Substrate holder, plating apparatus, and method for positioning substrate

Abstract

The present disclosure provides a substrate holder in which a center pin does not excessively press a substrate to the center side of a design position even if a first holder is displaced from the design position with respect to a second holder when the substrate is positioned. A substrate holder according to the present disclosure has a first holder and a second holder, the second holder having a positioning member for positioning a substrate at a predetermined position, and a stopper, the positioning member having a center pin movable between a first position and a second position, and a first holder having a drive member configured to urge the center pin toward the first position when the substrate is held by the first holder and the second holder, the drive member being configured to urge the center pin toward the second position when the substrate is held by the first holder and the second holder, the drive member being configured to urge the center pin toward the second position when the substrate is held by the first holder and the second holder, and the drive member being configured to urge the center pin toward the second position when the substrate is held by the second holder and the second holder. The stopper is configured to contact the center pin and stop the center pin at the first position.

Description

Technical Field

[0001] The invention relates to a substrate holding frame, a plating device and a substrate positioning method. Background Art

[0002] A plating device is used to form a metal thin film on the surface of a substrate. In the plating device, a substrate holder that can be detachably held on a substrate such as a semiconductor wafer is sometimes used. Then, in the plating device, the substrate held on the substrate holder is immersed in a plating solution and a voltage is applied to the substrate, thereby plating the surface of the substrate.

[0003] An example of a substrate holder is described in Patent Document 1. As shown in FIG. 15 , Patent Document 1 discloses a substrate holder having a first holding member 31 and a second holding member 32 that holds a substrate Wf together with the first holding member 31. The second holding member 32 has a positioning member 70 for positioning the substrate Wf at a predetermined position. The first holding member 31 has a protrusion 90. When the substrate Wf is held by the first holding member 31 and the second holding member 32, the protrusion 90 contacts the positioning member 70, and the positioning member 70 is moved to the first position. As a result, the positioning member 70 contacts the substrate Wf and positions the substrate Wf.

[0004] 14 , the second holding member 32 has a plurality of power supply contacts 50 for contacting the outer periphery of the substrate Wf and supplying power to the substrate Wf. Thus, the substrate holder of Patent Document 1 can supply power to the substrate Wf via the power supply contacts 50 .

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-9215

[0006] As described above, in the substrate holder 30 of Patent Document 1, the first holding member 31 and the second holding member 32 hold the substrate Wf by clamping the substrate Wf. That is, the first holding member 31 and the second holding member 32 engage with each other to hold the substrate Wf. Usually, in order to engage the two members, a gap is provided in a manner that the two members do not interfere with each other. Therefore, the first holding member 31 can deviate from the design position relative to the second holding member 32 by the amount of the gap.

[0007] In addition, as described above, in the substrate holder 30 of Patent Document 1, the protrusion 90 of the first holding member 31 contacts the positioning member 70 of the second holding member 32, thereby moving the positioning member 70. Therefore, when positioning the substrate Wf, in the case where the first holding member 31 deviates from the designed position relative to the second holding member 32 due to the gap between the first holding member 31 and the second holding member 32, there is a possibility that the protrusion 90 excessively presses the positioning member 70 and the positioning member 70 moves to the center side of the substrate Wf than the designed position. As a result, the positioning member 70 excessively presses the substrate Wf to the center side than the designed position, and there is a possibility that the position of the positioned substrate Wf relative to the second holding member 32 changes. In other words, there is a possibility that the substrate Wf deviates from the position to be arranged relative to the second holding member 32.

[0008] In this case, the power supply contact 50 of the second holding member 32 may not contact a predetermined portion of the substrate Wf due to the deviation of the substrate Wf. As a result, a problem may occur in power supply to the substrate Wf.

[0009] For these reasons, a substrate holder is required in which the positioning member 70 does not excessively press the substrate Wf to the center side beyond the design position even when the first holding member 31 deviates from the design position relative to the second holding member 32 during positioning of the substrate Wf. Summary of the invention

[0010] Therefore, in view of the above-mentioned problems, one of the objects of the present disclosure is to provide a substrate holder, a plating device and a substrate positioning method in which, when positioning the substrate, the center pin (positioning component 70) will not excessively press the substrate (substrate Wf) to the center side closer to the design position even when the first holding member (first holding member 31) deviates from the design position relative to the second holding member (second holding member 32).

[0011] The substrate holder according to one embodiment comprises: a first holder and a second holder for clamping and holding the substrate together with the first holder, the second holder comprises: a positioning component for positioning the substrate at a specified position, and a stopper, the positioning component comprises a center pin capable of moving between a first position and a second position, and is configured so that when the center pin moves from the second position to the first position, the center pin contacts the peripheral edge of the substrate and positions the substrate at the specified position, the first holder comprises a driving component, the driving component is configured to apply a force to the center pin toward the first position when the substrate is held by the first holder and the second holder, and the stopper is configured to contact the center pin and stop the center pin at the first position.

