Local cleaning module for substrate handling

Abstract

The embodiment of the invention relates to a local cleaning module for substrate treatment. A substrate handling robot includes an end effector for supporting a substrate and an arm coupled to the end effector to translate the end effector between an extended position and a retracted position. The substrate handling robot also includes a housing to at least partially enclose the substrate, wherein the substrate is located on the end effector in the retracted position. The housing includes a shower to provide a flow of purge gas to the substrate.

Description

[0001] Information about divisional applications

[0002] This application is a divisional application of the invention patent application with application date of May 30, 2021, application number 202180039711.8, and invention name “Local cleaning module for substrate disposal”.

[0003] Related Applications

[0004] This application claims priority to U.S. Provisional Patent Application No. 63 / 037,008, filed on June 10, 2020, the entire contents of which are incorporated by reference for all purposes. Technical Field

[0005] The present disclosure relates to substrate handling (eg, semiconductor-wafer handling), and more particularly, to gas cleaning in substrate handling systems. Background Art

[0006] A tool for manufacturing or inspecting substrates, such as semiconductor wafers, may include an equipment front end module. The equipment front end module includes a robot for moving substrates between various stations in the tool. The equipment front end module may be purged using a purge gas, such as nitrogen, to provide a desired environment for substrates handled by the robot. For example, purging is performed to remove oxygen from the equipment front end module.

[0007] Traditionally, the entire tool front end module is cleaned. However, this cleaning uses high cleaning gas and is relatively expensive. Cleaning the entire tool front end module also does not provide precise environmental control near the substrate. Summary of the invention

[0008]

[0006] Therefore, there is a need for improved systems and methods for performing gas cleaning of robotically handled substrates.

[0009] In some embodiments, a substrate handling robot includes an end effector for supporting a substrate and an arm coupled to the end effector to translate the end effector between an extended position and a retracted position. The substrate handling robot also includes a housing to at least partially enclose the substrate, wherein the substrate is located on the end effector in the retracted position. The housing includes a shower to provide a flow of a cleaning gas to the substrate.

[0010] In some embodiments, a method includes loading a substrate on an end effector coupled to an arm, wherein the arm is in an extended position. When the substrate is loaded on the end effector, retracting the arm to a retracted position. Retracting the arm includes at least partially enclosing the substrate in a housing having a shower. When the substrate is at least partially enclosed in the housing, providing a flow of a cleaning gas to the substrate through the shower. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] For a better understanding of the various embodiments described, reference should be made to the following detailed description in conjunction with the following drawings.

[0012] Figure 1A is a perspective view of a substrate handling robot with a substrate positioned on an end effector in a retracted position according to some embodiments.

[0013] Figure 1B According to some embodiments Figure 1A A perspective view of a substrate handling robot with a substrate positioned on an end effector in an extended position.

[0014] Figure 1C According to some embodiments Figure 1A and 1B A cross-sectional side view of a substrate handling robot with a substrate positioned on an end effector in a retracted position.

[0015] Figure 2 is a perspective view of a housing according to some embodiments.

[0016] Figure 3 is a flow chart showing a method of handling a substrate according to some embodiments.

[0017] Like reference numerals refer to corresponding parts throughout the drawings and description. DETAILED DESCRIPTION

[0018] Reference will now be made in detail to various embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the various embodiments described. However, it should be apparent to one of ordinary skill in the art that the various embodiments described may be practiced without these specific details. In other examples, well-known methods, processes, components, circuits, and networks have not been described in detail to avoid unnecessarily obscuring aspects of the embodiments.

[0019] Figures 1A to 1C A substrate handling robot 100 is shown according to some embodiments. Figure 1A and 1B is a perspective view of the substrate handling robot 100, and Figure 1C1 is a cross-sectional side view of the substrate handling robot 100. The substrate handling robot 100 includes a substrate handling robot 100 disposed about an axis 128 ( Figure 1C The rotatable platform 102 (e.g., a rotatable box, which may be referred to as a robot box or R-box for short) rotates in a circle 104 (e.g., a central axis) about a center axis. For example, the rotatable platform 102 may rotate a full 360°. The rotatable platform 102 may also be capable of other movements. For example, the rotatable platform 102 may be raised, lowered, and / or translated laterally in a particular direction. The rotatable platform 102 may include an axis 126 for performing the rotation.

