Apparatus comprising anisotropic thermally conductive channels and insulating material

Abstract

An apparatus comprising: an area comprising components configured to generate heat; and a thermally conductive layer coupled to the region, wherein the thermally conductive layer includes a plurality of segmented anisotropic thermally conductive channels. Each of the plurality of segmented anisotropic thermally conductive channels is aligned in a first direction. Each segmented anisotropic thermally conductive channel of the plurality of segmented anisotropic thermally conductive channels is configured to provide heat transfer capability in a first direction. The thermally conductive layer is configured to (i) reduce the junction temperature of the component and / or (ii) reduce the surface temperature of the device.

Description

[0001] field

[0002] Various features are directed to devices including heat dissipation assemblies.

[0003] background

[0004] Electronic devices include many components that generate heat, such as integrated devices. Integrated devices may be prone to overheating, which can affect the performance of the integrated device and other components of the electronic device. Overheated integrated devices have high junction temperatures, which can lead to high surface temperatures of the electronic device. This can ultimately affect the performance of the electronic device. There is an ongoing need to improve the heat dissipation performance of electronic devices that include components that generate heat. For example, there is an ongoing need to reduce the junction temperature of components that generate heat and / or reduce the surface temperature of electronic devices that include components that generate heat.

[0005] Overview

[0006] Various features relate to an apparatus including a heat sink.

[0007] One example provides a device including: a region including a component configured to generate heat; and a thermally conductive layer coupled to the region, wherein the thermally conductive layer includes a plurality of segmented anisotropic thermally conductive channels.

[0008] Another example provides an apparatus including: a region including a first integrated device configured to generate heat and a second integrated device configured to generate heat. The apparatus includes means for segmented anisotropic heat transfer coupled to the region. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Various features, characteristics and advantages will become apparent when the detailed description set forth below is read in conjunction with the accompanying drawings in which like reference numerals designate corresponding features throughout.

[0011] Figure 1 An exemplary front side view of an electronic device including a display is illustrated.

[0012] Figure 2 An exemplary backside view of an electronic device including two integrated devices is illustrated.

[0013] Figure 3 A cross-sectional cutaway view of a device including a thermally conductive layer including thermally conductive channels is illustrated.

[0014] Figure 4 An exemplary view of a thermally along-plane anisotropic sheet is illustrated.

[0015] Figure 5 An exemplary view of a thermally conductive layer including thermally conductive channels is illustrated.

[0016] Figure 6 An exemplary plan view of a thermally conductive layer including thermally conductive channels is illustrated.

[0017] Figure 7 An exemplary plan view of a thermally conductive layer including thermally conductive channels and thermally insulating material is illustrated.

[0018] Figure 8 An exemplary plan view of a thermally conductive layer including thermally conductive channels and a number of thermally insulating materials is illustrated.

[0019] Fig. 9 Exemplary plan views of a thermally conductive layer including thermally conductive channels aligned in different directions are illustrated.

[0020] Fig.10 Exemplary plan views of a thermally conductive layer including thermally conductive channels aligned in different directions are illustrated.

[0021] Fig.11 Exemplary plan views of a thermally conductive layer including thermally conductive channels aligned in different directions are illustrated.

[0022] Fig.12 An exemplary plan view of a thermally conductive layer including thermally conductive channels aligned in different directions is illustrated.

[0023] Fig.13 An exemplary junction temperature graph of a device without using a thermally conductive layer including thermally conductive vias is illustrated.

[0024] Fig.14 An exemplary junction temperature graph of a device using a thermally conductive layer including thermally conductive vias is illustrated.

[0025] Fig.15 An exemplary surface temperature graph of a device without using a thermally conductive layer including thermally conductive channels is illustrated.

[0026] Fig.16 An exemplary surface temperature graph of a device using a thermally conductive layer including thermally conductive channels is illustrated.

[0027] Fig.17 Exemplary processes for fabricating a thermally conductive layer including thermally conductive pathways are illustrated.

[0028] Fig.18 An exemplary process for making a thermally conductive layer including thermally insulating portions and thermally conductive pathways aligned in different directions is illustrated.

[0029] Fig.19 An exemplary flow chart of a method for providing a thermally conductive layer including thermally insulating portions and thermally conductive channels aligned in different directions is illustrated.

[0030] Fig. 20Various electronic devices are illustrated into which the dies, integrated devices, integrated passive devices (IPDs), passive components, packages, and / or device packages described herein may be integrated.

[0031] Detailed Description

[0032] In the following description, specific details are given to provide a thorough understanding of various aspects of the present disclosure. However, it will be understood by those of ordinary skill in the art that these aspects can be practiced without these specific details. For example, circuits may be shown with block diagrams to avoid burying these aspects in unnecessary details. In other examples, well-known circuits, structures, and techniques may not be shown in detail to avoid burying these aspects of the present disclosure.

[0033] The present disclosure describes a device (e.g., an electronic device) comprising: an area including a component configured to generate heat; and a thermally conductive layer coupled to the area, wherein the thermally conductive layer comprises a plurality of segmented anisotropic thermally conductive channels. Each of the plurality of segmented anisotropic thermally conductive channels is aligned in a first direction. Each of the plurality of segmented anisotropic thermally conductive channels has a high thermal conductivity in a first direction and a low thermal conductivity in another direction. For example, each of the plurality of segmented anisotropic thermally conductive channels is configured to first (e.g., initially) provide heat transfer primarily in a first direction. The thermally conductive layer may include graphite (e.g., a graphite sheet). The thermally conductive layer is configured to provide localized directional heat transfer to achieve thermal decoupling between components in the device. For example, as will be further described below, the region may include a first integrated device and a second integrated device, and the thermally conductive layer may be configured to provide heat transfer and / or heat dissipation in a manner such that heat generated by one integrated device is not dissipated (or is minimally dissipated) toward the other integrated device. As will be further described below, the use of multiple anisotropic thermally conductive channels helps reduce the integrated device junction temperature and the device surface temperature.

[0034] Exemplary device including a layer having a thermally conductive channel

[0035] Figure 1 and 2 Illustrated is a device 100 that may include at least one thermally conductive layer including thermally conductive channels. The device 100 may include an electronic device, such as a mobile phone (eg, a smart phone). Figure 1 An exemplary front side view of a device 100 including a display 102 and a housing 104 is illustrated. Figure 2An exemplary back-side view of device 100 is illustrated. Device 100 includes integrated device 205, integrated device 215, and camera 220. Integrated device 205 may be a first integrated device. Integrated device 215 may be a second integrated device. Integrated device 205 and integrated device 215 are located inside device 100. For example, integrated device 205 and integrated device 215 are located inside housing 104. Camera 220 may be at least partially embedded in housing 104 of device 100.

[0036] As will be further described below, the device 100 may include at least one thermally conductive layer including a thermally conductive channel. The thermally conductive channel may be an anisotropic thermally conductive channel that is configured to (i) provide high thermal conductivity along a first direction (e.g., length), and (ii) provide low thermal conductivity along another direction (e.g., width). For example, the thermally conductive channel may be an anisotropic thermally conductive channel that is configured to (i) initially provide heat transfer primarily (e.g., significantly, mostly, almost entirely) along the length of the thermally conductive channel; and (ii) initially provide little or no heat transfer along other directions (e.g., second direction, third direction, width). This configuration can help ensure that heat generated by the integrated device 205 is not initially dissipated toward the integrated device 215 and / or that heat generated by the integrated device 215 is not dissipated toward the integrated device 205. Thus, the layer (e.g., thermally conductive layer, heat transfer layer) can be configured to provide localized directional heat transfer to achieve thermal decoupling between components (e.g., integrated devices) in the device 100, while still providing effective and efficient heat dissipation from one or more components configured to generate heat.

[0037] Figure 3 Explained Figure 2 1 is an exemplary cross-sectional view of a cross section AA of device 100. Device 100 includes display 102, back cover 304, board 302, multiple components 303, integrated device 205, integrated device 215, thermal interface material 306, thermal interface material 316, shield 307, shield 317, thermal interface material 308, thermal interface material 318, heat transfer component 320, thermal conductive layer 330, and display module 340. Back cover 304 can be part of housing 104 of device 100.

[0038] The thermally conductive layer 330 includes anisotropic thermally conductive channels that are configured to (i) provide high thermal conductivity along a first direction (e.g., length) and (ii) provide low thermal conductivity along another direction (e.g., width, second direction). Examples of thermally conductive layers are described below at least in Figure 5-12 Further described in .

[0039] Board 302 may be a printed circuit board (PCB). Multiple components 303 may be coupled to the back surface of board 302. Multiple components 303 may face back cover 304 of device 100. Integrated device 205 and / or integrated device 215 may be coupled to the front side of board 302 through multiple solder interconnects (not shown). Thermal interface material 306 may be coupled to the back side of integrated device 205. Shield 307 may be coupled to board 302 and may surround integrated device 205. Shield 307 may be coupled to integrated device 205 through thermal interface material 306. Thermal interface material 316 may be coupled to the back side of integrated device 215. Shield 317 may be coupled to board 302 and may surround integrated device 215. Shield 317 may be coupled to integrated device 215 through thermal interface material 316. Shield 307 and / or shield 317 may include conductive material (e.g., metal, copper) and may be configured to serve as an electromagnetic interference (EMI) shield. Shield 307 and / or shield 317 may be configured to be coupled to ground.

[0040] Thermal interface material 308 is coupled to shield 307. Thermal interface material 318 is coupled to shield 317. Thermal interface material 308 and thermal interface material 318 are coupled to heat transfer assembly 320. Thermally conductive layer 330 may be located inside heat transfer assembly 320. Thermally conductive layer 330 may include one or more thermally conductive layers. In some implementations, thermally conductive layer 330 may be partially covered by heat transfer assembly 320. For example, one side of thermally conductive layer 330 is coupled to heat transfer assembly 320, and the other side of thermally conductive layer 330 is directly coupled to thermal interface material 308 and / or thermal interface material 318. Heat transfer assembly 320 may have different shapes and / or sizes. For example, heat transfer assembly 320 may be configured as a shell and / or plate for thermally conductive layer 330. Heat transfer assembly 320 is coupled to display module 340. Display module 340 may or may not be in contact with display 102. Heat transfer assembly 320 can assist in handling and placement of thermally conductive layer 330 in a device. In some implementations, heat transfer assembly 320 can be optional. In such examples, thermally conductive layer 330 can be directly coupled (e.g., directly touching) to display module 340, thermal interface material 308, and / or thermal interface material 318.

