Measurement method and detection device

Abstract

The application discloses a kind of measurement method and detection equipment, measurement method includes the following steps: selecting the gold finger of image to be measured, selecting target gold finger from gold finger, determine the setting direction of target gold finger;In the image to be measured, the coordinates of outer frame are obtained, the chamfer region of gold finger is determined according to the coordinates of outer frame, the chamfer region of gold finger includes the frame line on the two sides of target gold finger and the frame line in the frame line between target gold finger, and the gold finger between frame line;The region outside the chamfer region of gold finger is determined as non-chamfer region according to the coordinates of outer frame;According to the coordinates of outer frame, the frame line in the non-chamfer region and target gold finger is obtained, the distance between the frame line of non-chamfer region and the frame line of the chamfer region of gold finger where target gold finger is located is calculated, and measurement data is obtained.The measurement method of the application can reduce the possibility of measurement error or omission, and improve the measurement efficiency.The detection equipment with the above measurement method also has the above advantages.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic processing, and in particular to a measurement method and a detection device. BACKGROUND

[0002] In the design of a circuit board, there is a spacing requirement between the area provided with a gold finger pad and the area not provided with a gold finger pad, so as to ensure that the gold finger area has good contact and connection.

[0003] In the related art, the positions to be measured are found on the design drawing of the circuit board by manual operation, and then the positions are measured, and whether the circuit board meets the spacing requirement is determined according to the measurement value. The measurement method is slow and inefficient. When the number of measured positions is large, the measurement method is prone to measurement errors or omissions. SUMMARY

[0004] The present application aims to at least solve one of the technical problems in the prior art. To this end, the present application provides a measurement method and a detection device, which can reduce the possibility of measurement errors or omissions in the measurement process and improve the measurement efficiency.

[0005] The present application also provides a detection device having the above measurement method.

[0006] The measurement method according to the first aspect of the present application is used for detecting a circuit board, and the measurement method comprises the following steps:

[0007] Determining the direction: selecting a gold finger in a to-be-measured image, selecting a target gold finger from the gold finger, and determining the setting direction of the target gold finger; grouping: in the to-be-measured image, obtaining the coordinates of an outer frame, determining a gold finger chamfer area according to the coordinates of the outer frame, the gold finger chamfer area including the frame lines on both sides of the target gold finger and the target gold finger in the same direction and the closest distance, and the gold finger between the frame lines; determining an area outside the gold finger chamfer area as a non-chamfer area according to the coordinates of the outer frame; calculating: according to the coordinates of the outer frame, obtaining the frame line in the non-chamfer area in the same direction as the target gold finger, calculating the spacing between the frame line of the non-chamfer area and the frame line of the gold finger chamfer area where the target gold finger is located, and obtaining measurement data.

[0008] According to the measuring method, the setting direction of the target golden finger and the coordinates of the outer frame can be determined, so that all targets on the circuit board that need to be measured can be obtained, thereby avoiding the omission in the measuring process. Meanwhile, the coordinates of the outer frame and the target golden finger can be used to obtain the chamfered area and the non-chamfered area of the golden finger. The distance value can be directly obtained by measuring the distance between the chamfered area and the non-chamfered area of the golden finger, so that the measuring speed and the measuring efficiency are improved, and the problems of measuring errors or omissions are effectively solved. Therefore, the measured data is more reliable, and can be used to determine whether the circuit board meets the distance requirement, so as to improve the accuracy of the determination.

[0009] According to some embodiments of the present application, in the step of determining the direction, the method of selecting the golden finger in the image to be measured comprises: marking the golden finger according to the image to be measured, and selecting the golden finger by recognizing the mark; or selecting the golden finger from the image to be measured according to the shape structure; or selecting the golden finger from the image to be measured according to the arrangement mode.

[0010] According to some embodiments of the present application, in the step of determining the direction, the method of determining the setting direction of the target golden finger comprises:

[0011] The coordinates of any point in the outer frame are obtained as reference coordinates;

[0012] In the first direction, the frame lines located on both sides of the reference coordinates are obtained;

[0013] In the second direction, the frame lines located on both sides of the reference coordinates are obtained;

[0014] The first direction is perpendicular to the second direction. The setting direction of the target golden finger is determined by the setting position of the target golden finger, wherein the target golden finger located on the frame lines on both sides of the reference coordinates in the first direction is defined as a vertical golden finger, and the setting direction is vertical. The target golden finger located on the frame lines on both sides of the reference coordinates in the second direction is defined as a horizontal golden finger, and the setting direction is horizontal.

