Element tin soldering forming device

Abstract

The invention belongs to the technical field of element tin soldering forming, and particularly relates to an element tin soldering forming device which comprises a frame body, a feeding mechanism is arranged in the frame body, a clamping mechanism is fixedly connected to the outer surface of the feeding mechanism, a welding mechanism is fixedly connected to the outer surface of the feeding mechanism, and the clamping mechanism is fixedly connected to the outer surface of the welding mechanism. A fuse feeding mechanism is fixedly connected to the side, away from the feeding mechanism, of the welding mechanism, a turnover mechanism is arranged on the side, away from the welding mechanism, of the fuse feeding mechanism, and an automatic discharging mechanism is arranged on the side, away from the fuse feeding mechanism, of the turnover mechanism. Meanwhile, the supplement scheme that the adjustable range is 60 mm-79 mm in the height direction is met, the flexibility of automatic equipment is improved, meanwhile, some parameters of tin soldering equipment, an L-shaped workpiece clamping mechanism and the surface height of the element can be adjusted according to detection data of the height of the element, and the problems that pseudo soldering and missing soldering occur to the element, and the welding requirement cannot be met are solved.

Description

Technical Field

[0001] The invention belongs to the technical field of component soldering molding, in particular to a component soldering molding device. Background Art

[0002] Component soldering is an important electric fusion connection technology, which involves heating and melting low-melting-point metal solder, infiltrating and filling the gaps at the joints of metal parts to achieve electrical and mechanical connections between components. Soldering technology is widely used in the electronics industry, especially in scenarios where precision connections are required. It requires the solder to have good wettability and fluidity to ensure welding quality. At the same time, the heating time needs to be controlled during the welding process to avoid thermal damage to electronic components. In addition, the design of the solder joint is also key. Reasonable solder joint geometry can significantly improve the strength and reliability of welding.

[0003] In the component forming device, if the parameters of the soldering equipment and clamping mechanism relative to the component surface height cannot be adjusted in time according to the size range and height of the component, cold solder joints and leaking solder joints will occur, further causing the component to fail to meet the welding requirements. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a component soldering forming device, comprising a frame, a feeding mechanism is arranged inside the frame, a clamping mechanism is fixedly connected to the outer surface of the feeding mechanism, a welding mechanism is fixedly connected to the outer surface of the feeding mechanism, a fuse feeding mechanism is fixedly connected to the side of the welding mechanism away from the feeding mechanism, a flipping mechanism is arranged on the side of the fuse feeding mechanism away from the welding mechanism, and an automatic unloading mechanism is arranged on the side of the flipping mechanism away from the fuse feeding mechanism;

[0005] The feeding mechanism includes a blocking position, a rising block is arranged above the blocking position, a bar code scanner is fixedly connected to the outer surface of the rising block, an intercepting cylinder is arranged on the left side of the bar code scanner, a technical sensor is arranged below the intercepting cylinder, and a side baffle is arranged below the intercepting cylinder.

[0006] Furthermore, the clamping mechanism comprises a slider, the outer surface of which is rotatably connected to a connecting rod mechanism, a middle area of ​​the two sliders is provided with an avoidance hole, and both sides of the slider are provided with a limiting groove.

[0007] Furthermore, the welding mechanism includes a monitoring camera, a vibrating loading tray is arranged below the monitoring camera, an L-shaped workpiece clamping mechanism is arranged below the monitoring camera, and a soldering device is arranged on the side of the vibrating loading tray close to the L-shaped workpiece clamping mechanism. When the component is transported to the soldering station, the L-shaped workpiece clamping mechanism clamps the L-shaped wire and places it on the surface of the component, and then welds the L-shaped wire. The displacement and force control of the L-shaped workpiece clamping mechanism meet the tolerance, so as to avoid the wire not being placed in place, resulting in insufficient gap soldering strength or damage to the surface of the component.

[0008] Furthermore, a soldering head cleaning device is provided below the soldering device, a paddle mechanism is provided below the L-shaped workpiece clamping mechanism, a soldering detection device is provided on the side of the paddle mechanism away from the vibrating loading tray, and a height sensor detection device is provided on the side of the soldering head cleaning device close to the soldering device. The stripping is used to detect whether the wire is firmly soldered.

[0009] Furthermore, the fuse feeding mechanism comprises a fuse feeding bin, an outer surface of the fuse feeding bin is fixedly connected with a vibration plate, and a fuse clamping module is arranged below the vibration plate.