[0041] Figure 3An example of a device 100 is illustrated, the device 100 includes an area including at least one component configured to generate heat, wherein a thermally conductive layer is coupled (e.g., directly or indirectly) to the area including the at least one component configured to generate heat. The area of ​​the device 100 including the components configured to generate heat may include an integrated device 205 (e.g., a first integrated device) and / or an integrated device 215 (e.g., a second integrated device). Thus, the integrated device 205 and / or the integrated device 215 are examples of components that can be configured to generate heat. In some implementations, the thermally conductive layer 330 may be considered to be in an area including at least one component configured to generate heat. Different implementations may define the area of ​​the device 100 differently. The area of ​​the device 100 may include an internal area of ​​the device 100. A thermally conductive layer (e.g., 330) coupled to an area of ​​the device 100 may mean that the thermally conductive layer is coupled (e.g., directly coupled, indirectly coupled, mechanically coupled) to one or more components and / or one or more parts in the area of ​​the device 100. As will be further described in more detail below, thermally conductive layer 330 can be configured to provide localized directional heat transfer to achieve thermal decoupling between integrated device 205 and integrated device 215 (and possibly other components) by using anisotropic thermally conductive channels. Thermally conductive layer 330 can have different shapes, sizes, configurations, and / or arrangements. In one example, thermally conductive layer 330 can have a thickness of approximately 0.8 mm. In one example, heat transfer assembly 320 can have an overall thickness of approximately 1 mm. However, heat transfer assembly 320 can have other thicknesses. The following Figure 5-12 Different examples of configurations of a thermally conductive layer that may be implemented as and / or used for thermally conductive layer 330 in device 100 are illustrated and described. Thermally conductive layer 330 may be a means for segmented anisotropic heat transfer.

[0042] It should be noted that Figure 3 The configurations and / or arrangements shown in are exemplary. In some implementations, other components may be present, some components may be located differently in device 100, and / or some components may be optional.

[0043] It should be noted that in this disclosure, a number of coordinate systems (XYZ, X'-Y'-Z', X"-Y"-Z") are used and described. These exemplary coordinate systems are used to help illustrate the anisotropic thermal properties of the thermally conductive layer and / or the segmented thermally conductive channel. These different coordinate systems can be independent of each other, or they can be related to one or more coordinate systems. Other coordinate systems can be used to illustrate orientation and / or alignment.

[0044] The integrated device (e.g., 205, 215) may include a die (e.g., a bare semiconductor die). The integrated device may include a power management integrated circuit (PMIC). The integrated device may include an application processor. The integrated device may include a modem. The integrated device may include a radio frequency (RF) device, a passive device, a filter, a capacitor, an inductor, an antenna, a transmitter, a receiver, a gallium arsenide (GaAs)-based integrated device, a surface acoustic wave (SAW) filter, a bulk acoustic wave (BAW) filter, a light emitting diode (LED) integrated device, a silicon (Si)-based integrated device, a silicon carbide (SiC)-based integrated device, a memory, a power management processor, and / or a combination thereof. The integrated device (e.g., 205, 215) may include at least one electronic circuit (e.g., a first electronic circuit, a second electronic circuit, etc.). The integrated device may include a transistor. The integrated device may be an example of an electrical component and / or an electrical device. In some implementations, the integrated device may be a core particle. The core particles may be manufactured using one or more manufacturing processes that provide better yields than a manufacturing process used on another type of integrated device, which may reduce the overall cost of manufacturing the core particles. Different core particles may have different sizes and / or shapes. Different core particles may be configured to provide different functions. Different core particles may have different interconnect densities (e.g., interconnects with different widths and / or spacings). In some implementations, several core particles may be used to perform the functionality of one or more chips (e.g., one or more integrated devices). Relative to using a single chip to perform all functions of a package, using several core particles that perform several functions can reduce the overall cost of the package.

[0045] One or more integrated devices may be implemented in a radio frequency (RF) package. The RF package may be a radio frequency front end (RFFE) package. The package may be configured to provide wireless fidelity (WiFi) communications and / or cellular communications (e.g., 2G, 3G, 4G, 5G). The package may be configured to support a global system for mobile communications (GSM), a universal mobile telecommunications system (UMTS), and / or long term evolution (LTE). The package may be configured to transmit and receive signals having different frequencies and / or communication protocols.

[0046] Figure 4Explanation of an exemplary view of a heat conducting sheet 400. The heat conducting sheet 400 may be anisotropically heat conducting along a plane. The heat conducting sheet 400 is configured to provide high heat transfer capability (e.g., heat dissipation) mainly along a plane (e.g., an X'-Y' plane). Therefore, heat can be well dissipated along any direction of a plane (e.g., X'-Y'). However, the heat conducting sheet 400 provides poor, little (relative to heat transfer along a plane) heat transfer capability or does not provide heat transfer capability in other directions and / or other planes. For example, the heat conducting sheet 400 provides little heat transfer capability or does not provide heat transfer capability in the Z' direction, the Z' direction of the X'-Z' plane, and / or the Z' direction of the Y'-Z' plane. The heat conducting sheet 400 may include graphite (e.g., a graphite sheet). In some implementations, the thermal conductivity of the heat conducting sheet 400 in the X'-Y' plane is in the range of about 1000–1900 watts per meter Kelvin (W / (mk)). Thus, the thermal conductivity of the thermally conductive sheet 400 is in the range of about 1000-1900 Watts per meter Kelvin (W / (mk)) in any direction along the plane (e.g., X'-Y'). In some implementations, the thermal conductivity of the thermally conductive sheet 400 in the Z' direction is less than 30 Watts per meter Kelvin (W / (mk)) (e.g., 3.5 W / (mk)).

[0047] Figure 5Explanation of an exemplary view of a heat-conducting layer 500. The heat-conducting layer 500 may be anisotropically heat-conducting along a direction on a plane. The heat-conducting layer 500 includes a plurality of segmented heat-conducting channels 502 (e.g., segmented anisotropic heat-conducting channels). The heat-conducting layer 500 is configured to provide heat transfer (e.g., heat dissipation) mainly along a direction (e.g., Y' direction) in a plane (e.g., Y'-Z' plane). Therefore, heat can be well dissipated along the Y' direction of the plane (e.g., Y'-Z'). However, the heat-conducting sheet 400 may provide little (relative to the direction that can provide most of the heat transfer) heat transfer capability or no heat transfer capability in other directions and / or other planes. For example, the heat-conducting layer 500 may provide little or no heat transfer capability in the Z' direction (e.g., there is little or no heat transfer between the segmented heat-conducting channels 502). The heat-conducting layer 500 may include graphite (e.g., a graphite sheet). In some implementations, the thermal conductivity of the thermally conductive layer 500 in the Y' direction of the Y'-Z' plane is in the range of about 1000-1900 Watts per meter Kelvin (W / (mk)). In some implementations, the thermal conductivity of the thermally conductive layer 500 in the Z' direction is less than 30 Watts per meter Kelvin (W / (mk)) (e.g., 3.5 W / (mk)). The segmented thermally conductive channels (e.g., 502) may include a thermally conductive material having a high thermal conductivity value in a first direction but a low thermal conductivity value in at least a second direction. For example, at least one segmented thermally conductive channel includes a thermally conductive material having a high thermal conductivity value along the length of the segmented thermally conductive channel but having a low thermal conductivity value toward an adjacent segmented thermally conductive channel. The segmented thermally conductive channel includes a thermally conductive material having a relatively high thermal conductivity value in a first direction but a relatively low thermal conductivity value in at least a second direction. The segmented thermally conductive channels have a relatively high thermal conductivity value in a first direction (e.g., along the channel length), but have a relatively low thermal conductivity value in at least a second direction (e.g., along the width of one or more channels). Thus, the thermally conductive layer 500 includes segmented anisotropic thermally conductive channels (e.g., 502) that are configured to (i) provide high thermal conductivity along a first direction (e.g., length), and (ii) provide low thermal conductivity along another direction (e.g., width, second direction).

[0048] The term "high thermal conductivity value" can be high in absolute value and / or high relative to another thermal conductivity value. The term "low thermal conductivity value" can be low in absolute value and / or low relative to another thermal conductivity value. As used in the present disclosure, the term "relatively high thermal conductivity value" can mean a thermal conductivity value at least 5 times higher than a "relatively low thermal conductivity value". For example, a relatively high thermal conductivity value may have a thermal conductivity value at least 5 times higher than a relatively low thermal conductivity value. In another example, a relatively high thermal conductivity value may have a thermal conductivity value at least 10 times higher than a relatively low thermal conductivity value. In yet another example, a relatively high thermal conductivity value may have a thermal conductivity value at least 100 times higher than a relatively low thermal conductivity value. Therefore, a first direction thermal conductivity value (e.g., a high thermal conductivity value) may have a thermal conductivity value at least 5 times higher (e.g., at least 10 times higher, at least 100 times higher) than a second direction thermal conductivity value (e.g., a relatively low thermal conductivity value). Note that the ranges of thermal conductivity values ​​mentioned and described in this disclosure are exemplary. Different materials may have different thermal conductivity values, such as higher and / or lower values ​​than the thermal conductivity values ​​mentioned and described in this disclosure.

[0049] The plurality of segmented heat conducting channels 502 include a first segmented heat conducting channel 502a, a second segmented heat conducting channel 502b, a third segmented heat conducting channel 502c and a fourth segmented heat conducting channel 502d.

[0050] like Figure 5As shown in , each of the multiple segmented heat-conducting channels 502 is aligned in a first direction (e.g., Y' direction) along a plane (e.g., Y'-Z' plane). For example, the length of each of the multiple segmented heat-conducting channels 502 is aligned in a first direction (e.g., Y' direction) along a plane (e.g., Y'-Z' plane). In addition, each of the multiple segmented heat-conducting channels 502 (e.g., 502a, 502b, 502c, 502d) includes an anisotropic heat-conducting channel, which is configured to provide heat transfer mainly in a first direction (e.g., Y' direction, along the length of the segmented heat-conducting channel) in a first plane (e.g., Y'-Z' plane). The multiple segmented heat-conducting channels 502 are bonded by at least one adhesive 503. At least one adhesive 502 may include glue and / or bonding agent. At least one adhesive 503 may include adhesive 503a, adhesive 503b, adhesive 503c and adhesive 503d. At least one adhesive 503 may be located between segmented heat-conducting channels (e.g., 502a, 502b, 502c, 502d). For example, adhesive 503a may be located between the first segmented heat-conducting channel 502a and the second segmented heat-conducting channel 502b. Adhesive 503b may be located between the second segmented heat-conducting channel 502b and the third segmented heat-conducting channel 502c. Adhesive 503c may be located between the third segmented heat-conducting channel 502c and the fourth segmented heat-conducting channel 502d. It should be noted that the adhesive is not always present between the segmented heat-conducting channels and / or along the entire length of the segmented heat-conducting channels. Each segmented heat-conducting channel may be defined by a graphite sheet that has been cut.

