Heat dissipation module and display equipment

Abstract

The invention relates to the field of display equipment, and discloses a heat dissipation module and display equipment, the heat dissipation module comprises a plurality of radiators, a plurality of heat conduction pipes, a heat conduction main body and a support, the support is used for being connected with an electronic element, and at least one heat conduction pipe is connected between the support and the heat conduction main body; the at least one radiator is arranged on one side, adjacent to the connecting side of the bracket, of the heat conduction trunk; at least one heat conduction pipe is connected between the heat conduction trunk and the radiator; cavities are formed in the heat conduction pipes, the cavities are filled with cooling liquid, and the liquid level height of the cooling liquid is smaller than the pipe diameter of the heat conduction pipes. When the cooling liquid reaches a first preset temperature, the cooling liquid is gasified to form cooling liquid steam; when the cooling liquid steam reaches a second preset temperature, the cooling liquid steam is liquefied, and the first preset temperature is higher than the second preset temperature. Therefore, the heat dissipation module can effectively dissipate heat which is rapidly and sharply increased in a short time.

Description

Technical Field

[0001] The present application relates to the field of display devices, and in particular to a heat dissipation module and a display device. Background Art

[0002] Current display devices usually use a cooling module that combines a fan with an aluminum fin welded heat sink for heat dissipation, and the heat dissipation capacity of the cooling module often depends on the heat dissipation performance of the cooling module itself.

[0003] However, a display device often has more than one system or one CPU to operate. For example, when high temperature is generated at the heat source position of dual systems or multiple chips, the heat dissipation module that only uses heat dissipation fins for heat dissipation is prone to reach the upper limit of heat dissipation capacity and cannot meet the heat dissipation demand of rapid temperature rise, which may cause the display device to freeze. Moreover, it only uses a single natural medium (for example, only relies on air to carry away heat), has low heat dissipation efficiency, and has high requirements on the environment. Under special environmental factors, such as in a windless or high-temperature external environment, the temperature difference between the inside and outside of the module is not large, and the heat dissipation effect is not ideal.

[0004] Therefore, how to enable the heat dissipation module to effectively dissipate the heat that rapidly increases in a short period of time has become a problem that urgently needs to be solved in this field. Summary of the invention

[0005] The present application discloses a heat dissipation module and a display device, the purpose of which is to enable the heat dissipation module to effectively dissipate heat that rapidly surges in a short period of time.

[0006] The embodiment of the present application discloses a heat dissipation module, which includes multiple radiators, multiple heat-conducting pipes, a heat-conducting trunk and a bracket, wherein the bracket is used to connect with electronic components, and at least one of the heat-conducting pipes is connected between the bracket and the heat-conducting trunk; at least one of the radiators is arranged on a side adjacent to the connection side of the heat-conducting trunk and the bracket; at least one of the heat-conducting pipes is connected between the heat-conducting trunk and the radiator; a cavity is formed inside the heat-conducting pipes, and the cavity is filled with coolant, and the liquid level of the coolant is less than the diameter of the heat-conducting pipe; when the coolant reaches a first preset temperature, it vaporizes to form coolant vapor; when the coolant vapor reaches a second preset temperature, it liquefies, and the first preset temperature is greater than the second preset temperature.

[0007] Optionally, the heat-conducting trunk is of an elongated strip type, and the heat-conducting pipe includes a first heat-conducting pipe and a second heat-conducting pipe, one end of the first heat-conducting pipe is connected to the bracket, and the other end is connected to the bottom surface of the heat-conducting trunk, and the extension direction of the first heat-conducting pipe is the same as the extension direction of the heat-conducting trunk, and the length of the connection part between the first heat-conducting pipe and the heat-conducting trunk is less than or equal to the length of the heat-conducting trunk; the second heat-conducting pipe is perpendicular to the heat-conducting trunk in the horizontal direction, one end of the second heat-conducting pipe is connected to the radiator, and the other end passes through the heat-conducting trunk and overlaps above the first heat-conducting pipe.

[0008] Optionally, the heat-conducting trunk is of an elongated strip type, and the heat-conducting pipe includes a first heat-conducting pipe and a second heat-conducting pipe, one end of the first heat-conducting pipe is connected to the bracket, and the other end is connected to the bottom surface of the heat-conducting trunk, and the extension direction of the first heat-conducting pipe is the same as the extension direction of the heat-conducting trunk, and the length of the connection part between the first heat-conducting pipe and the heat-conducting trunk is less than or equal to the length of the heat-conducting trunk; the second heat-conducting pipe is perpendicular to the heat-conducting trunk in the horizontal direction, one end of the second heat-conducting pipe is connected to the radiator, and the other end is connected to the first heat-conducting pipe.

[0009] Optionally, a slot is provided on the bottom surface of the heat-conducting trunk, the extension direction of the slot is the same as the extension direction of the heat-conducting trunk, and both ends of the slot have openings, the shape of the slot matches the shape of the first heat-conducting pipe, the first heat-conducting pipe is inserted into the slot, and partially exposes the bottom surface of the heat-conducting trunk.

[0010] Optionally, a plurality of barriers are arranged at intervals in the cavity of the heat pipe, and the plurality of barriers divide the cavity into a plurality of partitions, each of which is filled with coolant; and each of the barriers is provided with a through hole, which connects two adjacent partitions; the height of the coolant filling the partition is greater than one half of the height of the cavity and less than two thirds of the height of the cavity.

[0011] Optionally, the through holes on two adjacent barrier members are staggered, and the area of ​​the through holes is less than one quarter of the area of ​​the barrier member.

[0012] Optionally, the through hole is located at the lower part of the barrier member, and the height of the through hole arranged at the barrier member is less than half of the height of the barrier member.

[0013] Optionally, the heat pipe is of an elongated shape and includes a first end, a second end and a heat pipe body, wherein the first end and the second end are respectively located on both sides of the length direction of the heat pipe body, and the cross-sectional area of ​​at least one of the first end and the second end is smaller than the cross-sectional area of ​​the heat pipe body.

