Grinding mechanism, silicon rod grinding equipment and silicon rod grinding method

Abstract

The embodiment of the invention provides a grinding mechanism, silicon rod grinding equipment and a silicon rod grinding method. The first driving part is arranged on the supporting seat, and the first driving part comprises a first driving main shaft; the grinding wheel is arranged at the end part of the first driving main shaft so as to grind a silicon rod under the driving of the first driving main shaft; and the rotating speed of the first driving main shaft is 3500 rpm to 13000rpm (revolutions per minute).

Description

Technical Field

[0001] The present application relates to the technical field of silicon rod processing, and in particular to a grinding mechanism, a silicon rod grinding device and a silicon rod grinding method. Background Art

[0002] After silicon rods are produced from the crystal pulling furnace, they are cut and squared in sequence to produce silicon rods of specific length specifications. Currently, the grinding wheels used for grinding silicon rods in the photovoltaic market have a long grinding process time and low grinding efficiency. Summary of the invention

[0003] The present application provides a grinding mechanism, a silicon rod grinding device and a silicon rod grinding method. The grinding mechanism can reduce the grinding time of the silicon rod and improve the grinding efficiency of the silicon rod.

[0004] This application is achieved through the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a grinding mechanism for grinding silicon rods, comprising: a support; a first driving member, the first driving member is arranged on the support, and the first driving member includes a first driving spindle; a grinding wheel, the grinding wheel is arranged at the end of the first driving spindle to grind the silicon rod under the drive of the first driving spindle; wherein the rotation speed of the first driving spindle is 3500rpm-13000rpm.

[0006] According to the grinding mechanism for silicon rod grinding in the embodiment of the present application, since the rotation speed of the first driving spindle is 3500rpm-13000rpm, the grinding wheel driven by the first driving spindle can grind the silicon rod at high speed, thereby greatly reducing the grinding time of the grinding wheel and greatly improving the production efficiency of the silicon rod. At the same time, the high-speed grinding wheel can also greatly improve the grinding quality of the silicon rod.

[0007] According to some embodiments of the present application, the dynamic balancing accuracy grade of the first driving spindle is no greater than G1.

[0008] According to some embodiments of the present application, the grinding mechanism further includes: a cooling member configured to cool at least the first driving spindle.

[0009] According to some embodiments of the present application, the cooling member includes a cooling channel, which is disposed on the first driving spindle and is suitable for the flow of a coolant.

[0010] According to some embodiments of the present application, the first drive spindle is connected to the support via a first support bearing and a second support bearing; the cooling channel includes: a first cooling channel and a second cooling channel, the first cooling channel is close to the first support bearing, and the second cooling channel is close to the second support bearing.

[0011] According to some embodiments of the present application, the first driving member also includes a driving motor, which is arranged inside the first driving spindle; the cooling channel also includes: a third cooling channel, which is close to the driving motor and suitable for cooling the driving motor.

[0012] According to some embodiments of the present application, the maximum linear speed of the grinding wheel is 100 m / s-150 m / s.

[0013] According to some embodiments of the present application, the grinding wheel is configured as a rough grinding wheel, and the cutting depth of the rough grinding wheel is 0.5mm-0.8mm; or the grinding wheel is configured as a fine grinding wheel, and the cutting depth of the fine grinding wheel is 0.05mm-0.08mm.

[0014] According to some embodiments of the present application, the grinding wheel is configured as a rough grinding wheel, and the mesh number of the rough grinding wheel is 150-200; or the grinding wheel is configured as a fine grinding wheel, and the mesh number of the fine grinding wheel is 500-600.

[0015] In a second aspect, the present application proposes a silicon rod grinding device, comprising: a base; a clamping mechanism, which is configured to clamp a silicon rod; and the above-mentioned grinding mechanism, which is arranged on the base and is constructed to grind the silicon rod clamped by the clamping mechanism.

[0016] Since the silicon rod grinding equipment in the embodiment of the present application is provided with the grinding mechanism of the above embodiment, the processing time of the silicon rod grinding equipment on the silicon rod is greatly reduced, and the processing efficiency of the silicon rod grinding equipment is greatly improved.

[0017] According to some embodiments of the present application, the clamping mechanism includes: a first chuck and a second chuck, the first chuck and the second chuck can be relatively close to or far away from each other to selectively clamp the silicon rod; a first shock-absorbing layer is provided on the clamping surface of the first chuck and / or the clamping surface of the second chuck.

