Conductive pressure-sensitive adhesive film, method for processing adherend, and method for manufacturing semiconductor device

Abstract

The conductive pressure-sensitive adhesive film according to the present invention is provided with a pressure-sensitive adhesive layer and a base material layer which are located on the side of an adherend, and the surface resistance value of the conductive pressure-sensitive adhesive film is 1 * 10 < 7 >-1 * 10 < 12 > Omega / square.

Description

Technical Field

[0001] The present invention relates to a conductive pressure-sensitive adhesive film, a method for processing an adherend, and a method for manufacturing a semiconductor device. Background Art

[0002] In the semiconductor manufacturing process, an electrostatic adsorption method is used as a method for fixing a semiconductor wafer on a stage of an etching device or the like in various processes such as etching, CVD (chemical vapor deposition), and PVD (physical vapor deposition). The electrostatic adsorption method is to apply a voltage between the stage and the semiconductor wafer placed on the stage via a dielectric layer, and adsorb the semiconductor wafer on the stage by the electrostatic force generated between the two (for example, see Japanese Patent Application Laid-Open No. 5-63062).

[0003] However, the electrostatic adsorption method requires, in principle, that the stage be one electrode and the workpiece (eg, semiconductor wafer) be the other electrode, and therefore cannot adsorb and fix an insulator as the workpiece onto the stage.

[0004] For example, since SOS (Silicon on Sapphire) and SOI (Silicon on Insulator) devices use insulating substrates, it is not possible to obtain strong adsorption force like semiconductor wafers, and electrostatic adsorption cannot be used. In addition, FPD (Flat Panel Display) and DVD (Digital Video Disc) use insulating substrates such as glass substrates, so electrostatic adsorption cannot be used either.

[0005] Therefore, a method has been proposed in which, when an insulating support is used, a conductive pressure-sensitive adhesive film is interposed between a support on which a semiconductor wafer is provided and a stage to perform electrostatic chuck adsorption (see, for example, Japanese Patent Nos. 4898199 and 5101449). Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] An object of one embodiment of the present disclosure is to provide a novel conductive pressure-sensitive adhesive film, a method for treating an adherend using the conductive pressure-sensitive adhesive film, and a method for manufacturing a semiconductor device.

[0008] Means for solving technical problems

[0009] The means for solving the above-mentioned technical problems include the following implementation modes.

[0010] <1> A conductive pressure-sensitive adhesive film, comprising a pressure-sensitive adhesive layer located on an adherend side and a substrate layer, wherein the surface resistance of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer side is 1×10 7 Ω / □~1×1012 Ω / □.

[0011] <2> A conductive pressure-sensitive adhesive film comprises a pressure-sensitive adhesive layer located on the adherend side and a substrate layer, and is used for an electrostatic chuck in which the adhesion with the adherend changes before and after the pressure-sensitive adhesive layer is irradiated with active energy rays.

[0012] <3> according to <1> The conductive pressure-sensitive adhesive film is used for electrostatic chucks.

[0013] <4> according to <1> ~ <3> The conductive pressure-sensitive adhesive film described in any one of the above aspects further comprises a conductive layer on the side of the substrate layer opposite to the surface on the pressure-sensitive adhesive layer side.

[0014] <5> according to <1> ~ <4> The conductive pressure-sensitive adhesive film described in any one of the above aspects, wherein a conductive layer is not disposed on a surface of the substrate layer on the pressure-sensitive adhesive layer side.

[0015] <6> according to <1> ~ <5> The conductive pressure-sensitive adhesive film according to any one of the preceding claims, wherein the surface resistance of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer side is 2×10 8 Ω / □~1×10 12 Ω / □.

[0016] <7> according to <1> ~ <6> The conductive pressure-sensitive adhesive film described above, wherein the elastic modulus of the substrate layer at 23° C. is 3.5 GPa or less.

[0017] <8> according to <1> ~ <7> The conductive pressure-sensitive adhesive film described in any one of the preceding claims, wherein the light transmittance of the conductive pressure-sensitive adhesive film is 85% or less at at least one wavelength included in the wavelength range of 380 nm to 780 nm.

[0018] <9> A method for processing an adherend, wherein <1> ~ <8> An adherend is attached to the pressure-sensitive adhesive layer of any one of the conductive pressure-sensitive adhesive films, and the adherend is adsorbed and fixed on an adsorption platform by electrostatic adsorption, and the adherend is processed.

[0019] <10> according to <9> In the method for processing the adherend, the processing is etching, CVD or PVD.

[0020] <11> according to <9> or <10> The method for processing an adherend, wherein the adherend comprises at least one selected from glass, ceramics, quartz and compound semiconductors.

[0021] <12> according to <9> ~ <11> The method for processing an adherend as described in any one of the above, wherein the adhesion between the above-mentioned conductive pressure-sensitive adhesive film and the adherend changes before and after the above-mentioned pressure-sensitive adhesive layer is irradiated with active energy rays, and the above-mentioned adherend is peeled off by irradiating the above-mentioned pressure-sensitive adhesive layer with the active energy rays after the above-mentioned processing is completed.

