Pickup head of to-be-bonded part, bonding method and storage medium

Abstract

The invention provides a pickup head of a to-be-bonded piece, a bonding method and a computer readable storage medium. The pick-up head of the to-be-bonded piece comprises a body and a detection module. The body comprises a suction nozzle and an extraction opening. And the extraction opening provides negative pressure for the to-be-bonded piece through the suction nozzle so as to adsorb the to-be-bonded piece. The detection module comprises a hard board structure and an angle sensor. A plurality of air holes are distributed in the hard board structure, and the hard board structure is installed between the suction nozzle and the extraction opening through a rotating structure so as to deflect according to the difference of acting force generated by airflow flowing through the air holes. And the angle sensor detects the deflection angle of the hard board structure so as to represent the parallelism between the suction nozzle and the to-be-bonded piece. The device can be used for supporting real-time leveling of the pick-up head in the process of picking up the to-be-bonded piece, so that the problem of parallelism change caused by multiple bonding is avoided, and the bonding precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of processing semiconductor devices, and in particular to a pickup head for a part to be bonded, a bonding method, and a computer-readable storage medium. Background Art

[0002] In the wafer and chip bonding process, the parallelism between the wafer or chip and the pickup device depends on the horizontal adjustment before bonding. However, in the prior art, it is impossible to measure the parallelism between the wafer or chip and the pickup device during the bonding process. Multiple bonding of the wafer and the chip may cause the parallelism between the wafer or chip and its pickup device to change, resulting in reduced bonding accuracy.

[0003] In order to overcome the above-mentioned defects of the prior art, the art urgently needs an improved pickup head for the parts to be bonded, which is used to support real-time leveling of the pickup head during the process of picking up the parts to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding and improving the bonding accuracy. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a picking head for a part to be bonded, a bonding method and a computer-readable storage medium, which can detect the parallelism between the suction nozzle and the part to be bonded by utilizing a hard plate structure with multiple air holes and an angle sensor, and is used to support real-time leveling of the picking head during the process of picking up the part to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding, so as to improve the bonding accuracy.

[0006] Specifically, the pickup head for the workpiece to be bonded provided according to the first aspect of the present invention includes a main body and a detection module. The main body includes a suction nozzle and an air suction port. The air suction port provides negative pressure to the workpiece to be bonded via the suction nozzle to adsorb the workpiece to be bonded. The detection module includes a hard plate structure and an angle sensor. A plurality of air holes are distributed on the hard plate structure, and the hard plate structure is installed between the suction nozzle and the air suction port via a rotating structure to deflect according to the difference in force generated by the air flow passing through each of the air holes. The angle sensor detects the deflection angle of the hard plate structure to characterize the parallelism between the suction nozzle and the workpiece to be bonded.

[0007] Furthermore, in some embodiments of the present invention, the rotating structure passes through the center of gravity of the hard plate structure. The plurality of air holes are arranged symmetrically with respect to the rotating structure.

[0008] Furthermore, in some embodiments of the present invention, the suction nozzle is provided with a plurality of suction ducts, each of which is aligned with one of the air holes, and the hard plate structure is spaced at a preset height from the suction nozzle.

[0009] Furthermore, in some embodiments of the present invention, the height interval is less than or equal to 1 mm.

[0010] Furthermore, in some embodiments of the present invention, the rotating structure is a spherical joint structure, which is located at the center of gravity of the hard plate structure and extends upward to connect to the corresponding position of the suction nozzle to support the deflection of the hard plate structure in any direction deviating from the vertical direction.

[0011] Furthermore, in some embodiments of the present invention, a filter structure is provided in the plurality of air holes to amplify the difference in force generated by the air flow passing through each of the air holes.

[0012] Furthermore, in some embodiments of the present invention, the pick-up head further includes a controller. The controller is configured to: determine the deflection angle of the hard board structure via the angle sensor when the pick-up head approaches the workpiece to be bonded; determine the distances from multiple first positions of the suction nozzle to the second positions corresponding to the workpiece to be bonded according to the deflection angle; and level the pick-up head and / or the workpiece to be bonded according to the distances from each first position to the second position corresponding to the workpiece to be bonded.

[0013] Further, in some embodiments of the present invention, the step of determining the distances from multiple first positions of the suction nozzle to the second position corresponding to the part to be bonded according to the deflection angle includes: determining the force applied to each of the air holes of the hard plate structure according to the deflection angle; determining the air flow velocity passing through each of the air holes according to the force applied to each of the air holes; and determining the distances from each of the first positions to the second position corresponding to the part to be bonded according to the air flow velocity passing through each of the air holes.

