Multi-network boss printed circuit board and manufacturing method thereof

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a multi-network boss printed circuit board and a manufacturing method thereof.The manufacturing method of the multi-network boss printed circuit board comprises the steps that a PP board is provided, the PP board comprises a first machining part, a second machining part and a connecting part, and the edge of the first machining part comprises a first edge and a second edge; cutting the PP plate along the first edge; cutting the PP plate along the second edge to form a first window; removing the second processing part to form a second window; the heat conduction substrate, the PP plate and the outer layer plate are sequentially stacked and pressed together, the heat conduction substrate comprises a first boss and a second boss, the first boss is contained in the first window, and the second boss is contained in the second window. According to the multi-network boss printed circuit board and the manufacturing method thereof provided by the invention, the problem that a connecting part is easy to break due to the fact that a window corresponding to the boss is processed on a PP (Propene Polymer) board in the related technology can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a multi-network boss printed circuit board and a manufacturing method thereof. Background Art

[0002] With the popularization and rapid development of renewable energy technology, energy storage technology has gradually become a hot topic in the energy field. Printed circuit board products for energy storage power supply equipment usually need to have multi-network heat dissipation, so multi-network boss printed circuit boards (such as multi-network double-sided boss printed circuit boards, etc.) have emerged. The bosses are used to facilitate the heat dissipation of high-heat components. At the same time, by filling insulating resin between adjacent bosses, the copper substrate is divided into multiple networks, making full use of the wiring space, and components can be mounted on the double-sided bosses.

[0003] In the related art, when producing printed circuit boards with multiple network bosses, due to the need to simultaneously meet the requirements for sufficient wiring, the spacing between some adjacent bosses is designed to be only 0.3 mm. PP (Prepreg, semi-cured sheet) boards need to be pressed between the bosses to form insulating resin to separate the two adjacent bosses, and the PP board needs to be processed in advance with windows corresponding to the bosses. Since the connection between two adjacent windows on the PP board is too small, the connection is easily broken. Summary of the invention

[0004] The present application provides a multi-network boss printed circuit board and a manufacturing method thereof, which can improve the problem of processing windows corresponding to the bosses on a PP board in the related art, and the problem that the connection between two adjacent windows on the PP board is too small, which easily leads to the breakage of the connection.

[0005] In a first aspect, an embodiment of the present application provides a method for manufacturing a multi-network boss printed circuit board, comprising:

[0006] A PP plate is provided, wherein the PP plate comprises a first processed portion, a second processed portion and a connecting portion, wherein the first processed portion and the second processed portion are arranged at an interval, and the first processed portion and the second processed portion are connected by the connecting portion, and an edge of the first processed portion comprises a first edge close to the connecting portion and a second edge away from the connecting portion;

[0007] Cutting the PP board along the first edge so that the first processed portion is separated from the connecting portion;

[0008] Cutting the PP board along the second edge to remove the first processed portion to form a first window;

[0009] removing the second processed portion to form a second window;

[0010] The heat-conducting substrate, the PP board and the outer layer board are stacked and pressed together in sequence, the heat-conducting substrate includes a first boss and a second boss, the first boss is accommodated in the first window, the second boss is accommodated in the second window, and the first boss and the second boss are both connected to the outer layer board.

[0011] In some embodiments, the edge of the second processed portion includes a third edge close to the connecting portion and a fourth edge away from the connecting portion, and removing the second processed portion to form a second window includes:

[0012] Cutting the PP board along the third edge so that the second processed portion is separated from the connecting portion;

[0013] The PP plate is cut along the fourth edge to remove the second processed portion and form the second window.

[0014] In some embodiments, the PP board includes glass fiber, wherein

[0015] The extension direction of the first window side wall is arranged at an angle to the extension direction of the glass fiber;

[0016] And / or, the extension direction of the second window side wall is arranged to form an angle with the extension direction of the glass fiber.

[0017] In some embodiments, the PP plate is cut along the first edge by laser cutting; and / or, the PP plate is cut along the second edge by laser cutting.

[0018] In some embodiments, the PP board is fixed before cutting the PP board along the first edge.

[0019] In some embodiments, before stacking and pressing the thermal conductive substrate, the PP board and the outer layer board together in sequence, the method for manufacturing the multi-network boss printed circuit board includes:

[0020] Inserting resin into the resin groove of the thermally conductive substrate and curing the resin, wherein the resin groove penetrates the thermally conductive substrate and comprises a first groove and a second groove that are connected;

[0021] The thermally conductive substrate is partially thinned to form a base layer, and the thermally conductive substrate that is not thinned forms the first boss protruding from the base layer and the second boss protruding from the base layer, and the first groove separates the first boss and / or the second boss;

[0022] The resin protruding from the base layer is removed.

[0023] In some embodiments, the thermally conductive substrate has a first side and a second side opposite to each other, and the resin includes a first resin and a second resin; and the step of inserting the resin into the resin groove of the thermally conductive substrate and curing the resin includes:

[0024] Processing a first blind groove on a first side of the thermally conductive substrate;

[0025] Processing an exhaust hole at the bottom of the first blind groove;

[0026] Inserting the first resin into the first blind groove and curing the first resin;

[0027] A second blind groove is processed on the second side of the thermally conductive substrate, the first resin defines a groove bottom surface of the second blind groove, and the depth of the second blind groove is less than the depth of the first blind groove;

[0028] The second resin is inserted into the second blind groove and the second resin is cured.