[0012] A plating device involved in one embodiment is a plating device, which includes: a plating tank configured to contain a plating liquid, the substrate holder, and a lifting mechanism configured to lift and lower the substrate holder, the substrate holder is configured to hold the substrate with the plated surface facing downward, the second holder is a supporting mechanism configured to support the outer peripheral portion of the plated surface of the substrate, and the first holder is a back plate assembly arranged on the back side of the plated surface of the substrate and configured to clamp the substrate together with the supporting mechanism.

[0013] A substrate positioning method involved in one embodiment is a substrate positioning method using the above-mentioned substrate holding frame, and the above-mentioned method has the following steps: a step in which the above-mentioned first holding member and the above-mentioned second holding member clamp and hold the above-mentioned substrate; a step in which the above-mentioned driving component moves the above-mentioned center pin from the above-mentioned second position to the above-mentioned first position; a step in which the above-mentioned center pin positions the above-mentioned substrate at the above-mentioned specified position; and a step in which the above-mentioned limiter contacts the above-mentioned center pin to stop the above-mentioned center pin at the above-mentioned first position. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to the present embodiment.

[0015] Figure 2 It is a plan view showing the overall structure of the plating apparatus according to the present embodiment.

[0016] Figure 3 It is a longitudinal sectional view schematically showing the structure of the plating module according to the present embodiment.

[0017] Figure 4 It is a perspective view schematically showing the structure of the substrate holder according to the present embodiment.

[0018] Figure 5 This is a perspective view schematically showing a part of the substrate holder according to the present embodiment in an enlarged manner.

[0019] Figure 6 It is a top view of the support mechanism of the substrate holder according to the present embodiment.

[0020] Figure 7 It is a perspective view of the support mechanism of the substrate holder according to the present embodiment.

[0021] Figure 8 It is a perspective view of the positioning member according to this embodiment.

[0022] Fig. 9 This is a perspective view schematically showing a part of the substrate holder according to the present embodiment in an enlarged manner.

[0023] Fig.10 This is a cross-sectional view schematically showing a part of the substrate holder according to the present embodiment in an enlarged manner.

[0024] Fig.11 This is a cross-sectional view schematically showing a part of the substrate holder according to the present embodiment in an enlarged manner. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted.

[0026] <Overall structure of plating equipment>

[0027] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to the present embodiment. Figure 2 2 is a top view showing the overall structure of the plating device of this embodiment. Figure 1 , 2 As shown, the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wetting module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , a spin dryer 600 , a transfer device 700 , and a control module 800 .

[0028] The loading port 100 is a module for carrying a substrate stored in a box such as a FOUP not shown in the figure into the plating device 1000, or carrying a substrate out of the box from the plating device 1000. In the present embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the spin dryer 600. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the substrates can be transferred via a temporary placement table not shown in the figure.

[0029] The aligner 120 is a module for aligning the orientation plane, notch and other positions of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 wets the plated surface of the substrate before the plating process using a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wet module 200 is configured to implement a pre-wet process, which is a process of easily supplying the plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wet modules 200 are arranged side by side in the up and down direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0030] The prepreg module 300 is configured to implement a prepreg treatment, which is, for example, etching with a treatment solution such as sulfuric acid or hydrochloric acid to remove the oxide film with large resistance on the surface of the seed layer formed on the plated surface of the substrate before the plating treatment, and cleaning or activating the surface of the plated substrate. In the present embodiment, two prepreg modules 300 are arranged side by side in the up and down direction, but the number and configuration of the prepreg modules 300 are arbitrary. The plating module 400 implements a plating treatment on the substrate. In the present embodiment, there are two groups of twelve plating modules 400, three of which are arranged side by side in the up and down direction and four of which are arranged side by side in the horizontal direction, and a total of twenty-four plating modules 400 are provided, but the number and configuration of the plating modules 400 are arbitrary.

[0031] The cleaning module 500 is configured to implement cleaning treatment to the substrate so as to remove the plating liquid etc. remaining in the substrate after the plating treatment. In the present embodiment, two cleaning modules 500 are arranged side by side in the up-down direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for rotating and drying the substrate after the cleaning treatment at high speed. In the present embodiment, two spin dryers are arranged side by side in the up-down direction, but the number and configuration of the spin dryers are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, for example, it can be composed of a general computer or a special computer having an input and output interface with an operator.

[0032] An example of a series of plating processes based on the plating device 1000 is described. First, the substrate stored in the box is moved to the loading port 100. Then, the transport robot 110 takes out the substrate from the box of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notch, etc. of the substrate in a predetermined direction. The transport robot 110 delivers the substrate aligned by the aligner 120 to the pre-wet module 200.

[0033] The prewetting module 200 performs a prewetting process on the substrate. The transport device 700 transports the substrate subjected to the prewetting process to the prepreg module 300. The prepreg module 300 performs a prepreg process on the substrate. The transport device 700 transports the substrate subjected to the prepreg process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0034] The transport device 700 transports the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate subjected to the cleaning process to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin dryer 600 and transports the substrate subjected to the drying process to the box of the loading port 100. Finally, the box containing the substrate is unloaded from the loading port 100.