[0010] Furthermore, a funnel-shaped guide mechanism is provided on the side of the fuse clamping module away from the fuse feeding bin, a fuse pressing mechanism is provided on the side of the vibration plate away from the fuse feeding bin, and a fuse bending mechanism is provided on the side of the fuse pressing mechanism away from the vibration plate. The clamping claw clamps the fuse from the material taking position, inserts the fuse into the interior of the component through the funnel-shaped guide mechanism, and then presses and bends the fuse.

[0011] Further, the flipping mechanism includes a soldering mechanism, a soldering flipping mechanism is arranged below the soldering mechanism, a visual inspection mechanism is arranged on the left side of the soldering mechanism, and a visual inspection flipping mechanism is arranged below the visual inspection mechanism. The soldering flipping mechanism clamps the component and flips it, and then the soldering mechanism solders the component.

[0012] Furthermore, the automatic unloading mechanism includes a six-axis robot, an NG component box is arranged on the right side of the six-axis robot, a multi-layer tray transplanting mechanism is arranged on the side of the NG component box away from the six-axis robot, an AGV is arranged below the multi-layer tray transplanting mechanism, and a transplanting trolley is arranged below the multi-layer tray transplanting mechanism.

[0013] Furthermore, a stacking area is provided on the side of the multi-layer tray transplanting mechanism close to the six-axis robot, a stacking lifting mechanism is provided on the side of the stacking area away from the multi-layer tray transplanting mechanism, an empty tray is provided on the side of the stacking lifting mechanism away from the stacking area, an empty tray storage area is fixedly connected to the outer surface of the empty tray, and an empty tray transplanting mechanism is provided above the empty tray.

[0014] The beneficial effects of the present invention are as follows:

[0015] (1) The system can meet the soldering needs of components of various sizes, and can also meet the supplementary solution of adjusting the height range to 60mm-79mm, thereby increasing the flexibility of the automation equipment. At the same time, the system can adjust some parameters of the soldering equipment, L-shaped workpiece clamping mechanism and the component surface height according to the detection data of the component height, thereby avoiding problems such as cold soldering, leaking soldering and welding failure to meet the requirements.

[0016] (2) The equipment is a fully automatic device with main functions including automatic feeding, grabbing and flipping, assembly, welding, testing and other functions, and has intelligent integration.

[0017] (3) The equipment has a high OEE design efficiency, with a target of 75% and a target production capacity of no less than 540 units per hour.

[0018] (4) The equipment can automatically unload materials and automatically alarm under abnormal circumstances, which has safety functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view of the present invention;

[0020] Figure 2 is a cross-sectional view of the frame of the present invention;

[0021] Figure 3 It is a structural schematic diagram of the feeding mechanism of the present invention;

[0022] Figure 4 The present invention Figure 3 A schematic diagram of the enlarged structure at A in the middle;

[0023] Figure 5 It is a structural schematic diagram of the clamping mechanism of the present invention;

[0024] Figure 6 The present invention Figure 5 A schematic diagram of the enlarged structure at B in the middle;

[0025] Figure 7 It is a structural schematic diagram of the welding mechanism of the present invention;

[0026] Figure 8 It is a schematic diagram of the enlarged structure of C in 7 of the present invention;

[0027] Fig. 9 It is a structural schematic diagram of the fuse feeding mechanism of the present invention;

[0028] Fig.10 The present invention Fig. 9Schematic diagram of the enlarged structure at D in the middle;

[0029] Fig.11 It is a structural schematic diagram of the vibration plate of the present invention;

[0030] Fig.12 The present invention Fig.11 Schematic diagram of the enlarged structure at E in the middle;

[0031] Fig.13 It is a structural schematic diagram of the turning mechanism of the present invention;

[0032] Fig.14 The present invention Fig.13 The enlarged structural diagram at F in the middle;

[0033] Fig.15 It is a structural schematic diagram of the automatic unloading mechanism of the present invention;

[0034] Fig.16 The present invention Fig.15 Schematic diagram of the enlarged structure at G in the middle.