[0029] In some embodiments, the first resin is inserted into the first blind groove using a mesh screen; and / or the second resin is inserted into the second blind groove using a mesh screen.

[0030] In some embodiments, laser drilling is used to remove the resin protruding from the base layer.

[0031] In a second aspect, an embodiment of the present application provides a multi-network boss printed circuit board, which is manufactured by the manufacturing method of the multi-network boss printed circuit board as described in the first aspect.

[0032] The beneficial effect of the method for manufacturing a multi-network boss printed circuit board provided in the embodiment of the present application is that: since the PP board includes a first processing part, a second processing part and a connecting part, the first processing part and the second processing part are arranged at intervals, and the first processing part and the second processing part are connected by the connecting part, the edge of the first processing part includes a first edge close to the connecting part and a second edge away from the connecting part, and the PP board is first cut along the first edge, and then the PP board is cut along the second edge to remove the first processing part to form a first window, so the first processing part can be separated from the connecting part first, and the other parts of the PP board corresponding to the second edge remain connected to the first processing part, and when the PP board is cut along the second edge to remove the first processing part to form the first window, the first processing part will not pull the connecting part, thereby avoiding the problem in the related art that the first processing part directly falls off and pulls the connecting part when the PP board is cut, resulting in the connection part breaking.

[0033] The beneficial effects of the multi-network boss printed circuit board provided in the present application compared with the prior art can be referred to the description of the beneficial effects of the manufacturing method of the multi-network boss printed circuit board provided in the present application compared with the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0035] Figure 1 It is a structural schematic diagram of a PP board in the prior art;

[0036] Figure 2 It is a structural schematic diagram of a first slot plugging screen in the prior art;

[0037] Figure 3 It is a structural schematic diagram of a second slot plugging screen in the prior art;

[0038] Figure 4 It is a flow chart of a method for manufacturing a multi-network boss printed circuit board in one embodiment of the present application;

[0039] Figure 5 It is a schematic diagram of the partial structure of a PP board in one of the embodiments of the present application;

[0040] Figure 6 is Figure 5 A schematic diagram showing the formation of a first window and a second window on a PP board shown;

[0041] Figure 7 Yes Figure 6 The schematic diagram of the PP plate pressed together with the thermal conductive substrate and the outer layer plate is shown;

[0042] Figure 8 yes Figure 7 The cross-sectional view of the PP board, the thermally conductive substrate and the outer layer board shown;

[0043] Fig. 9 yes Figure 7 A schematic structural diagram of the heat-conducting substrate shown;

[0044] Fig.10 yes Fig. 9 A schematic diagram of a resin tank in a thermally conductive substrate is shown;

[0045] Fig.11 yes Fig. 9 A partial enlarged view of the middle A;

[0046] Fig.12 yes Fig. 9 A partial enlarged view of point B in the middle;

[0047] Fig.13 It is a structural schematic diagram of a mesh screen in one of the embodiments of the present application.

[0048] The meanings of the marks in the figure are:

[0049] 1. PP board; 2. First window; 3. Second window; 4. Glass fiber; 5. First slot screen; 6. First opening; 7. Second slot screen; 8. Second opening;

[0050] 10. PP board;

[0051] 101, first processing part; 1011, first edge; 1012, second edge; 102, second processing part; 1021, third edge; 1022, fourth edge; 103, connecting part; 104, main body; 11, first window; 12, second window; 13, glass fiber;

[0052] 20. Thermally conductive substrate;

[0053] 201, first side; 202, second side; 21, first boss; 22, second boss; 23, resin tank; 24, base layer;

[0054] 30. Resin;

[0055] 31. first resin; 32. second resin;

[0056] 40. Mesh screen;

[0057] 41. Plug slot opening; 42. Stop point;

[0058] 50. Outer layer. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0060] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0061] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0062] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0063] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0064] Please refer to Figure 1 In the related art, when producing a printed circuit board with multiple network bosses, due to the need to simultaneously meet the requirement of sufficient wiring, the spacing between two adjacent bosses is designed to be only 0.3 mm. A PP (Prepreg) board needs to be pressed between the bosses to form an insulating resin to separate the two adjacent bosses, and the PP board 1 needs to be processed in advance with a first window 2 and a second window 3 corresponding to the bosses. Since the connection between the adjacent first window 2 and the second window 3 on the PP board 1 is too small, when processing the first window 2 and the second window 3, the PP board 1 that falls off will pull the connection, which can easily cause the connection to break.

[0065] At the same time, in the existing multi-network boss printed circuit board, the extension direction of the side wall of the first window 2 of the PP board 1 and the extension direction of the side wall of the second window 3 are both arranged parallel to the extension direction of the glass fiber 4 of the PP board 1, the glass fiber 4 is interwoven vertically and horizontally, and the bosses are also arranged at 90° vertically and horizontally. Since the spacing between two adjacent bosses is designed to be only 0.3 mm, and the glass fiber 4 is a grid design, the side length of the grid is also only 0.3 mm. After the window is opened on the PP board 1, the connection part of the PP board 1 is easily broken by the force.