[0018] According to some embodiments of the present application, the first shock-absorbing layer is configured as a polyurethane layer.

[0019] According to some embodiments of the present application, a foot pad is provided on the base, and a second shock-absorbing layer is provided on the foot pad.

[0020] According to some embodiments of the present application, there are multiple grinding mechanisms, and the multiple grinding mechanisms include: a first grinding mechanism and a second grinding mechanism, the grinding wheel of the first grinding mechanism is a rough grinding wheel, and the grinding wheel of the second grinding mechanism is a fine grinding wheel.

[0021] According to some embodiments of the present application, the grinding device further includes: a second driving member, the second driving member being disposed on the base and connected to the clamping mechanism to drive the clamping mechanism to move in the first direction;

[0022] Wherein, when the rough grinding wheel is working, the moving speed of the clamping mechanism in the first direction is 35mm / s-50mm / s, and when the fine grinding wheel is working, the moving speed of the clamping mechanism in the first direction is 40mm / s-50mm / s.

[0023] In a third aspect, the present application proposes a method for grinding a silicon rod, comprising:

[0024] The silicon rod grinding device is provided, wherein the clamping mechanism of the silicon rod grinding device is used to clamp a square silicon rod, wherein the square silicon rod comprises: surfaces to be ground connected in sequence in the circumferential direction and edges to be ground connecting two adjacent surfaces to be ground;

[0025] Using the grinding wheel of the grinding mechanism to grind the edge to be ground;

[0026] The surface to be ground is ground using the grinding wheel of the grinding mechanism.

[0027] According to some embodiments of the present application, the grinding process of the edge to be ground using the grinding wheel of the grinding mechanism includes:

[0028] Performing rough grinding on the edges to be ground of the square silicon rod;

[0029] The edges to be ground of the square silicon rod are finely ground.

[0030] According to some embodiments of the present application, the rough grinding of the edges to be ground of the square silicon rod includes:

[0031] Rotating the square silicon rod to an initial position where the surface to be ground is parallel to a horizontal plane;

[0032] Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in a second direction by a first angle to perform a first flat grinding on the edge to be ground;

[0033] Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in a second direction by a second angle to perform a second flat grinding on the edge to be ground;

[0034] Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in the second direction by a third angle to perform a third flat grinding on the edge to be ground;

[0035] The first angle is greater than the second angle, and the first angle is smaller than the third angle.

[0036] According to some embodiments of the present application, the first angle is 40°-50°, the second angle is 17.5°-27.5°, and the third angle is 62.5°-72.5°.

[0037] According to some embodiments of the present application, the fine grinding of the edge to be ground of the square silicon rod includes: using the upper area of ​​the grinding wheel of the grinding mechanism to perform reciprocating swing grinding on the edge to be ground.

[0038] According to some embodiments of the present application, the fine grinding of the edges to be ground of the square silicon rod includes: using the grinding wheel to grind each edge to be ground N1 times, and N1 is less than 3.

[0039] According to some embodiments of the present application, the grinding process of the surface to be ground using the grinding wheel of the grinding mechanism includes:

[0040] Performing rough grinding on the surface to be ground of the square silicon rod;

[0041] The surface to be ground of the square silicon rod is finely ground.

[0042] According to some embodiments of the present application, the rough grinding of the surface to be ground of the square silicon rod includes: using the grinding wheel to grind each surface to be ground N2 times, and N2 is less than 5.

[0043] According to some embodiments of the present application, the fine grinding of the surface to be ground of the square silicon rod includes: using the grinding wheel to grind each surface to be ground N3 times, and N3 is less than 5.

[0044] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A schematic diagram of a silicon rod grinding device provided in the first embodiment of the present application;

[0047] Figure 2 A schematic diagram of a grinding mechanism provided in the first embodiment of the present application;

[0048] Figure 3 A schematic diagram of a first driving member provided in the first embodiment of the present application;

[0049] Figure 4 A partial schematic diagram of a silicon rod grinding device provided in the first embodiment of the present application;

[0050] Figure 5 A schematic diagram of a silicon rod grinding process provided in the first embodiment of the present application;

[0051] Figure 6 This is a flow chart of a silicon rod grinding method provided in the first embodiment of the present application.

