Sensor packaging structure and sensing module thereof

Abstract

The invention discloses a sensor packaging structure and a sensing module thereof. The sensor package structure includes a substrate, a sensing chip disposed and electrically coupled to the substrate, an annular support layer disposed on the sensing chip, and a light transmitting layer disposed on the annular support layer. The annular supporting layer comprises an inner annular surface and an outer annular surface which are located on opposite sides, and at least one of the inner annular surface and the outer annular surface is provided with a plurality of round end microstructures which are connected in sequence and surround a sensing area of the sensing chip. The tail end of each round-end microstructure is a round corner part with the radius smaller than 1 micrometer. And the light-transmitting layer, the inner ring surface of the annular supporting layer and the sensing chip jointly surround to form a closed space. Therefore, each round end microstructure can reduce the stress concentration of the annular support layer through the round corner part with a specific condition.

Description

Technical Field

[0001] The present application relates to a packaging structure, and more particularly to a sensor packaging structure and a sensing module thereof. Background Art

[0002] The existing sensor packaging structure includes a glass, a sensor chip, and a glue layer sandwiched between the glass and the sensor chip. In order to reduce the possibility of glare from the sensor chip, the glue layer of the existing sensor packaging structure is formed with a plurality of sharp tooth-shaped microstructures to disperse light. However, the glue layer is prone to stress concentration at the ends of the plurality of sharp tooth-shaped microstructures, thereby affecting the overall structural strength.

[0003] Therefore, the applicant believes that the above defects can be improved, and has devoted himself to research and applied scientific principles, and finally proposed the present application which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The present application provides a sensor packaging structure and a sensing module thereof, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] The present application discloses a sensor packaging structure, which includes: a substrate; a sensing chip, which is disposed on the substrate and electrically coupled to the substrate; wherein a top surface of the sensing chip contains a sensing area and a bearing area surrounding the sensing area; an annular support layer, which is disposed on the bearing area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer includes a plurality of side strips arranged in an annular shape, and each side strip has a side length, and includes an adjustment section and two layout sections respectively connected to opposite ends of the adjustment section; wherein the annular support layer includes: An inner annular surface, which faces the sensing area; and an outer annular surface, which is arranged away from the sensing area; wherein at least one of the inner annular surface and the outer annular surface is formed with a plurality of sawtooth microstructures, which are sequentially connected and surround the sensing area; the plurality of sawtooth microstructures include a plurality of round-end microstructures, which are located at two layout sections of at least one edge strip, and the end of each round-end microstructure is a fillet portion with a radius greater than 1 micron; and a light-transmitting layer, which is arranged on the annular support layer, so that the light-transmitting layer, the inner annular surface of the annular support layer and the top surface of the sensing chip together surround a closed space.

[0006] Optionally, a plurality of round-end microstructures are located in two layout segments of each edge strip.

[0007] Optionally, the plurality of sawtooth microstructures include a plurality of tip microstructures, which are located in the adjustment section of each edge strip, and the end of each tip microstructure is in a sharp angle shape with an angle not greater than 40 degrees.

[0008] Optionally, in any edge strip, the terminal edges of the plurality of round-end microstructures fall on a first tangent line, the terminal edges of the plurality of pointed microstructures fall on a second tangent line, and the first tangent line and the second tangent line are spaced apart and parallel to each other.

[0009] Optionally, the plurality of side strips are arranged in a rectangular ring shape and include two first side strips facing each other and two second side strips facing each other; wherein the plurality of round-end microstructures are only located in two layout segments of each first side strip.

[0010] Optionally, the plurality of sawtooth microstructures include a plurality of tip microstructures, which are located at the adjustment section of each first side strip and each second side strip, and the end of each tip microstructure is a sharp angle of no more than 40 degrees.

[0011] Optionally, the plurality of side strips are arranged in a rectangular ring shape and include two first side strips facing each other and two second side strips facing each other; wherein the plurality of round-end microstructures are only located in the adjustment section and two layout sections of each first side strip.

[0012] Optionally, the plurality of sawtooth microstructures include a plurality of tip microstructures, which are located in the adjustment section and the two layout sections of each second side strip, and the end of each tip microstructure is in a sharp angle shape with an angle not greater than 40 degrees.

