Bonding device and method and storage medium

Abstract

The invention provides a bonding device and method and a storage medium. The bonding device comprises a bonding head used for adsorbing a to-be-bonded piece and bonding the to-be-bonded piece to a corresponding target position; the sensing mechanism is used for sensing coordinate information and / or angle information of at least three bonding positions on the to-be-bonded first surface of the to-be-bonded part in the process of bonding the to-be-bonded part; the controller is configured to determine the mass center of the to-be-bonded piece and the normal vector of the first surface according to the coordinate information and / or angle information of the at least three bonding positions; and determining the inclination angle of the first surface according to the mass center and the normal vector.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a bonding device, a bonding method and a computer-readable storage medium. Background Art

[0002] In the field of hybrid bonding, chip-to-wafer bonding achieves performance improvement and size reduction through 3D stacking. It not only reduces costs, but also further improves circuit density and further reduces line width from another dimension.

[0003] In the actual process, the relative parallelism between the bonding surfaces of the chip and the wafer is crucial to the bonding quality. In chip-to-wafer bonding, the wafer is often fixed, and the chip is removed from the cut wafer and moved to the bonding position for bonding. Here, the cut surface of the bonded part has a slight curvature. Therefore, the current bonding alignment technology by pre-adjusting the level cannot adapt to the curved surface of the bonded part, resulting in low bonding accuracy.

[0004] In order to overcome the above-mentioned defects in the prior art, there is an urgent need in the art for a bonding technology for leveling the bonding head to adapt to the curved surface of the bonded part, thereby improving the bonding accuracy. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects in the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium for leveling a bonding head to adapt to the curved surface of a bonded part to be bonded, thereby improving the bonding accuracy.

[0007] Specifically, the bonding device provided according to the first aspect of the present invention includes: a bonding head, used to adsorb the workpiece to be bonded and bond it to the corresponding target position; a sensing mechanism, used to sense the coordinate information and / or angle information of at least three bonding positions on the first surface to be bonded during the bonding of the workpiece to be bonded; and a controller, configured to: determine the center of mass of the workpiece to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions; and determine the inclination angle of the first surface based on the center of mass and the normal vector.

[0008] Further, in some embodiments of the present invention, the target position includes a second surface of the first wafer to be bonded, and the object to be bonded includes a chip peeled from the second wafer, which has a curved first surface.

[0009] Furthermore, in some embodiments of the present invention, the sensing mechanism includes a horizontal sensor, and the bonding device includes at least three horizontal sensors to sense the inclination angle information of at least three bonding positions on the first surface, and the step of determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions includes: fitting the first surface according to the inclination angle information of the at least three bonding positions; and determining the center of mass of the part to be bonded and the normal vector of the first surface based on the fitted first surface.

[0010] Furthermore, in some embodiments of the present invention, the sensing mechanism includes a distance sensor, and the bonding device includes at least three of the distance sensors to sense distance information from at least three bonding positions on the first surface to corresponding target positions. The step of determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions includes: fitting the first surface based on the distance information from the at least three bonding positions to the corresponding target positions; and determining the center of mass of the part to be bonded and the normal vector of the first surface based on the fitted first surface.

[0011] Furthermore, in some embodiments of the present invention, the sensing mechanism includes a 3D camera for collecting 3D point cloud data of at least three bonding positions on the first surface, and the step of determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions includes: fitting the first surface based on the 3D point cloud data of the at least three bonding positions; and determining the center of mass of the part to be bonded and the normal vector of the first surface based on the fitted first surface.

[0012] Furthermore, in some embodiments of the present invention, the bonding device also includes a leveling mechanism, and the controller is further configured to: determine a corresponding leveling control signal based on the inclination angle of the first surface; and transmit the leveling control signal to the leveling mechanism to correct the inclination angle.

[0013] Furthermore, in some embodiments of the present invention, the leveling mechanism includes: a ball head structure, a first end of which is fixedly connected to the bonding head; and a driving unit, including piezoelectric ceramics, wherein the piezoelectric ceramics expand and contract according to the leveling control signal, and laterally push or pull the second end of the ball head structure to adjust the inclination angle of the first surface via the ball head structure and the bonding head.

[0014] Further, in some embodiments of the present invention, the leveling control signal indicates the inclination angle of the first surface along preset X direction and Y direction, the X direction and the Y direction are parallel in a horizontal plane, and the leveling mechanism includes two driving parts, wherein the first piezoelectric ceramic of the first driving part expands and contracts along the X direction according to the leveling control signal, pushes or pulls the second end of the ball head structure, so as to adjust the inclination angle of the first surface along the X direction via the ball head structure and the bonding head, and the second piezoelectric ceramic of the second driving part expands and contracts along the Y direction according to the leveling control signal, pushes or pulls the second end of the ball head structure, so as to adjust the inclination angle of the first surface along the Y direction via the ball head structure and the bonding head.