[0066] Please refer to Figure 2 and Figure 3In addition, the resin slot of the existing multi-network boss printed circuit board is designed in the shape of a "mouth", and the traditional aluminum mesh is generally used to plug the slot. Because the shape of the slot plugging area (i.e., the aluminum mesh opening) is a closed design (i.e., a "mouth" shape), it is impossible to make an opening in a piece of aluminum mesh (if the same aluminum mesh is made into a "mouth"-shaped opening, the aluminum sheet inside the "mouth" shape will fall off). Generally, a split-net slot plugging method is used, that is, a "mouth"-shaped opening slot is divided into two screens, namely a first slot plugging screen 5 and a second slot plugging screen 7. The closed-mouth design is changed into a two-opening design, the first slot-plugging screen 5 is provided with a first opening 6, and the second slot-plugging screen 7 is provided with a second opening 8. The first slot-plugging screen 5 and the second slot-plugging screen 7 are respectively plugged once to complete the resin slot plugging. There are two alignments, and the slot plugging is prone to slot displacement, and the same area is filled at one time. Due to the large slot plugging depth, the first slot plugging screen 5 and the second slot plugging screen 7 are both directly opened designs, and the amount of resin plugged in the slot is large, which leads to problems such as difficulty in discharging bubbles and poor uniformity of resin plugging in the slot.

[0067] In view of this, the present application provides a multi-network boss printed circuit board and a manufacturing method thereof, which can improve the problem of processing windows corresponding to the bosses on a PP board in the related technology, and easily causing the connection part to break because the connection part between two adjacent windows on the PP board is too small.

[0068] Please refer to Figures 4 to 8 In a first aspect, an embodiment of the present application provides a method for manufacturing a multi-network boss printed circuit board, comprising:

[0069] S100: Provide a PP board 10, wherein the PP board 10 includes a first processing portion 101, a second processing portion 102 and a connecting portion 103, wherein the first processing portion 101 and the second processing portion 102 are spaced apart and connected via the connecting portion 103, and an edge of the first processing portion 101 includes a first edge 1011 close to the connecting portion 103 and a second edge 1012 away from the connecting portion 103.

[0070] Specifically, the first processed portion 101, the second processed portion 102 and the connecting portion 103 may be provided in plurality. The PP board 10 may also include other parts, such as a main body portion 104. The edge of the first processed portion 101 may only include a first edge 1011 and a second edge 1012. The first edge 1011 may occupy any proportion of the total edge of the first processed portion 101, and the second edge 1012 may occupy the remaining proportion of the total edge of the first processed portion 101.

[0071] S200 : cutting the PP board 10 along the first edge 1011 to separate the first processed portion 101 from the connecting portion 103 .

[0072] Specifically, the PP plate 10 may be cut along the first edge 1011 by mechanical processing or laser cutting to penetrate the PP plate 10. After the PP plate 10 is cut along the first edge 1011, the first processed portion 101 is separated from the connecting portion 103.

[0073] S300 : cutting the PP board 10 along the second edge 1012 to remove the first processed portion 101 and form a first window 11 .

[0074] Specifically, the PP board 10 can be cut along the second edge 1012 by mechanical processing or laser cutting to penetrate the PP board 10. Since the first processed portion 101 is no longer connected to the other parts of the PP board 10 (the main body 104), it will fall off, and the first window 11 will be formed at the location where the first processed portion 101 was originally located. Since the PP board 10 has been cut along the first edge 1011 before, so that the first processed portion 101 is separated from the connecting portion 103, the first processed portion 101 will not pull the connecting portion 103 when it falls off, and the connecting portion 103 will not break.

[0075] S400 : removing the second processed portion 102 to form a second window 12 .

[0076] Specifically, the second processed portion 102 may be removed by mechanical processing or laser cutting to form the second window 12 .

[0077] S500: stack and press the thermal conductive substrate 20, the PP board 10 and the outer layer board 50 together in sequence, wherein the thermal conductive substrate 20 comprises a first boss 21 and a second boss 22, wherein the first boss 21 is accommodated in the first window 11, and the second boss 22 is accommodated in the second window 12, and both the first boss 21 and the second boss 22 are connected to the outer layer board 50.

[0078] Specifically, the thermally conductive substrate 20 may be a copper substrate or an aluminum substrate, etc. The first boss 21 and the second boss 22 are arranged at intervals, and a plurality of the first boss 21 and the second boss 22 may be provided. The outer layer board 50 may be an RCC (Resin Coated Coppe) or a core board, etc., and the outer layer board 50 has a receiving hole for accommodating the first boss 21 and the second boss 22.

[0079] After the thermal conductive substrate 20, the PP board 10 and the outer layer board 50 are stacked and pressed together in sequence, the PP board 10 is melted and solidified to separate the first boss 21 and the second boss 22, and the first boss 21 and the second boss 22 are connected to the outer layer board 50 through the melted and solidified PP board 10 to form a multi-network boss printed circuit board.