[0022] <13> A method for manufacturing a semiconductor device, wherein <1> ~ <8> An adherend is attached to the pressure-sensitive adhesive layer of any one of the conductive pressure-sensitive adhesive films, and the adherend is adsorbed and fixed on an adsorption platform by electrostatic adsorption, and the adherend is processed.

[0023] Effects of the Invention

[0024] According to one embodiment of the present disclosure, a novel conductive pressure-sensitive adhesive film, a method for treating an adherend using the conductive pressure-sensitive adhesive film, and a method for manufacturing a semiconductor device can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A diagram schematically showing the structure of a conductive pressure-sensitive adhesive film. DETAILED DESCRIPTION

[0026] The following is a detailed description of the methods for implementing the present disclosure. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not required unless otherwise specifically indicated. The numerical values ​​and their ranges are also the same and do not limit the present disclosure.

[0027] In the present disclosure, the term "step" includes not only steps that are independent of other steps, but also steps that cannot be clearly distinguished from other steps as long as the purpose of the step can be achieved.

[0028] In the present disclosure, a numerical range expressed using “to” includes the numerical values ​​described before and after “to” as the minimum value and the maximum value, respectively.

[0029] In the present disclosure, in the numerical range recorded in stages, the upper limit or lower limit recorded in one numerical range can also be replaced by the upper limit or lower limit of the numerical range recorded in other stages. In addition, in the numerical range recorded in the present disclosure, the upper limit or lower limit of its numerical range can also be replaced by the value shown in the embodiment.

[0030] In the present disclosure, each component may contain a plurality of substances corresponding thereto. When a plurality of substances corresponding to each component are present in the composition, the content rate or content of each component refers to the total content rate or total content of the plurality of substances present in the composition unless otherwise specified.

[0031] In the present disclosure, particles corresponding to each component may include plural types. When plural types of particles corresponding to each component are present in the composition, the particle size of each component refers to the value of a mixture of the plural types of particles present in the composition unless otherwise specified.

[0032] In the present disclosure, the term "layer" means that when observing a region where the layer exists, it includes a case where the layer is formed in the entire region as well as a case where the layer is formed in only a part of the region.

[0033] In the present disclosure, the thickness of the conductive pressure-sensitive adhesive film or each layer constituting the conductive pressure-sensitive adhesive film can be measured using a known method. For example, it can be measured using a micrometer or the like, or it can be measured from a cross-sectional image of the conductive pressure-sensitive adhesive film. Alternatively, the material constituting the layer can be removed using a solvent or the like, and the thickness can be calculated from the mass before and after removal, the density of the material, the area of ​​the layer, and the like. When the thickness of a layer is not constant, the arithmetic mean value measured at any five points is taken as the thickness of the layer.

[0034] In the present disclosure, “(meth)acrylic acid” refers to either or both of acrylic acid and methacrylic acid, and “(meth)acrylate” refers to either or both of acrylate and methacrylate.

[0035] <Conductive pressure-sensitive adhesive film>

[0036] The conductive pressure-sensitive adhesive film disclosed in the present invention comprises a pressure-sensitive adhesive layer located on the adherend side and a substrate layer, and the surface resistance value of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer side satisfies 1×10 7 Ω / □~1×10 12 Ω / □.

[0037] The use of the conductive pressure-sensitive adhesive film disclosed in the present invention is not particularly limited, and can be used, for example, for electrostatic chucks, and can be used when various processing is performed in a state where the adherend is attached to the pressure-sensitive adhesive layer and the adherend is adsorbed and fixed from the substrate layer side. The use of the conductive pressure-sensitive adhesive film is not limited to electrostatic chucks, and can also be used in processing of adherends other than electrostatic chucks, the manufacture of electronic parts, optical materials, etc., temporary protection of adherends, dicing tapes, etc.

[0038] The adherend of the conductive pressure-sensitive adhesive film of the present disclosure is not particularly limited, and examples thereof include members made of at least one selected from glass, ceramics, quartz, and compound semiconductors.

[0039] The adherend may also be a semiconductor wafer and a support provided on the surface of the semiconductor wafer opposite to the processing surface. The support is a component for protecting the semiconductor wafer. The support may be, for example, a component formed of at least one selected from glass, ceramics, quartz and compound semiconductors.

[0040] The surface resistance value of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer side satisfies 1×10 7 Ω / □~1×10 12 Ω / □ is sufficient, for example, it is preferred to satisfy 1×10 7 Ω / □~1×10 11 Ω / □, more preferably 1×10 7 Ω / □~1×10 10 Ω / □.