[0035] <Structure of the plating module>

[0036] Next, the structure of the plating module 400 will be described. In the present embodiment, the twenty-four plating modules 400 have the same structure, and therefore only one plating module 400 will be described. Figure 3 4 is a longitudinal sectional view schematically showing the structure of the plating module 400. Figure 3 As shown, the plating module 400 is provided with a plating tank 410 for accommodating a plating solution. The plating module 400 is provided with a diaphragm 420 that separates the interior of the plating tank 410 in the up and down directions. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the diaphragm 420. The cathode region 422 and the anode region 424 are respectively filled with plating solutions. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424. An impedance body 450 is arranged opposite to the diaphragm 420 in the cathode region 422. The impedance body 450 is a component for realizing uniform plating treatment on the plated surface (processing surface) Wf-a of the substrate Wf, and is composed of a plate-like component having many holes.

[0037] In addition, the plating module 400 is provided with a substrate holder 440 for holding the substrate Wf in a state where the surface to be plated Wf-a faces downward. The plating module 400 is provided with a lifting mechanism 442 for lifting and lowering the substrate holder 440. The lifting mechanism 442 can be realized by a well-known mechanism such as a motor, for example. The plating module 400 is configured to immerse the substrate Wf in the plating solution in the cathode region 422 using the lifting mechanism 442, and to apply a voltage between the anode 430 and the substrate Wf, thereby performing a plating process on the surface to be plated Wf-a of the substrate Wf.

[0038] The plating module 400 also includes a rotating mechanism 446 for rotating the substrate holder 440 so as to rotate the substrate Wf around a virtual rotation axis extending vertically through the center of the plated surface Wf-a. The rotating mechanism 446 can be realized by a known mechanism such as a motor.

[0039] <Structure of substrate holder>

[0040] Next, the details of the substrate holder 440 according to the present embodiment will be described. Figure 4 It is a perspective view schematically showing the structure of the substrate holder according to the present embodiment. Figure 5 This is a perspective view schematically showing a part of the substrate holder according to the present embodiment in an enlarged manner.

[0041] like Figure 4 and Figure 5 As shown, the substrate holder 440 comprises: a supporting mechanism (a second holder or a first holder) 460 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf; a back plate assembly (a first holder or a second holder) 470 for holding the substrate Wf; and a rotating shaft 448 extending vertically upward from the back plate assembly 470.

[0042] The back plate assembly 470 includes a disk-shaped floating plate 472 for clamping the substrate Wf together with the support mechanism 460. The floating plate 472 is arranged on the back side of the plated surface Wf-a of the substrate Wf. In addition, the back plate assembly 470 includes: a floating mechanism 490 for applying a force to the floating plate 472 in a direction away from the back side of the substrate Wf; and a pressing mechanism 480 for pressing the floating plate 472 to the back side of the substrate Wf against the force based on the floating mechanism 490.

[0043] The pressing mechanism 480 includes a disc-shaped back plate 474 disposed above the floating plate 472, and a flow path 476 formed inside the back plate 474. The flow path 476 includes a first flow path 476-1 extending radially from the central portion of the back plate 474 toward the outer periphery, and a second flow path 476-2 extending in the up-down direction in a manner of opening from the first flow path 476-1 to the lower surface of the back plate 474. The pressing mechanism 480 includes a diaphragm 484 disposed in the second flow path 476-2. The diaphragm 484 is a thin film-shaped member. The outer periphery of the diaphragm 484 is fixed to the lower surface of the back plate 474 by a fixing member 483. The pressing mechanism 480 includes a rod 482 as a form of a pressing member disposed between the diaphragm 484 and the floating plate 472. The lower surface of the rod 482 is fixed to the floating plate 472 by the bolt 481, and the upper surface of the rod 482 is in contact with the lower surface of the diaphragm 484. The upper part of the rod 482 is covered with a cover 485 so as to sandwich the diaphragm 484. The central part of the diaphragm 484 is sandwiched between the cover 485 and the rod 482. The diaphragm 484, the rod 482, and the cover 485 are provided in a plurality along the circumferential direction of the back plate assembly 470. In addition, in the present embodiment, an example is shown in which the rod 482, which is a component different from the floating plate 472, is fixed to the upper surface of the floating plate 472, but it is not limited to this. For example, a protrusion may be formed on the upper surface of the floating plate 472 along the circumferential direction. In this case, the protrusion has the same function as the rod 482 as a pressing component.