[0015] According to some embodiments of the present application, in the step of grouping, in the image to be measured, the coordinates of the outer frame are obtained, and the method of determining the chamfered area of the golden finger according to the coordinates of the outer frame comprises:

[0016] In the image to be measured, the frame line in the same direction as the target golden finger is obtained;

[0017] The coordinates of the frame line in the same direction as the target golden finger and the target golden finger are obtained;

[0018] The distance between the frame line in the same direction as the target golden finger and the target golden finger is measured by the coordinate parameter, and the frame lines closest to the target golden finger on both sides of the target golden finger are selected from the frame lines in the same direction as the target golden finger;

[0019] The golden fingers between the frame lines closest to the target golden finger on both sides of the target golden finger are selected.

[0020] The frame lines closest to the target golden finger on both sides of the target golden finger and the golden fingers between the frame lines are collectively defined as a golden finger chamfer region.

[0021] According to some embodiments of the present application, the method for selecting the golden fingers between the frame lines closest to the target golden finger on both sides of the target golden finger comprises:

[0022] The coordinate parameters of the frame lines closest to the target golden finger on both sides of the target golden finger are obtained, and a coordinate interval is formed by the coordinate parameters;

[0023] The golden fingers in the same direction as the target golden finger are obtained.

[0024] The coordinate parameters of the golden fingers in the same direction as the target golden finger are obtained.

[0025] The golden fingers in the same direction as the target golden finger and having coordinate parameters within the coordinate interval are selected.

[0026] According to some embodiments of the present application, in the grouping step, if the circuit board has multiple groups of golden finger chamfer regions, before performing the method for determining the regions other than the golden finger chamfer regions as non-chamfer regions according to the coordinates of the outer frame, the frame lines and golden fingers in the known golden finger chamfer regions need to be removed, and new golden finger chamfer regions are determined in a loop until all the golden finger chamfer regions in the circuit board are determined.

[0027] According to some embodiments of the present application, in the grouping step, the method for determining the regions other than the golden finger chamfer regions as non-chamfer regions according to the coordinates of the outer frame comprises:

[0028] The frame lines of the outer frame are obtained.

[0029] The frame lines of all the golden finger chamfer regions are obtained.

[0030] The frame lines of the golden finger chamfer regions are removed from the frame lines of the outer frame.

[0031] The remaining frame lines of the frame lines of the outer frame are determined as non-chamfer regions.

[0032] According to some embodiments of the present application, in the step of calculating, according to the coordinates of the outer frame, the edge frame line in the non-chamfered area in the same direction as the target golden finger, the distance between the edge frame line of the non-chamfered area and the edge frame line of the golden finger chamfered area where the target golden finger is located is calculated, and the method for obtaining the measurement data comprises the following steps of:

[0033] obtaining the coordinates of the edge frame line of the golden finger chamfered area where the target golden finger is located;

[0034] obtaining the coordinates of the edge frame line in the non-chamfered area in the same direction as the target golden finger;

[0035] measuring the distance between the edge frame line of the golden finger chamfered area where the target golden finger is located and the edge frame line in the non-chamfered area in the same direction as the target golden finger;

[0036] obtaining the measurement data.

[0037] According to some embodiments of the present application, the measurement method further comprises the following steps of:

[0038] obtaining the minimum distance from the measurement data, and comparing the minimum distance with a standard value;

[0039] if the minimum distance is not less than the standard value, the circuit board meets the distance requirement;

[0040] if the minimum distance is less than the standard value, the circuit board does not meet the distance requirement.

[0041] According to the second aspect of the embodiments of the present application, the detection device comprises:

[0042] a memory and a processor, the memory being in communication with the processor, the memory storing a measurement program, and the processor executing the measurement program to realize the steps of the measurement method of any one of the above embodiments.

[0043] According to the detection device of the embodiments of the present application, at least the following beneficial effects are achieved: the measurement program is stored in the memory, so that when the circuit board needs to be tested, the processor can execute the measurement program to obtain the distance between the golden finger chamfered area and the non-chamfered area, thereby detecting the circuit board.

[0044] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0045] The present application will be further described below in conjunction with the drawings and embodiments, wherein:

[0046] Figure 1Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0047] Figure 2 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0048] Figure 3 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0049] Figure 4 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0050] Figure 5 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0051] Figure 6 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0052] Figure 7 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0053] Figure 8 Fig. 1 is a schematic diagram of a circuit board according to an embodiment of the present application.