[0080] As can be seen from the above, in the method for manufacturing a multi-network boss printed circuit board provided in the embodiment of the present application, since the PP board 10 includes a first processing portion 101, a second processing portion 102 and a connecting portion 103, the first processing portion 101 and the second processing portion 102 are arranged at intervals, the first processing portion 101 and the second processing portion 102 are connected by the connecting portion 103, the edge of the first processing portion 101 includes a first edge 1011 close to the connecting portion 103 and a second edge 1012 away from the connecting portion 103, and the PP board 10 is first cut along the first edge 1011, and then the PP board 10 is cut along the second edge 1012. 0, to remove the first processed portion 101 and form the first window 11, so the first processed portion 101 can be separated from the connecting portion 103 first, and the other portion of the PP board 10 corresponding to the second edge 1012 remains connected to the first processed portion 101, and when the PP board 10 is cut along the second edge 1012 to remove the first processed portion 101 and form the first window 11, the first processed portion 101 will not pull the connecting portion 103, thereby avoiding the problem in the related art that when the PP board 10 is cut, the first processed portion 101 directly falls off and pulls the connecting portion 103, resulting in the connection portion 103 breaking.

[0081] The quality yield of the multi-network boss printed circuit board produced by the method for producing the multi-network boss printed circuit board provided in the embodiment of the present application is greatly improved, while reducing the scrap abnormality, improving the production efficiency, and significantly reducing the cost.

[0082] In addition, the existing method for manufacturing a multi-network boss printed circuit board generally cuts a copper block into multiple pieces and then presses them together with the PP board 10. This method has the problem of poor pressing alignment. In the method for manufacturing a multi-network boss printed circuit board provided in the embodiment of the present application, the thermal conductive substrate 20 is a whole, and has a higher alignment accuracy when pressed together with the PP board 10.

[0083] Please refer to Figures 5 to 7 In this embodiment, the edge of the second processed portion 102 includes a third edge 1021 close to the connecting portion 103 and a fourth edge 1022 away from the connecting portion 103. The second processed portion 102 is removed to form the second window 12, including:

[0084] First, the PP board 10 is cut along the third edge 1021 so that the second processed portion 102 is separated from the connecting portion 103 .

[0085] Specifically, the PP board 10 may be cut along the third edge 1021 by mechanical processing or laser cutting to penetrate the PP board 10. After the PP board 10 is cut along the third edge 1021, the second processed portion 102 is separated from the connecting portion 103.

[0086] Next, the PP board 10 is cut along the fourth edge 1022 to remove the second processed portion 102 and form a second window 12 .

[0087] Specifically, the PP board 10 can be cut along the fourth edge 1022 by mechanical processing or laser cutting to penetrate the PP board 10. Since the second processed portion 102 is no longer connected to other parts of the PP board 10 (such as the main body 104), it will fall off, and the second window 12 is formed at the location where the second processed portion 102 was originally located. Since the PP board 10 has been cut along the third edge 1021 to separate the second processed portion 102 from the connecting portion 103, the second processed portion 102 will not pull the connecting portion 103 when it falls off, and the connecting portion 103 will not break.

[0088] By adopting the above solution, the problem in the related art that when the PP board 10 is cut, the second processed portion 102 directly falls off and pulls the connecting portion 103, resulting in the breaking of the connecting portion 103 can be avoided.

[0089] Please refer to Figure 5 and Figure 6 In this embodiment, the PP board 10 includes glass fiber 13, wherein

[0090] The extending direction of the side wall of the first window 11 forms an angle with the extending direction of the glass fiber 13 .

[0091] And / or, the extension direction of the side wall of the second window 12 is arranged to form an angle with the extension direction of the glass fiber 13 .

[0092] By adopting the above solution, the interweaving length of the glass fibers 13 corresponding to the connection part 103 can be increased, so that the glass fibers 13 corresponding to the connection part 103 are crisscrossed and longer, which can improve the problem that the connection part 103 is easy to break after being stressed.

[0093] Optionally, the extension direction of the side wall of the first window 11 and the extension direction of the glass fiber 13 are arranged at an angle of 45 degrees.

[0094] And / or, the extension direction of the side wall of the second window 12 and the extension direction of the glass fiber 13 are arranged to form an angle of 45 degrees.

[0095] Such an arrangement can significantly increase the interweaving length of the glass fibers 13 corresponding to the connecting portion 103 , thereby improving the problem that the connecting portion 103 is easily broken after being stressed.

[0096] In the related art, the thickness of the PP board 10 is relatively thin, generally 0.1 mm. When the PP board 10 is cut along the first edge 1011 and the second edge 1012 by mechanical processing (gong plate or punching plate), due to the thin thickness of the PP board 10 and the small width of the connecting portion 103 (such as when the spacing between the first boss 21 and the second boss 22 is 0.3 mm, the width of the connecting portion 103 is less than or equal to 0.3 mm), the punching tool or gong plate tool will pull the PP board 10, which may easily cause the connecting portion 103 of the PP board 10 to break, and the precision is not high, which may further reduce the width of the connecting portion 103, aggravating the problem of the connecting portion 103 breaking. After the PP board 10 and the outer layer board 50 are pressed together, a glue-deficient depression problem occurs at the fracture.

