Electronic device including printed circuit board

Abstract

An electronic device according to an embodiment may include: a housing including a front portion, a rear portion opposite to the front portion, and a side portion for surrounding an inner space between the front portion and the rear portion; a display visually exposed to the outside of the electronic device through the front portion; and a printed circuit board disposed in the internal space. In one embodiment, a printed circuit board may include: a plurality of circuit boards arranged parallel to each other and on which electronic components are arranged; and one or more middleware disposed between the plurality of circuit boards and connecting an adjacent pair of circuit boards in a height direction. In one embodiment, one or more through-holes, penetrations, and one or more interposer through-holes may be formed in one or more interposers.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a printed circuit board. Background Art

[0002] Technology has been developed to improve the efficiency of a mounting space and / or a wiring space in an electronic device by efficiently arranging a plurality of electric / electronic components in the electronic device. Summary of the invention

[0003] According to aspects of the present disclosure, an electronic device includes: a housing including a front surface, a rear surface opposite to the front surface, and a side surface surrounding an internal space between the front surface and the rear surface; and a printed circuit board disposed in the internal space, wherein the printed circuit board includes: a plurality of circuit boards substantially parallel to each other and including one or more electrical components, and one or more inserters disposed between the plurality of circuit boards and connecting a pair of circuit boards adjacent to each other in a height direction among the plurality of circuit boards, wherein the pair of circuit boards are spaced apart from the one or more inserters by a gap, and one or more board through-holes are formed through at least one of the plurality of circuit boards in a height direction, wherein the one or more inserters include: one or more through-holes formed through the one or more inserters in a height direction, one or more penetrations disposed in the through-holes in the one or more through-holes and configured to electrically connect the pair of circuit boards, and one or more inserter through-holes formed through the one or more inserters in a height direction and configured to each communicate with the one or more board through-holes of the pair of circuit boards, and wherein the printed circuit board also includes a non-conductive filler disposed in the gap.

[0004] The plurality of circuit boards may further include: a first circuit board including a first board surface and a second board surface located on a side of the first circuit board opposite to the first board surface; and a second circuit board including a third board surface substantially parallel to the first circuit board and facing the second board surface and a fourth board surface located on a side of the second circuit board opposite to the third board surface. The one or more interposers may further include a first interposer disposed between the first circuit board and the second circuit board. The first circuit board may further include a first board through hole from one or more board through holes, the first interposer may include a first interposer through hole from one or more interposer through holes, and the first interposer through hole may be connected to the first board through hole.

[0005] The second circuit board may further include a second through-board via from among the one or more through-board vias, and the second through-board via may be in communication with the first interposer via.

[0006] When viewed in the height direction, the cross-sectional area of ​​one or more board through-holes may be different from the cross-sectional area of ​​one or more interposer through-holes.

[0007] The printed circuit board may be configured to receive a liquid non-conductive filler through one or more board through-holes and one or more interposer through-holes and to allow the liquid non-conductive filler to flow through the gap.

[0008] The multiple circuit boards may further include: a first circuit board including a first board surface and a second board surface located on a side of the first circuit board opposite to the first board surface; a second circuit board including a third board surface substantially parallel to the first circuit board and facing the second board surface and a fourth board surface located on a side of the second circuit board opposite to the third board surface; and a third circuit board including a fifth board surface substantially parallel to the first circuit board and facing the fourth board surface and a sixth board surface on a side of the third circuit board opposite to the fifth board surface, wherein the second circuit board may be arranged between the first circuit board and the fifth board surface, and wherein the one or more inserters may further include: a first inserter arranged between the first circuit board and the second circuit board and a second inserter arranged between the second circuit board and the third circuit board.

[0009] The first circuit board may also include a first board through hole from one or more board through holes, and the first inserter may include a first inserter through hole from one or more inserter through holes. The second circuit board may also include a second board through hole from one or more board through holes, and the second inserter may include a second inserter through hole from one or more inserter through holes. The first board through hole may be formed from the first board surface through the first circuit board to the second board surface, and the second board through hole may be formed from the first board surface through the second circuit board to the second board surface. The first inserter through hole may be formed through the first inserter in the height direction and may be connected to the first board through hole and the second board through hole, and the second inserter through hole may be formed through the second inserter in the height direction and may be connected to the second board through hole.

[0010] The first interposer through hole may be communicated with the second interposer through hole through a gap between the first interposer and the second circuit board.

[0011] When viewed from the height direction, the second interposer through-hole may not overlap with the first interposer through-hole.

[0012] The third circuit board may further include a third board through-hole from the one or more board through-holes, the third board through-hole may be formed from the fifth board surface through the third circuit board to the sixth board surface, and the third board through-hole may communicate with the second interposer through-hole.

[0013] When viewed from the height direction, the second interposer through-hole may not overlap with the third board through-hole.

[0014] The cross-sectional shape of one or more board through holes when viewed from the height direction may be substantially circular or polygonal, and the cross-sectional shape of one or more interposer through holes when viewed from the height direction may be substantially circular or polygonal.

[0015] When viewed from the height direction, at least one of the one or more board through holes and at least one of the one or more plug-in through holes may overlap, and when viewed from the height direction, at least one of the one or more board through holes and at least one of the one or more plug-in through holes may have substantially similar cross-sectional shapes.

[0016] One or more interposers may be disposed along a perimeter of the plurality of circuit boards, and the printed circuit board may be configured to receive a liquid non-conductive filler through one or more board through-holes and one or more interposer through-holes and to allow the liquid non-conductive filler to flow through gaps around the perimeters of the plurality of circuit boards.

[0017] When viewed from a height direction, edges of the plurality of circuit boards and edges of the one or more interposers may be substantially aligned.

[0018] According to aspects of the present disclosure, a printed circuit board includes: a first circuit board, which includes a first board surface and a second board surface on a side of the first circuit board opposite to the first board surface; a second circuit board, which includes a third board surface substantially parallel to the first circuit board and facing the second board surface, and a fourth board surface located on a side of the second circuit board opposite to the third board surface; and a first interposer, which is arranged between the first circuit board and the second circuit board and connects the first circuit board to the second circuit board in a height direction perpendicular to the first board surface, wherein a first gap configured to receive a liquid non-conductive filler is formed between the first interposer and the first circuit board, and a first interposer is provided between the first interposer and the second circuit board A second gap configured to receive a liquid non-conductive filler is formed therebetween, wherein one or more board through-holes are formed through at least one of the first circuit board and the second circuit board in a height direction, wherein the first interposer comprises: one or more through-holes formed through the first interposer in a height direction; a through-piece arranged in the through-holes of the one or more through-holes and configured to electrically connect the first circuit board to the second circuit board; and one or more first interposer through-holes formed through the first interposer in a height direction and configured to be respectively connected to the one or more board through-holes, and wherein the printed circuit board further comprises a non-liquid non-conductive filler arranged in the first gap and the second gap.

[0019] The one or more through-board holes may include at least one of: a first through-board hole formed from the first board surface through the first circuit board to the second board surface; and a second through-board hole formed from the third board surface through the second circuit board to the fourth board surface. At least one of the first through-board hole and the second through-board hole may be connected to at least one of the one or more first interposer through-holes.

[0020] According to aspects of the present disclosure, a printed circuit board includes: a first circuit board including a first board surface and a second board surface located on a side of the first circuit board opposite to the first board surface; a second circuit board including a third board surface substantially parallel to the first circuit board and facing the second board surface and a fourth board surface located on a side of the second circuit board opposite to the third board surface; a third circuit board including a fifth board surface substantially parallel to the first circuit board and facing the fourth board surface and a sixth board surface located on a side of the third circuit board opposite to the fifth board surface, wherein the second circuit board is arranged between the first circuit board and the fifth board surface; a first interposer arranged between the first circuit board and the second circuit board and connecting the first circuit board to the second circuit board in a height direction perpendicular to the first board surface; and a second interposer arranged between the second circuit board and the third circuit board and connecting the second circuit board to the third circuit board in a height direction perpendicular to the third board surface, wherein the first interposer and the first circuit board are separated by a first gap, the first interposer and the second circuit board are separated by a second gap, the second interposer and the second circuit board are separated by a third gap, and the second interposer and The third circuit board is separated by a fourth gap, wherein one or more board through holes are formed through at least one of the first circuit board, the second circuit board and the third circuit board in a height direction, wherein the first interposer includes: a first through hole formed through the first interposer in a height direction; a first through piece disposed in the first through hole and configured to electrically connect the first circuit board to the second circuit board; and a first interposer through hole formed through the first interposer in a height direction and configured to communicate with the one or more board through holes, wherein the second interposer includes: a second through hole formed through the second interposer in a height direction; a second through piece disposed in the second through hole and configured to electrically connect the second circuit board to the third circuit board; and a second interposer through hole formed through the second interposer in a height direction and configured to communicate with the one or more board through holes, wherein the first gap, the second gap, the third gap and the fourth gap are configured to receive a non-conductive filler through the one or more board through holes and at least one of the first interposer through hole and the second interposer through hole, and wherein the printed circuit board further includes a non-conductive filler disposed in the first gap, the second gap, the third gap and the fourth gap.

