Intelligent temperature control and balancing of data center liquid cooling devices

Abstract

A liquid cooling method and system for cooling a rack-mounted process assembly is disclosed, the liquid cooling method and system providing a dry cooling unit, a first liquid distribution loop for delivering a cooling liquid, and a second liquid distribution loop for delivering a heated liquid from the rack-mounted process assembly, each of the rack-mounted data processing assemblies includes an intelligent control valve designed to be pressure independent and to control the flow rate of the cooling liquid based on the detected temperature and pressure flow. Each of the intelligent control valves operates to: measure a current liquid flow rate, a current input cooling liquid temperature, and a current output heated liquid temperature and calculate a current temperature difference; determining the relationship between the current temperature difference and the target temperature value; and dynamically adjusting the liquid flow rate of the intelligent control valve based on the determined relationship and the current liquid flow rate and the current input cooling liquid temperature.

Description

Technical Field

[0001] The present technology generally relates to the field of data center cooling, and more particularly to controlling and balancing liquid cooling arrangements for rack-mounted processing components in a data center. Background Art

[0002] Data centers and many computer processing facilities house a number of rack-mounted electronic processing devices. In operation, such electronic processing devices generate a large amount of heat that must be dissipated to avoid electronic component failure and to ensure continued efficient processing operations.

[0003] To this end, various liquid cooling measures have been implemented to facilitate the dissipation of heat generated by electronic processing equipment. One such measure uses liquid block cooling technology to directly cool one or more heat-generating processing components. The technology utilizes a liquid cooling block with internal channels, which receives cooling liquid from a liquid cooling source (e.g., a heat exchanger, a dry cooler, a municipal water supply, etc.) via a liquid cooling loop device to circulate the cooling liquid throughout the device. In this way, the liquid cooling block is positioned in direct thermal contact with the heat-generating component so that the received cooling liquid absorbs the generated heat and the heated liquid is circulated back to the liquid cooling source via the cooling loop device for recooling.

[0004] Another liquid cooling measure uses liquid immersion cooling (IC) technology, in which the electronic processing equipment is placed in an immersion housing containing a cooling dielectric fluid. In this way, the immersed electronic processing equipment dissipates heat, which is absorbed by the cooling dielectric fluid, wherein the heated dielectric fluid is circulated back to the cooling source via a cooling loop device for recooling.

[0005] In this regard, hybrid liquid cooling measures have been introduced, using a combination of liquid block cooling technology and liquid IC technology and various cooling loop arrangements to maximize cooling of electronic processing equipment.

[0006] In this regard, there remains interest in improving the control and balance of the temperature of cooling liquid received by electronic processing equipment and the temperature of heated liquid returned to the cooling source to optimize cooling efficiency.

[0007] The subject matter discussed in the background section should not be considered as prior art simply because it is mentioned in the background section. Similarly, the problems mentioned in the background section or problems associated with the subject matter in the background section should not be considered as having been previously recognized in the prior art. The subject matter in the background section merely represents different approaches. Summary of the invention

[0008] Embodiments of the present technology have been developed in light of certain shortcomings associated with conventional dry cooling techniques and embodiments.

[0009] In one aspect, the inventive concept of the present technology provides a method for controlling and balancing a liquid cooling device for rack-mounted processing components in a data center, the method comprising: providing a dry cooling unit, the dry cooling unit being used to supply cooling liquid to the rack-mounted processing components and receiving heated liquid from the rack-mounted processing components; providing a first liquid distribution circuit, the first liquid distribution circuit being used to transfer cooling liquid from the dry cooling unit to the rack-mounted processing components; and providing a second liquid distribution circuit, the second liquid distribution circuit being used to transfer heated liquid from the rack-mounted processing components to the dry cooling unit, wherein each of the rack-mounted data processing components The rack-mounted data processing component includes: at least one heat-generating electronic processing element and at least one liquid cooling block, the at least one liquid cooling block being arranged to be in thermal contact with the at least one heat-generating electronic processing element, respectively, the at least one liquid cooling block being fluidly connected to a first liquid distribution circuit to receive a cooling liquid and circulate the cooling liquid through the at least one liquid cooling block; and an intelligent control valve, the intelligent control valve being respectively arranged to be fluidly connected to the at least one liquid cooling block of the corresponding rack-mounted data processing component, the intelligent control valve being configured to be pressure-independent and to control the flow rate of the cooling fluid of the corresponding rack-mounted data processing component based on detected temperature and pressure flows.

[0010] The method also includes: each intelligent control valve operates to perform an initialization process, which includes: measuring the liquid flow rate, input cooling liquid temperature, and output heated liquid temperature of the corresponding rack-mounted data processing component, and calculating the temperature difference between the input cooling liquid temperature and the output heated liquid temperature; determining the relationship between the temperature difference and the target temperature value; and initializing the liquid flow rate of the intelligent control valve based on the determined relationship before operation.

