A wafer handling device

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and specifically discloses a wafer handling device, which includes a handling track. A device seat is arranged on the handling track. A circular seat is installed on the lower side of the device seat. A pneumatic suction cup is installed below the circular seat. A plurality of clamping blocks are arranged on the periphery of the circular seat. The lower side of the clamping block is rotatably connected to two left and right clamping strip blocks, and rubber contact heads are arranged on the lower sides of the outer ends of the clamping strip blocks. The wafer handling device of the present invention adopts a pneumatic suction cup, which enhances stability and flexibility. The pneumatic system can quickly adjust the adsorption force. The rubber contact head design avoids wafer damage. The tripod ensures stable placement and reduces the risk of falling off. The spring of the clamping block provides clamping force and has a buffering function. The rubber contact head at the outer end of the clamping strip block ensures safe contact. The outer gear ring and the spur gear achieve synchronous movement, enhancing the clamping accuracy. The sliding sleeve seat and the connecting rod design improve the overall coordination, ensuring the device moves smoothly, adapting to wafers of different sizes, and enhancing the protection function.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a wafer handling device. Background Art

[0002] Semiconductors are materials with electrical conductivity characteristics between those of conductors and insulators. They play a crucial role in modern electronic technologies and are widely used in various electronic devices such as computers, mobile phones, TVs, sensors, and more. During the handling of semiconductor wafers, there may be equipment failures and unexpected power outages, which can lead to the failure of pneumatic suction cups, causing the handling device to lose the adsorption effect on the wafer chips, resulting in the dropping of the wafers during the handling process. Moreover, the existing semiconductor wafer handling devices lack the ability to cope with external vibrations, and the wafers slide during the handling process, which easily causes damage to the wafers and affects the accurate placement of the wafer chips. Therefore, the present invention proposes a wafer handling device to solve the problems mentioned in the above background art. Summary of the Invention

[0003] The purpose of the present invention is to address the drawbacks existing in the prior art and propose a wafer handling device.

[0004] To achieve the above objective, the present invention adopts the following technical solutions:

[0005] A wafer handling device includes a handling track, on which a device seat is arranged. A circular seat is installed under the device seat, and a pneumatic suction cup is installed below the circular seat. A number of clamping blocks are arranged on the periphery of the circular seat. The lower side of the clamping block is rotatably connected to two left and right clamping strip blocks, and a rubber contact head is arranged on the lower side of the outer end of the clamping strip block. The rear side of the clamping block is rotatably connected to a toothed roller, and a torsion spring is arranged at the connection of the toothed roller. An end face tooth ring is arranged above a number of the toothed rollers, and the end face tooth ring is rotatably connected to the circular seat. The pneumatic suction cup is responsible for adsorbing and handling the wafers, and the rubber contact head can protect the surface of the wafers. The combination of the toothed roller and the torsion spring provides an effective rotation mechanism;

[0006] A number of support rods are evenly arranged on the upper side of the circular seat. The support rods are rotatably connected to the upper side of the circular seat. The upper ends of a number of the support rods are provided with a balance ring. The upper ends of the support rods are rotatably connected to a slider, and the slider slides inside and outside the lower side of the balance ring. A tripod is arranged on the upper side of the balance ring, and the tripod is located below the handling track. The design of the support rods and the balance ring enhances the stability of the entire device. The tripod is located below the handling track and may play a role in further supporting and stabilizing the wafers.

[0007] Preferably, an external gear ring rotatably connected to the circular base is provided on the upper side of several of the clamping blocks. A spur gear meshing with the external gear ring is provided on the outside of the external gear ring. The spur gear is rotatably connected to the circular base. A tooth groove meshing with the spur gear is provided on one side of the clamping block. A driving device fixedly connected to the external gear ring is installed inside the circular base. The combination of the external gear ring and the spur gear can achieve more efficient transmission, ensuring that the clamping blocks can move in a synchronous manner.

[0008] Preferably, a plurality of sliding grooves corresponding to the clamping blocks are uniformly formed inside the circular base. A first spring is arranged in the sliding groove. One end of the first spring is fixedly connected to the clamping block. The arrangement of the sliding groove and the spring ensures that the clamping block can move freely within a certain range. At the same time, the clamping force is provided by the spring to ensure the safety of the wafer.

[0009] Preferably, an external tooth surface is provided on the outside of the connection transfer part of the clamping bar block. An end face gear rotatably connected to the clamping block is provided on the outside of the external tooth surface. The end face gear meshes with both the upper and lower external tooth surfaces on the front side. The end face gear is fixedly connected to the corresponding tooth roller on the rear side.