[0041] The surface resistance value of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer may satisfy 2×10 8 Ω / □~1×10 12 Ω / □, and can also satisfy 1×10 9 Ω / □~1×10 12 Ω / □. Thus, the conduction between the conductive pressure-sensitive adhesive film and the adherend can be suppressed, and damage to the adherend caused by electrostatic damage can be suppressed. For example, when the adherend is processed in a state where the adherend is adsorbed and fixed on the adsorption table by an electrostatic chuck, the surface resistance value of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer satisfies 1×10 9 Ω / □~1×10 12 Ω / □, which can suppress the conduction with the adherend and the adverse effects on the adherend caused by damage due to static electricity during the attachment or peeling of the conductive pressure-sensitive adhesive film.

[0042] (Pressure-sensitive adhesive layer)

[0043] The conductive pressure-sensitive adhesive film disclosed in the present invention has a pressure-sensitive adhesive layer located on the adherend side. The pressure-sensitive adhesive layer is provided by coating the pressure-sensitive adhesive on the substrate layer or the conductive layer provided on the substrate layer in a manner to achieve a predetermined thickness, followed by drying or heating. When the pressure-sensitive adhesive is applied, a common coating method can be used, and known methods such as gravure coating, die coating, reverse coating, comma coating, air knife coating, and Meyer rod coating can be used.

[0044] The type of pressure-sensitive adhesive is not particularly limited, and examples thereof include acrylic pressure-sensitive adhesives, rubber pressure-sensitive adhesives, vinyl alkyl ether pressure-sensitive adhesives, silicone pressure-sensitive adhesives, polyester pressure-sensitive adhesives, polyamide pressure-sensitive adhesives, urethane pressure-sensitive adhesives, fluorine pressure-sensitive adhesives, and styrene-diene block copolymer pressure-sensitive adhesives. Among them, the pressure-sensitive adhesive is more preferably an acrylic pressure-sensitive adhesive. The pressure-sensitive adhesive layer may contain only one type of pressure-sensitive adhesive, or two or more types of pressure-sensitive adhesives.

[0045] Examples of the acrylic pressure-sensitive adhesive include an acrylic pressure-sensitive adhesive containing, as a base polymer, an acrylic polymer (homopolymer or copolymer) using one or more kinds of (meth)acrylic acid alkyl esters as monomer components.

[0046] Examples of the alkyl (meth)acrylate constituting the acrylic pressure-sensitive adhesive include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate. In addition, the alkyl group of the (meth)acrylic acid alkyl ester may be either linear or branched.

[0047] Acrylic polymers are intended to improve cohesiveness, heat resistance, crosslinking properties, etc., and may contain structural units derived from other monomer components (copolymerizable monomer components) that can copolymerize with alkyl (meth)acrylates as needed. Examples of such copolymerizable monomer components include carboxyl-containing monomers such as (meth)acrylic acid (acrylic acid, methacrylic acid), carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; anhydride-containing monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl methacrylate; styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid , (meth)acrylamidepropanesulfonic acid, (meth)acrylamide sulfonate, (meth)acryloxynaphthalenesulfonic acid and other sulfonic acid group-containing monomers; 2-hydroxyethylacryloyl phosphate and other phosphate group-containing monomers; (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-butyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-methylolpropane (meth)acrylamide and other (N-substituted)amide monomers; (meth)acrylic acid aminoalkyl ester monomers such as (meth)acrylic acid aminoethyl ester, (meth)acrylic acid N,N-dimethylaminoethyl ester, (meth)acrylic acid tert-butylaminoethyl ester; (meth)acrylic acid methoxyethyl ester, (meth)acrylic acid (Meth) acrylic acid alkoxyalkyl ester monomers such as ethoxyethyl acrylate; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy-containing acrylic monomers such as glycidyl (meth)acrylate; styrene monomers such as styrene and α-methylstyrene; vinyl ester monomers such as vinyl acetate and vinyl propionate; olefin monomers such as isoprene, butadiene, and isobutylene; vinyl ether monomers such as vinyl ether; N-vinyl pyrrolidone, methylvinyl pyrrolidone, vinyl pyridine, vinyl piperidone, vinyl pyrimidine, vinyl piperazine, vinyl pyrazine, vinyl pyrrole, vinyl imidazole, vinyl oxazole, vinyl morpholine, N-vinyl carboxylic acid amides, N-vinyl Nitrogen-containing monomers such as alkenyl caprolactam; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide; itaconimide monomers such as N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexylitaconimide, and N-laurylitaconimide; succinimide monomers such as N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, and N-(meth)acryloyl-8-oxyoctamethylenesuccinimide;Diol acrylate monomers such as polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, and methoxypolypropylene glycol (meth)acrylate; acrylate monomers having heterocyclic rings, halogen atoms, silicon atoms, etc. such as tetrahydrofurfuryl (meth)acrylate, fluoro(meth)acrylate, and silicone (meth)acrylate; polyfunctional monomers such as hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, divinylbenzene, butyl di(meth)acrylate, and hexyl di(meth)acrylate. These copolymerizable monomer components may be used alone or in combination of two or more. ;

[0048] The acrylic copolymer can also be a cross-linked acrylic copolymer. The cross-linked acrylic copolymer can be synthesized by cross-linking the monomers that become the raw materials of the acrylic copolymer using a cross-linking agent. As the cross-linking agent used in the synthesis of the cross-linked acrylic copolymer, known cross-linking agents such as isocyanate compounds, melamine compounds, and epoxy compounds can be cited. In addition, in order to slowly form an extended mesh structure in the acrylic pressure-sensitive adhesive, the cross-linking agent can be a multifunctional cross-linking agent such as a trifunctional or tetrafunctional cross-linking agent.

