cavity wall.

[0008] Optionally, the heat dissipation shield further comprises at least one heat-conducting column, which is disposed in the sealed cavity, one end of which is connected to the upper cavity wall, and the other end of which passes through the metal fiber and is connected to the lower cavity wall.

[0009] Optionally, the cover body includes an upper cover plate, a lower cover plate and a side frame, the lower cover plate and the side frame are connected to the lower surface of the upper cover plate, the side frame is arranged around the circumference of the lower cover plate, the sealing cavity is formed between the upper cover plate and the lower cover plate, and the accommodating groove is formed between the lower cover plate and the side frame.

[0010] Optionally, at least one convex bump protruding toward the receiving groove is formed partially on the lower cover plate, the convex bump is arranged corresponding to the chip, and the convex bump has a heat-conducting surface in contact with the chip.

[0011] Optionally, a plurality of convex humps are formed partially on the lower cover plate, a height of at least one convex hump protruding into the receiving groove is different from that of the other convex humps, and a height of each convex hump matches a thickness of the chip.

[0012] Optionally, the convex bulge forms a groove on the sealing cavity side, and the metal fiber is arranged in the groove and on the lower cavity wall outside the groove.

[0013] Optionally, the thickness of the metal fiber in the groove is equal to the thickness of the metal fiber on the lower cavity wall.

[0014] Optionally, the thickness of the metal fiber in the groove is greater than the thickness of the metal fiber on the lower cavity wall.

[0015] Optionally, the heat dissipation shield further includes a heat conductive medium layer, the heat conductive medium layer is filled in the accommodation groove, and the heat conductive medium layer is provided with an avoidance hole for avoiding the chip.

[0016] Optionally, a hole wall of the avoidance hole contacts a side surface of the chip.

[0017] Optionally, the metal fiber comprises a capillary structure for absorbing the coolant.

[0018] The present application also relates to a circuit board assembly, comprising a circuit board, at least one chip and the above-mentioned heat dissipation shielding cover, wherein the chip is electrically connected to the circuit board, the heat dissipation shielding cover is connected to the circuit board, and the chip is located in the accommodating groove.

[0019] The present application also relates to a smart terminal, comprising the above-mentioned heat dissipation shielding cover.

[0020] The sealed cavity of the heat dissipation shielding cover of the present application is provided with metal fibers, and the coolant is adsorbed in the metal fibers; when the heat of the chip is conducted to the metal fibers, the coolant in the metal fibers is vaporized by the heat, and the vaporized coolant flows toward the sealed cavity, and a directional heat dissipation and flow diversion effect is achieved through the change of the gas-liquid two-phase flow of the coolant, thereby improving the heat dissipation efficiency.

[0021] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specifically cites the preferred embodiments and describes them in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

[0023] Figure 1 A schematic diagram of the hardware structure of a mobile terminal for implementing various embodiments of the present application;

[0024] Figure 2 A communication network system architecture diagram provided for an embodiment of the present application;

[0025] Figure 3 is a schematic cross-sectional structural diagram of a circuit board assembly according to a first embodiment of the present application;

[0026] Figure 4 is a schematic cross-sectional structural diagram of a circuit board assembly according to a second embodiment of the present application;

[0027] Figure 5 is a schematic cross-sectional structural diagram of a circuit board assembly according to a third embodiment of the present application;

[0028] Figure 6 is a schematic cross-sectional structural diagram of a circuit board assembly according to a fourth embodiment of the present application;

[0029] Figure 7 It is a schematic cross-sectional structural diagram of a circuit board assembly according to the fifth embodiment of the present application.

[0030] The realization of the purpose, functional features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. The above-mentioned drawings have shown clear embodiments of this application, which will be described in more detail later. These drawings and textual descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0032] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. Optionally, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context in the specific embodiment.

[0033] It should be understood that, although the terms first, second, third, etc. may be used to describe various information in this article, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this article, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determination". Furthermore, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate that there are the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or", "and / or", "including at least one of the following" etc. used in this application can be interpreted as inclusive, or mean any one or any combination. For example, “comprising at least one of the following: A, B, C” means “any of the following: A; B; C; A and B; A and C; B and C; A and B and C”, and for another example, “A, B or C” or “A, B and / or C” means “any of the following: A; B; C; A and B; A and C; B and C; A and B and C”. An exception to this definition will only occur when a combination of elements, functions, steps or operations are inherently mutually exclusive in some manner.