[0013] Optionally, any two side strips connected to each other jointly define a corner, and a plurality of sawtooth-shaped microstructures are provided with a round-end microstructure at each corner.

[0014] Optionally, each edge strip includes an elongated base, and each round-end microstructure has a light-guiding portion connecting the elongated base and the rounded corner portion; wherein, in each round-end microstructure, the light-guiding portion tapers from the elongated base toward the rounded corner portion.

[0015] Optionally, the sensor packaging structure includes: a plurality of metal wires electrically coupling the substrate and the sensing chip; and a packaging body formed on the substrate; wherein the sensing chip, the annular support layer and the light-transmitting layer are within the packaging body, and the outer surface of the light-transmitting layer away from the substrate is at least partially exposed outside the packaging body.

[0016] The present application also discloses a sensor module of a sensor packaging structure, which includes: a sensor chip, whose top surface contains a sensing area and a carrying area surrounding the sensing area; an annular support layer, which is arranged on the carrying area of ​​the sensor chip and surrounds the sensing area; wherein the annular support layer includes a plurality of side strips arranged in a ring shape, and any two side strips connected to each other jointly define a corner; wherein the annular support layer includes: an inner annular surface, which faces the sensing area; and an outer annular surface, which is arranged away from the sensing area; wherein at least one of the inner annular surface and the outer annular surface is formed with a plurality of sawtooth microstructures, and the plurality of sawtooth microstructures are configured with a round end microstructure at each corner, and the end of the plurality of sawtooth microstructures is a rounded corner portion with a radius greater than 1 micron; and a light-transmitting layer, which is arranged on the annular support layer, so that the light-transmitting layer, the inner annular surface of the annular support layer and the top surface of the sensing chip jointly surround a closed space.

[0017] Optionally, the plurality of sawtooth microstructures are formed with a plurality of pointed microstructures arranged in a row on each edge strip, and each row of pointed microstructures is located between two round-end microstructures respectively arranged at two corners.

[0018] Optionally, the rounded end microstructures located at each corner are located on the inner annular surface.

[0019] Optionally, the outer annular surface forms an arc angle at each corner; in each corner, the radius of the arc angle is greater than the radius of the rounded corner portion of the round-end microstructure.

[0020] The present application further discloses a sensing module of a sensor packaging structure, which includes: a sensing chip, whose top surface contains a sensing area and a carrying area surrounding the sensing area; an annular support layer, which is arranged on the carrying area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer includes: an inner annular surface, which faces the sensing area; and an outer annular surface, which is arranged away from the sensing area; wherein at least one of the inner annular surface and the outer annular surface is formed with a plurality of round-end microstructures, which are connected in sequence and surround the sensing area; wherein the end of each round-end microstructure is a fillet portion with a radius less than 1 micron; and a light-transmitting layer, which is arranged on the annular support layer, so that the light-transmitting layer, the inner annular surface of the annular support layer and the top surface of the sensing chip together surround a closed space.

[0021] Optionally, a plurality of round-end microstructures are formed only on the inner annular surface, and two ends of each round-end microstructure are respectively connected to the sensing chip and the light-transmitting layer.

[0022] Optionally, a plurality of round-end microstructures are formed only on the outer annular surface, and two ends of each round-end microstructure are respectively connected to the sensing chip and the light-transmitting layer.

[0023] Optionally, multiple round-end microstructures are formed on the inner annular surface and the outer annular surface, and the two ends of each round-end microstructure are respectively connected to the sensing chip and the light-transmitting layer; wherein the appearance of any round-end microstructure formed on the inner annular surface is different from the appearance of any round-end microstructure formed on the outer annular surface.

[0024] Optionally, the annular support layer includes an annular base, and each round-end microstructure has a light-guiding portion connecting the annular base and the rounded corner portion; wherein, in each round-end microstructure, the light-guiding portion tapers from the annular base toward the rounded corner portion.

[0025] In summary, the sensor packaging structure and the sensing module thereof disclosed in the embodiment of the present application are formed with a plurality of the rounded end microstructures, so that each of the rounded end microstructures can reduce the stress concentration of the annular support layer by the rounded corners with specific conditions (e.g., radius less than 1 micron). Furthermore, the plurality of the rounded end microstructures of the annular support layer can be used to guide the light irradiated thereon through the rounded corners and scatter in the closed space, thereby effectively reducing the glare phenomenon generated in the sensor packaging structure.

