Connectable multi-channel air temperature regulating device and use thereof

By utilizing the cooling and heating properties of semiconductor materials through a connectable multi-channel air temperature control device, the problems of icing at the wellhead and high temperature and humidity underground in cold and deep mines have been solved. This has enabled simultaneous operation of wellhead antifreeze and underground cooling, improving temperature control efficiency and energy utilization.

CN119436331BActive Publication Date: 2025-11-25NORTHEASTERN UNIV CHINA
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Patent Information

Application Number
CN202411769512.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-11-25
Estimated Expiration
2044-12-04

AI Technical Summary

Technical Problem

Deep, cold mines face the problems of wellhead icing and high temperature and humidity underground. Traditional equipment is energy-intensive, inefficient, and polluting, making it difficult to simultaneously prevent wellhead freezing and lower underground temperatures.

Method used

It adopts a connectable multi-channel air temperature control device, which uses semiconductor materials to cool on one side and heat on the other, and transfers temperature through a spiral temperature conduction channel to achieve modular connection, making it suitable for temperature control needs in different scenarios.

Benefits of technology

It achieves simultaneous cooling and heating, improves temperature transfer efficiency and energy utilization, solves the simultaneous needs of wellhead antifreeze and well cooling, and is pollution-free, energy-saving and environmentally friendly.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application belongs to the field of air temperature regulation, and particularly relates to a connectable multi-channel air temperature regulation device and application thereof. The device comprises a channel main machine, the two ends of the channel main machine are in sealed communication with a first connecting piece and a second connecting piece through a sealing ring, the channel main machine comprises a main machine inner tube and a main machine outer tube, the main machine outer tube is sleeved outside the main machine inner tube, the main machine outer tube is a hollow ring structure, a plurality of temperature guide support sheets are evenly distributed between the outer ring inner wall of the main machine outer tube and the inner ring outer wall of the main machine outer tube to form a plurality of temperature guide channels I, a plurality of semiconductor plates are arranged outside the main machine inner tube, the semiconductor plates are separated by temperature insulation strips, and the semiconductor plates are attached to the inner ring inner wall of the main machine outer tube; a plurality of temperature guide partitions are evenly distributed on the inner wall of the main machine inner tube, and a plurality of temperature guide channels II are formed between the temperature guide partitions. The device can simultaneously realize refrigeration and heating based on the characteristics of the semiconductor material, and can simultaneously meet the use requirements of air temperature rise or drop in different application scenarios.
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Description

Technical Field

[0001] This invention belongs to the field of air temperature regulation, specifically relating to a connectable multi-channel air temperature regulation device and its application. Background Technology

[0002] Regulating air temperature is crucial for both daily life and industrial production. Human living and working spaces require suitable air temperatures, as do industrial production spaces. In vast areas of northern my country, winter temperatures are low. When there is water or dampness on the mine walls in the intake airways, the low temperature of the incoming fresh air can easily cause freezing, forming icicles. These icicles breaking and falling can seriously threaten the safety of personnel and equipment, causing accidents. Therefore, air preheating equipment is usually installed to preheat the air entering the mine to alleviate freezing. As shallow mineral resources are gradually depleted, my country's mineral resource mining has shifted to deep mining. Heat hazards are prevalent in deep mines; the deeper the deposit and the higher the ground temperature, the higher the air temperature in the mine tunnels. Some temperatures can even exceed 30°C, seriously affecting the health and safety of underground personnel. Therefore, cooling measures and equipment are needed underground to regulate air temperature.

[0003] In the high-altitude plateau regions of northwestern my country, deep mines in frigid areas have long faced the complex problem of low temperature and low pressure at the surface, while the underground environment is hot and humid. This problem is particularly pronounced during the mine's infrastructure construction phase. In these frigid regions, the surface air temperature is low, and the mine entrance is prone to freezing, requiring year-round air preheating. Furthermore, due to the difficulty in establishing a complete ventilation system during the mine's infrastructure construction phase, there are numerous dead-end roadways, high surrounding rock temperatures, and poor ventilation. The hot and humid air within these roadways is difficult to expel, resulting in persistently high air temperatures and significantly reducing the working efficiency of personnel and machinery underground. This extreme contrast between surface and underground temperatures further compels the extension of the mine's infrastructure construction period, leading to increased mining costs and impacting the company's economic benefits.

[0004] Traditional mine entrance antifreeze methods typically employ boiler steam preheating or geothermal preheating. However, boiler steam preheating suffers from drawbacks such as high energy consumption and significant heat loss. Furthermore, the steam carries a large amount of water vapor into the mine, further increasing the humidity. If the mine has heat hazards, boiler steam preheating will exacerbate the problem, making it more difficult to cool the underground air. Geothermal preheating utilizes heat exchange between the air and the surrounding rock mass, gradually raising the air temperature. This requires a large exposed area of ​​rock mass to dissipate sufficient heat, resulting in high costs and low efficiency. Traditional mine cooling methods typically include ventilation cooling, reducing heat sources, using mobile mine air conditioning units, or installing air coolers underground. Ventilation cooling, achieved by increasing air volume and velocity, is less effective in deep, high-temperature, single-ended roadways or chambers where ventilation loops are difficult to establish. When using mobile air conditioning units for mining or installing air coolers underground, the heat generated by the equipment itself will be directly dissipated into the mine shaft, which contradicts measures to reduce heat sources. Summary of the Invention

[0005] To address the problems of wellhead freezing and underground heat hazards faced by deep, cold-climate mines, this invention aims to provide a connectable multi-channel air temperature regulation device and its application. This device not only meets conventional use but is also an air temperature regulation device that can simultaneously meet the needs of wellhead freezing prevention and underground heat hazard control. Based on the characteristic of semiconductor materials that can cool on one side and heat on the other, the device can simultaneously cool and heat, thus meeting the needs of both heating and cooling the air. Furthermore, according to different usage scenarios, the device is configured as a connectable modular form to improve the efficiency of temperature transfer and energy utilization.

