Device for treating volatile matters in semiconductor equipment

Abstract

The invention provides a processing device for volatile matters in semiconductor equipment. The processing device comprises a bearing device, a nozzle and a protective cover which are arranged in a reaction cavity, the bearing device is used for placing a substrate; the bearing device, the nozzle and the protective cover are arranged in the reaction cavity, the nozzle is arranged in the protective cover, the protective cover arranged around the nozzle is used for preventing volatile matter from volatilizing upwards, and therefore the clean environment in the reaction cavity is protected.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a device for processing volatiles in semiconductor equipment. Background Art

[0002] In the semiconductor field, some semiconductor equipment will produce high-temperature volatiles during the process, such as by-products of volatile gases, water vapor and inert gases. At present, the treatment of high-temperature volatiles generated in the process is simply to discharge the high-temperature volatiles into the factory through the exhaust duct through the exhaust system in the reaction chamber for recycling. In this process, the high-temperature volatiles will evaporate and diffuse upward, polluting the environment in the reaction chamber. In particular, after long-term use, crystals will form on the inner wall of the reaction chamber, which not only affects the clean environment in the reaction chamber, but also requires regular cleaning and maintenance, and has high production costs.

[0003] Therefore, there is an urgent need for a volatile matter treatment device in a semiconductor device to improve the above-mentioned problems. Summary of the invention

[0004] The object of the present invention is to provide a device for treating volatiles in semiconductor equipment, which is used to prevent the environmental problem of a reaction chamber from being affected by the diffusion of volatiles during the process.

[0005] The present invention provides a device for processing volatiles in semiconductor equipment, comprising: a carrier device, a nozzle and a protective cover arranged in a reaction chamber;

[0006] The carrying device is used to place the substrate;

[0007] The nozzle is disposed in the protective cover and is used to spray liquid medicine onto the substrate on the carrying device;

[0008] The protective cover is used to prevent volatile substances from volatilizing upwards.

[0009] The beneficial effects of the present invention are as follows: by arranging a carrier, a nozzle and a protective cover in a reaction chamber, and arranging the nozzle in the protective cover, the protective cover arranged around the nozzle prevents volatiles from volatilizing upward, thereby protecting the clean environment in the reaction chamber.

[0010] Optionally, an air outlet is provided around the protective cover, and the air outlet is used to form an airflow protective cover around the protective cover after the protective gas is introduced;

[0011] The airflow protection cover and the protective cover together form a protection zone, so that the volatiles generated after the liquid medicine reaction are gathered in the protection zone. Its beneficial effect is that by arranging the air outlet around the protective cover, the airflow protection cover is formed around the protective cover after the protective gas is introduced into the air outlet; the airflow protection cover and the protective cover together form a protection zone, so that the volatiles generated after the liquid medicine reaction are gathered in the protection zone, thereby preventing the diffusion of the volatiles and protecting the clean environment in the reaction chamber.

[0012] Optionally, it also includes an exhaust pipe and recovery device;

[0013] One end of the exhaust pipe is arranged in the protective cover, and the other end is connected to the factory service end;

[0014] The recovery device is arranged on the exhaust pipe, and is used to generate suction to discharge the volatiles in the protection zone to the factory service end for recovery through the exhaust pipe. Its beneficial effect is that by setting the exhaust pipe and the recovery device; one end of the exhaust pipe is arranged in the protective cover, and the other end is connected to the factory service end; the recovery device is arranged on the exhaust pipe, and generates suction to discharge the volatiles in the protective cover to the factory service end for recovery through the exhaust pipe, the volatiles accumulated in the protection zone can be discharged to the factory service end in time, the clean environment in the reaction chamber can be protected, and the volatiles can be recovered.

[0015] Optionally, it also includes a protective air tube;

[0016] An air guide channel is provided in the cover body of the protective cover;

[0017] The protective air pipe is connected to the air outlet through the air guide channel, and is used to pass gas to the air outlet through the air guide channel, so that the air outlet forms an airflow protection cover around the protective cover. The beneficial effect is that by providing an air guide channel in the cover body of the protective cover; setting the protective air pipe to be connected to the air outlet through the air guide channel, passing gas to the air outlet through the protective air pipe and the air guide channel, so that the air outlet forms an airflow protection cover around the protective cover, the protection range of the protective cover is effectively improved, and there is no need to set a large volume of protective cover around the nozzle.