[0010] Preferably, the tooth roller meshes with the upper end face gear ring. A sliding bar block is rotatably connected to the rear end of the tooth roller. The sliding bar block slides inside and outside the circular base.

[0011] Preferably, a first spur gear rotatably connected to the circular base is provided on the upper side of several of the supporting rods. A second spur gear is fixed to one side of the connection transfer part of the supporting rod. The first spur gear meshes with the second spur gear on the lower side. A driving device fixedly connected to several first spur gears is installed on the circular base.

[0012] Preferably, a plurality of inclined blocks are fixed to the upper side of the end face gear ring. A lever is fixed to one end of the first spur gear. The lever corresponds to the inclined surfaces of several inclined blocks. The cooperation between the lever and the inclined blocks can achieve precise clamping and releasing actions.

[0013] Preferably, a plurality of arc-shaped rods penetrating the supporting rods are fixed to the upper side of the circular base. A second spring is sleeved on the circumference of the arc-shaped rod and is located between the supporting rod and the circular base. The upper and lower ends of the second spring are fixedly connected to the circular base and the supporting rod respectively. The arc-shaped rod can improve the stability of the whole device and play a certain buffering role during the handling process.

[0014] Preferably, the tripod is composed of several strip blocks. The ends of several strip blocks are rotatably connected to each other. A torsion spring is arranged at the connection transfer part of the strip block ends. A plurality of sliding sleeve seats sliding on the handling track are arranged on both sides of the device base. A connecting rod is rotatably connected to the left and right sides of the lower side of each sliding sleeve seat. The lower end of the connecting rod is rotatably connected to a sliding shaft sliding inside the strip block of the tripod. Torsion springs are arranged at the connection transfer parts of the connecting rod with the sliding sleeve seat and the sliding shaft. The arrangement of the sliding sleeve seat and the connecting rod enhances the overall movement coordination, enabling the whole device to move smoothly on the track.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. The present invention uses a pneumatic suction cup as the main adsorption element to ensure the stability and flexibility of the wafer during handling. The pneumatic system can quickly adjust the adsorption force to adapt to different handling conditions. The rubber contact design under the clamping block can effectively disperse the contact pressure, avoiding scratching or damaging the surface of the wafer, thereby improving the dynamic stability. At the same time, the combination of the toothed roller and the torsion spring forms an effective rotation mechanism, enabling the clamping block to remain stable during dynamic handling, reducing vibration. In addition, the design of the support rod and the balance ring provides additional support, and the slider slides to adapt to the change of the wafer's center of gravity, enhancing the balance of the overall device;

[0017] 2. The tripod design of the present invention provides additional support for the wafer, ensuring that it does not tilt or slide during placement, reducing the risk of accidental detachment. At the same time, the spring I inside the clamping block provides a clamping force, ensuring that the clamping block has a certain elasticity when clamping the wafer to adapt to the slight movement of the wafer. In addition, the arc rod and the spring II provided on the circular seat have a buffering function, which can reduce the impact when placing the wafer and ensure the stability of the wafer;

[0018] 3. The rubber contact design at the outer end of the clamping bar block of the present invention ensures safe contact with the edge of the wafer during clamping, reducing the risk of accidental detachment of the wafer chip. The combination of the external toothed ring and the spur gear realizes the synchronous movement of the clamping block, ensuring the accuracy of the clamping and releasing operations, further guaranteeing the safety of the wafer during handling and placement. The sliding sleeve seat and the connecting rod design on both sides of the device seat enhance the overall movement coordination, enabling the entire device to move smoothly on the track, effectively preventing the instability of the wafer caused by uneven force distribution. The free movement design of the clamping block and the efficient transmission mechanism of the toothed roller ensure that the clamping block can adapt to wafers of different sizes, enhancing the protection function during handling and placement.