[0021] The one or more board through holes may include at least one of: a first board through hole formed from the first board surface through the first circuit board to the second board surface; a second board through hole formed from the third board surface through the second circuit board to the fourth board surface; and a third board through hole formed from the fifth board surface through the third circuit board to the sixth board surface, and at least one of the first board through hole, the second board through hole and the third board through hole may be connected to at least one of the first inner plug-in through hole and the second inner plug-in through hole.

[0022] When viewed from the height direction, the second interposer through-hole may not overlap with the first interposer through-hole.

[0023] According to aspects of the present disclosure, a printed circuit board includes: a first circuit board including a first board through-hole; a second circuit board substantially parallel to the first circuit board; an inserter including an inserter through-hole and a through-piece, wherein the inserter is arranged between the first circuit board and the second circuit board; a first joining element arranged between the first circuit board and the inserter and electrically connected to the through-piece and the first circuit board; and a second joining element arranged between the second circuit board and the inserter and electrically connected to the through-piece and the second circuit board, wherein a first gap is formed between the first circuit board and the inserter, and a second gap is formed between the second circuit board and the inserter, and wherein the printed circuit board is configured to receive a liquid non-conductive filler through one or more of the first board through-hole, the inserter through-hole, the first gap, and the second gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment; Figure 2a is a perspective view of an electronic device according to an embodiment viewed from one direction; Figure 2b is a perspective view of the electronic device according to the embodiment viewed from another direction; Figure 2c is an exploded perspective view of an electronic device according to an embodiment; Figure 3a is a perspective view of a printed circuit board according to an embodiment; Figure 3b yes Figure 3a An enlarged view of area A; Figure 3c is along Figure 3b A cross-sectional view along line BB; Figure 3d is a cross-sectional view of an insert according to an embodiment; Figure 3e is a cross-sectional view of a printed circuit board according to an embodiment; Figure 3f is a diagram showing a filling flow of a filler in a printed circuit board according to an embodiment; Figure 4a and Figure 4b is a diagram showing shapes of through holes having different cross-sectional areas according to an embodiment; Figure 5a is a perspective view of a printed circuit board according to an embodiment; and Figure 5b and Figure 5c According to the embodiment Figure 5a Cross-sectional view along line CC. DETAILED DESCRIPTION

[0025] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same reference numerals denote the same elements, and repeated descriptions thereof will be omitted.

[0026] Figure 1 is a block diagram showing an electronic device in a network environment according to an embodiment. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be integrated into a single integrated component (eg, display module 160).

[0027] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0028] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., ISP or CP) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., NPU) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence model is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0029] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0030] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0031] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0032] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0033] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0034] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., the electronic device 102, such as a speaker or earphone) directly or wirelessly connected to the electronic device 101.

[0035] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0036] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 to an external electronic device (e.g., electronic device 102) directly (e.g., via wiring) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0037] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his or her sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0039] The camera module 180 may capture still images and moving images. According to embodiments, the camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0040] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0041] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more CPs capable of operating independently from the processor 120 (e.g., AP) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as a plurality of components (e.g., a plurality of chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network such as the first network 198 or the second network 199 using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the SIM 196.

[0043] The wireless communication module 192 may support 5G networks after 4G networks and next generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low latency communications (URLLC). The wireless communication module 192 may support high frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 may support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0044] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0045] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a PCB, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., a top surface or a side surface) of the PCB, or adjacent to the second surface and capable of transmitting or receiving signals in the specified high frequency band.

[0046] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0047] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be run in the electronic device 101 may be run in one or more of the external electronic devices (e.g., the external electronic device 102 and the external electronic device 104 or the server 108). For example, if the electronic device 101 needs to automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or MEC to provide ultra-low latency services. In an embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0048] The electronic device according to the embodiments disclosed herein may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0049] Figure 2a is a perspective view of an electronic device according to an embodiment viewed from one direction, Figure 2b is a perspective view of the electronic device according to the embodiment viewed from another direction, and Figure 2cis an exploded perspective view of an electronic device according to an embodiment.

[0050] Reference Figure 2a to Figure 2c , the electronic device 201 (eg, the electronic device 101 ) may include a housing 210 including a first surface 210 a (eg, a front surface), a second surface 210 b (eg, a rear surface), and a third surface 210 c (eg, a side surface), the third surface 210 c surrounding a space between the first surface 210 a and the second surface 210 b.

[0051] In an embodiment, the first surface 210a may be formed by a first plate 211a, at least a portion of which is substantially transparent. For example, the first plate 211a may include a polymer plate or a glass plate including at least one coating. The second surface 210b may be formed by a substantially opaque second plate 211b. For example, the second plate 211b may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination thereof. The third surface 210c may be formed by a frame 211c, which is coupled to the first plate 211a and the second plate 211b and includes metal and / or polymer. In an embodiment, the second plate 211b and the frame 211c may be integrally and seamlessly formed. In an embodiment, the second plate 211b and the frame 211c may be formed by substantially the same material (e.g., aluminum).

[0052] In an embodiment, the first plate 211a may include a plurality of first peripheral regions 212a-1 that are rounded in a direction from at least one area of ​​the first surface 210a toward the second plate 211b and extend in one direction (e.g., + / -Y direction), a plurality of second peripheral regions 212a-2 that are rounded in a direction from at least one area of ​​the first surface 210a toward the second plate 211b and extend in another direction (e.g., + / -X direction), and a plurality of third peripheral regions 212a-3 that are rounded in a direction from at least one area of ​​the first surface 210a toward the second plate 211b and are located between the plurality of first peripheral regions 212a-1 and the plurality of second peripheral regions 212a-2. In an embodiment, the second plate 211b may include a plurality of fourth peripheral regions 212b-1 that are rounded in a direction from at least one area of ​​the second surface 210b toward the first plate 211a and extend in one direction (e.g., + / -Y direction), a plurality of fifth peripheral regions 212b-2 that are rounded in a direction from at least one area of ​​the second surface 210b toward the first plate 211a and extend in another direction (e.g., + / -X direction), and a plurality of sixth peripheral regions 212b-3 that are rounded in a direction from at least one area of ​​the second surface 210b toward the first plate 211a and are located between the plurality of fourth peripheral regions 212b-1 and the plurality of fifth peripheral regions 212b-2.

[0053] The electronic device 201 may include a display 261 (e.g., a display module 160). In an embodiment, the display 261 may be located on the first surface 210a. In an embodiment, the display 261 may be exposed through at least a portion of the first plate 211a (e.g., a plurality of first peripheral areas 212a-1, a plurality of second peripheral areas 212a-2, and a plurality of third peripheral areas 212a-3). In an embodiment, the display 261 may have a shape substantially the same as that of the outer edge of the first plate 211a. In an embodiment, the periphery of the display 261 may be substantially consistent with the outer edge of the first plate 211a. In an embodiment, the display 261 may include a touch sensing circuit, a pressure sensor for measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic stylus. In an embodiment, the display 261 may include a screen display area 261a that is visually exposed and displays content through pixels or a plurality of units. In an embodiment, the screen display area 261a may include a sensing area 261a-1 and / or a camera area 261a-2. The sensing area 261a-1 may overlap at least one area of ​​the screen display area 261a. The sensing area 261a-1 may allow an input signal related to the sensor module 276 (e.g., sensor module 176) to be transmitted. Similar to the screen display area 261a that does not overlap with the sensing area 261a-1, the sensing area 261a-1 may display content. For example, the sensing area 261a-1 may display content when the sensor module 276 is not working. The camera area 261a-2 may overlap at least one area of ​​the screen display area 261a. The camera area 261a-2 may allow an optical signal related to the first camera module 280a (e.g., camera module 180) to be transmitted. Similar to the screen display area 261a that does not overlap with the camera area 261a-2, the camera area 261a-2 may display content. For example, the camera area 261a-2 may display content when the first camera module 280a is not working.