[0020] The arm 106 and the end effector 112 are mounted on the rotatable platform 102. The end effector 112 is coupled (e.g., rigidly connected) to the arm 106 and extends beyond the end of the arm 106 to support a substrate 116. The end effector 112 is coupled to the rotatable platform 102 by the arm 106, which includes a rear portion 108 and a front portion 110. Thus, the end effector extends beyond the end of the front portion 110 of the arm 106. In some embodiments, the substrate 116 is a semiconductor wafer. In some embodiments, the end effector 112 is a fork (e.g., having two fingers) that supports the substrate 116 (e.g., a semiconductor wafer).

[0021] The arm 106 is translationally coupled to the rotatable platform 102 so that it can move back and forth along the rotatable platform 102 to translate the end effector 112 and the substrate 116 back and forth between an extended position and a retracted position. Figure 1A and 1C is shown in a retracted position and in Figure 1B In some embodiments, the arm 106 may be rotatable relative to the rotatable platform 102 (e.g., relative to the axis 128, Figure 1C ) can be translated in a radial direction to translate the end effector 112 and substrate 116 between the extended position and the retracted position. For example, the arm 106 can be translated in a direction substantially parallel to the side of the rotatable platform 102 (e.g., within manufacturing tolerances). The arm 106 can extend beyond the end 118 of the rotatable platform 102 to translate the end effector 112 and substrate 116 to the extended position, such as Figure 1B102 . The end effector 112 and substrate 116 may be positioned beyond the end 118 of the rotatable platform 102 when in the extended platform and may be positioned above the rotatable platform 102 (e.g., above the end 118) in the retracted position. The arm 106 may extend beyond the end 118 of the rotatable platform 102 with the end effector 112 and substrate 116 in the extended position but not in the retracted position. The arm 106 may be positioned above the rotatable platform 102 with the end effector 112 and substrate 116 in the retracted position. The rotatable platform 102 may include a motor (e.g., inside a box of the rotatable platform 102) to move the arm 106 and thus translate the end effector 112 and substrate 116.

[0022] The housing 114 at least partially encloses the substrate 116 in the retracted position (i.e., with the substrate 116 loaded on the end effector 112 in the retracted position). In some embodiments, the housing 114 is coupled (e.g., rigidly connected) to the rotatable platform 102 (e.g., at or adjacent to the end 118). However, according to some embodiments, the housing 114 does not enclose the rotatable platform 102. Rotation of the rotatable platform 102 causes the housing 114 to rotate along with the arm 106 and the end effector 112. The housing 114 may have a fixed position on the rotatable platform 102 (e.g., at or adjacent to the end 118). In some embodiments, the housing 114 has a top that covers the substrate 116 and / or sidewalls that enclose the substrate 116 on respective sides when the substrate 116 is in the retracted position (e.g., at or adjacent to the end 118). Figure 1A and 1B 106 and is shown without padding to show underlying structure). However, housing 114 does not cover or enclose the entire arm 106 with the substrate in the retracted position, although it may or may not enclose a portion of the arm 106 (e.g., the end of front portion 110) according to some embodiments. Housing 114 may have a side opening (e.g., end 118 parallel to rotating platform 102) through which substrate 116, end effector 112, and arm 106 pass when substrate 116, end effector 112, and a portion of arm 106 are translated from the retracted position to the extended position.

[0023] The housing 114 includes a shower to provide a flow of a cleaning gas 124 to the substrate. In some embodiments, the cleaning gas 124 is nitrogen (N2). In some embodiments, the shower includes one or more porous surfaces through which the cleaning gas 124 flows. For example, the inner surface 122 ( Figure 1C) or a portion of the inner surface 122 is porous. When the substrate 116 is loaded on the end effector 112 with the end effector 112 and the substrate 116 in the retracted position, the inner surface 122 is positioned to face the surface of the substrate 116. The cleaning gas 124 flows through the inner surface 122 on the surface of the substrate 116 (i.e., through the pores in the inner surface 122).