[0034] It should be understood that, although the various steps in the flowchart in the embodiment of the present application are displayed in sequence according to the indication of the arrows, these steps are not necessarily performed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and it can be performed in other orders. Moreover, at least a portion of the steps in the figure may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily performed at the same time, but can be performed at different times, and their execution order is not necessarily performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0035] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0036] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0037] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.

[0038] The smart terminal may be implemented in various forms. For example, the smart terminal described in this application may include smart terminals such as mobile phones, tablet computers, laptop computers, PDAs, portable media players (PMPs), navigation devices, wearable devices, smart bracelets, pedometers, etc., as well as fixed terminals such as digital TVs and desktop computers.

[0039] The subsequent description will be illustrated by taking a smart terminal as an example, and those skilled in the art will understand that, in addition to components specifically used for mobile purposes, the construction according to the embodiments of the present application can also be applied to fixed-type terminals.

[0040] Figure 1 For a hardware structure diagram of a mobile terminal implementing each embodiment of the present application, please refer to Figure 1, which is a schematic diagram of the hardware structure of a smart terminal for implementing various embodiments of the present application, the smart terminal 100 may include: RF (Radio Frequency) unit 101, WiFi module 102, audio output unit 103, A / V (audio / video) input unit 104, sensor 105, display unit 106, user input unit 107, interface unit 108, memory 109, processor 110, and power supply 111 and other components. Those skilled in the art can understand that Figure 1 The structure of the smart terminal shown in the figure does not constitute a limitation on the smart terminal. The smart terminal may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0041] Combine the following Figure 1 A detailed introduction to each component of the smart terminal:

[0042] The radio frequency unit 101 can be used for receiving and sending signals during information transmission or communication. Specifically, after receiving the downlink information of the base station, it is sent to the processor 110 for processing; in addition, the uplink data is sent to the base station. Generally, the radio frequency unit 101 includes but is not limited to an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, etc. In addition, the radio frequency unit 101 can also communicate with the network and other devices through wireless communication. The above-mentioned wireless communications can use any communication standard or protocol, including but not limited to GSM (Global System of Mobile communication), GPRS (General Packet Radio Service), CDMA2000 (Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division Duplexing-Long Term Evolution), TDD-LTE (Time Division Duplexing-Long Term Evolution) and 5G, etc.

[0043] WiFi is a short-range wireless transmission technology. The smart terminal can help users send and receive emails, browse web pages, and access streaming media through the WiFi module 102. It provides users with wireless broadband Internet access. Figure 1 The WiFi module 102 is shown, but it is understandable that it is not a necessary component of the smart terminal and can be omitted as needed without changing the essence of the invention.

[0044] The audio output unit 103 can convert the audio data received by the RF unit 101 or the WiFi module 102 or stored in the memory 109 into an audio signal and output it as sound when the smart terminal 100 is in a call signal receiving mode, a call mode, a recording mode, a voice recognition mode, a broadcast receiving mode, etc. Moreover, the audio output unit 103 can also provide audio output related to a specific function performed by the smart terminal 100 (for example, a call signal receiving sound, a message receiving sound, etc.). The audio output unit 103 may include a speaker, a buzzer, etc.

[0045] The A / V input unit 104 is used to receive audio or video signals. The A / V input unit 104 may include a graphics processor (GPU) 1041 and a microphone 1042, and the graphics processor 1041 processes the image data of a static picture or video obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The processed image frame can be displayed on the display unit 106. The image frame processed by the graphics processor 1041 can be stored in the memory 109 (or other storage medium) or sent via the radio frequency unit 101 or the WiFi module 102. The microphone 1042 can receive sound (audio data) via the microphone 1042 in a telephone call mode, a recording mode, a voice recognition mode, and other operating modes, and can process such sound into audio data. The processed audio (voice) data can be converted into a format output that can be sent to a mobile communication base station via the radio frequency unit 101 in the case of a telephone call mode. The microphone 1042 can implement various types of noise elimination (or suppression) algorithms to eliminate (or suppress) noise or interference generated in the process of receiving and sending audio signals.