[0054] The electronic device 201 may include an audio module 270 (eg, audio module 170). In an embodiment, the audio module 270 may be located on the third surface 210c. In an embodiment, the audio module 270 may obtain sound through at least one hole.

[0055] The electronic device 201 may include a sensor module 276. In an embodiment, the sensor module 276 may be located on the first surface 210a. The sensor module 276 may form a sensing area 261a-1 in at least a portion of the screen display area 261a. The sensor module 276 may receive an input signal sent through the sensing area 261a-1 and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, or ultrasound). For another example, the input signal may include a signal related to the user's biometric information (e.g., fingerprint).

[0056] The electronic device 201 may include a first camera module 280a, a second camera module 280b (e.g., camera module 180), and a flash 280c. In an embodiment, the first camera module 280a may be located on the first surface 210a, and the second camera module 280b and the flash 280c may be located on the second surface 210b. In an embodiment, at least a portion of the first camera module 280a may be located under the display 261. In an embodiment, the first camera module 280a may receive an optical signal sent through the camera area 261a-2. In an embodiment, the second camera module 280b may include a plurality of camera modules (e.g., dual cameras, triple cameras, or quad cameras). In an embodiment, the flash 280c may include a light emitting diode or a xenon lamp.

[0057] The electronic device 201 may include a sound output module 255 (eg, the sound output module 155). In an embodiment, the sound output module 255 may be located on the third surface 210c. In an embodiment, the sound output module 255 may include one or more holes.

[0058] The electronic device 201 may include an input module 250 (eg, input module 150). In an embodiment, the input module 250 may be located on the third surface 210c. In an embodiment, the input module 250 may include at least one key input device.

[0059] The electronic device 201 may include a connection terminal 278 (e.g., connection terminal 178). In an embodiment, the connection terminal 278 may be located on the third surface 210c. For example, when the electronic device 201 is viewed from one direction (e.g., +Y direction), the connection terminal 278 may be located in the central portion of the third surface 210c, and the sound output module 255 may be located on one side (e.g., right side) relative to the connection terminal 278.

[0060] The electronic device 201 may include a support body 240, PCBs 251 and 252, and a battery 289 (eg, Figure 1The support body 240 may include a first board 211a and a second board 211b. At least a portion of the support body 240 may form the housing 210 together with the first board 211a and the second board 211b. In an embodiment, the support body 240 may include a frame structure 241 (e.g., a frame 211c) and a board structure 242. The frame structure 241 may be formed to surround the periphery of the board structure 242. The frame structure 241 may connect the periphery of the first board 211a and the periphery of the second board 211b, surround the space between the first board 211a and the second board 211b, and form the third surface 210c of the electronic device 201. The board structure 242 may include one or more placement portions 242a and 242b that accommodate one or more PCBs 251 and 252. For example, the electronic device 201 may include a first PCB 251 and a second PCB 252, and the board structure 242 may include a first seating portion 242a in which the first PCB 251 is seated and a second seating portion 242b in which the second PCB 252 is seated.

[0061] In an embodiment, the display 261 may be on a surface (e.g., bottom surface) of the board structure 242, and the first PCB 251 and the second PCB 252 may be on another surface (e.g., top surface) of the board structure 242. In an embodiment, the board structure 242 may include an opening 245 located between the first placement portion 242a and the second placement portion 242b and passing through both surfaces of the board structure 242. The opening 245 may accommodate the battery 289. Although Figure 2a to Figure 2c The electronic device 201 shown has a belt-type or plate-type appearance, but the appearance of the electronic device 201 is not limited to the belt-type or plate-type. For example, the electronic device 201 may be a rollable or foldable electronic device. For another example, the electronic device 201 may be a portable electronic device such as a smart phone as well as an electronic device such as a laptop computer or a home appliance.

[0062] Figure 3a is a three-dimensional diagram of a PCB according to an embodiment, Figure 3b yes Figure 3a A magnified view of area A, Figure 3c is along Figure 3b A cross-sectional view of line BB, Figure 3d is a cross-sectional view of an insert according to an embodiment, Figure 3e is a cross-sectional view of a PCB according to an embodiment, and Figure 3f is a diagram illustrating a filling flow of a filler in a PCB according to an embodiment.

[0063] refer to Figure 3a to Figure 3f , PCB 300 (for example, Figure 2c PCBs 251 and 252) may be used in electronic devices (e.g., Figure 2cIn an embodiment, the PCB 300 may be formed as a multi-layer circuit board structure including one or more circuit boards 310 .

[0064] In an embodiment, PCB 300 may include circuit boards 310 respectively including electrical components, one or more interposers 320 connecting circuit boards 310 to each other, one or more through holes 330 formed through PCB 300 , and filler 340 coating at least a portion of a surface of PCB 300 .

[0065] In an embodiment, the circuit board 310 may include a first circuit board 311 and a second circuit board 312 that are parallel to each other. In an embodiment, the surfaces of the first circuit board 311 and the second circuit board 312 may include one or more electrical components. For example, the electrical components may include components for performing functions in the electronic device, such as AP, GPU, and PMIC.

[0066] In an embodiment, the first circuit board 311 may include a first board surface 311a and a second board surface 311b opposite to the first board surface 311a. In an embodiment, the second circuit board 312 may include a third board surface 312a and a fourth board surface 312b opposite to the third board surface 312a. In an embodiment, the second circuit board 312 may be arranged so that its third board surface 312a may face the second board surface 311b of the first circuit board 311. In an embodiment, the first circuit board 311 and the second circuit board 312 may be substantially parallel to each other, so that the second board surface 311b and the third board surface 312a may be spaced apart from each other.

[0067] In an embodiment, the interposer 320 may be between the circuit boards 310 which are parallel to each other, and the circuit boards 310 may be arranged in a height direction (eg, Figure 3a In an embodiment, the inner plug-in 320 may include one or more through holes (via hole) 3241 formed by passing through the inner plug-in 320 in the height direction of the PCB 300. In an embodiment, the through holes 3241 may each include a via 324. In an embodiment, the via 324 may electrically connect a pair of adjacent circuit boards 310 connected by the inner plug-in 320 to each other. For example, the via 324 may be directly or indirectly electrically connected to a circuit or electrical component on a pair of circuit boards 310. In an embodiment, the via 324 may include a conductive material to electrically connect electrical components on the circuit board 310. In an embodiment, the through hole 3241 may be connected to the circuit board 310 through a joining element 323 to be described below.

[0068] In an embodiment, the interposer 320 may include a first interposer 321 that connects the first circuit board 311 to the second circuit board 312. For example, the first interposer 321 may connect the second board surface 311b of the first circuit board 311 to the third board surface 312a of the second circuit board 312 along a height direction perpendicular to the second board surface 311b. Hereinafter, for ease of description, the direction perpendicular to the second board surface 311b (e.g., Figure 3a The Z-axis direction) can be called the height direction.

[0069] In addition, despite the Figures 3a to 3e The PCB 300 shown in FIG. 1 includes two circuit boards 310 and one interposer 320 connecting the two circuit boards 310, but the above example is only for convenience of description, and the number of circuit boards 310 included in the PCB 300 and the number of interposers 320 included in the PCB 300 are not limited thereto. Figure 5a As shown, PCB (e.g. Figure 5a The PCB 500 may include three circuit boards (eg, Figure 5a The circuit board 510) and two interposers (eg, Figure 5a ), and it should be noted that the PCB may also include four or more circuit boards and three or more interposers.

[0070] In an embodiment, the first interposer 321 may be located at an edge of the first circuit board 311 and at an edge of the second circuit board 312. For example, when facing the second board surface 311b of the first circuit board 311, the first interposer 321 may be arranged along at least some peripheries of the second board surface 311b and may connect the first circuit board 311 and the second circuit board 312. For example, the first interposer 321 may be arranged in a closed loop along respective edges of the first circuit board 311 and the second circuit board 312.

[0071] In an embodiment, when the first inner plug-in 321 is located at an edge of the first circuit board 311 or an edge of the second circuit board 312, and when facing the first board surface 311a, the edge of the first circuit board 311 or the edge of the second circuit board 312 may not actually be stepped compared to the outer surface of the first inner plug-in 321.