[0054] Reference signs:

[0055] Circuit board 100; golden finger 110; vertical golden finger 111; horizontal golden finger 112;

[0056] Outer frame 120; reference coordinate 121; frame line 122; measurement edge line 123; first boundary 1231; second boundary 1232; horizontal edge line 124; vertical edge line 125;

[0057] Golden finger chamfer region 130; non-chamfer region 140; interval h. DETAILED DESCRIPTION

[0058] Embodiments of the present application are described in detail below with reference to the accompanying drawings, in which like reference numerals refer to like elements throughout. The embodiments described below are examples of the present application, and are not intended to limit the present application.

[0059] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0060] In the description of the present application, if several meanings are one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features.

[0061] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0062] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0063] The measurement method of the first aspect embodiment of the present application is described below with reference to the accompanying drawings of the specification. It should be noted that the first direction in the embodiment is shown in the up-down direction in the drawings, and the second direction is shown in the left-right direction in the drawings.

[0064] The embodiment of the present application provides a measurement method for detecting a circuit board 100, which comprises determining direction, grouping and calculation. The determining direction step comprises: selecting a gold finger in a to-be-measured image, selecting a target gold finger from the gold finger, and determining the setting direction of the target gold finger; the grouping step comprises: obtaining the coordinates of an outer frame in the to-be-measured image, determining a gold finger chamfer region according to the coordinates of the outer frame, and determining a non-chamfer region outside the gold finger chamfer region according to the coordinates of the outer frame; the calculation step comprises: obtaining a frame line in the non-chamfer region in the same direction as the target gold finger according to the coordinates of the outer frame, calculating the distance between the frame line of the non-chamfer region and the frame line of the gold finger chamfer region where the target gold finger is located, and obtaining measurement data. In application, the above determining direction, grouping and calculation steps can be performed in sequence, for example: refer to Figures 1 to 3 As shown, the measurement method comprises the following steps:

[0065] S100, determining direction: selecting a gold finger in a to-be-measured image, selecting a target gold finger from the gold finger, and determining the setting direction of the target gold finger;

[0066] S200, grouping: obtaining the coordinates of the outer frame in the image to be measured, determining the gold finger chamfer region according to the coordinates of the outer frame, and determining the region outside the gold finger chamfer region as the non-chamfer region; wherein the gold finger chamfer region includes the frame lines closest to the target gold finger on both sides of the target gold finger and the gold fingers between the frame lines;

[0067] S300, calculation: obtaining the frame lines in the non-chamfer region in the same direction as the target gold finger according to the coordinates of the outer frame, calculating the distance between the frame lines of the non-chamfer region and the frame lines of the gold finger chamfer region where the target gold finger is located, and obtaining the measurement data.

[0068] Alternatively, in some embodiments, the above measurement method can be implemented in other orders, for example, "obtaining the coordinates of the outer frame" can be performed before the step of selecting the gold finger in the image to be measured; for example, the coordinates of the gold finger and the outer frame in the image to be measured are obtained at the beginning of the measurement; or, after the step of "selecting the gold finger in the image to be measured" is completed, the two steps of "selecting the target gold finger from the gold finger" and "obtaining the coordinates of the outer frame" are performed simultaneously.

[0069] Specifically, in step S100, all gold fingers 110 in the image to be measured need to be selected, and then a target gold finger is selected from all gold fingers 110, and the setting direction of the target gold finger is determined. The setting direction includes horizontal setting and vertical setting. It should be noted that the selected target gold finger can be any one or multiple.

[0070] In step S200, the coordinates of the outer frame 120 in the image to be measured are obtained. The outer frame 120 is the outer periphery of the circuit board 100, and the outer frame 120 includes a plurality of frame lines 122. The gold finger chamfer region 130 is determined according to the coordinates of the outer frame 120 and the setting direction of the target gold finger to achieve grouping. Before determining the gold finger chamfer region 130, the frame lines 122 closest to the target gold finger on both sides of the target gold finger and in the same direction as the target gold finger need to be obtained. The same direction means that the orientation of the frame line 122 is the same as the setting direction of the gold finger 110, which is horizontal or vertical. For ease of understanding, refer to Figure 1 and Figure 2As shown in the figure, in the embodiment of the present application, the frame lines 122 located on both sides of the target golden finger and in the same direction as the target golden finger and closest to the target golden finger are defined as the first boundary 1231 and the second boundary 1232 respectively. The golden finger chamfer region 130 includes the first boundary 1231, the second boundary 1232 and the golden finger 110 between the first boundary 1231 and the second boundary 1232. In step S200, the step of "determining the region outside the golden finger chamfer region as the non-chamfer region according to the coordinates of the outer frame" needs to remove all the coordinates of the first boundary 1231 and the coordinates of the second boundary 1232 from the coordinates of the outer frame 120, and the remaining frame lines 122 are the non-chamfer region 140, which does not include the golden finger 110. The golden finger chamfer region 130 and the non-chamfer region 140 are the targets to be measured. Through step S200, all the golden finger chamfer regions 130 and non-chamfer regions 140 to be measured in the measurement process can be found out, so that the possibility of measurement omission in the measurement process is avoided, and the measurement efficiency is improved.