[0011] The method also includes: each intelligent control valve operates to perform an operation process, which includes: measuring the current liquid flow rate, the current input cooling liquid temperature, and the current output heated liquid temperature of the corresponding rack-mounted data processing component, and calculating the current temperature difference between the current input cooling liquid temperature and the current output heated liquid temperature; determining the relationship between the current temperature difference and the target temperature value; and dynamically adjusting the liquid flow rate of the intelligent control valve based on the determined relationship and the current liquid flow rate and the current input cooling liquid temperature.

[0012] The method also includes: for the initialization process, when the temperature difference is less than the target temperature value, the liquid flow rate of the corresponding intelligent control valve is reduced, and then it is confirmed that the reduced flow rate is not lower than the minimum flow rate limit; when the temperature difference is equal to the target temperature value, it is determined whether the internal temperature of the rack-mounted processing component at the input cooling liquid temperature is less than the predetermined lower temperature limit: when the internal temperature is less than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is reduced, and when the internal temperature is greater than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is increased.

[0013] The method also includes: with respect to the operation process, when the current temperature difference is greater than the target temperature value, increasing the liquid flow rate of the corresponding intelligent control valve, and when the increased liquid flow rate is the same as the current flow rate, issuing an alarm message indicating that the liquid flow rate of the corresponding intelligent control valve is insufficient; when the current temperature difference is less than the target temperature value, reducing the liquid flow rate of the corresponding intelligent control valve, and then confirming that the reduced flow rate is not lower than the minimum flow rate limit.

[0014] The method also includes: for the operation process, when the current temperature difference is equal to the target temperature value, determining whether the internal temperature of the rack-mounted processing component at the current input cooling liquid temperature is less than a predetermined lower temperature limit, when the internal temperature is less than the predetermined lower temperature limit, reducing the liquid flow rate of the corresponding intelligent control valve, and then checking whether the reduced flow rate is lower than the minimum flow rate limit or whether the current temperature difference is greater than the target temperature plus the offset temperature.

[0015] The method also includes: for the operation process, when the reduced flow rate is lower than the minimum flow rate limit or the current temperature difference is greater than the target temperature plus the offset temperature, the current liquid flow rate of the corresponding intelligent control valve is increased; when the internal temperature of the rack-mounted processing component is greater than the predetermined lower temperature limit, a message indicating a warning message indicating a possible high temperature trend is issued, and the current liquid flow rate of the corresponding intelligent control valve is increased.

[0016] In a related aspect of the inventive concept, the present technology provides a controlled and balanced liquid cooling device for rack-mounted processing components in a data center, the liquid cooling device comprising: a dry cooling unit configured to supply cooling liquid to the rack-mounted processing components and receive heated liquid from the rack-mounted processing components; a first liquid distribution circuit configured to transfer cooling liquid from the dry cooling unit to the rack-mounted processing components, the first liquid distribution circuit comprising a pump configured to drive the flow of cooling liquid supplied by the dry cooling unit; a second liquid distribution circuit configured to transfer heated liquid from the rack-mounted processing components to the dry cooling unit; In the embodiment of the present invention, each of the rack-mounted data processing components includes: at least one heat-generating electronic processing element; at least one liquid cooling block, which is arranged to be in thermal contact with the at least one heat-generating electronic processing element, respectively, and the at least one liquid cooling block is fluidly connected to a first liquid distribution circuit to receive cooling liquid and circulate the cooling liquid through the at least one liquid cooling block; and an intelligent control valve, which is respectively arranged to be fluidly connected to the at least one liquid cooling block of the corresponding rack-mounted data processing component, and the intelligent control valve is configured to be pressure-independent and to control the flow rate of the cooling liquid of the corresponding rack-mounted data processing component based on the detected temperature and pressure flow.

[0017] The liquid cooling device also includes: in an initialization mode, each intelligent control valve operates to: measure the liquid flow rate, input cooling liquid temperature, and output heated liquid temperature of the corresponding rack-mounted data processing component, calculate the temperature difference between the input cooling liquid temperature and the output heated liquid temperature; determine the relationship between the temperature difference and the target temperature value; and initialize the liquid flow rate of the intelligent control valve based on the determined relationship before the operation mode.

[0018] The liquid cooling device also includes: in an operating mode, each intelligent control valve operates, wherein, when a current temperature difference is greater than a target temperature value, the liquid flow rate of the corresponding intelligent control valve is increased, and if the increased liquid flow rate is the same as the current flow rate, an alarm message indicating that the liquid flow rate of the corresponding intelligent control valve is insufficient is issued; when the current temperature difference is equal to the target temperature value, it is determined whether the internal temperature of the rack-mounted processing component at the current input cooling liquid temperature is less than a predetermined lower temperature limit; and when the internal temperature is less than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is reduced, and then a check is performed to determine whether the reduced flow rate is lower than the minimum flow rate limit or whether the current temperature difference is greater than the target temperature plus the offset temperature.