[0014] Optionally, a plurality of convex patterns are arranged at intervals on the outer side of the heat pipe body, and the plurality of convex patterns extend along the length direction of the heat pipe body, with a gap formed between two adjacent convex patterns.

[0015] An embodiment of the present application further discloses a display device, including a housing and a display panel, wherein the display panel is connected to the housing, and the display device further includes the above-mentioned heat dissipation module, wherein the heat dissipation module is disposed in the housing.

[0016] The present application has made improvements to the heat dissipation module, connecting the bracket and the heat-conducting trunk through a heat pipe. When the heat generated during the operation of the electronic component is transferred to the bracket, the bracket will transfer the heat to the heat-conducting trunk through the heat pipe. The heat-conducting trunk is used as the heat conduction center to quickly take the heat away from the heat source, avoiding the accumulation of heat near the electronic component, which causes the electronic component to overheat. At the same time, the heat-conducting trunk disperses the heat and transfers it to the radiator through the heat pipe. The radiator dissipates the heat to the external environment, forming the first effective heat dissipation. When the temperature of the electronic component rises sharply in a short period of time, the conventional heat dissipation capacity of the radiator reaches its upper limit, and the heat pipe The coolant inside continues to absorb heat. When the coolant absorbs heat and reaches the first preset temperature, the coolant is gasified into coolant steam, which further takes away heat to form a second heat dissipation. When the electronic components stop working and the coolant steam cools down to the second preset temperature, the coolant steam is re-liquefied into coolant and stored in the heat pipe for the next heat dissipation cycle. In this way, the first heat dissipation formed by the radiator and the second heat dissipation formed by the coolant inside the heat pipe, the heat dissipation module breaks through the heat dissipation limit of the radiator itself by utilizing the heat dissipation combination of two different methods, effectively dissipates the heat that rapidly increases in the display device in a short time, and improves the overall heat dissipation capacity of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 A schematic diagram of a first embodiment of the heat dissipation module of the present application;

[0019] Figure 2 A schematic diagram of a heat pipe in a first embodiment of the heat dissipation module of the present application;

[0020] Figure 3A partial front view of the first heat conducting pipe and the second heat conducting pipe in the second embodiment of the heat dissipation module of the present application;

[0021] Figure 4 A schematic diagram of a third embodiment of the heat dissipation module of the present application;

[0022] Figure 5 A partial front view of a fourth embodiment of the heat dissipation module of the present application;

[0023] Figure 6 A schematic diagram of a heat pipe in a fifth embodiment of the heat dissipation module of the present application;

[0024] Figure 7 A schematic diagram of a heat pipe in a sixth embodiment of the heat dissipation module of the present application;

[0025] Figure 8 A schematic diagram of a heat pipe body of a heat pipe in a seventh embodiment of the heat dissipation module of the present application;

[0026] Fig. 9 A schematic diagram of a heat pipe in an eighth embodiment of the heat dissipation module of the present application;

[0027] Fig.10 A partial front view of a ninth embodiment of the heat dissipation module of the present application;

[0028] Fig.11 A schematic diagram of a first embodiment of a display device of the present application;

[0029] Fig.12 It is a partial front view of a second embodiment of the display device of the present application.

[0030] Among them, 10, display device; 100, heat dissipation module; 110, heat pipe; 111, cavity; 112, coolant; 113, first heat pipe; 114, second heat pipe; 115, first end; 116, second end; 117, heat pipe body; 118, convex pattern; 119, gap; 120, heat conduction trunk; 121, slot; 122, opening; 130, bracket; 140, radiator; 141, heat dissipation fin; 142, fin hole; 150, heat spreader; 151, first opening; 190, waterproof layer; 200, shell; 210, cover; 220, heat dissipation hole; 300, electronic component; 400, display panel; 500, barrier; 510, partition; 511, through hole. DETAILED DESCRIPTION

[0031] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0032] Figure 1 is a schematic diagram of a first embodiment of the heat dissipation module of the present application, Figure 2 Schematic diagram of the heat pipe in the first embodiment of the heat dissipation module of the present application, as shown Figure 1 and Figure 2 As shown, the present application discloses a heat dissipation module 100, which includes a plurality of heat sinks 140, a plurality of heat pipes 110, a heat-conducting trunk 120 and a bracket 130, wherein the bracket 130 is used to connect with the electronic component 300, and at least one heat pipe 110 is connected between the bracket 130 and the heat-conducting trunk 120; at least one heat sink 140 is arranged on a side adjacent to the connection side of the heat-conducting trunk 120 and the bracket 130; at least one heat pipe 110 is connected between the heat-conducting trunk 120 and the heat sink 140; a cavity 111 is formed inside the heat-conducting tubes 110, and the cavity 111 is filled with a coolant 112, and the liquid level of the coolant 112 is less than the diameter of the heat-conducting tube 110; when the coolant 112 reaches a first preset temperature, it is vaporized to form coolant vapor; when the coolant vapor reaches a second preset temperature, it is liquefied, and the first preset temperature is greater than the second preset temperature.

[0033] The present application makes improvements to the heat dissipation module 100, and connects the bracket 130 with the heat-conducting trunk 120 through the heat-conducting pipe 110. When the heat generated during the operation of the electronic component 300 is transferred to the bracket 130, the bracket 130 will transfer the heat to the heat-conducting trunk 120 through the heat-conducting pipe 110, and use the heat-conducting trunk 120 as the hub of heat conduction to quickly take the heat away from the heat source, so as to avoid the accumulation of heat near the electronic component 300, resulting in the occurrence of excessive temperature of the electronic component 300; at the same time, the heat-conducting trunk 120 will disperse the heat and transfer it to the radiator 140 through the heat-conducting pipe 110, and use the radiator 140 to dissipate the heat to the external environment, forming the first effective heat dissipation; and when the temperature of the electronic component 300 rises sharply in a short period of time, the conventional heat dissipation capacity of the radiator 140 reaches The upper limit is reached, and the coolant 112 in the heat pipe 110 continues to absorb heat. When the coolant 112 absorbs heat and reaches the first preset temperature, the coolant 112 is gasified into coolant steam, which further takes away heat and forms a second heat dissipation. When the electronic component 300 stops working and the coolant steam is cooled to reach the second preset temperature, the coolant steam is reliquefied into coolant 112 and stored in the heat pipe 110 for the next heat dissipation cycle. In this way, the first heat dissipation formed by the radiator 140 and the second heat dissipation formed by the coolant 112 in the heat pipe 110, the heat dissipation module 100 breaks through the heat dissipation limit of the radiator 140 itself by utilizing two different heat dissipation combinations, effectively dissipates the heat that rapidly surges in the display device 10 in a short time, and improves the overall heat dissipation capacity of the heat dissipation module 100.