[0026] Furthermore, the sensor packaging structure and the sensing module thereof disclosed in the embodiments of the present application can also form a plurality of the round-end microstructures at specific positions (such as: the layout segment or the corner of any one of the edge strips) so that each of the round-end microstructures can reduce the stress concentration in the annular support layer with the rounded corner portion having specific conditions, and effectively alleviate the glare phenomenon generated by the sensor packaging structure.

[0027] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, such description and drawings are only used to illustrate the present application and are not intended to limit the scope of protection of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional schematic diagram of the sensor packaging structure of the first embodiment of the present application.

[0029] Figure 2 for Figure 1 A partial three-dimensional cross-sectional schematic diagram of .

[0030] Figure 3 for Figure 1 Schematic cross-sectional view along section line III-III.

[0031] Figure 4 for Figure 1 Schematic top view of .

[0032] Figure 5 for Figure 4An enlarged schematic diagram of region V.

[0033] Figure 6 for Figure 5 Another schematic diagram.

[0034] Figure 7 for Figure 5 Another schematic diagram.

[0035] Figure 8 FIG. 1 is a schematic top view of a sensor packaging structure according to a second embodiment of the present application.

[0036] Fig. 9 for Figure 8 A top view of another embodiment.

[0037] Fig.10 for Figure 8 Another schematic top view of the embodiment.

[0038] Fig.11 Schematic diagram of a top view of a sensor packaging structure according to the third embodiment of the present application.

[0039] Fig.12 for Fig.11 A top view of another embodiment.

[0040] Fig.13 for Fig.11 Another schematic top view of the embodiment.

[0041] Fig.14 for Fig.11 Another schematic top view of the embodiment.

[0042] Fig.15 Schematic diagram of a top view of a sensor packaging structure according to a fourth embodiment of the present application. DETAILED DESCRIPTION

[0043] The following is an explanation of the implementation methods of the "sensor packaging structure" disclosed in this application through specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the contents disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. In addition, the drawings of this application are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of this application in detail, but the disclosed contents are not intended to limit the scope of protection of this application.

[0044] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0045] Example 1 Please refer to Figures 1 to 7 As shown, it is the first embodiment of the present application. Figure 1 and Figure 2 As shown, this embodiment discloses a sensor packaging structure 100; that is, any structure inside is not a packaged sensor, and its structural design basis is different from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

[0046] like Figures 1 to 4 As shown, the sensor package structure 100 includes a substrate 1, a sensor chip 2 disposed on the substrate 1, a plurality of metal wires 3 electrically coupling the sensor chip 2 and the substrate 1, an annular support layer 4 disposed on the sensor chip 2, a light-transmitting layer 5 disposed on the annular support layer 4, and a package body 6 formed on the substrate 1. It should be noted that the annular support layer 4 is sandwiched between the sensor chip 2 and the light-transmitting layer 5 in this embodiment, and they can be collectively referred to as a sensor module 10.

[0047] Among them, although the sensor package structure 100 is described in this embodiment as including the above-mentioned components, the sensor package structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present application, the sensor package structure 100 can omit the package body 6 and the plurality of metal wires 3, and the sensing chip 2 is fixed and electrically coupled to the substrate 1 by flip chip or die bonding; or, the sensing module 10 can be used alone (such as: sold) or used in combination with other components. The following will respectively explain the structure and connection relationship of each component of the sensor package structure 100 in this embodiment.

[0048] The substrate 1 is square or rectangular in this embodiment, but the present application is not limited thereto. The substrate 1 is provided with a chip fixing area 111 approximately in the center of its upper surface 11, and the substrate 1 is formed with a plurality of bonding pads 112 located outside the chip fixing area 111 on the upper surface 11. The plurality of bonding pads 112 are roughly arranged in a ring shape in this embodiment, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing area 111.

[0049] In addition, the substrate 1 may also be provided with a plurality of solder balls 7 on its lower surface 12, and the sensor packaging structure 100 can be soldered and fixed on an electronic component (not shown in the figure) through the plurality of solder balls 7, so that the sensor packaging structure 100 can be electrically connected to the electronic component through the plurality of solder balls 7.