[0019] The liquid cooling device also includes: when in an operating mode, for a currently input cooling liquid temperature, when the internal temperature of the rack-mounted processing component is greater than a predetermined lower temperature limit, a message indicating a warning message indicating a possible high temperature trend is issued, and a current liquid flow rate of the corresponding intelligent control valve is increased.

[0020] In the context of this specification, unless otherwise expressly specified, a computer system may refer to but is not limited to an "electronic device", "operating system", "system", "computer-based system", "controller unit", "monitoring device", "control device" and / or a combination thereof suitable for the current related task.

[0021] In the context of this specification, unless expressly provided otherwise, the expressions "computer-readable medium" and "memory" are intended to include media of any nature and kind, non-limiting examples of which include RAM, ROM, disks (CD-ROM, DVD, floppy disks, hard disk drives, etc.), USB keys, flash memories, solid-state drives, and tape drives. Still in the context of this specification, "a" computer-readable medium and "the" computer-readable medium should not be interpreted as the same computer-readable medium. On the contrary, and where appropriate, "a" computer-readable medium and "the" computer-readable medium may also be interpreted as a first computer-readable medium and a second computer-readable medium.

[0022] In the context of this specification, unless expressly specified otherwise, the words "first", "second", "third" etc. have been used as adjectives merely for the purpose of allowing the nouns they modify to be distinguished from each other, rather than for the purpose of describing any specific relationship between these nouns.

[0023] The embodiments of the present technology each have at least one of the purposes and / or aspects described above, but not necessarily all of them. It should be understood that some aspects of the present technology generated in an attempt to achieve the above-mentioned purpose may not meet the purpose and / or may meet other purposes not specifically described herein.

[0024] Additional and / or alternative features, aspects, and advantages of implementations of the present techniques will become apparent from the following description, drawings, and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] For a better understanding of the present technology and other aspects and further features thereof, reference is made to the following description which will be used in conjunction with the accompanying drawings, in which:

[0026] Figure 1A high-level functional block diagram of a controlled and balanced liquid cooling arrangement for data center rack-mounted processing components is shown in accordance with a non-limiting embodiment of the present technology;

[0027] Figure 2A A flow chart illustrating an initialization process for controlling and balancing a liquid cooling system for rack-mounted processing components in accordance with a non-limiting embodiment of the present technology; and

[0028] Figure 2B A flow chart illustrating an operational sequential process for controlling and balancing a liquid cooling system for rack-mounted processing components in accordance with a non-limiting embodiment of the present technology;

[0029] It should be understood that the accompanying drawings are not drawn to scale unless otherwise explicitly indicated herein. DETAILED DESCRIPTION

[0030] The examples and conditional language described herein are primarily intended to help the reader understand the principles of the present technology, rather than limiting its scope to such specific examples and conditions described herein. It will be appreciated that those skilled in the art may design various arrangements that, although not explicitly described or shown herein, still embody the principles of the present technology.

[0031] In addition, to facilitate understanding, the following description may describe relatively simplified implementations of the present technology. It will be appreciated by those skilled in the art that various implementations of the present technology may have greater complexity.

[0032] In some cases, examples that are considered helpful for modifications of the present technology may also be set forth. This is done solely to aid understanding, and is not intended to limit the scope of the present technology or set forth its boundaries. These modifications are not an exhaustive list, and those skilled in the art may make other modifications that remain within the scope of the present technology. In addition, if no examples of modifications are set forth, it should not be interpreted that modifications are impossible and / or that what is described is the only way to implement that element of the present technology.

[0033] In addition, all statements describing the principles, aspects, and implementations of the present technology and specific examples thereof herein are intended to cover both structural and functional equivalents thereof, whether they are currently known or developed in the future. Thus, for example, it will be understood by those skilled in the art that any block diagram herein represents a conceptual view of an illustrative loop embodying the principles of the present technology. Similarly, it will be understood that any flow chart, job chart, state transition diagram, pseudocode, etc. represent various processes, which can be substantially represented in a non-transient computer-readable medium and thus executed by a computer or processor, whether or not such a computer or processor is explicitly shown.

[0034] The functions of the various elements shown in the figure (including any functional blocks marked as "processors") can be provided by using dedicated hardware and hardware that can be combined with appropriate software to execute software. When these functions are provided by a processor, it can be provided by a single dedicated processor, a single shared processor, or some of its shareable multiple separate processors. In some embodiments of the present technology, the processor can be a general-purpose processor (such as a central processing unit (CPU)) or a processor dedicated to a specific purpose (such as a digital signal processor (DSP)). In addition, the explicit use of the term "processor" should not be interpreted as specifically referring to hardware that can execute software, and may implicitly include but is not limited to application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), read-only memories (ROMs), random access memories (RAMs) and non-volatile memories for storing software. Other conventional and / or customized hardware may also be included.

[0035] Software modules, or simply modules implied as software, may be represented herein as any combination of flow chart elements or other elements indicating the execution of process steps and / or text descriptions. These modules may be executed by hardware, either explicitly or implicitly shown. Furthermore, it should be understood that modules may include, for example, but not limited to, computer program logic, computer program instructions, software, stacks, firmware, hardware circuits, or combinations thereof, that provide the desired capabilities.