[0024] The showerhead may further include a chamber 120 located in the top of the housing 114. The chamber 120 is surrounded by a surface including an inner surface 122, an outer surface of the top of the housing 114, and a side surface of the top of the housing 114. A cleaning gas 124 is provided to the chamber 120, and the cleaning gas 124 flows from the chamber 120 over the inner surface 122. In some embodiments, one or more tubes 130 ( Figure 1C ) provides cleaning gas 124 to chamber 120. One or more tubes 130 may extend through the box of the rotatable platform 102 (the connection between the rotating platform 102 and the housing 114 of the one or more tubes 130 is at Figure 1C This connection is not visible in the cross section. Figure 2 The elbow 218 discussed. )

[0025] In some embodiments, the housing 114 is not hermetically sealed. For example, the housing 114 has portions of the substrate 116, end effector 112, and arm 106 passing therethrough and the cleaning gas 124 can flow through its side openings. The flow of cleaning gas 124 provided by the showerhead can be continuous. For example, the flow of cleaning gas 124 can be continuous when the end effector 112 and substrate 116 are in the retracted position and the flow of cleaning gas 124 can continue when the end effector 112 and substrate 116 are not in the retracted position.

[0026] Figure 2 2 is a perspective view of housing 200 according to some embodiments. Housing 200 is a housing 114 ( Figures 1A to 1C ) is an example. The top 202 of the housing 200 has a chamber 204, which is the chamber 120 ( Figure 1C ) is an example. The inner surface 206 of the top 202 (which is the inner surface 122 ( Figure 1C ) includes a porous surface 208. When the substrate 116 is loaded on the end effector 112 with the end effector 112 and the substrate 116 in the retracted position, the porous surface 208 is positioned to face the surface of the substrate 116. The cleaning gas 124 passes from the chamber 204 through the surface of the substrate 116 ( Figures 1A to 1C ) on a porous surface 208.

[0027] The housing 200 further includes a side wall 210 connected to the top 202 of the housing 200 (e.g., forming part of the top 202 of the housing 200). In some embodiments, the corresponding portion of the side wall 210 is a side surface of the chamber 204. The side wall 210 is connected to the housing 200 for connecting the housing 200 to the rotatable platform 102 ( Figures 1A to 1C ). For example, the bracket 214 includes a hole 216 into which a connector (e.g., a screw, a bolt, etc.) is inserted to connect the bracket 214 to the corresponding side of the box of the rotatable platform 102. The bracket 214 can be connected to the side wall 210 by a surface 212 that can be tilted downward and inward from the side wall 210 to the bracket 214. The substrate 116 on the end effector 112 can be inserted into the housing 200 (e.g., by the arm 106 retracted into the housing 200, Figures 1A to 1C When it is in the retracted position, the end effector 112 on which the substrate 116 is loaded can also be accommodated in this space.

[0028] In some embodiments, one or both of the sidewalls 210 may include an inner surface, all or a portion of which may be porous. These porous surfaces may be used instead of or in addition to the porous surface 208 to provide a flow of the cleaning gas 124 to the substrate 116. The porous surface 208 may not be present. The cleaning gas 124 may be provided through the chamber 204 to the porous surface of the sidewall 210.

[0029] According to some embodiments, the elbow 218 is connected to the housing 200 (eg, to the top 202) and can be connected to the rotating platform 102 (eg, to a box connected to the rotating platform 102). The elbow 218 is for one or more tubes 130 ( Figure 1C ) provides a path to provide the cleaning gas 124 to the chamber 204. One or more tubes 130 may extend through the elbow 218. For example, one or more tubes 130 extend through the box of the rotating platform 102 and extend through the elbow 218 to the chamber 204.

[0030] Figure 3 is a flow chart showing a substrate handling method 300 according to some embodiments. In method 300, a substrate (e.g., substrate 116, Figures 1A to 1C ) is loaded at (302) and coupled to an arm (e.g., arm 106, Figures 1A to 1C ) of an end effector (e.g., end effector 112, Figures 1A to 1C ) with the arm in an extended position (e.g. Figure 1B In some embodiments, the substrate is a semiconductor wafer, the end effector comprises a fork and the fork picks up (304) the semiconductor wafer.