[0018] Optionally, the air outlet is an annular air outlet, and the airflow protection cover is an annular airflow protection cover. The beneficial effect is that by setting the air outlet as an annular air outlet and the airflow protection cover as an annular airflow protection cover, the diffusion of volatiles can be prevented in all directions, thereby ensuring a clean environment in the reaction chamber.

[0019] Optionally, the bearing device includes a support seat and a clamp;

[0020] The clamp is disposed on the support base and connected to the support base;

[0021] The clamp is used to clamp and fix the substrate. Its beneficial effect is that by providing a bearing device including a support seat and a clamp, the clamp is provided on the support seat, and the substrate is clamped and fixed by the clamp, so that the substrate can be fixed during the process of spraying the liquid medicine on the substrate by the nozzle, and the substrate can be removed after the liquid medicine reaction is completed.

[0022] Optionally, the nozzle and the protective cover are arranged above the substrate clamped and fixed by the clamp;

[0023] The plane where the protective cover is located is parallel to the plane where the substrate is located;

[0024] The direction of the air outlet on the protective cover is parallel to the plane where the substrate is located. The beneficial effect is that by arranging the nozzle and the protective cover above the substrate clamped by the clamper, and arranging the plane where the protective cover is located and the direction of the air outlet on the protective cover are parallel to the plane where the substrate is located, it is helpful to prevent the diffusion of volatiles.

[0025] Optionally, the cross-sectional size of the end of the protective cover facing the substrate is the same as the cross-sectional size of the other end of the protective cover, or the cross-sectional size of the end of the protective cover facing the substrate is larger than the cross-sectional size of the other end of the protective cover. The beneficial effect is that by setting the cross-sectional size of the end of the protective cover facing the substrate to be larger than the cross-sectional size of the other end of the protective cover, it is helpful to gather volatiles at the other end of the protective cover and block the diffusion of volatiles.

[0026] Optionally, after the nozzle sprays the liquid medicine onto the substrate on the carrier device, a protective gas is introduced so that the gas outlet forms an airflow protective cover around the protective cover;

[0027] The airflow protection hood and the protective cover together form a protection zone, so that the volatiles generated after the liquid medicine reaction are gathered in the protection zone, and at the same time, the recovery device generates suction, and discharges the volatiles in the protection zone to the factory service end for recycling through the exhaust pipe. Its beneficial effect is that after the nozzle sprays the liquid medicine to the substrate on the carrier device, the protective gas is introduced to form an airflow protection hood around the protective cover to prevent the airflow from affecting the uniformity of the sprayed liquid medicine covering the substrate, thereby affecting the process quality. The airflow protection hood and the protective cover are used to form a protection zone together, so that the volatiles generated after the liquid medicine reaction are gathered in the protection zone, and at the same time, the recovery device generates suction, and discharges the volatiles in the protection zone to the factory service end for recycling through the exhaust pipe, which can effectively prevent the diffusion of volatiles and timely discharge the volatiles gathered in the protection zone to the factory service end, thereby recovering the volatiles.

[0028] Optionally, the protective gas is clean nitrogen. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the structure of a device for processing volatiles in a semiconductor device provided by an embodiment of the present invention;

[0030] Figure 2 A schematic structural diagram of a protective cover and an airflow protective cover provided in an embodiment of the present invention;

[0031] Figure 3 A schematic structural diagram of another protective cover and airflow protective cover provided in an embodiment of the present invention;

[0032] Figure 4 A schematic structural diagram of another protective cover and airflow protective cover provided in an embodiment of the present invention;

[0033] Figure 5 A schematic structural diagram of a protective cover and an air outlet provided in an embodiment of the present invention.