[0072] In an embodiment, the first interposer 321 may electrically connect the first circuit board 311 to the second circuit board 312. For example, the first interposer 321 may be connected to the first circuit board 311 and the second circuit board 312 through a plurality of joining elements 323. In an embodiment, the joining elements 323 may be between the circuit board 310 and the interposer 320, and may connect the circuit board 310 to the interposer 320.

[0073] For example, the engaging elements 323 may be provided on the first interposer 321 in a direction facing the second board surface 311b and the third board surface 312a. In an embodiment, the engaging elements 323 may be arranged in various forms, and each of the engaging elements 323 may be substantially the same shape.

[0074] In an embodiment, a gap 350 may be between the interposer 320 and the circuit board 310 based on the height direction of the PCB 300. For example, the gap 350 may be formed by a bonding element 323 between the circuit board 310 and the interposer 320 connected to each other. In an embodiment, a liquid filler 340 to be described below may fill the gap 350 between the circuit board 310 and the interposer 320. In an embodiment, a first gap 351 may be between the second board surface 311b of the first circuit board 311 and the first interposer 321, and a second gap 352 may be between the third board surface 312a of the second circuit board 312 and the first interposer 321.

[0075] In an embodiment, a through hole 330 may be formed through the PCB 300 in the height direction. In an embodiment, the through hole 330 may be at a position where the circuit board 310 overlaps the inner plug 320 when facing the first board surface 311a. For example, the through hole 330 may be formed through a portion where the circuit board 310 is connected to the inner plug 320 in the height direction. In an embodiment, the lengths of the through holes 330 in the height direction may be different from each other. In an embodiment, the through hole 330 may be formed through at least one of the circuit board 310 and the inner plug 320 in the height direction of the PCB 300.

[0076] Hereinafter, a description of the through hole 330 formed through the PCB 300 is provided under the assumption that the filler 340 is supplied in a liquid state into the interposer 320 through the first board surface 311a. Figure 3a to Figure 3f , the first circuit board 311 is shown on top of the second circuit board 312, and the through hole 330 is shown to be formed from the first board surface 311a through the PCB 300 along the -Z axis direction to describe that when the filler 340 is supplied to the PCB 300, the filler 340 flows along the direction of gravity.

[0077] In an embodiment, the through hole 330 may include a board through hole 331 formed through the circuit board 310 and an interposer through hole 332 formed through the interposer 320. In an embodiment, at least some of the board through holes 331 and the interposer through holes 332 forming one through hole 330 may overlap in a height direction so that the board through holes 331 and the interposer through holes 332 may communicate with each other. In an embodiment, the number of the board through holes 331 and the number of the interposer through holes 332 may be one or more.

[0078] In an embodiment, at least one of the circuit boards 310 may include a board through hole 331. The board through hole 331 may be formed through the circuit board 310 in the height direction of the PCB 300. In an embodiment, the board through hole 331 may include a first board through hole 331a formed through the first circuit board 311 in the height direction and a second board through hole 331b formed through the second circuit board 312 in the height direction. In an embodiment, the first board through hole 331a may be formed through the first circuit board 311 to the second board surface 311b from the first board surface 311a in the height direction of the PCB 300. In an embodiment, the second board through hole 331b may be formed through the second circuit board 312 to the fourth board surface 312b from the third board surface 312a in the height direction of the PCB 300.

[0079] In an embodiment, the interposer through-hole 332 may be formed through the interposer 320 in the height direction of the PCB 300. In an embodiment, one or more interposer through-holes 332 may be formed through one interposer 320. In an embodiment, the interposer through-hole 332 formed through the interposer 320 may communicate with a board through-hole 331 of the circuit board 310 adjacent to the interposer through-hole 332. For example, when viewed from the height direction of the PCB 300, the interposer through-hole 332 may overlap with the board through-hole 331, so that the interposer through-hole 332 and the board through-hole 331 may be integrally formed. In an embodiment, at least one interposer through-hole 332 formed through one interposer 320 may not overlap with a board through-hole 331 of the circuit board 310 adjacent to the interposer through-hole 332. In this case, the interposer through-hole 332 and the board through-hole 331 that do not overlap each other may communicate with each other indirectly through a gap 350 between the circuit board 310 and the interposer 320.

[0080] In an embodiment, the interposer through hole 332 may include a first interposer through hole 332a formed through the first interposer 321. In an embodiment, based on the height direction of the PCB 300, the first interposer through hole 332a may be located at a position overlapping or non-overlapping with the first board through hole 331a and / or the second board through hole 331b.

[0081] In an embodiment, when viewed from the height direction of the PCB 300, the through hole 330 may have a substantially circular or polygonal cross-sectional shape, but the circular or polygonal shape is merely an example, and the cross-sectional shape of the through hole 330 is not limited thereto. In other words, the cross section of the through hole 330 may be formed in various shapes according to the inflow condition of the filler 340 or the design condition of the PCB 300. In an embodiment, when viewed from the height direction of the PCB 300, and the board through hole 331 overlaps with the interposer through hole 332, the board through hole 331 and the interposer through hole 332 may have substantially the same shape (e.g., a circle).

[0082] In an embodiment, the filler 340 may be supplied to the PCB 300 in a liquid state and may be applied to at least a portion of the surface of the PCB 300. In an embodiment, the filler 340 may flow into the inside of the PCB 300 through the through hole 330 formed through the PCB 300. In an embodiment, the filler 340 flowing into the inside of the PCB 300 (e.g., the inside of the circuit board 310, the inside of the interposer 320, or the gap 350 between the circuit board 310 and the interposer 320) through the through hole 330 may fill the gap 350 between the circuit board 310 and the interposer 320. In an embodiment, the filler 340 may include a non-conductive material. In an embodiment, the filler 340 may be supplied to the PCB 300 in a liquid state, may be hardened by heating or at room temperature after being supplied, and may coat at least a portion of the surface of the PCB 300. For example, the filler 340 may coat a portion connecting the circuit board 310 to the interposer 320. In an embodiment, the filler 340 may fill and coat the gap 350 between the circuit board 310 and the interposer 320, and may increase the hardness of the PCB 300. In an embodiment, the filler 340 flowing into the inside of the PCB 300 through the through hole 330 may fill and coat the through hole 330 in addition to the gap 350 between the circuit board 310 and the interposer 320.

[0083] In an embodiment, when the filler 340 is supplied to the inside of the interposer 320 through the through hole 330, the area of ​​the PCB 300 can be reduced. For example, since the liquid filler 340 falls in the direction of gravity, when the filler 340 is directly applied to the outer surface of the interposer 320, a dummy area of ​​the circuit board 310 protruding outside the interposer 320 may be required to place the liquid filler 340. In an embodiment, when the through hole 330 for supplying the filler 340 is formed through the PCB 300, the dummy area of ​​the circuit board 310 for preventing the filler 340 from falling can be omitted, and the size of the PCB 310 can be reduced.

[0084] In an embodiment, when the filler 340 is supplied to the PCB 300 in a liquid state, the liquid filler 340 may be supplied to the inside of the interposer 320 through the through hole 330. In an embodiment, the filler 340 may flow into the inside of the PCB 300 through the through hole 330 formed through the PCB 300, for example, through the first board surface 311a. In an embodiment, the filler 340 injected into the inside of the PCB 300 may flow in the height direction of the PCB 300, for example, in the gravity direction (for example, Figure 3c -Z axis direction) flow.

[0085] In an embodiment, the fillers 341 and 342 each flowing through the first plate through-holes 331a-1 and 331a-2 may coat the second plate surface 311b by flowing through the first gap 351 between the second plate surface 311b and the first interposer 321. In an embodiment, the fillers 341 and 342 each flowing through the first plate through-holes 331a-1 and 331a-2 may flow toward the first interposer through-holes 332a-1 and 332a-2. In an embodiment, the fillers 341 and 342 each flowing through the first interposer through-holes 332a-1 and 332a-2 may flow through the second gap 352 between the first interposer 321 and the third plate surface 312a, and may cover the third plate surface 312a.

[0086] In an embodiment, when the first interposer through hole 332a-2 overlaps the second board through hole 331b, the filler 342 flowing through the first interposer through hole 332a-2 may flow through the second circuit board 312 to the fourth board surface 312b. In this case, the filler 342 may coat the fourth board surface 312b.