[0044] The pressing mechanism 480 includes a fluid source 488 for supplying fluid to the diaphragm 484. The fluid may be a gas such as air, or a liquid such as water. A flow path 449 extending in a vertical direction is formed on the rotating shaft 448, and the fluid source 488 is connected to the upper end of the flow path 449. The lower end of the flow path 449 is connected to a first flow path 476-1 formed on the back plate 474. The first flow path 476-1 extends radially from the center of the back plate 474 and is connected to the upper surface of the cover 485 via the second flow path 476-2. The fluid source 488 supplies the fluid to the diaphragm 484 via the flow path 449 and the flow path 476. In this way, the cover 485 and the rod 482 are pressed downward, and thereby the floating plate 472 is pressed downward.

[0045] The support mechanism 460 includes an annular support member 462 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf. The support member 462 has a flange 462a protruding from the outer periphery of the lower surface of the back plate assembly 470. An annular sealing member 464 is arranged on the flange 462a. The sealing member 464 is an elastic member. The support member 462 supports the outer periphery of the plated surface Wf-a of the substrate Wf via the sealing member 464. The substrate Wf is clamped by the sealing member 464 and the floating plate 472, so that the support member 462 and the substrate Wf are sealed. The sealing member 464 has elasticity, and therefore is crushed in accordance with the pressing force of the pressing mechanism 480 on the substrate Wf, and the thickness α changes.

[0046] The support mechanism 460 includes an annular clamper 466 held by the support member 462. The clamper 466 can raise and lower the back plate assembly 470 relative to the support mechanism 460 when the substrate Wf is placed on or taken out of the substrate holder 440. In addition, the clamper 466 can restrict the back plate 474 from moving in the upward direction (the direction away from the back surface of the substrate Wf) when the fluid is supplied from the fluid source 488 to the diaphragm 484. This point will be described below.

[0047] The back plate assembly 470 includes a slide ring 478 provided in an annular shape on the outer peripheral portion of the upper surface of the back plate 474. The slide ring 478 is movable in the circumferential direction independently of the back plate 474. The back plate assembly 470 includes a slide plate 479 protruding from the slide ring 478 toward the clamper 466.

[0048] On the other hand, the clamper 466 has a key-shaped notch 466d formed on the surface facing the slide ring 478. The key-shaped notch 466d includes a first groove 466a extending in the up-down direction so that the slide plate 479 can be raised and lowered, and a second groove 466b communicating with the first groove 466a and extending in the circumferential direction of the clamper 466. A contact surface 466c is formed on the upper surface of the second groove 466b, and the contact surface 466c contacts the upper surface of the slide plate 479 that moves with the upward movement of the back plate 474 when the fluid is supplied from the fluid source 488 to the diaphragm 484. A plurality of slide plates 479 and notches 466d are provided in the circumferential direction of the substrate holder 440.

[0049] When the substrate Wf is set on the substrate holder 440, the back plate assembly 470 is located above the support mechanism 460. When the substrate Wf is placed on the support mechanism 460 in this state, the circumferential position of the slide plate 479 is aligned with the first groove 466a, so that the back plate assembly 470 can be lowered relative to the support mechanism 460. After the back plate assembly 470 is lowered, the slide ring 478 is rotated in the circumferential direction to fit the slide plate 479 into the second groove 466b. As a result, the slide plate 479 becomes opposed to the abutment surface 466c, thereby restricting the upward movement of the back plate assembly 470.

[0050] The floating mechanism 490 includes an axis 492 extending upward from the floating plate 472 through the through hole 474a of the back plate 474. The lower end of the axis 492 is fixed to the floating plate 472. The floating mechanism 490 includes a flange 495 mounted on the axis 492 at an upper portion than the back plate 474. The flange 495 is mounted on the upper end of the axis 492 by bolts 493. The floating mechanism 490 includes a guide 494 provided in the through hole 474a. The guide 494 has a hole slightly larger than the outer diameter of the axis 492 and is mounted on the upper end of the through hole 474a. The guide 494 is configured to guide the movement of the axis 492 in the lifting direction. By providing the guide 494, the radial positional deviation between the floating plate 472 and the back plate 474 can be suppressed.

[0051] The floating mechanism 490 includes a compression spring 496 mounted on the upper surface of the guide 494 and the lower surface of the flange 495. The compression spring 496 may be disposed between the upper surface of the back plate 474 and the lower surface of the flange 495. The compression spring 496 has a force to lift the flange 495 upward, and thus applies force to the floating plate 472 in a direction away from the back surface of the substrate Wf via the axis 492.

[0052] When the fluid is supplied from the fluid source 488, the pressing mechanism 480 presses the substrate Wf toward the sealing member 464 with a force stronger than the biasing force of the floating mechanism 490. The pressing mechanism 480 can change the holding position of the substrate Wf according to the pressure of the fluid supplied from the fluid source 488.