[0071] In step S300, according to the coordinates of the outer frame 120, the frame lines 122 in the same direction as the target golden finger in the non-chamfer region 140 are obtained. For ease of understanding, refer to Figure 1 and Figure 2 As shown in the figure, in the embodiment of the present application, the frame lines 122 located on both sides of the target golden finger and in the same direction as the target golden finger and closest to the target golden finger are defined as the first boundary 1231 and the second boundary 1232 respectively. The golden finger chamfer region 130 includes the first boundary 1231, the second boundary 1232 and the golden finger 110 between the first boundary 1231 and the second boundary 1232. In step S200, the step of "determining the region outside the golden finger chamfer region as the non-chamfer region according to the coordinates of the outer frame" needs to remove all the coordinates of the first boundary 1231 and the coordinates of the second boundary 1232 from the coordinates of the outer frame 120, and the remaining frame lines 122 are the non-chamfer region 140, which does not include the golden finger 110. The golden finger chamfer region 130 and the non-chamfer region 140 are the targets to be measured. Through step S200, all the golden finger chamfer regions 130 and non-chamfer regions 140 to be measured in the measurement process can be found out, so that the possibility of measurement omission in the measurement process is avoided, and the measurement efficiency is improved.

[0072] In the prior art, the position to be measured needs to be found on the design drawing of the circuit board 100 by manual operation, and then the position is measured and the measured value is recorded. Compared with the prior art, the measurement method provided by the present application determines the setting direction of the target golden finger and the coordinates of the outer frame 120 to obtain all the targets to be measured on the circuit board 100, thereby avoiding the omission in the measurement process. At the same time, the circuit board 100 is grouped by using the coordinates of the outer frame 120 and the setting direction of the target golden finger to form a golden finger chamfer region 130 and a non-chamfer region 140. The distance value can be directly obtained by measuring the spacing h between the golden finger chamfer region 130 and the non-chamfer region 140. The measurement method measures the circuit board 100 through simple and convenient steps, thereby improving the speed and measurement efficiency of the measurement method.

[0073] In some embodiments, in step S100, the method of "picking up the golden finger in the image to be measured" includes: before obtaining the image to be measured, marking the golden finger 110 on the image to be measured, wherein the marking can be a symbol mark, such as a shape symbol drawn on the golden finger 110 in advance, a numerical symbol, or a pattern symbol, etc., or a color mark, etc. All the golden fingers 110 in the image to be measured are picked up by recognizing the marking.

[0074] In another embodiment, the golden fingers 110 in the image to be measured can be picked up by the shape structure of the golden fingers 110, such as: if only the golden fingers 110 in the circuit board 100 are in a rectangular structure, all the golden fingers 110 can be picked up by recognizing the object in the rectangular structure. In other embodiments, the golden fingers 110 can also be picked up by the arrangement method, such as: the arrangement method of the golden fingers 110 is often equidistant and arrayed, and the golden fingers 110 can also be picked up from the image to be measured by recognizing the arrangement method.

[0075] In some embodiments, in step S100, the method of "determining the setting direction of the target golden finger" includes:

[0076] Obtaining the coordinates of any point in the outer frame as a reference coordinate;

[0077] Obtaining the frame lines on both sides of the reference coordinate along the first direction;

[0078] Obtaining the frame lines on both sides of the reference coordinate along the second direction.