[0087] In an embodiment, when the first interposer through-hole 332a-1 does not overlap with the second board through-hole 331b, the filler 341 flowing through the first interposer through-hole 332a-1 may flow in the direction of gravity (eg, Figure 3dThe through hole 330 may be formed through the first circuit board 311, the first interposer 321, and the second circuit board 312 when the first board through hole 331a-2, the first interposer through hole 332a-2, and the second board through hole 331b overlap each other. Therefore, the through hole 330 may be used to supply the filler 342 after the second circuit board 312 is arranged on top of the first circuit board 311 in the direction of gravity, contrary to the case where the first interposer through hole 332a-1 does not overlap with the second board through hole 331b. In this case, the filler 342 supplied from the fourth board surface 312b through the second board through hole 331b may flow toward the first circuit board 311 in the direction of gravity, and may flow toward the first gap 351 between the second board surface 311b and the first interposer 321. Therefore, the filler 340 may be uniformly applied between the first and second circuit boards 311 and 312 and the first interposer 321 .

[0088] In the following, reference Figure 3f To describe the filling flow of the filler 340. Although for ease of description, Figure 3f 3. The first circuit board 311 and the first board through-hole 331a are mainly shown in FIG. 3, but this is only an example, and the filling flow of the circuit board 310 through which the through-hole 330 is formed may also be substantially the same as the following description.

[0089] refer to Figure 3f , the filler 340 flowing through the first board through hole 331 formed through the first circuit board 311 may flow through the first gap 351 between the first circuit board 311 and the first interposer 321, and may flow to the second board surface 311b. In an embodiment, the number of the first board through hole 331 may be multiple. In an embodiment, based on one first board through hole 331a, the filler 340 may flow in two directions along the periphery of the first circuit board 311. In an embodiment, at least some of the flow paths of the filler 340 flowing through the plurality of first board through holes 311 may overlap. In an embodiment, in the case where at least some of the flow paths of the filler 340 overlap, the filler 340 may be uniformly applied along the edge of the first circuit board 311.

[0090] Figure 4a and Figure 4b 2 is a diagram illustrating shapes of through holes having different cross-sectional areas according to an embodiment.

[0091] Reference Figure 4a and Figure 4bThe through hole 330 may include a first board through hole 331a formed through the first board surface 311a and a first interposer through hole 332a formed through the first interposer 321. In an embodiment, the first board through hole 331a may be formed starting from a surface of the first circuit board 311 (e.g., the first board surface 311a) and may be formed along a height direction of the PCB 300 (e.g., Figure 4a In an embodiment, the first interposer through hole 332a may pass through the interposer (eg, Figure 3a The first board through hole 331a may be connected to the first interposer through hole 332a in the height direction. In an embodiment, when viewed from the height direction of the PCB 300, the cross-sectional area of ​​the first board through hole 331a may be different from the cross-sectional area of ​​the first interposer through hole 332a. For example, the cross-sectional area of ​​the first board through hole 331a may be greater than or less than the cross-sectional area of ​​the first interposer through hole 332a. In an embodiment, the cross-sectional area of ​​the first board through hole 331a and the cross-sectional area of ​​the first interposer through hole 332a may vary according to the respective design conditions of the circuit board 310 and the interposer 320 and the inflow condition of the filler 340. In an embodiment, when facing the first board surface 311a, the arrangement distance (for example, in Figure 4a The arrangement distance on the XY plane of the circuit board 310 and the interposer 320 may vary according to the respective design conditions of the circuit board 310 and the interposer 320 and the inflow condition of the filler 340.

[0092] Hereinafter, a PCB according to an embodiment is described. Unless otherwise described, the description of the above embodiment may be equally applied to the following embodiments.

[0093] Figure 5a is a perspective view of a printed circuit board according to an embodiment, and Figure 5b and Figure 5c According to the embodiment Figure 5a Cross-sectional view along line CC.

[0094] Reference Figure 5a to Figure 5c , the PCB 500 may include a plurality of circuit boards 510 parallel to each other, a plurality of interposers 520 electrically connecting the circuit boards 510 to each other, through holes 530 formed through the circuit boards 510 and the interposers 520 , and a filler 540 coating at least a portion of a surface of the PCB 500 .

[0095] In an embodiment, the circuit board 510 may include a first circuit board 511, a second circuit board 512, and a third circuit board 513 that are parallel to each other. In an embodiment, the first circuit board 511 may include a first board surface 511a and a second board surface 511b opposite to the first board surface 511a. In an embodiment, the second circuit board 512 may include a third board surface 512a substantially parallel to the first circuit board 511 and a fourth board surface 512b opposite to the third board surface 512a. In an embodiment, the third circuit board 513 may include a fifth board surface 513a substantially parallel to the first circuit board 511 (in the case where the second circuit board 512 is located between the first circuit board 511 and the fifth board surface 513a) and a sixth board surface 513b opposite to the fifth board surface 513a. In an embodiment, the third circuit board 513 may be arranged so that its fifth board surface 513a may face the fourth board surface 512b of the second circuit board 512. In an embodiment, the second circuit board 512 and the third circuit board 513 may be substantially parallel to each other, such that the fourth board surface 512 b and the fifth board surface 513 a may be spaced apart from each other.

[0096] In an embodiment, the interposer 520 may be located between the circuit boards 510 that are parallel to each other, and may be arranged along a height direction of the PCB 500 (eg, Figure 5a In an embodiment, the inserter 520 may include a through hole 5241 formed through the inserter 520 in the height direction of the PCB 500. In an embodiment, the through hole 5241 may include a through piece 524 for electrically connecting the circuit boards 510 parallel to each other. In an embodiment, the through piece 524 may include a conductive material to electrically connect the electrical components on the circuit board 510. In an embodiment, the through hole 5241 may be connected to the circuit board 510 through the bonding element 523.

[0097] In an embodiment, the interposer 520 may include a first interposer 521 and a second interposer 522, wherein the first interposer 521 is located between the first circuit board 511 and the second circuit board 512 and electrically connects the first circuit board 511 to the second circuit board 512, and the second interposer 522 is located between the second circuit board 512 and the third circuit board 513 and electrically connects the second circuit board 512 to the third circuit board 513. For example, the first interposer 521 may connect the second board surface 511b of the first circuit board 511 to the third board surface 512a of the second circuit board 512 in a height direction perpendicular to the board surface, and the second interposer 522 may connect the fourth board surface 512b of the second circuit board 512 to the fifth board surface 513a of the third circuit board 513 in a height direction. In an embodiment, when facing the first board surface 511a, the first interposer 521 may be at an edge of the first circuit board 511 and an edge of the second circuit board 512, and the second interposer 522 may be at an edge of the second circuit board 512 and an edge of the third circuit board 513. In an embodiment, based on a direction perpendicular to the first plate surface 511a (eg, Figure 5a In the Z-axis direction), the first interposer 521 and the second interposer 522 may overlap or not overlap each other, or overlap or not overlap the first circuit board 511 to the third circuit board 513. In an embodiment, the first interposer 521 and the second interposer 522 may connect a pair of circuit boards 510 adjacent to each other, and may have various arrangement forms according to design conditions. For example, at least some of the periphery of the interposer 520 may protrude from the inside of the periphery of the circuit board 510 to the outside.

[0098] In an embodiment, one or more through holes 5241 may be formed through the first interposer 521 and the second interposer 522 in the height direction of the PCB 500. In an embodiment, the through holes 5241 may each include a through piece 524. In an embodiment, the through piece 524 may electrically connect a pair of adjacent circuit boards 510 connected by the interposer 520 to each other. For example, the through piece 524 in the through hole 5241 formed through the first interposer 521 may electrically connect the first circuit board 511 to the second circuit board 512. The through piece 524 in the through hole 5241 formed through the second interposer 522 may electrically connect the second circuit board 512 to the third circuit board 513. In an embodiment, the through hole 5241 may be connected to the circuit board 510 through the engaging element 523 to be described below.

[0099] In an embodiment, the interposer 520 may include a plurality of bonding elements 523 for electrically connecting a plurality of adjacent circuit boards 510. In an embodiment, the bonding elements 523 may be located between the circuit board 510 and the interposer 520 to contact the board surface and may connect the circuit board 510 to the interposer 520.

[0100] In an embodiment, the gap 550 may be between the interposer 520 and the circuit board 510 based on the height direction of the PCB 500. For example, the interposer 520 and the circuit board 510 may be spaced apart from each other by the engagement element 523, and the gap 550 may be formed between the interposer 520 and the circuit board 510. In an embodiment, the first gap 551 may be between the second board surface 511b of the first circuit board 511 and the first interposer 521, the second gap 552 may be between the third board surface 512a of the second circuit board 512 and the first interposer 521, the third gap 553 may be between the fourth board surface 512b of the second circuit board 512 and the second interposer 522, and the fourth gap 554 may be between the fifth board surface 513a of the third circuit board 513 and the second interposer 522.