[0049] The pressure-sensitive adhesive layer may further contain other components besides the pressure-sensitive adhesive and the crosslinking agent. Examples of other components include pressure-sensitive adhesive imparting resins, colorants, tackifiers, extenders, fillers, plasticizers, anti-aging agents, antioxidants, surfactants, and the like.

[0050] The conductive pressure-sensitive adhesive film disclosed herein may also be provided with a separator on the surface of the pressure-sensitive adhesive layer on the adherend side. Examples of the separator include resin films such as polyethylene terephthalate (PET), polyethylene, and polypropylene, resin films coated with release agents such as silicone release agents, fluorine release agents, and long-chain alkyl acrylate release agents, and paper.

[0051] The thickness of the pressure-sensitive adhesive layer is not particularly limited, and may be, for example, 3 μm or more, or 5 μm or more. The thickness of the pressure-sensitive adhesive layer may be, for example, 50 μm or less, or 30 μm or less.

[0052] (Base material layer)

[0053] The conductive pressure-sensitive adhesive film disclosed in the present invention has a substrate layer. The substrate layer is a layer used to support the adherend via the pressure-sensitive adhesive layer. In addition, the surface resistance value of the conductive pressure-sensitive adhesive film disclosed in the present invention on the side opposite to the pressure-sensitive adhesive layer side can be adjusted by adjusting the material and composition of the substrate layer.

[0054] The material of the substrate layer is not particularly limited. For example, resins such as polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyimides, polyamides, polyester ethers, polyamide-imides, fluorine-containing resins, and thermoplastic elastomers can be cited. Among them, polyolefins such as polyethylene and polypropylene and polyethylene terephthalate are preferred, and polyolefins such as polyethylene and polypropylene are more preferred from the viewpoint of following the adherend and detecting using a light sensor. From the viewpoint of reducing the elastic modulus of the substrate layer and improving the following the adherend, it is preferred that the substrate layer does not contain polyimide (e.g., polyimide containing biphenylimide rings).

[0055] The resin contained in the base material layer may be only one kind or two or more kinds.

[0056] The substrate layer may be a layer composed of the above resin, or may contain other components other than the resin. Other components that may be contained in the substrate layer include the above other components that may be contained in the pressure-sensitive adhesive layer, antistatic agents described later, conductive polymer materials, conductive materials such as metals, and the like.

[0057] The substrate layer may or may not be stretched. When stretched, the conductive pressure-sensitive adhesive film tends to have excellent strength, while when not stretched, the conductive pressure-sensitive adhesive film tends to have excellent stretchability.

[0058] The thickness of the substrate layer is not particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, and further preferably 30 μm or more. When the thickness of the substrate layer is 10 μm or more, it is difficult to break, and when the thickness of the substrate layer is 30 μm or more, the handling property is more excellent.

[0059] The thickness of the substrate layer is preferably 300 μm or less, more preferably 200 μm or less, and further preferably 100 μm or less. When the thickness of the substrate layer is 300 μm or less, sufficient conformability to the adherend (property of deforming in accordance with the shape of the adherend) can be obtained.

[0060] The elastic modulus of the substrate layer at 23°C is not particularly limited, but is preferably 3.5 GPa or less, more preferably 2.0 GPa or less, further preferably 1.5 GPa or less, and particularly preferably 1.0 GPa or less. When the elastic modulus of the substrate layer at 23°C is 3.5 GPa or less, there is a tendency that the followability to the adherend (the property of deforming along with the shape of the adherend) can be fully obtained.

[0061] The substrate layer may consist of only one layer or two or more layers. Examples of methods for obtaining a substrate layer consisting of two or more layers include a method of extruding materials of each layer by coextrusion and a method of laminating two or more films.

[0062] When the release film includes a conductive layer, the surface of the substrate layer provided with the conductive layer may be treated to improve adhesion with the conductive layer. Examples of the treatment method include surface treatments such as corona treatment and plasma treatment, and application of a primer.

[0063] The back side of the substrate layer (the side opposite to the side to be bonded) may be provided with a back side treatment agent for adjusting the roll-out property of the release film from the roller as required. As the back side treatment agent, silicone resin, fluorine-containing resin, polyvinyl alcohol, resin with alkyl group, etc. may be cited. These back side treatment agents may also be modified as required. Only one back side treatment agent may be used, or two or more may be used in combination.