[0034] Numbers in the figure:

[0035] 1. Carrying device; 2. Nozzle; 3. Protective cover; 4. Base plate; 5. Air outlet; 6. Air flow protective cover; 7. Exhaust pipe; 8. Protective air pipe;

[0036] 11. Support seat; 12. Clamp;

[0037] 31. Upper cylindrical shell; 32. Lower truncated cone shell. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0039] In view of the problems existing in the existing technology, such as Figure 1As shown, the present invention provides a device for processing volatiles in a semiconductor device, comprising: a carrier 1, a nozzle 2 and a protective cover 3 arranged in a reaction chamber; the carrier 1 is used to place a substrate 4; the nozzle 2 is arranged in the protective cover 3, and is used to spray a high-temperature liquid medicine onto the substrate 4 on the carrier 1; the protective cover 3 is used to prevent volatiles from volatilizing upward.

[0040] In some embodiments, Figure 1 As shown, the protective cover 3 is provided with an air outlet 5 around it, and the air outlet 5 is used to form an airflow protective cover 6 around the protective cover 3 after the protective gas is introduced; the airflow protective cover 6 and the protective cover 3 together form a protection zone, so that the volatiles generated after the liquid medicine reacts are gathered in the protection zone. It is worth noting that the protective cover 3 can be a baffle or a hollow cover body, and the cover body is open toward one end of the carrying device 1; the cover body around the opening is provided with an air outlet 5, and the air outlet 5 is used to form an airflow protective cover 6 around the opening after the protective gas is introduced.

[0041] In some embodiments, Figure 1 As shown, in order to timely discharge the volatiles gathered in the protection zone to the factory service end for recycling, the volatiles processing device in the semiconductor device of the present invention also includes an exhaust pipe 7 and a recovery device; one end of the exhaust pipe 7 is arranged in the protective cover 3, and the other end is connected to the factory service end; the recovery device is arranged on the exhaust pipe 7, and is used to generate suction to discharge the volatiles in the protective cover 3 to the factory service end for recycling through the exhaust pipe 7. It should be understood that when the protective cover 3 is a baffle, the nozzle 2 and the exhaust pipe 7 penetrate the protective cover 3, and when the protective cover 3 is a hollow cover body, the nozzle 2 and the exhaust pipe 7 penetrate the other end of the protective cover 3 and are located inside the cover body.

[0042] In some specific embodiments, in order to prevent the airflow blown out of the air outlet 5 from affecting the uniformity of the high-temperature liquid sprayed from the nozzle 2 covering the substrate 4 and ensure the process quality, the volatile matter processing device in the semiconductor device of the present invention is arranged that after the nozzle 2 sprays the high-temperature liquid onto the substrate 4 on the carrier device 1, a protective gas is introduced so that the air outlet 5 forms an airflow protection cover 6 around the protective cover 3; the airflow protection cover 6 and the protective cover 3 together form a protection zone, so that the volatiles generated after the high-temperature liquid reacts are gathered in the protection zone, and at the same time, the recovery device generates suction to discharge the volatiles in the protection zone to the factory end through the exhaust pipe 7 for recovery and treatment.

[0043] In some embodiments, Figure 1As shown, in order to increase the area of ​​the protection zone and prevent the protective cover 3 arranged around the nozzle 2 from being too large, the volatile matter processing device in the semiconductor device of the present invention also includes a protective air pipe 8; an air guide channel is provided in the cover body of the protective cover 3; the protective air pipe 8 is connected to the air outlet 5 through the air guide channel, and is used to pass gas to the air outlet 5 through the air guide channel, so that the air outlet 5 forms an airflow protective cover 6 around the protective cover 3.

[0044] In some specific embodiments, Figure 5 As shown, in order to prevent the diffusion of volatiles in all directions and ensure a clean environment in the reaction chamber, the protective cover 3 is composed of a double-layer shell, the air outlet 5 is located between the double-layer shell, the air outlet 5 is set as an annular air outlet, and the airflow protective cover 6 is an annular airflow protective cover 6. It is worth noting that the annular air outlet can be a connected air outlet, or composed of a plurality of air outlets spaced around the protective cover 3.

[0045] In some embodiments, in order to facilitate fixing of the substrate 4 and to remove the substrate 4 from the clamp 12 after the liquid medicine reaction is completed, the carrier device 1 of the volatile material processing device in the semiconductor device of the present invention includes a support seat 11 and a clamp 12; the clamp 12 is arranged on the support seat 11 and connected to the support seat 11; the clamp 12 is used to clamp and fix the substrate 4.