[0050] The sensing chip 2 is square (e.g., rectangular or square) in this embodiment and is described as an image sensing chip, but is not limited thereto. The sensing chip 2 (the bottom surface 22) is fixed to the chip fixing area 111 of the substrate 1 (along a preset direction D and through a die-bonding adhesive); that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 (in a ring shape) surrounding the sensing area 211, and the two ends of each of the metal wires 3 are respectively connected to the substrate 1 and the supporting area 212 of the sensing chip 2, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other.

[0051] In more detail, the sensing chip 2 includes a plurality of connection pads 213 located in the carrying area 212 (that is, the plurality of connection pads 213 are located outside the sensing area 211). The number and position of the plurality of connection pads 213 of the sensing chip 2 in this embodiment respectively correspond to the number and position of the plurality of bonding pads 112 of the substrate 1; that is, the plurality of connection pads 213 in this embodiment are also arranged roughly in a ring shape. Furthermore, the two ends of each of the metal wires 3 are respectively connected to one of the bonding pads 112 and the corresponding connection pad 213.

[0052] The annular support layer 4 is disposed on the supporting area 212 of the sensing chip 2 and surrounds the outside of the sensing area 211. In this embodiment, the annular support layer 4 is located inside the plurality of metal wires 3 and does not contact any of the metal wires 3 (that is, each of the metal wires 3 is located outside the annular support layer 4 and is completely buried in the package 6), but the present application is not limited thereto. For example, each of the metal wires 3 may be partially buried in the annular support layer 4, while the rest of each of the metal wires 3 is buried in the package 6.

[0053] The light-transmitting layer 5 is illustrated as a flat glass in this embodiment, but the present application is not limited thereto. The light-transmitting layer 5 has an outer surface 51 and an inner surface 52 located on opposite sides, and the light-transmitting layer 5 (with the inner surface 52) is disposed on the annular support layer 4, so that the light-transmitting layer 5, the inner annular surface 4S1 of the annular support layer 4 and the top surface 21 of the sensing chip 2 together surround a closed space E.

[0054] The package body 6 is opaque in this embodiment to block visible light from passing through. The package body 6 is described as a liquid encapsulation, and the package body 6 is formed on the upper surface 11 of the substrate 1 and its edge is cut flush with the edge of the substrate 1. Among them, at least part of each of the metal wires 3, the sensing chip 2, the annular support layer 4 and the light-transmitting layer 5 are all buried in the package body 6, and at least part of the outer surface 51 of the light-transmitting layer 5 is exposed outside the package body 6, but the present application is not limited thereto.

[0055] In more detail, Figure 2 , Figure 4 ,and Figure 5 As shown, an inner ring surface 4S1 and an outer ring surface 4S2 of the annular support layer 4 are located on opposite sides thereof along a direction perpendicular to the preset direction D in this embodiment, and the inner ring surface 4S1 faces the sensing area 211, while the outer ring surface 4S2 is arranged away from the sensing area 211 (e.g., the outer ring surface 4S2 is connected to the packaging body 6 without a gap).

[0056] The annular support layer 4 may be formed with a plurality of round-end microstructures 42 on the inner annular surface 4S1 and the outer annular surface 4S2, which are sequentially connected and surround the sensing region 211. In other words, the plurality of round-end microstructures 42 are arranged in a circle of sequentially connected round-end microstructures 42 on the inner annular surface 4S1 and the outer annular surface 4S2, which surround the outer side of the sensing region 211.

[0057] Furthermore, each of the round-end microstructures 42 in this embodiment is substantially columnar in structure along the preset direction D, and the two ends of each of the round-end microstructures 42 are respectively connected to the sensing chip 2 (the top surface 21) and the light-transmitting layer 5 (the inner surface 52). Among them, the appearance of any of the round-end microstructures 42 formed on the inner annular surface 4S1 may be different from the appearance of any of the round-end microstructures 42 formed on the outer annular surface 4S2, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, all of the round-end microstructures 42 may have the same appearance; or, any two of the round-end microstructures 42 formed on the inner annular surface 4S1 (or the outer annular surface 4S2) may also have different appearances.