[0006] A connectable multi-channel air temperature regulating device includes a channel main unit. The two ends of the channel main unit are sealed and connected to a first connector and a second connector through sealing rings. The channel main unit includes an inner tube and an outer tube. The outer tube is sleeved on the outside of the inner tube and has a hollow ring structure. Multiple temperature-conducting support plates are evenly distributed between the inner wall of the outer ring and the outer wall of the inner ring of the outer tube to form multiple temperature-conducting channels I. Multiple semiconductor plates are provided on the outside of the inner tube, and the semiconductor plates are separated by heat-insulating strips. The semiconductor plates are attached to the inner wall of the outer tube. Multiple temperature-conducting spacers are evenly distributed on the inner wall of the inner tube, and multiple temperature-conducting channels II are formed between the spacers.

[0007] The first connector and the second connector have the same structure, both including an inner connector tube and an outer connector tube. The outer connector tube is sleeved on the outside of the inner connector tube. Multiple flow guide support plates are provided between the inner connector tube and the outer connector tube at the connection with the channel host. One end of the inner connector tube is sealed to the inner connector tube of the host through a sealing ring, and the other end is provided with an inner tube channel connection port. One end of the outer connector tube is sealed to the outer connector tube of the host through a sealing ring, and the other end is provided with an outer tube channel connection port.

[0008] The channel host is provided as one or more, and the multiple channel hosts are connected by sealing rings, and then their two ends are respectively sealed and connected to the first connector and the second connector by sealing rings.

[0009] The shape of the flow guide support plate is the same as the cross-sectional shape of the temperature conduction support sheet, and the number and position of the flow guide support plates correspond to those of the temperature conduction support sheets.

[0010] The inner tube of the connector is filled with thermal insulation material.

[0011] The thermally conductive support sheet and thermally conductive partition are spiral-shaped, and the thermally conductive channels I and II are spiral-shaped thermally conductive channels.

[0012] The outer wall of the main unit's outer tube is wrapped with a heat insulation layer.

[0013] An application of a connectable multi-channel air temperature control device, using the aforementioned temperature control device for air cooling in a conventional space, specifically includes the following steps:

[0014] Step 1: Use a channel main unit. The two ends of the channel main unit are sealed and connected to the first connector and the second connector through sealing rings. The inner tube channel connection port of the first connector is connected to the connecting pipe I, and the outer tube channel connection port of the first connector is connected to the connecting pipe II. The connecting pipe I and the connecting pipe II are connected in a normal space at a distance apart. An air drive device is installed on the inner tube channel connection port of the second connector.

[0015] Step 2: The semiconductor board on the inner tube of the main unit is used for cooling on the side facing the inner tube and for heating on the other side; the air drive device draws external air into the temperature conduction channel II of the main unit. The cooling side of the semiconductor board generates cold energy. When the air passes through the temperature conduction channel II of the inner tube of the main unit, it absorbs the cold energy and its temperature drops to low temperature cold air. The low temperature cold air enters the normal space through the connecting pipe I.

[0016] Step 3: When the normal space is a closed space, after the low temperature cold air enters the closed space, the original high temperature air in the closed space will enter the temperature conduction channel I of the channel host through the connecting pipe II. The heating side of the semiconductor board generates heat, which is absorbed by the air flowing through the temperature conduction channel I and discharged through the outer pipe channel connection port of the second connector.

[0017] When the regular space is not a sealed space, after the low-temperature cold air enters the sealed space, the original high-temperature air in the sealed space will be discharged through other channels in the regular space. Tap water is introduced into the external pipe channel connection port of the second connector. The low-temperature tap water enters the temperature conduction channel I of the channel host through the external pipe channel connection port of the second connector. Heat is generated on the heating side of the semiconductor plate. The low-temperature tap water will absorb the heat generated on the heating side of the semiconductor plate in the temperature conduction channel I and be heated. Finally, it enters the connecting pipe II through the external pipe channel connection port of the first connector and is used as domestic water in the regular space.

[0018] An application of a connectable multi-channel air temperature regulating device, wherein the device is used to reduce air temperature in a single-ended mine shaft, specifically includes the following steps:

[0019] Step 1: A channel main unit is used. The two ends of the channel main unit are sealed and connected to the first connector and the second connector through sealing rings. The inner pipe channel connection port of the first connector is connected to the connecting pipe III, and the outer pipe channel connection port of the first connector is connected to the connecting pipe IV. An auxiliary fan I is installed on the connecting pipe IV. The outer pipe channel connection port of the second connector is connected to the connecting pipe V, and the inner pipe channel connection port of the second connector is connected to the connecting pipe VI. An auxiliary fan II is installed on the connecting pipe VI.

[0020] Step 2: Install the device from Step 1 in the mine's dead-end roadway. The first connector is located on the closed side of the dead-end roadway. The semiconductor plate on the inner tube of the main unit is used for cooling on the side facing the inner tube of the main unit, and for heating on the other side. The auxiliary fan II draws the mine airflow in the mine roadway into the connecting pipe VI. The cooling side of the semiconductor plate generates cold energy. When the high-temperature air in the mine passes through the temperature conduction channel II of the inner tube of the main unit, it absorbs the cold energy and its temperature decreases, becoming low-temperature cold air. The low-temperature air enters the connecting pipe III through the inner tube channel connection port of the first connector and is transported to the mine's dead-end roadway.

[0021] Step 3: Auxiliary fan I draws polluted air from the mine's single-ended roadway into connecting pipe IV. The air then enters the temperature-conducting channel I of the main unit through the external pipe connection port of the first connector. Heat is generated on the heating side of the semiconductor plate. This heat is absorbed by the polluted air flowing through the temperature-conducting channel I and then enters connecting pipe V through the external pipe connection port of the second connector before being transported to the mine's return airway. Finally, the air is discharged to the surface through the return air shaft.

[0022] An application of a connectable multi-channel air temperature control device, employing the aforementioned temperature control device, is used in high-altitude, deep mines to simultaneously achieve wellhead antifreeze and underground cooling, specifically including the following steps:

[0023] Step 1: One channel main unit is used for well cooling. The two ends of the channel main unit are sealed and connected to the first and second connecting parts through sealing rings. Two channel main units are used for wellhead antifreeze. The two channel main units are connected and then sealed and connected to the first and second connecting parts through sealing rings.