[0064] (Conductive layer)

[0065] The conductive pressure-sensitive adhesive film of the present disclosure may further include a conductive layer. The position of the conductive layer is not particularly limited, and the conductive layer may be disposed between the pressure-sensitive adhesive layer and the substrate layer, or on the side of the substrate layer opposite to the side of the pressure-sensitive adhesive layer.

[0066] In the conductive film of the present invention, the conductive layer is not an essential layer. For example, the surface resistance value of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer side easily satisfies 1×10 7 Ω / □~1×10 12 From the perspective of Ω / □, a conductive layer may be provided.

[0067] The surface resistance of the conductive layer meets 1×10 7 Ω / □~1×10 12 Ω / □ is sufficient, for example, it is preferred to satisfy 1×10 7 Ω / □~1×10 111 Ω / □, more preferably 1×10 7 Ω / □~1×10 10 Ω / □.

[0068] In addition, the surface resistance of the conductive layer can also meet 1×10 9 Ω / □~1×10 12 Ω / □.

[0069] A conductive layer may also be disposed between the pressure-sensitive adhesive layer and the substrate layer, and on the side of the substrate layer opposite to the pressure-sensitive adhesive layer. In this case, a pressure-sensitive adhesive layer, a conductive layer, a substrate layer, and a conductive layer may be disposed in sequence. The compositions of the two conductive layers may be the same or different.

[0070] Alternatively, the conductive layer may be disposed only between the pressure-sensitive adhesive layer and the substrate layer, or only on the side of the substrate layer opposite to the side of the pressure-sensitive adhesive layer. In this case, the pressure-sensitive adhesive layer, the conductive layer, the substrate layer, and the conductive layer may be disposed in sequence (wherein the conductive layer is not disposed on the outside of the substrate layer), or the pressure-sensitive adhesive layer, the substrate layer, and the conductive layer may be disposed in sequence (wherein the conductive layer is not disposed between the pressure-sensitive adhesive layer and the substrate layer).

[0071] When a conductive layer is disposed between the pressure-sensitive adhesive layer and the substrate layer, it may precipitate onto the surface of the pressure-sensitive adhesive layer depending on the compatibility with the pressure-sensitive adhesive layer, and may affect the adherend when the adhesive is attached to the adherend (for example, there is a possibility that residues of the conductive layer adhere to the adherend). Therefore, the conductive layer is preferably disposed only on one side of the substrate layer opposite to the surface on the pressure-sensitive adhesive layer side, and the conductive layer is preferably not disposed on the surface on the pressure-sensitive adhesive layer side of the substrate layer.

[0072] The conductive layer is not particularly limited in composition as long as it can improve the conductivity of the conductive pressure-sensitive adhesive film and suppress charging. For example, it can be a layer containing conductive materials such as antistatic agents, conductive polymer materials, and metals. In addition, the conductive layer is provided by coating a conductive layer forming material containing a conductive material on the substrate layer in a manner to achieve a predetermined thickness and then drying or heating. When applying the conductive layer forming material, a common coating method can be used in the same manner as the coating of the pressure-sensitive adhesive.

[0073] As the antistatic agent contained in the conductive layer, there can be mentioned cationic antistatic agents having cationic groups such as quaternary ammonium salts, pyridinium salts, primary to tertiary amino groups, anionic antistatic agents having anionic groups such as sulfonate groups, sulfate ester groups, and phosphate ester groups, amphoteric antistatic agents such as amino acid systems and amino acid sulfate ester systems, nonionic antistatic agents having nonionic groups such as amino alcohol systems, glycerol systems, and polyethylene glycol systems, high molecular weight antistatic agents obtained by making these antistatic agents high in molecular weight, etc. The antistatic agent can also be a combination of a main agent and an auxiliary agent (curing agent, etc.).

[0074] Examples of the conductive polymer material contained in the conductive layer include polymer compounds having polythiophene, polyaniline, polypyrrole, polyacetylene, and the like in their skeletons.

[0075] Examples of the metal include aluminum, copper, gold, chromium, and tin. From the viewpoint of availability, aluminum is preferred.

[0076] There is no particular limitation on the method of forming the conductive layer. Examples include a method of laminating a metal foil on one side of a film that becomes a substrate layer, a method of applying a conductive layer material on one side of a film that becomes a substrate layer, and applying the conductive layer material by vapor deposition.

[0077] The thickness of the conductive layer is not particularly limited as long as the antistatic effect of the conductive pressure-sensitive adhesive film can be sufficiently obtained, and may be, for example, in the range of 0.01 μm to 1 μm.

[0078] Figure 1 An example of the structure of a conductive pressure-sensitive adhesive film including a pressure-sensitive adhesive layer, a substrate layer, and a conductive layer is schematically shown. Figure 1 The conductive pressure-sensitive adhesive film 40 shown includes a pressure-sensitive adhesive layer 10 , a base material layer 20 , and a conductive layer 30 in this order.

[0079] The total thickness of the conductive pressure-sensitive adhesive film is not particularly limited and can be set according to desired physical properties (elongation, elastic modulus, resistivity, etc.), for example, 30 μm to 300 μm, 35 μm to 250 μm, or 40 μm to 200 μm.