[0035] In the figure: 1. frame; 2. feeding mechanism; 21. blocking position; 22. rising block; 23. barcode scanner; 24. interception cylinder; 25. technical sensor; 26. side baffle; 3. clamping mechanism; 31. slider; 32. connecting rod mechanism; 33. avoidance hole; 34. limit groove; 4. welding mechanism; 41. monitoring camera; 42. vibration feeding tray; 43. L-shaped workpiece clamping mechanism; 44. soldering equipment; 45. soldering head cleaning device; 46. pick mechanism; 47. soldering detection equipment; 48. height sensor detection equipment; 5. fuse feeding mechanism; 51. fuse Feeding bin; 52. Vibrating plate; 53. Clamping fuse module; 54. Funnel-shaped guiding mechanism; 55. Fuse pressing mechanism; 56. Fuse bending mechanism; 6. Turning mechanism; 61. Soldering mechanism; 62. Soldering turning mechanism; 63. Visual inspection mechanism; 64. Visual inspection turning mechanism; 7. Automatic unloading mechanism; 71. Six-axis robot; 72. NG component material box; 73. Multi-layer material tray transplanting mechanism; 74. AGV; 75. Transplanting trolley; 76. Palletizing area; 77. Palletizing lifting mechanism; 78. Empty material tray; 79. Empty material tray storage area; 701. Empty material tray transplanting mechanism. DETAILED DESCRIPTION

[0036] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0037] See also Figure 1-Figure 16 The present invention is a component soldering forming device, comprising a frame 1, a feeding mechanism 2 is arranged inside the frame 1, a clamping mechanism 3 is fixedly connected to the outer surface of the feeding mechanism 2, a welding mechanism 4 is fixedly connected to the outer surface of the feeding mechanism 2, a fuse feeding mechanism 5 is fixedly connected to the side of the welding mechanism 4 away from the feeding mechanism 2, a flipping mechanism 6 is arranged on the side of the fuse feeding mechanism 5 away from the welding mechanism 4, and an automatic unloading mechanism 7 is arranged on the side of the flipping mechanism 6 away from the fuse feeding mechanism 5;

[0038] The feeding mechanism 2 includes a blocking position 21, a rising block 22 is arranged above the blocking position 21, a bar code scanner 23 is fixedly connected to the outer surface of the rising block 22, an intercepting cylinder 24 is arranged on the left side of the bar code scanner 23, a technical sensor 25 is arranged below the intercepting cylinder 24, and a side baffle 26 is arranged below the intercepting cylinder 24.

[0039] The clamping mechanism 3 comprises a slider 31 , the outer surface of which is rotatably connected to a connecting rod mechanism 32 , a middle area of ​​the two sliders 31 is provided with an avoidance hole 33 , and two sides of the slider 31 are provided with limiting grooves 34 .

[0040] The welding mechanism 4 includes a monitoring camera 41, a vibrating loading tray 42 is arranged below the monitoring camera 41, an L-shaped workpiece clamping mechanism 43 is arranged below the monitoring camera 41, and a soldering device 44 is arranged on the side of the vibrating loading tray 42 close to the L-shaped workpiece clamping mechanism 43. When the component is transported to the soldering station, the L-shaped workpiece clamping mechanism 43 clamps the L-shaped wire and places it on the surface of the component, and then welds the L-shaped wire. The displacement and force control of the L-shaped workpiece clamping mechanism 43 meet the tolerance, avoiding the wire not being placed in place, resulting in insufficient gap soldering strength or damage to the surface of the component.

[0041] A soldering head cleaning device 45 is provided below the soldering device 44, a paddle mechanism 46 is provided below the L-shaped workpiece clamping mechanism 43, a soldering detection device 47 is provided on the side of the paddle mechanism 46 away from the vibrating loading tray 42, and a height sensor detection device 48 is provided on the side of the soldering head cleaning device 45 close to the soldering device 44. The paddle is used to detect whether the wire is firmly soldered.

[0042] The fuse feeding mechanism 5 comprises a fuse feeding bin 51 , an outer surface of which is fixedly connected with a vibration plate 52 , and a fuse clamping module 53 is arranged below the vibration plate 52 .

[0043] A funnel-shaped guide mechanism 54 is provided on the side of the fuse clamping module 53 away from the fuse feeding bin 51, a fuse pressing mechanism 55 is provided on the side of the vibration plate 52 away from the fuse feeding bin 51, and a fuse bending mechanism 56 is provided on the side of the fuse pressing mechanism 55 away from the vibration plate 52. The clamping claw clamps the fuse from the material taking position, inserts the fuse into the interior of the component through the funnel-shaped guide mechanism 54, and then presses and bends the fuse.

[0044] The flip mechanism 6 includes a soldering mechanism 61, a soldering flip mechanism 62 is provided below the soldering mechanism 61, a visual inspection mechanism 63 is provided on the left side of the soldering mechanism 61, and a visual inspection flip mechanism 64 is provided below the visual inspection mechanism 63. The soldering flip mechanism 62 clamps the component and flips it 180°, and then the soldering mechanism 61 solders the component.