[0058] The annular support layer 4 includes an annular base 41, and the inner annular surface 4S1 and the outer annular surface 4S2 are respectively located on opposite sides of the annular base 41, and a plurality of the circular end microstructures 42 are integrally connected to the annular base 41. Each of the circular end microstructures 42 has a rounded corner portion 421 located at its end and having a radius R421 less than 1 micrometer (μm), and a light guide portion 422 connecting the annular base 41 and the rounded corner portion 421. In each of the circular end microstructures 42, the angle of the rounded corner portion 421 is preferably not greater than 180 degrees, and the light guide portion 422 is tapered from the annular base 41 toward the rounded corner portion 421 (e.g., truncated cone shape).

[0059] Accordingly, the sensor packaging structure 100 (or the sensing module 10) in this embodiment is formed with a plurality of the round-end microstructures 42, so that each of the round-end microstructures 42 can reduce the stress concentration generated in the annular support layer 4 by having the rounded corner portion 421 with specific conditions (such as: the radius R421 is less than 1 micron).

[0060] Furthermore, the multiple round-end microstructures 42 of the annular supporting layer 4 can be used to guide the light (passing through the light-transmitting layer 5) irradiated thereon through the rounded corner portion 421 (and the light-guiding portion 422) to be scattered within the enclosed space E, thereby effectively reducing the glare phenomenon generated in the sensor packaging structure 100.

[0061] It should be additionally noted that the plurality of round-end microstructures 42 are Figure 5 The description is based on the inner annular surface 4S1 and the outer annular surface 4S2, but the present application is not limited thereto. Figure 6 As shown, the plurality of round end microstructures 42 may be formed only on the inner annular surface 4S1; or Figure 7As shown, the plurality of circular end microstructures 42 may also be formed only on the outer annular surface 4S2. Figures 5 to 7 As shown, the annular support layer 4 in the present application can be formed with a plurality of the round-end microstructures 42 on at least one of the inner annular surface 4S1 and the outer annular surface 4S2 according to design requirements.

[0062] Example 2 Please refer to Figures 8 to 10 As shown, it is the second embodiment of the present application. Since this embodiment is similar to the first embodiment, the similarities between the two embodiments are not repeated here, and the difference between this embodiment and the first embodiment mainly lies in: the annular support layer 4.

[0063] In this embodiment, the annular support layer 4 includes a plurality of side strips 4a arranged in a ring shape, and a plurality of corners 4b. The plurality of side strips 4a are arranged in a rectangular ring shape and each has a side length L4a, and any two of the side strips 4a connected to each other jointly define a corner 4b. Each of the side strips 4a includes an adjustment section 41a, and two layout sections 42a respectively connected to opposite ends of the adjustment section 41a. Furthermore, in each of the side strips 4a, the length L42a of any one of the layout sections 42a may be, for example, at least 10% of the side length L4a, and preferably not greater than the length L41a of the adjustment section 41a, but the present application is not limited thereto.

[0064] Further, if Figure 8 As shown, the annular support layer 4 has a plurality of sawtooth microstructures 40 formed on the inner annular surface 4S1, which are sequentially connected and surround the sensing area 211, thereby forming a circle, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the plurality of sawtooth microstructures 40 may also be formed on the outer annular surface 4S2, thereby forming a circle, or formed on the inner annular surface 4S1 and the outer annular surface 4S2, thereby forming two circles.

[0065] Furthermore, the plurality of sawtooth microstructures 40 include a plurality of round-end microstructures 42 and a plurality of pointed microstructures 43. The plurality of round-end microstructures 42 are located in the layout segments 42a of the plurality of side strips 4a and the plurality of corners 4b (e.g., each corner 4b is provided with at least one round-end microstructure 42), and the plurality of pointed microstructures 43 are located in the adjustment segments 41a of the plurality of side strips 4a.

[0066] In addition, at least one of the round-end microstructures 42 located at each corner 4b may be disposed on at least one of the inner annular surface 4S1 and the outer annular surface 4S2. Figure 8As shown, each of the corners 4b may be formed with a round end microstructure 42 on the inner annular surface 4S1; or Fig. 9 As shown, each of the corners 4b may be formed with a round end microstructure 42 on the outer annular surface 4S2; or, as shown Fig.10 As shown, each of the corners 4b may have a round end microstructure 42 formed on the inner annular surface 4S1 and the outer annular surface 4S2.