[0052] Icons: grinding mechanism 100, support 110, top plate 111, bottom plate 112, first side plate 113, second side plate 114, grinding wheel cover assembly 115, first driving member 120, first driving spindle 121, grinding wheel 130, lifting mechanism 140,

[0053] Silicon rod grinding device 1000, first grinding mechanism 100a, second grinding mechanism 100b, base 200, clamping mechanism 300, first chuck 310, second chuck 320, feeding mechanism 400, second driving member 500, feeding slide 510,

[0054] Installation space 101 , surface to be ground 103 , and grinding edge 102 . DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0056] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary and secondary relationship.

[0057] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0058] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0060] The term "multiple" as used in this application refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple sheets" refers to more than two sheets (including two sheets).

[0061] After the single crystal silicon rod is produced in the crystal pulling furnace, it is cut and squared in sequence to produce single crystal silicon rods of specific length specifications. The grinding wheel used for grinding single crystal silicon rods in the current photovoltaic market has a long grinding process time and low grinding efficiency.

[0062] At present, the grinding wheel speed used for grinding single crystal silicon rods in the photovoltaic market is generally between 2800rpm and 3200rpm, and the linear speed is generally less than 45m / s, which belongs to conventional grinding. However, high-speed grinding with grinding wheels has not been applied in the market for various reasons.

[0063] The present application provides a grinding mechanism 100 for grinding silicon rods, which can greatly shorten the grinding processing time of silicon rods, thereby greatly improving the production efficiency and processing quality of silicon rod grinding.

[0064] like Figure 2 and Figure 3 As shown, the grinding mechanism 100 for silicon rod grinding according to the embodiment of the present application may include a support 110 , a first driving member 120 and a grinding wheel 130 .

[0065] The grinding mechanism 100 of the embodiment of the present application can grind single crystal silicon rods, square silicon rods, and round silicon rods. The grinding mechanism 100 of the embodiment of the present application does not limit the shape of the silicon rods.

[0066] The support 110 is a supporting mechanism of the grinding mechanism 100 , and the first driving member 120 , the grinding wheel 130 , the electrical unit, etc. can be installed on the supporting mechanism.

[0067] The first driving member 120 is arranged on the support 110. A part of the first driving member 120 can be fixed on the support 110, and a part of the first driving member 120 can also move relative to the support 110. For example, a part of the first driving member 120 can also translate or rotate relative to the support 110.

[0068] The first driving member 120 includes a first driving spindle 121, and the grinding wheel 130 is disposed at the end of the first driving spindle 121. The first driving member 120 can provide a driving force to drive the first driving spindle 121 to rotate. The present application does not limit the type of the first driving member 120. For example, the first driving member 120 can be a driving motor.

[0069] When the first driving member 120 provides power to rotate the first driving spindle 121, since the grinding wheel 130 is provided at the end of the first driving spindle 121, the grinding wheel 130 can rotate under the drive of the first driving spindle 121, so that the grinding wheel 130 can contact the silicon rod during the rotation process, thereby grinding the surface of the silicon rod.

[0070] In some embodiments of the present application, the driving speed of the first driving spindle 121 is 3500rpm-13000rpm. Compared with the grinding wheel in the prior art with a rotation speed of 2800rpm-3200rpm, the driving speed of the first driving spindle 121 in the embodiment of the present application is in the range of high-speed rotation, and the grinding wheel 130 driven by the first driving spindle 121 can grind the silicon rod at high speed.

[0071] For example, the driving speed of the first driving spindle 121 can be 3500rpm, 4500rpm, 5500rpm, 6500rpm, 7500rpm, 8500rpm, 9500rpm, 10500rpm, 11500rpm, 12500rpm, 13000rpm. The present application does not specifically limit the driving speed of the first driving spindle 121, as long as the driving speed of the first driving spindle 121 meets the above range.

[0072] Since the rotation speed of the first driving spindle 121 is 3500rpm-13000rpm, the grinding wheel 130 driven by the first driving spindle 121 can grind the silicon rod at high speed, thereby greatly reducing the grinding time of the grinding wheel 130 and greatly improving the production efficiency of the silicon rod. At the same time, the high-speed grinding wheel 130 can also greatly improve the grinding quality of the silicon rod.

[0073] In some embodiments of the present application, the dynamic balancing accuracy level of the first driving spindle 121 is not greater than G1.