[0036] With this basic understanding in mind, the disclosed embodiments are directed to controlling and balancing a data center liquid cooling system for rack-mounted processing components. Controlling and balancing the liquid cooling system is based on maintaining an optimal temperature difference between the supplied cooling liquid and the returned heated liquid by dynamically adjusting the liquid flow rate to each individual rack-mounted processing component.

[0037] Figure 1 The overall architecture of a controlled and balanced liquid cooling system 100 for rack-mounted processing components according to a non-limiting embodiment of the present technology is shown. As shown, the system 100 includes: a dry cooling unit 110; a plurality of rack-mounted processing components 120A to 120N; a plurality of "smart" valves 122A to 122N, each of which is fluidly coupled to a respective processing component; a forward liquid distribution circuit 115 including a pump 112 for supplying cooling liquid from the dry cooling unit 110; and a return liquid distribution loop 125 for returning heated liquid to the dry cooling unit 110.

[0038] The dry cooling unit 110 includes an outlet 110C configured to supply cooling liquid and an inlet 110D configured to receive heated liquid. The dry cooling unit 110 is used to dissipate heat energy from the heated liquid circulating therein to the surrounding environment. For example, in a data center or similar facility, the dry cooling unit 110 operates to receive heated liquid from rack-mounted processing components 120A to 120N (e.g., circulating water by contacting a water block with a heat-generating component) and extracts heat energy from the heated liquid by dissipating energy into the surrounding environment via at least one fan assembly 110A, thereby re-cooling the heated liquid. The dry cooling unit 110 then operates to supply the re-cooled liquid back to the rack-mounted processing components 120A to 120N.

[0039] As shown, the dry cooling unit 110 includes at least one heat exchanger 110B and at least one fan assembly 110A. The heat exchanger 110 can take on a variety of configurations, such as an air-liquid heat exchanger, etc., and the heat exchanger 110 can also include an evaporative pad or a cooling pad. For the purposes of this disclosure, the exact configuration of the dry cooling unit 110 and the heat exchanger 110 is not limited, as various configurations can be adopted without departing from the concept of this disclosure.

[0040] Liquid cooled / recooled by the dry cooling unit 110 is supplied to the rack mounted processing components 120A to 120N via the outlet 110C and the forward liquid distribution loop 115. The forward liquid distribution loop 115 includes a pump 112 to maintain the flow rate of the cooled / recooled liquid supplied to the processing components 120A to 120N at an appropriate level.

[0041] The heated liquid from the rack mounted processing components 120A to 120N is returned to the dry cooling unit 110 for recooling via the inlet 110D and the return liquid distribution loop 125. As shown, the dry cooling unit 110 supplies the rack mounted processing components 120A to 120N with cooled / recooled liquid at a nominal temperature T, and the heated liquid returning to the dry cooling unit 110 is at a nominal temperature of T+ΔT, where ΔT represents the temperature difference between the cooled / recooled liquid and the heated liquid.

[0042] Back to Figure 1The liquid cooling system 100 includes a plurality of rack-mounted processing components 120A to 120N, which receive a supply of cooled / recooled liquid via a forward liquid distribution loop 115, internally direct the liquid (e.g., water circulated through a water block) to heat-generating processing components, and transfer the heated liquid from the heat-generating processing components to a return liquid distribution loop 125.

[0043] The rack-mounted processing components 120A-120N may or may not be configured with similar heat generating processing components. Therefore, each of the rack-mounted processing components 120A-120N may have different temperature and flow rate requirements to operate properly.

[0044] It will be understood that although the rack-mounted processing components 120A to 120N are shown as being arranged in a parallel configuration, this is not meant to be limiting, as the processing components 120A to 120N may also be arranged in a series configuration or a combination of parallel and series configurations without departing from the concepts of the present disclosure.

[0045] As shown, each of the rack-mounted processing components 120A-120N is fluidly coupled to a "smart" valve 120A-120N that dynamically controls the flow rate of the corresponding processing component 120A-120N based on the detected liquid temperature. For the purposes of this disclosure, the term "smart" valve refers to a valve that is independent of pressure and susceptible to temperature, and the term "smart" valve includes a differential pressure regulator to automatically adjust for system pressure changes. Such smart valves may include: PICV, ABQM, or other functionally similar valves or valve combinations, such as a solenoid valve combined with a control valve.

[0046] As shown, the temperature of the liquid entering each of the rack-mounted processing components 20A to 120N is measured as T in , which depends on environmental factors and the distance traversed, T in may be the same as the temperature T of the cooled / recooled liquid provided by the dry cooling unit 110 or T in May be different from the temperature T of the cooled / recooled liquid provided by the dry cooling unit 110 .

[0047] The heated liquid flowing out of each of the rack-mounted processing components 120A to 120N is provided to the corresponding smart valve 122A to 122N. In addition, the temperature of the heated liquid flowing out of each processing component 120A to 120N is measured as T out , T outIt is also provided to the corresponding smart valves 122A to 122N.