[0053] If the pressure of the fluid supplied from the fluid source 488 increases, the amount of collapse of the sealing component 464 increases, and thus the thickness of the sealing component 464 becomes thinner in proportion to the increase in the pressure of the fluid supplied from the fluid source 488. The thinning of the thickness of the sealing component 464 means that the holding position of the substrate Wf moves downward, and thus means that the distance between the anode 430 and the substrate Wf becomes shorter. That is, by adjusting the flow rate of the fluid supplied from the fluid source 488, the distance between the anode 430 and the substrate Wf can be adjusted. Therefore, according to the present embodiment, the distance between the anode 430 and the substrate Wf is adjusted according to the type of substrate Wf, so that the uniformity of the plating film thickness on the plated surface Wf-a can be improved. In addition, as Figure 5 As shown, the substrate holder 440 includes a peeling mechanism 471 configured to apply a force to the back surface of the plated surface Wf-a of the substrate Wf so as to peel the substrate Wf from the back plate assembly 470 .

[0054] Figure 6 It is a top view of the support mechanism 460 of the substrate holder 440 according to the present embodiment. Figure 7 FIG. 4 is a perspective view of the support mechanism 460 of the substrate holder 440 of the present embodiment. Figure 6 and Figure 7 As shown, the support mechanism 460 includes a plurality of electric contacts 902 and a positioning member 920 .

[0055] The electric contact 902 is configured to contact the outer periphery of the substrate Wf and supply power to the substrate Wf when the substrate holder 440 holds the substrate Wf (see Fig. 9 ). A plurality of electrical contacts 902 are mounted on almost the entire circumference of the support mechanism 460 (see Figure 6 ). The electric contact 902 is preferably formed of a spring material such as stainless steel. As an example, the electric contact 902 is configured to elastically contact the outer periphery of the substrate Wf when the substrate Wf is held by the substrate holder 440. Specifically, the electric contact 902 contacts the outer periphery of the substrate Wf while bending when the substrate Wf is held by the substrate holder 440. Thus, the electric contact 902 can apply a force caused by elasticity to the outer periphery of the substrate Wf and can reliably contact the substrate Wf. In addition, as an example, the electric contact 902 contacts the substrate Wf over more than 95% of the circumference of the substrate Wf.

[0056] The positioning member 920 is configured to position the substrate Wf at a predetermined position. In this embodiment, four positioning members 920 are arranged in parallel at equal intervals on the circumference of the support mechanism 460 (see Figure 6). However, in other embodiments of the present disclosure, the number and configuration of the positioning components 920 are arbitrary. In particular, it is preferred that three or more positioning components 920 are arranged at equal intervals on the circumference of the support mechanism 460. The details of the positioning components 920 are described below. In addition, in this manuscript, "positioning" means moving a component that is not located at a specified position to move it closer to a specified position.

[0057] Figure 8 It is a perspective view of the positioning member 920 according to this embodiment. Fig. 9 It is a perspective view schematically showing a part of the substrate holder 440 according to the present embodiment in an enlarged manner. Fig.10 This is an enlarged cross-sectional view schematically showing a portion of the substrate holder 440 of the present embodiment when the center pin 930 is in the second position. Fig.11 This is an enlarged cross-sectional view schematically showing a portion of the substrate holder 440 of the present embodiment when the center pin 930 is at the first position.

[0058] Reference Figure 8 The positioning component 920 includes: a center pin 930, a bearing 940, an elastic component 950, and two fastening components 922. Fig. 9 As shown, the positioning member 920 is fixed to the support member 462 of the support mechanism 460 by two fastening members 922 .

[0059] As an example, the center pin 930 is a rigid body and is formed of PEEK material. Fig.10 As shown in FIG. 1 , the center pin 930 includes a base portion 931 extending in the front-rear direction, a claw portion 932 extending downward from the front of the base portion 931, and an extension portion 933 extending upward from the rear of the base portion 931. Fig. 9 As shown, the center pin 930 has a rotation axis 934 extending from a base 931 in a horizontal direction. Moreover, the bearing 940 is configured to rotatably support the rotation axis 934. Thus, the center pin 930 can rotate around the rotation axis 934. Moreover, the center pin 930 is configured to be movable between a first position and a second position by rotating. In other words, the positioning member 920 has the center pin 930 that can move between a first position and a second position.

[0060] The claw portion 932 has a contact surface 935 (see Fig.10 ). Thus, when the center pin 930 moves between the first position and the second position, the contact surface 935 contacts and presses the substrate Wf. In other words, the center pin 930 contacts and presses the peripheral edge of the substrate Wf, so that the positioning member 920 positions the substrate Wf at a predetermined position.

[0061] Reference Fig.11 , the back plate assembly 470 includes a driving component 990. In addition, the center pin 930 has a pressed surface 938 located on the upper side of the extension portion 933. As an example, the driving component 990 is a plunger with an elastic body (spring), and is fixed to the back plate 474. In other words, the driving component 990 has a spring 991. The driving component 990 is configured to press the pressed surface 938 and apply force to the center pin 930 toward the first position when the substrate Wf is held by the back plate assembly 470 and the support mechanism 460. As a result, when the substrate Wf is held, the center pin 930 moves from the second position toward the first position.