[0074] Since the rotation speed of the first driving spindle 121 is very fast, in order to ensure the stability of the first driving spindle 121, the dynamic balancing accuracy level of the first driving spindle 121 is set to no more than G1. In some embodiments of the present application, the dynamic balancing accuracy level of the first driving spindle 121 is set to G0.4, which is the highest dynamic balancing accuracy level, thereby further ensuring the stability of the first driving spindle 121.

[0075] In some embodiments of the present application, since the grinding wheel 130 is driven to rotate by the first driving spindle 121, the rotation speed of the grinding wheel 130 is the same as the rotation speed of the first driving spindle 121. In order to ensure the stability of the grinding wheel 130, the dynamic balancing accuracy level of the grinding wheel 130 is set to be no greater than G1. In some embodiments of the present application, the dynamic balancing accuracy level of the grinding wheel 130 is set to G0.4, which is the highest dynamic balancing accuracy level, thereby further ensuring the stability of the grinding wheel 130.

[0076] In some embodiments of the present application, the grinding mechanism 100 further includes a cooling member, which is configured to cool at least the first drive spindle 121. It is understandable that since the rotation speed of the first drive spindle 121 is 3500rpm-13000rpm, the rotation speed of the first drive spindle 121 is very fast, and more heat will be generated during the rotation process, and the high temperature will affect the working state of the first drive spindle 121. Therefore, the present application is provided with a cooling member, which can cool at least the first drive spindle 121, thereby reducing the temperature of the first drive spindle 121 and ensuring that the first drive spindle 121 can work in a more comfortable environment.

[0077] In some embodiments of the present application, the cooling member may include a cooling channel, which is disposed on the first driving spindle 121 and is suitable for the flow of cooling liquid. In other words, the present application may cool the first driving spindle 121 by liquid cooling.

[0078] The cooling channel can be integrally formed on the first drive spindle 121. When the coolant flows through the cooling channel, the coolant can exchange heat with the part to be cooled on the first drive spindle 121, thereby ensuring that the first drive member 120 has a suitable operating temperature, and the coolant with increased temperature can be discharged from the cooling channel.

[0079] In some embodiments of the present application, the first drive spindle 121 is connected to the support 110 through the first support shaft and the second support shaft, and the cooling channel includes a first cooling channel and a second cooling channel, the first cooling channel is close to the first support bearing, and the second cooling channel is close to the second support bearing.

[0080] When the first drive spindle 121 rotates at a high speed, the portion of the first drive spindle 121 connected to the first support bearing and the second support bearing will generate a large amount of heat. Since the first cooling channel is close to the first support bearing and the second cooling channel is close to the second support bearing, the first cooling channel can exchange heat with the portion of the first drive spindle 121 connected to the first support bearing, and take away a large amount of heat generated by the portion of the first drive spindle 121 connected to the first support bearing; the second cooling channel can exchange heat with the portion of the first drive spindle 121 connected to the second support bearing, and take away a large amount of heat generated by the portion of the first drive spindle 121 connected to the second support bearing.

[0081] The first cooling channel and the second cooling channel can be independent flow channels. Of course, the first cooling channel and the second cooling channel can also be connected through other channels. The coolant in the first cooling channel can enter the second cooling channel, or the coolant in the second cooling channel can enter the first cooling channel.

[0082] The first driving member 120 further includes a driving motor, which can be arranged inside the first driving spindle 121 . The cooling channel further includes a third cooling channel, which is close to the driving motor and suitable for cooling the driving motor.

[0083] The coolant in the third cooling channel can exchange heat with the portion of the first drive spindle 121 close to the drive motor, so that the third cooling channel can cool the portion of the first drive spindle 121 close to the drive motor. The third cooling channel can be connected to the first cooling channel or / and the second cooling channel.

[0084] In some embodiments of the present application, the maximum linear speed of the grinding wheel 130 is 100m / s-150m / s. Compared with the linear speed of the grinding wheel 130 in the prior art of about 40m / s, the high-speed grinding wheel 130 with the above-mentioned linear speed range can improve the grinding efficiency of the grinding wheel 130. For example, under the same cutting depth, the high-speed rotating grinding wheel 130 can process the silicon rod in a shorter time than the low-speed rotating grinding wheel 130, so that the grinding wheel 130 has a higher grinding efficiency for the silicon rod.