[0048] As will be described in detail below, based on the measured T of each of the processing components 120A to 120N in and T out , the corresponding smart valves 122A to 122N function to dynamically control the individual liquid flow rates of each of the rack-mounted process components to balance and maintain an optimal temperature difference ΔT between the supplied cooling / recooled liquid and the returned heated liquid of the system 100. Maintaining this optimal temperature difference ΔT increases the efficiency of the cooling system.

[0049] Regarding this, Figure 2A A flow chart of an initialization process 200 for controlling and balancing a liquid cooling system for rack-mounted processing components according to a non-limiting embodiment of the present technology is shown. In some embodiments, the initialization process 200, or portions thereof, will be performed by individual rack-mounted processing components that are directly connected to the smart valves 122A to 122N, respectively. In other embodiments, the initialization process 200, or portions thereof, may be performed by a master control unit that is communicatively coupled to each of the individual rack-mounted processing components. For purposes of this disclosure, the exact entity that performs the initialization process is not limited by the concepts provided with respect to this disclosure.

[0050] Thus, the initialization process 200 begins at task block 202, where each of the smart valves 122A to 122N for all of the rack-mounted processing components 120A to 120N is opened. At task block 204, for each individual rack-mounted processing component 120A to 120N, the process 200 performs an operation on the liquid flow rate V of the rack-mounted component, the temperature T of the heated liquid flowing out of the rack-mounted component, and the temperature of the heated liquid flowing out of the rack-mounted component. out , and the temperature T of the cooling liquid entering the rack-mounted components 120A to 120N in Take measurements.

[0051] At decision block 206, process 200 determines whether the temperature difference ΔT between the incoming cooling liquid and the outgoing heated liquid is within the range of target temperature X°K ± tolerance value Z°K. If the temperature difference ΔT is not within the range of target temperature X°K ± tolerance value Z°K, then at decision block 208, a determination is made as to whether the temperature difference ΔT is greater than the tolerance target temperature X°K ± Z°K, and if the temperature difference ΔT is greater than the tolerance target temperature X°K ± Z°K, process 200 determines that the liquid flow rate V is insufficient, and issues an alarm message and exits the process. The tolerance target temperature X°K ± Z°K is directly related to the optimal temperature difference ΔT, thereby improving the efficiency of the cooling system.

[0052] However, if at decision block 208, it is determined that the temperature difference ΔT is not greater than the target temperature X°K±Z°K, then at task block 210 the liquid flow rate V is reduced by a predetermined value to V'. The predetermined reduction and increase values ​​may be based on a percentage of the total flow or on a quantitative basis of liters / min per kW. At decision block 212, it is determined whether the reduced liquid flow rate V' is less than a predetermined minimum liquid flow rate V min If the reduced liquid flow rate V' is not less than the predetermined minimum liquid flow rate V min , the process 200 returns to task block 204 to adjust the liquid flow rate V', the temperature T of the heated liquid out and the temperature of the cooling liquid T in If at decision block 212, it is determined that the reduced liquid flow rate V' is less than the minimum liquid flow rate V min , the liquid flow rate V' is increased by a predetermined value to V", and is directed to decision block 216 to be explained below.

[0053] Returning to decision block 206 , if it is determined that the temperature difference ΔT is equal to the tolerance target temperature X°K±Z°K, the process 200 proceeds to decision block 216 to adjust the temperature T of the cooling liquid. in For certain internal temperature indicators of the rack-mounted processing components 120A to 120N (such as, for example, the airflow temperature T air and the processing component temperature T chip ) is less than a predetermined lower temperature limit, and if certain internal temperature indicators of the rack-mounted processing components 120A to 120N (such as, for example, the airflow temperature T air and the processing component temperature T chip ) is less than a predetermined lower temperature limit, then at task block 218 the liquid flow rate V is reduced by a predetermined value to V'.

[0054] The process 200 then proceeds to decision block 220 to determine whether the reduced liquid flow rate V' is less than a predetermined minimum liquid flow rate V minOr whether the temperature difference ΔT is greater than the tolerance target X°K±Z°K plus the acceptable offset temperature Y°K. If any of these conditions are met, the process 200 moves to task block 222 to increase the liquid flow rate V by a predetermined value to V″, and then exits the process 200.

[0055] If none of the conditions in decision block 220 are met, process 200 returns to decision block 216, which again determines the temperature T. in Certain internal temperature indicators (such as T air and T chip ) is less than a predetermined lower temperature limit, and if certain internal temperature indicators of the rack-mounted processing components 120A to 120N (such as T air and T chip ) is less than the predetermined lower temperature limit, the process 200 loops through blocks 218, 220, and 222. However, if none of the conditions in decision block 216 are met, the process 200 proceeds to block 224 to increase the liquid flow rate V by a predetermined value to V" and moves to decision block 226.