[0024] The main unit for wellhead antifreeze, along with the first and second connecting parts, is placed on one side of the wellhead house on the ground. The inner pipe channel of the first connecting part for wellhead antifreeze is connected to connecting pipe VII, which extends into the wellhead house on the ground. The outer pipe channel of the first connecting part for wellhead antifreeze is connected to one end of connecting pipe VIII. A blower I is installed at the inner pipe channel of the second connecting part for wellhead antifreeze, and the outer pipe channel of the second connecting part for wellhead antifreeze is connected to one end of connecting pipe IX. A media drive is installed on connecting pipe IX. The pump is connected to the other end of the connecting pipe IX, which is connected to the outer pipe channel of the second connector for well cooling. The inner pipe channel of the second connector for well cooling is equipped with a fan II. The inner pipe channel of the first connector for well cooling is connected to the connecting pipe X. The outer pipe channel of the first connector for well cooling is connected to the other end of the connecting pipe VIII, which is used for the connection between the air temperature regulating device for wellhead antifreeze and the air temperature regulating device for well cooling. The connecting pipes VIII and IX are filled with a heat-conducting medium.

[0025] Step 2: The semiconductor plate of the channel host for cooling down the well is used for cooling on the side facing the inner tube of the host, and for heating on the other side; the semiconductor plate of the channel host for antifreeze at the wellhead is used for heating on the side facing the inner tube of the host, and for cooling on the other side; Fan I draws outside air into the temperature-conducting channel II of the channel host. The heat generated by the semiconductor plate on the heating side of the channel host for cooling down the wellhead heats the outside air and delivers it to the connecting pipe VII through the temperature-conducting channel II of the channel host. The connecting pipe VII delivers the high-temperature gas to the surface wellhead room, and then enters the mine through the ventilation shaft for preheating the air at the wellhead and preventing ice formation at the wellhead;

[0026] Step 3: The downhole cooling fan II draws the high-temperature gas from the well into the second connection of the downhole cooling unit, and then into the temperature conduction channel II of the channel host. The semiconductor board in the downhole cooling channel host generates cooling in the temperature conduction channel II. The high-temperature gas absorbs the cooling in the temperature conduction channel II and is cooled down into low-temperature cold air, which is then transported to the air demand point through the connecting pipe X to meet the downhole air cooling needs.

[0027] Step 4: The medium-driven pump drives the temperature-conducting medium inside connecting pipes VIII and IX. The temperature-conducting channel I of the wellhead antifreeze channel host conducts the cold energy generated by the cooling side of the semiconductor plate, turning the temperature-conducting medium into a low-temperature medium. The flow of the temperature-conducting medium is used to cool down the temperature-conducting channel I of the wellhead antifreeze channel host. The temperature-conducting channel I of the wellhead antifreeze channel host conducts the heat generated by the heating side of the semiconductor plate, turning the temperature-conducting medium into a high-temperature medium. The flow of the temperature-conducting medium is used to heat up the temperature-conducting channel I of the wellhead antifreeze channel host. The heat energy generated by wellhead antifreeze is used to keep the host warm during wellhead antifreeze, and the low temperature generated by wellhead antifreeze is used to cool down the host during wellhead antifreeze, so as to ensure the normal operation of the wellhead antifreeze and wellhead antifreeze synchronous system.

[0028] Compared with the prior art, the beneficial effects of the present invention are:

[0029] 1. The device disclosed in this invention has a temperature conduction channel I on the outer tube of the main unit and a temperature conduction channel II on the inner tube of the main unit. It can simultaneously collect the cold energy generated on the cooling side and the heat generated on the heating side when the semiconductor material is working, and conduct the temperature to the medium flowing in the channel. The device achieves the effect of simultaneous cooling and heating, has a wide range of applications, and is highly practical.

[0030] 2. The device disclosed in this invention has multiple temperature-conducting baffles on the inner side of the main unit inner tube and multiple temperature-conducting support plates on the outer tube of the main unit, thereby dividing the inner side of the main unit inner tube and the outer tube of the main unit into multiple spiral temperature-conducting channels. The temperature-conducting baffles and temperature-conducting support plates can extend the flow path of the medium in the device and improve the temperature conduction efficiency.

[0031] 3. The device disclosed in this invention is a connectable modular device that can connect multiple channel main units according to different usage requirements, further extending the flow path of the medium in the device, thereby enabling the low temperature generated on the cooling side and the high temperature generated on the heating side of the device to be fully conducted to the medium flowing in the channel.

[0032] 4. The device disclosed in this invention also includes a first connector and a second connector. The first connector and the second connector are sealed and connected to the channel host, and are provided with an inner tube channel connection port and an outer tube channel connection port to form an inner channel and an outer channel of the entire device, which can separate the cold energy generated on the cooling side and the heat generated on the heating side of the device. The inner tube of the connector of the first connector and the second connector is also filled with heat insulation material to isolate the temperature conduction in the inner and outer channels, so as to facilitate the further utilization of different temperature resources.

[0033] 5. The device disclosed in this invention has a channel main unit with two ends sealed and connected to the first connector and the second connector through sealing rings, which allows different media to flow in the device channel, including but not limited to air and water.

[0034] 6. The device disclosed in this invention can not only connect multiple channel hosts, but also connect other devices, such as fans, water pumps, air ducts, water pipes, etc., with two external connection ports respectively provided on the first and second connectors; the device can be configured in various forms and has extremely high expandability.

[0035] 7. The device disclosed in this invention only requires electrical energy to operate, and the high and low temperature resources generated during the operation of the device can be collected and utilized without being transferred to the environment in which the device operates; it is zero-emission, zero-pollution, energy-saving and environmentally friendly.