[0015] Furthermore, in some embodiments of the present invention, the leveling mechanism also includes a supporting portion, which is rollingly connected to the third end of the ball head structure and fixedly connected to the first end of the first driving portion, and the second end of the first driving portion is fixedly connected to the first end of the second driving portion, and the second end of the ball head structure is pushed or pulled via the second end of the second driving portion to cooperate with the second driving portion to adjust the inclination angle of the first surface along the X direction and the Y direction.

[0016] Furthermore, in some embodiments of the present invention, the bonding device also includes: a translation mechanism connected to the support portion to adjust the planar position of the bonding head along the X direction and / or the Y direction; and / or a lifting mechanism connected to the support portion to adjust the height of the bonding head along the vertical Z direction.

[0017] In addition, the bonding method provided according to the second aspect of the present invention includes the following steps: adsorbing the part to be bonded via a bonding head; in the process of bonding the part to be bonded, sensing the coordinate information and / or angle information of at least three bonding positions on the first surface to be bonded; determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions; determining the inclination angle of the first surface based on the center of mass and the normal vector; and leveling the first surface according to the inclination angle, and bonding it to the corresponding target position.

[0018] In addition, the computer-readable storage medium provided according to the third aspect of the present invention stores computer instructions, which, when executed by a processor, implement the bonding method as described in the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0020] Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0021] Figure 2 A schematic diagram of a level sensor provided according to some embodiments of the present invention is shown.

[0022] Figure 3 A schematic diagram of a 3D camera provided according to some embodiments of the present invention is shown.

[0023] Figure 4 A schematic structural diagram of a translation device provided according to some embodiments of the present invention is shown.

[0024] Reference numerals:

[0025] 10 Bonding head

[0026] 201 Level sensor

[0027] 202 Camera

[0028] 30 Parts to be bonded

[0029] 301 First Surface

[0030] 40 Ball head structure

[0031] 50 Drive unit

[0032] 60 Support

[0033] 70 Translation mechanism DETAILED DESCRIPTION

[0034] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0037] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0038] As mentioned above, in the field of hybrid bonding, chip-to-wafer bonding achieves performance improvement and size reduction through 3D stacking. It not only reduces costs, but also further improves circuit density, and further reduces line width from another dimension.

[0039] In the actual process, the relative parallelism between the bonding surfaces of the chip and the wafer is crucial to the bonding quality. In chip-to-wafer bonding, the wafer is often fixed, and the chip is removed from the cut wafer and moved to the bonding position for bonding. Here, the cut surface of the bonded part has a slight curvature. Therefore, the current bonding alignment technology by pre-adjusting the level cannot adapt to the curved surface of the bonded part, resulting in low bonding accuracy.

[0040] In order to overcome the above-mentioned defects in the prior art, the present invention provides a bonding device, a bonding method and a computer-readable storage medium for leveling a bonding head to adapt to the curved surface of a bonded part to be bonded, thereby improving the bonding accuracy.

[0041] In some non-limiting embodiments, the bonding method provided in the second aspect of the present invention can be implemented based on the bonding device provided in the first aspect of the present invention. Specifically, the bonding device is configured with a memory and a processor. The memory includes but is not limited to the computer-readable storage medium provided in the third aspect of the present invention, on which computer instructions are stored. When the computer instructions are executed by the processor, the bonding method described in the second aspect of the present invention is implemented.

[0042] Please refer to Figure 1 , Figure 1 A schematic structural diagram of a bonding device provided according to some embodiments of the present invention is shown.

[0043] like Figure 1 As shown, the bonding device includes a bonding head, a sensing mechanism and a controller. The bonding head is used to absorb the part to be bonded and bond it to the corresponding target position. The target position includes the second surface of the first wafer to be bonded. The part to be bonded includes a chip peeled from the second wafer, which has a curved first surface. The sensing mechanism may include a horizontal sensor, a distance sensor and a 3D camera, and the sensing mechanism is used to sense the coordinate information and / or angle information of at least three bonding positions on the first surface to be bonded during the bonding of the part to be bonded. The controller determines the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions, and then determines the inclination angle of the first surface based on the center of mass and the normal vector.

[0044] Please refer to Figure 2-Figure 3 , Figure 2 A schematic diagram of a level sensor provided according to some embodiments of the present invention is shown. Figure 3 A schematic diagram of a 3D camera provided according to some embodiments of the present invention is shown.

[0045] like Figure 2As shown, the sensing mechanism includes at least three horizontal sensors to sense the tilt angle information of at least three bonding positions on the first surface. The controller fits the first surface according to the tilt angle information of at least three bonding positions, thereby determining the centroid of the to-be-bonded member and the normal vector of the first surface according to the fitted first surface.