[0034] Specifically, the coolant 112 is made of an alkyl fluoride material, and the boiling point of the coolant 112 is between 55° C. and 65° C.

[0035] The coolant 112 in the present application uses an alkyl fluoride (HFC), and the common ones are R404A, R410A, R407C, and R407B, which are obtained by diluting and surface treating one or more of the mixtures, and are not ordinary water-cooled liquids; the coolant 112 in the present application has the characteristics of low corrosivity, low viscosity, high insulation, non-toxic and odorless, high volatility, high specific gravity, low surface tension, low boiling point, non-flammability, high thermal stability and chemical stability, and its boiling point range is 55°C to 65°C, which is close to the high temperature range reached by the electronic component 300. Therefore, when the temperature of the electronic component 300 suddenly rises in a short period of time, the coolant 112 can be used to further absorb heat for vaporization when the radiator 140 of the heat dissipation module 100 reaches the heat dissipation limit, and take away the heat generated by the electronic component 300, effectively reduce the temperature of the electronic component 300, and improve the heat dissipation performance of the heat dissipation module 100.

[0036] It should be noted that the first preset temperature in the present application can be determined according to the actual boiling point of the coolant 112 , and the second preset temperature can be determined according to the critical temperature of the coolant 112 .

[0037] The heat-conducting trunk 120 in the present application is long and made of a metal heat-conducting material. The heat-conducting pipe 110 includes a first heat-conducting pipe 113 and a second heat-conducting pipe 114. One end of the first heat-conducting pipe 113 is connected to the bracket 130, and the other end is connected to the bottom surface of the heat-conducting trunk 120. The extension direction of the first heat-conducting pipe 113 is the same as the extension direction of the heat-conducting trunk 120. The length of the connecting portion between the first heat-conducting pipe 113 and the heat-conducting trunk 120 is less than or equal to the length of the heat-conducting trunk 120; the second heat-conducting pipe 114 is perpendicular to the heat-conducting trunk 120 in the horizontal direction, one end of the second heat-conducting pipe 114 is connected to the radiator 140, and the other end passes through the heat-conducting trunk 120 and overlaps above the first heat-conducting pipe 113.

[0038] When the heat generated during the operation of the electronic component 300 is transferred to the bracket 130, the bracket 130 will transfer the heat to the heat-conducting trunk 120 through the first heat-conducting pipe 113, and the long heat-conducting trunk 120 is extended in a direction away from the electronic component 300 to quickly take the heat away from the heat source, thereby avoiding the accumulation of heat near the electronic component 300, which may cause the temperature of the electronic component 300 to be too high. When the length of the connecting part between the first heat-conducting pipe 113 and the heat-conducting trunk 120 is equal to the length of the heat-conducting trunk 120, the first heat-conducting pipe 113 and the heat-conducting trunk 120 can achieve overall heat conduction. , further enhancing the uniformity of heat conduction of the first heat pipe 113 to the heat conducting trunk 120, and quickly transferring heat to various positions of the heat conducting trunk 120, so that the heat conducting trunk 120 forms the heat transfer center; and because the second heat conducting tube 114 runs through the heat conducting trunk 120 and is connected to the top of the first heat conducting tube 113, the heat of the first heat conducting tube 113 can be directly transferred to the second heat conducting tube 114 through the heat conducting trunk 120, effectively avoiding heat loss between the heat conducting trunk 120, the first heat conducting tube 113 and the second heat conducting tube 114. At the same time, the heat conducting trunk 120 transfers the heat The heat is dispersedly transferred to the radiator 140 through the second heat pipe 114, and the radiator 140 dissipates the heat to the external environment, forming the first effective heat dissipation; when the temperature of the electronic component 300 rises sharply in a short period of time, the conventional heat dissipation capacity of the radiator 140 reaches the upper limit, and the coolant 112 in the first heat pipe 113 and the second heat pipe 114 continues to absorb heat. When the heat absorbed by the coolant 112 reaches the first preset temperature, the coolant 112 gasifies into coolant steam, further taking away the heat, forming the second heat dissipation. When the electronic component 300 stops working, the coolant steam When the steam temperature drops to a second preset temperature, the coolant vapor is reliquefied into coolant 112 and stored in the first heat pipe 113 and the second heat pipe 114 to be used in the next heat dissipation cycle. In this way, the first heat dissipation formed by the radiator 140 and the second heat dissipation formed by the coolant 112 inside the first heat pipe 113 and the second heat pipe 114, the heat dissipation module 100 breaks through the heat dissipation limit of the radiator 140 itself by utilizing two different heat dissipation combinations, effectively dissipates the heat of the display device 10 that rapidly increases in a short time, and improves the overall heat dissipation capacity of the heat dissipation module 100.

[0039] Furthermore, in the present application, the diameter of the first heat pipe 113 ranges from 6 mm to 10 mm, and the diameter of the second heat pipe 114 ranges from 4 mm to 8 mm. The diameter of the first heat pipe 113 is larger than the diameter of the second heat pipe 114 .