[0067] like Figure 8 As shown, each of the side strips 4a includes an elongated base 411, and its two ends are connected to the two corners 4b respectively. In each of the side strips 4a, each of the round-end microstructures 42 has a rounded corner portion 421 located at its end and having a radius less than 1 micrometer (μm), and a light-guiding portion 422 connecting the elongated base 411 and the rounded corner portion 421, and the light-guiding portion 422 is gradually tapered (e.g., truncated cone shape) from the elongated base 411 toward the rounded corner portion 421. The specific appearance of each of the round-end microstructures 42 can be the same as that in the first embodiment, and will not be described in detail here.

[0068] In addition, the end of each of the tip microstructures 43 is in a sharp angle shape with an angle σ43 not greater than 40 degrees. It should be noted that, in any of the side strips 4a of this embodiment, the end edges of the plurality of round-end microstructures 42 fall on a first tangent line T1, and the end edges of the plurality of tip microstructures 43 fall on a second tangent line T2, and the first tangent line T1 and the second tangent line T2 are spaced apart and parallel to each other. In other words, in each of the side strips 4a, the distance between the first tangent line T1 and the elongated base 411 is preferably smaller than the distance between the second tangent line T2 and the elongated base 411, but the present application is not limited thereto.

[0069] As described above, in the sensor packaging structure 100 (or the sensing module 10), since each corner 4b and the two adjacent layout segments 42a are locations where stress concentration is more significant and are more likely to cause glare, a plurality of round-end microstructures 42 are formed at specific locations (such as: the layout segment 42a or the corner 4b of any one of the edge strips 4a) so that each of the round-end microstructures 42 can reduce the stress concentration of the annular support layer 4 with the rounded corner portion 421 having specific conditions (such as: a radius less than 1 micron), and effectively reduce the glare phenomenon generated in the sensor packaging structure 100.

[0070] Example 3, please refer to Figures 11 to 14As shown, it is the third embodiment of the present application. Since this embodiment is similar to the above-mentioned second embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned second embodiment are roughly described as follows:

[0071] In this embodiment, the plurality of side strips 4a are arranged in a rectangular ring shape and include two first side strips 4a-1 facing each other and two second side strips 4a-2 facing each other, and the length of each first side strip 4a-1 is greater than the length of any second side strip 4a-2 in this embodiment. Fig.11 As shown, the plurality of round-end microstructures 42 are located only in the two layout segments 42a of each first side strip 4a-1, and the plurality of pointed microstructures 43 are located in the adjustment segment 41a of each first side strip 4a-1 and each second side strip 4a-2.

[0072] Furthermore, if Fig.12 As shown, the multiple round-end microstructures 42 may also be located only in the adjustment segment 41a and the two layout segments 42a of each of the first side strips 4a-1, while the multiple pointed microstructures 43 are located in the adjustment segment 41a and the two layout segments 42a of each of the second side strips 4a-2, but the present application is not limited to the above.

[0073] For example, if Fig.13 and Fig.14 As shown, the length of each of the first side strips 4a-1 may also be less than the length of any of the second side strips 4a-2. In addition, in other embodiments not shown in the present application, the plurality of round-end microstructures 42 may be two layout segments 42a located only in at least one of the side strips 4a (e.g., the first side strip 4a-1 or the second side strip 4a-2).

[0074] In addition, if Fig.11 As shown, the outer annular surface 4S2 may further form an arc angle σ4S2 at each of the corners 4b, and in each of the corners 4b, the radius of the arc angle σ4S2 is greater than the radius of the rounded corner portion 421 of the round-end microstructure 42.

[0075] Example 4 Please refer to Fig.15 As shown, it is the fourth embodiment of the present application. Since this embodiment is similar to the above-mentioned embodiments 1 to 3, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiments 1 to 3 are roughly described as follows:

[0076] In this embodiment, the annular support layer 4 is formed with a plurality of sawtooth microstructures 40 on at least one of the inner annular surface 4S1 and the outer annular surface 4S2. Among them, the plurality of sawtooth microstructures 40 are configured with a round end microstructure 42 at each corner 4b, and a plurality of pointed microstructures 43 arranged in a row are formed at each edge strip 4a. It should be noted that the round end microstructure 42 located at each corner 4b is located at the inner annular surface 4S1 in this embodiment; that is, each row of pointed microstructures 43 is located between two round end microstructures 42 respectively configured at two corners 4b, but the present application is not limited thereto.