[0014] Further, in some embodiments of the present invention, the step of determining the force applied to each of the pores of the hard plate structure according to the deflection angle includes: determining the torque T on each of the pores of the hard plate structure according to the deflection angle:

[0015]

[0016] in, is the deflection angle. L is the length of the torsion member from the air hole to the rotating structure. GIp is the torsional stiffness; and according to the torque T on each of the air holes, the force on each of the air holes is determined respectively.

[0017] Further, in some embodiments of the present invention, the step of determining the air flow velocity flowing through each of the pores according to the force applied to each of the pores comprises: determining the air pressure difference on both sides of each of the pores according to the force applied to each of the pores; and determining the air flow velocity v flowing through each of the pores according to the air pressure difference on both sides of each of the pores:

[0018]

[0019] Wherein, P is the air pressure on the side of the air hole facing the suction nozzle. P0 is the air pressure on the side of the air hole facing the air suction port. ρ is the gas density.

[0020] Further, in some embodiments of the present invention, the step of determining the distance from each first position to the second position corresponding to the component to be bonded according to the air flow velocity flowing through each air hole includes: calculating the air path volume V between each air hole and the component to be bonded according to the air flow velocity flowing through each air hole:

[0021] V=v*t*S

[0022] Wherein, v is the air flow velocity, t is the suction time, S is the area of ​​the air hole, and according to the air path volume V between each of the air holes and the part to be bonded, the distance from each corresponding first position on the suction nozzle to its corresponding second position is determined respectively.

[0023] Furthermore, in some embodiments of the present invention, the object to be bonded is selected from a wafer or a chip with at least one circuit element.

[0024] In addition, the above-mentioned bonding method provided according to the second aspect of the present invention includes the following steps: controlling the pick-up head provided as the first aspect of the present invention to approach the workpiece to be bonded, and detecting the parallelism between the suction nozzle of the pick-up head and the workpiece to be bonded; leveling the pick-up head and / or the workpiece to be bonded according to the parallelism; and contacting and picking up the workpiece to be bonded via the leveled pick-up head, and transferring it to a bonding head to bond the workpiece to be bonded to the target position.

[0025] Furthermore, in some embodiments of the present invention, the step of detecting the parallelism between the suction nozzle of the pickup head and the workpiece to be bonded includes: detecting the deflection angle of the hard plate structure of the pickup head when the pickup head approaches the workpiece to be bonded; and determining the distances from multiple first positions of the suction nozzle to the second positions corresponding to the workpiece to be bonded based on the deflection angle.

[0026] In addition, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, implement the bonding method provided in the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0028] Figure 1 A schematic structural diagram of a pickup head for a workpiece to be bonded provided according to some embodiments of the present invention is shown.

[0029] Figure 2 A schematic structural diagram of a pickup head provided according to some embodiments of the present invention is shown.

[0030] Figure 3 A schematic structural diagram of a detection device provided according to some embodiments of the present invention is shown.

[0031] Figure 4 A schematic structural diagram of an angle sensor provided according to some embodiments of the present invention is shown.

[0032] Figure 5 A schematic structural diagram of an angle sensor provided according to some embodiments of the present invention is shown.

[0033] Figure 6 A schematic structural diagram of an angle sensor provided according to some embodiments of the present invention is shown.

[0034] Figure 7 A histogram of the resolution of various angle sensors provided according to some embodiments of the present invention is shown.

[0035] Figure 8 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0036] Fig. 9 A schematic diagram showing the deflection of a rigid plate structure provided according to some embodiments of the present invention is shown.

[0037] Fig.10 A force diagram of a hard plate structure provided according to some embodiments of the present invention is shown.

[0038] Fig.11 A schematic diagram showing the difference in air pressure on both sides of each air hole provided according to some embodiments of the present invention is shown.

[0039] Fig.12 A schematic diagram showing the air flow rate of each air hole provided according to some embodiments of the present invention is shown.

[0040] Fig.13 A schematic diagram showing the distance from each corresponding first position to its corresponding second position on a suction nozzle provided according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0041] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0044] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0045] As mentioned above, in the wafer and chip bonding process, the parallelism between the wafer or chip and the pickup device depends on the horizontal adjustment before bonding. However, in the prior art, it is impossible to measure the parallelism between the wafer or chip and the pickup device during the bonding process. Multiple bonding of the wafer and the chip may cause the parallelism between the wafer or chip and its pickup device to change, thereby reducing the bonding accuracy.