[0046] The sensing mechanism may also include at least three distance sensors to sense distance information from at least three bonding positions on the first surface to corresponding target positions, where the distances are determined based on coordinates of the second wafer coordinate system. In some embodiments, the controller fits the first surface based on the distance information from at least three bonding positions to corresponding target positions, thereby determining the centroid of the to-be-bonded member and the normal vector of the first surface based on the fitted first surface.

[0047] like Figure 3 As shown, the 3D camera is used to collect 3D point cloud data of at least three bonding positions on the first surface, and the 3D point cloud data is determined based on the coordinates of the camera coordinate system. Here, since the cut surface of the part to be bonded has a slight curvature, the technology of using the 3D point cloud data for bonding alignment can adapt to the curved surface of the part to be bonded, which is conducive to improving its bonding accuracy.

[0048] In some embodiments, the controller fits the first surface according to the 3D point cloud data of at least three bonding positions, thereby determining the center of mass of the part to be bonded and the normal vector of the first surface according to the fitted first surface.

[0049] In addition, please continue to refer to Figure 1 ,like Figure 1 As shown, the leveling mechanism also includes a ball head structure and a driving unit. The first end (e.g., upper end) of the ball head structure is fixedly connected to the bonding head. The driving unit includes a piezoelectric ceramic. The piezoelectric ceramic expands and contracts according to the leveling control signal, and laterally pushes or pulls the second end (e.g., one side) of the ball head structure to adjust the inclination angle of the first surface via the ball head structure and the bonding head.

[0050] Specifically, the controller can determine a corresponding leveling control signal according to the tilt angle of the first surface, and then transmit the leveling control signal to the leveling mechanism to correct the tilt angle. The corrected tilt angle can be to reduce the tilt angle or even return the tilt angle to zero so that the bonded component is level with the wafer.

[0051] In some embodiments, the leveling control signal indicates a tilt angle of the first surface along a preset X direction and a preset Y direction, where the X direction and the Y direction are parallel in a horizontal plane.

[0052] In some embodiments, the leveling mechanism may include two driving parts. Here, the first piezoelectric ceramic of the first driving part expands and contracts along the X direction according to the leveling control signal, pushes or pulls the second end of the ball head structure, so as to adjust the inclination angle of the first surface along the X direction via the ball head structure and the bonding head. The second piezoelectric ceramic of the second driving part expands and contracts along the Y direction according to the leveling control signal, pushes or pulls the second end of the ball head structure, so as to adjust the inclination angle of the first surface along the Y direction via the ball head structure and the bonding head.

[0053] Furthermore, the leveling mechanism further includes a support portion, which is rollingly connected to the third end (e.g., the lower end) of the ball head structure and fixedly connected to the first end of the first driving portion. The second end of the first driving portion is fixedly connected to the first end of the second driving portion, and the second end of the ball head structure is pushed or pulled via the second end of the second driving portion to cooperate with the second driving portion to adjust the inclination angle of the first surface along the X direction and the Y direction.

[0054] Those skilled in the art will appreciate that the two driving unit embodiments are merely some non-limiting implementations provided by the present invention, which are intended to clearly demonstrate the main concepts of the present invention and to provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the driving unit.

[0055] Optionally, in some embodiments, the driving part may be three driving parts distributed along an angle of 120° to respectively adjust the inclination angle of the first surface along corresponding directions.

[0056] Please refer to Figure 4 , Figure 4 A schematic structural diagram of a translation device provided according to some embodiments of the present invention is shown.

[0057] like Figure 4 As shown, the bonding device may further include a translation mechanism connected to the support portion to adjust the planar position of the bonding head along the X direction and / or the Y direction.

[0058] In some embodiments, the bonding device may further include a lifting mechanism, wherein the lifting mechanism is connected to the supporting part to adjust the height of the bonding head along the vertical Z direction.

[0059] The working principle of the above-mentioned bonding device will be described below in combination with some embodiments of the bonding method. Those skilled in the art will understand that the embodiments of these bonding methods are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the bonding device. Similarly, the bonding device is also only some non-limiting implementation methods provided by the present invention, and does not constitute a limitation on the execution subject or execution order of each step in these bonding methods.

[0060] Specifically, the bonding device can first adsorb the workpiece to be bonded via the bonding head, and then, in the process of bonding the workpiece to be bonded, sense the coordinate information and / or angle information of at least three bonding positions on the first surface to be bonded. Afterwards, the center of mass of the workpiece to be bonded and the normal vector of the first surface are determined based on the coordinate information and / or angle information of at least three bonding positions. Afterwards, the inclination angle of the first surface is determined based on the center of mass and the normal vector. Finally, the first surface is leveled according to the inclination angle and bonded to the corresponding target position.