[0101] Hereinafter, when describing the through hole 530 formed through the PCB 500, the first circuit board 511 is shown on top of the second circuit board 512, the second circuit board 512 is shown on top of the third circuit board 513, and the through hole 530 is shown as formed through the PCB 500 along the -Z axis direction to describe the flow of the filler 540 along the direction of gravity when being supplied to the PCB 500.

[0102] In an embodiment, the through-holes 530 may include a board through-hole 531 formed through the circuit board 510 and an interposer through-hole 532 formed through the interposer 520. In an embodiment, the number of the board through-holes 531 and the number of the interposer through-holes 532 may be one or more.

[0103] In an embodiment, when viewed from the height direction of the PCB 500, the board through hole 531 may include a first board through hole 531a, a second board through hole 531b, and a third board through hole 531c, wherein the first board through hole 531a is formed from the first board surface 511a through the first circuit board 511 to the second board surface 511b, the second board through hole 531b is formed from the third board surface 512a through the second circuit board 512 to the fourth board surface 512b, and the third board through hole 531c is formed from the fifth board surface 513a through the third circuit board 513 to the sixth board surface 513b. In an embodiment, the number of each of the first board through hole 531a, the second board through hole 531b, and the third board through hole 531c may be one or more.

[0104] In an embodiment, the interposer through hole 532 may communicate with the board through hole 531. For example, when viewed from the height direction of the PCB 500, the interposer through hole 532 may overlap with the board through hole 531. In an embodiment, when the interposer through hole 532 does not overlap with the board through hole 531, the interposer through hole 532 may indirectly communicate with the board through hole 531 through the gap 550 between the circuit board 510 and the interposer 520.

[0105] In an embodiment, the interposer through-hole 532 may include a first interposer through-hole 532a formed through the first interposer 521 and a second interposer through-hole 532b formed through the second interposer 522, based on the height direction of the PCB 500. In an embodiment, the first interposer through-hole 532a may be located at a position that overlaps or does not overlap with the first board through-hole 531a and / or the second board through-hole 531b, based on the height direction of the PCB 500. In an embodiment, the second interposer through-hole 532b may be located at a position that overlaps or does not overlap with the second board through-hole 531b and / or the third board through-hole 531c, based on the height direction of the PCB 500. In an embodiment, the second interposer through-hole 532b may be located at a position that overlaps or does not overlap with the first interposer through-hole 532a, based on the height direction of the PCB 500.

[0106] In an embodiment, a filler 540 in a liquid state may fill a gap 550 between the circuit board 510 and the interposer 520. In an embodiment, the filler 540 may be supplied to the PCB 500 in a liquid state and may coat at least a portion of a surface of the PCB 500. For example, the filler 540 may coat a portion connecting the PCB 500 to the interposer 520. In an embodiment, the filler 540 may flow into the interior of the PCB 500 through the through hole 530.

[0107] In an embodiment, the fillers 541, 542, and 543 that each flow through the first plate through-holes 531a-1, 531a-2, and 531a-3 may coat the second plate surface 511b by flowing through the first gap 551 between the second plate surface 511b and the first interposer 521. In an embodiment, the fillers 541, 542, and 543 that each flow through the first plate through-holes 531a-1, 531a-2, and 531a-3 may flow to the first interposer through-holes 532a-1, 532a-2, and 532a-3. In an embodiment, the fillers 541, 542, and 543 that each flow through the first interposer through-holes 531a-1, 531a-2, and 531a-3 may flow through the second gap 552 between the first interposer 521 and the third plate surface 512a, and may cover the third plate surface 512a.

[0108] Reference Figure 5b, when the first interposer through hole 532a-1 does not overlap with the second board through hole 531b-4, the filler 544 flowing through the second gap 552 may flow through the third gap 553 and the fourth gap 554 when flowing in the gravity direction, and may cover the fourth board surface 512b and the fifth board surface 513a. In this case, the filling of the filler 544 may be performed when the filler 544 flows in the gravity direction (e.g., Figure 5b When flowing in the -Z-axis direction), the liquid is concentrated on the fourth gap 554.

[0109] Reference Figure 5c , when the first interposer through hole 532a-3 overlaps with the second board through hole 531b-3, the filler 543 flowing through the first interposer through hole 532a-3 may flow through the second circuit board 512. In an embodiment, the filler 543 flowing through the second board through hole 531b-3 may coat the fourth board surface 512b and the fifth board surface 513a through the third gap 553 and the fourth gap 554 when the filler 543 flows in the direction of gravity. In this case, the filling of the filler 543 may be performed when the filler 543 flows in the direction of gravity (e.g., Figure 5c When flowing in the -Z-axis direction), the liquid is concentrated on the fourth gap 554.

[0110] Reference Figure 5b and Figure 5c , when the first board through hole 531a-2, the first interposer through hole 532a-2, the second board through hole 531b-2, the second interposer through hole 532b-2, and the third board through hole 531c overlap each other, the filler flowing through the first board through hole 531a-2 may flow in the direction of gravity, may flow through the first gap 551, the second gap 552, the third gap 553, and the fourth gap 554 and cover the second board surface 511b, the third board surface 512a, the fourth board surface 512b, and the fifth board surface 513a. In an embodiment, the filler 542 flowing through the second interposer through hole 532b-2 may flow through the third circuit board 513 and may coat the sixth board surface 513b.

[0111] According to an embodiment, the electronic device 201 may include a housing 210 including a front surface 210a, a rear surface 210b opposite to the front surface 210a, and a side surface 210c surrounding an internal space between the front surface 210a and the rear surface 210b; a display 261, which is visually exposed to the outside of the electronic device 201; and a printed circuit board 300 or 500, which is located in the internal space. In an embodiment, the printed circuit board 300 or 500 may include a plurality of circuit boards 310 or 510 that are parallel to each other and each include an electrical component, and one or more inner plug-ins 320 or 520 that are located between the plurality of circuit boards 310 or 510 and connect a pair of circuit boards 310 or 510 that are adjacent to each other in the height direction. In an embodiment, a gap 350 or 550 may be between a pair of circuit boards 310 or 510 that are adjacent to each other and one or more inner plug-ins 320 or 520. In an embodiment, one or more board through holes 331 or 531 may be formed through at least one of the plurality of circuit boards 310 or 510 in the height direction. In an embodiment, one or more interposers 320 or 520 may include one or more through holes 3241 or 5241 formed through the one or more interposers 320 or 520 in a height direction, through pieces 324 or 524 in the one or more through holes 3241 or 5241 and electrically connecting a pair of circuit boards 310 or 510 adjacent to each other, and one or more interposer through holes 331 or 531 formed through the one or more interposers 320 or 520 in a height direction and each communicating with one or more board through holes 331 or 531 of a pair of circuit boards 310 or 510 adjacent to each other. In an embodiment, a non-conductive filler 340 or 540 may be used in a gap 350 or 550 between one or more interposers 320 or 520 and a pair of circuit boards 310 or 510 adjacent to each other through the one or more board through holes 331 or 531 and the one or more interposer through holes 332 or 432.

[0112] In an embodiment, the plurality of circuit boards 310 or 510 may include a first circuit board 311 or 511 and a second circuit board 312 or 512, the first circuit board 311 or 511 including a first board surface 311a or 511a and a second board surface 311b or 511b opposite to the first board surface 311a or 511a, the second circuit board 312 or 512 including a third board surface 312a or 512b substantially parallel to the first circuit board 311 or 511 and facing the second board surface 311b or 511b and A fourth board surface 312b or 512b is opposite to the third board surface 312a or 512a, and one or more inner plug-ins 320 or 520 may include a first inner plug-in 321 or 521 between the first circuit board 311 or 511 and the second circuit board 312 or 512, wherein the first circuit board 311 or 511 includes a first board through hole 331a or 531a, and the first inner plug-in 321 or 521 includes a first inner plug-in through hole 332a or 532a connected to the first board through hole 331a or 531a.

[0113] In an embodiment, the second circuit board 312 or 512 may include a second board through-hole 331 b or 531 b in communication with the first interposer through-hole 332 a or 532 a .

[0114] In an embodiment, the cross-sectional area of ​​the board through hole 331 or 531 may be different from the cross-sectional area of ​​the interposer through hole 332 or 532 when viewed from the height direction.