[0046] In order to overcome the above-mentioned defects of the prior art, the present invention provides a picking head for a part to be bonded, a bonding method and a computer-readable storage medium, which can detect the parallelism between the suction nozzle and the part to be bonded by utilizing a hard plate structure with multiple air holes and an angle sensor, and is used to support real-time leveling of the picking head during the process of picking up the part to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding, so as to improve the bonding accuracy.

[0047] Please refer to the reference for details Figure 1 and Figure 2 . Figure 1 A schematic structural diagram of a pickup head for a workpiece to be bonded provided according to some embodiments of the present invention is shown. Figure 2 A schematic structural diagram of a pickup head provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a detection device provided according to some embodiments of the present invention is shown. Figure 4 A schematic structural diagram of an angle sensor provided according to some embodiments of the present invention is shown.

[0048] exist Figure 1 to Figure 4 In the illustrated embodiment, the pick-up head 10 for the above-mentioned workpiece to be bonded provided by the first aspect of the present invention includes a main body and a detection module 13. Here, the main body includes a suction nozzle 11 and an air suction port 12. The air suction port 12 provides negative pressure to the workpiece to be bonded via the suction nozzle 11 to adsorb the workpiece to be bonded. The detection module 13 includes a hard plate structure 131 and an angle sensor 132. A plurality of air holes are distributed on the hard plate structure 131, and is installed between the suction nozzle 11 and the air suction port 12 via a rotating structure to deflect according to the difference in the force generated by the air flow passing through each air hole. The angle sensor 132 detects the deflection angle of the hard plate structure 131 to characterize the parallelism between the suction nozzle 11 and the workpiece to be bonded.

[0049] Further, in some preferred embodiments, the rotating structure passes through the center of gravity of the hard plate structure 131 to avoid measurement errors caused by gravity deflection. The plurality of air holes are symmetrically arranged relative to the rotating structure. Here, if the rotating structure is a rotating axis, the plurality of air holes are axially symmetrical relative to the rotating structure. If the rotating structure is a vertical line or a spherical joint structure, the plurality of air holes are centrally symmetrical relative to the rotating structure.

[0050] exist Figure 2 In the embodiment shown, a plurality of suction ducts are provided on the suction nozzle 11. Here, each suction duct is aligned with an air hole to avoid measurement errors caused by air extraction deviation. The hard plate structure 131 maintains a preset height interval with the suction nozzle 11 to avoid the porous suction nozzle 11 structure interfering with the normal deflection of the hard plate structure 131.

[0051] Furthermore, the above height interval is less than or equal to 1 mm.

[0052] In addition, in some optional embodiments, the above-mentioned rotating structure is a spherical joint structure, which is located at the center of gravity of the hard plate structure 131 and extends upward to connect to the corresponding position of the suction nozzle 11 to support the deflection of the hard plate structure 131 in any direction deviating from the vertical direction.

[0053] Alternatively, in some optional embodiments, the rotating structure is a vertical structure, which is located at the center of gravity of the hard plate structure 131 and extends upward to connect to the corresponding position of the suction nozzle 11 to support the deflection of the hard plate structure 131 in any direction deviating from the vertical direction.

[0054] Alternatively, in some optional embodiments, the above-mentioned rotating structure also supports the hard plate structure 131 to rotate around the center of gravity.

[0055] In addition, in some preferred embodiments, a filter structure is provided in the above-mentioned multiple air holes to expand the force difference generated by the air flow passing through each air hole, and can also be used to filter out external pollution.

[0056] Please refer to further Figure 5 to Figure 7 And Table 1. Figure 5 A schematic structural diagram of an angle sensor provided according to some embodiments of the present invention is shown. Figure 6 A schematic structural diagram of an angle sensor provided according to some embodiments of the present invention is shown. Figure 7 The following table shows the resolution bar graph of various angle sensors provided according to some embodiments of the present invention. Table 1 shows the resolution accuracy table of various angle sensors provided according to some embodiments of the present invention.

[0057] Table 1 Resolution accuracy of various angle sensors

[0058]

[0059] exist Figure 5 In the embodiment shown, the angle sensor 132 is an optical sensor, and the nozzle 11 is connected to the detection module 13. Figure 6 In the illustrated embodiment, the angle sensor 132 is a capacitive sensor (Capactive Sensor), which has a double-layer structure and forms a capacitive structure by applying a voltage.

[0060] In addition, if Figure 7 As shown in Table 1, the angle sensor 132 may also use sensors with different measurement principles or different types, such as a Hall Effect Sensor, an Eddy Current Sensor, a Magneto-resistive Sensor, and a Resisitive Sensor.

[0061] In addition, Figure 5 and Figure 6 In the illustrated embodiment, the pickup head for the above-mentioned workpiece to be bonded provided by the first aspect of the present invention also includes a cable, which connects the angle sensor 132, the hard board structure 131 and the suction nozzle 11, and is used to obtain the deflection angle signal detected by the angle sensor 132.