[0097] In order to solve the above problem, optionally, the PP board 10 is cut along the first edge 1011 by laser cutting; and / or, the PP board 10 is cut along the second edge 1012 by laser cutting.

[0098] Such a configuration can avoid pulling the PP plate 10 when cutting the PP plate 10 along the first edge 1011 and the second edge 1012, and is not likely to cause the connecting portion 103 of the PP plate 10 to break. The laser can more easily cut the PP plate 10 at high temperature with higher precision, thereby ensuring that the width of the connecting portion 103 is within the tolerance range.

[0099] It should be noted that when the PP board 10 is cut along the first edge 1011 by laser cutting, the tolerance is adjusted from the original 0.15mm to 0.03mm (that is, the mechanical processing compensation needs to be 0.15mm, and the laser processing accuracy is higher). During production, it can be produced in stacks of 5 sheets, and 5 PP boards 10 can be processed at a time, while mechanical window opening can process 1 sheet at a time.

[0100] It is understandable that the PP board 10 can be cut along the third edge 1021 and the fourth edge 1022 by laser cutting to avoid pulling the PP board 10 when cutting the PP board 10 along the third edge 1021 and the fourth edge 1022, which is not easy to cause the PP board 10 to break. The laser can cut the PP board 10 more easily at high temperature with higher precision, thereby ensuring the width of the connecting portion 103.

[0101] After cutting the PP board 10 along the third edge 1021 and the fourth edge 1022 by laser cutting, the PP board 10 is pre-laminated with the RCC or the core board by a conventional method and then laminated, milled, non-woven abrasive plate, overflow glue inspection, outer layer circuit, outer layer etching, outer layer AOI (Automated Optical Inspection), solder mask, characters, drilling, flying probe test, routing, abrasive plate, high voltage test, board washing, OSP (Organic solderability preservative), FQC (Final Quality Control), FQA (Factory Quality Assurance), packaging and other processes, all of which can be completed according to the conventional production method.

[0102] Optionally, before cutting the PP board 10 along the first edge 1011, the PP board 10 is fixed.

[0103] With such a setting, it is possible to avoid the movement of the PP board 10 during cutting along the first edge 1011, which affects the cutting accuracy.

[0104] Exemplarily, the PP board 10 can be placed on the laser engraving machine table, and the PP board 10 is fixed by turning on the vacuum adsorption, and then the process edge of the PP board 10 is fixed with crepe glue, and the PP board 10 is removed after cutting is completed.

[0105] With such a setting, the PP board 10 can be fixed more conveniently.

[0106] Please refer to Figures 7 to 12 , in this embodiment, before laminating and pressing the heat-conducting substrate 20, the PP board 10 and the outer layer board 50 together in sequence, the manufacturing method of the multi-network boss printed circuit board includes:

[0107] First, resin 30 is inserted into the resin groove 23 of the heat-conducting substrate 20 and the resin 30 is cured. The resin groove 23 penetrates the heat-conducting substrate 20, and the resin groove 23 includes a first groove and a second groove that are communicated with each other.

[0108] Specifically, the thickness of the heat-conducting substrate 20 can be 3.0 mm, the width of the resin groove 23 can be 2.5 mm, and the depth of the resin groove 23 is also 3.0 mm. The resin groove 23 can be distributed in a roughly "mouth" shape.

[0109] Secondly, a part of the heat-conducting substrate 20 is thinned to form a base layer 24, and the un-thinned heat-conducting substrate 20 forms a first boss 21 protruding from the base layer 24 and a second boss 22 protruding from the base layer 24. The first groove separates the first boss 21 and / or the second boss 22.

[0110] Specifically, a portion of the thermally conductive substrate 20 may be thinned by etching to form the base layer 24 , and the rest of the thermally conductive substrate 20 is not thinned to form a first boss 21 protruding from the base layer 24 and a second boss 22 protruding from the base layer 24 .

[0111] For example, the sum of the thicknesses of the PP plate 10 and the outer layer plate 50 is 0.32 mm-0.35 mm, and the etching depth is controlled to be 0.32 mm-0.35 mm, that is, the height of the first boss 21 and the height of the second boss 22 are 0.32 mm-0.35 mm.

[0112] It can be understood that when a plurality of first bosses 21 and a plurality of second bosses 22 are provided, the first groove can separate all the first bosses 21 and all the second bosses 22, and the multiple networks will not be conductive.

[0113] Finally, the resin 30 protruding from the base layer 24 is removed.

[0114] Specifically, the resin 30 protruding from the base layer 24 can be removed by mechanical grinding (such as ceramic grinding plate, etc.) or laser drilling. The resin 30 protruding from the base layer 24 includes the resin 30 protruding from the base layer 24 in the first groove and the resin 30 protruding from the base layer 24 in the second groove. After the resin 30 protruding from the base layer 24 in the first groove is removed, the first groove can be used to accommodate the connecting portion 103 later.

[0115] It is understandable that the resin 30 is at the same height as the first boss 21 and the second boss 22. The first boss 21 and the second boss 22 need to be pressed against the outer layer circuit, and the first boss 21 and the second boss 22 are at the same height as the outer layer circuit, so after thinning a portion of the thermal conductive substrate 20, the resin 30 protruding from the base layer 24 needs to be removed.