[0019] In summary, this wafer handling device uses a pneumatic suction cup to improve the stability and flexibility during handling. The pneumatic system quickly adjusts the adsorption force. The rubber contact design effectively disperses the contact pressure, avoiding damage to the wafer surface and enhancing the dynamic stability. The tripod design ensures no tilting during placement, reducing the risk of accidental detachment. At the same time, the spring inside the clamping block provides the necessary clamping force, and the buffering function further guarantees the stability of the wafer. The rubber contact at the outer end of the clamping bar block ensures safe contact, reducing the risk of chip detachment. The combination of the external toothed ring and the spur gear realizes the synchronous movement of the clamping block, ensuring accurate clamping and releasing. The sliding sleeve seat and the connecting rod design enhance the overall movement coordination, ensuring smooth movement of the device, adapting to wafers of different sizes, and enhancing the protection function during handling and placement. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic structural diagram of a wafer handling device proposed by the present invention Figure 1 ;

[0021] Figure 2 Structural schematic of a wafer handling device proposed by the present invention Figure 2 ;

[0022] Figure 3 Connection structure schematic of the device base in a wafer handling device proposed by the present invention Figure 1 ;

[0023] Figure 4 Bottom surface structure schematic diagram of the device base in a wafer handling device proposed by the present invention;

[0024] Figure 5 Side surface structure schematic diagram of the device base in a wafer handling device proposed by the present invention;

[0025] Figure 6 Connection structure schematic of the device base in a wafer handling device proposed by the present invention Figure 2 ;

[0026] Figure 7 Connection structure schematic diagram of the clamping block in a wafer handling device proposed by the present invention;

[0027] Figure 8 Structural schematic diagram of the end face gear ring in a wafer handling device proposed by the present invention.

[0028] In the figure: 1, handling track; 101, sliding sleeve seat; 102, connecting rod; 2, device base; 3, circular base; 4, pneumatic suction cup; 5, balance ring; 6, tripod; 7, end face gear ring; 8, slide bar block; 9, gear roller; 10, clamping block; 11, clamping bar block; 12, external tooth surface; 13, end face gear; 14, inclined block; 15, support rod; 16, first spur gear; 17, arc rod; 18, first spring; 19, second spring; 20, rubber contact; 21, external tooth ring; 22, slider; 23, second spur gear; 24, lever; 25, spur gear. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0030] Refer to Figure 1-8, A wafer handling device, including a handling track 1, on which a device seat 2 is arranged. Under the device seat 2, a circular seat 3 is installed. Below the circular seat 3, a pneumatic suction cup 4 is installed. Around the circular seat 3, several clamping blocks 10 are arranged. Under the clamping blocks 10, two left and right clamping strip blocks 11 are rotatably connected. At the lower side of the outer end of the clamping strip block 11, there is a rubber contact head 20. After the wafer chip is preliminarily adsorbed and fixed by the pneumatic suction cup 4, by expanding the clamping blocks 10 on both sides, the rubber contact head 20 at the outer end of the clamping strip block 11 is close to the side of the wafer, playing a role in assisting in fixing the wafer chip and avoiding the wafer falling off caused by accidental power-off or equipment failure during the process of handling the wafer;

[0031] Furthermore, referring to Figure 3 , 6 , On the upper side of several clamping blocks 10, an external gear ring 21 rotatably connected to the circular seat 3 is arranged. Outside the external gear ring 21, a spur gear 25 meshing with it is arranged. The spur gear 25 is rotatably connected to the circular seat 3, and on one side of the clamping block 10, there is a tooth groove meshing with the spur gear 25. And inside the circular seat 3, a driving device fixedly connected to the external gear ring 21 is installed. The clamping range of the rubber contact head 20 can be adjusted according to the size of the wafer chip being handled, which can be achieved by adjusting the inner and outer positions of the clamping blocks 10. The specific implementation method is to start the driving device inside the circular seat 3. The driving device drives the connected external gear ring 21 to rotate. The external gear ring 21 drives the spur gear 25 meshing outside it to rotate. The spur gear 25 makes the clamping block 10 move outward or inward through the meshing tooth groove. Inside the circular seat 3, several sliding grooves corresponding to the clamping blocks 10 are evenly opened. Inside the sliding grooves, a first spring 18 is arranged. One end of the first spring 18 is fixedly connected to the clamping block 10. Due to the continuous elastic pulling force of the first spring 18, the clamping block 10 always maintains a tendency towards the inner center. At the rear side of the clamping block 10, a toothed roller 9 is rotatably connected. At the connection of the toothed roller 9, a torsion spring is arranged. On the upper side of several toothed rollers 9, an end face gear ring 7 is arranged. The end face gear ring 7 is rotatably connected to the circular seat 3. The toothed roller 9 meshes with the upper side end face gear ring 7. And at the rear end of the toothed roller 9, a sliding strip block 8 is rotatably connected. The sliding strip block 8 slides inside and outside the circular seat 3. The toothed roller 9 and the upper side end face gear ring 7 always maintain a meshing state. The sliding strip block 8 connected to the toothed roller 9 slides inside and outside the circular seat 3;