[0036] 8. The multi-channel air temperature regulating device of the present invention utilizes the characteristic of semiconductor materials to simultaneously cool and heat, transferring different temperatures to the flowing medium within the channels through temperature-conducting channels I and II. By utilizing the characteristic of the spiral temperature-conducting channels I and II within the inner and outer pipes of the main unit to transfer different temperatures, heat energy exchange between the surface and underground is achieved. This preheats the fresh, cold air entering the mine shaft while simultaneously cooling the high-temperature air in deep mine shafts, saving energy and being environmentally friendly, achieving efficient energy utilization and effectively improving the underground working environment. In addition to solving problems related to air circulation and temperature regulation in conventional spaces and single-ended mine shafts, the key feature of this invention is addressing the long-standing problem of extreme surface and underground temperature conditions in high-altitude, deep mines. Attached Figure Description

[0037] Figure 1 A schematic diagram of the overall structure of a connectable multi-channel air temperature control device;

[0038] Figure 2 This is a cross-sectional schematic diagram of the device in this invention;

[0039] Figure 3 This is a cross-sectional schematic diagram of the device channel host in this invention;

[0040] Figure 4 This is a schematic diagram of the structure of the first connector and the second connector of the device in this invention;

[0041] Figure 5 This is a schematic diagram showing the connection between the second connector of the device in this invention and the inner tube of the channel host.

[0042] Figure 6 This is a cross-sectional schematic diagram of the outer tube of the channel host in the device of the present invention;

[0043] Figure 7 This is a schematic diagram of the channel host structure of the device in this invention;

[0044] Figure 8 This is a schematic diagram showing the arrangement of the inner spiral temperature-conducting channel, semiconductor material, and heat insulation strip in the device of the present invention;

[0045] Figure 9 This is a schematic diagram of an embodiment of the device of the present invention applied to conventional space temperature regulation;

[0046] Figure 10 This is a schematic diagram of an embodiment of the device of the present invention for regulating the air temperature in a single-head shaft of a mine.

[0047] Figure 11 This is a schematic diagram of an embodiment of the device of the present invention for preventing freezing at the wellhead and lowering the temperature underground in deep, cold mines;

[0048] Explanation of reference numerals in the attached drawings: 1. First connector; 2. Channel main unit; 201. Inner tube of the main unit; 202. Outer tube of the main unit; 2021. Inner wall of the outer ring; 2022. Outer wall of the inner ring; 203. Temperature-conducting support plate; 204. Temperature-conducting channel I; 205. Semiconductor plate; 206. Insulation strip; 207. Temperature-conducting spacer; 208. Temperature-conducting channel II; 3. Second connector; 301. Inner tube of the connector; 302. Outer tube of the connector; 303. Flow guide support plate; 304. Sealing ring; 305. Inner tube channel connection port; 306. Outer tube channel connection port; 307. Insulation 4. Conventional Space; 401. Connecting Pipe I; 402. Connecting Pipe II; 5. Mine Dead-End Roadway; 501. Auxiliary Fan I; 502. Auxiliary Fan II; 503. Connecting Pipe III; 504. Connecting Pipe IV; 505. Connecting Pipe V; 506. Connecting Pipe VI; 507. Mine Roadway; 508. Airflow Direction Marker; 6. High-Altitude Cold and Deep Mine; 601. Surface Shaft House; 602. Connecting Pipe VII; 603. Fan I; 604. Connecting Pipe VIII; 605. Connecting Pipe IX; 606. Medium-Driven Pump; 607. Fan II; 608. Connecting Pipe X. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be described in detail and completely below with reference to the accompanying drawings. It should be noted that the embodiments and drawings described below are only for the purpose of helping to understand the method and core ideas of the present invention, and are only some embodiments of the present invention; for other people skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas provided by the present invention; therefore, the content of this specification should not be construed as a limitation of the present invention; all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this invention can be combined with other embodiments.

[0051] like Figure 1-8 As shown, this invention discloses a connectable multi-channel air temperature regulating device. Based on the characteristic of semiconductor materials to simultaneously cool and heat, the device provides a solution that simultaneously transmits different temperatures to the flowing medium within the channels via spiral temperature-conducting channels I 204 and II 208. By setting up multi-stage connections between the spiral channels and the device, the efficiency and flexibility of temperature regulation can be effectively improved. Utilizing the characteristic of the inner and outer channels transmitting different temperatures, heat energy exchange between the surface and underground is achieved. This preheats the fresh, cold air entering the mine shaft while simultaneously cooling the high-temperature air in the deep mine shaft, saving energy and being environmentally friendly, thus achieving efficient energy utilization and effectively improving the underground working environment.

[0052] A connectable multi-channel air temperature regulating device includes a channel main unit 2. The two ends of the channel main unit 2 are sealed and connected to a first connecting member 1 and a second connecting member 3 via sealing rings 304. The channel main unit 2 includes an inner tube 201 and an outer tube 202. The outer tube 202 is sleeved on the outside of the inner tube 201, and an insulation layer 307 is wrapped around its outer wall. The outer tube 202 has a hollow ring structure, with the inner wall 2021 of the outer ring and the outer wall 2022 of the inner ring of the outer tube 202... Multiple temperature-conducting support plates 203 are evenly distributed to form multiple temperature-conducting channels I 204; multiple semiconductor plates 205 are provided on the outer side of the main unit inner tube 201, and the semiconductor plates 205 are separated by temperature-insulating strips 206. The semiconductor plates 205 are attached to the inner wall of the inner ring of the main unit outer tube 202; multiple temperature-conducting spacers 207 are evenly distributed on the inner wall of the main unit inner tube 201, and multiple temperature-conducting channels II 208 are formed between the temperature-conducting spacers 207; the temperature-conducting support plates 203 and temperature-conducting spacers 207 are spiral-shaped, and the temperature-conducting channels I 204 and temperature-conducting channels II 208 are spiral-shaped temperature-conducting channels.

[0053] The first connector 1 and the second connector 3 have the same structure, both including an inner connector tube 301 and an outer connector tube 302. The outer connector tube 302 is sleeved on the outside of the inner connector tube 301. Multiple flow guide support plates 303 are provided between the inner connector tube 301 and the outer connector tube 302 at the connection with the channel host 2. One end of the inner connector tube 301 is sealed to the host inner tube 201 through a sealing ring 304, and the other end is provided with an inner tube channel connection port 305. One end of the outer connector tube 302 is sealed to the host outer tube 202 through a sealing ring 304, and the other end is provided with an outer tube channel connection port 306. The inner connector tube 301 is filled with heat insulation material to isolate the temperature conduction in the inner and outer channels.