[0079] Specifically, the setting direction of the target golden finger can be determined by the setting position of the target golden finger. Referring to Figure 1 and Figure 2As shown in FIG. 1, wherein the up-down direction in the drawing is the first direction, and the left-right direction is the second direction. Taking any point in the outer frame 120 as the reference coordinate 121, the coordinate parameters of the reference coordinate 121 are obtained, and the setting direction of the target golden finger is determined through the reference coordinate 121. Along the first direction, the frame lines 122 located on the upper and lower sides of the reference coordinate 121 are obtained. For the convenience of understanding and description, the frame lines 122 located on the upper and lower sides of the reference coordinate 121 are defined as horizontal edge lines 124 in the following. Along the second direction, the frame lines 122 located on the left and right sides of the reference coordinate 121 are obtained. For the convenience of understanding and description, the frame lines 122 located on the left and right sides of the reference coordinate 121 are defined as vertical edge lines 125 in the following. Since the setting direction of the target golden finger is perpendicular to the frame line 122. Therefore, the target golden finger perpendicular to the horizontal edge line 124 and located on the horizontal edge line 124 is defined as a vertical golden finger 111, and the setting direction of the vertical golden finger 111 is vertical; the target golden finger perpendicular to the vertical edge line 125 and located on the vertical edge line 125 is defined as a horizontal golden finger 112, and the setting direction of the horizontal golden finger 112 is horizontal, thereby determining the setting direction of the target golden finger through the setting position of the target golden finger.

[0080] In some embodiments, referring to FIGS. 1-2, in step S200, the operation method of "obtaining the coordinates of the outer frame in the to-be-tested image, and determining the golden finger chamfer region according to the coordinates of the outer frame" includes: Figure 1 、 Figure 2 and Figure 4 As shown in FIG. 1, in step S200, the operation method of "obtaining the coordinates of the outer frame in the to-be-tested image, and determining the golden finger chamfer region according to the coordinates of the outer frame" includes:

[0081] S210, obtaining the frame line in the same direction as the target golden finger in the to-be-tested image;

[0082] S220, obtaining the coordinate parameters of the frame line in the same direction as the target golden finger and the target golden finger;

[0083] S230, measuring the distance between the frame line in the same direction as the target golden finger and the target golden finger through the coordinate parameters, and selecting the frame lines located on the two sides of the target golden finger and closest to the target golden finger from the frame line in the same direction as the target golden finger;

[0084] S240, selecting the golden finger between the frame lines located on the two sides of the target golden finger and closest to the target golden finger.

[0085] Specifically, in step S210, since the outer border 120 of the image to be tested contains multiple border lines 122, it is necessary to select the border line 122 that is in the same direction as the gold finger 110 from the multiple border lines 122. For ease of understanding and description, in this embodiment, the border lines 122 that are in the same direction as the gold finger 110 are collectively referred to as "same-direction border lines". In step S220, the coordinates of the same-direction border lines and the target gold finger are obtained to obtain the first boundary 1231 and the second boundary 1232. In step S230, the distance between each same-direction border line and the target gold finger is measured using the coordinate parameters of the same-direction border lines and the coordinate parameters of the target gold finger, thereby determining the border line 122 that is closest to the target gold finger among the same-direction border lines, thus obtaining the first boundary 1231 and the second boundary 1232. Since the first boundary 1231 and the second boundary 1232 are located on both sides of the target gold finger, and there is a gap between the first boundary 1231 and the second boundary 1232, in step S240, in order to define the gold finger chamfer area 130, it is necessary to select all the gold fingers 110 located between the first boundary 1231 and the second boundary 1232, so that the first boundary 1231, the second boundary 1232 and all the gold fingers 110 between the first boundary 1231 and the second boundary 1232 are collectively defined as the gold finger chamfer area 130, thereby achieving the grouping effect of "determining the gold finger chamfer area according to the coordinates of the outer frame" in step S200.

[0086] In some embodiments, see Figure 1 , Figure 2 and Figure 5 As shown, step S240 specifically includes the following steps:

[0087] S241. Obtain the coordinate parameters of the nearest border line 122 located on both sides of the target gold finger, and form a coordinate range using the coordinate parameters;

[0088] S242, Obtain a cheat code that is in the same direction as the target cheat code;

[0089] S243. Obtain the coordinate parameters of the gold finger that is in the same direction as the target gold finger;

[0090] S244. Select the gold fingers that are in the same direction as the target gold fingers and whose coordinate parameters are within the coordinate range.