[0116] For example, the thickness of the thermal conductive substrate 20 is 3.0 mm, the height of the first boss 21 and the height of the second boss 22 are both 0.32-0.35 mm, so the thickness of the base layer 24 is 3.0-(0.32-0.35)*2=2.3-2.36 mm. Because part of the thermal conductive substrate 20 is thinned to form the base layer 24, the unthinned thermal conductive substrate 20 forms the first boss 21 protruding from the base layer 24 and the second boss 22 protruding from the base layer 24, and then needs to be pressed with the PP board 10, RCC or core board. Therefore, it is necessary to remove the resin 30 protruding from the base layer 24, that is, remove the resin 30 in the resin groove 23 of the entire board. After removing, the resin 30 is flush with the base layer 24 to be pressed with the PP board 10, RCC or core board.

[0117] It should be noted that the thickness of the thermally conductive substrate 20 is not limited to 3.0 mm, and the height of the first boss 21 and the height of the second boss 22 are not limited to 0.32 mm-0.35 mm, and other numerical designs can be made according to the number of circuit board layers and their designed thickness.

[0118] By adopting the above solution, the thermally conductive substrate 20 can be manufactured more conveniently, and the resin 30 can be prevented from flowing to the area outside the first boss 21 and the second boss 22 when the resin 30 is inserted into the resin groove 23 of the thermally conductive substrate 20, resulting in an uneven surface of the thermally conductive substrate 20.

[0119] The thermal conductive substrate 20 has a first side 201 and a second side 202 opposite to each other, and the resin 30 includes a first resin 31 and a second resin 32. The resin 30 is inserted into the resin groove 23 of the thermal conductive substrate 20 and the resin 30 is cured, including:

[0120] First, a first blind groove is processed on the first side 201 of the thermal conductive substrate 20 .

[0121] Specifically, the thermally conductive substrate 20 may have been through processes such as cutting and primary drilling.

[0122] From cutting to primary drilling: it is completed according to conventional production. Specifically, the primary drilling is to drill the peripheral holes, the material number holes and the circuit alignment holes, which are used as the positioning points for the alignment of the first boss 21 and the second boss 22 of the inner layer of the circuit.

[0123] The first blind groove may be processed on the first side 201 of the thermal conductive substrate 20 by removal or etching.

[0124] For example, the first blind groove is processed on the first side 201 of the thermal conductive substrate 20 by inner layer circuits, inner layer etching, inner layer AOI and browning.

[0125] Inner layer circuit: expose the corresponding thermal conductive substrate 20 by dry film pasting, exposure and development, and cover other areas with dry film exposure.

[0126] Inner layer etching: Etch out the first blind groove exposed after development. The etching depth is controlled at 1.8mm, and the etching compensation is 0.1mm on one side. Etch twice, and the etching depth is 0.9mm each time.

[0127] The inner layer AOI and browning are completed according to the conventional manufacturing process. AOI is to inspect the quality of the first blind groove after etching, and browning is to improve the bonding strength between the first blind groove and the first resin 31.

[0128] For example, the thickness of the thermally conductive substrate 20 is 3.0 mm, and the depth of the first blind groove is 1.8 mm.

[0129] It should be noted that after the first blind groove is processed on the first side 201 of the thermal conductive substrate 20 , the bottom of the first blind groove is supported by the thermal conductive substrate 20 , and deformation and other problems will not occur even if the thickness is smaller.

[0130] Secondly, a vent hole is processed at the bottom of the first blind groove.

[0131] Specifically, the exhaust hole can be processed at the bottom of the first blind groove by mechanical processing or laser processing.

[0132] Next, the first resin 31 is inserted into the first blind groove and the first resin 31 is cured.

[0133] Specifically, since the exhaust hole has been processed at the bottom of the first blind groove, it is helpful to discharge bubbles when the first resin 31 is inserted into the first blind groove, thereby avoiding the problem of bubbles being generated at the bottom of the first blind groove after the groove is plugged.

[0134] After the first resin 31 is cured, the ceramic plate grinding, glue overflow detection and transfer process can be continued according to the conventional manufacturing method.

[0135] Then, a second blind groove is processed on the second side 202 of the thermally conductive substrate 20 , and the first resin 31 defines the bottom surface of the second blind groove. The depth of the second blind groove is smaller than that of the first blind groove.

[0136] Specifically, the second blind groove may be processed on the second side 202 of the thermally conductive substrate 20 by means of removal or etching. The depth of the second blind groove may be 1.2 mm.

[0137] For example, processing the second blind groove on the second side 202 of the thermal conductive substrate 20 includes processes such as film lamination, inner layer circuit, inner layer etching, inner layer AOI and browning.

[0138] Pasting film to inner layer circuit: expose the corresponding thermal conductive substrate 20 by pasting dry film, exposing and developing, and cover other areas with dry film exposure.