[0056] At decision block 226, a determination is made as to whether the increased flow rate V" is the same as the liquid flow rate V. If the increased flow rate V" is the same as the liquid flow rate V, the process 200 determines that the liquid flow rate V" is insufficient, issues an alarm message and exits the process. However, if the increased flow rate V" is different from the liquid flow rate V, the process 200 loops back to decision block 216.

[0057] In this manner, the process 200 initializes the system 100 to calibrate each of the smart valves 122A to 122N corresponding to each of the rack-mounted processing components 120A to 120N to balance the liquid flow rate and temperature to maintain an optimal temperature difference ΔT between the supplied cooled / recooled liquid and the returned heated liquid to achieve maximum cooling efficiency.

[0058] Figure 2B A flow chart of an operational process 250 for controlling and balancing a liquid cooling system for rack-mounted processing components according to a non-limiting embodiment of the present technology is shown. In some embodiments, the operational process 250, or portions thereof, will be performed by individual rack-mounted processing components that are directly connected to the smart valves 122A to 122N, respectively. In other embodiments, the operational process 250, or portions thereof, may be performed by a master control unit that is communicatively coupled to each of the individual rack-mounted processing components. For purposes of this disclosure, the exact entity that performs the initialization process is not limited by the concepts provided with respect to this disclosure.

[0059] Operational process 250 begins at task block 252 where, for each individual rack-mounted processing component 120A to 120N, the liquid flow rate V to the rack-mounted component, the temperature T of the heated liquid flowing out of the rack-mounted component, and the temperature T of the heated liquid flowing out of the rack-mounted component are determined. out , and the temperature T of the cooling liquid entering the rack-mounted components 120A to 120N in Take measurements.

[0060] The process 250 then moves to decision block 254, where a determination is made as to whether the temperature difference ΔT between the incoming cooling liquid and the outgoing heated liquid is within the range of the target temperature X°K±tolerance value Z°K. If the temperature difference ΔT is not within the range of the target temperature X°K±tolerance value Z°K, decision block 256 determines whether the temperature difference ΔT is greater than the tolerance target temperature X°K±Z°K, and if the temperature difference ΔT is greater than the tolerance target temperature X°K±Z°K, the liquid flow rate V is increased by a predetermined value to V". Then, decision block 260 determines whether the increased flow rate V" is the same as the liquid flow rate V, and if the increased flow rate V" is the same as the liquid flow rate V, the process 250 determines that the liquid flow rate V" is insufficient, and issues an alarm message and exits the process. However, if V" is different from the liquid flow rate V, the process 250 returns to decision block 254.

[0061] Returning to decision block 256, if it is determined that the temperature difference ΔT is not greater than the tolerance target temperature X°K±Z°K, the process 250 reduces the liquid flow rate V by a predetermined value to V' at task block 262, and then determines whether the reduced liquid flow rate V' is less than a predetermined minimum liquid flow rate V at decision block 264. min The predetermined minimum liquid flow rate V min Configured to prevent laminar flow within the internal channelized liquid circulating within the water block, to limit the accumulation of debris or mineral deposits within the water block, and / or to prevent overheating within the channels.

[0062] If decision block 264 determines that V' is not less than V min , the process 250 returns to task block 252 to adjust the V, T of the rack-mounted component. in and T out If decision block 264 determines that V' is less than V min , the process 250 proceeds to task block 266 to increase the liquid flow rate V by a predetermined value to V".

[0063] Returning to decision block 254 , if it is determined that the temperature difference ΔT is within the range of the target temperature X°K ± the tolerance value Z°K, the process 250 proceeds to decision block 268 to determine the temperature T of the cooling liquid.in For certain internal temperature indicators of the rack-mounted processing components 120A to 120N (such as, for example, the airflow temperature T air and the processing component temperature T chip ) is less than a predetermined lower temperature limit. air and T chip If the temperature is not less than the predetermined lower temperature limit, then at task 270, process 250 issues a warning message indicating that high temperature may exist within rack-mounted processing components 120A to 120N. Then, at task block 272, the liquid flow rate V is increased by a predetermined value to V".

[0064] On the other hand, if decision block 268 determines that the airflow temperature T air and the processing component temperature T chip If the temperature is less than the predetermined lower limit, the process 250 proceeds to task block 274 to reduce the liquid flow rate V to a predetermined value V'. Then, decision block 276 determines whether the reduced liquid flow rate V' is less than the predetermined minimum liquid flow rate V min Or whether the temperature difference ΔT is greater than the tolerance target temperature X°K±Z°K plus the acceptable offset temperature Y°K. If neither of these conditions is met, the process 250 loops back to decision block 268. However, if any of these conditions is met, the process 250 moves to task 278 to increase the liquid flow rate V by a predetermined value to V", and then exits the process.

[0065] In this manner, the process 250 functions to control and balance the liquid flow rate provided by each of the smart valves 122A to 122N corresponding to each of the rack-mounted process components 120A to 120N during operation to maintain an optimal temperature difference ΔT between the supplied cooled / recooled liquid and the returned heated liquid to achieve maximum cooling efficiency.

