Electronic device

Abstract

The present disclosure relates to an electronic device comprising: a display panel comprising a display surface, the display surface includes a folding area foldable with respect to a folding axis extending in a first direction, a first non-folding area defined on one side of the folding area, and a second non-folding area defined to be spaced apart from the first non-folding area in a second direction intersecting the first direction, the folding area is inserted between the first non-folding area and the second non-folding area; a first digitizer overlapping the first non-folding region; a second digitizer spaced apart from the first digitizer and overlapping the second non-folded region; a third digitizer overlapping the folding region; and a connection member connected to the third digitizer, and the connection member is connected to one of the first digitizer and the second digitizer and is spaced apart from the other of the first digitizer and the second digitizer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2023-0100720, filed on August 1, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to electronic devices including a digitizer, and more particularly, to electronic devices including a digitizer having improved sensitivity in a folding region. Background Art

[0004] In the information society, electronic devices are increasingly important as a medium for transmitting visual information. The electronic devices are activated by receiving electrical signals. The electronic devices include a digitizer that detects input applied from the outside of a display layer that displays an image.

[0005] The digitizer of the electronic device may include various detection coils activated by electrical signals. The area where the detection coil is activated reacts to the signal applied from the outside. Summary of the invention

[0006] Embodiments of the present disclosure provide an electronic device including a digitizer that can detect an external input, prevent sensitivity reduction due to folding stress, and provide uniform sensitivity even in a folded area.

[0007] According to an embodiment, an electronic device includes: a display panel including a display surface and a rear surface opposite to the display surface, the display surface including a folding area, a first non-folding area, and a second non-folding area, wherein the folding area is foldable relative to a folding axis extending in a first direction, the first non-folding area is defined on one side of the folding area, and the second non-folding area is defined to be spaced apart from the first non-folding area in a second direction intersecting the first direction, and the folding area is interposed between the first non-folding area and the second non-folding area; a first digitizer disposed on the rear surface and overlapping with the first non-folding area; a second digitizer disposed on the rear surface, spaced apart from the first digitizer, and overlapping with the second non-folding area; a third digitizer disposed on the rear surface and overlapping with the folding area; and a connecting member connected to the third digitizer, wherein the connecting member is connected to one of the first digitizer and the second digitizer and spaced apart from the other of the first digitizer and the second digitizer.

[0008] The electronic device may further include a supporting member disposed on a rear surface of the display panel, wherein the supporting member includes: a first non-folding portion disposed between the display panel and the first digitizer and overlapping with the first non-folding area; a second non-folding portion disposed between the display panel and the second digitizer and overlapping with the second non-folding area; and a folding portion disposed between the display panel and the third digitizer, connected to the first non-folding portion and the second non-folding portion, and overlapping with the folding area, and a plurality of holes may be defined in the folding portion.

[0009] The support member may include a base layer, and the base layer may include a plurality of fiber strands.

[0010] The first digitizer may be disposed on the first non-folding portion, the second digitizer may be disposed on the second non-folding portion, and the third digitizer may be spaced apart from the folding portion in a cross-sectional view.

[0011] The first digitizer may include a sensor detecting an external input applied to the first unfolded region and a bridge electrically insulated from the sensor, and the third digitizer may be connected to the bridge.

[0012] The first digitizer may further include a first pad portion and a connecting pad portion, the connecting pad portion may be spaced apart from the first pad portion in the second direction and closer to the folding area than the first pad portion, the sensor may include a first annular coil overlapping the first non-folding area, a first input pad connected to one end of the first annular coil, and a first output pad connected to the other end of the first annular coil, the bridge may include a bridge wire, a first bridge pad connected to one end of the bridge wire, and a second bridge pad connected to the other end of the bridge wire, the first input pad, the first output pad, and the first bridge pad may be arranged in the first pad portion, and the second bridge pad may be set in the connecting pad portion.

[0013] The connection member may electrically connect the second bridge pad and the third digitizer.

[0014] The connection member may include an anisotropic conductive film.

[0015] The electronic device may further include an adhesive member spaced apart from the connecting member in the first direction.

[0016] The first digitizer may include glass fiber reinforced plastic, carbon fiber reinforced plastic, or a prepreg material.

[0017] The electronic device may further include a support plate arranged between the display panel and the first to third digitizers, wherein the support plate may include a first non-folding portion overlapping the first digitizer, a second non-folding portion overlapping the second digitizer, and a folding portion overlapping the third digitizer, and a plurality of holes may be defined by the folding portion.

[0018] The support plate may comprise glass fiber reinforced plastic, carbon fiber reinforced plastic or a prepreg material.

[0019] According to an embodiment, an electronic device includes: a display panel, including a display surface and a rear surface opposite to the display surface, the display surface including a folding area folded relative to a folding axis extending in a first direction, a first non-folding area defined on one side of the folding area, and a second non-folding area defined to be spaced apart from the first non-folding area in a second direction intersecting the first direction, and the folding area is inserted between the first non-folding area and the second non-folding area; a digitizer, detecting input of an electromagnetic pen; and a support plate, arranged between the digitizer and the display panel, and having a plurality of holes overlapping the folding area defined in the support plate, wherein the digitizer includes: a first digitizer, arranged on the rear surface and overlapping with the first non-folding area; a second digitizer, arranged on the rear surface, spaced apart from the first digitizer, and overlapping with the second non-folding area; a third digitizer, arranged on the rear surface and overlapping with the folding area; and a connecting member, connecting one of the first digitizer and the second digitizer with the third digitizer.

[0020] The first digitizer and the second digitizer may be in contact with the support plate, and the third digitizer may be spaced apart from the support plate.

[0021] The first digitizer may include a first toroidal coil, a bridging wire electrically insulated from the first toroidal coil, a first pad connected to the first toroidal coil, a first bridging pad connected to one end of the bridging wire, and a second bridging pad connected to the other end of the bridging wire, and a connecting member may be connected to the second bridging pad, and the second bridging pad may be closer to the folding region than the first bridging pad.

[0022] The third digitizer may include a third loop coil and a third pad connected to the third loop coil, and the connection member may be disposed between the second bridge pad and the third pad.

[0023] In the unfolded state of the electronic device, the first loop coil may not overlap with the folding area.

[0024] The support plate may comprise glass fiber reinforced plastic, carbon fiber reinforced plastic or a prepreg material.

[0025] The first digitizer and the second digitizer may include glass fiber reinforced plastic, carbon fiber reinforced plastic, or prepreg material.

[0026] The electronic device may further include an adhesive member coupling the third digitizer and the support plate, wherein the adhesive member is spaced apart from the connection member in the first direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0028] Figures 1A to 1C is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0029] Figure 2A is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0030] Figure 2B is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0031] Figure 3A is a plan view of a display panel according to an embodiment of the present disclosure.

[0032] Figure 3B yes Figure 3A An enlarged plan view of a portion of the area.

[0033] Figure 4 It is along Figure 2A A cross-sectional view taken along line II'.

[0034] Figure 5A It is along Figure 3A A cross-sectional view taken along line II-II'.

[0035] Figure 5B is a cross-sectional view of a curved display device according to an embodiment of the present disclosure.

[0036] Fig. 6A is a plan view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0037] Figure 6B is a schematic plan view showing the configuration of a digitizer according to an embodiment of the present disclosure.

[0038] Figure 6C is a side view showing a portion of the electronic device in a folded state.

[0039] Fig. 7A and Figure 7B is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0040] Figure 8 is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0041] Fig. 9A and Fig. 9B is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0042] Fig. 10A is a cross-sectional view of a base layer included in a digitizer according to an embodiment of the present disclosure.

[0043] Fig. 10B is a plan view of a base layer included in a digitizer according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0044] In this specification, the statement that a first component (or region, layer, part, portion, etc.) is "on", "connected to" or "coupled to" a second component means that the first component is directly on, directly connected to or directly coupled to the second component, or means that a third component is interposed therebetween.

[0045] The same reference numerals represent the same components. In addition, in the drawings, in order to effectively describe the technical content, the thickness, ratio and size of the components are exaggerated. The term "and / or" includes one or more combinations that the associated components can define.

[0046] Although the terms "first", "second", etc. can be used to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another component. For example, without departing from the correct scope of the present disclosure, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component. Singular expressions include plural expressions unless otherwise clearly indicated in the context.

[0047] In addition, the terms "under", "below", "on", "above" and the like are used to describe the relationship between components shown in the drawings. These terms of relative concepts are described based on the directions shown in the drawings.

[0048] It will be understood that the terms "include", "comprising", "having", etc. specify the presence of the features, quantities, steps, operations, elements or components, or a combination thereof, described in the specification, and do not exclude the presence or additional possibilities of one or more other features, quantities, steps, operations, elements or components, or a combination thereof.

[0049] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. In addition, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with the meaning in the context of the relevant technology, and should not be interpreted as an overly ideal or overly formal meaning, unless explicitly defined herein.