[0046] In some specific embodiments, Figure 1 As shown, in order to improve the performance of the protective cover 3 and the airflow protective cover 6 in gathering high-temperature volatiles, the nozzle 2 and the protective cover 3 are arranged above the substrate 4 clamped and fixed by the clamp 12; the plane where the protective cover 3 is located is parallel to the plane where the substrate 4 is located; the direction of the air outlet 5 on the protective cover 3 is parallel to the plane where the substrate 4 is located. It is worth noting that Figure 2 As shown, the air outlet 5 on the protective cover 3 can also face the substrate 4, that is, the angle between the direction of the air outlet 5 on the protective cover 3 and the plane where the protective cover 3 is located is an acute angle.

[0047] In some specific embodiments, the cross-sectional size of one end of the protective cover 3 facing the substrate 4 is the same as the cross-sectional size of the other end of the protective cover 3. Figure 1 As shown, the protective cover 3 is an internal hollow cylindrical shell, an air guide channel is provided inside the shell, the nozzle 2 is arranged on the top of the protective cover 3 and is located in the cylindrical shell, the bottom of the cylindrical shell is open, and an annular air outlet connected to the air guide channel is provided around the opening, and the plane where the opening is located and the direction of the air outlet 5 on the protective cover 3 are parallel to the plane where the substrate 4 is located.

[0048] In other specific embodiments, in order to further improve the performance of the protective cover 3 and the airflow protective cover 6 in collecting high-temperature volatiles, the cross-sectional size of one end of the protective cover 3 facing the substrate 4 is larger than the cross-sectional size of the other end of the protective cover 3. For example, Figure 3 The protective cover 3 is a hollow truncated cone-shaped shell, an air guide channel is provided inside the shell, the nozzle 2 is arranged on the end of the shell with a smaller cross section and is located inside the truncated cone-shaped shell, an opening is arranged on the end of the truncated cone-shaped shell with a larger cross section, and an annular air outlet connected to the air guide channel is arranged around the opening, and the plane where the opening is located and the direction of the air outlet 5 on the protective cover 3 are parallel to the plane where the substrate 4 is located. It should be understood that the shape of the protective cover 3 can also be a triangular prism, a rectangular parallelepiped or a hemispherical shape.

[0049] In addition, the protective cover 3 can also be a combined structure. Figure 4 As shown, the protective cover 3 includes an upper cylindrical shell 31 and a lower truncated cone shell 32, the upper cylindrical shell 31 and the lower truncated cone shell 32 are hollow inside, and a connected air guide channel is provided in the body of the upper cylindrical shell 31 and the body of the lower truncated cone shell 32, the nozzle 2 is arranged on the top of the upper cylindrical shell 31, and is located in the upper cylindrical shell 31, the end of the lower truncated cone shell 32 with a smaller cross-section is connected to the upper cylindrical shell 31, and the end of the truncated cone shell with a larger cross-section is provided with an opening, and a ring-shaped air outlet connected to the air guide channel is provided around the opening, and the plane where the opening is located and the direction of the air outlet 5 on the protective cover 3 are parallel to the plane where the substrate 4 is located.

[0050] In some embodiments, the protective gas is clean nitrogen.

[0051] In actual use scenarios, the wafer is used as the substrate 4, and a lifting rod or a swing arm can be set. The volatile matter processing device in the semiconductor device of the present invention is connected to the reaction chamber through the lifting rod or the swing arm, and the height of the protective cover 3 is adjusted by the lifting rod or the swing arm. The whole working process of the volatile matter processing device in the semiconductor device of the present invention is described below by taking the nozzle 2 in the semiconductor device spraying high-temperature liquid to the wafer clamped on the clamper 12 as an example:

[0052] Step 1: Place the wafer to be processed on the support base 11 of the carrier 1 and fix the wafer by the clamp 12.

[0053] Step 2, move the protective cover 3 to directly above the wafer through a lifting rod or a swing arm, and make the plane where the protective cover 3 is located parallel to the plane where the wafer is located.

[0054] Step 3, the nozzle 2 sprays the high-temperature liquid medicine onto the surface of the wafer, and does not introduce protective gas into the air guide channel when spraying the high-temperature liquid medicine.