[0046] The smart terminal 100 also includes at least one sensor 105, such as a light sensor, a motion sensor, and other sensors. Optionally, the light sensor includes an ambient light sensor and a proximity sensor. Optionally, the ambient light sensor can adjust the brightness of the panel 1061 according to the brightness of the ambient light, and the proximity sensor can turn off the panel 1061 and / or the backlight when the smart terminal 100 is moved to the ear. As a type of motion sensor, the accelerometer sensor can detect the magnitude of acceleration in all directions (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that can also be configured on the mobile phone, such as fingerprint sensors, pressure sensors, iris sensors, molecular sensors, gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0047] The display unit 106 is used to display information input by the user or information provided to the user. The display unit 106 may include a flexible display panel 1061, which may be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.

[0048] The user input unit 107 can be used to receive input digital or character information, and to generate key signal input related to the user settings and function control of the intelligent terminal. Optionally, the user input unit 107 may include a touch panel 1071 and other input devices 1072. The touch panel 1071, also known as a touch screen, can collect the user's touch operation on or near it (such as the user's operation on the touch panel 1071 or near the touch panel 1071 using any suitable object or accessory such as a finger, stylus, etc.), and drive the corresponding connection device according to a pre-set program. The touch panel 1071 may include two parts: a touch detection device and a touch controller. Optionally, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into the touch point coordinates, and then sends it to the processor 110, and can receive and execute commands sent by the processor 110. In addition, the touch panel 1071 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves. In addition to the touch panel 1071, the user input unit 107 may further include other input devices 1072. Optionally, the other input devices 1072 may include, but are not limited to, one or more of a physical keyboard, a function key (such as a volume control key, a switch key, etc.), a trackball, a mouse, a joystick, etc., which are not specifically limited here.

[0049] Optionally, the touch panel 1071 may cover the flexible display panel 1061. When the touch panel 1071 detects a touch operation on or near it, it transmits it to the processor 110 to determine the type of touch event, and then the processor 110 provides a corresponding visual output on the panel 1061 according to the type of touch event. Figure 1 In the figure, the touch panel 1071 and the flexible display panel 1061 are used as two independent components to realize the input and output functions of the smart terminal. However, in some embodiments, the touch panel 1071 and the flexible display panel 1061 can be integrated to realize the input and output functions of the smart terminal, which is not limited here.

[0050] The interface unit 108 is used as an interface through which at least one external device can be connected to the smart terminal 100. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, a headphone port, etc. The interface unit 108 may be used to receive input (e.g., data information, power, etc.) from an external device and transmit the received input to one or more elements within the smart terminal 100 or may be used to transmit data between the smart terminal 100 and an external device.

[0051] The memory 109 can be used to store software programs and various data. The memory 109 can mainly include a program storage area and a data storage area. Optionally, the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory 109 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0052] The processor 110 is the control center of the smart terminal. It uses various interfaces and lines to connect various parts of the entire smart terminal. It executes various functions of the smart terminal and processes data by running or executing software programs and / or modules stored in the memory 109, and calling data stored in the memory 109, so as to monitor the smart terminal as a whole. The processor 110 may include one or more processing units; preferably, the processor 110 may integrate an application processor and a modem processor. Optionally, the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 110.

[0053] The intelligent terminal 100 may also include a power supply 111 (such as a battery) for supplying power to various components. Preferably, the power supply 111 may be logically connected to the processor 110 through a power management system, thereby managing functions such as charging, discharging, and power consumption through the power management system.

[0054] although Figure 1 Not shown, the smart terminal 100 may also include a Bluetooth module, etc., which will not be described in detail here.

[0055] To facilitate understanding of the embodiments of the present application, the communication network system on which the smart terminal of the present application is based is described below.

[0056] See also Figure 2 , Figure 2 A communication network system architecture diagram is provided for an embodiment of the present application, wherein the communication network system is an LTE system of universal mobile communication technology, and the LTE system includes a UE (User Equipment) 201, an E-UTRAN (Evolved UMTS Terrestrial Radio Access Network) 202, an EPC (Evolved Packet Core) 203 and an operator's IP service 204, which are connected in sequence for communication.

[0057] Optionally, UE201 may be the above-mentioned terminal 100, which will not be described in detail here.

[0058] E-UTRAN 202 includes eNodeB 2021 and other eNodeBs 2022 , etc. Optionally, eNodeB 2021 may be connected to other eNodeBs 2022 via a backhaul (eg, an X2 interface), and eNodeB 2021 is connected to EPC 203 , and eNodeB 2021 may provide UE 201 with access to EPC 203 .