[0091] Specifically, since there is a distance between the first boundary 1231 and the second boundary 1232, if there are other gold fingers 110 between the first boundary 1231 and the second boundary 1232 in addition to the target gold finger, the other gold fingers 110 between the first boundary 1231 and the second boundary 1232 need to be selected to define the gold finger chamfer region 130. In order to select the other gold fingers 110 between the first boundary 1231 and the second boundary 1232, the coordinate parameters of the first boundary 1231 and the second boundary 1232 need to be obtained through step S241. Since the first boundary 1231 and the second boundary 1232 are respectively located on both sides of the target gold finger, the coordinate parameters of the first boundary 1231 and the second boundary 1232 have differences in the vertical direction or the horizontal direction. Referring to Figure 2 As shown, if the target gold finger is the horizontal gold finger 112, the first boundary 1231 and the second boundary 1232 have a distance in the first direction. Referring to Figure 1 As shown, if the target gold finger is the vertical gold finger 111, the first boundary 1231 and the second boundary 1232 have a distance in the second direction. The distance between the first boundary 1231 and the second boundary 1232 forms a coordinate interval. Since the direction of the target gold finger needs to be determined in step S100, the other gold fingers 110 in the same direction as the target gold finger can be obtained through the same method in step S242. The coordinate parameters of the gold fingers 110 in the same direction as the target gold finger are obtained through step S243. Finally, the gold fingers 110 in the same direction as the target gold finger and whose coordinate parameters are located in the coordinate interval formed by the first boundary 1231 and the second boundary 1232 are selected through step S244, so that the first boundary 1231, the second boundary 1232, the target gold finger and the selected gold fingers 110 can be collectively defined as the gold finger chamfer region 130.

[0092] In some embodiments, referring to Figure 1 and Figure 2As shown, in step S200, if the circuit board 100 has multiple sets of the gold finger chamfer region 130, i.e. the circuit board 100 includes at least two sets of the gold finger chamfer region 130. Before performing the operation of "determining the region other than the gold finger chamfer region as the non-chamfer region according to the coordinates of the outer frame" in step S200, the first boundary 1231, the second boundary 1232 and the gold finger 110 between the first boundary 1231 and the second boundary 1232 in the determined gold finger chamfer region 130 are removed from the outer frame 120 and the selected gold finger 110 in step S100, and then the new target gold finger is selected to determine the other gold finger chamfer region 130, so as to avoid the influence of the determined gold finger chamfer region 130 on the selection of the new target gold finger to find the new gold finger chamfer region 130, and to avoid the repeated determination of the gold finger chamfer region 130. When all the gold finger chamfer regions 130 are determined, the operation of "determining the region other than the gold finger chamfer region as the non-chamfer region according to the coordinates of the outer frame" in step S200 is performed. Since each determined new gold finger chamfer region 130 includes the gold finger 110. When the known gold finger chamfer region 130 is removed to determine the new gold finger chamfer region 130, if all the gold fingers 110 in the circuit board 100 are removed and there is no gold finger 110 that can be selected as the target gold finger, it indicates that all the gold finger chamfer regions 130 in the circuit board 100 are determined, and then the operation of "determining the region other than the gold finger chamfer region as the non-chamfer region according to the coordinates of the outer frame" in step S200 is performed.

[0093] In some embodiments, as shown in Figure 1 、 Figure 2 and Figure 6 , the operation of "determining the region other than the gold finger chamfer region as the non-chamfer region according to the coordinates of the outer frame" in step S200 specifically includes the following steps:

[0094] S250, obtaining the frame line of the outer frame;

[0095] S260, obtaining the frame line of all the gold finger chamfer regions;

[0096] S270, removing the frame line of the gold finger chamfer region from the frame line of the outer frame;

[0097] S280, determining the remaining frame line of the frame line of the outer frame as the non-chamfer region.

[0098] Specifically, after all the gold finger chamfer regions 130 of the circuit board 100 are determined, the frame line 122 of the outer frame 120 is determined by step S250, wherein the first boundary 1231 and the second boundary 1232 of the gold finger chamfer region 130 are also contained in the frame line 122 of the outer frame 120. Then the frame line 122 of all the gold finger chamfer regions 130, i.e. all the first boundaries 1231 and the second boundaries 1232 on the circuit board 100, is obtained by step S260. In step S270, all the first boundaries 1231 and the second boundaries 1232 on the circuit board 100 are removed from the frame line 122 of the outer frame 120 obtained in step S250. The remaining frame line 122 is defined as the non-chamfer region 140 in step S280, so that all the frame lines 122 in the outer frame 120 can be screened and classified to avoid omission in the measurement process, and facilitate the calculation in step S300.