[0050] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0051] Figures 1A to 1C is a perspective view of an electronic device according to an embodiment of the present disclosure. Figure 1A The electronic device is shown in an unfolded state, and Figure 1B and Figure 1C The electronic device is shown in a folded state.

[0052] refer to Figures 1A to 1C , the electronic device ED according to an embodiment of the present disclosure may include a display surface DS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED may provide an image IM to a user through the display surface DS.

[0053] The display surface DS may include a display area DA and a non-display area NDA around the display area DA. The display area DA may display an image IM, and the non-display area NDA may not display the image IM. The non-display area NDA may surround the display area DA. However, the present disclosure is not limited thereto, and the shape of the display area DA and the shape of the non-display area NDA may be changed.

[0054] The display surface DS may include a sensing area TA. The sensing area TA may be a partial area of ​​the display area DA. The sensing area TA has a higher transmittance than other areas of the display area DA. Hereinafter, other areas of the display area DA except the sensing area TA may be defined as a general display area.

[0055] The optical signal (eg, a visible light beam or an infrared light beam) may move to the sensing area TA. The electronic device ED may capture an external image through the visible light beam passing through the sensing area TA, or determine the reachability of an external object through the infrared light beam. Figure 1A One sensing area TA is exemplarily shown, but the present disclosure is not limited thereto, and a plurality of sensing areas TA may be provided.

[0056] Hereinafter, a direction substantially perpendicular to a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. The third direction DR3 is used as a criterion for distinguishing a front surface and a rear surface for each of the components. In this specification, the wording "in a plan view" may be defined as a state observed in the third direction DR3.

[0057] The electronic device ED may include a folding area FA and a plurality of non-folding areas NFA1 and NFA2. The non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The first non-folding area NFA1 and the second non-folding area NFA2 may be spaced apart from each other in the second direction DR2, with the folding area FA interposed therebetween.

[0058] like Figure 1B As shown in , the folding area FA can be folded relative to a folding axis FX parallel to the first direction DR1. The folding area FA has a predetermined curvature and a radius of curvature VV. The distance between the first non-folding area NFA1 and the second non-folding area NFA2 may be substantially equal to twice the radius of curvature VV. According to an embodiment, the first non-folding area NFA1 and the second non-folding area NFA2 may face each other, and the electronic device ED may be folded in an inward folding manner so that the display surface DS is not exposed to the outside.

[0059] like Figure 1C As shown in , the distance between the first non-folding area NFA1 and the second non-folding area NFA2 can be less than twice the radius of curvature VV. Therefore, in the folded state, the separation distance between the first non-folding area NFA1 and the second non-folding area NFA2 can be reduced. Therefore, an electronic device ED having a slim state when folded can be provided.

[0060] However, the present disclosure is not limited thereto, and in an embodiment, the electronic device ED may be folded outward so that the display surface DS is exposed to the outside. In an embodiment of the present disclosure, the electronic device ED may be configured to repeatedly perform an inward folding operation and an outward folding operation from an unfolding operation, but the present disclosure is not limited thereto. In an embodiment of the present disclosure, the electronic device ED may select any one of the unfolding operation, the inward folding operation, and the outward folding operation.

[0061] Figure 2A is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2B is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0062] refer to Figure 2A and Figure 2B, the electronic device ED may include a display device DD, an electronic module EM, an electronic optical module ELM, a power supply module PSM, and a housing HM. Although not shown separately, the electronic device ED may also include a mechanical structure (eg, a hinge) for controlling the folding operation of the display device DD.

[0063] The display device DD generates an image and detects an external input. The display device DD may include a window WM, a display module DM, an input sensor IS, and a digitizer DTM. The window WM provides a front surface of the electronic device ED. The window WM will be described in detail below.

[0064] The display module DM may include a display panel DP. Figure 2A Only the display panel DP in the stack structure of the display module DM is shown, but basically, the display module DM may further include a plurality of components arranged on the display panel DP. The stack structure of the display module DM will be described in detail below.

[0065] The type of the display panel DP is not particularly limited. For example, the display panel DP may be a light-emitting display panel, such as an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0066] The display panel DP includes a display area DA (see Figure 1A ) and non-display area NDA (see Figure 1A ) corresponds to the display area DP-DA and the non-display area DP-NDA. In this specification, the expression "area / portion and area / portion correspond to each other" means that the area / portion and the area / portion overlap each other and are not limited to the same area.

[0067] The display panel DP may include Figure 1A The sensing area TA may be a region having a lower resolution than the display area (second area) DP-DA. The sensing area DP-TA will be described in detail below.

[0068] like Figure 2A As shown in , the driving chip DIC may be disposed on the non-display area DP-NDA of the display panel DP. The flexible circuit board FCB may be coupled to the non-display area DP-NDA of the display panel DP. The flexible circuit board FCB may be connected to the main circuit board. The main circuit board may be one of the electronic components constituting the electronic module EM.

[0069] The driving chip DIC may include driving elements, such as a data driving circuit, for driving the pixels of the display panel DP. Figure 2A2 shows a structure in which the driving chip DIC is mounted on the display panel DP, but the present disclosure is not limited thereto. For example, the driving chip DIC may be mounted on a flexible circuit board FCB.

[0070] The input sensor IS detects the input of the user. The capacitive input sensor IS may be disposed on the display panel DP. The digitizer DTM detects the input of the stylus pen. The electromagnetic induction type digitizer DTM may be disposed under the display panel DP.

[0071] The electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, an audio input module 40, an audio output module 50, a memory 60, and an external interface module 70. The electronic module EM may include a main circuit board, and these modules may be mounted on the main circuit board or may be electrically connected to the main circuit board through a flexible circuit board. Each of the input sensor IS and the digitizer DTM may be connected to the main circuit board through a connector, etc. The electronic module EM is electrically connected to the power supply module PSM.

[0072] The electronic module EM can be provided in each of the first housing HM1 and the second housing HM2, and the power supply module PSM can be provided in each of the first housing HM1 and the second housing HM2. Although not shown, the electronic module EM provided in the first housing HM1 and the electronic module EM provided in the second housing HM2 can be electrically connected to each other through a flexible circuit board.

[0073] The control module 10 controls the overall operation of the electronic device ED. For example, the control module 10 activates or deactivates the display device DD according to user input. The control module 10 can control the image input module 30, the audio input module 40, and the audio output module 50 according to user input. The control module 10 may include at least one microprocessor.

[0074] The wireless communication module 20 may transmit / receive wireless signals to / from another terminal using a Bluetooth line or a Wi-Fi line. The wireless communication module 20 may transmit / receive voice signals using a general communication line. The wireless communication module 20 may include a plurality of antenna modules.

[0075] The image input module 30 processes the image signal and converts the processed image signal into image data that can be displayed on the display device DD. The audio input module 40 receives an external audio signal through a microphone in a recording mode, a voice recognition mode, etc., and converts the received external audio signal into electrical voice data. The audio output module 50 converts the audio data received from the wireless communication module 20 or the audio data stored in the memory 60 into sound, and outputs the converted sound to the outside.

[0076] The external interface module 70 serves as an interface to an external charger, a wired / wireless data port, a card (eg, a memory card and a Subscriber Identity Module (“SIM”) / User Identity Module (“UIM”) card) socket, and the like.

[0077] The power supply module PSM provides the power required for the overall operation of the electronic device ED. The power supply module PSM may include a universal battery device.

[0078] The electronic optical module ELM may be an electronic component that outputs or receives an optical signal. The electronic optical module ELM may include a camera module and / or a proximity sensor. The camera module captures an external image through the sensing area DP-TA. The electronic optical module ELM may be disposed under the display device DD and may overlap with the sensing area DP-TA.

[0079] The housing HM is coupled to the window WM to accommodate the above-mentioned other modules. It is shown that the housing HM includes a first housing HM1 and a second housing HM2, but the present disclosure is not limited thereto. The electronic device ED according to the embodiment may further include a hinge structure for connecting the first housing HM1 and the second housing HM2.

[0080] Figure 3A is a plan view of a display panel according to an embodiment of the present disclosure. Figure 3B yes Figure 3A An enlarged plan view of a partial area AA.

[0081] refer to Figure 3A , the display panel DP may include a display area DP-DA and a non-display area DP-NDA disposed around the display area DP-DA. The display area DP-DA and the non-display area DP-NDA are distinguished according to the presence of the pixel PX. The pixel PX is disposed in the display area DP-DA. The scanning driving unit SDV, the data driving unit, and the light emitting driving unit EDV may be disposed in the non-display area DP-NDA. The data driving unit may be disposed in Figure 3A Part of the circuit configured in the driver chip DIC shown in FIG.

[0082] The display panel DP includes a first non-bending area AA1, a second non-bending area AA2, and a bending area BA divided in a second direction DR2. The second non-bending area AA2 and the bending area BA may be partial areas of the non-display area DP-NDA. The bending area BA is disposed between the first non-bending area AA1 and the second non-bending area AA2.