[0077] Technical Effects of the Application In summary, the sensor packaging structure and the sensing module thereof disclosed in the embodiments of the present application are formed with a plurality of the round-end microstructures, so that each of the round-end microstructures can reduce the stress concentration of the annular support layer by the rounded corners with specific conditions (e.g., radius less than 1 micron). Furthermore, the plurality of the round-end microstructures of the annular support layer can be used to guide the light irradiated thereon through the rounded corners and scatter in the closed space, thereby effectively reducing the glare phenomenon generated in the sensor packaging structure.

[0078] Furthermore, the sensor packaging structure and the sensing module thereof disclosed in the embodiments of the present application can also form a plurality of the round-end microstructures at specific positions (such as: the layout segment or the corner of any one of the edge strips) so that each of the round-end microstructures can reduce the stress concentration in the annular support layer with the rounded corner portion having specific conditions, and effectively alleviate the glare phenomenon generated by the sensor packaging structure.

[0079] The contents disclosed above are only preferred feasible embodiments of the present application, and are not intended to limit the patent scope of the present application. Therefore, all equivalent technical changes made using the description and drawings of the present application are included in the patent scope of the present application.

Claims

1. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: a substrate; A sensing chip is disposed on the substrate and electrically coupled to the substrate; wherein a top surface of the sensing chip includes a sensing area and a carrying area surrounding the sensing area; An annular support layer is disposed on the bearing area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer includes a plurality of side strips arranged in an annular shape, and each of the side strips has a side length, and includes an adjustment section, and two layout sections respectively connected to opposite ends of the adjustment section; wherein the annular support layer includes: an inner annular surface facing the sensing area; and an outer annular surface, which is arranged away from the sensing area; wherein at least one of the inner annular surface and the outer annular surface is formed with a plurality of sawtooth-shaped microstructures, which are sequentially connected and surround the sensing area; the plurality of sawtooth-shaped microstructures include a plurality of round-end microstructures, which are located at two of the layout segments of at least one of the edge strips, and the end of each of the round-end microstructures is a rounded corner portion with a radius greater than 1 micron; and A light-transmitting layer is disposed on the annular supporting layer, so that the light-transmitting layer, the inner annular surface of the annular supporting layer, and the top surface of the sensing chip together surround and form a closed space.

2. The sensor packaging structure according to claim 1, characterized in that: A plurality of the round-end microstructures are located in the two layout segments of each of the edge strips.

3. The sensor packaging structure according to claim 2, characterized in that: The plurality of sawtooth microstructures include a plurality of tip microstructures, which are located in the adjustment section of each of the edge strips, and the end of each of the tip microstructures is in a sharp angle shape with an angle not greater than 40 degrees.

4. The sensor packaging structure according to claim 3, characterized in that: In any of the edge strips, the terminal edges of the plurality of round-end microstructures fall on a first tangent line, and the terminal edges of the plurality of pointed microstructures fall on a second tangent line, and the first tangent line and the second tangent line are spaced apart and parallel to each other.

5. The sensor packaging structure according to claim 1, characterized in that: The plurality of side strips are arranged in a rectangular ring shape and include two first side strips facing each other and two second side strips facing each other; wherein the plurality of round-end microstructures are only located in the two layout segments of each of the first side strips.

6. The sensor packaging structure according to claim 5, characterized in that: The plurality of sawtooth microstructures include a plurality of tip microstructures, which are located at the adjustment section of each of the first side strips and each of the second side strips, and the end of each of the tip microstructures is a sharp angle of no more than 40 degrees.

7. The sensor packaging structure according to claim 1, characterized in that: The plurality of side strips are arranged in a rectangular ring shape and include two first side strips facing each other and two second side strips facing each other; wherein the plurality of round-end microstructures are only located in the adjustment section and the two layout sections of each of the first side strips.

8. The sensor packaging structure according to claim 7, characterized in that: The plurality of sawtooth microstructures include a plurality of tip microstructures, which are located at the adjustment section and the two layout sections of each of the second side strips, and the end of each tip microstructure is a sharp angle of no more than 40 degrees.

9. The sensor packaging structure according to claim 1, characterized in that: Any two of the side strips connected to each other define a corner together, and a plurality of the sawtooth-shaped microstructures are provided with a round-end microstructure at each corner.

