Cover for cleaning module for cleaning semiconductor wafer and method for cleaning semiconductor wafer in cleaning line

Abstract

A cover and method for a cleaning module for cleaning a semiconductor wafer, in which the semiconductor wafer is treated with a liquid in a vertically oriented manner during a cleaning step, the cover comprises a main body with a wedge-shaped cross section, a sealing frame for placing the cover on the cleaning module, a cover covering the main body and having a groove for introducing the semiconductor wafer into the cleaning module, and a support fixed on the cover such that it can be displaced above the groove, characterized in that the cover has a first discharge channel, the first discharging channel is parallel to the groove and is machined in the upper side face of the support along the edge boundary, close to the groove, of the support; the cover is provided with a panel, and the panel can move above the main body and above the groove; and the cover is provided with a second discharge channel, and the second discharge channel is parallel to the groove and is machined in the upper side face of the panel along the edge boundary of the panel close to the groove. The holder and the panel push against each other such that the width of the slot is limited to a size necessary for movement of the gripping system during placement or reception of the semiconductor wafer by means of the gripping system.

Description

Technical Field

[0001] The invention relates to a cover of a cleaning module for cleaning semiconductor wafers, in which cleaning module the semiconductor wafers are treated with a fluid in a vertically oriented state during a cleaning step. The invention also relates to a method for cleaning semiconductor wafers in a cleaning line comprising at least one cleaning module having such a cover. Background Art

[0002] US2006 0 254 715A1 describes a method by which semiconductor wafers are transported between cleaning modules of a cleaning line, which are arranged one after the other so that a single wafer cleaning operation is performed in each of the cleaning modules. During this, at least one robot moves along a guide into one of the cleaning modules and a manipulator descends into the cleaning module in order to place or receive the semiconductor wafer in the cleaning module. A disadvantage here is that fluid dripping from the manipulator or the semiconductor wafer may reach the cleaning module and may jeopardize the success of the cleaning process.

[0003] According to US 2014 / 0209239 A1, a cleaning module with a closable cover can be provided. In the open state, the cover is intended to ensure access to the cleaning module, while in the closed state, the cover is intended to prevent fluid from being sprayed from the cleaning module into the environment during cleaning of semiconductor wafers. Summary of the invention

[0004] The object of the invention is to limit the unintentional arrival of fluid at the cleaning module.

[0005] The object of the present invention is achieved by a cover of a cleaning module for cleaning semiconductor wafers, in which the semiconductor wafers are treated with a fluid in a vertically oriented state during a cleaning step, the cover comprising a base part with a wedge-shaped cross-section, a sealing frame for placing the cover on the cleaning module, a cover covering the base part and having a groove for introducing the semiconductor wafer into the cleaning module, and a bracket fixed on the cover so as to be able to shift above the groove, characterized in that the cover has a first discharge channel, which is parallel to the groove and is incorporated into (or combined with) the upper side of the bracket along the edge boundary of the bracket close to the groove; and the cover has a panel, which can be shifted above the base part and above the groove; and the cover has a second discharge channel, which is parallel to the groove and is incorporated into the upper side of the panel along the edge boundary of the panel close to the groove.

[0006] The panel and the bracket that can be displaced above the slot of the cover are used to reduce the width of the slot to the greatest extent possible when the slot is open. Droplets that may fall into the cleaning module through the slot will be stopped if they hit the bracket or the panel. Droplets that fall on the bracket or the panel are discharged outwardly away from the cleaning module by means of the first discharge channel on the upper side of the bracket or the second discharge channel on the upper side of the panel.

[0007] The invention also relates to a method for cleaning semiconductor wafers in a cleaning line, the cleaning line comprising at least one cleaning module in which a vertically oriented semiconductor wafer is treated during a cleaning step with a fluid of the cleaning step, wherein a gripping system for picking up or putting down the semiconductor wafer is moved into the cleaning module through a slot of a cover of the cleaning module. The method is characterized in that the cleaning module is provided with a cover according to the invention, the support and the panel push against each other so that when the gripping system is used to pick up or put down the semiconductor wafer, the width of the slot is limited to the range necessary for the movement of the gripping system. Preferably, it is ensured that for such a movement towards the support or the panel, an additional clearance of no more than 2 mm is provided.

[0008] Preferably, the method is used for a cleaning line comprising two or more cleaning modules, each of which is provided with a cover according to the invention.

[0009] Embodiments of the present invention will be described below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a perspective view of a cover according to the present invention;

[0011] Figure 2 is a side view of the lid;

[0012] Figure 3 This is a plan view of the lid.