[0051] In some implementations, the thermal conductivity of each segmented thermally conductive channel (e.g., 502a, 502b, 502c, 502d) in the Y' direction of the Y'-Z' plane is in the range of about 1000-1900 Watts per meter Kelvin (W / (mk)). In some implementations, the thermal conductivity of each segmented thermally conductive channel (e.g., 502a, 502b, 502c, 502d) in the Z' direction, the Z' direction of the X'-Z' plane, and / or the Z' direction of the Y'-Z' plane is less than 30 Watts per meter Kelvin (W / (mk)) (e.g., 3.5 W / (mk)). Each segmented thermally conductive channel can be an anisotropic thermally conductive channel (e.g., a first anisotropic thermally conductive channel, a second anisotropic thermally conductive channel, a third anisotropic thermally conductive channel, a fourth anisotropic thermally conductive channel). Each segmented heat-conducting channel may have high thermal conductivity (e.g., high thermal conductivity value, relatively high thermal conductivity value, first direction thermal conductivity, first direction thermal conductivity value) along the length of the segmented heat-conducting channel. Each segmented heat-conducting channel may have low thermal conductivity (e.g., low thermal conductivity value, relatively low thermal conductivity value, second direction thermal conductivity, second direction thermal conductivity value) along the width of the segmented heat-conducting channel. Each segmented heat-conducting channel may have low thermal conductivity (e.g., low thermal conductivity value, relatively low thermal conductivity value, second direction thermal conductivity, second direction thermal conductivity value) between adjacent and / or adjacent segmented heat-conducting channels. Thus, the thermal conductivity value between adjacent and / or adjacent heat-conducting channels (e.g., the first heat-conducting channel and the second heat-conducting channel) may be low and / or lower than the thermal conductivity value of the heat-conducting channel along the length of the heat-conducting channel.

[0052] In some implementations, each of the segmented heat-conducting channels 502 may have a width in the range of about 25-50 microns. However, it should be noted that the segmented heat-conducting channels 502 may have a width outside the range mentioned above. In some implementations, the segmented heat-conducting channels 502 may have similar or different widths. Multiple segmented heat-conducting channels 502 are configured so that heat transfer occurs primarily along the length of the segmented heat-conducting channels at first, and initially little or no heat transfer occurs between adjacent segmented heat-conducting channels. However, after a period of time, there may be more heat transfer (e.g., heat dissipation) occurring in other non-primary directions. The term "little or no heat transfer capacity" in a specific direction may mean that relative to the heat transfer capacity in the direction where there is the maximum, main and / or most of the heat transfer capacity, there is a minimum or negligible heat transfer capacity in the specific direction (e.g., the heat transfer capacity represents less than 5% of the heat transfer capacity in the direction where there is the maximum heat transfer capacity). The thickness of the thermally conductive layer 500 or the thinnest point (in the X' direction) (relative to the length of the thermally conductive layer and / or the length of the segmented thermally conductive channel) is such that heat transfer (e.g., heat dissipation) will first occur mostly and primarily in the Y' direction. For example, if there is a heat source located below the center of the thermally conductive layer 500, the heat will initially and mostly travel in the Y' direction along the segmented thermally conductive channel 502, with some heat subsequently and / or eventually escaping and / or dissipating in the X' direction and / or the Z' direction. The heat transfer capability can be expressed in absolute and / or relative terms. The heat transfer capability can be expressed by a thermal conductivity value.

[0053] Thermally conductive layer 500 may be implemented in many configurations and / or implementations. Figure 6 -12 illustrates how the thermally conductive layer 500 may be implemented, combined, and / or modified to provide examples of different thermally conductive layers. Thus, the properties described for the thermally conductive layer 500 and the thermally conductive channel 502 (eg, anisotropic properties) may also be applicable to at least Figure 6-12 Any thermally conductive layer and / or any thermally conductive path illustrated and described in the description. Figure 17-18 An exemplary process for fabricating a thermally conductive layer including a plurality of segmented thermally conductive channels is described in .

[0054] Figure 6 A plan view of a thermally conductive layer 600 including a plurality of segmented thermally conductive channels 602 is illustrated. The thermally conductive layer 600 is shown positioned over the integrated device 205 and the integrated device 215. The thermally conductive layer 600 is similar to Figure 5 The plurality of segmented heat conducting channels 602 may be similar to the plurality of segmented heat conducting channels 502. Figure 6As shown in , the thermally conductive layer 600 is positioned over the area (of the device) including the integrated device 205 and / or the integrated device 215 in the following manner so that heat transfer (e.g., heat dissipation) occurs primarily along the X" direction of the X"-Y" plane. The thermally conductive layer 600 can be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. Figure 6 As shown in , the lengths of the plurality of segmented heat conductive channels 602 are aligned in the X” direction of the X”-Y” plane. In this configuration and / or arrangement, the plurality of segmented heat conductive channels 602 are aligned in the X” direction (e.g., the first direction) of the X”-Y” plane, and heat transfer first occurs primarily along the X” direction of the X”-Y” plane. This provides thermal decoupling between the integrated device 205 and the integrated device 215 because there is initially little or no heat transfer in the Y” direction of the X”-Y” plane. Thus, the thermally conductive layer 600 includes segmented anisotropic heat conductive channels that are configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the second direction).

[0055] It should be noted that in the portion(s) of the thermally conductive layer 600 above the integrated device 205 and / or the integrated device 215, there may be heat transfer capability in the Z” direction (orthogonal to both the Y” direction and the X” direction). In some implementations, two separate thermally conductive layers (e.g., 600) may be used, with each thermally conductive layer (e.g., 600) being located above a respective integrated device. For example, a first thermally conductive layer (e.g., 600) may be located above the integrated device 205, and a second thermally conductive layer (e.g., 600) may be located above the integrated device 215.

[0056] Figure 7A plan view of a thermally conductive layer 700 including a first portion 705, a second portion 715, and a thermally insulating material 710 (e.g., a thermally insulating layer) is illustrated. The first portion 705 includes a first plurality of segmented thermally conductive channels 707 (e.g., segmented anisotropic thermally conductive channels). The second portion 715 includes a second plurality of segmented thermally conductive channels 717 (e.g., segmented anisotropic thermally conductive channels). The first portion 705 is coupled to the second portion 715 by the thermally insulating material 710. The thermally insulating material 710 may include an aerogel. The thermally insulating material 710 may have a thermal conductivity of approximately 0.018 watts per meter Kelvin (W / (mk)). However, different implementations and / or different materials may have different thermal conductivity values. For example, the thermally insulating material 710 (and / or any thermally insulating material described in the present disclosure) may have a thermal conductivity of 0.1 W / mk or less. Foam sponge is another example of a thermally insulating material. The first plurality of segmented heat-conducting channels 707 are coupled to the second plurality of segmented heat-conducting channels 717 through the insulation material 710. The first portion 705 may be bonded to the insulation material 710 using an adhesive. Similarly, the second portion 715 may be bonded to the insulation material 710 using an adhesive. However, it should be noted that other methods may be used to combine the first portion 705, the insulation material 710, and the second portion 715. The first plurality of segmented heat-conducting channels 707 and the second plurality of segmented heat-conducting channels 717 are part of a plurality of segmented heat-conducting channels of the heat-conducting layer 700. The first plurality of segmented heat-conducting channels 707 and the second plurality of segmented heat-conducting channels 717 are aligned in the X" direction of the X"-Y" plane. Thus, the segmented heat-conducting channels 707 and 717 are configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the second direction).

[0057] like Figure 7 As shown in , the thermally conductive layer 700 is positioned over the area (of the device) including the integrated device 205 and / or the integrated device 215 in a manner such that heat transfer (e.g., heat dissipation) occurs primarily along the X” direction of the X”-Y” plane. The thermally conductive layer 700 may be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. The use of the thermally insulating material 710 helps improve the thermal decoupling between the integrated device 205 and the integrated device 215, as the thermally insulating material 710 further helps reduce and / or eliminate heat transfer in the Y” direction of the X”-Y” plane. It should be noted that in the portion(s) of the thermally conductive layer 700 above the integrated device 205 and / or the integrated device 215, there may be heat transfer capability in the Z” direction (orthogonal to both the Y” direction and the X” direction).

[0058] Figure 8A plan view of a thermally conductive layer 800 including alternating segmented thermally conductive channels and thermally insulating materials is illustrated. The thermally conductive layer 800 includes multiple segmented thermally conductive channels 707a, multiple segmented thermally conductive channels 707b, multiple segmented thermally conductive channels 707c, multiple segmented thermally conductive channels 717a, multiple segmented thermally conductive channels 717b, multiple segmented thermally conductive channels 717c, thermally insulating materials 710a, thermally insulating materials 710b, thermally insulating materials 710c, thermally insulating materials 710d, thermally insulating materials 710e, thermally insulating materials 710f, and thermally insulating materials 710g. An adhesive may be used to join multiple segmented thermally conductive channels and (all) thermally insulating materials. The thermally insulating materials (e.g., 710a-710g) may include aerogels.

[0059] A plurality of segmented thermally conductive channels 707a (e.g., segmented anisotropic thermally conductive channels), a plurality of segmented thermally conductive channels 707b (e.g., segmented anisotropic thermally conductive channels), a plurality of segmented thermally conductive channels 707c (e.g., segmented anisotropic thermally conductive channels), a plurality of segmented thermally conductive channels 717a (e.g., segmented anisotropic thermally conductive channels), a plurality of segmented thermally conductive channels 717b (e.g., segmented anisotropic thermally conductive channels), and / or a plurality of segmented thermally conductive channels 717c (e.g., segmented anisotropic thermally conductive channels) may be aligned in the X” direction of the X”-Y” plane.