[0040] Since the heat pipe 110 is a key component that affects heat transfer, the thicker the heat pipe 110 is and the more the number is, the better the heat transfer and heat dissipation effect is. The heat-conducting trunk 120 is the center of heat transfer, and the heat will be more concentrated, and the required heat dissipation demand is relatively large. The radiator 140 mainly dissipates heat through the heat dissipation fins 141. The heat-conducting pipe 110 is mainly used to transfer heat between the heat-conducting trunk 120 and the radiator 140; therefore, in this embodiment, two different specifications of heat-conducting pipe 110 designs are adopted, and the first heat-conducting pipe 113 with a larger diameter is connected between the bracket 130 and the heat-conducting trunk 120, and the second heat-conducting pipe 114 with a smaller diameter is connected between the heat-conducting trunk 120 and the radiator 140.

[0041] Specifically, two first heat pipes 113 with a diameter of 8 mm can be used to connect between the bracket 130 and the heat-conducting trunk 120. When the heat generated by the electronic component 300 is transferred to the bracket 130, the first heat pipe 113 can quickly transfer the heat of the bracket 130 to the heat-conducting trunk 120, so that the heat can quickly move away from the heat source to avoid accumulation near the electronic component 300 to form a high temperature. Then, multiple second heat pipes 114 with a diameter of 6 mm are evenly arranged on the heat-conducting trunk 120 and connected to the radiator 140. The heat on the heat-conducting trunk 120 is evenly transferred to the radiator 140 through the multiple second heat pipes 114, and finally dissipated to the external environment through the radiator 140.

[0042] In addition, since the diameter of the first heat pipe 113 is relatively large, the first heat pipe 113 can accommodate more coolant 112; when the temperature of the electronic component 300 rises sharply in a short period of time, the coolant 112 in the first heat pipe 113 continues to absorb heat. When the coolant 112 absorbs heat and reaches the first preset temperature, more coolant 112 is vaporized into coolant steam, further taking away heat, effectively reducing the heat conduction load and heat dissipation pressure of the first heat pipe 113. When the heat of the electronic component 300 that surges rapidly in a short period of time is transferred to the heat conduction trunk 120, the combination of heat pipes 110 of different specifications can be used to adapt to the module structure with different heat dissipation requirements in the heat dissipation module 100, so as to achieve the overall heat dissipation uniformity of the heat dissipation module 100 and improve the overall heat dissipation efficiency of the heat dissipation module 100.

[0043] Figure 3 FIG. 1 is a partial schematic diagram of the first heat conducting pipe and the second heat conducting pipe in the second embodiment of the heat dissipation module of the present application. Figure 3 As shown, Figure 3 The illustrated embodiment is based on Figure 1The improvement is that the heat-conducting trunk 120 is long and strip-shaped, and the heat-conducting pipe 110 includes a first heat-conducting pipe 113 and a second heat-conducting pipe 114. One end of the first heat-conducting pipe 113 is connected to the bracket 130, and the other end is connected to the bottom surface of the heat-conducting trunk 120. The extension direction of the first heat-conducting pipe 113 is the same as the extension direction of the heat-conducting trunk 120. The length of the connecting part of the first heat-conducting pipe 113 and the heat-conducting trunk 120 is less than or equal to the length of the heat-conducting trunk 120; the second heat-conducting pipe 114 is perpendicular to the heat-conducting trunk 120 in the horizontal direction, and one end of the second heat-conducting pipe 114 is connected to the radiator 140, and the other end is connected to the first heat-conducting pipe 113.

[0044] The present embodiment is different from the previous embodiment in that, in the present embodiment, the first heat conducting pipe 113 and the second heat conducting pipe 114 are connected to each other, that is, the cooling liquid 112 in the first heat conducting pipe 113 and the cooling liquid 112 in the second heat conducting pipe 114 are common.

[0045] When the heat generated during the operation of the electronic component 300 is transferred to the bracket 130, the bracket 130 will transfer the heat to the heat-conducting trunk 120 through the first heat-conducting pipe 113, and at the same time transfer the heat to the second heat-conducting pipe 114, and then use the heat-conducting trunk 120 and the second heat-conducting pipe 114 to disperse the heat and transfer it to the radiator 140, and use the radiator 140 to dissipate the heat to the external environment, forming the first effective heat dissipation, and further improving the heat transfer rate in the heat dissipation module 100; and when the temperature of the electronic component 300 rises sharply in a short period of time, the conventional heat dissipation capacity of the radiator 140 reaches the upper limit, and the first heat-conducting pipe 114 is used to transfer the heat to the heat sink 140. The cooling liquid 112 in the first heat pipe 113 and the second heat pipe 114 continues to absorb heat at the same time. When the cooling liquid 112 absorbs heat and reaches a first preset temperature, the cooling liquid 112 vaporizes into cooling liquid steam, further taking away heat to form a second heat dissipation. In this way, the first heat dissipation formed by the radiator 140 and the second heat dissipation formed by the cooling liquid 112 in the first heat pipe 113 and the second heat pipe 114, the heat dissipation module 100 breaks through the heat dissipation limit of the radiator 140 itself by utilizing two different heat dissipation combinations, effectively dissipates the heat that rapidly increases in a short time from the display device 10, and improves the overall heat dissipation capacity of the heat dissipation module 100.

[0046] Figure 4 Schematic diagram of the third embodiment of the heat dissipation module of the present application, as shown Figure 4 As shown, the radiator 140 includes a plurality of cooling fins 141, the plurality of cooling fins 141 are arranged at intervals, each cooling fin 141 is provided with a fin hole 142, and the fin holes 142 on two adjacent cooling fins 141 are arranged opposite to each other; the second heat pipe 114 passes through the fin holes 142 arranged opposite to each other on the plurality of cooling fins 141 in sequence, and is connected to the plurality of cooling fins 141.

[0047] In this embodiment, the second heat pipe 114 is used to pass through the fin holes 142 on the multiple heat dissipation fins 141 in sequence, so that the second heat pipe 114 is connected to the multiple heat dissipation fins 141, and is in direct contact with the heat dissipation fins 141 that mainly play a heat dissipation effect in the heat dissipation module 100. When the second heat pipe 114 conducts the heat on the heat conduction trunk 120 to the radiator 140, the heat of the second heat pipe 114 is directly conducted to the heat dissipation fins 141, and the heat is dissipated through the heat dissipation fins 141, thereby further improving the heat dissipation effect.