[0062] Furthermore, as an example, the pressed surface 938 is parallel to the plated surface Wf-a of the substrate Wf (see Fig.11 ). In addition, the driving component 990 is configured to press the pressed surface 938 in a pressing direction perpendicular to the plated surface Wf-a of the substrate Wf. In other words, the pressed surface 938 is orthogonal to the pressing direction of the driving component 990. Thus, the driving component 990 can apply a force to the pressed surface 938 only in a direction substantially orthogonal to the pressed surface 938. Therefore, when the driving component 990 applies a force to the pressed surface 938, the driving component 990 is not easy to slide on the pressed surface 938.

[0063] When the driving member 990 slides on the pressed surface 938, the driving member 990 and the pressed surface 938 rub against each other, and there is a risk of wear of the driving member 990 and the pressed surface 938. Moreover, when the driving member 990 or the pressed surface 938 is worn, the driving member 990 may not be able to move the center pin 930 to the first position. In addition, there is a risk of generation of tiny particles due to the friction between the driving member 990 and the pressed surface 938. However, in this embodiment, as described above, when the driving member 990 applies a force to the pressed surface 938, the driving member 990 is not easy to slide on the pressed surface 938. As a result, the wear of the driving member 990 and the pressed surface 938 is suppressed. In addition, the generation of tiny particles caused by the friction between the driving member 990 and the pressed surface 938 is also suppressed.

[0064] In addition, refer to Fig.10 The elastic member 950 passes through the stopper 980 and is located inside the hole 936 provided in the base 931 and the hole 463 provided in the support member 462. As an example, the elastic member 950 is a coil spring. The elastic member 950 is configured to apply force to the bottom surface 937 of the base 931 in an upward direction. In other words, the elastic member 950 applies force to the center pin 930 toward the second position. Therefore, when the driving member 990 does not move the center pin 930 to the first position, the center pin 930 automatically moves to the second position through the elastic member 950.

[0065] like Fig.10 As shown, the support mechanism 460 further includes a stopper 980. The stopper 980 is located below the base 931 of the center pin 930 and has a contact surface 982. When the center pin 930 is located at the first position, the contact surface 982 is configured to contact the lower surface 939 of the center pin 930. In other words, the stopper 980 is configured to contact the center pin 930 and stop the center pin 930 at the first position.

[0066] <Method of Holding Substrate Wf by Substrate Holder 440>

[0067] Next, an example of a method for holding the substrate Wf by the substrate holder 440 is described. First, the substrate Wf is placed on the sealing member 264 (see Fig.10 ). Next, in order to make the substrate holder 440 clamp the substrate Wf, the back plate assembly 470 is lowered from the upper side of the support member 462 toward the support member 462. Next, the driving member 990 presses the pressed surface 938 to apply force to the center pin 930 toward the first position (refer to Fig.11 ). As a result, the center pin 930 moves from the second position toward the first position. As a result, the center pin 930 contacts the peripheral portion of the substrate Wf and presses the substrate Wf. As a result, the substrate Wf moves to the position to be positioned. In this way, positioning based on the center pin 930 is performed. In addition, positioning based on the center pin 930 is, in principle, completed before the center pin 930 contacts the stopper 980. In other words, when the center pin 930 is between the first position and the second position, the positioning of the substrate Wf is completed. However, the positioning of the substrate Wf can also be completed when the center pin 930 contacts the stopper 980 and the center pin 930 stops at the first position.

[0068] Next, the back plate assembly 470 is lowered to a predetermined position and stops. Next, the sliding ring 478 rotates, and the sliding plate 479 of the sliding ring 478 is inserted into the second groove 466b (refer to Figure 4 ). Thus, the upward movement of the back plate assembly 470 is restricted. Next, the fluid source 488 supplies fluid to the diaphragm 484 via the flow path 449 and the flow path 476. Thus, the floating plate 472 moves downward, and the substrate Wf is clamped and fixed by the floating plate 472 and the sealing member 464. In other words, the substrate Wf is clamped and held by the support mechanism 460 and the back plate assembly 470. In this way, the substrate holder 440 holds the substrate Wf.

[0069] As described above, in the substrate holder 440 , when the support mechanism 460 and the back plate assembly 470 sandwich and hold the substrate Wf, the positioning member 920 can position the substrate Wf at a predetermined position.

[0070] In addition, in the substrate holder 440, when positioning the substrate Wf, the center pin 930 moves from the second position to the first position. At this time, due to the presence of the stopper 980, the center pin 930 stops reliably at the first position. Since the stopper 980 is provided on the support mechanism 460, the first position where the center pin 930 stops does not change relative to the support mechanism 460. Therefore, in the substrate holder 440, when positioning the substrate Wf, even if the floating plate 472 deviates from the design position relative to the support mechanism 460, the center pin 930 will not excessively press the substrate Wf to the center side closer to the design position. In other words, the substrate holder 440 can prevent the center pin 930 from excessively pressing the substrate Wf, causing the substrate Wf to deviate from the position where the substrate Wf should be arranged relative to the support mechanism 460.