[0060] The plurality of segmented heat-conducting channels 707a, the plurality of segmented heat-conducting channels 707b, the plurality of segmented heat-conducting channels 707c, the plurality of segmented heat-conducting channels 717a, the plurality of segmented heat-conducting channels 717b, and / or the plurality of segmented heat-conducting channels 717c may be configured to provide heat transfer primarily along the X" direction of the X"-Y" plane. Thus, the thermally conductive layer 800 includes segmented anisotropic heat-conducting channels that are configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel), and (ii) provide high thermal conductivity along another direction. The thermally conductive layer 800 may be directly or indirectly coupled to the integrated device 205 and / or the integrated device 215. The thermally conductive layer 800 may provide improved thermal decoupling between the integrated device 205 and the integrated device 215 by using additional thermally insulating materials. It should be noted that in the portion(s) above the integrated device 205 and / or the integrated device 215 in the thermally conductive layer 800, there may be heat transfer capability in the Z" direction (orthogonal to both the Y" direction and the X" direction).

[0061] Fig. 9A plan view of a thermally conductive layer 900 including a first thermally conductive layer 905 and a second thermally conductive layer 915 is illustrated. The first thermally conductive layer 905 may be a first portion of the thermally conductive layer 900. The second thermally conductive layer 915 may be a second portion of the thermally conductive layer 900. Although not shown, the thermally conductive layer 900 may include a thermally insulating material (e.g., 710) between the first thermally conductive layer 905 and the second thermally conductive layer 915. The first thermally conductive layer 905 includes a first plurality of segmented thermally conductive channels 907 (e.g., segmented anisotropic thermally conductive channels). The second thermally conductive layer 915 includes a second plurality of segmented thermally conductive channels 917 (e.g., segmented anisotropic thermally conductive channels). The first thermally conductive layer 905 is coupled to the second thermally conductive layer 915 (e.g., by using an adhesive). In some implementations, the first thermally conductive layer 905 is coupled to the second thermally conductive layer 915 through the thermally insulating material 710.

[0062] The first plurality of segmented heat-conducting channels 907 and the second plurality of segmented heat-conducting channels 917 are part of the plurality of segmented heat-conducting channels of the heat-conducting layer 900. The first plurality of segmented heat-conducting channels 907 are aligned in the Y” direction of the X”-Y” plane. For example, the lengths of the first plurality of segmented heat-conducting channels 907 are aligned in the Y” direction of the X”-Y” plane. The first plurality of segmented heat-conducting channels 907 are configured to first provide heat transfer (e.g., provide a high first-direction thermal conductivity value) mainly along the Y” direction of the X”-Y” plane. The second plurality of segmented heat-conducting channels 917 are aligned in the X” direction of the X”-Y” plane. For example, the lengths of the second plurality of segmented heat-conducting channels 917 are aligned in the X” direction of the X”-Y” plane. The second plurality of segmented heat-conducting channels 917 are configured to provide heat transfer (e.g., provide a high second-direction thermal conductivity value) mainly along the X” direction of the X”-Y” plane. The Y" direction (eg, the second direction) may be orthogonal with respect to the X" direction (eg, the first direction).

[0063] The segmented thermally conductive channel 907 is configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel, the Y” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the second direction, the X” direction). The segmented thermally conductive channel 917 is configured to (i) provide high thermal conductivity along a second direction (e.g., the length of the channel, the X” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the first direction, the Y” direction).

[0064] This configuration and / or arrangement of multiple segmented thermally conductive channels may be used when heat transfer in a particular direction and / or toward a particular location (eg, heat dissipation) is desired.

[0065] Thermally conductive layer 900 may be directly or indirectly coupled to integrated device 205 and / or integrated device 215. Fig. 9As shown in , the thermal conductive layer 900 is positioned over the region including the integrated device 205 and / or the integrated device 215 in such a manner that (i) heat transfer (e.g., heat dissipation) in a first region including the integrated device 205 occurs primarily along the Y” direction of the X”-Y” plane and (ii) heat transfer (e.g., heat dissipation) in a second region including the integrated device 215 occurs primarily along the X” direction of the X”-Y” plane. It should be noted that in the portion(s) of the thermal conductive layer 900 above the integrated device 205 and / or the integrated device 215, there may be heat transfer capability in the Z” direction (orthogonal to both the Y” direction and the X” direction).

[0066] Fig.10 A plan view of a thermally conductive layer 1000 including a first thermally conductive layer 1005 and a second thermally conductive layer 915 is illustrated. The first thermally conductive layer 1005 may be a first portion of the thermally conductive layer 1000. The second thermally conductive layer 915 may be a second portion of the thermally conductive layer 1000. Although not shown, the thermally conductive layer 1000 may include a thermally insulating material (e.g., 710) between the first thermally conductive layer 1005 and the second thermally conductive layer 915. The first thermally conductive layer 1005 includes a first plurality of segmented thermally conductive channels 1007 (e.g., segmented anisotropic thermally conductive channels). The second thermally conductive layer 915 includes a second plurality of segmented thermally conductive channels 917 (e.g., segmented anisotropic thermally conductive channels). The first thermally conductive layer 1005 is coupled to the second thermally conductive layer 915 (e.g., by using an adhesive). In some implementations, the first thermally conductive layer 1005 is coupled to the second thermally conductive layer 915 through the thermally insulating material 710.

[0067] The first plurality of segmented heat-conducting channels 1007 and the second plurality of segmented heat-conducting channels 917 are part of the plurality of segmented heat-conducting channels of the heat-conducting layer 1000. The first plurality of segmented heat-conducting channels 1007 are aligned in the diagonal direction of the X"-Y" plane. For example, the lengths of the first plurality of segmented heat-conducting channels 1007 are aligned in the diagonal direction of the X"-Y" plane. The first plurality of segmented heat-conducting channels 1007 are configured to first provide heat transfer (e.g., provide a high first-direction thermal conductivity value) primarily along the diagonal direction of the X"-Y" plane. The second plurality of segmented heat-conducting channels 917 are aligned in the X" direction of the X"-Y" plane. For example, the lengths of the second plurality of segmented heat-conducting channels 917 are aligned in the X" direction of the X"-Y" plane. The second plurality of segmented thermally conductive channels 917 are configured to primarily provide heat transfer (e.g., provide a high second-direction thermal conductivity value) along the X” direction of the X”-Y” plane. The diagonal direction (e.g., the second direction) can be orthogonal with respect to the X” direction (e.g., the first direction).

[0068] The segmented heat-conducting channel 1007 is configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel, a diagonal direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, a second direction, another diagonal direction). The segmented heat-conducting channel 917 is configured to (i) provide high thermal conductivity along a third direction (e.g., the length of the channel, the X” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, a fourth direction, the Y” direction).

[0069] This configuration and / or arrangement of multiple segmented thermally conductive channels may be used when heat transfer in a particular direction and / or toward a particular location (eg, heat dissipation) is desired.

[0070] Thermally conductive layer 1000 may be directly or indirectly coupled to integrated device 205 and / or integrated device 215. Fig.10 As shown in , the thermal conductive layer 1000 is positioned over the region including the integrated device 205 and / or the integrated device 215 in such a manner that (i) heat transfer (e.g., heat dissipation) in a first region including the integrated device 205 occurs primarily along the diagonal direction of the X"-Y" plane and (ii) heat transfer (e.g., heat dissipation) in a second region including the integrated device 215 occurs primarily along the X" direction of the X"-Y" plane. It should be noted that in the portion(s) of the thermal conductive layer 1000 above the integrated device 205 and / or the integrated device 215, there may be heat transfer capability in the Z" direction (orthogonal to both the Y" direction and the X" direction).

[0071] Fig.11A plan view of a thermally conductive layer 1100 including a first thermally conductive layer 1125, a second thermally conductive layer 1135, a third thermally conductive layer 1145, a fourth thermally conductive layer 1155, thermally insulating material 710, thermally insulating material 1110, and thermally insulating material 1111 is illustrated. The first thermally conductive layer 1125 may be a first portion of the thermally conductive layer 1100. The second thermally conductive layer 1135 may be a second portion of the thermally conductive layer 1100. The third thermally conductive layer 1145 may be a third portion of the thermally conductive layer 1100. The fourth thermally conductive layer 1155 may be a fourth portion of the thermally conductive layer 1100. The first thermally conductive layer 1125 includes a first plurality of segmented thermally conductive channels 1127 (e.g., segmented anisotropic thermally conductive channels). The second thermally conductive layer 1135 includes a second plurality of segmented thermally conductive channels 1137 (e.g., segmented anisotropic thermally conductive channels). The third thermally conductive layer 1145 includes a third plurality of segmented thermally conductive channels 1147 (e.g., segmented anisotropic thermally conductive channels). The fourth thermally conductive layer 1155 includes a fourth plurality of segmented thermally conductive channels 1157 (e.g., segmented anisotropic thermally conductive channels). The first thermally conductive layer 1125 is coupled to the second thermally conductive layer 1135 and the third thermally conductive layer 1145 through the thermally insulating material 710. The second thermally conductive layer 1135 is coupled to the third thermally conductive layer 1145 through the thermally insulating material 1110. The first thermally conductive layer 1125 is coupled to the fourth thermally conductive layer 1155 through the thermally insulating material 1111. The third thermally conductive layer 1145 is coupled to the fourth thermally conductive layer 1155 through the thermally insulating material 710. It should be noted that Fig.11 The thermal insulation material shown in FIG. 1 is optional. In some implementations, a portion of the thermally conductive layer 1100 can be coupled to another portion of the thermally conductive layer 1100 by an adhesive.