[0055] In step 4, after the nozzle 2 finishes spraying the high-temperature liquid medicine, the liquid medicine temperature is too high and reacts with the wafer to generate a large amount of volatiles. At this time, clean nitrogen is introduced into the air guide channel, so that the annular air outlet forms an airflow protection cover 6 around the protective cover 3. The airflow protection cover 6 and the protective cover 3 together form a protection zone, so that the volatiles generated after the liquid medicine reaction are gathered in the protection zone, and the high-temperature volatiles are blocked from evaporating upward. At the same time, the recovery device generates suction, so that the exhaust pipe 7 arranged in the central area of ​​the protective cover 3 discharges the volatiles in the protection zone to the factory service end for recovery and treatment. The use of air sealing not only reduces the volume of the volatile treatment device in the semiconductor equipment, but also can effectively cooperate with the physical protective cover 3 to increase the protection range of the protective cover 3, realize the real-time recovery of high-temperature volatiles, effectively prevent the crystallization caused by the diffusion of high-temperature volatiles, and ensure the clean environment in the reaction chamber.

[0056] Step 5, stop introducing the protective gas into the gas guide channel, and move the protective cover 3 away from directly above the wafer through a lifting rod or a swing arm.

[0057] Step 6, taking the processed wafer from the clamp 12, and performing subsequent processing on the wafer, while placing a new wafer to be processed on the clamp 12, and repeating the above steps 1-5.

[0058] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A device for processing volatiles in a semiconductor device, characterized in that: include: A carrying device, a nozzle and a protective cover arranged in the reaction chamber; The carrying device is used to place the substrate; The nozzle is disposed in the protective cover and is used to spray liquid medicine onto the substrate on the carrying device; The protective cover is used to prevent volatile substances from volatilizing upwards.

2. The processing device according to claim 1, characterized in that An air outlet is provided around the protective cover, and the air outlet is used to form an airflow protective cover around the protective cover after the protective gas is introduced; The airflow protection cover and the protective cover together form a protection zone, so that volatile substances generated after the reaction of the liquid medicine are gathered in the protection zone.

3. The processing device according to claim 2, characterized in that Also includes exhaust pipe and recovery device; One end of the exhaust pipe is arranged in the protective cover, and the other end is connected to the factory service end; The recovery device is arranged on the exhaust pipe, and is used to generate suction to discharge the volatiles in the protection zone through the exhaust pipe to the plant service end for recovery and treatment.

4. The processing device according to claim 2, characterized in that It also includes protecting the trachea; An air guide channel is provided in the cover body of the protective cover; The protective air pipe is connected to the air outlet through the air guide channel, and is used to introduce gas into the air outlet through the air guide channel, so that the air outlet forms an airflow protective cover around the protective cover.

5. The processing device according to claim 4, characterized in that The air outlet is an annular air outlet, and the airflow protection cover is an annular airflow protection cover.

6. The processing device according to claim 1, characterized in that The bearing device comprises a supporting seat and a clamp; The clamp is disposed on the support base and connected to the support base; The clamp is used to clamp and fix the substrate.

7. The processing device according to claim 6, characterized in that The nozzle and the protective cover are arranged above the substrate clamped and fixed by the clamp; The plane where the protective cover is located is parallel to the plane where the substrate is located; The direction of the air outlet on the protective cover is parallel to the plane where the substrate is located.

8. The processing device according to claim 7, characterized in that The cross-sectional size of one end of the protective cover facing the substrate is the same as the cross-sectional size of the other end of the protective cover, or the cross-sectional size of one end of the protective cover facing the substrate is larger than the cross-sectional size of the other end of the protective cover.

9. The processing device according to claim 3, characterized in that After the nozzle sprays the liquid medicine onto the substrate on the carrier device, a protective gas is introduced so that the gas outlet forms an airflow protective cover around the protective cover; The airflow protection cover and the protective cover together form a protection zone, so that the volatiles generated after the liquid medicine reaction are gathered in the protection zone. At the same time, the recovery device generates suction to discharge the volatiles in the protection zone to the plant service end for recovery and treatment through the exhaust pipe.

10. The processing device according to claim 2, characterized in that The protective gas is clean nitrogen.

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