[0059] EPC203 may include MME (Mobility Management Entity) 2031, HSS (Home Subscriber Server) 2032, other MMEs 2033, SGW (Serving Gate Way) 2034, PGW (PDN Gate Way) 2035 and PCRF (Policy and Charging Rules Function) 2036, etc. Optionally, MME 2031 is a control node that processes signaling between UE 201 and EPC 203, and provides bearer and connection management. HSS 2032 is used to provide some registers to manage functions such as home location register (not shown in the figure), and store some user-specific information such as service features and data rates. All user data can be sent through SGW2034, PGW2035 can provide IP address allocation and other functions for UE 201, PCRF2036 is the policy and charging control policy decision point for service data flow and IP bearer resources, which selects and provides available policy and charging control decisions for the policy and charging execution function unit (not shown in the figure).

[0060] The IP service 204 may include the Internet, an intranet, an IMS (IP Multimedia Subsystem) or other IP services.

[0061] Although the above introduction takes the LTE system as an example, those skilled in the art should know that the present application is not only applicable to the LTE system, but also to other wireless communication systems, such as GSM, CDMA2000, WCDMA, TD-SCDMA, 5G and future new network systems (such as 6G), etc., without limitation here.

[0062] Based on the above-mentioned smart terminal hardware structure and communication network system, various embodiments of the present application are proposed.

[0063] First embodiment

[0064] Figure 3 is a schematic cross-sectional view of a circuit board assembly according to the first embodiment of the present application. Figure 3 As shown, the circuit board assembly includes a circuit board 10 (PCB), at least one chip 20 and a heat shield 30, wherein the chip 20 is electrically connected to the circuit board 10, and the heat shield 30 is connected to the circuit board 10 and covers the chip 20. In this embodiment, the heat shield 30 is used to protect the chip 20 and to provide heat dissipation and electromagnetic shielding for the chip 20.

[0065] Optionally, the heat dissipation shield 30 includes a cover body 31, metal fibers 32 and a coolant (not shown), a sealed cavity 301 is formed in the cover body 31, the metal fibers 32 are arranged in the sealed cavity 301, the coolant is adsorbed in the metal fibers 32, and a receiving groove 302 for receiving the chip 20 is formed at the bottom of the cover body 31. In this embodiment, the cover body 31 is connected to the circuit board 10, and the chip 20 is in the receiving groove 302.

[0066] The sealed cavity 301 of the heat dissipation shield 30 of the present application is provided with metal fibers 32, and the coolant is adsorbed in the metal fibers 32; when the heat of the chip 20 is conducted to the metal fibers 32, the coolant in the metal fibers 32 is vaporized by the heat, and the vaporized coolant flows toward the sealed cavity 301, and a directional heat dissipation and flow diversion effect is achieved through the change of the gas-liquid two-phase flow of the coolant, which can improve the heat dissipation efficiency.

[0067] Optionally, the sealed cavity 301 includes an upper cavity wall 3011 and a lower cavity wall 3012 that are arranged opposite to each other, the lower cavity wall 3012 is arranged close to the accommodating groove 302, the metal fiber 32 is arranged on the lower cavity wall 3012, and a gas-liquid convection space is formed between the metal fiber 32 and the upper cavity wall 3011.

[0068] Optionally, the heat dissipation shield 30 further includes at least one heat-conducting column 33, which is disposed in the sealed cavity 301, one end of which is connected to the upper cavity wall 3011, and the other end of which passes through the metal fiber 32 and is connected to the lower cavity wall 3012. In this embodiment, the metal fiber 32 can conduct heat laterally, and the heat-conducting column 33 can conduct heat longitudinally, so that the heat-conducting column 33 can reduce the longitudinal heat transfer resistance and improve the longitudinal heat dissipation efficiency.

[0069] Optionally, the heat-conducting pillar 33 is made of metal material, such as copper or steel.

[0070] Optionally, the heat dissipation shielding cover 30 includes a plurality of heat-conducting columns 33 , and the plurality of heat-conducting columns 33 are arranged in the sealed cavity 301 at intervals.