[0072] The first plurality of segmented heat-conducting channels 1127 are aligned in a first diagonal direction of the X"-Y" plane. For example, the lengths of the first plurality of segmented heat-conducting channels 1127 are aligned in a first diagonal direction of the X"-Y" plane. The first plurality of segmented heat-conducting channels 1127 are configured to first provide heat transfer (e.g., provide a high first-direction thermal conductivity value) primarily along the first diagonal direction of the X"-Y" plane. The second plurality of segmented heat-conducting channels 1137 are aligned in the X" direction of the X"-Y" plane. For example, the lengths of the second plurality of segmented heat-conducting channels 1137 are aligned in the X" direction of the X"-Y" plane. The second plurality of segmented heat-conducting channels 1137 are configured to first provide heat transfer (e.g., provide a high second-direction thermal conductivity value) primarily along the X" direction of the X"-Y" plane. The third plurality of segmented heat-conducting channels 1147 are aligned in the X" direction of the X"-Y" plane. For example, the lengths of the third plurality of segmented thermally conductive channels 1147 are aligned in the X” direction of the X”-Y” plane. The third plurality of segmented thermally conductive channels 1147 are configured to first provide heat transfer (e.g., provide a high third-direction thermal conductivity value) primarily along the X” direction of the X”-Y” plane. The fourth plurality of segmented thermally conductive channels 1157 are aligned in a second diagonal direction of the X”-Y” plane. For example, the lengths of the fourth plurality of segmented thermally conductive channels 1157 are aligned in the second diagonal direction of the X”-Y” plane. The fourth plurality of segmented thermally conductive channels 1157 are configured to first provide heat transfer (e.g., provide a high fourth-direction thermal conductivity value) primarily along the second diagonal direction of the X”-Y” plane. The second diagonal direction may be the same direction or a different direction from the first diagonal direction. The first diagonal direction (e.g., the second direction) may be diagonal relative to the X” direction (e.g., the first direction) and / or the Y” direction. The second diagonal direction (eg, the second direction) may be diagonal relative to the X" direction (eg, the first direction) and / or the Y" direction.

[0073] The segmented heat-conducting channel 1127 is configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel, the first diagonal direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the second direction, the second diagonal direction). The segmented heat-conducting channel 1137 is configured to (i) provide high thermal conductivity along a third direction (e.g., the length of the channel, the X” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y” direction). The segmented heat-conducting channel 1147 is configured to (i) provide high thermal conductivity along a third direction (e.g., the length of the channel, the X” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y” direction). The segmented thermally conductive channel 1157 is configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel, a first diagonal direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, a second direction, a second diagonal direction).

[0074] This configuration and / or arrangement of multiple segmented thermally conductive channels may be used when heat transfer in a particular direction and / or toward a particular location (eg, heat dissipation) is desired.

[0075] Thermally conductive layer 1100 may be directly or indirectly coupled to integrated device 205, integrated device 215, component 1105, and / or component 1115. Fig.11 As shown in , the thermal conductive layer 1000 is positioned over the (device) region including the integrated device 205, the integrated device 215, the assembly 1105 and the assembly 1115 in the following manner so that (i) in the first region including the integrated device 205, heat transfer (e.g., heat dissipation) first occurs mainly along the first diagonal direction of the X"-Y" plane, (ii) in the second region including the integrated device 215, heat transfer (e.g., heat dissipation) first occurs mainly along the X" direction of the X"-Y" plane, (iii) in the third region including the assembly 1115, heat transfer (e.g., heat dissipation) first occurs mainly along the X" direction of the X"-Y" plane, and (iv) in the fourth region including the assembly 1105, heat transfer (e.g., heat dissipation) first occurs mainly along the first diagonal direction of the X"-Y" plane. It should be noted that in the portion(s) of thermally conductive layer 1100 above integrated device 205, integrated device 215, assembly 1105 and / or assembly 1115, there may be heat transfer capability in the Z" direction (orthogonal to both the Y" and X" directions).

[0076] Fig.12A plan view of a thermally conductive layer 1200 including a first thermally conductive layer 1225, a second thermally conductive layer 1135, a third thermally conductive layer 1245, a fourth thermally conductive layer 1155, thermally insulating material 710, thermally insulating material 1110, and thermally insulating material 1111 is illustrated. The first thermally conductive layer 1225 may be a first portion of the thermally conductive layer 1200. The second thermally conductive layer 1135 may be a second portion of the thermally conductive layer 1200. The third thermally conductive layer 1245 may be a third portion of the thermally conductive layer 1200. The fourth thermally conductive layer 1155 may be a fourth portion of the thermally conductive layer 1200. The first thermally conductive layer 1225 includes a first plurality of segmented thermally conductive channels 1227 (e.g., segmented anisotropic thermally conductive channels). The second thermally conductive layer 1135 includes a second plurality of segmented thermally conductive channels 1137 (e.g., segmented anisotropic thermally conductive channels). The third thermally conductive layer 1245 includes a third plurality of segmented thermally conductive channels 1247 (e.g., segmented anisotropic thermally conductive channels). The fourth thermally conductive layer 1155 includes a fourth plurality of segmented thermally conductive channels 1157 (e.g., segmented anisotropic thermally conductive channels). The first thermally conductive layer 1225 is coupled to the second thermally conductive layer 1135 and the third thermally conductive layer 1245 through the thermally insulating material 710. The second thermally conductive layer 1135 is coupled to the third thermally conductive layer 1245 through the thermally insulating material 1110. The first thermally conductive layer 1225 is coupled to the fourth thermally conductive layer 1155 through the thermally insulating material 1111. The third thermally conductive layer 1245 is coupled to the fourth thermally conductive layer 1155 through the thermally insulating material 710. It should be noted that Fig.12 The insulating material(s) shown in are optional. In some implementations, a portion of the thermally conductive layer 1200 can be coupled to another portion of the thermally conductive layer 1200 by an adhesive.

[0077] The first plurality of segmented heat conductive channels 1227 are aligned in the second diagonal direction of the X"-Y" plane. For example, the lengths of the first plurality of segmented heat conductive channels 1227 are aligned in the second diagonal direction of the X"-Y" plane. The first plurality of segmented heat conductive channels 1227 are configured to first provide heat transfer (e.g., provide a high first direction thermal conductivity value) mainly along the second diagonal direction of the X"-Y" plane. The second plurality of segmented heat conductive channels 1137 are aligned in the X" direction of the X"-Y" plane. For example, the lengths of the second plurality of segmented heat conductive channels 1137 are aligned in the X" direction of the X"-Y" plane. The second plurality of segmented heat conductive channels 1137 are configured to first provide heat transfer (e.g., provide a high second direction thermal conductivity value) mainly along the X" direction of the X"-Y" plane. The third plurality of segmented heat conductive channels 1247 are aligned in the Y" direction of the X"-Y" plane. For example, the lengths of the third plurality of segmented thermally conductive channels 1247 are aligned in the Y” direction of the X”-Y” plane. The third plurality of segmented thermally conductive channels 1247 are configured to first provide heat transfer (e.g., provide a high third-direction thermal conductivity value) primarily along the Y” direction of the X”-Y” plane. The fourth plurality of segmented thermally conductive channels 1157 are aligned in a first diagonal direction of the X”-Y” plane. For example, the lengths of the fourth plurality of segmented thermally conductive channels 1157 are aligned in a first diagonal direction of the X”-Y” plane. The fourth plurality of segmented thermally conductive channels 1157 are configured to first provide heat transfer (e.g., provide a high fourth-direction thermal conductivity value) primarily along the first diagonal direction of the X”-Y” plane. The second diagonal direction may be a direction different from the first diagonal direction. The first diagonal direction and / or the second diagonal direction may be diagonal relative to the X” direction and / or the Y” direction.

[0078] The segmented heat-conducting channel 1227 is configured to (i) provide high thermal conductivity along a second direction (e.g., the length of the channel, the second diagonal direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the first direction, the first diagonal direction). The segmented heat-conducting channel 1137 is configured to (i) provide high thermal conductivity along a third direction (e.g., the length of the channel, the X” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the fourth direction, the Y” direction). The segmented heat-conducting channel 1247 is configured to (i) provide high thermal conductivity along a fourth direction (e.g., the length of the channel, the Y” direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the third direction, the X” direction). The segmented thermally conductive channel 1157 is configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel, a first diagonal direction), and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, a second direction, a second diagonal direction).

[0079] This configuration and / or arrangement of multiple segmented thermally conductive channels may be used when heat transfer in a particular direction and / or toward a particular location (eg, heat dissipation) is desired.

[0080] Thermally conductive layer 1200 may be directly or indirectly coupled to integrated device 205, integrated device 215, component 1105, and / or component 1115. Fig.12 As shown in , the thermal conductive layer 1000 is positioned over the region including the integrated device 205, the integrated device 215, the assembly 1105, and the assembly 1115 in the following manner so that (i) in the first region including the integrated device 205, heat transfer (e.g., heat dissipation) first occurs mainly along the second diagonal direction of the X"-Y" plane, (ii) in the second region including the integrated device 215, heat transfer (e.g., heat dissipation) first occurs mainly along the X" direction of the X"-Y" plane, (iii) in the third region including the assembly 1115, heat transfer (e.g., heat dissipation) first occurs mainly along the Y" direction of the X"-Y" plane, and (iv) in the fourth region including the assembly 1105, heat transfer (e.g., heat dissipation) first occurs mainly along the first diagonal direction of the X"-Y" plane. It should be noted that in the portion(s) of thermally conductive layer 1200 above integrated device 205, integrated device 215, assembly 1105 and / or assembly 1115, there may be heat transfer capability in the Z" direction (orthogonal to both the Y" and X" directions).

[0081] It should be noted that the use of the term direction (eg, X" direction, Y" direction, X' direction, Y' direction) in the present disclosure may mean a positive direction and / or a negative direction. Figure 3 The heat conductive layer 330 or the combination thereof Figure 5-12 The thermal conductive layer includes segmented thermal conductive channels. Figure 6 -12 illustrates how a thermally conductive layer including segmented thermally conductive channels can be used to control how and / or where heat is dissipated in a device. It should be noted that other implementations may use other configurations and / or arrangements of segmented anisotropic thermally conductive channels.

[0082] Fig.13 and 14 Exemplary temperature graphs and / or heat maps showing temperatures at junctions of components configured to generate heat are illustrated. Fig.13 An exemplary junction temperature graph 1300 for a device that does not include a thermally conductive layer including a plurality of segmented thermally conductive channels is illustrated. The junction temperature graph 1300 includes the junction temperature at the integrated device 205 and the junction temperature at the integrated device 215. Fig.13 As shown in , when the device does not include a thermally conductive layer including a plurality of segmented thermally conductive channels, the junction temperature at the integrated device 205 and the junction temperature at the integrated device 215 can reach 100 degrees Celsius.

[0083] Fig.14 An exemplary junction temperature graph 1400 of a device including a thermally conductive layer including a plurality of segmented thermally conductive channels is illustrated. The junction temperature graph 1400 includes the junction temperature at the integrated device 205 and the junction temperature at the integrated device 215. Fig.14 As shown in , when the device includes a thermally conductive layer including a plurality of segmented thermally conductive channels, the junction temperature at the integrated device 205 and the junction temperature at the integrated device 215 can reach 93 degrees Celsius.