[0045] The automatic unloading mechanism 7 includes a six-axis robot 71, an NG component box 72 is arranged on the right side of the six-axis robot 71, a multi-layer tray transplanting mechanism 73 is arranged on the side of the NG component box 72 away from the six-axis robot 71, an AGV 74 is arranged below the multi-layer tray transplanting mechanism 73, and a transplanting trolley 75 is arranged below the multi-layer tray transplanting mechanism 73.

[0046] A stacking area 76 is provided on the side of the multi-layer tray transplanting mechanism 73 close to the six-axis robot 71, a stacking lifting mechanism 77 is provided on the side of the stacking area 76 away from the multi-layer tray transplanting mechanism 73, an empty tray 78 is provided on the side of the stacking lifting mechanism 77 away from the stacking area 76, an empty tray storage area 79 is fixedly connected to the outer surface of the empty tray 78, and an empty tray transplanting mechanism 701 is provided above the empty tray 78.

[0047] The specific working process is as follows: first, the components are loaded, that is, the cylinder opens to let the components flow in. When the number of components flowing in reaches the standard, that is, there is a risk of explosion, the cylinder closes and stops letting in components. Then the components are grabbed and rotated to identify the barcode, and then the components are grabbed and placed on the carrier platform. The process of the components completing this step takes 5 seconds.

[0048] The carrier platform in the clamping mechanism 3 includes a spring, a slider 31, a connecting rod mechanism 32, an avoidance hole 33, a limit groove 34, a cylinder and a positioning device. The function of the carrier platform is to clamp or release components and fix components; the connecting rod mechanism 32 makes the slider 31 move and displace in a consistent manner, so that components of different sizes can be in the center position without changing tooling. It can be compatible with components with a diameter of 40-60mm, or even larger and smaller specifications, and has a richer compatible size. Among them, a spring is arranged inside the slider 31, and the spring plays a reciprocating force effect. The slider 31 can be compatible with different sizes. The Z-direction limit of the connecting rod mechanism 32 pushes the V block to open or close, and the displacement of the two V blocks is equal, so that the components are centered. The function of the avoidance hole 33 is to avoid L-shaped copper wires, fuses, etc.; the function of the limit groove 34 is to cooperate with the positioning device. The cylinder can push the connecting rod mechanism 32 to move, and the positioning device plays the role of carrier positioning.

[0049] When the component needs to be welded, the height sensor detection device 48 detects the height of the component, and then the component is transported to the soldering station, and the L-shaped workpiece clamping mechanism 43 clamps the L-shaped wire and places it on the surface of the component, and then welds the L-shaped wire, peels and detects the strength after welding, and finally visually inspects the welding quality. The soldering of the component A side takes 5 seconds, the peeling detection takes 3 seconds, and the visual inspection takes 4 seconds.

[0050] The clamping claws clamp the fuse from the material taking position, then insert it into the interior of the component through the funnel-shaped guide mechanism 54, and finally bend the fuse.

[0051] The lifting device opens the carrier to facilitate the removal of the component, and then the flip mechanism 6 clamps the component and flips it 180 degrees, and then soldering and visual inspection are performed respectively.

[0052] When the components are automatically unloaded after soldering, they are unloaded by visual scanning. Unqualified products enter the waste box next to them, and qualified products are picked up by the robot and stacked on the tray. When the number of layers of qualified product stacking trays reaches the requirement, the robot will stop 1-2 component code beats, and the subsequent robot will speed up to add 1-2 beat time. The multi-layer tray transfer mechanism 73 will remove it and put it on the transfer trolley 75. After the multi-layer tray is removed, the stacking area 76 lifting mechanism will rise to the initial height , and a new tray is placed by the empty tray 78 clamp. When there is no tray in one area of ​​the empty tray 78, the empty tray storage area 79 can be opened manually to put in the corresponding number of empty trays 78; when qualified products are picked up by the robot and stacked on the tray, if the tray is almost full, the empty tray 78 clamp grabs the empty tray 78 and waits for it to be put in. After the empty tray 78 is full of components, it automatically descends by one tray height, and the empty tray transplanting mechanism 701 places a new tray on the full tray, and the robot continues to stack.

[0053] After the multi-layer tray transfer mechanism 73 moves the multi-layer tray to the transfer trolley 75, it can be transported away by AGV74 or removed manually. When the number of tray layers at the stacking lifting mechanism 77 reaches the specified number, the multi-layer tray transfer mechanism 73 will move to the stacking lifting mechanism 77 again for transportation.