[0054] The channel host 2 is provided in one or more. The multiple channel hosts 2 are connected by sealing rings and then their two ends are respectively sealed and connected to the first connecting member 1 and the second connecting member 3 by sealing ring 304.

[0055] The shape of the flow guide support plate 303 is the same as the cross-sectional shape of the temperature conduction support plate 203, and the number and position of the flow guide support plate 303 correspond to those of the temperature conduction support plate 203.

[0056] The present invention provides a connectable multi-channel air temperature regulation device, which can be used to solve the problems of air circulation and temperature regulation in conventional spaces and single-headed mine shafts. The key point is to solve the problem of the extreme temperature conditions between the surface and underground that have long been faced by deep, cold mines.

[0057] Example 1: The device of the present invention is applied to temperature regulation in a conventional space.

[0058] In this embodiment, "conventional space" refers to the usual places where people live and work, including but not limited to enclosed or not completely enclosed spaces such as residential housing, office spaces, and industrial plants.

[0059] Figure 9 The illustration shows an application example of a connectable multi-channel air temperature regulating device for temperature adjustment in a conventional space. In this example, only one channel host 2 is used to form the basic form of the device, achieving a reduction in air temperature within the conventional space 4. The side of the semiconductor plate facing the inner tube 201 of the host 2 is for cooling, while the other side is for heating; specifically, the cooling energy generated by the cooling side of the semiconductor plate 205 is conducted through the temperature conduction channel I 204 of the device, thereby reducing the air temperature within the conventional space 4.

[0060] An application of a connectable multi-channel air temperature control device for cooling air in a conventional space 4 includes the following steps:

[0061] Step 1: A channel host 2 is used. Both ends of the channel host 2 are sealed and connected to the first connector 1 and the second connector 3 through sealing rings 304. The inner tube channel connection port of the first connector 1 is connected to the connecting pipe I 401, and the outer tube channel connection port of the first connector 1 is connected to the connecting pipe II 402. The connecting pipe I 401 and the connecting pipe II 402 are connected in the conventional space 4 at a distance apart. An air drive device is installed on the inner tube channel connection port 305 of the second connector 3, and the outer tube channel connection port 306 of the second connector 3 is exposed to air.

[0062] Step 2: The semiconductor board 205 on the inner tube 201 of the main unit is used for cooling on the side facing the inner tube 201 and for heating on the other side; the air drive device draws external air into the temperature conduction channel II 208 of the main unit 2. The cooling side of the semiconductor board 205 generates cold energy. When the air passes through the temperature conduction channel II 208 of the inner tube 201 of the main unit, it absorbs the cold energy and cools down to become low-temperature cold air. The low-temperature cold air enters the normal space 4 through the connecting pipe I 401.

[0063] Step 3: When the conventional space 4 is a closed space, after the low-temperature cold air enters the closed space, the original high-temperature air in the closed space will enter the temperature conduction channel I 204 of the channel host 2 through the connecting pipe II 402. The semiconductor plate 205 generates heat on the heating side, which is absorbed by the air flowing through the temperature conduction channel I 204 and discharged through the outer pipe channel connection port 306 of the second connector 3. Moreover, the heating effect of the semiconductor plate 205 on the air can create a pressure difference between the temperature conduction channel I 204 and the closed space, driving the air in the closed space to flow into the temperature conduction channel I 204 at an accelerated rate.

[0064] When the conventional space 4 is a non-sealed space, that is, when there is some connection between the conventional space 4 and the outside world, the air drive device on the inner pipe channel connection port 305 of the second connector 3 increases the air pressure in the conventional space 4. Therefore, after the low-temperature cold air enters the non-sealed space, the original high-temperature air in the non-sealed space will be discharged through other channels of the conventional space. Tap water is introduced into the outer pipe channel connection port 306 of the second connector 3. The low-temperature tap water enters the temperature conduction channel I 204 of the channel host 2 through the outer pipe channel connection port 306 of the second connector 3. The semiconductor plate 205 generates heat on the heating side. The low-temperature tap water will absorb the heat generated by the semiconductor plate 205 on the heating side in the temperature conduction channel I 204 and be heated. Finally, it enters the connecting pipe II 402 through the outer pipe channel connection port of the first connector 1 and is used as domestic water in the conventional space.

[0065] In this embodiment, the advantages of the device of the present invention are: first, it can regulate the air temperature in a conventional space; second, it can quickly replace the polluted air in a conventional space with the fresh air outside; and third, it can collect the heat energy generated by the semiconductor material for secondary use, making reasonable use of the high and low temperature resources generated by the heating and cooling sides of the semiconductor material.

[0066] Example 2: The device of the present invention is applied to air temperature regulation in a single-ended mine shaft.

[0067] Figure 10 The illustration shows an application embodiment of a connectable multi-channel air temperature regulating device in the air temperature regulation of a mine's single-ended roadway. In this embodiment, only one channel main unit 2 is used to form the basic form of the device of the present invention, thereby reducing the air temperature in the mine's single-ended roadway; the side of the semiconductor plate facing the inner tube 201 of the main unit is for cooling, and the other side is for heating; specifically, the cooling energy generated by the semiconductor material on the cooling side is conducted through the temperature conduction channel II of the device of the present invention, thereby reducing the air temperature in the mine's single-ended roadway.

[0068] An application of a connectable multi-channel air temperature regulating device for reducing air temperature in a mine shaft includes the following steps:

[0069] Step 1: A channel host 2 is used. Both ends of the channel host 2 are sealed and connected to the first connector 1 and the second connector 3 through sealing rings 304. The inner pipe channel connection port of the first connector 1 is connected to the connecting pipe III 503, and the outer pipe channel connection port of the first connector 1 is connected to the connecting pipe IV 504. An auxiliary fan I 501 is installed on the connecting pipe IV 504. The outer pipe channel connection port 306 of the second connector 3 is connected to the connecting pipe V 505, and the inner pipe channel connection port 305 of the second connector 3 is connected to the connecting pipe VI 506. An auxiliary fan II 502 is installed on the connecting pipe VI 506. The airflow direction indicator 508 represents the airflow direction in the mine roadway 507.