[0084] Therefore, if Fig.13 and 14 As shown in , using a thermally conductive layer including multiple segmented thermally conductive channels (e.g., segmented anisotropic thermally conductive channels) helps reduce the junction temperature of the integrated device, which helps prevent the integrated device from overheating. This can lead to better performance of the integrated device and / or equipment including these integrated devices.

[0085] Fig.15 and 16 Exemplary temperature graphs and / or heat maps showing temperatures at display points of a device are illustrated. Fig.15 An exemplary display surface temperature graph 1500 for a device that does not include a thermally conductive layer including a plurality of segmented thermally conductive channels is illustrated. Display surface temperature graph 1500 includes a display surface temperature over integrated device 205 and a display surface temperature over integrated device 215. Fig.15 As shown in , when the device does not include a thermally conductive layer including a plurality of segmented thermally conductive channels, the display surface temperature above the integrated device 205 and the display surface temperature above the integrated device 215 can reach 52 degrees Celsius.

[0086] Fig.16 An exemplary display surface temperature graph 1600 of a device including a thermally conductive layer including a plurality of segmented thermally conductive channels is illustrated. Display surface temperature graph 1600 includes a display surface temperature over integrated device 205 and a display surface temperature over integrated device 215 . Fig.15 Explains how the display surface temperature can be reduced by using a thermally conductive layer including a plurality of segmented thermally conductive channels (eg, segmented anisotropic thermally conductive channels). Fig.16 As shown in , when the device includes a thermally conductive layer including a plurality of segmented thermally conductive channels, the display surface temperature above the integrated device 205 and the display surface temperature above the integrated device 215 can reach 44 degrees Celsius. Fig.16 It is illustrated that more of the heat generated by integrated device 205 and integrated device 215 is spread over a larger surface with the help of the thermally conductive pathways, which helps reduce the surface temperature of the device (eg, display surface temperature). Fig.16 It also explains how thermally conductive channels help thermally decouple two adjacent integrated devices. Thermally conductive channels help keep heat in a channel away from another adjacent integrated device.

[0087] Therefore, if Fig.15 and 16 As shown in , using a thermally conductive layer including multiple segmented thermally conductive channels (e.g., segmented anisotropic thermally conductive channels) helps reduce the display surface temperature of the device, which helps make the device more comfortable to hold and handle. It should be noted that Figure 13-16 The explanation is merely exemplary. Figure 13-16 The values ​​used in are exemplary and are used to illustrate the performance advantages of a thermally conductive layer including a plurality of segmented thermally conductive channels. Different implementations may provide different results and performance in heat maps and temperature maps, depending on the use, location, configuration, size, shape and / or arrangement of a thermally conductive layer including a plurality of segmented thermally conductive channels.

[0088] Exemplary process for making a thermally conductive layer including thermally conductive channels

[0089] Fig.17 Exemplary processes for providing or manufacturing a thermally conductive layer including a thermally conductive channel are described. In some implementations, Fig.17 The process may be used to provide or manufacture the thermally conductive layer 500 described in the present disclosure.

[0090] It should be noted that Fig.17 The process of the present invention can combine one or more stages to simplify and / or clarify the process for providing or manufacturing the thermally conductive layer. In some implementations, the order of the processes can be changed or modified. In some implementations, one or more of these processes can be replaced or substituted without departing from the spirit of the present disclosure.

[0091] like Fig.17 As shown in , stage 1 illustrates a state after providing a plurality of thermally conductive sheets 400. The plurality of thermally conductive sheets 400 include graphite (e.g., graphite sheets). Each thermally conductive sheet 400 may be anisotropically thermally conductive along a plane. The thermally conductive sheet 400 is configured to provide heat transfer capability (e.g., heat dissipation) primarily along a plane (e.g., an X'-Y' plane). There is little or no heat transfer capability in the Z' direction.

[0092] Stage 2 illustrates a state after stacking, laminating and bonding multiple thermally conductive layers to form a laminated block 1700 of thermally conductive sheets. Multiple thermally conductive sheets may be bonded together using at least one adhesive to form a laminated block 1700 of thermally conductive sheets. The laminated block 1700 of thermally conductive sheets is configured to provide heat transfer capabilities (e.g., heat dissipation) primarily along a plane (e.g., an X'-Y' plane). There is little or no heat transfer capability in the Z' direction. Each sheet in the laminated block 1700 of thermally conductive sheets is configured to provide heat transfer capabilities (e.g., heat dissipation) primarily along a plane (e.g., an X'-Y' plane).

[0093] Stage 3 illustrates a state after the laminated block 1700 of the thermally conductive sheet is cut (e.g., sliced) to form individual thermally conductive layers 500 including a plurality of segmented thermally conductive channels 502. The laminated block 1700 of the thermally conductive sheet is cut along various Y'-Z' planes of the laminated block 1700 of the thermally conductive sheet to form individual thermally conductive layers 500. The plurality of segmented thermally conductive channels 502 may be coplanar with each other. The plurality of segmented thermally conductive channels 502 are aligned in the Y' direction. For example, the lengths of the plurality of segmented thermally conductive channels 502 are aligned in the Y' direction. The plurality of segmented thermally conductive channels 502 are configured to primarily (e.g., provide high thermal conductivity values) provide heat transfer capabilities (e.g., heat dissipation) along the Y' direction and / or along the lengths of the plurality of segmented thermally conductive channels 502. Thermally conductive layer 500 includes segmented thermally conductive channels 502 configured to (i) provide high thermal conductivity along a first direction (e.g., the length of the channel, the Y direction) and (ii) provide low thermal conductivity along another direction (e.g., the width of the channel, the second direction, the Z direction).

[0094] Exemplary process for making a thermally conductive layer including thermally conductive channels

[0095] Fig.18 Exemplary processes for providing or manufacturing a thermally conductive layer including thermally conductive channels aligned in different directions are described. In some implementations, Fig.18 The process may be used to provide or manufacture the thermally conductive layer 1200 described in the present disclosure. However, Fig.18 The process may be used to provide any thermally conductive layer described in the present disclosure.

[0096] It should be noted that Fig.18 The process of the present invention can combine one or more stages to simplify and / or clarify the process for providing or manufacturing the thermally conductive layer. In some implementations, the order of the processes can be changed or modified. In some implementations, one or more of these processes can be replaced or substituted without departing from the spirit of the present disclosure.

[0097] like Fig.18 As shown in , stage 1 illustrates a state after providing several thermally conductive layers (e.g., 1815, 1805, 1835, 1825). Each thermally conductive layer includes a plurality of segmented anisotropic thermally conductive channels aligned in different directions (e.g., a first direction, a second direction, a first diagonal direction, a second diagonal direction). In some implementations, some thermally conductive layers may include thermally conductive channels aligned in the same direction as thermally conductive channels in other thermally conductive layers. The thermally conductive layers may have the same, similar, and / or different shapes and / or sizes. Fig.18 An example of fabricating a thermally conductive layer including a plurality of segmented anisotropic thermally conductive channels is illustrated.

[0098] Stage 2 illustrates the state after several layers have been combined by using thermal insulation materials. The first heat-conducting layer 1805 is coupled to the second heat-conducting layer 1815 and the third heat-conducting layer 1825 by the thermal insulation material 710. The second heat-conducting layer 1815 is coupled to the third heat-conducting layer 1825 by the thermal insulation material 1110. The first heat-conducting layer 1205 is coupled to the fourth heat-conducting layer 1835 by the thermal insulation material 1111. The third heat-conducting layer 1825 is coupled to the fourth heat-conducting layer 1835 by the thermal insulation material 710. It should be noted that the thermal insulation material shown is optional. In some implementations, a part of the heat-conducting layer can be coupled to another part of the heat-conducting layer and / or the thermal insulation material by an adhesive (e.g., glue, bonding agent). It should be noted that other methods and / or materials can be used to couple a part of the heat-conducting layer to another part of the heat-conducting layer and / or the thermal insulation material.

[0099] Exemplary flow chart of a method for coupling a thermally conductive layer including a thermally conductive channel

[0100] Fig.19 An exemplary flow chart of a method 1900 for manufacturing a thermally conductive layer including a plurality of segmented thermally conductive channels is illustrated. In some implementations, Fig.19 The method 1900 may be used to manufacture the thermally conductive layer 1200. However, the method 1900 may be used to manufacture any thermally conductive layer described in the present disclosure.

[0101] It should be noted that Fig.19 The method 1900 may combine one or more processes to simplify and / or clarify the method for manufacturing a thermally conductive layer. In some implementations, the order of the processes may be changed or modified.

[0102] The method provides (at 1905) a plurality of thermally conductive sheets 400 (e.g., anisotropic thermally conductive sheets). The plurality of thermally conductive sheets 400 include graphite (e.g., graphite layers). Each thermally conductive sheet 400 may be anisotropically thermally conductive along a plane. The thermally conductive sheet 400 is configured to primarily provide heat transfer capability (e.g., heat dissipation) along a plane (e.g., an X'-Y' plane). The thermally conductive layer has little or no heat transfer capability in the Z' direction. Fig.17 Stage 1 of FIG. 1 illustrates an example of multiple thermally conductive layers.

[0103] The method (at 1910) couples a plurality of thermally conductive sheets by using stacking, lamination, and bonding to form a laminated block 1700 of thermally conductive sheets. A plurality of thermally conductive sheets may be bonded together using at least one adhesive to form the laminated block 1700 of thermally conductive sheets. The laminated block 1700 of thermally conductive sheets is configured to primarily provide heat transfer capability (e.g., heat dissipation) along a plane (e.g., an X'-Y' plane). The laminated block 1700 of thermally conductive sheets has little or no heat transfer capability in the Z' direction. Each layer in the laminated block 1700 of thermally conductive sheets is configured to primarily provide heat transfer capability (e.g., heat dissipation) along a plane (e.g., an X'-Y' plane). Fig.17 Stage 2 of FIG. 1 illustrates an example of a laminated block of thermally conductive sheets.