[0032] Even further, referring to Figure 3, a number of struts 15 are evenly arranged on the upper side of the round seat 3, the struts 15 are rotatably connected to the upper side of the round seat 3, a balance ring 5 is arranged on the upper ends of the struts 15, a slider 22 is rotatably connected to the upper ends of the struts 15, and the slider 22 slides inside and outside on the lower side of the balance ring 5, and a spur gear 16 rotatably connected to the round seat 3 is arranged on the upper sides of the struts 15, a number of inclined blocks 14 are fixed on the upper side of the end face gear ring 7, a lever 24 is fixed at one end of the spur gear 16, and the lever 24 corresponds to the inclined surfaces of the several inclined blocks 14, and a driving device fixedly connected to the several spur gears 16 is installed on the round seat 3, and the spur gear 16 connected to the round seat 3 is driven to rotate, and the spur gear 16 drives the lever 24 connected to one side to rotate, and the lever 24 squeezes the corresponding inclined block 14 through the inclined surface, so that the end face gear ring 7 on the round seat 3 is squeezed and deviated to rotate, and the rotating end face gear ring 7 drives the gear roller 9 meshing on the lower side to rotate;

[0033] Furthermore, referring to Figure 6 , an outer tooth surface 12 is arranged on the outer side of the clamping strip block 11 at the transition point, and an end face gear 13 connected to the clamping block 10 is arranged on the outer side of the outer tooth surface 12, and the end face gear 13 is meshed with the upper and lower outer tooth surfaces 12 on the front side, and the end face gear 13 is fixedly connected to the corresponding gear roller 9 on the rear side, and the above-mentioned driven gear roller 9 drives the end face gear 13 connected to the front end to rotate, and the end face gear 13 rotates toward the two centers through the meshing outer tooth surface 12, and the rubber contact 20 releases the contact with the edge of the wafer chip. Due to the action of the torsion spring at the transition point of the gear roller 9, the two clamping strip blocks 11 are in an unfolded state, that is, the rubber contact 20 at the outer end of the clamping strip block 11 always keeps close to the edge of the wafer chip;

[0034] Furthermore, referring to Figure 5 , a spur gear 23 is fixed on one side of the connecting part of the support rod 15, and the spur gear 16 is meshed with the spur gear 23 on the lower side, and a plurality of arc rods 17 penetrating the support rod 15 are fixed on the upper side of the round seat 3, and a spring 29 is sleeved on the circumference of the arc rod 17 and located between the support rod 15 and the round seat 3, and the upper and lower ends of the spring 29 are respectively fixedly connected to the round seat 3 and the support rod 15. When the above-mentioned spur gear 16 rotates, the spur gear 16 drives the spur gear 23 meshed on the lower side, and the spur gear 23 drives the connected support rod 15 to rotate, and the support rod 15 deflects toward the above, thereby supporting the upper balance ring 5, and the tripod 6 on the balance ring 5 contacts the lower side of the upper transport track 1, so that the wafer transport device is in close contact with the transport track 1 at this time. At this time, because the above-mentioned rubber contact 20 releases the contact with the edge of the wafer, the wafer transport structure is stable at this time, and the pneumatic suction cup 4 is closed to achieve stable placement of the wafer after transport;

[0035] Furthermore, referring to Figure 1-3, a tripod 6 is provided on the upper side of the balance ring 5. The tripod 6 is located under the handling track 1. The tripod 6 is composed of several strips. The ends of the several strips are rotatably connected to each other, and a torsion spring is provided at the transfer joint of the strip ends. A number of sliding sleeve seats 101 that slide on the handling track 1 are provided on both sides of the device seat 2. Link rods 102 are rotatably connected to the left and right of the lower side of the sliding sleeve seat 101. The lower end of the link rod 102 is connected to a sliding shaft that slides inside the strip of the tripod 6, and torsion springs are provided at the transfer joints of the link rod 102 with the sliding sleeve seat 101 and the sliding shaft. During the rotation process of the above-mentioned support rod 15, the balance ring 5 is squeezed and moved upward. At this time, the sliding sleeve seat 101 and the link rod 102 structure between the balance ring 5 and the handling track 1 are also squeezed and stabilized, maintaining a tight fit between the handling structure and the semi-circular track, ensuring the stability of the placed wafer during handling. When handling the wafer chip, the pneumatic suction cup 4 always maintains the adsorption of the wafer chip below. At the same time, a number of rubber contacts 20 on the periphery are in close contact with the edge of the wafer chip. The upper balance ring 5, the lower support rod 15 structure, and the upper tripod 6 structure ensure the dynamic stability during the wafer handling process.