[0139] Inner layer etching: Etch out the second blind groove exposed after development, and control the etching depth to be greater than 1.2mm to ensure that the first resin 31 is exposed after etching to prevent incomplete etching from causing conduction between multiple networks. The etching compensation is 0.1mm on one side, and the etching is performed twice. The first etching depth is 0.9mm, and the second etching depth is greater than 0.3mm.

[0140] Inner layer AOI and browning: Completed according to the conventional production process. AOI is to inspect the quality of the first blind groove after etching, to ensure that there is no residual thermal conductive substrate 20 at the bottom of the groove, and the first resin 31 is completely exposed. Browning is to improve the bonding strength between the second blind groove and the second resin 32.

[0141] It should be noted that, although the bottom of the second blind groove is not the heat-conducting substrate 20, the first resin 31 is relatively thick and can provide good support without obvious deformation. In addition, since the first resin 31 defines the bottom surface of the second blind groove, it can ensure that the heat-conducting substrate 20 corresponding to the second blind groove has been cleaned to prevent conduction between multiple networks.

[0142] Finally, the second resin 32 is inserted into the second blind groove and the second resin 32 is cured.

[0143] Specifically, since the depth of the second blind groove is less than that of the first blind groove, the depth of the second blind groove can be designed to be smaller, so as to expel bubbles when the second resin 32 is inserted into the second blind groove, thereby avoiding the problem of bubbles being generated at the bottom of the second blind groove after insertion.

[0144] After the second resin 32 is cured, the ceramic plate grinding, glue overflow detection and transfer process can be continued according to the conventional manufacturing method.

[0145] By adopting the above solution, it is possible to avoid the problem of bubbles being generated when the resin 30 is inserted into the resin groove 23 of the thermally conductive substrate 20 , and it is also possible to avoid obvious deformation of the thermally conductive substrate 20 when the resin groove 23 is machined on the thermally conductive substrate 20 .

[0146] It can be understood that the first side 201 and the second side 202 of the thermal conductive substrate 20 can be provided with multiple first bosses 21 and multiple second bosses 22, and the first side 201 and the second side 202 of the thermal conductive substrate 20 can be pressed together with the PP board 10 and the outer layer board 50 to form a multi-network double-sided sandwich boss printed circuit board for low-voltage energy storage power supply equipment.

[0147] Optionally, the first resin 31 is inserted into the first blind groove using a mesh screen 40 ; and / or the second resin 32 is inserted into the second blind groove using a mesh screen 40 .

[0148] With such a configuration, when the first resin 31 is inserted into the first blind groove or the second resin 32 is inserted into the second blind groove, the resin 30 can fall more slowly, and the bubbles in the first blind groove or the second blind groove can be discharged better. In addition, the slot opening 41 of the mesh screen 40 is a grid, and the plugging hole area is supported by mesh. When applied to the "mouth"-shaped resin slot 23, the "mouth"-shaped slot opening 41 will not allow the closed inner stop point 42 to fall, and the "mouth"-shaped plugging of the resin 30 can be completed with one screen, reducing the investment of a set of screens, and at the same time reducing the problem of slot displacement.

[0149] Exemplarily, the mesh screen stencil 40 can be designed with 18T mesh screen. The resin groove 23 in the shape of "mouth" uses the mesh screen opening as the plug groove opening 41 (closed type design, and stop points 42 are designed in other areas). The plug groove opening 41 is made according to the overall resin groove 23. Before screen printing, the whole data should be shrunk inward by 0.1 mm, so that the resin 30 will not overflow during printing. Compared with the previous method of plugging resin 30 with an aluminum sheet, one set of stencil can be reduced.

[0150] In the prior art, the excess resin 30 is generally removed by milling a countersunk head, but due to the relatively dense design positions of the bosses, the minimum part spacing is only 0.3 mm, while the smallest milling cutter is 0.8 mm. Only a 0.3 mm drill bit can be used to produce by the method of controlled-depth drilling. This production method has low efficiency, high tool breakage rate, and high cost. Using traditional tools increases the dead corners of the resin groove 23 that cannot be milled in place. Enlarging the milling groove position will cause damage to the dense boss positions and the problem of boss burrs.

[0151] To solve the above problems, optionally, a laser drilling method is adopted to remove the resin 30 protruding from the base layer 24.

[0152] With such a setting, the resin 30 protruding from the base layer 24 can be removed more precisely, avoiding damage to the first boss 21 and the second boss 22 and the problem of burrs.

[0153] Exemplarily, the laser drilling data is designed to use a 0.15 mm hole diameter for filling, and the filling range is 0.1 mm larger than the resin 30 on one side. The number of laser holes does not exceed 990,000. Special attention should be paid to the fact that the same resin 30 position cannot be re-drilled during laser drilling. The parameters are effectively controlled, and the laser design is produced by an overlay method.

[0154] Among them, the heat-conducting substrate 20 can be a copper substrate, and the laser drilling can be a carbon dioxide laser. The carbon dioxide laser does not react with copper and will not cause damage to the first boss 21, the second boss 22, and the base layer 24.

[0155] Optionally, the laser drilling adopts an overlay design method, and the laser drilling will not miss drilling, avoiding the problems of partial area missing drilling and unevenness after drilling.