[0080] The transmittance of the conductive pressure-sensitive adhesive film of the present invention in the visible light region may be 98% or less, or 85% or less. By being 70% or less, detection by light irradiation becomes easy. In addition, the transmittance of the conductive pressure-sensitive adhesive film of the present invention in the visible light region may be 0% or more.

[0081] The visible light region refers to, for example, a range of 380 nm to 780 nm. At at least one wavelength included in the wavelength range, the light transmittance of the conductive pressure-sensitive adhesive film may satisfy the above range (for example, 85% or less).

[0082] <Modification>

[0083] A modified example of the conductive pressure-sensitive adhesive film disclosed herein may be a conductive pressure-sensitive adhesive film having a pressure-sensitive adhesive layer and a substrate layer located on the adherend side, and used for an electrostatic chuck application in which the adhesion between the pressure-sensitive adhesive layer and the adherend changes before and after the pressure-sensitive adhesive layer is irradiated with active energy rays. By changing (e.g., decreasing) the adhesion between the pressure-sensitive adhesive layer and the adherend before and after the pressure-sensitive adhesive layer is irradiated with active energy rays, the adherend can be easily peeled off after the processing of the adherend is completed, and the handling property is excellent.

[0084] The active energy ray is not particularly limited as long as it can change the adhesion between the pressure-sensitive adhesive layer and the adherend by irradiation, and examples thereof include ultraviolet rays, visible rays, and electron beams.

[0085] The conductive pressure-sensitive adhesive film of the modified example may satisfy the above-mentioned structure or preferred structure of the conductive pressure-sensitive adhesive film. For example, in the conductive pressure-sensitive adhesive film of the modified example, its surface resistance value may satisfy 1×10 7 Ω / □~1×10 12 Ω / □.

[0086] In the conductive pressure-sensitive adhesive film of the modified example, the type of the pressure-sensitive adhesive is not particularly limited, and the pressure-sensitive adhesives exemplified in the conductive pressure-sensitive adhesive film of the present disclosure can be preferably used. In particular, acrylic pressure-sensitive adhesives are preferred as the pressure-sensitive adhesive.

[0087] <Method for processing bonded body and method for manufacturing semiconductor device>

[0088] The processing method of the adherend disclosed in the present invention is as follows: the adherend is attached to the pressure-sensitive adhesive layer of the conductive pressure-sensitive adhesive film disclosed in the present invention, the adherend is adsorbed and fixed on an adsorption table by electrostatic adsorption, and the adherend is processed. In addition, a semiconductor device can be manufactured by processing the adherend.

[0089] In the method for processing an adherend disclosed in the present invention, an adherend is attached to the pressure-sensitive adhesive layer of the conductive pressure-sensitive adhesive film, and the adherend attached with the conductive pressure-sensitive adhesive film is placed on an adsorption table, for example, in a vacuum chamber of a dry etching device, etc. Then, the adherend adsorbed and fixed on the adsorption table is processed.

[0090] As the adherend, there can be cited a member comprising at least one selected from glass, ceramics, quartz and compound semiconductors. As an example of the adherend, there can be cited a laminated body formed by bonding a support for supporting the semiconductor substrate to a semiconductor substrate having an electronic device formed on the surface. The support can be a member comprising at least one selected from glass, ceramics, quartz and compound semiconductors.

[0091] After placing the adherend on the adsorption table, a voltage can be applied to the internal electrodes provided inside the adsorption table to generate positive / negative charges on the conductive pressure-sensitive adhesive film and the surface of the adsorption table, and the adherend can be adsorbed and fixed on the adsorption table by the static electricity acting therebetween.

[0092] Examples of the processing performed on the adherend adsorbed and fixed on the adsorption stage include etching, CVD (chemical vapor deposition), PVD (physical vapor deposition), and the like.

[0093] When a conductive pressure-sensitive adhesive film is used in which the adhesion to the adherend changes before and after the pressure-sensitive adhesive layer is irradiated with active energy rays, the adherend can be peeled off by irradiating the pressure-sensitive adhesive layer with active energy rays after the processing.

[0094] After the peeled adherend is taken out from the vacuum chamber of a dry etching apparatus or the like, it may be subjected to treatments such as washing.

[0095] Example

[0096] The conductive pressure-sensitive adhesive film of the present disclosure is described below based on examples, but the present disclosure is not limited to the following examples.

[0097] <Example 1 to Example 4>

[0098] As the base material layer, the films shown in Table 1, one surface of which was subjected to a corona treatment, were prepared.

[0099] A pressure-sensitive adhesive having the composition of the pressure-sensitive adhesive layer shown in Table 1 was applied to the corona-treated surface of the substrate layer, and heated at 100° C. for 1 minute to form a pressure-sensitive adhesive layer having a thickness of 10 μm or 20 μm. In addition, as the pressure-sensitive adhesive, one in which the total amount of the components in Table 1 was diluted to 10% by mass with toluene / MEK (methyl ethyl ketone) (8 / 2 (mass ratio)) was used.