[0115] In an embodiment, the filler 340 or 540 can be supplied to the board through-hole 331 or 531 and the plug-in through-hole 332 or 532 in a liquid state, and can flow to the surface of multiple circuit boards 310 or 510 through the gap 350 or 550 between one or more plug-ins 320 or 520 and a pair of circuit boards 310 or 510 adjacent to each other.

[0116] In an embodiment, the plurality of circuit boards 310 or 510 may further include a first circuit board 511 including a first board surface 511a and a second board surface 511b opposite to the first board surface 511a; a second circuit board 512 including a third board surface 512a substantially parallel to the first circuit board 511 and facing the second board surface 511b and a fourth board surface 512b opposite to the third board surface 512a; and a third circuit board 513 including a fifth board surface 513a substantially parallel to the first circuit board 511 and facing the fourth board surface 512b (when the second circuit board 512 is located between the first circuit board 511 and the fifth board surface 513a) and a sixth board surface 513b opposite to the fifth board surface 513a; and one or more inserters 520 may include a first inserter 521 located between the first circuit board 511 and the second circuit board 512 and a second inserter 522 located between the second circuit board 512 and the third circuit board 513.

[0117] In an embodiment, the first board through hole 531a can be formed from the first board surface 511a through the first circuit board 511 to the second board surface 511b, the second board through hole 531b can be formed from the third board surface 512a through the second circuit board 512 to the fourth board surface 512b, the first inner plug-in through hole 532a can be formed through the first inner plug-in 521 in the height direction and can be connected with the first board through hole 531a and the second board through hole 531b, and the second inner plug-in through hole 532b can be formed through the second inner plug-in 522 in the height direction and can be connected with the second board through hole 531b.

[0118] In an embodiment, the first interposer through hole 532 a may communicate with the second interposer through hole 531 b through the gap 552 between the first interposer 521 and the second circuit board 512 .

[0119] In an embodiment, the second interposer through-hole 532b may be located at a position not overlapping with the first interposer through-hole 532a when viewed from the height direction.

[0120] In an embodiment, the third board through hole 531c may be formed through the third circuit board 513 from the fifth board surface 513a to the sixth board surface 513b and may communicate with the second interposer through hole 532b.

[0121] In an embodiment, the second interposer through-hole 532b may be located at a position not overlapping with the third board through-hole 531c when viewed from the height direction.

[0122] In an embodiment, the cross-sectional shape of the board through hole 331 or 531 and the cross-sectional shape of the interposer through hole 332 or 532 may be a substantially circular form or a polygonal form when viewed from the height direction.

[0123] In an embodiment, the board through-hole 331 or 531 and the interposer through-hole 332 or 532 overlapping each other may include substantially the same shape when viewed from the height direction.

[0124] In an embodiment, when viewed from the height direction, the inserter 320 or 520 may be at the edge of the circuit board 310 or 510, and the filler 340 or 540 supplied through the board through hole 331 or 531 and the inserter through hole 332 or 532 may flow through the gap 350 or 550 between one or more inserters 320 or 520 and a pair of circuit boards 310 or 510 along the peripheral direction of the circuit board 310 or 510.

[0125] In an embodiment, when viewed from the height direction, the edge of the circuit board 310 or 510 and the edge of the interposer 320 or 520 may not be substantially stepped.

[0126] According to an embodiment, the printed circuit board 300 or 500 may include a first circuit board 311 or 511, which includes a first board surface 311a or 511a and a second board surface 311b or 511b opposite to the first board surface 311a or 511a; a second circuit board 312 or 512, which includes a third board surface 312a or 512b that is substantially parallel to the first circuit board 311 or 511 and faces the second board surface 311b or 511b and a fourth board surface 312b or 512b opposite to the third board surface 312a or 512a; and a first inner plug-in 321 or 521, which is located between the first circuit board 311 or 511 and the second circuit board 312 or 512 and connects the first circuit board 311 or 511 to the second circuit board 312 or 512 along a height direction perpendicular to the first board surface 311a or 511a. In an embodiment, a gap 350 or 550 through which the non-conductive filler 340 or 540 flows may be between the first interposer 321 or 521 and the first circuit board 311 or 511 and between the first interposer 321 or 521 and the second circuit board 312 or 512. In an embodiment, one or more through-board holes 331 or 531 may be formed through at least one of the first circuit board 311 or 511 and the second circuit board 312 or 512 in a height direction. In an embodiment, the first interposer 321 or 521 may include one or more through holes 3241 or 5241 formed through the first interposer 321 or 521 in the height direction, a through piece 324 or 524 in the one or more through holes 3241 or 5241 and electrically connecting the first circuit board 311 or 511 to the second circuit board 312 or 512, and one or more first interposer through holes 332a or 532a formed through the first interposer 321 or 521 in the height direction and each communicating with one or more board through holes 331 or 531. In an embodiment, a non-conductive filler 340 or 540 may be used in the gap 350 or 550 between the first interposer 321 or 521 and the first circuit board 311 or 511 and between the first interposer 321 or 521 and the second circuit board 312 or 512 through the board through holes 331 or 531 and the first interposer through holes 332a or 532a.

[0127] In an embodiment, the board through hole 331 or 531 may include at least one of a first board through hole 331a or 531a and a second board through hole 331b or 531b, the first board through hole 331a or 531a being formed along the height direction from the first board surface 311a or 511a through the first circuit board 311 or 511 to the second board surface 311b or 511b, and the second board through hole 331b or 531b being formed from the third board surface 312a or 512a through the second circuit board 312 or 512 to the fourth board surface 312b or 512b, wherein at least one of the first board through hole 331a or 531a and the second board through hole 331b or 531b is connected to the first internal plug-in through hole 332a or 532a.

[0128] According to an embodiment, the printed circuit board 500 may include a first circuit board 511 including a first board surface 511a and a second board surface 511b opposite to the first board surface 511a; a second circuit board 512 including a third board surface 512a substantially parallel to the first circuit board 511 and facing the second board surface 511b and a fourth board surface 512b opposite to the third board surface 512a; a third circuit board 513 including a fifth board surface 513a substantially parallel to the first circuit board 511 and facing the fourth board surface 512b (on the second circuit board 512). 2 is located between the first circuit board 511 and the fifth board surface 513a) and the sixth board surface 513b opposite to the fifth board surface 513a; the first interposer 521 is located between the first circuit board 511 and the second circuit board 512 and connects the first circuit board 511 to the second circuit board 512 in the height direction perpendicular to the first board surface 511a; the second interposer 522 is located between the second circuit board 512 and the third circuit board 513 and connects the second circuit board 512 to the third circuit board 513 in the height direction perpendicular to the third board surface 512a. In an embodiment, the gap 550 through which the non-conductive filler 540 flows may be between the first interposer 521 and the first circuit board 511, between the first interposer 521 and the second circuit board 512, between the second interposer 522 and the second circuit board 512, and between the second interposer 522 and the third circuit board 513. In an embodiment, one or more board through holes 531 may be formed through at least one of the first circuit board 511, the second circuit board 512, and the third circuit board 513 in the height direction. In an embodiment, the first interposer 521 and the second interposer 522 may include one or more through holes 5241 formed through the first interposer 521 and the second interposer 522 in the height direction, a through piece 524 in the one or more through holes 5241 and electrically connecting the first circuit board 511 to the second circuit board 512 and electrically connecting the second circuit board 512 to the third circuit board 513, and one or more interposer through holes 532 formed through the first interposer 521 and the second interposer 522 in the height direction and each communicating with one or more board through holes 531. In an embodiment, a non-conductive filler 540 may be used in the gap 550 through the board through hole 531 and the interposer through hole 532.

[0129] In an embodiment, the board through hole 531 may include at least one of a first board through hole 531a, a second board through hole 531b and a third board through hole 531c, the first board through hole 531a is formed along the height direction from the first board surface 511a through the first circuit board 511 to the second board surface 511b, the second board through hole 531b is formed along the height direction from the third board surface 512a through the second circuit board 512 to the fourth board surface 512b, and the third board through hole 531c is formed from the fifth board surface 513a through the third circuit board 513 to the sixth board surface 513b, wherein at least one of the first board through hole 531a, the second board through hole 531b and the third board through hole 531c is connected to the internal plug-in through hole 532.

[0130] In an embodiment, the inserter through hole 532 may include at least one of a first inserter through hole 532a formed by passing through the first inserter 521 along the height direction and a second inserter through hole 532b formed by passing through the second inserter 522 along the height direction, wherein, when viewed from the height direction, the second inserter through hole 532b is in a position that does not overlap with the first inserter through hole 532a.