[0071] Alternatively, if Figure 3As shown, the cover body 31 includes an upper cover plate 311, a lower cover plate 312 and a side frame 313. The lower cover plate 312 and the side frame 313 are connected to the lower surface of the upper cover plate 311. The side frame 313 is arranged around the circumference of the lower cover plate 312. The sealed cavity 301 is formed between the upper cover plate 311 and the lower cover plate 312. The lower surface of the upper cover plate 311 forms the upper cavity wall 3011 of the sealed cavity 301, and the upper surface of the lower cover plate 312 forms the lower cavity wall 3012 of the sealed cavity 301. The accommodating groove 302 is formed between the lower cover plate 312 and the side frame 313. The lower surface of the lower cover plate 312 and the inner wall of the side frame 313 form the groove wall of the accommodating groove 302. In this embodiment, the side frame 313 is a polygon of a rectangular, circular or other shape, and the side frame 313 is used for the side signal shielding of the chip 20.

[0072] Optionally, the upper cover plate 311 , the lower cover plate 312 and the side frame 313 are all made of metal materials, such as copper, stainless steel, aluminum, alloy, etc.

[0073] Alternatively, if Figure 3 As shown, the lower cover plate 312 includes a connecting portion, an inclined portion and a horizontal portion, the inclined portion is connected between the connecting portion and the horizontal portion, the connecting portion is the periphery of the lower cover plate 312 and is connected to the upper cover plate 311, the horizontal portion is parallel to and opposite to the upper cover plate 311, the metal fiber 32 covers the horizontal portion, one end of each heat-conducting column 33 is connected to the upper cover plate 311, and the other end of each heat-conducting column 33 passes through the metal fiber 32 and is connected to the horizontal portion.

[0074] Alternatively, if Figure 3 As shown, at least one convex bump 3121 protruding toward the accommodating groove 302 is formed partially on the lower cover plate 312, and the convex bump 3121 is arranged corresponding to the chip 20, and the convex bump 3121 has a heat conducting surface in contact with the chip 20. In this embodiment, the convex bump 3121 contacts the chip 20 through the heat conducting surface, which can improve the heat conduction efficiency.

[0075] Optionally, the convex bump 3121 is formed on the horizontal portion of the lower cover plate 312 by stamping.

[0076] Optionally, the convex hump 3121 forms a groove 303 on the side of the sealed cavity 301 , and the metal fiber 32 is arranged in the groove 303 and on the lower cavity wall 3012 outside the groove 303 .

[0077] Alternatively, if Figure 3 As shown, the thickness of the metal fiber 32 in the groove 303 is equal to the thickness of the metal fiber 32 on the lower cavity wall 3012 .

[0078] Alternatively, if Figure 3As shown, the heat dissipation shield 30 further includes a heat conductive medium layer 34, which is filled in the accommodating groove 302, and the heat conductive medium layer 34 is provided with an escape hole 304 for escaping the chip 20. In this embodiment, the heat conductive medium layer 34 is used to conduct the heat generated by the chip 20 to the lower cover plate 312, which is beneficial to improve the heat dissipation efficiency of the chip 20.

[0079] Optionally, the hole wall of the avoidance hole 304 contacts the side surface of the chip 20 , which can further improve the heat conduction efficiency.

[0080] Optionally, the metal fiber 32 includes a capillary structure for absorbing the coolant; under the condition of local high temperature of the chip 20, the heat dissipation and flow diversion effect is achieved through the change of the two-phase flow of the coolant, thereby improving the heat dissipation efficiency.

[0081] Second embodiment

[0082] Figure 4 is a schematic cross-sectional view of a circuit board assembly according to a second embodiment of the present application. Figure 4 As shown, the circuit board assembly of this embodiment has substantially the same structure as the circuit board assembly of the first embodiment, except that the thickness of the metal fiber 32 is different. In this embodiment, the thickness of the metal fiber 32 in the groove 303 is greater than the thickness of the metal fiber 32 on the lower cavity wall 3012.

[0083] Optionally, the metal fiber 32 includes a first heat conducting part 321 and a second heat conducting part 322 connected to each other, the first heat conducting part 321 is arranged in the groove 303, the second heat conducting part 322 is arranged on the lower cavity wall 3012, and the thickness of the first heat conducting part 321 is greater than the thickness of the second heat conducting part 322.