[0083] The first non-bending area AA1 corresponds to Figure 1AThe first non-bending area AA1 may include a first non-folding area NFA10, a second non-folding area NFA20, and a folding area FA0. The first non-folding area NFA10, the second non-folding area NFA20, and the folding area FA0 correspond to Figures 1A to 1C The first non-folding area NFA1, the second non-folding area NFA2 and the folding area FA.

[0084] The bending area BA and the second non-bending area AA2 may have lengths less than that of the first non-bending area AA1 in the first direction DR1. The bending area BA having a relatively short length in the first direction DR1 may be easily bent with respect to a bending axis extending in the first direction DR1.

[0085] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, and a plurality of display pads D-PD. In this case, "m" and "n" are natural numbers greater than 1. The pixels PX may be connected to the scan lines SL1 to SLm, the data lines DL1 to DLn, and the emission lines EL1 to ELm.

[0086] The scan lines SL1 to SLm may extend in the first direction DR1 and may be connected to the scan driving unit SDV. The data lines DL1 to DLn may extend in the second direction DR2 and may be connected to the driving chip DIC via the bending area BA. The emission lines EL1 to ELm may extend in the first direction DR1 and may be connected to the emission driving unit EDV.

[0087] The power line PL may include a portion extending in the second direction DR2 and a portion extending in the first direction DR1. The portion extending in the first direction DR1 and the portion extending in the second direction DR2 may be arranged in different layers. The portion of the power line PL extending in the second direction DR2 may extend to the second non-bending area AA2 via the bending area BA. The power line PL may provide a first voltage to the pixel PX.

[0088] The first control line CSL1 may be connected to the scan driving unit SDV and may extend toward the lower end of the second non-bending area AA2 through the bending area BA. The second control line CSL2 may be connected to the light emitting driving unit EDV and may extend toward the lower end of the second non-bending area AA2 through the bending area BA.

[0089] In a plan view, the display pad D-PD may be arranged adjacent to the lower end of the second non-bending area AA2. The driving chip DIC, the power line PL, the first control line CSL1, and the second control line CSL2 may be connected to the display pad D-PD. The substrate pad F-PD included in the flexible circuit board FCB may be electrically connected to the corresponding display pad D-PD through an anisotropic conductive adhesive layer.

[0090] refer to Figure 3B , the sensing area (first area) DP-TA may be an area having a higher transmittance than the transmittance of the display area (second area) DP-DA and a lower resolution than the resolution of the display area (second area) DP-DA. The transmittance and the resolution are measured in a reference area. The sensing area DP-TA has a shading structure occupancy rate in the reference area that is smaller than the shading structure occupancy rate of the display area DP-DA. The shading structure may include a conductive pattern of a circuit layer, an electrode of a light emitting element, a shading pattern, etc., which will be described below.

[0091] The sensing area DP-TA has a resolution in the reference area lower than that of the display area DP-DA. The sensing area DP-TA has fewer pixels PX arranged in the reference area (or the same area) than the display area DP-DA.

[0092] like Figure 3B As shown in , the first pixel PX1 may be disposed in the display area DP-DA, and the second pixel PX2 may be disposed in the sensing area DP-TA. When comparing the areas providing pixels of the same color, the first pixel PX1 and the second pixel PX2 may have different light emitting areas. The first pixel PX1 and the second pixel PX2 may have different arrangements.

[0093] Figure 3B The light emitting areas LA of the first pixel PX1 and the second pixel PX2 are shown, and the first pixel PX1 and the second pixel PX2 are represented at the same time. Each of the light emitting areas LA can be defined as an area where the anode of the light emitting element is exposed from the pixel defining film. The non-light emitting area NLA is disposed between the light emitting areas LA within the display area DP-DA.

[0094] The first pixel PX1 may include a first color pixel PX1-R, a second color pixel PX1-G, and a third color pixel PX1-B, and the second pixel PX2 may include a first color pixel PX2-R, a second color pixel PX2-G, and a third color pixel PX2-B. The first color pixel PX1-R and the first color pixel PX2-R may provide a red light beam, the second color pixel PX1-G and the second color pixel PX2-G may provide a green light beam, and the third color pixel PX1-B and the third color pixel PX2-B may provide a blue light beam.

[0095] The sensing area DP-TA may include a pixel area PA, a wiring area BL, and a transmission area BT. The second pixel PX2 is disposed in the pixel area PA. It is shown that two first color pixels PX2-R, four second color pixels PX2-G, and two third color pixels PX2-B are arranged in one pixel area PA, but the present disclosure is not limited thereto.

[0096] A conductive pattern, a signal line, or a light shielding pattern related to the second pixel PX2 is disposed in the pixel area PA and the wiring area BL. The light shielding pattern may be a metal pattern and may substantially overlap the pixel area PA and the wiring area BL. The pixel area PA and the wiring area BL may be non-transmission areas.

[0097] The transmission region BT is a region through which the optical signal substantially passes. Since the second pixel PX2 is not disposed in the transmission region BT, a conductive pattern, a signal line, or a light shielding pattern is disposed. Therefore, the transmission region BT increases the transmittance of the sensing region DP-TA. According to an embodiment, Figure 2A The electronic optical module ELM described in the embodiment may overlap with the sensing area DP-TA having high light transmittance, thereby improving the optical signal receiving efficiency.

[0098] Figure 4 It is along Figure 2A A cross-sectional view taken along line II'.

[0099] refer to Figure 4 The display module DM may include a display panel DP, an input sensor IS, and an anti-reflection layer ARL. The display panel DP may include a base layer 110, a circuit layer 120, a light emitting element layer 130, and an encapsulation layer 140.

[0100] The base layer 110 may provide a base surface on which the circuit layer 120 is disposed. The base layer 110 may be a flexible substrate that can be bent, folded, and rolled. The base layer 110 may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments of the present disclosure are not limited thereto, and the base layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0101] The base layer 110 may have a multi-layer structure. For example, the base layer 110 may include a first synthetic resin layer, a multi-layer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multi-layer or single-layer inorganic layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin, but the present disclosure is not particularly limited thereto.

[0102] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, and the like.

[0103] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micron light emitting diode ("LED"), or a nano LED.

[0104] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from impurities such as moisture, oxygen, and dust particles. The encapsulation layer 140 may include at least one inorganic layer. The encapsulation layer 140 may include a stacked structure of inorganic layer / organic layer / inorganic layer.

[0105] The input sensor IS may be directly disposed on the display panel DP. The display panel DP and the input sensor IS may be formed by a continuous process. Here, the expression that the input sensor IS is directly disposed on the display panel DP may mean that no third component is disposed between the input sensor IS and the display panel DP. That is, no separate adhesive layer is disposed between the input sensor IS and the display panel DP.

[0106] The anti-reflection layer ARL may be directly disposed on the input sensor IS. The anti-reflection layer ARL may reduce the reflectivity of an external light beam input from the outside of the display device DD (see FIG. 1 ). The anti-reflection layer ARL may include a color filter. The color filter may have a predetermined arrangement. For example, the color filter may be arranged according to the luminous color of the pixel PX included in the display panel DP. In addition, the anti-reflection layer ARL may further include a black matrix adjacent to the color filter.

[0107] In an embodiment of the present disclosure, the positions of the input sensor IS and the anti-reflection layer ARL may be changed from each other. In an embodiment of the present disclosure, the anti-reflection layer ARL may be replaced with a polarizing film. The polarizing film may be coupled to the input sensor IS through an adhesive layer.

[0108] Figure 5A It is along Figure 3A A cross-sectional view taken along line II-II'. Figure 5B is a cross-sectional view of a curved display device according to an embodiment of the present disclosure. Figure 5A A state in which the display module DM is not bent and folded is shown. Figure 5B A state in which the bending area BA of the display module DM is bent is shown.

[0109] refer to Figure 5A and Figure 5B, the display device DD may include a window WM, an upper member UM, a display module DM, a support plate SPP (in other words, a support member), a digitizer DTM, and a lower member LM. In an embodiment, the upper member UM generally refers to a component disposed between the window WM and the display module DM, and the lower member LM generally refers to a component disposed below the digitizer DTM.

[0110] The window WM may include a thin film glass substrate UTG, a window protection layer PF disposed on the thin film glass substrate UTG, and a bezel pattern BP disposed on a lower surface of the window protection layer PF. In an embodiment, the window protection layer PF may include a synthetic resin film.

[0111] The bezel pattern BP may be disposed on one surface of the thin-film glass substrate UTG or one surface of the window protection layer PF. Figure 5A The frame pattern BP provided on the lower surface of the window protection layer PF is exemplarily shown. The present disclosure is not limited thereto, and the frame pattern BP may be provided on the upper surface of the window protection layer PF. The frame pattern BP as a colored light shielding film may be formed by, for example, a coating method. The frame pattern BP may include a base material and a dye or pigment mixed with the base material. Figure 1A The non-display area NDA shown in FIG. 4 may be defined by the shape of the bezel pattern BP.