[0099] In some embodiments, as shown in Figure 1 、 Figure 2 and Figure 7 , step S300 further comprises the following steps:

[0100] S310, obtaining the coordinates of the frame line of the gold finger chamfer region where the target gold finger is located;

[0101] S320, obtaining the coordinates of the frame line in the non-chamfer region which is in the same direction as the target gold finger;

[0102] S330, measuring the distance between the frame line of the gold finger chamfer region where the target gold finger is located and the frame line in the non-chamfer region which is in the same direction as the target gold finger.

[0103] Specifically, when the gold finger chamfer region 130 and the non-chamfer region 140 need to be measured to detect the circuit board 100, the coordinates of the frame line 122 of the gold finger chamfer region 130 to be measured, i.e. the coordinate parameters of the first boundary 1231 and the second boundary 1232 to be measured, are obtained by step S310. Then the coordinates of the frame line 122 in the non-chamfer region 140 which is in the same direction as the target gold finger, i.e. the coordinates of the measurement edge line 123, are obtained by step S320. Finally, in step S430, the distance between the first boundary 1231 and the measurement edge line 123, and the distance between the second boundary 1232 and the measurement edge line 123 are measured. Thus the distance h between the gold finger chamfer region 130 and each non-chamfer region 140 is obtained, and the measurement data is obtained.

[0104] In some embodiments, as shown in Figure 1 、 Figure 2 and Figure 8 , the measurement method further comprises the following steps:

[0105] S400, obtaining the minimum distance from the measurement data, comparing the minimum distance with the standard value;

[0106] S410, if the minimum distance is not less than the standard value, the circuit board meets the distance requirement;

[0107] S420, if the minimum distance is less than the standard value, the circuit board does not meet the distance requirement.

[0108] Specifically, after step S300 is performed, the distance h between each group of the gold finger chamfer region 130 and the measurement line 123 is obtained, and in step S400, the minimum distance value is obtained from all the measurement data by comparing the value of the distance h. Since the circuit board 100 has a distance requirement between the gold finger chamfer region 130 and the non-chamfer region 140 during the design process to ensure that the gold finger chamfer region 130 has good contact and connection. Therefore, by comparing the minimum distance value with the standard value, it can be determined whether the circuit board 100 meets the distance requirement. If the minimum distance value is not less than the distance standard value of the circuit board 100, it indicates that the gold finger chamfer region 130 and the non-chamfer region 140 meet the distance requirement, and the circuit board 100 can be used normally; if the minimum distance value is less than the distance standard value of the circuit board 100, it indicates that the gold finger chamfer region 130 and the non-chamfer region 140 do not meet the distance requirement, and the circuit board 100 cannot be used normally and needs to be improved. Through these steps, the design result of the circuit board 100 can be directly obtained, and manual comparison of measurement values is no longer needed, thereby improving the measurement efficiency.

[0109] The detection device of the second aspect of the present application will be described below with reference to the accompanying drawings. Referring to Figures 1 to 8 As shown in the figure, the detection device includes a memory and a processor, wherein the processor is in communication with the memory, the memory is a computer readable storage medium, and the memory stores a measurement program, which is a computer program for executing the method steps in the above embodiments. When it is necessary to detect the circuit board 100, the processor reads the storage content in the memory and executes the measurement program in the memory to realize the steps of the measurement method in any of the above embodiments.

[0110] The detection device of this embodiment stores the measurement program in the memory, so that when it is necessary to test the circuit board 100, the distance between the gold finger chamfer region 130 and the non-chamfer region 140 can be obtained by executing the measurement program by the processor to detect the circuit board 100, thereby improving the detection efficiency of the circuit board 100.