[0084] Since the thickness of the metal fiber 32 in the groove 303 is greater than the thickness of the metal fiber 32 on the lower cavity wall 3012 , the metal fiber 32 in the groove 303 can absorb more coolant, thereby further improving the heat dissipation efficiency.

[0085] Third embodiment

[0086] Figure 5 is a schematic cross-sectional view of a circuit board assembly according to a third embodiment of the present application. Figure 5 As shown, the circuit board assembly of this embodiment has a substantially similar structure to the circuit board assembly of the above-mentioned embodiment, except that the diameters of some heat-conducting pillars 33 are different. In this embodiment, at least one heat-conducting pillar 33 is correspondingly disposed in the groove 303, and the heat-conducting pillar 33 is defined as a first heat-conducting pillar 331; at least one heat-conducting pillar 33 is disposed in the sealed cavity 301 outside the groove 303, and the heat-conducting pillar 33 is defined as a second heat-conducting pillar 332, and the diameter of the second heat-conducting pillar 332 is greater than the diameter of the first heat-conducting pillar 331.

[0087] Since the diameter of the first heat-conducting column 331 is small, the perforation on the metal fiber 32 that avoids the first heat-conducting column 331 is small, and the metal fiber 32 in the groove 303 can absorb more coolant; since the diameter of the second heat-conducting column 332 is large, it conducts more heat and can improve the heat conduction efficiency.

[0088] Fourth embodiment

[0089] Figure 6 is a schematic cross-sectional view of a circuit board assembly according to a fourth embodiment of the present application. Figure 6 As shown, the circuit board assembly of this embodiment has a substantially similar structure to that of the circuit board assembly of the above-mentioned embodiment, except that the lengths of some heat-conducting pillars 33 are different. In this embodiment, at least one heat-conducting pillar 33 is correspondingly arranged in the groove 303, and the heat-conducting pillar 33 is defined as a third heat-conducting pillar 333; at least one heat-conducting pillar 33 is arranged in the sealed cavity 301 outside the groove 303, and the heat-conducting pillar 33 is defined as a fourth heat-conducting pillar 334. The third heat-conducting pillar 333 does not penetrate the lower cover plate 312, and the fourth heat-conducting pillar 334 penetrates the lower cover plate 312 and is buried in the heat-conducting medium layer 34. Since the fourth heat-conducting pillar 334 is at least partially buried in the heat-conducting medium layer 34, the heat-conducting efficiency of the heat-conducting medium layer 34 can be improved, and rapid heat dissipation can be achieved.

[0090] Fifth embodiment

[0091] Figure 7 is a schematic cross-sectional view of a circuit board assembly according to a fifth embodiment of the present application. Figure 7 As shown, the circuit board assembly of this embodiment has a substantially similar structure to that of the circuit board assembly of the above-mentioned embodiment, except that the local structure of the lower cover plate 312 is different. In this embodiment, a plurality of convex bumps 3121 are formed locally on the lower cover plate 312, and the height of at least one convex bump 3121 protruding into the accommodating groove 302 is different from the heights of the other convex bumps 3121. The height of each convex bump 3121 matches the thickness of the chip 20, that is, the thinner the thickness of the chip 20, the greater the height of the convex bump 3121, and the thicker the thickness of the chip 20, the smaller the height of the convex bump 3121, so that the heat conduction surface of each convex bump 3121 is in contact with the surface of the chip 20.

[0092] Alternatively, if Figure 7 As shown, two chips 20 are connected to the circuit board 10, namely the first chip 21 and the second chip 22, and the thickness of the first chip 21 is greater than the thickness of the second chip 22; two convex bumps 3121 are formed partially on the lower cover 312, namely the first convex bump and the second convex bump, the height of the first convex bump is less than the height of the second convex bump, the heat conductive surface of the first convex bump contacts the surface of the first chip 21, and the heat conductive surface of the second convex bump contacts the surface of the second chip 22.

[0093] The heat dissipation shield 30 of this embodiment can meet the heat dissipation requirements of chips 20 of different thicknesses. The height of each convex bump 3121 matches the thickness of the chip 20. This design can reduce the gap between the convex bump 3121 and the chip 20 and reduce the heat transfer resistance.

[0094] Sixth embodiment

[0095] The present application also relates to a smart terminal, comprising the above-mentioned heat dissipation shielding cover 30.

[0096] Please refer to the above for the structure and functions of the smart terminal, which will not be repeated here.