[0156] In a second aspect, an embodiment of the present application provides a multi-network boss printed circuit board, and the multi-network boss printed circuit board is processed by the manufacturing method of the multi-network boss printed circuit board as in the first aspect.

[0157] The multi-network boss printed circuit board provided in the embodiment of the present application has a PP board 10 including a first processing portion 101, a second processing portion 102 and a connecting portion 103, the first processing portion 101 and the second processing portion 102 are arranged at intervals, the first processing portion 101 and the second processing portion 102 are connected by the connecting portion 103, the edge of the first processing portion 101 includes a first edge 1011 close to the connecting portion 103 and a second edge 1012 away from the connecting portion 103, and during processing, the PP board 10 is first cut along the first edge 1011, and then the PP board 10 is cut along the second edge 1012, so as to The first processed portion 101 is removed to form the first window 11, so the first processed portion 101 can be separated from the connecting portion 103 first, and the other portions of the PP board 10 corresponding to the second edge 1012 remain connected to the first processed portion 101. When the PP board 10 is cut along the second edge 1012 to remove the first processed portion 101 and form the first window 11, the first processed portion 101 will not pull the connecting portion 103, thereby avoiding the problem in the related art that when the PP board 10 is cut, the first processed portion 101 directly falls off and pulls the connecting portion 103, causing the connecting portion 103 to break.

[0158] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for manufacturing a multi-network boss printed circuit board, characterized in that: include: A PP plate is provided, wherein the PP plate comprises a first processed portion, a second processed portion and a connecting portion, wherein the first processed portion and the second processed portion are arranged at an interval, and the first processed portion and the second processed portion are connected by the connecting portion, and an edge of the first processed portion comprises a first edge close to the connecting portion and a second edge away from the connecting portion; Cutting the PP board along the first edge so that the first processed portion is separated from the connecting portion; Cutting the PP board along the second edge to remove the first processed portion to form a first window; removing the second processed portion to form a second window; The heat-conducting substrate, the PP board and the outer layer board are stacked and pressed together in sequence, the heat-conducting substrate includes a first boss and a second boss, the first boss is accommodated in the first window, the second boss is accommodated in the second window, and the first boss and the second boss are both connected to the outer layer board.

2. The method for manufacturing a multi-network boss printed circuit board according to claim 1, characterized in that: The edge of the second processed portion includes a third edge close to the connecting portion and a fourth edge away from the connecting portion, and the removing the second processed portion to form a second window includes: Cutting the PP board along the third edge so that the second processed portion is separated from the connecting portion; The PP plate is cut along the fourth edge to remove the second processed portion and form the second window.

3. The method for manufacturing a multi-network boss printed circuit board according to claim 1, characterized in that: The PP board includes glass fiber, wherein The extension direction of the first window side wall is arranged at an angle to the extension direction of the glass fiber; And / or, the extension direction of the second window side wall is arranged to form an angle with the extension direction of the glass fiber.

4. The method for manufacturing a multi-network boss printed circuit board according to claim 1, characterized in that: The PP board is cut along the first edge by laser cutting; and / or, the PP board is cut along the second edge by laser cutting.

5. The method for manufacturing a multi-network boss printed circuit board according to claim 4, characterized in that: Before cutting the PP board along the first edge, the PP board is fixed.

6. The method for manufacturing a multi-network boss printed circuit board according to any one of claims 1 to 5, characterized in that: Before stacking and pressing the heat-conducting substrate, the PP board and the outer layer board together in sequence, the method for manufacturing the multi-network boss printed circuit board includes: Inserting resin into the resin groove of the thermally conductive substrate and curing the resin, wherein the resin groove penetrates the thermally conductive substrate and comprises a first groove and a second groove that are connected; The thermally conductive substrate is partially thinned to form a base layer, and the thermally conductive substrate that is not thinned forms the first boss protruding from the base layer and the second boss protruding from the base layer, and the first groove separates the first boss and / or the second boss; The resin protruding from the base layer is removed.

7. The method for manufacturing a multi-network boss printed circuit board according to claim 6, characterized in that: The thermally conductive substrate has a first side and a second side opposite to each other, and the resin includes a first resin and a second resin; The step of inserting resin into the resin groove of the thermally conductive substrate and curing the resin comprises: Processing a first blind groove on a first side of the thermally conductive substrate; Processing an exhaust hole at the bottom of the first blind groove; Inserting the first resin into the first blind groove and curing the first resin; A second blind groove is processed on the second side of the thermally conductive substrate, the first resin defines a groove bottom surface of the second blind groove, and the depth of the second blind groove is less than the depth of the first blind groove; The second resin is inserted into the second blind groove and the second resin is cured.

8. The method for manufacturing a multi-network boss printed circuit board according to claim 7, characterized in that: The first resin is inserted into the first blind groove using a mesh screen; and / or the second resin is inserted into the second blind groove using a mesh screen.

9. The method for manufacturing a multi-network boss printed circuit board according to claim 6, characterized in that: The resin protruding from the base layer is removed by laser drilling.

10. A multi-network boss printed circuit board, characterized in that: The multi-network boss printed circuit board is manufactured by the manufacturing method of the multi-network boss printed circuit board according to any one of claims 1 to 9.

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