[0131] It should be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if a component (e.g., a first component) is referred to as being “coupled with another component (e.g., the second component)”, “coupled to another component (e.g., the second component)”, “connected with another component (e.g., the second component)”, or “connected to another component (e.g., the second component)”, with or without the terms “operably” or “communicatively” being used, it means that the component may be directly connected to the other component (e.g., by wiring), wirelessly connected to the other component, or connected to the other component via a third component.

[0132] As used in connection with the embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0133] The embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0134] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) the computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0135] According to an embodiment, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to an embodiment, one or more of the above-mentioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to an embodiment, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performing one or more functions before integration. According to an embodiment, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

Claims

1. An electronic device (201), comprising: A housing (210) comprising a front surface (210a), a rear surface (210b) opposite to the front surface (210a), and a side surface (210c) surrounding an internal space between the front surface (210a) and the rear surface (210b); as well as A printed circuit board (300, 500) is arranged in the internal space, wherein the printed circuit board (300, 500) comprises: a plurality of circuit boards (310, 510) substantially parallel to one another and including one or more electrical components; and One or more interposers (320, 520) are arranged between the plurality of circuit boards (310, 510) and connect a pair of circuit boards (310, 510) adjacent to each other in a height direction among the plurality of circuit boards, The pair of circuit boards (310, 510) are separated from the one or more interposers by a gap (350, 550), and one or more through-board holes (331, 531) are formed through at least one of the plurality of circuit boards (310, 510) along the height direction. Wherein, the one or more internal plug-ins (320, 520) include: One or more through holes (3241, 5241) formed along the height direction through the one or more inner plug-ins (320, 520); A through-piece (324, 524) disposed in the one or more through-holes (3241, 5241) and configured to electrically connect the pair of circuit boards (310, 510); and one or more inner plug-in through holes (332, 532) formed through the one or more inner plug-ins (320, 520) along the height direction and configured to communicate with the one or more board through holes (331, 531) of the pair of circuit boards (310, 510), respectively; and Wherein, the printed circuit board (300, 500) further comprises a non-conductive filler (340, 540) arranged in the gap (350, 550).

2. The electronic device (201) according to claim 1, in, The plurality of circuit boards (310, 510) further include: a first circuit board (311, 511) comprising a first board surface (311a, 511a) and a second board surface (311b, 511b), the second board surface being located on a side of the first circuit board opposite to the first board surface (311a, 511a); and a second circuit board (312, 512) comprising a third board surface (312a, 512b) and a fourth board surface (312a, 512b), the third board surface (312a, 512b) being substantially parallel to the first circuit board (311, 511) and facing the second board surface (311b, 511b), the fourth board surface (312a, 512b) being located on a side of the second circuit board opposite to the third board surface (312a, 512a), The one or more interposers (320, 520) further include a first interposer (321, 521) arranged between the first circuit board (311, 511) and the second circuit board (312, 512), and The first circuit board (311, 511) further comprises a first board through hole (331a, 531a) from among the one or more board through holes (331, 531), the first inner plug-in unit (321, 521) comprises a first inner plug-in unit through hole (332a, 532a) from among the one or more inner plug-in unit through holes (332, 532), and the first inner plug-in unit through hole (332a, 532a) is connected to the first board through hole (331a, 531a).

3. The electronic device (201) according to any one of claims 1 and 2, in, The second circuit board (312, 512) further includes a second board through hole (331b, 531b) from the one or more board through holes (331, 531), and the second board through hole (331b, 531b) is connected to the first inner plug-in through hole (332a, 532a).

4. The electronic device (201) according to any one of claims 1 to 3, in, When viewed from the height direction, the cross-sectional area of ​​the one or more board through holes (331, 531) is different from the cross-sectional area of ​​the one or more interposer through holes (332, 532).

5. The electronic device (201) according to any one of claims 1 to 4, in, The printed circuit board (300, 500) is configured to receive a liquid non-conductive filler (340, 540) through the one or more board through-holes (331, 531) and the one or more interposer through-holes (332, 532), and to allow the liquid non-conductive filler (340, 540) to flow through the gap (350, 550).

6. The electronic device (201) according to any one of claims 1 to 5, in, The plurality of circuit boards (310, 510) further include: A first circuit board (511), comprising a first board surface (511a) and a second board surface (511b), wherein the second board surface is located on a side of the first circuit board (511) opposite to the first board surface (511a); a second circuit board (512), comprising a third board surface (512a) and a fourth board surface (512b), the third board surface being substantially parallel to the first circuit board (511) and facing the second board surface (511b), the fourth board surface (512b) being located on a side of the second circuit board (512) opposite to the third board surface (512a); and a third circuit board (513), comprising a fifth board surface (513a) and a sixth board surface (513b), the fifth board surface being substantially parallel to the first circuit board (511) and facing the fourth board surface (512b), the sixth board surface being located on a side of the third circuit board (513) opposite to the fifth board surface (513a), wherein the second circuit board (512) is arranged between the first circuit board (511) and the third circuit board (513), and Wherein, the one or more internal plug-ins (520) further include: A first interposer (521) is arranged between the first circuit board (511) and the second circuit board (512); and A second interposer (522) is arranged between the second circuit board (512) and the third circuit board (513).

7. The electronic device (201) according to any one of claims 1 to 6, in, The first circuit board (511) further comprises a first board through hole (531a) from among the one or more board through holes (531), and the first interposer (521) comprises a first interposer through hole (532a) from among the one or more interposer through holes (532), wherein the second circuit board (512) further comprises a second board through hole (531b) from among the one or more board through holes (531), and the second interposer (522) comprises a second interposer through hole (532b) from among the one or more interposer through holes (532), wherein the first board through hole (531a) is formed from the first board surface (511a) through the first circuit board (511) to the second board surface (511b), and the second board through hole (531b) is formed from the first board surface (512a) through the second circuit board (512) to the second board surface (512b), wherein the first inner plug-in through hole (532a) is formed through the first inner plug-in (521) along the height direction and is connected to the first board through hole (531a) and the second board through hole (531b); and The second inner plug-in through hole (532b) is formed through the second inner plug-in (522) along the height direction and is connected to the second plate through hole (531b).

8. The electronic device (201) according to any one of claims 1 to 7, in, The first interposer through hole (532a) is connected to the second interposer through hole (531b) via a gap (552) between the first interposer (521) and the second circuit board (512).

9. The electronic device (201) according to any one of claims 1 to 8, in, When viewed from the height direction, the second interposer through hole (532b) does not overlap with the first interposer through hole (532a).

10. The electronic device (201) according to any one of claims 1 to 9, in, The third circuit board (513) further comprises a third board through hole (531c) from the one or more board through holes (531), the third board through hole (531c) being formed from the fifth board surface (513a) through the third circuit board (513) to the sixth board surface (513b), and the third board through hole (531c) is connected to the second inner plug-in through hole (532b).

11. The electronic device (201) according to any one of claims 1 to 10, in, When viewed from the height direction, the second inner plug-in through hole (532b) and the third board through hole (531c) do not overlap.

12. The electronic device (201) according to any one of claims 1 to 11, in, When viewed from the height direction, the cross-sectional shape of the one or more plate through holes (331, 531) is substantially circular or polygonal, and when viewed from the height direction, the cross-sectional shape of the one or more plug-in through holes (332, 532) is substantially circular or polygonal.

13. The electronic device (201) according to any one of claims 1 to 12, in, When viewed from the height direction, at least one of the one or more board through holes (331, 531) and at least one of the one or more plug-in through holes (332, 532) overlap, and when viewed from the height direction, at least one of the one or more board through holes (331, 531) and at least one of the one or more plug-in through holes (332, 532) include substantially similar cross-sectional shapes.

14. The electronic device (201) according to any one of claims 1 to 13, in, The one or more interposers (320, 520) are arranged along the periphery of the plurality of circuit boards (310, 510), and The printed circuit board (300, 500) is configured to receive a liquid non-conductive filler (340, 540) through the one or more board through-holes (331, 531) and the one or more plug-in through-holes (332, 532), and to allow the liquid non-conductive filler (340, 540) to flow through the gaps (350, 550) around the periphery of the plurality of circuit boards (310, 510).

15. The electronic device (201) according to any one of claims 1 to 14, in, When viewed from the height direction, edges of the plurality of circuit boards (310, 510) and edges of the one or more interposers (320, 520) are substantially aligned.

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