[0112] The thickness of the thin film glass substrate UTG may be in the range of 15 micrometers (μm) to 45 μm. The thin film glass substrate UTG may be made of chemically strengthened glass. Even when the thin film glass substrate UTG is repeatedly folded and unfolded, the occurrence of wrinkles may be minimized.

[0113] The thickness of the window protection layer PF may be in the range of 50 μm to 80 μm. The synthetic resin film of the window protection layer PF may include polyimide, polycarbonate, polyamide, triacetyl cellulose, polymethyl methacrylate, or polyethylene terephthalate. Although not shown separately, at least one of a hard coating layer, an anti-fingerprint layer, and an anti-reflection layer may be provided on the upper surface of the window protection layer PF.

[0114] The window protection layer PF and the thin film glass substrate UTG may be coupled to each other by a first adhesive layer AL1. The first adhesive layer AL1 may be a pressure sensitive adhesive ("PSA") film or an optically clear adhesive ("OCA") member. The adhesive layer described below may also include the same adhesive as that of the first adhesive layer AL1.

[0115] The first adhesive layer AL1 may be separated from the thin-film glass substrate UTG. That is, the adhesive force between the first adhesive layer AL1 and the thin-film glass substrate UTG may be smaller than the adhesive force between the first adhesive layer AL1 and the window protection layer PF. Since the window protection layer PF is disposed on the upper side, it may be relatively less susceptible to scratches than the thin-film glass substrate UTG. After the first adhesive layer AL1 and the window protection layer PF are separated from each other, a new window protection layer PF may be attached to the thin-film glass substrate UTG.

[0116] In a plan view, the edge of the thin-film glass substrate UTG may not overlap with the bezel pattern BP. Since the above conditions are met, the edge of the thin-film glass substrate UTG may be exposed from the bezel pattern BP, and fine cracks occurring in the edge of the thin-film glass substrate UTG may be inspected by an inspection device.

[0117] The upper member UM includes an upper film DL. The upper film DL may include a synthetic resin film. The synthetic resin film may include polyimide, polycarbonate, polyamide, triacetyl cellulose, polymethyl methacrylate, or polyethylene terephthalate.

[0118] The upper film DL may absorb external impact applied to the front surface of the display device DD. Figure 4 The display module DM described may include an anti-reflection layer ARL instead of a polarizing film, and therefore, the front impact strength of the display device DD may be reduced. The upper film DL may compensate for the reduced impact strength by applying the anti-reflection layer ARL. In an embodiment of the present disclosure, the upper film DL may be omitted. The thin film glass substrate UTG and the upper film DL may be coupled to each other by a second adhesive layer AL2. The upper film DL and the display module DM may be coupled to each other by a third adhesive layer AL3.

[0119] The panel protection layer PPL may be disposed under the display module DM. The panel protection layer PPL may protect the lower portion of the display module DM. The panel protection layer PPL may include a flexible synthetic resin film. For example, the panel protection layer PPL may include polyethylene terephthalate.

[0120] In an embodiment, the panel protection layer PPL may not be disposed in the bending area BA. The panel protection layer PPL may include a protective display panel DP (see Figure 3A ) of the first panel protection layer PPL-1 protecting the first non-bending area AA1 and the second panel protection layer PPL-2 protecting the second non-bending area AA2.

[0121] The fourth adhesive layer AL4 couples the panel protection layer PPL and the display module DM. The fourth adhesive layer AL4 may include a first portion AL4-1 corresponding to the first panel protection layer PPL-1 and a second portion AL4-2 corresponding to the second panel protection layer PPL-2.

[0122] like Figure 5B As shown in , when the bending area BA is bent, the second panel protection layer PPL-2 together with the second non-bending area AA2 can be arranged under the first non-bending area AA1 and the first panel protection layer PPL-1. Since the panel protection layer PPL is not arranged in the bending area BA, the bending area BA can be bent more easily. The second panel protection layer PPL-2 can be attached to the metal plate MP through the tenth adhesive layer AL10. The tenth adhesive layer AL10 can be omitted. Although not shown separately, an additional component such as an insulating tape can also be provided between the second panel protection layer PPL-2 and the metal plate MP.

[0123] like Figure 5B As shown in , the bending area BA has a predetermined curvature and a radius of curvature. The radius of curvature may be in the range of about 0.1 mm to 0.5 mm. The bending protection layer BPL is disposed at least in the bending area BA. The bending protection layer BPL may overlap the bending area BA, the first non-bending area AA1, and the second non-bending area AA2. The bending protection layer BPL may be disposed in the entire area of ​​the bending area BA, and may be disposed at a portion of the first non-bending area AA1 and a portion of the second non-bending area AA2.

[0124] The bending protection layer BPL may be bent together with the bending area BA. The bending protection layer BPL protects the bending area BA from external impact and controls the neutral surface of the bending area BA. The bending protection layer BPL controls the stress of the bending area BA so that the signal line arranged in the bending area BA becomes closer to the neutral surface.

[0125] The barrier layer BAR may be disposed under the panel protection layer PPL. The barrier layer BAR and the panel protection layer PPL may be coupled to each other through a fifth adhesive layer AL5.

[0126] The barrier layer BAR can increase the resistance to the compressive force caused by the external pressure. Therefore, the barrier layer BAR can be used to prevent deformation of the display panel DP. The barrier layer BAR may include a flexible plastic material such as polyimide or polyethylene terephthalate. In addition, the barrier layer BAR may be a colored film with low light transmittance. The barrier layer BAR may absorb light beams input from the outside. For example, the barrier layer BAR may be a black synthetic resin film. When the display device DD is observed from the upper side of the window protection layer PF, the components arranged under the barrier layer BAR may not be visually recognized by the user.

[0127] The sixth adhesive layer AL6 couples the barrier layer BAR and the support sheet SPP. The sixth adhesive layer AL6 may include a first portion AL6-1 and a second portion AL6-2 spaced apart from each other. A separation distance between the first portion AL6-1 and the second portion AL6-2 may correspond to a width D6 of the folding area FA0.

[0128] In an embodiment, the first portion AL6-1 and the second portion AL6-2 are defined as different parts of one adhesive layer, but the present disclosure is not limited thereto. When the first portion AL6-1 is defined as one adhesive layer (e.g., the first adhesive layer or the second adhesive layer), the second portion AL6-2 may also be defined as another adhesive layer (e.g., the second adhesive layer or the third adhesive layer). The above definition may be applied to all adhesive layers, including the two parts of the adhesive layer to be described below and the sixth adhesive layer AL6.

[0129] The support plate SPP is disposed under the display panel DP. When folded, the support plate SPP supports the display panel DP. The support plate SPP may have insulating properties. The support plate SPP may include a reinforced fiber composite material. The reinforced fiber composite material may be one of a carbon fiber reinforced plastic ("CFRP") and a glass fiber reinforced plastic ("GFRP"). This will be described in detail below.

[0130] According to an embodiment, the support plate SPP may include a first non-folding portion SPP-1 overlapping the first non-folding area NFA10, a second non-folding portion SPP-2 overlapping the second non-folding area NFA20, and a folding portion SPP-F overlapping the folding area FA0. The first non-folding portion SPP-1, the second non-folding portion SPP-2, and the folding portion SPP-F may have an integral shape in which the first non-folding portion SPP-1, the second non-folding portion SPP-2, and the folding portion SPP-F are connected to each other.

[0131] A hole HL passing through in the third direction DR3 as a thickness direction may be defined in the folded portion SPP-F. Since the hole HL is defined in the folded portion SPP-F of the support plate SPP, the shape of the support plate SPP may be easily changed during a folding operation of the electronic device ED.

[0132] The digitizer DTM may be disposed under the support plate SPP. The digitizer DTM according to the present disclosure may detect an input of an electromagnetic pen. In this case, the digitizer DTM may detect the input of the electromagnetic pen in a manner using electromagnetic resonance ("EMR").

[0133] The digitizer DTM may include a first digitizer DTM-1 overlapping the first non-folding area NFA10, a second digitizer DTM-2 overlapping the second non-folding area NFA20, and a third digitizer DTM-F overlapping the folding area FA0.

[0134] The first digitizer DTM-1 is disposed to overlap the first non-folding area NFA10. In an embodiment, the first digitizer DTM-1 may be disposed on the rear surface of the first non-folding portion SPP-1. The first digitizer DTM-1 detects an input applied to the first non-folding area NFA10 through the electromagnetic pen.

[0135] The second digitizer DTM-2 is disposed to overlap the second non-folding area NFA20. In an embodiment, the second digitizer DTM-2 may be disposed on the rear surface of the second non-folding portion SPP-2. The second digitizer DTM-2 detects an input applied to the second non-folding area NFA20 by the electromagnetic pen.