[0104] The method (at 1915) cuts the laminated block 1700 of the thermally conductive sheet into individual thermally conductive layers 500 including a plurality of segmented thermally conductive channels 502. The laminated block 1700 of the thermally conductive sheet is cut along various Y'-Z' planes of the laminated block 1700 of the thermally conductive sheet to form individual thermally conductive layers 500. The plurality of segmented thermally conductive channels 502 are aligned in the Y' direction. The plurality of segmented thermally conductive channels 502 are configured to primarily provide heat transfer capabilities (e.g., heat dissipation) along the Y' direction. Fig.17 Stage 3 of FIG. 1 illustrates an example of multiple segmented thermal paths.

[0105] The method (at 1920) couples several layers by using thermally insulating materials. For example, the first thermally conductive layer 1225 is coupled to the second thermally conductive layer 1135 and the third thermally conductive layer 1245 through the thermally insulating material 710. The second thermally conductive layer 1135 is coupled to the third thermally conductive layer 1245 through the thermally insulating material 1110. The first thermally conductive layer 1225 is coupled to the fourth thermally conductive layer 1155 through the thermally insulating material 1111. The third thermally conductive layer 1245 is coupled to the fourth thermally conductive layer 1155 through the thermally insulating material 710. It should be noted that the thermally insulating material shown is optional. In some implementations, a portion of the thermally conductive layer can be coupled to another portion of the thermally conductive layer and / or the thermally insulating material through an adhesive. It should be noted that the use of one or more thermally insulating materials is optional. Fig.18 Phase 2 of FIG. 1 illustrates an example of coupling different layers together.

[0106] It should be noted that in this disclosure, a number of coordinate systems (XYZ, X'-Y'-Z', X"-Y"-Z") are used and described. These exemplary coordinate systems are used to help illustrate the anisotropic thermal properties of the thermally conductive layer and / or the segmented thermally conductive channel. These different coordinate systems can be independent of each other, or they can be related to one or more coordinate systems. Other coordinate systems can be used to illustrate direction, orientation, and / or alignment.

[0107] Exemplary Electronic Devices

[0108] Fig. 20 Various electronic devices that may be integrated with any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, package-on-package (PoP), system-in-package (SiP), or systems-on-chip (SoC) are illustrated. For example, a mobile phone device 2002, a laptop computer device 2004, a fixed location terminal device 2006, a wearable device 2008, or a motor vehicle 2010 may include a device 2000 as described herein. The device 2000 may be, for example, any of the devices and / or integrated circuit (IC) packages described herein. Fig. 20 The devices 2002, 2004, 2006, and 2008, and the vehicle 2010 illustrated in the figure are merely exemplary. Other electronic devices can also feature the device 2000, including, but not limited to, a group of devices (e.g., electronic devices) including: mobile devices, handheld personal communication system (PCS) units, portable data units (such as personal digital assistants), devices enabled with a global positioning system (GPS), navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units (such as meter reading equipment), communication devices, smart phones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0109] Figure 3-12 and / or Figure 17-20 One or more of the components, processes, features, and / or functions described herein may be rearranged and / or combined into a single component, process, feature, or function, or implemented in several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the present disclosure. It should also be noted that Figure 3-12 and / or 17-20 and their corresponding descriptions in this disclosure are not limited to die and / or IC. In some implementations, Figure 3-12 and / or Figure 17-20 The invention and its corresponding description may be used to manufacture, create, provide, and / or produce an apparatus and / or an integrated device. In some implementations, the device may include a die, an integrated device, an integrated passive device (IPD), a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat sink, and / or an interposer.

[0110] Note that the drawings in this disclosure may represent actual representations and / or conceptual representations of various components, assemblies, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some instances, the drawings may not be to scale. In some instances, for clarity, not all components and / or parts are shown. In some instances, the positioning, location, size, and / or shape of the various components and / or assemblies in the drawings may be exemplary. In some implementations, the various components and / or parts in the drawings may be optional.

[0111] The wording "exemplary" is used herein to mean "serving as an example, instance, or illustration". Any implementation or aspect described herein as "exemplary" is not necessarily to be construed as superior or superior to other aspects of the present disclosure. Likewise, the term "aspect" does not require that all aspects of the present disclosure include the discussed features, advantages, or modes of operation. The term "coupling" is used herein to refer to a direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A physically contacts object B, and object B contacts object C, objects A and C can still be considered to be coupled to each other - even if they are not in direct physical contact with each other. The term "electrical coupling" may mean that two objects are coupled together directly or indirectly so that current (e.g., signal, power, ground) can be transferred between the two objects. Two electrically coupled objects may or may not have current transfer between the two objects. Electromagnetic coupling may mean that a signal from one circuit and / or component affects a signal from another circuit and / or component. Electromagnetic coupling may cause crosstalk. Electromagnetic coupling may be in the form of signal coupling. The use of the terms "first", "second", "third", and "fourth" (and / or anything higher than the fourth) is arbitrary. Any component described may be a first component, a second component, a third component, or a fourth component. For example, a component referred to as a second component may be a first component, a second component, a third component, or a fourth component. The terms "top" and "bottom" are arbitrary. A component located at the top may be located above a component located at the bottom. A top component may be considered a bottom component, and vice versa. As described in the present disclosure, a first component located "above" a second component may mean that the first component is located above or below the second component, depending on how the bottom or top is arbitrarily defined. In another example, a first component may be located above (e.g., above) a first surface of a second component, and a third component may be located above (e.g., below) a second surface of the second component, wherein the second surface is opposite to the first surface. Further note that the term "above" as used in the context of a component being located above another component in the present application may be used to indicate that a component is on and / or in another component (e.g., on the surface of a component or embedded in a component). Thus, for example, a first component is above a second component may mean: (1) the first component is above the second component, but not directly contacting the second component; (2) the first component is on (e.g., on a surface of) the second component; and / or (3) the first component is in (e.g., embedded in) the second component. The term "encloses" means that an object may partially enclose or completely enclose another object. The term "surrounds" means that the object(s) may partially surround or completely surround another object. The term "extends through" means that an object may partially extend or completely extend through another object.Further note that the term "above" as used in the context of one component being above another component in this application may be used to indicate that a component is on and / or in (e.g., on a surface of or embedded in) another component. Thus, for example, a first component being above a second component may mean: (1) the first component is above, but not directly contacting, the second component; (2) the first component is on (e.g., on a surface of) the second component; and / or (3) the first component is in (e.g., embedded in) the second component. A first component that is "in" a second component may be partially in or completely in the second component. As used in this disclosure, the term "about 'value X'" or "approximately value X" means within ten percent of 'value X'. For example, a value of about 1 or approximately 1 would mean a value in the range of 0.9-1.1.

[0112] In some implementations, interconnection is an element or component that allows or facilitates electrical connection between two points, elements and / or components in a device or package. In some implementations, interconnection may include traces, through holes, pads, solder posts, redistribution metal layers, and / or under bump metallization (UBM) layers. Interconnection may include one or more metal components (e.g., seed layer+metal layer). In some implementations, interconnection may include a conductive material that can be configured to provide an electrical path for a signal (e.g., data signal), grounding and / or power. Interconnection may be part of a circuit. Interconnection may include more than one element or component. Interconnection may be defined by one or more interconnections. Different implementations may use different processes and / or procedures to form interconnection. In some implementations, chemical vapor deposition (CVD) processes, physical vapor deposition (PVD) processes, sputtering processes, spraying, and / or electroplating processes may be used to form interconnection.

[0113] It should also be noted that the various disclosures contained herein may be described as processes depicted as flow charts, flow diagrams, structure diagrams, or block diagrams. Although a flow chart may describe an operation as a sequential process, many operations may be performed in parallel or concurrently. In addition, the order of the operations may be rearranged. A process terminates when its operations are completed.

[0114] Further examples are described below to facilitate understanding of the present disclosure.

[0115] Aspect 1: An apparatus includes: a region including a component configured to generate heat; and a thermally conductive layer coupled to the region, wherein the thermally conductive layer includes a plurality of segmented anisotropic thermally conductive channels.

[0116] Aspect 2: The apparatus of aspect 1, wherein at least one segmented anisotropic thermally conductive channel among the plurality of segmented anisotropic thermally conductive channels is aligned in a first direction.

[0117] Aspect 3: The apparatus of aspect 2, wherein each segmented anisotropic thermally conductive channel of the plurality of segmented anisotropic thermally conductive channels is configured to provide high thermal conductivity in a first direction and low thermal conductivity in a second direction.

[0118] Aspect 4: The apparatus of aspects 2 to 3, wherein the thermally conductive layer comprises at least one adhesive bonding the plurality of segmented anisotropic thermally conductive channels.

[0119] Aspect 5: The apparatus of Aspect 4, wherein the plurality of segmented anisotropic thermally conductive channels include a first segmented anisotropic thermally conductive channel and a second segmented anisotropic thermally conductive channel, and wherein the at least one adhesive is located between at least the first segmented anisotropic thermally conductive channel and the second segmented anisotropic thermally conductive channel.

[0120] Aspect 6: The apparatus of aspect 1, wherein a first plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels are aligned in a first direction, and wherein a second plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels are aligned in a second direction.

[0121] Aspect 7: The apparatus of Aspect 6, wherein each segmented anisotropic thermally conductive channel of the first plurality of segmented anisotropic thermally conductive channels is configured to provide a high first thermal conductivity value in a first direction, and wherein each segmented anisotropic thermally conductive channel of the second plurality of segmented anisotropic thermally conductive channels is configured to provide a high second thermal conductivity value in a second direction.

[0122] Aspect 8: The apparatus of any of aspects 6 to 7, wherein the second direction is orthogonal to the first direction.

[0123] Aspect 9: The apparatus of aspects 6 to 7, wherein the second direction is diagonal to the first direction.

[0124] Aspect 10: The apparatus of aspect 1, wherein the segmented anisotropic thermally conductive channels of the plurality of segmented anisotropic thermally conductive channels are configured to provide high thermal conductivity along the length of the segmented anisotropic thermally conductive channels.

[0125] Aspect 11: The apparatus of aspect 10, wherein the anisotropic thermally conductive channel comprises an anisotropic thermally conductive material configured to provide high thermal conductivity along a first direction.

[0126] Aspect 12: The apparatus of aspect 11, wherein the anisotropic thermally conductive material has a high thermal conductivity value in a first direction, and wherein the anisotropic thermally conductive material has a low thermal conductivity value in at least a second direction.

[0127] Aspect 13: The apparatus of aspect 12, wherein the first direction is along a length of the anisotropic thermally conductive channel, and wherein the second direction is along a width of the anisotropic thermally conductive channel.