[0062] In some non-limiting embodiments, the pickup head of the above-mentioned bonding part provided in the first aspect of the present invention further includes a memory and a controller. Here, the memory includes but is not limited to the computer-readable storage medium provided in the third aspect, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the bonding method provided in the second aspect of the present invention.

[0063] The working principle of the above pick-up head will be described below in conjunction with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, and are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working methods of the pick-up head. Similarly, the pick-up head is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these bonding methods.

[0064] Please refer to the reference for details Figure 8 to Figure 13 . Figure 8 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown. Fig. 9A schematic diagram showing the deflection of a rigid plate structure provided according to some embodiments of the present invention is shown. Fig.10 A force diagram of a hard plate structure provided according to some embodiments of the present invention is shown. Fig.11 A schematic diagram showing the difference in air pressure on both sides of each air hole provided according to some embodiments of the present invention is shown. Fig.12 A schematic diagram showing the air flow rate of each air hole provided according to some embodiments of the present invention is shown. Fig.13 A schematic diagram showing the distance from each corresponding first position to its corresponding second position on a suction nozzle provided according to some embodiments of the present invention is shown.

[0065] like Figure 8 As shown, the controller may first control the pick-up head 10 provided in the first aspect of the present invention to approach the workpiece 14 to be bonded, and detect the parallelism between the suction nozzle 11 of the pick-up head 10 and the workpiece 14 to be bonded.

[0066] Specifically, if Fig. 9 As shown, when the pick-up head 10 approaches the bonding part 14, the controller can determine the deflection angle of the hard plate structure 131 of the pick-up head 10 via the angle sensor 132.

[0067] Afterwards, the controller can adjust the deflection angle The distances d from the plurality of first positions of the suction nozzle 11 to the second positions corresponding to the to-be-bonded component 14 are determined.

[0068] Specifically, if Fig.10 As shown, the controller can first Determine the torque T on each pore of the hard plate structure 131:

[0069]

[0070] in, is the deflection angle, L is the length of the torsion member from the air hole to the rotating structure, and GIp is the torsional stiffness.

[0071] Afterwards, the controller can determine the force F exerted on each pore according to the torque T on each pore.

[0072] After that, if Fig.11 and Fig.12 As shown, the controller can determine the pressure difference pp on both sides of each pore according to the force F applied to each pore. 0 , and according to the pressure difference on both sides of each pore, the air velocity v flowing through each pore is determined:

[0073]

[0074] Wherein, P is the air pressure on the side of the air hole facing the nozzle 11, P 0 is the air pressure on the side of the pore facing the air suction port 12, and ρ is the gas density.

[0075] After that, if Fig.13 As shown, the controller can calculate the air path volume V between each air hole and the to-be-bonded component 14 according to the air flow velocity v flowing through each air hole:

[0076] V=v*t*S

[0077] Among them, v is the air flow velocity, t is the inspiration time, and S is the area of ​​the pore.

[0078] Afterwards, the controller may determine the distance d from each corresponding first position on the suction nozzle 11 to its corresponding second position according to the air path volume V between each air hole and the workpiece 14 to be bonded.

[0079] Thereafter, the controller may level the pickup head 10 and / or the workpiece 14 to be bonded according to the parallelism between the suction nozzle 11 and the workpiece 14 to be bonded, or directly according to the distance d from multiple first positions of the suction nozzle 11 to the second positions corresponding to the workpiece 14 to be bonded.

[0080] Thereafter, the controller may contact and pick up the to-be-bonded component 14 via the leveled pickup head 10 , and transfer it to a bonding head so as to bond the to-be-bonded component 14 to a target position.

[0081] In summary, the picking head, bonding method and computer-readable storage medium for the above-mentioned parts to be bonded provided by the present invention can detect the parallelism between the suction nozzle and the parts to be bonded by utilizing a hard plate structure with multiple air holes and an angle sensor, and are used to support real-time leveling of the picking head during the process of picking up the parts to be bonded, thereby avoiding the problem of parallelism changes caused by multiple bonding, so as to improve the bonding accuracy.

[0082] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0083] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0084] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as resulting in a departure from the scope of the present invention.

[0085] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0086] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0087] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A pickup head for a part to be bonded, characterized in that: include: A main body, comprising a suction nozzle and an air suction port, wherein the air suction port provides negative pressure to the workpiece to be bonded via the suction nozzle to adsorb the workpiece to be bonded; and The detection module includes a hard board structure and an angle sensor, wherein the hard board structure is provided with a plurality of air holes and is installed between the suction nozzle and the air outlet via a rotating structure so as to deflect according to the difference in force generated by the air flow passing through each of the air holes. The angle sensor detects the deflection angle of the hard board structure to characterize the parallelism between the suction nozzle and the part to be bonded.