[0136] The first digitizer DTM-1 may be spaced apart from the second digitizer DTM-2 in a plan view. That is, each of the first digitizer DTM-1 and the second digitizer DTM-2 may not overlap with the hole HL defined in the folded portion SPP-F of the support plate SPP in a plan view.

[0137] In a plan view, the third digitizer DTM-F may overlap with a hole HL defined in the folded portion SPP-F of the support plate SPP. The third digitizer DTM-F may be electrically connected to one of the first digitizer DTM-1 and the second digitizer DTM-2. The third digitizer DTM-F detects an input applied to the folded area FA0 by the electromagnetic pen.

[0138] The third digitizer DTM-F can be connected to the circuit board through the digitizers in the connected first digitizer DTM-1 and the second digitizer DTM-2. In an embodiment, the third digitizer DTM-F can be connected to the first digitizer DTM-1 through a connecting member CNP. The connecting member CNP may include an anisotropic conductive film (ACF). The specific components included in the digitizer DTM will be described below.

[0139] In the embodiment, it is shown that the first digitizer DTM-1 and the second digitizer DTM-2 are directly arranged on the support plate SPP. However, this is shown exemplarily, and the first digitizer DTM-1 and the second digitizer DTM-2 can be connected to the support plate SPP through a predetermined adhesive layer, and the present disclosure is not limited to the embodiment.

[0140] The lower member LM may include a metal layer ML, a buffer layer CS, a metal plate MP, a heat dissipation layer HRP, a magnetic field shielding sheet MSM, and a step compensation member AS disposed under the digitizer DTM.

[0141] The metal layer ML may be disposed under the digitizer DTM. The metal layer ML may include a first metal layer ML1 and a second metal layer ML2 overlapping the first non-folding portion SPP-1 and the second non-folding portion SPP-2, respectively, in a plan view. In a plan view, the first metal layer ML1 and the second metal layer ML2 may be spaced apart from each other in a region overlapping the folding portion SPP-F.

[0142] The metal layer ML may have electrical conductivity and thermal conductivity greater than those of the metal plate MP to be described later. The metal layer ML may radiate heat generated when the digitizer DTM is driven to the outside. The metal layer ML transfers the heat generated from the digitizer DTM to the lower side. In addition, the metal layer ML having relatively high electrical conductivity may prevent the electronic module EM (see FIG. 1 ) provided on the lower side from being radiated. Figure 2A ) generates electromagnetic waves that affect the digitizer DTM as noise. The metal layer ML may include copper or aluminum.

[0143] The seventh adhesive layer AL7 may couple the digitizer DTM and the metal layer ML. The seventh adhesive layer AL7 may include a first portion AL7-1 and a second portion AL7-2 corresponding to the first metal layer ML1 and the second metal layer ML2, respectively.

[0144] In a plan view, the first buffer layer CS1 overlaps the first digitizer DTM-1, and the second buffer layer CS2 overlaps the second digitizer DTM-2. The third buffer layer CS-F is disposed in the folding area FA0, and overlaps the third digitizer DTM-F in a plan view.

[0145] When the display device DD is folded, the first buffer layer CS1 and the second buffer layer CS2 can prevent impurities from being introduced into the hole HL. In addition, when the display device DD is unfolded, even when the folding portion SPP-F is folded at a predetermined curvature, the first buffer layer CS1 and the second buffer layer CS2 are spaced apart from each other in a region overlapping with the third digitizer DTM-F in a plan view, and thus the shape of the digitizer DTM can be easily changed.

[0146] The buffer layer CS may be disposed under the metal layer ML. The buffer layer CS may protect the display module DM from an impact transmitted from a lower portion of the display module DM. The buffer layer CS may include foam or sponge. The foam may include polyurethane foam or thermoplastic polyurethane foam. When the buffer layer CS includes foam, a barrier film as a base layer may be added to the buffer layer CS, and the buffer layer CS may be formed by foaming a foaming agent on the barrier film.

[0147] The eighth adhesive layer AL8 may couple the metal layer ML and the buffer layer CS. The eighth adhesive layer AL8 may include a first portion AL8-1 and a second portion AL8-2 corresponding to the first buffer layer CS1 and the second buffer layer CS2, respectively.

[0148] The metal plate MP may be disposed under the buffer layer CS. The metal plate MP may include a first metal plate MP1 and a second metal plate MP2 respectively overlapping the first buffer layer CS1 and the second buffer layer CS2 in a plan view. The metal plate MP may absorb an external impact applied from the lower side. The metal plate MP may have a strength greater than that of the metal layer ML and a thickness greater than that of the metal layer ML. The metal plate MP may include a metal material such as stainless steel.

[0149] The ninth adhesive layer AL9 couples the buffer layer CS and the metal plate MP. The ninth adhesive layer AL9 may include first and second portions AL9-1 and AL9-2 corresponding to the first and second metal plates MP1 and MP2, respectively.

[0150] The heat dissipation layer HRP may be disposed under the metal plate MP. The heat dissipation layer HRP may include a first heat dissipation layer HRP1 and a second heat dissipation layer HRP2 respectively overlapping the first metal plate MP1 and the second metal plate MP2 in a plan view. The heat dissipation layer HRP may dissipate heat generated from electronic components arranged on the lower side. The electronic components may be Figure 2A and Figure 2B The electronic module EM shown in FIG. The heat dissipation layer HRP may have a structure in which adhesive layers and graphite layers are alternately stacked. The heat dissipation layer HRP may be attached to the metal plate MP by an additional adhesive layer provided between the heat dissipation layer HRP and the metal plate MP.

[0151] The magnetic field shielding sheet MSM is disposed under the metal plate MP. The magnetic field shielding sheet MSM shields a magnetic field generated from a magnetic body (not shown) disposed on the lower side. The magnetic field shielding sheet MSM can prevent a magnetic field generated from a magnetic object from interfering with the digitizer DTM.

[0152] The magnetic field shielding sheet MSM includes a plurality of parts. At least some of the plurality of parts may have different thicknesses. The plurality of parts may be arranged to match the steps of a bracket (not shown) provided under the display device DD. The magnetic field shielding sheet MSM may have a structure in which a magnetic field shielding layer and an adhesive layer are alternately stacked. A portion of the magnetic field shielding sheet MSM may be directly attached to the metal plate MP.

[0153] The step compensating member AS is coupled to the lower side of the metal layer ML. The step compensating member AS may be a double-sided tape or an insulating film. The step compensating member AS may be provided as a first step compensating member AS-1 and a second step compensating member AS-2, and may compensate for steps formed due to different widths of components included in the lower member LM.

[0154] Through holes LTH may be defined in some members of the lower member LM. The through holes LTH are provided to Figure 2A The sensing areas DP-TA overlap. Figure 5A As shown in , the through hole LTH may penetrate from the fifth adhesive layer AL5 to the metal plate MP. The through hole LTH may be equal to a path obtained by removing the light shielding structure from a path for an optical signal, and the through hole LTH may improve optical signal receiving efficiency of the electronic optical module ELM.

[0155] In the lower member LM according to the embodiment, at least one of the metal layer ML, the buffer layer CS, the metal plate MP, and the step compensation member AS may be omitted, but the present disclosure is not limited to the embodiment.

[0156] On the other hand, the lower member LM-F (hereinafter referred to as the lower member of the third digitizer DTM-F) can be arranged under the third digitizer DTM-F. The lower member LM-F of the third digitizer DTM-F can be arranged in a configuration corresponding to the lower member LM. In the embodiment, it is shown that the lower member LM-F of the third digitizer DTM-F includes a metal layer ML-F, a buffer layer (i.e., the third buffer layer) CS-F and a metal plate MP-F. The seventh adhesive layer AL7-F can connect the third digitizer DTM-F and the metal layer ML-F, the eighth adhesive layer AL8-F can connect the metal layer ML-F and the buffer layer CS-F, and the ninth adhesive layer AL9-F connects the buffer layer CS-F and the metal plate MP-F. However, this is shown exemplarily, and the lower member LM-F of the third digitizer DTM-F can also be arranged in a configuration different from the lower member LM, but the present disclosure is not limited to the embodiment.

[0157] Fig. 6A is a plan view showing a portion of an electronic device according to an embodiment of the present disclosure. Figure 6B is a schematic plan view showing the configuration of a digitizer according to an embodiment of the present disclosure. Figure 6C is a side view showing a portion of an electronic device in a folded state. For ease of description, Fig. 6A and Figure 6C Only the support plate SPP and the digitizer DTM are shown. FIG. 6A to FIG. 6C On the other hand, the same reference numerals are assigned to Figures 1A to 5B The components described are the same components, and repeated descriptions thereof will be omitted.

[0158] refer to Fig. 6A , the digitizer DTM is disposed on the rear surface of the support plate SPP. Each of the first digitizer DTM-1, the second digitizer DTM-2, and the third digitizer DTM-F may include an independent sensor. The first digitizer DTM-1 includes a sensor disposed on the first non-folding portion SPP-1, and detects an external input applied to the first non-folding area NFA10. The second digitizer DTM-2 includes a sensor disposed on the second non-folding portion SPP-2, and detects an external input applied to the second non-folding area NFA20.