[0128] Aspect 14: A device as in Aspects 12 to 13, wherein the thermally conductive material comprises a thermal conductivity value in the range of approximately 1000-1900 Watts per meter Kelvin (W / (mk)) in the first direction, and wherein the thermally conductive material comprises a thermal conductivity value of less than 30 Watts per meter Kelvin (W / (mk)) in the second direction.

[0129] Aspect 15: A device as in Aspect 1, wherein the thermally conductive layer comprises: a first portion, the first portion comprising a first plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels; a second portion, the second portion comprising a second plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels; and a thermally insulating material coupled to the first portion and the second portion.

[0130] Aspect 16: The apparatus of aspect 15, wherein the first plurality of segmented anisotropic thermally conductive channels are aligned in a first direction, and wherein the second plurality of segmented anisotropic thermally conductive channels are aligned in a second direction.

[0131] Aspect 17: The apparatus of aspects 15 to 16, wherein the thermally insulating material comprises aerogel, and / or wherein the thermally conductive layer comprises graphite.

[0132] Aspect 18: The apparatus of aspects 1 to 17, wherein the region comprises a first integrated device, wherein the assembly comprises a second integrated device, and wherein the thermally conductive layer is configured to thermally decouple the first integrated device from the second integrated device.

[0133] Aspect 19: A device as in Aspects 1 to 18, wherein the device is configured to provide wireless fidelity (WiFi) communication and / or cellular communication, wherein the thermally conductive layer including the multiple segmented thermally conductive channels is configured to reduce the junction temperature of the component, and wherein the thermally conductive layer including the multiple segmented thermally conductive channels is further configured to reduce the surface temperature of the device.

[0134] Aspect 20: A device as in Aspects 1 to 19, wherein the device is selected from the group consisting of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in a motor vehicle.

[0135] Aspect 21: An apparatus comprising: a region including a first integrated device configured to generate heat and a second integrated device configured to generate heat. The apparatus comprises means for segmented anisotropic heat transfer coupled to the region.

[0136] Aspect 22: An apparatus as in Aspect 21, wherein the means for segmented anisotropic heat transfer comprises a plurality of anisotropic thermally conductive channels aligned in a first direction, and wherein each of the plurality of anisotropic thermally conductive channels is configured to provide high heat transfer capability in the first direction and to provide low heat transfer capability in a direction parallel to a width of the anisotropic thermally conductive channel.

[0137] Aspect 23: An apparatus as in Aspect 21, wherein the means for segmented anisotropic heat transfer comprises: a plurality of first anisotropic heat conductive channels aligned in a first direction, and a plurality of second anisotropic heat conductive channels aligned in a second direction, wherein each of the plurality of first anisotropic heat conductive channels is configured to provide high heat transfer capability along the length of the first anisotropic heat conductive channel, and wherein each of the plurality of second anisotropic heat conductive channels is configured to provide high heat transfer capability along the length of the second anisotropic heat conductive channel.

[0138] Aspect 24: An apparatus as in Aspect 23, wherein the device for segmented anisotropic heat transfer includes an insulating material, wherein the plurality of first anisotropic thermally conductive channels are part of a first portion of the device for segmented anisotropic heat transfer, wherein the plurality of second anisotropic thermally conductive channels are part of a second portion of the device for segmented anisotropic heat transfer, and wherein the first portion is coupled to the second portion via the insulating material.

[0139] Aspect 25: An apparatus as in Aspect 21, wherein the means for segmented anisotropic heat transfer comprises a plurality of anisotropic thermally conductive channels aligned in a first direction, wherein the plurality of anisotropic thermally conductive channels have a high thermal conductivity value along a length of the plurality of anisotropic thermally conductive channels, and wherein the plurality of anisotropic thermally conductive channels have a low thermal conductivity value in a direction parallel to a width of one or more of the anisotropic thermally conductive channels.

[0140] Aspect 26: The apparatus of aspects 21 to 25, wherein the means for segmented anisotropic heat transfer is configured to reduce a junction temperature of the first integrated device and the second integrated device, and wherein the means for segmented anisotropic heat transfer is further configured to reduce a surface temperature of the apparatus.

[0141] The various features of the present disclosure described herein may be implemented in different systems without departing from the present disclosure. It should be noted that the above aspects of the present disclosure are merely examples and should not be construed as limiting the present disclosure. The description of the various aspects of the present disclosure is intended to be illustrative rather than limiting the scope of the appended claims. Thus, the teachings of the present disclosure may be readily applied to other types of devices, and many substitutions, modifications, and variations will be apparent to those skilled in the art.

Claims

1. A device comprising: an area including components configured to generate heat; as well as A thermally conductive layer is coupled to the region, wherein the thermally conductive layer includes a plurality of segmented anisotropic thermally conductive channels. 2 . The apparatus of claim 1 , wherein at least one of the plurality of segmented anisotropic thermally conductive channels is aligned in a first direction.

3. The apparatus of claim 2, wherein each of the plurality of segmented anisotropic thermally conductive channels is configured to provide high thermal conductivity in the first direction and low thermal conductivity in a second direction.

4. The apparatus of claim 2, wherein the thermally conductive layer comprises at least one adhesive bonding the plurality of segmented anisotropic thermally conductive channels.

5. The device as claimed in claim 4, wherein the plurality of segmented anisotropic heat-conducting channels include a first segmented anisotropic heat-conducting channel and a second segmented anisotropic heat-conducting channel, and The at least one adhesive is located between at least the first segmented anisotropic thermal conductive channel and the second segmented anisotropic thermal conductive channel.

6. The device as claimed in claim 1, wherein a first plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels are aligned in a first direction, and A second plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels are aligned in a second direction.

7. The device as claimed in claim 6, wherein each of the first plurality of segmented anisotropic thermally conductive channels is configured to provide a high first thermal conductivity value in the first direction, and Each of the second plurality of segmented anisotropic thermally conductive channels is configured to provide a high second thermal conductivity value in the second direction.

8. The apparatus of claim 7, wherein the second direction is orthogonal to the first direction.

9. The apparatus of claim 7, wherein the second direction is diagonal to the first direction.

10. The apparatus of claim 1, wherein a segmented anisotropic thermally conductive channel of the plurality of segmented anisotropic thermally conductive channels is configured to provide high thermal conductivity along a length of the segmented anisotropic thermally conductive channel.

11. The apparatus of claim 10, wherein the anisotropic thermally conductive channel comprises an anisotropic thermally conductive material configured to provide high thermal conductivity along a first direction.

12. The device according to claim 11, wherein the anisotropic thermally conductive material has a high thermal conductivity value in the first direction, and The anisotropic thermally conductive material has a low thermal conductivity value in at least a second direction.

13. The device as claimed in claim 12, wherein the first direction is along the length of the anisotropic thermal conductive channel, and The second direction is along the width of the anisotropic heat conductive channel.

14. The device according to claim 12, wherein the anisotropic thermally conductive material comprises a thermal conductivity value in the range of about 1000-1900 Watts per meter Kelvin (W / (mk)) in the first direction, and Wherein the anisotropic thermally conductive material comprises a thermal conductivity value in the second direction of less than 30 Watts per meter Kelvin (W / (mk)).

15. The apparatus of claim 1, wherein the thermally conductive layer comprises: a first portion, the first portion comprising a first plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels; a second portion, the second portion comprising a second plurality of segmented anisotropic thermally conductive channels among the plurality of segmented anisotropic thermally conductive channels; as well as A thermal insulation material is coupled to the first portion and the second portion.

16. The device according to claim 15, wherein the first plurality of segmented anisotropic heat conductive channels are aligned in a first direction, and The second plurality of segmented anisotropic heat conductive channels are aligned in a second direction.

17. The device according to claim 15, Wherein the thermal insulation material comprises aerogel, and / or The heat conducting layer comprises graphite.

18. The device according to claim 1, wherein the region includes a first integrated device, wherein the assembly comprises a second integrated device, and The thermally conductive layer is configured to thermally decouple the first integrated device from the second integrated device.

19. The device of claim 1, wherein the device is configured to provide Wireless Fidelity (WiFi) communications and / or cellular communications.

20. The device of claim 1, wherein the device is selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in a motor vehicle.

21. A device comprising: One area, including: a first integrated device configured to generate heat; and a second integrated device configured to generate heat; and Means for segmented anisotropic heat transfer are coupled to the region.

22. The device according to claim 21, wherein the device for segmented anisotropic heat transfer comprises a plurality of anisotropic thermally conductive channels aligned in a first direction, and Each of the plurality of anisotropic thermally conductive channels is configured to provide high heat transfer capability in the first direction and low heat transfer capability in a direction parallel to a width of the anisotropic thermally conductive channel.

23. The device of claim 21, Wherein the device for segmented anisotropic heat transfer comprises: a plurality of first anisotropic thermally conductive channels aligned in a first direction, and a plurality of second anisotropic thermally conductive channels aligned in a second direction, wherein each of the plurality of first anisotropic thermally conductive channels is configured to provide high heat transfer capability along the length of the first anisotropic thermally conductive channel, and Each of the plurality of second anisotropic thermally conductive channels is configured to provide high heat transfer capability along a length of the second anisotropic thermally conductive channel.

24. The device as claimed in claim 23, wherein said means for segmented anisotropic heat transfer comprises thermal insulation material, wherein the plurality of first anisotropic thermally conductive channels are part of a first portion of the apparatus for segmented anisotropic heat transfer, wherein the plurality of second anisotropic thermally conductive channels are part of a second portion of the device for segmented anisotropic heat transfer, and Wherein the first portion is coupled to the second portion via the thermal insulation material.

25. The apparatus of claim 21, wherein the device for segmented anisotropic heat transfer comprises a plurality of anisotropic thermally conductive channels aligned in a first direction, wherein the plurality of anisotropic thermally conductive channels have a high thermal conductivity value along the length of the plurality of anisotropic thermally conductive channels, and The plurality of anisotropic thermally conductive channels have a low thermal conductivity value in a direction parallel to a width of one or more of the anisotropic thermally conductive channels.

26. The device of claim 21, wherein the means for segmented anisotropic heat transfer is configured to reduce a junction temperature of the first integrated device and the second integrated device, and Wherein the means for segmented anisotropic heat transfer is further configured to reduce a surface temperature of the device.

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