[0071] In addition, as described above, the support mechanism 460 has a plurality of electric contacts 902. Therefore, there is no deviation of the contact position of the electric contact 902 due to the center pin 930 excessively pressing the substrate Wf to the center side relative to the designed position. In other words, the substrate holder 440 can prevent the deviation of the contact position of the electric contact 902 due to the center pin 930 excessively pressing the substrate Wf.

[0072] In addition, as described above, the driving member 990 has the spring 991. Thus, after the center pin 930 moves to the first position, the spring 991 is compressed, and the driving member 990 does not further press the center pin 930. As a result, there is no situation where an excessive force is applied to the driving member 990, the center pin 930, and the stopper 980 to damage these components. In addition, when the substrate Wf is large, the spring 991 of the driving member 990 plays a buffering role, and there is no situation where the substrate Wf is damaged due to the excessive force applied to the substrate Wf. In other words, the substrate holder 440 can prevent the substrate Wf from being damaged.

[0073] [Note]

[0074] A part or all of the above-mentioned embodiments may be described as the following supplementary notes, but are not limited to the following supplementary notes.

[0075] (Note 1)

[0076] The substrate holding frame involved in Note 1 comprises: a first holding member, and a second holding member that clamps and holds the substrate together with the above-mentioned first holding member, the above-mentioned second holding member comprises: a positioning component for positioning the above-mentioned substrate at a specified position, and a limiter, the above-mentioned positioning component comprises a center pin that can move between a first position and a second position, and is configured so that when the above-mentioned center pin moves from the above-mentioned second position to the above-mentioned first position, the above-mentioned center pin contacts the peripheral edge portion of the above-mentioned substrate and positions the above-mentioned substrate at the above-mentioned specified position, the above-mentioned first holding member comprises a driving component, and the driving component is configured to apply a force to the above-mentioned center pin toward the above-mentioned first position when the above-mentioned substrate is held by the above-mentioned first holding member and the above-mentioned second holding member, and the above-mentioned limiter is configured to contact the above-mentioned center pin and stop the above-mentioned center pin at the above-mentioned first position.

[0077] In the substrate holder according to Supplement 1, the center pin is reliably stopped at the first position due to the presence of the stopper. Since the stopper is provided on the second holder, the first position where the center pin stops does not change relative to the second holder. That is, in the substrate holder, when positioning the substrate, even if the first holder deviates from the designed position relative to the second holder, the center pin will not excessively press the substrate to the center side of the designed position.

[0078] (Note 2)

[0079] The substrate holder according to Supplementary Note 2 is the substrate holder according to Supplementary Note 1, wherein the second holder further includes an electric contact that contacts the substrate and supplies power to the substrate.

[0080] The substrate holder according to Supplementary Note 2 can prevent the contact position of the electric contact from being shifted due to the center pin excessively pressing the substrate to the center side rather than the designed position.

[0081] (Note 3)

[0082] The substrate holder according to Supplementary Note 3 is the substrate holder according to Supplementary Note 1 or 2, wherein the positioning member includes an elastic member for urging the center pin toward the second position.

[0083] In the substrate holder according to Supplementary Note 3, when the driving member does not move the center pin to the first position, the center pin is automatically moved to the second position by the elastic member.

[0084] (Note 4)

[0085] The substrate holder according to Supplementary Note 4 is the substrate holder according to any one of Supplementary Notes 1 to 3, wherein the driving member includes a plunger with a spring or an elastic body for urging the center pin toward the first position.

[0086] In the substrate holder according to Supplementary Note 4, when positioning the substrate, the plunger with a spring or an elastic body moves the center pin from the second position to the first position.

[0087] (Note 5)

[0088] The substrate holding frame involved in Note 5 is composed of, on the basis of the substrate holding frame recorded in any one of Notes 1 to 4, the above-mentioned center pin has a pressed surface, and the above-mentioned driving component is configured to press the above-mentioned pressed surface in a pressing direction perpendicular to the processed surface of the above-mentioned substrate when the above-mentioned substrate is held by the above-mentioned first holding member and the above-mentioned second holding member, and the above-mentioned pressed surface is orthogonal to the above-mentioned pressing direction.

[0089] In the substrate holder according to Supplementary Note 5, the driving component applies a force in a direction perpendicular to the pressed surface to the pressed surface. Therefore, when the driving component applies a force to the pressed surface, the driving component is not easy to slide on the pressed surface. As a result, the wear of the driving component or the pressed surface can be suppressed. In addition, the generation of tiny particles caused by the friction between the driving component and the pressed surface can also be suppressed.

[0090] (Note 6)

[0091] The substrate holding frame involved in Note 6 is composed of the substrate holding frame recorded in any one of Notes 1 to 5, wherein the center pin has a rotating shaft, the positioning component has a bearing supporting the rotating shaft, and the center pin rotates around the rotating shaft, thereby moving between the first position and the second position.