[0031] When the substrate is loaded on the end effector, the arm retracts (306) to a retracted position. In the retracted position, the substrate is at least partially enclosed in a housing (e.g., housing 114, Figures 1A to 1C ; Housing 200, Figure 2 In some embodiments, the showerhead comprises (308) a porous surface. For example, the housing has a porous surface (e.g., porous surface 208, Figure 2 ) of an inner surface (e.g., inner surface 206, Figure 2 ) (e.g., top 202, Figure 2 ). The surface of the substrate is positioned (310) to face the inner surface. In another example, the housing has a side wall (e.g., side wall 210, Figure 2 ). The substrate is positioned (312) adjacent to the inner surface.

[0032] When the substrate is at least partially enclosed in the housing, a cleaning gas (e.g., cleaning gas 124, Figure 1C ) is provided (314) to the substrate through a showerhead. For example, the flow of cleaning gas is provided continuously. In some embodiments, providing the flow of cleaning gas includes causing (316) the cleaning gas to flow through a porous surface. For example, through one or more tubes (e.g., one or more tubes 130, Figure 1C and 2 ) providing (318) a cleaning gas to a chamber (e.g., chamber 120, ) surrounded by a surface including a porous surface (e.g., surrounded by a surface including an inner surface, wherein the porous surface is all or a portion of the inner surface) Figure 1C ; Chamber 204, Figure 2 ). The cleaning gas flows from the chamber through the porous surface onto the substrate.

[0033] In some embodiments, the arm and housing are mounted on a rotatable platform (e.g., rotatable platform 102, Figures 1A to 1C ). The method 300 may include rotating the rotatable platform while providing a flow of cleaning gas to the substrate through the sprayer. For example, a substrate is loaded (302) on the end effector, wherein the rotatable platform is in a first orientation. The rotatable platform is rotated (320) from the first orientation to a second orientation. While rotating the rotatable platform, a flow of cleaning gas is provided to the substrate through the sprayer. When the rotatable platform is in the second orientation, the substrate is moved (322) to the station. Moving the substrate to the station includes extending the arm from a retracted position to an extended position, thereby removing the substrate from the housing. The station may be a second station corresponding to the second orientation. The method 300 may include moving the substrate from a first station relative to the first orientation to a second station. For example, in operations 302 and 306, the substrate may be picked up from the first station.

[0034] In some embodiments, the rotatable platform includes a box. One or more tubes that provide cleaning gas to the shower extend through the box (e.g., Figure 1C For example, one or more tubes may extend through the box and through an elbow (e.g., elbow 218, Figure 2 ).

[0035] Method 300 may include comparing Figure 3 The performance of two or more operations may overlap, and two or more operations may be combined into a single operation.

[0036] Housing 114( Figures 1A to 1C )(For example, housing 200, Figure 2 ) acts as a local cleaning module. The housing 114 and method 300 allow cleaning to be performed locally with respect to the substrate, and thus precisely. This local cleaning also uses a relatively low flow rate of cleaning gas, as compared to, for example, the gas flow rate used to clean the entire tool front end module containing a wafer handler robot. In addition, according to some embodiments, the expense and complexity of a full robot housing is avoided.

[0037] The foregoing description has been described with reference to specific embodiments for purposes of illustration. However, the above illustrative discussion is not intended to be exhaustive or to limit the scope of the claims to the precise forms disclosed. In light of the above teachings, many modifications and variations are possible. The embodiments were chosen to best illustrate the underlying principles of the claims and their practical application to thereby enable those skilled in the art to best use the embodiments with various modifications suitable for the particular use contemplated.

Claims

1. A substrate handling robot, comprising: an end effector for supporting the substrate; an arm coupled to the end effector to translate the end effector between an extended position and a retracted position; a rotatable platform, the arm being mounted on the rotatable platform; and A housing mounted on the rotatable platform and configured to at least partially enclose the substrate, wherein the substrate is located on the end effector in the retracted position, the housing comprising a shower to provide a flow of a cleaning gas to the substrate, wherein the housing comprises side walls covering a top portion of the substrate and enclosing the substrate on respective sides when the substrate is in the retracted position, and a bracket connected to the side walls to connect the housing to the rotatable platform, wherein the bracket is connected to the side walls by a surface that slopes downwardly and inwardly from the side walls to the bracket.