[0066] Although the implementation described above has been described and illustrated with reference to specific steps performed in a specific order, it should be understood that these steps can be combined, subdivided, or reordered without departing from the teachings of the present technology. At least some of the steps can be performed in parallel or in series. Therefore, the order and grouping of steps are not limitations of the present technology.

[0067] Modifications and improvements to the embodiments of the present technology described above will be apparent to those skilled in the art. The foregoing description is intended to be exemplary and not limiting. Therefore, the scope of the present technology is intended to be limited solely by the scope of the appended claims.

Claims

1. A liquid cooling method (200, 250) for a rack-mounted processing component (120A-120N), the liquid cooling method (200, 250) comprising: providing a dry cooling unit (110) for supplying cooling liquid to the rack-mounted processing components and receiving heated liquid from the rack-mounted processing components; providing a first liquid distribution circuit (115) for conveying the cooling liquid from the dry cooling unit to the rack-mounted processing components; and providing a second liquid distribution circuit (125) for conveying the heated liquid from the rack-mounted processing components to the dry cooling unit; Each of the rack-mounted data processing components (120A-120N) comprises: at least one heat generating electronic processing element and at least one liquid cooling block disposed in thermal contact with the at least one heat generating electronic processing element, respectively, the at least one liquid cooling block being fluidly coupled to the first liquid distribution circuit to receive the cooling liquid and circulate the cooling liquid through the at least one liquid cooling block, and smart control valves (122A-122N) respectively arranged to be fluidly coupled to at least one liquid cooling block of a corresponding rack-mounted data processing component, the smart control valves being configured to be pressure independent and to control a flow rate of the cooling fluid of the corresponding rack-mounted data processing component based on detected temperature and pressure flow; Each intelligent control valve is operated to perform an initialization process (200), wherein the initialization process (200) comprises: measuring a liquid flow rate, an input cooling liquid temperature, and an output heated liquid temperature of the corresponding rack-mounted data processing component, and calculating a temperature difference between the input cooling liquid temperature and the output heated liquid temperature (204); determining a relationship between the temperature difference and a target temperature value (206); and Prior to operation, initializing the liquid flow rate of the smart control valve based on the determined relationship (210, 214, 218, 222, 224); and Each intelligent control valve is operated to perform an operation process (250), wherein the operation process (250) includes: measuring a current liquid flow rate, a current input cooling liquid temperature, and a current output heated liquid temperature of the corresponding rack-mounted data processing component, and calculating a current temperature difference between the current input cooling liquid temperature and the current output heated liquid temperature (252); Determine the relationship between the current temperature difference and the target temperature value (254, 256); and The liquid flow rate of the smart control valve is dynamically adjusted based on the determined relationship and the current liquid flow rate and the current input cooling liquid temperature (258, 262, 266, 272, 274, 278).

2. The liquid cooling method according to claim 1, wherein: The initialization process (200) further comprises: when the temperature difference is greater than the target temperature value, issuing an alarm message indicating that the liquid flow rate of the corresponding intelligent control valve is insufficient.

3. The liquid cooling method according to claim 1, wherein: The initialization process (200) further includes: when the temperature difference is less than the target temperature value, reducing the liquid flow rate of the corresponding intelligent control valve, and then confirming that the reduced flow rate is not less than a minimum flow rate limit (210, 212).

4. The liquid cooling method according to claim 1, wherein: The initialization process (200) further includes: when the temperature difference is equal to the target temperature value (206), determining (216) whether the internal temperature of the rack-mounted processing component is less than a predetermined lower temperature limit at the input cooling liquid temperature, and When the internal temperature is less than the predetermined lower temperature limit, reducing the liquid flow rate of the corresponding intelligent control valve (218); and When the internal temperature is greater than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is increased (224).

5. The liquid cooling method according to claim 1, wherein: The operation process (250) further includes: when the current temperature difference is greater than the target temperature value, increasing the liquid flow rate of the corresponding intelligent control valve (258).

6. The liquid cooling method according to claim 5, wherein: The operation process (250) further includes: when the increased liquid flow rate is the same as the current flow rate, issuing an alarm message (260) indicating that the liquid flow rate of the corresponding intelligent control valve is insufficient.

7. The liquid cooling method according to claim 5, wherein: The operation process (250) also includes: when the current temperature difference is less than the target temperature value, reducing the liquid flow rate of the corresponding intelligent control valve, and then confirming that the reduced flow rate is not lower than the minimum flow rate limit (262, 264).

8. The liquid cooling method according to claim 5, wherein: The operation (250) further includes determining (268) whether the internal temperature of the rack-mounted processing component is less than a predetermined lower temperature limit at the current input cooling liquid temperature when the current temperature difference is equal to the target temperature value, and When the internal temperature is less than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is reduced (274), and then a check is performed to see whether the reduced flow rate is lower than the minimum flow rate limit or whether the current temperature difference is greater than the target temperature plus the offset temperature (276).