[0048] In addition, since the second heat pipe 114 is in direct contact with the heat dissipation fins 141, when the heat dissipation capacity of the heat dissipation fins 141 reaches an upper limit, the second heat pipe 114 can more accurately sense the temperature change of the heat dissipation fins 141. When the heat dissipation fins 141 reach the upper limit of heat dissipation and the temperature thereof suddenly rises in a short period of time, the coolant 112 in the second heat pipe 114 further absorbs heat and vaporizes to form coolant vapor to take away heat, thereby forming secondary heat dissipation, effectively reducing the temperature of the heat dissipation fins 141, and helping to restore the continuous heat dissipation capacity of the heat dissipation fins 141.

[0049] Figure 5 Schematic diagram of a fourth embodiment of the heat dissipation module of the present application, such as Figure 5 As shown, a slot 121 is provided on the bottom surface of the heat-conducting trunk 120, the extension direction of the slot 121 is the same as the extension direction of the heat-conducting trunk 120, and both ends of the slot 121 have openings 122, the shape of the slot 121 matches the shape of the first heat-conducting pipe 113, the first heat-conducting pipe 113 is inserted into the slot 121, and partially exposes the bottom surface of the heat-conducting trunk 120.

[0050] In this embodiment, by providing a slot 121 on the bottom surface of the heat-conducting trunk 120, when installing the first heat-conducting pipe 113 and the heat-conducting trunk 120, it is only necessary to insert the first heat-conducting pipe 113 into the slot 121, so that an embedded fixing mode is formed between the first heat-conducting pipe 113 and the heat-conducting trunk 120, which is convenient for installation and simple for disassembly; and after a part of the first heat-conducting pipe 113 is embedded in the slot 121, the other part is exposed to the bottom surface of the heat-conducting trunk 120, so that a sufficient part of the first heat-conducting pipe 113 can be in contact with the air, and the air under the heat-conducting trunk 120 can be used to quickly take away the heat of the first heat-conducting pipe 113, so as to effectively reduce the temperature of the first heat-conducting pipe 113 and ensure the efficiency of heat conduction of the first heat-conducting pipe 113.

[0051] Furthermore, since part of the first heat pipe 113 is embedded in the heat-conducting trunk 120, there is a larger contact area between the heat-conducting trunk 120 and the first heat pipe 113, and most of the heat of the first heat pipe 113 can be directly transferred to the heat-conducting trunk 120, further improving the heat conduction efficiency of the first heat pipe 113 and avoiding heat loss. The first heat pipe 113 can effectively concentrate most of the heat through the heat-conducting trunk 120, and then transfer it to each radiator 140 through the heat-conducting trunk 120. The radiator 140 finally dissipates the heat to the environment, further improving the overall heat dissipation efficiency of the heat dissipation module 100.

[0052] Figure 6 Schematic diagram of the heat pipe in the fifth embodiment of the heat dissipation module of the present application. Figure 6 As shown, a cavity 111 is formed inside the heat pipe 110, and a plurality of barrier members 500 are arranged at intervals in the cavity 111. The plurality of barrier members 500 divide the cavity 111 into a plurality of partitions 510, and each partition 510 is filled with coolant 112; and each barrier member 500 is provided with a through hole 511, and the through hole 511 connects two adjacent partitions 510, and the height of the partition 510 filled with the coolant 112 is greater than one half of the height of the cavity 111 and less than two thirds of the height of the cavity 111.

[0053] The present application divides the cavity 111 of the heat pipe 110 into a plurality of partitions 510 by arranging a plurality of barriers 500 at intervals in the cavity 111 of the heat pipe 110, and uses the through holes 511 on each barrier 500 to connect two adjacent partitions 510, so that after the coolant 112 is filled into each partition 510 respectively, the coolant 112 as a whole is divided into a plurality of parts, and the coolant 112 in each partition 510 can only flow through the through holes 511. When the heat pipe 110 shakes, the coolant 112 in each partition 510 also shakes, and the coolant 112 in each partition 510 is restricted in its own partition 510 by the two adjacent barriers 500, which effectively reduces the shaking of the coolant 112 in the heat pipe 110. The space is filled with water, which reduces the shaking amplitude of the coolant 112. At the same time, the blocking member 500 is used to hinder the coolant 112 to prevent the coolant 112 from shaking excessively in the heat pipe 110. The coolant 112 in the two adjacent partitions 510 releases the impact force through the through hole 511 to form a damping effect, which effectively alleviates the impact force generated by the shaking of the coolant 112 in the two adjacent partitions 510, so that even when the heat pipe 110 shakes, the coolant 112 in the heat pipe 110 can remain relatively stable, and the amount of coolant 112 in each partition 510 is roughly the same. In this way, the heat dissipation efficiency of the heat pipe 110 can be improved while preventing the coolant 112 from shaking violently in the heat pipe 110, thereby ensuring the continuous heat dissipation stability of the coolant 112 in the heat pipe 110.

[0054] Specifically, the height d of the coolant 112 filling the partition 510 is greater than one-half of the height D of the cavity 111 and less than two-thirds of the height D of the cavity 111. The height D of the cavity 111 mentioned in the present application is actually the distance between the inner tube walls of the heat pipe 110 in the vertical direction.

[0055] That is, the coolant 112 in the present application does not completely fill the entire internal cavity 111 of the heat pipe 110, but leaves a portion of the space empty. This can effectively ensure that the coolant 112 can absorb heat in the heat pipe 110, thereby improving the heat dissipation capacity of the heat pipe 110, and will not expand or vaporize after absorbing heat, causing expansion pressure on the inside of the heat pipe 110, causing the heat pipe 110 to deform, thereby further improving the structural stability of the heat pipe 110.