[0085] The grinding wheel of the grinding mechanism 100 in the embodiment of the present application can be a rough grinding wheel or a fine grinding wheel. The rough grinding wheel can perform rough processing on the silicon rod, thereby pre-processing the silicon rod first; the fine grinding wheel can perform fine processing on the silicon rod, and further process the roughly processed silicon rod to meet the grinding requirements of the silicon rod.

[0086] When the grinding wheel 130 is constructed as a rough grinding wheel, the cutting depth of the rough grinding wheel is 0.5mm-0.8mm. Since the rough grinding wheel performs rough processing on the grinding wheel, the cutting depth can be slightly larger, and there is no need to worry about the surface roughness of the silicon rod after grinding being unsatisfactory due to the large cutting depth.

[0087] For example, the cutting depth of the rough grinding wheel can be 0.5mm, 0.6mm, 0.7mm, and 0.8mm. The cutting depth of the rough grinding wheel will directly affect the surface roughness of the silicon rod after grinding. At the same rotation speed of the rough grinding wheel, too much cutting depth of the rough grinding wheel may cause the surface of the silicon rod after grinding to be too rough. Although too little cutting depth of the rough grinding wheel can ensure that the silicon rod after grinding meets the requirements after rough grinding, it will result in a long processing time and low efficiency. The embodiment of the present application does not make a specific limitation on the cutting depth of the rough grinding wheel. As long as the cutting depth of the rough grinding wheel meets the above conditions, the surface of the silicon rod after rough grinding can meet the rough grinding requirements and have a high grinding efficiency for the silicon rod.

[0088] When the grinding wheel 130 is configured as a fine grinding wheel, the cutting depth of the fine grinding wheel is 0.05 mm-0.08 mm. Since the fine grinding wheel performs fine processing on the silicon rod, the cutting depth needs to be slightly smaller to reduce the probability of unsatisfactory surface roughness of the silicon rod after grinding due to the large cutting depth.

[0089] For example, the cutting depth of the fine grinding wheel can be 0.05mm, 0.06mm, 0.07mm, and 0.08mm. The cutting depth of the fine grinding wheel will directly affect the surface roughness of the silicon rod after grinding. At the same rotation speed of the fine grinding wheel, too much cutting depth of the fine grinding wheel may cause the surface of the silicon rod after grinding to be too rough. Although too little cutting depth of the fine grinding wheel can ensure that the silicon rod after grinding meets the requirements after fine grinding, it will result in a long processing time and low efficiency. The embodiment of the present application does not make a specific limitation on the cutting depth of the fine grinding wheel. As long as the cutting depth of the fine grinding wheel meets the above conditions, the surface of the silicon rod after rough grinding can meet the rough grinding requirements and have a high grinding efficiency for the silicon rod.

[0090] In some embodiments of the present application, the grinding wheel 130 is configured as a rough grinding wheel, the mesh number of which is 150-200; or the grinding wheel is a fine grinding wheel, the mesh number of which is 500-600.

[0091] For example, the mesh number of the rough grinding wheel can be 150, 160, 170, 180, 190, 200, and the embodiment of the present application does not limit the mesh number of the rough grinding wheel, as long as the mesh number of the rough grinding wheel meets the above conditions. The mesh number of the fine grinding wheel can be 500, 520, 540, 560, 580, 600, and the embodiment of the present application does not limit the mesh number of the fine grinding wheel, as long as the mesh number of the fine grinding wheel meets the above conditions.

[0092] The mesh number of the grinding wheel 130 refers to the size of the abrasive grain size. The mesh number of the grinding wheel 130 is mainly related to the roughness of the workpiece surface during grinding. When performing rough grinding, the grinding allowance is large and the required surface roughness value is also large, so a grinding wheel 130 with a smaller mesh number should be used, so that the grinding wheel 130 is not easy to be blocked and heated. When performing fine grinding, the roughness value of the workpiece surface is low, so a grinding wheel 130 with a larger mesh number should be selected. The finer the abrasive grains, the better the roughness of the workpiece surface.

[0093] In some embodiments of the present application, Figure 2As shown, the support 110 includes a top plate 111 and a bottom plate 112 spaced apart in the up-down direction, and a first side plate 113 and a second side plate 114 spaced apart in the left-right direction, the first side plate 113 is connected to one end of the top plate 111 and the bottom plate 112 on the same side, and the second side plate 114 is connected to the other end of the top plate 111 and the bottom plate 112 on the same side. The top plate 111, the first side plate 113, the bottom plate 112 and the second side plate 114 define the installation space 101.