[0159] The sensor of the first digitizer DTM-1 and the sensor of the second digitizer DTM-2 may be spaced apart from each other in the second direction DR2. The sensor of the first digitizer DTM-1 and the sensor of the second digitizer DTM-2 may be connected to separate circuit boards and may transmit / receive signals independently of each other. The first digitizer DTM-1 and the second digitizer DTM-2 may be driven independently of each other.

[0160] The third digitizer DTM-F includes a sensor disposed on the folded portion SPP-F and detects an external input applied to the folded area FA0. The third digitizer DTM-F may be formed and disposed separately from the first digitizer DTM-1 and the second digitizer DTM-2.

[0161] The first digitizer DTM-1 may include a sensor DGS and a bridge BR. The sensor DGS may include a plurality of first toroidal coils RC1 (see Fig. 7A ) and a plurality of first pads PD1. Figure 6B and Fig. 7A , the first annular coil RC1 may include a first coil RCH1 and a second coil RCV1. The first annular coil RC1 may be disposed in the first non-folding area NFA10. The sensor DGS is connected to the circuit board through the first pad PD1. The electrical signal transmitted through the first pad PD1 may be transmitted to the first annular coil RC1, and an external input applied to the first non-folding area NFA10 may be detected. Figure 6B Description Sensor DGS.

[0162] like Figure 6B As shown in , the ring coil RC may include a plurality of first coils RCH (hereinafter referred to as first coils) and a plurality of second coils RCV (hereinafter referred to as second coils). The first coil RCH may be referred to as a driving coil, and the second coil RCV may be referred to as a detection coil.

[0163] Each of the first coils RCH may extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. Each of the second coils RCV may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1.

[0164] One end of the first coil RCH is connected to the input terminal HIP, and the other end thereof is connected to the output terminal HOP. An alternating current ("AC") signal may be sequentially provided to the input terminal HIP, and the output terminal HOP may have a constant voltage, for example, may be grounded. Therefore, the first coil RCH may be formed in a closed curve shape, and when current flows through the first coil RCH, magnetic lines of force may be induced between the first coil RCH and the second coil RCV.

[0165] One end of the second coil RCV is connected to the input terminal VIP, and the other end thereof is connected to the output terminal VOP. The output terminal VOP may have a constant voltage, for example, may be grounded. Therefore, the second coil RCV may be formed into a closed curve shape, and the second coil RCV may output a signal obtained by detecting the induced electromagnetic force emitted from the electromagnetic pen to the output terminal VOP of the second coil RCV.

[0166] Figure 6B The sensor DGS according to the embodiment is exemplarily shown, but the present disclosure is not limited thereto. The arrangement relationship between the first coil RCH and the second coil RCV is not limited to Figure 6B , and various modifications may be made. On the other hand, although not shown, each of the second digitizer DTM-2 and the third digitizer DTM-F may include a sensor unit having the same structure as the sensor unit of the first digitizer DTM-1. However, this is described exemplarily, and the second digitizer DTM-2 and the third digitizer DTM-F may include coils having a different arrangement relationship from the arrangement relationship of the coils of the first digitizer DTM-1, as long as the second digitizer DTM-2 and the third digitizer DTM-F can independently detect external inputs applied to the second non-folding area NFA20 and the folding area FA0, respectively, but the present disclosure is not limited to the embodiments.

[0167] Back to reference Fig. 6A, the first pad PD1 may include a plurality of first input pads IP1 and a plurality of first output pads OP1. The first input pad IP1 may include Figure 6B The input terminals HIP and VIP shown in FIG. 1 and the first output pad OP1 may include Figure 6B The output terminals HOP and VOP are shown in FIG.

[0168] The bridge BR overlaps the first non-folding area NFA10. The bridge BR may be electrically insulated from the sensor DGS. The bridge BR may include a plurality of bridge lines BRL (hereinafter referred to as bridge lines), a plurality of first bridge pads BRP, and a plurality of second bridge pads BRP-F.

[0169] The bridge wire BRL may be insulated from and intersect the first toroidal coil RC1. For example, the bridge wire BRL and the first coil RCH1 may be arranged on different layers from each other. However, this is shown exemplarily, and in another embodiment, the bridge wire BRL and the first toroidal coil RC1 may be arranged on the same layer as long as the bridge wire BRL and the first toroidal coil RC1 are electrically insulated from each other, but the present disclosure is not limited to the embodiment.

[0170] For ease of description, Fig. 6A 2. Some of the bridge lines BRL are shown in FIG. 2. The bridge lines BRL overlap the first non-folding area NFA10. The bridge lines BRL may be insulated from and intersect the first toroidal coil RC1 of the first digitizer DTM-1.

[0171] The first bridging pad BRP may be provided to the first pad portion PDR1. The first bridging pads BRP may be respectively connected to one end of the bridging line BRL. The second bridging pad BRP-F may be provided to a position different from the first pad portion PDR1. The second bridging pads BRP-F may be respectively connected to the other end of the bridging line BRL. That is, the bridging line BRL may be a line electrically connecting the first bridging pad BRP and the second bridging pad BRP-F.

[0172] The second digitizer DTM-2 is disposed on the second non-folding portion SPP-2 and overlaps the second non-folding area NFA20. The first digitizer DTM-1 and the second digitizer DTM-2 may be disposed at positions that do not overlap the hole HL in a plan view.

[0173] The second digitizer DTM-2 may include Figure 6B The sensor DGS shown in FIG. That is, the second digitizer DTM-2 may include a second toroidal coil RC2 and a second pad PD2. The second toroidal coil RC2 may include Figure 6B and Fig. 7AThe first coil RCH2 and the second coil RCV2 shown in FIG. 1 and the second pad PD2 may include a second input pad IP2 and a second output pad OP2. The second input pad IP2 may include Figure 6B The input terminals HIP and VIP shown in FIG. 1 and the second output pad OP2 may include Figure 6B The output terminals HOP and VOP are shown in FIG.

[0174] The third digitizer DTM-F is disposed on the folding portion SPP-F and overlaps the folding area FA0. The third digitizer DTM-F is electrically connected to the first digitizer DTM-1 through the connecting member CNP. However, this is shown exemplarily, and the third digitizer DTM-F may be electrically connected to the second digitizer DTM-2, but the present disclosure is not limited to the embodiment.

[0175] The third digitizer DTM-F may include Figure 6B That is, the third digitizer DTM-F may include a third toroidal coil RC3 (refer to Figure 7B ) and the third pad PD3 (reference Figure 7B ). The third toroidal coil RC3 may include FIG. 7B to FIG. 9B The first coil RCH3 and the second coil RCV3 shown in FIG. 1 and the third pad PD3 may include Figure 6B The input terminals HIP and VIP and the output terminals HOP and VOP are shown in FIG.

[0176] The third pad PD3 may be provided to the connecting pad portion PDR3 of the first digitizer DTM-1. The third pad PD3 is connected to the bridge BR through the connecting member CNP. The circuit board may be arranged in the first pad portion PDR1 via the first non-folding area NFA10 through the first bridge pad BRP, the bridge line BRL and the second bridge pad BRP-F, and electrically connected to the third digitizer DTM-F. However, this is described exemplarily, and the first bridge pad BRP connected to the third pad PD3 may be arranged at a position different from that of the first pad portion PDR1, and may be connected to a separate circuit board independent of the circuit board connected to the first pad PD1, and the present disclosure is not limited thereto. Reference Figure 6C , when the electronic device ED is folded, the support plate SPP is also folded relative to the folding axis FX. The first digitizer DTM-1 and the second digitizer DTM-2 are arranged in the first non-folding area NFA10 and the second non-folding area NFA20, and are therefore not folded. Therefore, the folding stress according to the folding operation is not applied to the first digitizer DTM-1 and the second digitizer DTM-2, and thus stable electrical reliability can be provided.

[0177] The third digitizer DTM-F may be disposed in the folding area FA0 and connected to the first digitizer DTM-1 through a connecting member CNP. The digitizer DTM according to the present disclosure may further include the third digitizer DTM-F, and thus an external input applied to the folding area FA0 may be easily detected. In addition, since the third digitizer DTM-F is disposed separately from the first digitizer DTM-1 or the second digitizer DTM-2, the material or structure of the layer constituting the third digitizer DTM-F may be designed independently of the first digitizer DTM-1 or the second digitizer DTM-2. Therefore, the third digitizer DTM-F having improved folding characteristics may be disposed in the folding area FA0, and thus a digitizer DTM having improved reliability may be provided even when the electronic device ED is folded. In addition, since the third digitizer DTM-F is connected to the first digitizer DTM-1 or the second digitizer DTM-2, a separate circuit board for driving the third digitizer DTM-F may be omitted, and thus a simplified electronic device ED may be provided.