2. The pickup head according to claim 1, characterized in that The rotating structure passes through the center of gravity of the hard plate structure, and the plurality of air holes are symmetrically arranged relative to the rotating structure.

3. The pickup head according to claim 2, characterized in that The suction nozzle is provided with a plurality of suction ducts, wherein each of the suction ducts is aligned with one of the air holes respectively, and the hard plate structure maintains a preset height interval with the suction nozzle.

4. The pickup head according to claim 3, characterized in that The height interval is less than or equal to 1 mm.

5. The pickup head according to claim 3, characterized in that The rotating structure is a spherical joint structure, which is located at the center of gravity of the hard plate structure and extends upward to connect the corresponding position of the suction nozzle to support the deflection of the hard plate structure in any direction deviating from the vertical direction.

6. The pickup head according to claim 1, characterized in that The plurality of air holes are provided with a filter structure for enlarging the difference in force generated by the air flow passing through each of the air holes.

7. The pickup head according to claim 1, characterized in that The pickup head also includes a controller, which is configured to: When the pickup head approaches the part to be bonded, the angle sensor is used to determine the deflection angle of the hard board structure; Determining the distances from a plurality of first positions of the suction nozzle to a second position corresponding to the part to be bonded according to the deflection angle; as well as The pickup head and / or the part to be bonded are leveled according to the distance from each of the first positions to the second position corresponding to the part to be bonded.

8. The pickup head according to claim 7, characterized in that The step of determining the distances from the plurality of first positions of the suction nozzle to the second positions corresponding to the to-be-bonded component according to the deflection angle comprises: Determining the force acting on each of the pores of the hard plate structure according to the deflection angle; Determining the air flow velocity flowing through each of the air holes according to the force applied to each of the air holes; and The distances from each of the first positions to the second positions corresponding to the components to be bonded are determined respectively according to the air flow speeds flowing through the air holes.

9. The pickup head according to claim 8, characterized in that The step of determining the force acting on each of the air holes of the hard plate structure according to the deflection angle comprises: According to the deflection angle, the torque T on each of the air holes of the hard plate structure is determined: in, is the deflection angle, L is the length of the torsion member from the air hole to the rotating structure, and GIp is the torsional stiffness; and According to the torque T on each of the air holes, the force acting on each of the air holes is determined respectively.

10. The pickup head according to claim 8, characterized in that The step of determining the air flow velocity flowing through each of the air holes according to the force applied to each of the air holes comprises: Determining the air pressure difference on both sides of each of the air holes according to the force applied to each of the air holes; and According to the air pressure difference on both sides of each pore, the air flow velocity v flowing through each pore is determined respectively: Wherein, P is the air pressure on the side of the air hole facing the suction nozzle, P0 is the air pressure on the side of the air hole facing the suction port, and ρ is the gas density.

11. The pickup head according to claim 8, characterized in that The step of determining the distance from each first position to the second position corresponding to the to-be-bonded component according to the air flow velocity flowing through each air hole comprises: According to the air flow velocity flowing through each of the air holes, the air path volume V between each of the air holes and the to-be-bonded component is calculated respectively: V=v*t*S Wherein, v is the airflow velocity, t is the inhalation time, and S is the area of ​​the pore; and According to the volume V of the air path between each of the air holes and the workpiece to be bonded, the distance from each corresponding first position on the suction nozzle to its corresponding second position is determined respectively.

12. The pickup head according to claim 1, characterized in that The object to be bonded is selected from a wafer or a chip with at least one circuit element.

13. A bonding method, characterized in that: The following steps are involved: Controlling the pick-up head according to any one of claims 1 to 12 to approach the workpiece to be bonded, and detecting the parallelism between the suction nozzle of the pick-up head and the workpiece to be bonded; Leveling the pickup head and / or the part to be bonded according to the parallelism; as well as The pick-up head contacts and picks up the bonded part through a leveling method, and transfers it to a bonding head to bond the bonded part to a target position.

14. The bonding method according to claim 13, characterized in that: The step of detecting the parallelism between the nozzle of the pickup head and the part to be bonded comprises: When the pickup head approaches the part to be bonded, detecting the deflection angle of the hard plate structure of the pickup head; and According to the deflection angle, the distances from the plurality of first positions of the suction nozzle to the second positions corresponding to the part to be bonded are determined.

15. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 13 or 14 is implemented.

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