[0056] Since the coolant 112 in the present application is not completely filled in the inner cavity 111 of the heat pipe 110, in order to ensure that the through hole 511 on the barrier 500 can always ensure that the coolant 112 in two adjacent partitions 510 can flow normally through the through hole 511 whether the heat pipe 110 is static or shaking, the present application also designs the through hole 511, as follows:

[0057] The barrier 500 is a plate-like structure, and may be a baffle or a baffle sheet. The through holes 511 on two adjacent barrier members 500 are staggered, and the area of ​​the through hole 511 is less than one quarter of the area of ​​the barrier 500 .

[0058] The area of ​​the through hole 511 is less than one quarter of the area of ​​the barrier 500, which is beneficial to control the size of the through hole 511 so that the through hole 511 can form a liquid damping effect through a suitable size without hindering the flow of the coolant 112 in the two adjacent partitions 510, thereby preventing the through hole 511 from being too large, which may cause the coolant 112 in the two adjacent partitions 510 to be unable to effectively alleviate the impact force when passing through the through hole 511, and cause the coolant 112 in the two adjacent partitions 510 to be shaken by the heat pipe 110. 的 If the difference in quantity is too large, the heat dissipation uniformity of the heat pipe 110 and the stability of continuous heat dissipation will be affected.

[0059] Furthermore, the through hole 511 is located at the lower part of the barrier 500, and the height of the through hole 511 set on the barrier 500 is less than half of the height of the barrier 500; wherein, the height of the through hole 511 set on the barrier 500 is the distance between the position of the through hole 511 on the barrier 500 and the bottom of the barrier 500.

[0060] When the through hole 511 is located at the lower part of the barrier 500 and is less than half the height of the barrier 500, it can ensure that the coolant 112 in the two adjacent partitions 510 can flow through the through hole 511 even when shaking occurs, and the through holes 511 on the two adjacent barrier members are staggered, so that the coolant 112 in the two adjacent partitions 510 will not form continuous impact at the through holes 511, and the through holes 511 can form a damping effect to alleviate the impact force generated by the shaking of the coolant 112 in the two adjacent partitions 510.

[0061] Figure 7 Schematic diagram of the heat pipe in the sixth embodiment of the heat dissipation module of the present application, as shown Figure 7As shown, the heat pipe 110 is long and includes a first end 115, a second end 116 and a heat pipe body 117. The first end 115 and the second end 116 are respectively located on both sides of the length direction of the heat pipe body 117. Among the first end 115 and the second end 116, the cross-sectional area of ​​at least one end is smaller than the cross-sectional area of ​​the heat pipe body 117.

[0062] In this embodiment, the cross-sectional area of ​​at least one of the first end 115 and the second end 116 of the heat pipe 110 is smaller than the cross-sectional area of ​​the heat pipe body 117, that is, at least one of the first end 115 and the second end 116 of the heat pipe 110 is made thinner than the heat pipe body 117. For example, the first end 115 is designed to be conical, similar to the structure of a pen tip, so that heat is not easily accumulated at the first end 115, thereby improving the uniformity of the overall heat conduction of the heat pipe 110.

[0063] Of course, in order to further improve the thermal conductivity uniformity of the heat pipe 110, the first end 115 and the second end 116 can also be made into a cone, so that heat is not easily accumulated at the first end 115 and the second end 116 at the same time, thereby improving the thermal conductivity uniformity of the heat pipe 110 and enhancing the thermal conductivity effect.

[0064] In order to further improve the heat dissipation effect of the heat pipe 110, the present application also improves the structure of the heat pipe 110, and the specific improvements are as follows:

[0065] Figure 8 Schematic diagram of the heat pipe body of the heat pipe in the seventh embodiment of the heat dissipation module of the present application, as shown Figure 8 As shown, Figure 8 The illustrated embodiment is based on Figure 7 In the improvement, a plurality of convex grooves 118 are arranged at intervals on the outer side of the heat pipe body 117 , and the plurality of convex grooves 118 extend along the length direction of the heat pipe body 117 , and a gap 119 is formed between two adjacent convex grooves 118 .

[0066] In this embodiment, a plurality of convex grooves 118 are arranged on the outer side of the heat pipe body 117, and a gap 119 formed on the outer surface of the heat pipe body 117 between the plurality of convex grooves 118 arranged at intervals is used to increase the flow rate of the air near the heat pipe 110. When the air near the heat pipe 110 passes through the gap 119 between two adjacent convex grooves 118, the air circulation rate is increased due to the reduction of the circulation area, so that the air can quickly bring the heat to the external environment on the outer surface of the heat pipe body 117, avoiding the accumulation of heat at the heat pipe 110, effectively improving the heat dissipation rate of the heat pipe 110, and enhancing the heat dissipation effect of the heat pipe 110.

[0067] Of course, a plurality of convex patterns 118 may also be provided on the outer side of the entire heat pipe 110 , which can also achieve the above-mentioned effects, and will not be described in detail here.

[0068] Fig. 9 Schematic diagram of the heat pipe in the eighth embodiment of the heat dissipation module of the present application, as shown Fig. 9 As shown, the heat pipe 110 is made of a heat-conducting metal material, and the outer side of the heat pipe 110 is wrapped with a waterproof layer 190 .

[0069] Since the heat pipe 110 in the present application adopts an internal hollow structure, the material selection for the hollow heat pipe 110 needs to be considered based on the welding performance of the selected heat pipe, the density of the material (poor density will lead to leakage), processing ductility and thermal conductivity, etc. Therefore, copper can be used to make the heat pipe 110.

[0070] In addition, in order to further prevent the coolant 112 inside the heat pipe 110 from leaking out, the present application also improves the structure of the heat pipe 110, and a waterproof layer 190 is wrapped around the outer side of the heat pipe 110. The waterproof layer 190 effectively prevents the coolant 112 inside the heat pipe 110 from leaking out, thereby ensuring the storage of the coolant 112 inside the heat pipe 110 and preventing the loss of the coolant 112, which leads to a decrease in the heat dissipation performance of the heat pipe 110.