[0178] On the other hand, the electronic device ED according to the present disclosure may further include an adhesive member ADP for connecting the third digitizer DTM-F and the support plate SPP. A plurality of adhesive members ADP may be spaced apart from each other in the first direction DR1, and the connecting member CNP is interposed between them, but the present disclosure is not limited thereto. The electronic device ED may further include an adhesive member ADP to supplement the adhesive force of the connecting member CNP. Therefore, when the electronic device ED is folded, the movement of the third digitizer DTM-F may be minimized, and the third digitizer DTM-F may be prevented from being separated from the support plate SPP. In addition, the first digitizer DTM-1 and the second digitizer DTM-2 are driven separately, and the sensor DGS is disposed in the folding area FA0 through the third digitizer DTM-F. Therefore, since the detection coil whose shape is changed to pass between the holes HL in the folding area FA0 is omitted, an electronic device ED including a digitizer DTM with improved sensing sensitivity may be provided.

[0179] Fig. 7A and Figure 7B is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. Fig. 7A shows a state in which the support plate SPP, the first digitizer DTM-1 and the second digitizer DTM-2 are coupled, and Figure 7B A state is shown in which a third digitizer DTM-F is additionally connected thereto. Fig. 7A and Figure 7B On the other hand, the same reference numerals are assigned to Figures 1A to 6CThe components described are the same components, and repeated descriptions thereof will be omitted.

[0180] refer to Fig. 7A The first digitizer DTM-1 may include a first base layer BG1, a second base layer BG2, a first coil RCH1, a second coil RCV1, a first pad PD1, a bridge line BRL, a first bridge pad BRP, a second bridge pad BRP-F, a first cover layer IL1, and a second cover layer IL2. The first coil RCH1, the second coil RCV1, and the bridge line BRL may include copper.

[0181] The first coil RCH1 may be arranged on the first base layer BG1. The second base layer BG2 may be provided below the first base layer BG1. The second coil RCV1 may be arranged on the front surface BG2-U of the second base layer BG2. The bridge BR (e.g., the first bridge pad BRP) may be arranged on the rear surface BG2-B of the second base layer BG2. According to an embodiment, the second base layer BG2 may include the same material as that of the first base layer BG1.

[0182] The first cover layer IL1 may be disposed on the first base layer BG1 and cover the first coil RCH1. The second cover layer IL2 may be disposed on the rear surface BG2-B of the second base layer BG2 and cover the bridge line BRL. According to an embodiment, the first cover layer IL1 and the second cover layer IL2 may include the same material as that of the first base layer BG1. However, this is described exemplarily, and the first cover layer IL1 and the second cover layer IL2 may include a material different from that of the first base layer BG1. For example, the second cover layer IL2 may be an adhesive layer.

[0183] According to an embodiment, the first coil RCH and the second coil RCV may not be arranged in the folded portion SPP-F. Therefore, the arrangement design in which the first coil RCH and the second coil RCV pass between the holes HL can be omitted, and when the electronic device ED (see Figure 1B ) is folded, cracks can be prevented from occurring in the first coil RCH and the second coil RCV.

[0184] Some of the first coils RCH may be connected to corresponding connection patterns through first contact holes CNT1 defined by the first base layer BG1 and the second base layer BG2. Similarly, some of the second coils RCV may be connected to corresponding connection patterns through second contact holes CNT2 defined by the second base layer BG2. According to an embodiment, the first coils RCH and the second coils RCV may be arranged on different layers and thus may be insulated and crossed from each other in a plan view.

[0185] The second bridge pad BRP-F may be arranged on the rear surface BG2-B of the second base layer BG2. The second bridge pad BRP-F may be exposed from the second cover layer IL2. That is, a portion of the second cover layer IL2 may be removed so that the second bridge pad BRP-F is exposed. The connection member CNP may be provided on the second bridge pad BRP-F.

[0186] The connection member CNP may be conductive. For example, the connection member CNP may be an anisotropic conductive film. The connection member CNP is electrically / physically coupled to the second bridge pad BRP-F.

[0187] The second digitizer DTM-2 may have the same layer structure as that of the first digitizer DTM-1, but may have a structure in which the bridge BR is omitted. Specifically, the second digitizer DTM-2 may include a first base layer BG1, a second base layer BG2, a first coil RCH2, a second coil RCV2, a first cover layer IL1, and a second cover layer IL2.

[0188] refer to Figure 7B , the third digitizer DTM-F may include a base layer BG, a first coil RCH3, a second coil RCV3, a third pad PD3, a first cover layer IL1, and a second cover layer IL2. In the second direction DR2, the third digitizer DTM-F may be spaced apart from the lower layers LF1 to LF4 arranged in the first non-folding area NFA10 by a predetermined distance GP1, and spaced apart from the lower layers LF1 to LF4 arranged in the second non-folding area NFA20 by a predetermined distance GP2.

[0189] The first coil RCH3 and the second coil RCV3 may be disposed on different layers from each other. In an embodiment, the first coil RCH3 may be disposed on an upper surface of the base layer BG, and the second coil RCV3 may be disposed on a rear surface of the base layer BG.

[0190] The third pad PD3 may be arranged on the upper surface of the base layer BG and exposed from the first cover layer IL1. The third pad PD3 may be electrically connected to the second bridge pad BRP-F through a connection member CNP. The third digitizer DTM-F may be selectively connected to one of the first digitizer DTM-1 and the second digitizer DTM-2. In an embodiment, the third digitizer DTM-F may be electrically connected to the first digitizer DTM-1 through a connection member CNP.

[0191] The lower layers LF1, LF2, LF3 and LF4 of the first digitizer DTM-1 may be respectively included in the Figure 5AThat is, each of the lower layers LF1, LF2, LF3 and LF4 may include Figure 5A Any one of the metal layer ML, buffer layer CS, metal plate MP, heat dissipation layer HRP and magnetic field shielding sheet MSM shown in FIG.

[0192] In an embodiment, the lower layers LF1, LF2, LF3 and LF4 of the third digitizer DTM-F may have the same stacking structure as the lower layers LF1, LF2, LF3 and LF4 of the first digitizer DTM-1. Therefore, the digitizers DTM-1 and DTM-2 arranged in the non-folding areas NFA10 and NFA20 and the third digitizer DTM-F provided in the folding area FA0 may be supported by the same lower member, and thus an environment for input detection may be uniformly provided in the folding area FA0 and the non-folding areas NFA10 and NFA20.

[0193] Figure 8 is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. For ease of description, Figure 8 Shows the corresponding Figure 7B In the following, reference will be made to Figure 8 On the other hand, the same reference numerals are assigned to Figures 1A to 7B The components described are the same components, and repeated descriptions thereof will be omitted.

[0194] refer to Figure 8 In the electronic device ED, the lower member LM-F of the third digitizer DTM-F may have a layer structure different from the layer structure of the lower member LM arranged in the non-folding areas NFA10 and NFA20. In an embodiment, when compared with the lower side of the first digitizer DTM-1, the lower member LM-F of the third digitizer DTM-F may have a structure in which the third lower layer LF3 is omitted.

[0195] The third lower layer LF3 may correspond to Figure 5B The metal layer ML shown in Figure 5B ). That is, the third lower layer LF3 can be a layer having a heat dissipation function and an electromagnetic wave blocking function. The third digitizer DTM-F is arranged in a folding area FA0 that is narrower than the first non-folding area NFA10 and the second non-folding area NFA20, and therefore a relatively small area can be provided as compared with the first digitizer DTM-1 and the second digitizer DTM-2. Therefore, even when there is no heat dissipation layer, the dissipated heat can be relatively small. Therefore, even when the third lower layer LF3 is omitted, a stable external input detection environment can be provided.

[0196] In addition, the third digitizer DTM-F is connected to the third lower layer LF3 disposed in the non-folding areas NFA10 and NFA20, and thus can easily block electromagnetic waves. According to the present disclosure, the lower member disposed under the third digitizer DTM-F includes fewer layers than the layers of the lower member arranged in the non-folding areas NFA10 and NFA20, and the thickness of the third digitizer DTM-F in the folding area FA can be reduced, and thus improved folding characteristics can be achieved.

[0197] Fig. 9A and Fig. 9B is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure. For ease of description, Fig. 9A and Fig. 9B Shows the corresponding Figure 7B In the following, reference will be made to Fig. 9A and Fig. 9B On the other hand, the same reference numerals are assigned to Figures 1A to 8 The components described are the same components, and repeated descriptions thereof will be omitted.

[0198] refer to Fig. 9A , each of the first digitizer DTM-1 and the second digitizer DTM-2 may have a layer structure different from that of the third digitizer DTM-F. For example, the first digitizer DTM-1 may include a first base layer BG1, a second base layer BG2, a second coil RCV1, a first pad PD1, a first bridge pad BRP, a second bridge pad BRP-F, and a second cover layer IL2. The second coil RCV1 may be arranged on the front surface BG2-U of the second base layer BG2.