[0097] It is understood that the above scenarios are only examples and do not constitute a limitation on the application scenarios of the technical solutions provided in the embodiments of the present application. The technical solutions of the present application can also be applied to other scenarios. For example, it is known to those skilled in the art that with the evolution of the system architecture and the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0098] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0099] The steps in the method of the embodiment of the present application can be adjusted in order, combined and deleted according to actual needs.

[0100] The units in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0101] In the present application, the same or similar terminology concepts, technical solutions and / or application scenario descriptions are generally described in detail only the first time they appear. When they appear again later, they are generally not repeated for the sake of brevity. When understanding the technical solutions and other contents of the present application, for the same or similar terminology concepts, technical solutions and / or application scenario descriptions that are not described in detail later, reference can be made to the previous related detailed descriptions.

[0102] In the present application, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0103] The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0104] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as above, and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, a controlled terminal, or a network device, etc.) to execute the method of each embodiment of the present application.

[0105] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loading and executing computer program instructions on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server, a data center, etc. that contains one or more available media integrated. The available medium can be a magnetic medium, (e.g., a floppy disk, a storage disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state storage disk Solid State Disk (SSD)), etc.

[0106] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation shield, characterized in that: It comprises a cover body, metal fibers and cooling liquid. A sealed cavity is formed in the cover body. The metal fibers are arranged in the sealed cavity. The cooling liquid is adsorbed in the metal fibers. A receiving groove for receiving a chip is formed at the bottom of the cover body.

2. The heat dissipation shield as claimed in claim 1, characterized in that: The sealed cavity comprises an upper cavity wall and a lower cavity wall which are arranged opposite to each other. The lower cavity wall is arranged close to the containing groove. The metal fiber is arranged on the lower cavity wall. A gas-liquid convection space is formed between the metal fiber and the upper cavity wall.

3. The heat dissipation shield as claimed in claim 2, characterized in that: The heat dissipation shield also includes at least one heat-conducting column, which is arranged in the sealed cavity, one end of which is connected to the upper cavity wall, and the other end of which passes through the metal fiber and is connected to the lower cavity wall.

4. The heat dissipation shield as claimed in claim 2, characterized in that: The cover body includes an upper cover plate, a lower cover plate and a side frame, the lower cover plate and the side frame are connected to the lower surface of the upper cover plate, the side frame is arranged around the circumference of the lower cover plate, the sealed cavity is formed between the upper cover plate and the lower cover plate, and the accommodating groove is formed between the lower cover plate and the side frame.

5. The heat dissipation shield as claimed in claim 4, characterized in that: Include at least one of the following: At least one convex bump protruding toward the containing groove is formed partially on the lower cover plate, the convex bump is arranged corresponding to the chip, and the convex bump has a heat conducting surface in contact with the chip; At least one convex bump is formed partially on the lower cover plate, and the height of the at least one convex bump protruding into the accommodating groove is different from the heights of the other convex bumps, and the height of each convex bump matches the thickness of the chip.

6. The heat dissipation shield as claimed in claim 5, characterized in that: Include at least one of the following: The convex bulge forms a groove on the side of the sealing cavity, and the metal fiber is arranged in the groove and on the lower cavity wall outside the groove; The thickness of the metal fiber in the groove is equal to the thickness of the metal fiber on the lower cavity wall; The thickness of the metal fiber in the groove is greater than the thickness of the metal fiber on the lower cavity wall.

7. The heat dissipation shield according to any one of claims 1 to 6, characterized in that: Include at least one of the following: The heat dissipation shield further comprises a heat conductive medium layer, the heat conductive medium layer is filled in the containing groove, and the heat conductive medium layer is provided with an escape hole for evading the chip; The hole wall of the avoidance hole contacts the side surface of the chip.

8. The heat dissipation shield according to any one of claims 1 to 6, characterized in that: The metal fiber includes a capillary structure for absorbing the coolant.

9. A circuit board assembly, characterized in that: It comprises a circuit board, at least one chip and the heat dissipation shielding cover according to any one of claims 1 to 8, wherein the chip is electrically connected to the circuit board, the heat dissipation shielding cover is connected to the circuit board, and the chip is located in the accommodating groove.

10. An intelligent terminal, characterized in that: The invention comprises the heat dissipation shield as claimed in any one of claims 1 to 9.

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