[0100] A conductive layer forming material having a conductive layer composition shown in Table 1 was applied to the surface of the substrate layer opposite to the corona treated surface, and heated at 100° C. for 1 minute to form a conductive layer with a thickness of 0.2 μm. In addition, as the conductive layer forming material, a material in which the total amount of the components in Table 1 was diluted to 1.65 mass % or 2.0 mass % with methanol was used.

[0101] The separators shown in Table 1 were attached to the pressure-sensitive adhesive layer provided on the base material layer.

[0102] As described above, a conductive pressure-sensitive adhesive film in which the separator, the pressure-sensitive adhesive layer, the base material layer, and the conductive layer are sequentially laminated is obtained.

[0103] The elastic modulus of each base material layer at 23° C. is as follows.

[0104] Polypropylene: 0.7GPa

[0105] Polyolefin: 0.1GPa

[0106] Polyethylene terephthalate: 3.4 GPa

[0107] <Comparative Example 1>

[0108] The same operations as in Example 3 were carried out except that a conductive layer was not formed. Thus, a pressure-sensitive adhesive film having a separator, a pressure-sensitive adhesive layer, and a substrate layer laminated in this order was obtained.

[0109] The following evaluation tests were carried out using the obtained conductive pressure-sensitive adhesive film and pressure-sensitive adhesive film. The results are shown in Table 1.

[0110] <Si wafer properties>

[0111] The separator of the conductive pressure-sensitive adhesive film and the pressure-sensitive adhesive film was peeled off, and the adhesive properties (Si wafer properties) when a Si wafer was pasted on the pressure-sensitive adhesive layer were evaluated.

[0112] Specifically, the 180° peel strength (gf / 25 mm) of the Si wafer was measured under the conditions of 23°C and a tensile speed of 300 mm / min. This value was taken as the adhesive force at 23°C. The results are shown in Table 1.

[0113] Furthermore, after a Si wafer was pasted on the pressure-sensitive adhesive layer, the conductive pressure-sensitive adhesive film with the Si wafer pasted thereon was heated at 110°C for 1 hour. After that, the 180° peel strength (gf / 25 mm) of the Si wafer was measured under the conditions of 23°C and a tensile speed of 300 mm / min. This value was taken as the adhesive force after 1 hour at 110°C. The results are shown in Table 1.

[0114] In addition, after a Si wafer was pasted on the pressure-sensitive adhesive layer, the conductive pressure-sensitive adhesive film and the pressure-sensitive adhesive film with the Si wafer pasted thereon were stored at 23°C for 14 days. After storage, it was evaluated whether the Si wafer翘ed from the pressure-sensitive adhesive layer. The results are shown in Table 1.

[0115] <Glass properties>

[0116] The separator of the conductive pressure-sensitive adhesive film was peeled off, and the adhesive properties (glass properties) when glass was pasted on the pressure-sensitive adhesive layer were evaluated.

[0117] Specifically, the 180° peel strength (gf / 25 mm) of the glass was measured under the conditions of 23°C and a tensile speed of 300 mm / min. This value was taken as the adhesive force at 23°C. The results are shown in Table 1.

[0118] Furthermore, after glass was pasted on the pressure-sensitive adhesive layer, the conductive pressure-sensitive adhesive film with the glass pasted thereon was heated at 110°C for 1 hour. After that, the 180° peel strength (gf / 25 mm) of the glass was measured under the conditions of 23°C and a tensile speed of 300 mm / min. This value was taken as the adhesive force after 1 hour at 110°C. The results are shown in Table 1.

[0119] <Surface resistance value>

[0120] Use an insulation resistance meter (digital ultra-high resistance / micro current meter made by Advantest) to measure the surface resistance of the conductive pressure-sensitive adhesive film and the pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer. Specifically, after placing the conductive pressure-sensitive adhesive film and the pressure-sensitive adhesive film in an environment with a humidity of 55% RH for more than 1 hour, apply a voltage of 500V for 1 minute and measure the surface resistance value (Ω), and calculate the surface resistance value (Ω / □) using the following formula. The results are shown in Table 1. In addition, in Table 1, α.E+0β and α.E+β (α and β are integers) refer to α×10 β .

[0121] Surface resistance value = π(D+d) / (Dd)×R

[0122] π: circumference, D: inner diameter of the ring electrode, d: outer diameter of the ring electrode, R: surface resistance

[0123] The value of π(D+d) / (Dd) used in the calculation of the surface resistance value is 18.84.

[0124] <Light Transmittance (%)>

[0125] The light transmittance (%) of the three-layer laminate structure of the pressure-sensitive adhesive layer, the substrate layer, and the conductive layer used in each Example and Comparative Example was measured using a red LED (wavelength of about 650 nm).

[0126] <Surface roughness (μm)>

[0127] The surface roughness (arithmetic mean roughness Ra) of the substrate layer used in each Example and Comparative Example was measured using a surface roughness measuring machine (Model SE3500, Kosaka Laboratory Co., Ltd.).