[0111] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application. Furthermore, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A measurement method for detecting a wiring board, characterized by, The measurement method comprises the following steps: Determination of direction: selecting a gold finger in a to-be-measured image, selecting a target gold finger from the gold finger, and determining the setting direction of the target gold finger; Grouping: in the to-be-measured image, coordinates of an outer frame are obtained, a gold finger chamfer region is determined according to the coordinates of the outer frame, the gold finger chamfer region comprises frame lines on both sides of the target gold finger and pointing in the same direction as the target gold finger and closest to the target gold finger, and gold fingers between the frame lines; and a region outside the gold finger chamfer region is determined as a non-chamfer region according to the coordinates of the outer frame; In the to-be-measured image, the method for determining the gold finger chamfer region according to the coordinates of the outer frame comprises: obtaining frame lines pointing in the same direction as the target gold finger in the to-be-measured image; obtaining coordinate parameters of the frame lines pointing in the same direction as the target gold finger and the target gold finger; measuring the distance between the frame lines pointing in the same direction as the target gold finger and the target gold finger through the coordinate parameters; selecting frame lines on both sides of the target gold finger and closest to the target gold finger from the frame lines pointing in the same direction as the target gold finger; selecting gold fingers between the frame lines on both sides of the target gold finger and closest to the target gold finger; and defining the frame lines on both sides of the target gold finger and closest to the target gold finger and the gold fingers between the frame lines as the gold finger chamfer region. If the circuit board has multiple gold finger chamfer regions, before the method for determining the region outside the gold finger chamfer region as the non-chamfer region according to the coordinates of the outer frame is performed, frame lines and gold fingers in the known gold finger chamfer region need to be removed, new gold finger chamfer regions are determined in a loop until all gold finger chamfer regions in the circuit board are determined; Calculation: according to the coordinates of the outer frame, frame lines pointing in the same direction as the target gold finger in the non-chamfer region are obtained, the distance between the frame lines of the non-chamfer region and the frame lines of the gold finger chamfer region where the target gold finger is located is calculated, and measurement data is obtained.

2. The measurement method according to claim 1, characterized in that, In the step of determining the direction, the method for selecting the gold finger in the to-be-measured image comprises: marking the gold finger according to the to-be-measured image, and selecting the gold finger by recognizing the mark; or selecting the gold finger from the to-be-measured image according to the shape structure; or selecting the gold finger from the to-be-measured image according to the arrangement mode.

3. The measurement method according to claim 1, characterized in that, In the step of determining the direction, the method for determining the setting direction of the target gold finger comprises: Obtaining coordinates of any point in the outer frame as a reference coordinate; Obtaining frame lines on both sides of the reference coordinate in a first direction; Obtaining frame lines on both sides of the reference coordinate in a second direction; The first direction is perpendicular to the second direction, and the setting direction of the target golden finger is determined by the setting position of the target golden finger, wherein a target golden finger located on the frame line on the two sides of the reference coordinate along the first direction is a vertical golden finger, and the setting direction is vertical; a target golden finger located on the frame line on the two sides of the reference coordinate along the second direction is a horizontal golden finger, and the setting direction is horizontal.

4. The measurement method according to claim 1, characterized by, The method for selecting a golden finger between the frame lines closest to the target golden finger on the two sides of the target golden finger comprises: obtaining the coordinate parameters of the frame lines closest to the target golden finger on the two sides of the target golden finger, and forming a coordinate interval by the coordinate parameters; obtaining a golden finger in the same direction as the target golden finger; obtaining the coordinate parameters of the golden finger in the same direction as the target golden finger; selecting a golden finger in the same direction as the target golden finger and having the coordinate parameters located in the coordinate interval.

5. The method of claim 1, wherein, In the grouping step, the method for determining the area other than the golden finger chamfer area as a non-chamfer area according to the coordinates of the outer frame comprises: obtaining the frame line of the outer frame; obtaining the frame line of all the golden finger chamfer areas; removing the frame line of the golden finger chamfer area from the frame line of the outer frame; determining the remaining frame line of the frame line of the outer frame as the non-chamfer area.

6. The measurement method of claim 1, wherein, In the calculating step, the method for obtaining the frame line in the same direction as the target golden finger in the non-chamfer area according to the coordinates of the outer frame, calculating the distance between the frame line of the non-chamfer area and the frame line of the golden finger chamfer area where the target golden finger is located, and obtaining the measurement data comprises: obtaining the coordinates of the frame line of the golden finger chamfer area where the target golden finger is located; obtaining the coordinates of the frame line in the same direction as the target golden finger in the non-chamfer area; measuring the distance between the frame line of the golden finger chamfer area where the target golden finger is located and the frame line in the same direction as the target golden finger in the non-chamfer area; obtaining the measurement data.

7. The method of measuring of claim 1, wherein, The measurement method further comprises the following steps: obtaining the minimum distance from the measurement data, and comparing the minimum distance with a standard value; if the minimum distance is not less than the standard value, the circuit board meets the distance requirement; if the minimum distance is less than the standard value, the circuit board does not meet the distance requirement.

8. A detection device, characterized in that comprises: a memory and a processor, the memory is in communication with the processor, the memory stores a measurement program, and the processor executes the measurement program to realize the steps of the measurement method in any one of claims 1 to 7. comprises: a memory and a processor, the memory is in communication with the processor, the memory stores a measurement program, and the processor executes the measurement program to realize the steps of the measurement method in any one of claims 1 to 7.

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