[0070] Step 2: Install the device from Step 1 in the mine's single-ended roadway 5. The first connector 1 is located on the closed side of the single-ended roadway. The semiconductor plate 205 on the main unit's inner tube 201 is used for cooling on the side facing the main unit's inner tube 201 and for heating on the other side. The auxiliary fan II 502 draws the mine airflow in the mine roadway 507 into the connecting pipe VI 506. The cooling side of the semiconductor plate 205 generates cold energy. When the high-temperature air in the mine passes through the temperature-conducting channel II 208 of the main unit's inner tube 201, it absorbs the cold energy and its temperature decreases, transforming into low-temperature cold air. The low-temperature air enters the connecting pipe III 503 through the inner tube channel connection port of the first connector 1 and is transported to the mine's single-ended roadway 5.

[0071] Step 3: The auxiliary fan I 501 draws the polluted air in the mine's single-ended roadway 5 into the connecting pipe IV 504. The air then enters the temperature-conducting channel I 204 of the main unit 2 through the external pipe channel connection port of the first connector 1. The heating side of the semiconductor plate 205 generates heat, which is absorbed by the polluted air flowing through the temperature-conducting channel I 204 in the mine's single-ended roadway 5. The air then enters the connecting pipe V 505 through the external pipe channel connection port 306 of the second connector and is transported to the mine's return airway. Finally, the air is discharged to the surface through the return air shaft.

[0072] In this embodiment, in addition to the auxiliary fan I501 guiding the air in the mine's single-ended roadway 5 into the temperature-conducting channel I204 to absorb the heat generated by the heating side of the semiconductor plate 205, the mine's gushing water can also be guided into the temperature-conducting channel I204 by a water pump to absorb the heat generated by the heating side of the semiconductor plate 205, and then discharged to other places or directly transported to the ground through the connecting pipe V505.

[0073] In this embodiment, the advantages of the device of the present invention are: first, to achieve air temperature regulation in the mine's single-ended roadway; second, to increase the wind speed and air volume in the mine's single-ended roadway, thereby improving the air quality of the mine's single-ended roadway; and third, to selectively collect the heat energy generated by the semiconductor board and discharge it into the mine's return airway or to reuse it.

[0074] Example 3: Application of the device of the present invention in the antifreeze at the wellhead and the cooling of the mine shaft in a cold and deep mine.

[0075] Figure 11 The illustration shows an application embodiment of a connectable multi-channel air temperature regulation device in wellhead antifreeze and wellhead cooling in a high-altitude, deep mine. Specifically, multiple channel main units 2 are set up and then connected to a first connector 1 and a second connector 3 to form a synchronized wellhead antifreeze and wellhead cooling system. In this embodiment, one channel main unit 2 is used for wellhead cooling, and two channel main units 2 are connected together for wellhead antifreeze. The semiconductor plate 205 of the channel main unit 2 used for wellhead cooling is used for cooling on the side facing the inner tube 201 of the main unit, and for heating on the other side; the semiconductor plate 205 of the channel main unit 2 used for wellhead antifreeze is used for heating on the side facing the inner tube 201 of the main unit, and for cooling on the other side.

[0076] The application of a connectable multi-channel air temperature control device, which is used in a high-altitude, deep mine to simultaneously achieve wellhead antifreeze and underground cooling, specifically includes the following steps:

[0077] Step 1: One channel host 2 is used for well cooling. Both ends of the channel host 2 are sealed and connected to the first connector 1 and the second connector 3 through sealing rings 304. Two channel hosts 2 are used for wellhead antifreeze. The two channel hosts 2 are connected and then sealed and connected to the first connector 1 and the second connector 3 through sealing rings 304.

[0078] The main unit 2 for wellhead antifreeze, along with the first connector 1 and the second connector 3, is placed on one side of the surface wellhead room 601. The inner pipe channel of the first connector 1 is connected to the connecting pipe VII 602, which extends into the surface wellhead room 601. The outer pipe channel of the first connector 1 is connected to one end of the connecting pipe VIII 604. The inner pipe channel of the second connector 3 is fitted with a blower I 603, and the outer pipe channel of the second connector 3 is connected to one end of the connecting pipe IX 605. A medium-driven pump 606 is installed on the connecting pipe IX 605, and the other end of the connecting pipe IX 605 is connected to the well descent. The outer pipe channel connection port 306 of the second connecting member 3 for well cooling is equipped with a fan II 607. The inner pipe channel connection port 305 of the second connecting member 3 for well cooling is connected to the connecting pipe X 608. The outer pipe channel connection port of the first connecting member 1 for well cooling is connected to the other end of the connecting pipe VIII 604, which is used for the connection between the air temperature regulating device for wellhead antifreeze and the air temperature regulating device for well cooling. The connecting pipes VIII 604 and IX 605 are filled with a heat-conducting medium, which is powered by the medium-driven pump 606 to make the heat-conducting medium circulate in one direction in a closed loop, thus forming a synchronous system for wellhead antifreeze and well cooling.

[0079] Step 2: The semiconductor plate 205 of the channel host 2 for cooling in the well is used for cooling on the side facing the inner tube 201 of the host, and for heating on the other side; the semiconductor plate 205 of the channel host 2 for antifreeze at the wellhead is used for heating on the side facing the inner tube 201 of the host, and for cooling on the other side; the fan I 603 draws outside air into the temperature-conducting channel II 208 of the channel host 2. The heat generated by the semiconductor plate 205 in the channel host 2 for cooling at the wellhead heats the outside air and delivers it to the connecting pipe VII 602 through the temperature-conducting channel II 208 of the channel host 2. The connecting pipe VII 602 delivers the high-temperature gas to the surface wellhead room 601, and then enters the mine through the ventilation shaft for preheating the air at the wellhead and preventing icing at the wellhead;

[0080] Step 3: The downhole cooling fan II 607 ​​draws the high-temperature gas from the well into the second connection part 3 for downhole cooling, and then into the temperature conduction channel II 208 of the channel host 2. The semiconductor board 205 in the channel host 2 generates cooling in the temperature conduction channel II 208. The high-temperature gas absorbs the cooling in the temperature conduction channel II 208 and is cooled down into low-temperature cold air, which is then transported to the air-requiring point through the connecting pipe X 608 to meet the downhole air cooling needs.