[0071] Fig.10 Schematic diagram of the ninth embodiment of the heat dissipation module of the present application, as shown Figure 6 As shown, a heat spreader 150 is arranged above the heat-conducting trunk 120, and the heat spreader 150 is connected to the top surface of the heat-conducting trunk 120; the heat spreader 150 is long and hollow inside, and the extension direction of the heat spreader 150 is the same as the extension direction of the heat-conducting trunk 120. The heat spreader 150 has a first opening 151 at both ends of the extension direction of the heat-conducting trunk 120; the length and width of the heat spreader 150 are the same as the length and width of the heat-conducting trunk 120.

[0072] In this embodiment, a heat spreader 150 is further provided above the heat-conducting trunk 120. The high thermal conductivity of the heat spreader 150 is utilized to further improve the thermal conductivity rate of the heat-conducting trunk 120. Moreover, the length and width of the heat spreader 150 are the same as those of the heat-conducting trunk 120. When the heat spreader 150 is installed above the heat-conducting trunk 120, the heat spreader 150 forms a full-surface coverage of the heat-conducting trunk 120, further improving the thermal conductivity uniformity of the heat-conducting trunk 120. Moreover, in this embodiment, the heat spreader 150 is also provided to the heat spreader 150. The structure of the heat spreader 150 is improved, and the heat spreader 150 is designed to be a hollow cylindrical structure with first openings 151 at both ends, so that air can circulate through the middle of the heat spreader 150, forming convection with the air at other positions of the heat spreader 150, thereby increasing the flow rate of the air near the heat spreader 150, so that the heat near the heat spreader 150 can be quickly taken away by the air, avoiding the accumulation of heat at the heat spreader 150, effectively improving the heat dissipation efficiency of the heat spreader 150, and further improving the heat dissipation effect of the heat dissipation module 100.

[0073] Fig.11 Schematic diagram of the first embodiment of the display device of the present application, such as Fig.11 As shown, the present application also discloses a display device 10, a housing 200 and a display panel 400, the display panel 400 is connected to the housing 200, and the display device 10 also includes the above-mentioned heat dissipation module 100, which is arranged in the housing 200. The housing 200 is used to protect the heat dissipation module 100 and the display panel 400 from being invaded by external water vapor, and prevent water vapor from corroding the heat dissipation module 100 and the display panel 400, thereby avoiding the occurrence of a decrease in the heat dissipation performance of the heat dissipation module 100 and the display effect of the display panel 400; at the same time, when the display device 10 is being carried or moved, it can also effectively prevent the outside world from causing a collision with the heat dissipation module 100 and the display panel 400, resulting in damage to the heat dissipation module 100.

[0074] It should be noted that the display device 10 in the present application can be a device with display function such as a computer or a television, and the present application does not specifically limit the type of the display device 10.

[0075] Since the display device 10 usually only uses a single heat dissipation module 100 for heat dissipation, the heat dissipation performance mainly depends on the heat dissipation capacity of the heat dissipation module 100 itself. The heat generated by the display device 10 in a short time can easily reach the heat dissipation limit of the heat dissipation module 100 itself, causing the display device 10 to be overheated and burnt.

[0076] In view of the above problems, the present application improves the heat dissipation module 100 in the display device 10, and connects the bracket 130 and the heat-conducting trunk 120 through the heat-conducting pipe 110. When the heat generated during the operation of the electronic component 300 is transferred to the bracket 130, the bracket 130 will transfer the heat to the heat-conducting trunk 120 through the heat-conducting pipe 110, and use the heat-conducting trunk 120 as the heat conduction hub to quickly take the heat away from the heat source, so as to avoid the accumulation of heat near the electronic component 300, resulting in the occurrence of excessive temperature of the electronic component 300; at the same time, the heat-conducting trunk 120 will disperse the heat and transfer it to the radiator 140 through the heat-conducting pipe 110, and use the radiator 140 to dissipate the heat to the external environment, forming the first effective heat dissipation; and when the temperature of the electronic component 300 rises sharply in a short period of time, the conventional heat dissipation capacity of the radiator 140 reaches the upper limit at this time. , while the coolant 112 in the heat pipe 110 continues to absorb heat. When the coolant 112 absorbs heat and reaches the first preset temperature, the coolant 112 is gasified into coolant steam, which further takes away heat to form a second heat dissipation. When the electronic component 300 stops working and the coolant steam cools down to the second preset temperature, the coolant steam is re-liquefied into coolant 112 and stored in the heat pipe 110 for the next heat dissipation cycle. In this way, the first heat dissipation formed by the radiator 140 and the second heat dissipation formed by the coolant 112 in the heat pipe 110, the heat dissipation module 100 breaks through the heat dissipation limit of the radiator 140 itself by using two different heat dissipation combinations, effectively dissipates the heat of the display device 10 that rapidly increases in a short time, improves the overall heat dissipation capacity of the heat dissipation module 100, and further extends the service life of the display device 10.

[0077] Fig.12 This is a schematic diagram of a second embodiment of a display device of the present application, such as Fig.12 As shown, the display device 10 also includes a cover body 210, which covers the top of the heat dissipation module 100 and is connected to the shell 200. The cover body 210 is provided with a plurality of heat dissipation holes 220 at positions corresponding to the heat spreader 150 in the heat dissipation module 100. The distance d between the heat spreader 150 and the heat dissipation holes 220 in the heat dissipation module 100 ranges from 0.5 mm to 1.5 mm.

[0078] This embodiment is different from the previous embodiment in that, in this embodiment, a plurality of heat dissipation holes 220 are opened on the cover body 210 at positions corresponding to the heat spreader 150, and the plurality of heat dissipation holes 220 are utilized to realize air circulation inside and outside the shell 200. The outside air can enter the shell 200 of the display device 10 and form a circulation with the air inside the shell 200, so that the heat absorbed by the heat spreader 150 is quickly taken away from the shell 200 and dissipated to the external environment, thereby further improving the overall heat dissipation effect of the display device 10.