[0199] The first pad PD1, the first bridge pad BRP, and the second bridge pad BRP-F are arranged on the rear surface BG2-B of the second base layer BG2. Although not shown, the first bridge pad BRP and the second bridge pad BRP-F may be formed on the first pad portion PDR1 (see Fig. 6A ) is exposed from the second cover layer IL2. The second bridging pad BRP-F may be adjacent to the folding area FA0, may be exposed from the second cover layer IL2, and may define a connection pad portion PDR3 (see Fig. 6A ). The third pad PD3 may be electrically connected to the second bridge pad BRP-F through the connection member CNP.

[0200] The second digitizer DTM-2 may include a first base layer BG1, a second base layer BG2, a second coil RCV2, a second pad PD2, and a second cover layer IL2. The second coil RCV2 may be arranged on the front surface BG2-U of the second base layer BG2. The second pad PD2 may be provided on the rear surface BG2-B of the second base layer BG2, and although not shown, may be provided on the second pad portion PDR2 (see Fig. 6A ) is exposed from the second cover layer IL2.

[0201] refer to Fig. 9B , each of the first digitizer DTM-1S and the second digitizer DTM-2S may be inserted into the support plate SPP. For example, the base layer BG (e.g., the first base layer BG1 and the second base layer BG2), the first cover layer IL1 and the second cover layer IL2 included in the first digitizer DTM-1S may be included in the first non-folded portion SPP-1 of the support plate SPP. At least one of the base layer BG, the first cover layer IL1 and the second cover layer IL2 may include a reinforced fiber composite material or a prepreg material. For example, the base layer BG may include a fiber reinforced plastic, and each of the first cover layer IL1 and the second cover layer IL2 may include an insulating layer. Alternatively, each of the base layer BG, the first cover layer IL1 and the second cover layer IL2 may include a reinforced fiber composite material or a prepreg material. The second digitizer DTM-2S may have the same layer structure as that of the first digitizer DTM-1S.

[0202] The first digitizer DTM-1S and the second digitizer DTM-2S can be manufactured simultaneously with the support plate SPP. Different from this, the third digitizer DTM-F can be manufactured separately from the first digitizer DTM-1S and the second digitizer DTM-2S. According to the present disclosure, since the third digitizer DTM-F is also included separately, defects such as disconnection of the digitizer in the folding area FA0 can be prevented. Therefore, a digitizer can be provided that can effectively prevent sensitivity reduction in a foldable electronic device and has improved electrical reliability.

[0203] Fig. 10A is a cross-sectional view of a base layer included in a digitizer according to an embodiment of the present disclosure. Fig. 10B is a plan view of a base layer included in a digitizer according to an embodiment of the present disclosure. Fig. 10A and Fig. 10B The description of the base layer BG can be applied to Figure 5A The support plate SPP shown in FIG. Fig. 9B The base layers BG, BG1 and BG2 and the cover layers IL1 and IL2 are shown in FIG.

[0204] refer to Fig. 10A and Fig. 10B , the base layer BG according to the present disclosure may include a matrix MT and braided fiber lines FL1 and FL2 arranged in the matrix MT, the matrix MT including a filler.

[0205] The fiber lines FL1 and FL2 may be alternately arranged in the first direction DR1 and the second direction DR2 to have a fabric shape in a plan view. Each of the fiber lines FL1 and FL2 may be provided in the form of a bundle of a plurality of fibers GL. The diameter of a portion of the fiber GL included in one fiber line may be in the range of 3 μm to 10 μm.

[0206] Each of the fiber lines FL1 and FL2 may include a reinforced fiber composite material. The reinforced fiber composite material may be one of CFRP and GFRP. The fiber lines FL1 and FL2 may be arranged in a matrix MT. The matrix MT according to an embodiment may include at least one of epoxy resin, polyester, polyamide, polycarbonate, polypropylene, polybutylene, and vinyl ester.

[0207] The matrix MT may include a filler. The filler may include at least one of silica, barium sulfate, sintered talc, barium titanate, titanium oxide, clay, aluminum oxide, mica, boehmite, zinc borate, and zinc titanate.

[0208] According to the present disclosure, including Fig. 9B The base layer BG in the digitizer shown in FIG. 1 includes fiber bundles of glass fiber reinforced plastic or carbon fiber reinforced plastic arranged in a matrix MT, and thus can protect the display device DD when the electronic device ED is folded (see FIG. 2 ). Figure 5A )’s lower part.

[0209] Therefore, the digitizer according to the present disclosure can be used as a protective member and at the same time play a role in detecting pen input. Therefore, a separate metal plate for protecting the display device DD can be omitted. Therefore, a slim electronic device ED with reduced cost can be provided.

[0210] According to the present disclosure, since the digitizer formed on a separate substrate is also provided in the folding region, the sensor of the digitizer may not be provided in the folding region. Since the digitizer provided in the folding region and the digitizer provided in the non-folding region are provided separately, the digitizer to which the folding stress is applied can be easily changed to a material having high rigidity. In addition, an electronic device including a digitizer having improved sensing sensitivity because a detection coil that is deformed to pass between holes in the folding region is omitted can be provided.

[0211] Although the above description has been made with reference to the embodiments of the present disclosure, it is to be understood that various modifications and changes may be made to the present disclosure by those skilled in the art or those of ordinary skill in the art without departing from the spirit and technical scope of the present disclosure described in the appended claims. Therefore, the technical scope of the present disclosure is not limited to the detailed description of the specification, but should be defined by the appended claims.

Claims

1. An electronic device, comprising: A display panel, comprising a display surface and a rear surface opposite to the display surface, the display surface comprising a folding area, a first non-folding area, and a second non-folding area, wherein the folding area is foldable with respect to a folding axis extending in a first direction, the first non-folding area is defined on one side of the folding area, and the second non-folding area is defined to be spaced apart from the first non-folding area in a second direction intersecting the first direction, and the folding area is interposed between the first non-folding area and the second non-folding area; a first digitizer disposed on the rear surface and overlapping the first unfolded area; a second digitizer disposed on the rear surface, spaced apart from the first digitizer, and overlapping the second non-folding area; a third digitizer disposed on the rear surface and overlapping the folding area; and a connecting member connected to the third digitizer, The connecting member is connected to one of the first digitizer and the second digitizer and is spaced apart from the other of the first digitizer and the second digitizer.

2. The electronic device according to claim 1, further comprising a support member provided on the rear surface of the display panel, in, The supporting member comprises: a first non-folding portion, disposed between the display panel and the first digitizer and overlapping the first non-folding area; a second non-folding portion, disposed between the display panel and the second digitizer and overlapping the second non-folding region; and a folding portion disposed between the display panel and the third digitizer, connected to the first non-folding portion and the second non-folding portion, and overlapping the folding region, and Wherein, a plurality of holes are defined in the folded portion.

3. The electronic device according to claim 2, wherein: The support member includes a base layer, and the base layer includes a plurality of fiber strands.

4. The electronic device according to claim 2, wherein: The first digitizer is disposed on the first unfolded portion, The second digitizer is disposed on the second unfolded portion, and In the cross-sectional view, the third digitizer is spaced apart from the folded portion.

5. The electronic device according to claim 1, wherein: The first digitizer comprises: a sensor configured to detect an external input applied to the first unfolded region; and a bridge member electrically insulated from the sensor, and Wherein, the third digitizer is connected to the bridge member.

6. The electronic device according to claim 5, wherein: The first digitizer further includes a first pad portion and a connecting pad portion, The connecting pad portion is spaced apart from the first pad portion in the second direction and is closer to the folding region than the first pad portion. The sensor includes a first loop coil overlapping the first non-folding area, a first input pad connected to one end of the first loop coil, and a first output pad connected to the other end of the first loop coil. The bridge member includes a bridge line, a first bridge pad connected to a first end of the bridge line, and a second bridge pad connected to a second end of the bridge line opposite to the first end. The first input pad, the first output pad, and the first bridge pad are arranged in the first pad portion, and The second bridge pad is provided in the connection pad portion.

7. The electronic device according to claim 6, wherein: The connection member electrically connects the second bridge pad and the third digitizer.

8. The electronic device according to claim 1, wherein: The connection member includes an anisotropic conductive film.

9. The electronic device according to claim 1, further comprising: An adhesive member is spaced apart from the connecting member in the first direction.

10. The electronic device according to claim 1, wherein: The first digitizer includes glass fiber reinforced plastic, carbon fiber reinforced plastic or prepreg material.

11. The electronic device according to claim 1, further comprising: a support plate disposed between the display panel and the first to third digitizers, wherein the support plate comprises a first non-folding portion overlapping the first digitizer, a second non-folding portion overlapping the second digitizer, and a folding portion overlapping the third digitizer, and A plurality of apertures are defined through the folded portion.

12. The electronic device according to claim 11, wherein: The support plate comprises glass fiber reinforced plastic, carbon fiber reinforced plastic or prepreg material.

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