[0081] Step 4: The medium-driven pump 606 drives the temperature-conducting medium inside the connecting pipe VIII 604 and connecting pipe IX 605. The temperature-conducting channel I 204 of the wellhead antifreeze channel host 2 conducts the cold energy generated by the cooling side of the semiconductor plate 205, making the temperature-conducting medium a low-temperature medium. The flow of the temperature-conducting medium is used to cool the temperature-conducting channel I 204 of the wellhead antifreeze channel host 2. The temperature-conducting channel I 204 of the wellhead antifreeze channel host 2 conducts the heat generated by the heating side of the semiconductor plate 205, making the temperature-conducting medium a high-temperature medium. The flow of the temperature-conducting medium is used to heat the temperature-conducting channel I 204 of the wellhead antifreeze channel host 2. The heat energy generated by the wellhead antifreeze is used to keep the host warm during wellhead antifreeze, and the low temperature generated by the wellhead antifreeze is used to cool the host during wellhead antifreeze, so as to ensure the normal operation of the wellhead antifreeze and wellhead antifreeze synchronous system.

[0082] In this embodiment, the advantages of the device of the present invention are: firstly, it simultaneously meets the needs of antifreeze at the wellhead and cooling in the mine; secondly, the heat generated by the cooling device and the cold generated by the antifreeze device at the wellhead are both rationally utilized, realizing heat exchange between the surface and the underground, saving energy and ensuring the normal operation of the system; thirdly, the application of the device of the present invention in this embodiment is emission-free and pollution-free, achieving the needs of antifreeze at the wellhead and cooling in the mine without causing any air pollution in the mine.

[0083] This invention provides an air temperature regulation device that not only meets conventional usage requirements but also simultaneously addresses the needs of mine entrance frost prevention and underground heat hazard control. This device utilizes the characteristic of semiconductor materials that can cool on one side and heat on the other, enabling simultaneous cooling and heating to meet the needs of both air heating and cooling. Furthermore, based on different usage scenarios, the device is configured in a connectable modular form, solving the problems of mine entrance frost prevention and underground heat hazard control faced by deep, cold mines, improving temperature transfer efficiency and energy utilization.

Claims

1. A connectable multi-channel air temperature control device, characterized in that, The system includes a channel main unit, whose two ends are sealed and connected to a first connector and a second connector via sealing rings. The channel main unit includes an inner tube and an outer tube, with the outer tube sleeved on the outside of the inner tube. The outer tube has a hollow ring structure, and multiple temperature-conducting support plates are evenly distributed between the inner wall of the outer ring and the outer wall of the inner ring of the outer tube to form multiple temperature-conducting channels I. Multiple semiconductor plates are provided on the outside of the inner tube, separated by thermal insulation strips, and the semiconductor plates are attached to the inner wall of the outer tube. Multiple temperature-conducting spacers are evenly distributed on the inner wall of the inner tube, forming multiple temperature-conducting channels II between the spacers. The first connector and the second connector have the same structure, both including an inner connector tube and an outer connector tube. The outer connector tube is sleeved on the outside of the inner connector tube. Multiple flow guide support plates are provided between the inner connector tube and the outer connector tube at the connection with the channel host. One end of the inner connector tube is sealed to the inner connector tube of the host through a sealing ring, and the other end is provided with an inner tube channel connection port. One end of the outer connector tube is sealed to the outer connector tube of the host through a sealing ring, and the other end is provided with an outer tube channel connection port. The channel host is provided as one or more, and the multiple channel hosts are connected by sealing rings, and then their two ends are respectively sealed and connected to the first connector and the second connector by sealing rings.

2. The connectable multi-channel air temperature regulating device according to claim 1, characterized in that, The shape of the flow guide support plate is the same as the cross-sectional shape of the temperature conduction support sheet, and the number and position of the flow guide support plates correspond to those of the temperature conduction support sheets.

3. The connectable multi-channel air temperature regulating device according to claim 1, characterized in that, The inner tube of the connector is filled with thermal insulation material.

4. The connectable multi-channel air temperature regulating device according to claim 1, characterized in that, The thermally conductive support sheet and thermally conductive partition are spiral-shaped, and the thermally conductive channels I and II are spiral-shaped thermally conductive channels.

5. The connectable multi-channel air temperature regulating device according to claim 1, characterized in that, The outer wall of the main unit's outer tube is wrapped with a heat insulation layer.

6. An application of a connectable multi-channel air temperature control device, employing the temperature control device of claim 1, wherein the device is used for air cooling in conventional spaces, characterized in that... Specifically, the following steps are included: Step 1: Use a channel main unit. The two ends of the channel main unit are sealed and connected to the first connector and the second connector through sealing rings. The inner tube channel connection port of the first connector is connected to the connecting pipe I, and the outer tube channel connection port of the first connector is connected to the connecting pipe II. The connecting pipe I and the connecting pipe II are connected in a normal space at a distance apart. An air drive device is installed on the inner tube channel connection port of the second connector. Step 2: The semiconductor board on the inner tube of the main unit is used for cooling on the side facing the inner tube and for heating on the other side; the air drive device draws external air into the temperature conduction channel II of the main unit. The cooling side of the semiconductor board generates cold energy. When the air passes through the temperature conduction channel II of the inner tube of the main unit, it absorbs the cold energy and its temperature drops to low temperature cold air. The low temperature cold air enters the normal space through the connecting pipe I. Step 3: When the normal space is a closed space, after the low temperature cold air enters the closed space, the original high temperature air in the closed space will enter the temperature conduction channel I of the channel host through the connecting pipe II. The heating side of the semiconductor board generates heat, which is absorbed by the air flowing through the temperature conduction channel I and discharged through the outer pipe channel connection port of the second connector. When the regular space is not a sealed space, after the low-temperature cold air enters the sealed space, the original high-temperature air in the sealed space will be discharged through other channels in the regular space. Tap water is introduced into the external pipe channel connection port of the second connector. The low-temperature tap water enters the temperature conduction channel I of the channel host through the external pipe channel connection port of the second connector. Heat is generated on the heating side of the semiconductor plate. The low-temperature tap water will absorb the heat generated on the heating side of the semiconductor plate in the temperature conduction channel I and be heated. Finally, it enters the connecting pipe II through the external pipe channel connection port of the first connector and is used as domestic water in the regular space.