[0061] In summary, the bonding device, method and computer-readable storage medium provided by the present invention can be used to level the bonding head to adapt to the curved surface of the bonded part, thereby improving the bonding accuracy.

[0062] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0063] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0064] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0065] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding device, characterized in that: include: A bonding head is used to absorb the parts to be bonded and bond them to the corresponding target positions; A sensing mechanism, used for sensing coordinate information and / or angle information of at least three bonding positions on the first surface to be bonded during bonding of the member to be bonded; as well as The controller is configured to: determine the center of mass of the bonded part and the normal vector of the first surface according to the coordinate information and / or angle information of the at least three bonding positions; and determine the inclination angle of the first surface according to the center of mass and the normal vector.

2. The bonding device according to claim 1, characterized in that The target position includes a second surface of a first wafer to be bonded, and the object to be bonded includes a chip peeled from the second wafer and having a curved first surface.

3. The bonding device according to claim 1, characterized in that The sensing mechanism includes a horizontal sensor, and the bonding device includes at least three horizontal sensors to sense the tilt angle information of at least three bonding positions on the first surface. The step of determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions includes: fitting the first surface based on the inclination angle information of the at least three bonding positions; and determining the center of mass of the part to be bonded and the normal vector of the first surface based on the fitted first surface.

4. The bonding device according to claim 1, characterized in that The sensing mechanism includes a distance sensor, and the bonding device includes at least three distance sensors to sense distance information from at least three bonding positions on the first surface to corresponding target positions. The step of determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions includes: fitting the first surface based on the distance information from the at least three bonding positions to the corresponding target positions; and determining the center of mass of the part to be bonded and the normal vector of the first surface based on the fitted first surface.

5. The bonding device according to claim 1, characterized in that The sensing mechanism includes a 3D camera for collecting 3D point cloud data of at least three bonding positions on the first surface, The step of determining the center of mass of the part to be bonded and the normal vector of the first surface based on the coordinate information and / or angle information of the at least three bonding positions includes: fitting the first surface based on the 3D point cloud data of the at least three bonding positions; and determining the center of mass of the part to be bonded and the normal vector of the first surface based on the fitted first surface.

6. The bonding device according to claim 1, characterized in that The bonding device also includes a leveling mechanism, and the controller is further configured to: determining a corresponding leveling control signal according to the inclination angle of the first surface; and The leveling control signal is transmitted to the leveling mechanism to correct the tilt angle.

7. The bonding device according to claim 6, characterized in that The leveling mechanism comprises: a ball head structure, a first end of which is fixedly connected to the bonding head; and The driving part includes a piezoelectric ceramic, wherein the piezoelectric ceramic expands and contracts according to the leveling control signal, and laterally pushes or pulls the second end of the ball head structure to adjust the tilt angle of the first surface via the ball head structure and the bonding head.

8. The bonding device according to claim 7, characterized in that The leveling control signal indicates the tilt angle of the first surface along a preset X direction and a preset Y direction, the X direction and the Y direction are parallel in a horizontal plane, and the leveling mechanism includes two driving parts, wherein: The first piezoelectric ceramic of the first driving part expands and contracts along the X direction according to the leveling control signal, and pushes or pulls the second end of the ball head structure, so as to adjust the inclination angle of the first surface along the X direction via the ball head structure and the bonding head. The second piezoelectric ceramic of the second driving part expands and contracts along the Y direction according to the leveling control signal, pushes or pulls the second end of the ball head structure, so as to adjust the inclination angle of the first surface along the Y direction via the ball head structure and the bonding head.

9. The bonding device according to claim 8, characterized in that The leveling mechanism further includes a support portion, the support portion is rollingly connected to the third end of the ball head structure and fixedly connected to the first end of the first driving portion. The second end of the first driving part is fixedly connected to the first end of the second driving part, and the second end of the ball head structure is pushed or pulled via the second end of the second driving part to cooperate with the second driving part to adjust the inclination angle of the first surface along the X direction and the Y direction.

10. The bonding device according to claim 9, characterized in that Also includes: A translation mechanism connected to the support portion to adjust the planar position of the bonding head along the X direction and / or the Y direction; and / or A lifting mechanism is connected to the support part to adjust the height of the bonding head along the vertical Z direction.

11. A bonding method, characterized in that: The following steps are involved: Adsorb the parts to be bonded via the bonding head; During bonding of the member to be bonded, sensing coordinate information and / or angle information of at least three bonding positions on the first surface to be bonded; Determining the center of mass of the to-be-bonded component and the normal vector of the first surface according to the coordinate information and / or angle information of the at least three bonding positions; Determining an inclination angle of the first surface according to the centroid and the normal vector; as well as The first surface is leveled according to the tilt angle and bonded to a corresponding target position.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 11 is implemented.

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