[0054] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A component soldering molding device, comprising a frame (1), characterized in that: A feeding mechanism (2) is arranged inside the frame (1); a clamping mechanism (3) is fixedly connected to the outer surface of the feeding mechanism (2); a welding mechanism (4) is fixedly connected to the outer surface of the feeding mechanism (2); a fuse feeding mechanism (5) is fixedly connected to the side of the welding mechanism (4) away from the feeding mechanism (2); a flipping mechanism (6) is arranged on the side of the fuse feeding mechanism (5) away from the welding mechanism (4); and an automatic unloading mechanism (7) is arranged on the side of the flipping mechanism (6) away from the fuse feeding mechanism (5); The feeding mechanism (2) comprises a blocking position (21), a rising block (22) is arranged above the blocking position (21), a bar code scanner (23) is fixedly connected to the outer surface of the rising block (22), an intercepting cylinder (24) is arranged on the left side of the bar code scanner (23), a technical sensor (25) is arranged below the intercepting cylinder (24), and a side baffle (26) is arranged below the intercepting cylinder (24).

2. A component soldering forming device according to claim 1, characterized in that: The clamping mechanism (3) comprises a slider (31), the outer surface of the slider (31) is rotatably connected to a connecting rod mechanism (32), a middle area of ​​the two sliders (31) is provided with an avoidance hole (33), and both sides of the slider (31) are provided with a limiting groove (34).

3. A component soldering forming device according to claim 1, characterized in that: The welding mechanism (4) comprises a monitoring camera (41), a vibrating loading tray (42) is arranged below the monitoring camera (41), an L-shaped workpiece clamping mechanism (43) is arranged below the monitoring camera (41), and a soldering device (44) is arranged on one side of the vibrating loading tray (42) close to the L-shaped workpiece clamping mechanism (43).

4. A component soldering forming device according to claim 1, characterized in that: A soldering head cleaning device (45) is provided below the soldering equipment (44), a paddle mechanism (46) is provided below the L-shaped workpiece clamping mechanism (43), a soldering detection device (47) is provided on the side of the paddle mechanism (46) away from the vibrating loading tray (42), and a height sensor detection device (48) is provided on the side of the soldering head cleaning device (45) close to the soldering equipment (44).

5. A component soldering forming device according to claim 1, characterized in that: The fuse feeding mechanism (5) comprises a fuse feeding bin (51), the outer surface of the fuse feeding bin (51) is fixedly connected with a vibration disk (52), and a fuse clamping module (53) is arranged below the vibration disk (52).

6. A component soldering forming device according to claim 1, characterized in that: A funnel-shaped guiding mechanism (54) is provided on the side of the fuse clamping module (53) away from the fuse feeding bin (51), a fuse pressing mechanism (55) is provided on the side of the vibration disk (52) away from the fuse feeding bin (51), and a fuse bending mechanism (56) is provided on the side of the fuse pressing mechanism (55) away from the vibration disk (52).

7. A component soldering forming device according to claim 1, characterized in that: The flipping mechanism (6) comprises a soldering mechanism (61), a soldering flipping mechanism (62) is arranged below the soldering mechanism (61), a visual inspection mechanism (63) is arranged on the left side of the soldering mechanism (61), and a visual inspection flipping mechanism (64) is arranged below the visual inspection mechanism (63).

8. A component soldering forming device according to claim 1, characterized in that: The automatic unloading mechanism (7) comprises a six-axis robot (71), an NG component material box (72) is arranged on the right side of the six-axis robot (71), a multi-layer material tray transplanting mechanism (73) is arranged on the side of the NG component material box (72) away from the six-axis robot (71), an AGV (74) is arranged below the multi-layer material tray transplanting mechanism (73), and a transplanting trolley (75) is arranged below the multi-layer material tray transplanting mechanism (73).

9. A component soldering forming device according to claim 1, characterized in that: A stacking area (76) is arranged on the side of the multi-layer tray transplanting mechanism (73) close to the six-axis robot (71), a stacking lifting mechanism (77) is arranged on the side of the stacking area (76) away from the multi-layer tray transplanting mechanism (73), an empty tray (78) is arranged on the side of the stacking lifting mechanism (77) away from the stacking area (76), an empty tray storage area (79) is fixedly connected to the outer surface of the empty tray (78), and an empty tray transplanting mechanism (701) is arranged above the empty tray (78).

Images