2. The robot according to claim 1, wherein: The arm is translatable in a radial direction relative to the rotatable platform to translate the end effector between the extended position and the retracted position; and The housing has a fixed position on the rotatable platform.

3. The robot according to claim 2, wherein: The housing is rigidly connected to the rotatable platform; and The arm may extend beyond an end of the rotatable platform to translate the end effector to the extended position.

4. The robot of claim 1, wherein the shower comprises a porous surface through which the cleaning gas flows.

5. The robot according to claim 4, wherein: The housing includes a top having an inner surface including the porous surface; and The inner surface is positioned as a surface facing the substrate, wherein the substrate is positioned on the end effector in the retracted position. 6 . The robot of claim 5 , wherein the shower further comprises a chamber in the top portion of the housing, the chamber being surrounded by a surface including the inner surface.

7. The robot of claim 6, further comprising one or more tubes to provide the cleaning gas to the chamber.

8. The robot according to claim 7, wherein: The rotatable platform includes the arm and a box on which the housing is mounted; The robot further includes a bent pipe coupled between the box and the housing; and The one or more tubes extend through the box and the elbow.

9. The robot of claim 4, wherein the housing includes a first sidewall having an inner surface including the porous surface.

10. The robot according to claim 9, wherein: The porous surface is a first porous surface; The shower further includes a second porous surface through which the cleaning gas will flow; The housing includes a second sidewall having an inner surface; and The inner surface of the second sidewall includes the second porous surface.

11. The robot according to claim 1, wherein: The substrate is a semiconductor wafer; and The end effector includes a fork for holding the semiconductor wafer.

12. A method comprising: loading a substrate onto an end effector coupled to an arm, wherein the arm is in an extended position, wherein the arm is mounted on a rotatable platform; retracting the arm to a retracted position when the substrate is loaded on the end effector, wherein retracting the arm comprises at least partially enclosing the substrate in a housing including a showerhead, the housing being mounted on the rotatable platform, wherein the housing comprises sidewalls covering a top portion of the substrate and enclosing the substrate on respective sides when the substrate is in the retracted position, and a bracket connected to the sidewall to connect the housing to the rotatable platform, wherein the bracket is connected to the sidewall by a surface that slopes downwardly and inwardly from the sidewall to the bracket; and The rotatable platform is rotated and a flow of a cleaning gas is provided to the substrate through the showerhead while the substrate is at least partially enclosed in the housing.

13. The method according to claim 12, wherein: performing said loading while said rotatable platform is in a first orientation; The rotating comprises rotating the rotatable platform from the first orientation to a second orientation; While rotating the rotatable platform, providing the flow rate of cleaning gas to the substrate through the shower comprises providing the flow rate of cleaning gas; and The method further includes moving the substrate to a station when the rotatable platform is in the second orientation, including extending the arm from the retracted position to the extended position, wherein extending the arm includes removing the substrate from the housing.

14. The method of claim 12, wherein: The shower comprises a porous surface; and Providing the flow rate of cleaning gas through the shower includes causing the cleaning gas to flow through the porous surface.

15. The method according to claim 14, wherein: The housing includes a top having an inner surface including the porous surface; and Enclosing the substrate in the housing includes positioning a surface of the substrate facing the inner surface.

16. The method of claim 15, wherein: The shower further includes a chamber in the top portion of the housing, the chamber being surrounded by a surface including the inner surface; and Providing the flow of cleaning gas includes providing the cleaning gas to the chamber through one or more tubes.

17. The method of claim 16, wherein: The rotatable platform includes a box; The one or more tubes extend through the box; and The rotating includes rotating the rotatable platform while providing the flow of cleaning gas to the substrate through the shower.

18. The method of claim 14, wherein: The housing includes a first sidewall having an inner surface including the porous surface; and Enclosing the substrate in the housing includes positioning the substrate adjacent to the interior surface.

19. The method of claim 12, wherein: The substrate is a semiconductor wafer; The end effector comprises a fork; and Loading the substrate onto the end effector includes picking up the semiconductor wafer using the fork.

Images