[0013] List of reference symbols used

[0014] 1 Base assembly

[0015] 2 Hood

[0016] 3 slots

[0017] 4 Bracket

[0018] 5 Panel

[0019] 6 Sleeve

[0020] 7 Guide Rail

[0021] 8 Slender hole

[0022] 9 Impact rod

[0023] 10 Discharge channel

[0024] 11. Discharge channel

[0025] 12 Sealing frame DETAILED DESCRIPTION

[0026] Figure 1 The cover shown comprises a base part 1, a sealing frame 12, a cover 2 having a slot 3, a bracket 4 and a panel 5. The base part 1 has a wedge-shaped cross section and is positioned on a cleaning module (not shown) by means of the sealing frame 12. The cover 2 having a slot 3 for introducing a semiconductor wafer into the cleaning module by means of a gripping system is fixed on the base part 1 by means of a sleeve 6 of the base part 1 and covers the base part 1. In the open state of the cover shown, the slot 3 is sandwiched by the bracket 4 on one side thereof and the panel 5 on the opposite side thereof. The bracket 4 is fixed on the guide rail 7 of the cover 2 so as to be able to shift over the slot 3. The bracket 4 can be shifted in the direction of the slot 3 so that it completely covers the slot 3 and thus moves the cover to the closed state. The panel 5 located at the other side of the slot 3 has an elongated hole 8, and the panel 5 can be pushed along the elongated hole 8 via the slot 3 so that the width of the slot 3 can be adjusted in the open state of the cover. Under the cover 2, an impact rod 9 is arranged, which is fixed to the lower side of the bracket 4. In the open state of the cover, the groove 3 is sandwiched by the drain channels 10 and 11. The drain channel 10 is incorporated into the upper side of the bracket 4, close to the edge boundary of the bracket 4 adjacent to the groove 3, and is oriented parallel to the groove 3. The drain channel 11 is incorporated into the upper side of the panel 5, close to the edge boundary of the panel adjacent to the groove 3, and is oriented parallel to the groove 3.

[0027] Figure 2 A side view of the cover is shown. Due to the wedge-shaped cross section of the base part 1, there is a descending slope towards the guide rail 7. The bracket 4 and the panel 5 are inclined according to this descending slope, so that droplets of fluid falling on the bracket 4 or the panel 5 are discharged along the discharge channel 10 or the discharge channel 11, and thus the droplets are prevented from falling into the cleaning module through the groove 3.

[0028] Figure 3 A top view of the cover in the open state is shown. The width of the slot depends on the length of the displacement path along which the support 4 and the panel 5 are pushed over the slot. The support 4 and the panel 5 are pushed against each other so that when the semiconductor wafer is placed in or received by the clamping system, the width of the slot is limited to the size required for the movement of the clamping system.

[0029] The possibility that fluid could inadvertently pass through the slot to the cleaning module when the cover is in the open state is effectively limited by adjusting the width of the slot.

Claims

1. A cover of a cleaning module for cleaning semiconductor wafers, in which the semiconductor wafers are treated with a fluid in a vertically oriented state during a cleaning step, the cover comprising a base member having a wedge-shaped cross-section, a sealing frame for placing the cover on the cleaning module, a cover covering the base member and having a groove for introducing the semiconductor wafer into the cleaning module, and a bracket fixed to the cover so as to be able to shift over the groove, the cover having a first discharge channel, the first discharge channel being parallel to the groove and being incorporated into the upper side of the bracket along an edge boundary of the bracket close to the groove; and the cover having a panel, the panel being able to shift over the base member and over the groove; and the cover having a second discharge channel, the second discharge channel being parallel to the groove and being incorporated into the upper side of the panel along an edge boundary of the panel close to the groove.

2. A method for cleaning semiconductor wafers in a cleaning line, the cleaning line comprising at least one cleaning module in which a vertically oriented semiconductor wafer is treated during a cleaning step with a fluid of the cleaning step, wherein: A gripping system for picking up or putting down the semiconductor wafer moves into the cleaning module through a slot of a cover of the cleaning module, wherein the cleaning module is provided with a cover according to claim 1, and a bracket and a panel push against each other so that when the gripping system is used to pick up or put down the semiconductor wafer, the width of the slot is limited to a range required for the movement of the gripping system.

3. The method according to claim 2, wherein: Ensure that no more than 2 mm of additional clearance is provided for movement of the gripping system towards the bracket or the panel.

4. The method according to claim 2 or 3, wherein: The cleaning line comprises two or more cleaning modules, each of which is provided with a cover according to claim 1 .

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