7. An application of a connectable multi-channel air temperature regulating device, employing the temperature regulating device as described in claim 1, wherein the device is used to reduce air temperature in a single-ended mine shaft, characterized in that... Specifically, the following steps are included: Step 1: A channel main unit is used. The two ends of the channel main unit are sealed and connected to the first connector and the second connector through sealing rings. The inner pipe channel connection port of the first connector is connected to the connecting pipe III, and the outer pipe channel connection port of the first connector is connected to the connecting pipe IV. An auxiliary fan I is installed on the connecting pipe IV. The outer pipe channel connection port of the second connector is connected to the connecting pipe V, and the inner pipe channel connection port of the second connector is connected to the connecting pipe VI. An auxiliary fan II is installed on the connecting pipe VI. Step 2: Install the device from Step 1 in the mine's dead-end roadway. The first connector is located on the closed side of the dead-end roadway. The semiconductor plate on the inner tube of the main unit is used for cooling on the side facing the inner tube of the main unit, and for heating on the other side. The auxiliary fan II draws the mine airflow in the mine roadway into the connecting pipe VI. The cooling side of the semiconductor plate generates cold energy. When the high-temperature air in the mine passes through the temperature conduction channel II of the inner tube of the main unit, it absorbs the cold energy and its temperature decreases, becoming low-temperature cold air. The low-temperature air enters the connecting pipe III through the inner tube channel connection port of the first connector and is transported to the mine's dead-end roadway. Step 3: Auxiliary fan I draws polluted air from the mine's single-ended roadway into connecting pipe IV. The air then enters the temperature-conducting channel I of the main unit through the external pipe connection port of the first connector. Heat is generated on the heating side of the semiconductor plate. This heat is absorbed by the polluted air flowing through the temperature-conducting channel I and then enters connecting pipe V through the external pipe connection port of the second connector before being transported to the mine's return airway. Finally, the air is discharged to the surface through the return air shaft.

8. An application of a connectable multi-channel air temperature regulating device, employing the temperature regulating device described in claim 1, wherein the device is applied in high-altitude, deep mines to simultaneously achieve wellhead antifreeze and underground cooling, characterized in that... Specifically, the following steps are included: Step 1: One channel main unit is used for well cooling. The two ends of the channel main unit are sealed and connected to the first and second connecting parts through sealing rings. Two channel main units are used for wellhead antifreeze. The two channel main units are connected and then sealed and connected to the first and second connecting parts through sealing rings. The main unit for wellhead antifreeze, along with the first and second connecting parts, is placed on one side of the wellhead house on the ground. The inner pipe channel of the first connecting part for wellhead antifreeze is connected to connecting pipe VII, which extends into the wellhead house on the ground. The outer pipe channel of the first connecting part for wellhead antifreeze is connected to one end of connecting pipe VIII. A blower I is installed at the inner pipe channel of the second connecting part for wellhead antifreeze, and the outer pipe channel of the second connecting part for wellhead antifreeze is connected to one end of connecting pipe IX. A media drive is installed on connecting pipe IX. The pump is connected to the other end of the connecting pipe IX, which is connected to the outer pipe channel of the second connector for well cooling. The inner pipe channel of the second connector for well cooling is equipped with a fan II. The inner pipe channel of the first connector for well cooling is connected to the connecting pipe X. The outer pipe channel of the first connector for well cooling is connected to the other end of the connecting pipe VIII, which is used for the connection between the air temperature regulating device for wellhead antifreeze and the air temperature regulating device for well cooling. The connecting pipes VIII and IX are filled with a heat-conducting medium. Step 2: The semiconductor plate of the channel host for cooling down the well is used for cooling on the side facing the inner tube of the host, and for heating on the other side; the semiconductor plate of the channel host for antifreeze at the wellhead is used for heating on the side facing the inner tube of the host, and for cooling on the other side; Fan I draws outside air into the temperature-conducting channel II of the channel host. The heat generated by the semiconductor plate on the heating side of the channel host for cooling down the wellhead heats the outside air and delivers it to the connecting pipe VII through the temperature-conducting channel II of the channel host. The connecting pipe VII delivers the high-temperature gas to the surface wellhead room, and then enters the mine through the ventilation shaft for preheating the air at the wellhead and preventing ice formation at the wellhead; Step 3: The downhole cooling fan II draws the high-temperature gas from the well into the second connection of the downhole cooling unit, and then into the temperature conduction channel II of the channel host. The semiconductor board in the downhole cooling channel host generates cooling in the temperature conduction channel II. The high-temperature gas absorbs the cooling in the temperature conduction channel II and is cooled down into low-temperature cold air, which is then transported to the air demand point through the connecting pipe X to meet the downhole air cooling needs. Step 4: The medium-driven pump drives the temperature-conducting medium inside connecting pipes VIII and IX. The temperature-conducting channel I of the wellhead antifreeze channel host conducts the cold energy generated by the cooling side of the semiconductor plate, making the temperature-conducting medium a low-temperature medium. The flow of the temperature-conducting medium is used to cool down the temperature-conducting channel I of the wellhead cooling channel host. The temperature-conducting channel I of the wellhead cooling channel host conducts the heat generated by the heating side of the semiconductor plate, making the temperature-conducting medium a high-temperature medium. The flow of the temperature-conducting medium is used to heat up the temperature-conducting channel I of the wellhead antifreeze channel host.

Citation Information

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