[0128] <Evaluation of Electrostatic Chuck>

[0129] The conductive pressure-sensitive adhesive film and the separator of the pressure-sensitive adhesive film were peeled off, and a quartz substrate as an adherend was attached to the pressure-sensitive adhesive layer, and an electrostatic chuck evaluation was performed as follows.

[0130] An attempt was made to apply a voltage between the stage and the conductive pressure-sensitive adhesive film or the pressure-sensitive adhesive film disposed on the stage while the adherend was attached to the pressure-sensitive adhesive layer, and to use the static electricity generated between the two to adsorb the adherend on the stage. At this time, if the leakage of He for cooling the adherend was less than 10 Pa / min, the electrostatic chuck was evaluated as A (good), and if the leakage of He was more than 10 Pa / min, the electrostatic chuck was evaluated as B (bad). The results are shown in Table 1.

[0131] <Optical sensor detection evaluation>

[0132] The conductive pressure-sensitive adhesive film and the separator of the pressure-sensitive adhesive film were peeled off, and a quartz substrate as an adherend was attached to the pressure-sensitive adhesive layer, and the optical sensor detection evaluation was performed as follows. In the optical sensor detection evaluation, light was irradiated from the thickness direction of the conductive pressure-sensitive adhesive film and the pressure-sensitive adhesive film to the area where the adherend was attached, and it was evaluated whether the substrate could be detected by the optical sensor when the substrate was transported. If it could be detected, it was rated as A, and if it could be detected but difficult to detect, it was rated as B.

[0133] Table 1 shows the results.

[0134]

[0135] As shown in Table 1, in Examples 1 to 4, the electrostatic chuck evaluation was good, and in particular, in Examples 1 to 3, the optical sensor detection evaluation was also good.

[0136] On the other hand, in Comparative Example 1, the electrostatic chuck was evaluated as poor.

[0137] The disclosure of PCT / JP2023 / 020722 filed on June 2, 2023 is incorporated in its entirety into this specification by reference.

[0138] All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, or technical standard was specifically and individually described by reference.

Claims

1. A conductive pressure-sensitive adhesive film comprising a pressure-sensitive adhesive layer and a substrate layer located on the adherend side, wherein: The surface resistance of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer is 1×10 7 Ω / □~1×10 12 Ω / □.

2. A conductive pressure-sensitive adhesive film comprising a pressure-sensitive adhesive layer located on an adherend side and a substrate layer, which is used for an electrostatic chuck in which the adhesion with the adherend changes before and after the pressure-sensitive adhesive layer is irradiated with active energy rays.

3. The conductive pressure-sensitive adhesive film according to claim 1, which is used for electrostatic chuck applications.

4. The conductive pressure-sensitive adhesive film according to any one of claims 1 to 3, wherein The substrate layer further includes a conductive layer on the side opposite to the surface on the pressure-sensitive adhesive layer side.

5. The conductive pressure-sensitive adhesive film according to any one of claims 1 to 4, wherein No conductive layer is disposed on the surface of the substrate layer on the pressure-sensitive adhesive layer side.

6. The conductive pressure-sensitive adhesive film according to any one of claims 1 to 5, wherein The surface resistance of the conductive pressure-sensitive adhesive film on the side opposite to the pressure-sensitive adhesive layer side is 2×10 8 Ω / □~1×10 12 Ω / □.

7. The conductive pressure-sensitive adhesive film according to any one of claims 1 to 6, wherein The elastic modulus of the substrate layer at 23° C. is 3.5 GPa or less.

8. The conductive pressure-sensitive adhesive film according to any one of claims 1 to 7, wherein The light transmittance of the conductive pressure-sensitive adhesive film is 85% or less at at least one wavelength included in the wavelength range of 380 nm to 780 nm.

9. A method for treating an adherend, wherein: An adherend is attached to the pressure-sensitive adhesive layer of the conductive pressure-sensitive adhesive film according to any one of claims 1 to 8, and the adherend is adsorbed and fixed on an adsorption table by electrostatic adsorption, and the adherend is processed.

10. The method for processing an adherend according to claim 9, wherein: The processing is etching, CVD or PVD.

11. The method for processing an adherend according to claim 9 or 10, wherein: The adherend includes at least one selected from glass, ceramics, quartz and compound semiconductors.

12. The method for treating an adherend according to any one of claims 9 to 11, wherein: The conductive pressure-sensitive adhesive film changes its adhesion to the adherend before and after the pressure-sensitive adhesive layer is irradiated with active energy rays. The adherend is peeled off by irradiating the pressure-sensitive adhesive layer with the active energy ray after the processing.

13. A method for manufacturing a semiconductor device, wherein: An adherend is attached to the pressure-sensitive adhesive layer of the conductive pressure-sensitive adhesive film according to any one of claims 1 to 8, and the adherend is adsorbed and fixed on an adsorption table by electrostatic adsorption, and the adherend is processed.

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