10. The sensor packaging structure according to claim 1, characterized in that: Each of the edge strips includes an elongated base, and each of the round-end microstructures has a light-guiding portion connecting the elongated base and the rounded corner portion; wherein, in each of the round-end microstructures, the light-guiding portion tapers from the elongated base toward the rounded corner portion.

11. The sensor packaging structure according to claim 1, characterized in that: The sensor packaging structure includes: A plurality of metal wires electrically coupling the substrate and the sensing chip; and A package is formed on the substrate; wherein the sensing chip, the annular support layer, and the light-transmitting layer are inside the package, and the outer surface of the light-transmitting layer away from the substrate is at least partially exposed outside the package.

12. A sensor module of a sensor packaging structure, characterized in that: The sensing module of the sensor packaging structure includes: A sensing chip, the top surface of which includes a sensing area and a carrying area surrounding the sensing area; An annular support layer is disposed on the bearing area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer includes a plurality of side strips arranged in an annular shape, and any two of the side strips connected to each other jointly define a corner; wherein the annular support layer includes: an inner annular surface facing the sensing area; and an outer annular surface disposed away from the sensing area; wherein at least one of the inner annular surface and the outer annular surface is formed with a plurality of sawtooth-shaped microstructures, and the plurality of sawtooth-shaped microstructures are provided with a rounded end microstructure at each corner, the end of which is a rounded corner portion with a radius greater than 1 micron; and A light-transmitting layer is disposed on the annular supporting layer, so that the light-transmitting layer, the inner annular surface of the annular supporting layer, and the top surface of the sensing chip together surround and form a closed space.

13. The sensing module of the sensor packaging structure according to claim 12, characterized in that: The plurality of sawtooth microstructures are formed with a plurality of pointed microstructures arranged in a row on each of the edge strips, and each row of the pointed microstructures is located between two round-end microstructures respectively arranged at the two corners.

14. The sensing module of the sensor packaging structure according to claim 13, characterized in that: The rounded end microstructure located at each of the corners is located on the inner annular surface.

15. The sensor module of the sensor packaging structure according to claim 14, characterized in that: The outer annular surface forms an arc angle at each of the corners; in each of the corners, the radius of the arc angle is greater than the radius of the rounded corner portion of the round-end microstructure.

16. A sensor module of a sensor packaging structure, characterized in that: The sensing module of the sensor packaging structure includes: A sensing chip, the top surface of which includes a sensing area and a carrying area surrounding the sensing area; An annular support layer is disposed on the bearing area of ​​the sensing chip and surrounds the sensing area; wherein the annular support layer comprises: an inner annular surface facing the sensing area; and an outer annular surface, which is disposed away from the sensing area; wherein at least one of the inner annular surface and the outer annular surface is formed with a plurality of round-end microstructures, which are sequentially connected and surround the sensing area; wherein the end of each of the round-end microstructures is a rounded corner portion with a radius less than 1 micron; and A light-transmitting layer is disposed on the annular supporting layer, so that the light-transmitting layer, the inner annular surface of the annular supporting layer, and the top surface of the sensing chip together surround and form a closed space.

17. The sensing module of the sensor packaging structure according to claim 16, characterized in that: A plurality of the round-end microstructures are only formed on the inner annular surface, and two ends of each of the round-end microstructures are respectively connected to the sensing chip and the light-transmitting layer.

18. The sensor module of the sensor packaging structure according to claim 16, characterized in that: A plurality of the round-end microstructures are only formed on the outer annular surface, and two ends of each of the round-end microstructures are respectively connected to the sensing chip and the light-transmitting layer.

19. The sensor module of the sensor packaging structure according to claim 16, characterized in that: A plurality of the round-end microstructures are formed on the inner annular surface and the outer annular surface, and the two ends of each of the round-end microstructures are respectively connected to the sensing chip and the light-transmitting layer; wherein the appearance of any one of the round-end microstructures formed on the inner annular surface is different from the appearance of any one of the round-end microstructures formed on the outer annular surface.

20. The sensing module of the sensor packaging structure according to claim 16, characterized in that: The annular support layer includes an annular base, and each of the round-end microstructures has a light-guiding portion connecting the annular base and the rounded corner portion; wherein, in each of the round-end microstructures, the light-guiding portion tapers from the annular base toward the rounded corner portion.

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