[0092] (Note 7)

[0093] The substrate holder according to Supplementary Note 7 is the substrate holder according to any one of Supplementary Notes 1 to 6, wherein the second holder has four of the positioning members.

[0094] In the substrate holder according to Supplementary Note 7, the four positioning members can position the substrate.

[0095] (Note 8)

[0096] The plating device involved in Note 8 is a plating device, which includes: a plating tank configured to accommodate a plating liquid, a substrate holder recorded in any one of Notes 1 to 7, and a lifting mechanism configured to lift and lower the substrate holder, the substrate holder is configured to hold the substrate with the plated surface facing downward, the second holder is a supporting mechanism configured to support the outer peripheral portion of the plated surface of the substrate, and the first holder is a back plate assembly arranged on the back side of the plated surface of the substrate and configured to clamp the substrate together with the supporting mechanism.

[0097] The plating device involved in Supplement 8 has the same effect as the substrate holder of Supplement 1. That is, in the plating device of Supplement 8, when positioning the substrate, even if the first holder deviates from the designed position relative to the second holder, the center pin will not excessively press the substrate to the center side of the designed position.

[0098] (Note 9)

[0099] The substrate positioning method involved in Note 9 is a substrate positioning method using a substrate holding frame recorded in any one of Notes 1 to 7, and the method includes the following steps: a step in which the first holding member and the second holding member clamp and hold the substrate; a step in which the driving member moves the center pin from the second position to the first position; a step in which the center pin positions the substrate at the specified position; and a step in which the stopper contacts the center pin to stop the center pin at the first position.

[0100] The substrate positioning method of Supplementary Note 9 has the same effect as the substrate holder of Supplementary Note 1. That is, in the substrate positioning method of Supplementary Note 9, when positioning the substrate, even if the first holder deviates from the designed position relative to the second holder, the center pin will not excessively press the substrate to the center side of the designed position.

[0101] Description of Reference Numerals

[0102] 264...sealing component; 400...plating module; 410...plating tank; 440...substrate holder; 442...lifting mechanism; 460...supporting mechanism; 462...supporting component; 470...back plate assembly; 472...floating plate; 474...back plate; 902...electric contact; 920...positioning component; 930...center pin; 934...rotating shaft; 935...contact surface; 938...pressed surface; 940...bearing; 950...elastic component; 980...stopper; 982...abutment surface; 990...driving component; 1000...plating device; Wf...substrate.

Claims

1. A substrate holder, wherein: have: a first retaining member, and a second holder for clamping and holding the substrate together with the first holder, The second retaining member has: a positioning member for positioning the substrate at a predetermined position, and Limiter, The positioning member includes a center pin that is movable between a first position and a second position, and is configured such that when the center pin moves from the second position to the first position, the center pin contacts the peripheral edge of the substrate and positions the substrate at the predetermined position. The first holding member includes a driving member configured to apply force to the center pin toward the first position when the substrate is held by the first holding member and the second holding member. The stopper is configured to come into contact with the center pin and stop the center pin at the first position.

2. The substrate holder according to claim 1, wherein: The second holder also has an electrical contact for contacting the substrate to supply power to the substrate.

3. The substrate holder according to claim 1 or 2, wherein: The positioning member includes an elastic member for urging the center pin toward the second position.

4. The substrate holder according to any one of claims 1 to 3, wherein The driving member includes a plunger with a spring or an elastic body for urging the center pin toward the first position.

5. The substrate holder according to any one of claims 1 to 4, wherein The center pin has a pressed surface, The driving member is configured to press the pressed surface in a pressing direction perpendicular to the processed surface of the substrate when the substrate is held by the first holding member and the second holding member. The pressed surface is orthogonal to the pressing direction.

6. The substrate holder according to any one of claims 1 to 5, wherein: The center pin has a rotation axis, The positioning member has a bearing for supporting the rotating shaft. The center pin rotates about the rotation axis to move between the first position and the second position.

7. The substrate holder according to any one of claims 1 to 6, wherein: The second holding member has four positioning components.

8. A plating device, wherein: The plating device comprises: A plating tank configured to contain a plating solution, The substrate holder according to any one of claims 1 to 7, and a lifting mechanism configured to lift and lower the substrate holder, The substrate holding frame is configured to hold the substrate with the plated surface facing downward. The second holder is a support mechanism configured to support the outer peripheral portion of the plated surface of the substrate. The first holder is a back plate assembly that is disposed on the back side of the plated surface of the substrate and is configured to sandwich the substrate together with the support mechanism.

9. A method for positioning a substrate, the method using the substrate holder according to any one of claims 1 to 7, wherein: The method comprises the following steps: The first holding member and the second holding member clamp and hold the substrate; The driving member moves the center pin from the second position to the first position; The center pin positions the substrate at the specified position; as well as The stopper contacts the center pin to stop the center pin at the first position.

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