[0079] In addition, in order to ensure that there is enough space between the heat spreader 150 and the cover 210 for air circulation, and at the same time, the flow rate of air when circulating between the heat spreader 150 and the cover 210 will not be too slow, so as to ensure the heat dissipation efficiency, the present application also designs the spacing d between the heat spreader 150 and the heat dissipation holes 220. The spacing d between the heat spreader 150 and the heat dissipation holes 220 in the heat dissipation module 100 ranges from 0.5 mm to 1.5 mm. When the spacing d between the heat spreader 150 and the heat dissipation holes 220 is less than 0.5 mm, the heat spreader 150 and the heat dissipation holes 220 are too close to each other, resulting in the air between the heat spreader 150 and the heat dissipation holes 220 not being able to circulate. It is easy to circulate, and it is impossible to effectively bring heat to the external environment. When the distance d between the heat spreader 150 and the heat dissipation hole 220 is greater than 1.5 mm, the space between the heat spreader 150 and the heat dissipation hole 220 is larger, and the air flow rate is slower, and the heat cannot be quickly brought to the external environment. Therefore, the distance d between the heat spreader 150 and the heat dissipation hole 220 is set in the range of 0.5 mm to 1.5 mm. For example, when the distance d between the heat spreader 150 and the heat dissipation hole 220 is 1 mm, the heat absorbed by the heat spreader 150 can be quickly dissipated from the heat dissipation hole 220 to the external environment through air circulation, thereby effectively improving the heat dissipation efficiency of the display device 10.

[0080] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0081] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module comprises a plurality of heat sinks, a plurality of heat pipes, a heat-conducting trunk and a bracket, wherein the bracket is used to connect with the electronic component, and at least one heat pipe is connected between the bracket and the heat-conducting trunk; at least one heat sink is arranged on a side adjacent to the connection side of the heat-conducting trunk and the bracket; At least one heat-conducting pipe is connected between the heat-conducting trunk and the radiator; a cavity is formed inside each of the heat-conducting pipes, and the cavity is filled with a coolant, and the liquid level of the coolant is smaller than the diameter of the heat-conducting pipe; When the coolant reaches a first preset temperature, it gasifies to form coolant vapor; when the coolant vapor reaches a second preset temperature, it liquefies, and the first preset temperature is greater than the second preset temperature.

2. The heat dissipation module according to claim 1, characterized in that: The heat-conducting trunk is long and strip-shaped, and the heat-conducting pipe includes a first heat-conducting pipe and a second heat-conducting pipe, one end of the first heat-conducting pipe is connected to the bracket, and the other end is connected to the bottom surface of the heat-conducting trunk, and the extension direction of the first heat-conducting pipe is the same as the extension direction of the heat-conducting trunk, and the length of the connection part between the first heat-conducting pipe and the heat-conducting trunk is less than or equal to the length of the heat-conducting trunk; The second heat-conducting pipe is perpendicular to the heat-conducting trunk in the horizontal direction. One end of the second heat-conducting pipe is connected to the radiator, and the other end of the second heat-conducting pipe passes through the heat-conducting trunk and overlaps above the first heat-conducting pipe.

3. The heat dissipation module according to claim 1, characterized in that: The heat-conducting trunk is long and strip-shaped, and the heat-conducting pipe includes a first heat-conducting pipe and a second heat-conducting pipe, one end of the first heat-conducting pipe is connected to the bracket, and the other end is connected to the bottom surface of the heat-conducting trunk, and the extension direction of the first heat-conducting pipe is the same as the extension direction of the heat-conducting trunk, and the length of the connection part between the first heat-conducting pipe and the heat-conducting trunk is less than or equal to the length of the heat-conducting trunk; The second heat-conducting pipe is perpendicular to the heat-conducting trunk in a horizontal direction. One end of the second heat-conducting pipe is connected to the radiator, and the other end is communicated with the first heat-conducting pipe.

4. The heat dissipation module according to claim 2, characterized in that: A slot is provided on the bottom surface of the heat-conducting trunk, the extension direction of the slot is the same as the extension direction of the heat-conducting trunk, and both ends of the slot have openings. The shape of the slot matches the shape of the first heat-conducting pipe. The first heat-conducting pipe is inserted into the slot and partially exposes the bottom surface of the heat-conducting trunk.

5. The heat dissipation module according to claim 4, characterized in that: A plurality of barrier members are arranged in the cavity of the heat conducting pipe at intervals, and the plurality of barrier members divide the cavity into a plurality of partitions, and each of the partitions is filled with a coolant; Each of the barrier members is provided with a through hole, and the through hole connects two adjacent partitions; the height of the partition filled with the coolant is greater than one half of the height of the cavity and less than two thirds of the height of the cavity.

6. The heat dissipation module according to claim 5, characterized in that: The through holes on two adjacent barrier members are staggered, and the area of ​​the through holes is less than one quarter of the area of ​​the barrier member.

7. The heat dissipation module according to claim 6, characterized in that: The through hole is located at the lower part of the barrier element, and the height of the through hole disposed at the barrier element is less than half of the height of the barrier element.

8. The heat dissipation module according to claim 7, characterized in that: The heat pipe is long and strip-shaped, and includes a first end, a second end and a heat pipe body. The first end and the second end are respectively located on both sides of the heat pipe body in the length direction. Among the first end and the second end, at least one end has a cross-sectional area smaller than the cross-sectional area of ​​the heat pipe body.

9. The heat dissipation module according to claim 8, characterized in that: A plurality of convex patterns are arranged at intervals on the outer side of the heat pipe body. The plurality of convex patterns extend along the length direction of the heat pipe body, and a gap is formed between two adjacent convex patterns.

10. A display device, comprising a housing and a display panel, wherein the display panel is connected to the housing, characterized in that: The display device further comprises a heat dissipation module as claimed in any one of claims 1 to 9, wherein the heat dissipation module is arranged in the housing.

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