9. The liquid cooling method according to claim 8, wherein: The operation process (250) also includes: when the reduced flow rate is lower than the minimum flow rate limit or the current temperature difference is greater than the target temperature plus the offset temperature (276), increasing (278) the current liquid flow rate of the corresponding intelligent control valve.

10. The liquid cooling method according to claim 8, wherein: The operation process (250) also includes: for the current input cooling liquid temperature, when the internal temperature of the rack-mounted processing component is greater than a predetermined lower temperature limit (268), issuing a warning message indicating a possible high temperature trend, and increasing the current liquid flow rate of the corresponding intelligent control valve (272).

11. A liquid cooling system (100) for a rack-mounted processing component (120A-120N), the liquid cooling system (100) comprising: a dry cooling unit (110) configured to supply cooling liquid to the rack-mounted processing components and to receive heated liquid from the rack-mounted processing components; a first liquid distribution circuit (115) configured to deliver the cooling liquid from the dry cooling unit to the rack-mounted processing components, the first liquid distribution circuit (115) comprising a pump (112) configured to drive the flow of the cooling liquid supplied by the dry cooling unit; a second liquid distribution circuit (125) configured to deliver the heated liquid from the rack-mounted processing assembly to the dry cooling unit; Each of the rack-mounted data processing components (120A-120N) comprises: at least one heat generating electronic processing component, at least one liquid cooling block disposed in thermal contact with the at least one heat generating electronic processing element, respectively, the at least one liquid cooling block being fluidly coupled to the first liquid distribution circuit to receive the cooling liquid and circulate the cooling liquid through the at least one liquid cooling block, and smart control valves (122A-122N) respectively arranged to be fluidly coupled to at least one liquid cooling block of a corresponding rack-mounted data processing component, the smart control valves being configured to be pressure independent and to control a flow rate of the cooling fluid of the corresponding rack-mounted data processing component based on detected temperature and pressure flow; In the initialization mode (200), each intelligent control valve operates to: measuring the liquid flow rate, the input cooling liquid temperature, and the output heated liquid temperature of the corresponding rack-mounted data processing component, and calculating a temperature difference between the input cooling liquid temperature and the output heated liquid temperature (204), determining a relationship between the temperature difference and a target temperature value (206); and Prior to an operating mode, initializing the liquid flow rate of the smart control valve based on the determined relationship (210, 214, 218, 222, 224); and Wherein, in the operation mode (250), each intelligent control valve operates to: measuring a current liquid flow rate, a current input cooling liquid temperature, and a current output heated liquid temperature of the corresponding rack-mounted data processing component, and calculating a temperature difference between the current input cooling liquid temperature and the current output heated liquid temperature (252); The relationship between the temperature difference and the target temperature value is determined (254), and the liquid flow rate of the intelligent control valve is dynamically adjusted (258, 262, 266, 272, 274, 278) based on the determined relationship and the measured current liquid flow rate and the measured current input cooling liquid temperature.

12. The liquid cooling system according to claim 11, wherein: The initialization process (200) also includes: when the temperature difference is greater than the target temperature value, issuing an alarm message indicating that the liquid flow rate of the corresponding intelligent control valve is insufficient, and when the temperature difference is less than the target temperature value, reducing the liquid flow rate of the corresponding intelligent control valve, and then confirming that the reduced flow rate is not lower than the minimum flow rate limit (210, 212).

13. The liquid cooling system according to claim 11, wherein: The initialization process (200) further includes: when the temperature difference is equal to the target temperature value (206), determining (216) whether the internal temperature of the rack-mounted processing component is less than a predetermined lower temperature limit at the input cooling liquid temperature, and When the internal temperature is less than the predetermined lower temperature limit, reducing the liquid flow rate of the corresponding intelligent control valve (218); and When the internal temperature is greater than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is increased (224).

14. The liquid cooling system according to claim 11, wherein: The operation process (250) also includes: In the case where the current temperature difference is greater than the target temperature value, increasing the liquid flow rate of the corresponding intelligent control valve (258), and if the increased liquid flow rate is the same as the current flow rate, issuing an alarm message indicating that the liquid flow rate of the corresponding intelligent control valve is insufficient (260); In the case where the current temperature difference is equal to the target temperature value, determining whether the internal temperature of the rack-mounted processing component at the current input cooling liquid temperature is less than a predetermined lower temperature limit (268); and When the internal temperature is less than the predetermined lower temperature limit, the liquid flow rate of the corresponding intelligent control valve is reduced (274), and then a check is performed to see whether the reduced flow rate is lower than the minimum flow rate limit or whether the current temperature difference is greater than the target temperature plus the offset temperature (276).

15. The liquid cooling system according to claim 14, wherein: The operation process (250) also includes: for the current input cooling liquid temperature, when the internal temperature of the rack-mounted processing component is greater than a predetermined lower temperature limit (268), issuing a warning message indicating a possible high temperature trend, and increasing the current liquid flow rate of the corresponding intelligent control valve (272).

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