[0036] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wafer handling device, comprising a handling track (1), characterized in that, A device seat (2) is provided on the handling track (1). A round seat (3) is installed on the lower side of the device seat (2). A pneumatic suction cup (4) is installed below the round seat (3). A number of clamping blocks (10) are arranged on the circumferential side of the round seat (3). The lower sides of the clamping blocks (10) are rotatably connected to two left and right clamping bar blocks (11). Rubber contact heads (20) are arranged on the lower sides of the outer ends of the clamping bar blocks (11). A toothed roller (9) is rotatably connected to the rear side of the clamping block (10). An end face tooth ring (7) is arranged on the upper sides of a number of the toothed rollers (9). The end face tooth ring (7) is rotatably connected to the round seat (3). A number of support rods (15) are evenly arranged on the upper side of the round seat (3). The support rods (15) are rotatably connected to the upper side of the round seat (3). The upper ends of a number of the support rods (15) are provided with a balance ring (5). The upper ends of the support rods (15) are rotatably connected to a slider (22), and the slider (22) slides in and out on the lower side of the balance ring (5). A tripod (6) is arranged on the upper side of the balance ring (5). The tripod (6) is located below the handling track (1). A number of the clamping blocks (10) are provided with an outer tooth ring (21) rotatably connected to the round seat (3) on the upper side. A straight gear (25) meshing with the outer tooth ring (21) is arranged on the outside of the outer tooth ring (21). The straight gear (25) is rotatably connected to the round seat (3), and a tooth groove meshing with the straight gear (25) is arranged on one side of the clamping block (10).

2. The wafer handling device according to claim 1, wherein A number of sliding grooves corresponding to the clamping blocks (10) are evenly opened inside the round seat (3). A first spring (18) is arranged in the sliding groove. The outer end of the first spring (18) is fixedly connected to the clamping block (10).

3. The wafer handling device according to claim 1, wherein, An outer tooth surface (12) is arranged on the outside of the connection transfer part of the clamping bar block (11). An end face gear (13) transferred to the clamping block (10) is arranged on the outside of the outer tooth surface (12). The end face gear (13) meshes with the upper and lower outer tooth surfaces (12) on the front side, and the end face gear (13) is fixedly connected to the corresponding toothed roller (9) on the rear side.

4. The wafer handling device according to claim 1, wherein, The toothed roller (9) meshes with the upper end face tooth ring (7), and a sliding bar block (8) is rotatably connected to the rear end of the toothed roller (9). The sliding bar block (8) slides in and out inside the round seat (3).

5. The wafer handling device according to claim 1, wherein, A number of the support rods (15) are provided with a first spur gear (16) rotatably connected to the round seat (3) on the upper side. A second spur gear (23) is fixed to one side of the connection transfer part of the support rod (15), and the first spur gear (16) meshes with the second spur gear (23) on the lower side.

6. The wafer handling device according to claim 5, characterized in that, A number of inclined blocks (14) are fixed to the upper side of the end face tooth ring (7). A shift lever (24) is fixed to one end of the first spur gear (16). The shift lever (24) corresponds to the inclined surfaces of a number of the inclined blocks (14).

7. The wafer handling device according to claim 1, wherein A number of arc rods (17) penetrating the support rods (15) are fixed to the upper side of the round seat (3). A second spring (19) is sleeved on the circumferential side of the arc rod (17) and is located between the support rod (15) and the round seat (3). The upper and lower ends of the second spring (19) are respectively fixedly connected to the round seat (3) and the support rod (15).

8. The wafer handling device according to claim 1, characterized in that, The tripod (6) is composed of several strips. The ends of the several strips are rotatably connected to each other, and a torsion spring is arranged at the transfer joint of the strip ends. A plurality of sliding sleeve seats (101) sliding on the handling track (1) are arranged on both sides of the device seat (2). Link rods (102) are rotatably connected to the left and right sides of the lower side of the sliding sleeve seat (101). The lower ends of the link rods (102) are connected to a sliding shaft sliding inside the strip of the tripod (6), and torsion springs are arranged at the transfer joints of the link rods (102) with the sliding sleeve seats (101) and the sliding shaft.

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