[0094] One end of the first driving spindle 121 is located in the installation space 101, and the other end of the first driving spindle 121 extends out of the installation space 101 and is connected to the grinding wheel 130. A grinding wheel cover assembly 115 is also provided on the support 110, and the grinding wheel cover assembly 115 can cover the portion of the first driving spindle 121 extending out of the installation space 101, and a nozzle is provided in the grinding wheel cover assembly 115, and the nozzle can spray coolant to the grinding portion between the grinding wheel 130 and the silicon rod.

[0095] In some embodiments of the present application, a lifting mechanism 140 is further provided on the top plate 111, and the lifting mechanism 140 is connected to the first driving member 120, so that the first driving member 120 can be driven to move in the up and down directions, and the positions of the first driving spindle 121 and the grinding wheel 130 in the up and down directions can be adjusted, so that different positions on the grinding wheel 130 can be selected to grind the silicon rod.

[0096] The silicon rod grinding device 1000 in the embodiment of the present application is described in detail below.

[0097] like Figure 1 As shown, the silicon rod grinding device 1000 according to the embodiment of the present application may include a base 200, a clamping mechanism 300 and the grinding mechanism 100 of the above embodiment. The grinding mechanism 100 is arranged on the base 200 and is configured to grind the silicon rod clamped by the clamping mechanism 300.

[0098] Since the silicon rod grinding device 1000 in the embodiment of the present application is provided with the grinding mechanism 100 of the above-mentioned embodiment, the processing time of the silicon rod grinding device 1000 on the silicon rod is greatly reduced, and the processing efficiency of the silicon rod grinding device 1000 is greatly improved.

[0099] In some embodiments of the present application, a feeding mechanism 400 is provided between the base 200 and the support 110 of the grinding mechanism 100, and the feeding mechanism 400 can drive the support 110 to move relative to the base 200, so that the base 200 as a whole is close to or away from the center line of the silicon rod, ensuring the feeding amount of the grinding wheel 130. The feeding mechanism 400 can be a feeding motor, and the feeding motor and the base 200 are connected by a lead screw mechanism, so that the driving shaft of the feeding motor can drive the support 110 to move when it rotates.

[0100] In some embodiments of the present application, Figure 4 As shown, the clamping mechanism 300 includes a first clamp 310 and a second clamp 320, and the distance between the first clamp 310 and the second clamp 320 can be adjusted to selectively clamp the silicon rod. A first shock absorbing layer is provided on the clamping surface of the first clamp 310 and / or the clamping surface of the second clamp 320. In other words, one of the clamping surface of the first clamp 310 and the clamping surface of the second clamp 320 is provided with the first shock absorbing layer, or the clamping surface of the first clamp 310 and the clamping surface of the second clamp 320 are all provided with the first shock absorbing layer.

[0101] The first chuck 310 and the second chuck 320 can be spaced apart from each other, so that a strip-shaped silicon rod can be placed between the first chuck 310 and the second chuck 320, and both ends of the silicon rod in the length direction can contact the first chuck 310 and the second chuck 320 respectively. The first chuck 310 can clamp one end of the silicon rod in the length direction, and the second chuck 320 can clamp the other end of the silicon rod in the length direction.

[0102] One of the first chuck 310 and the second chuck 320 may be a floating chuck, so that the floating chuck can drive the silicon rod to rotate around the center line.

[0103] The high-speed rotating grinding wheel 130 will inevitably cause the silicon rod to vibrate during the grinding process. By providing a first shock-absorbing layer on the clamping surface of the first chuck 310 and / or the clamping surface of the second chuck 320, the vibration generated by the silicon rod during the grinding process can be greatly absorbed, thereby improving the processing stability of the silicon rod and reducing the transmission of vibration within the entire system.

[0104] In some embodiments of the present application, the first shock absorbing layer is a polyurethane layer. The polyurethane layer has a good shock absorbing effect. Of course, the present application does not limit the material of the first shock absorbing layer, as long as the first shock absorbing layer can better absorb the vibration of the silicon rod during processing.

[0105] In some embodiments of the present application, a foot pad is provided on the base 200, the foot pad is in direct contact with the ground, and a second shock-absorbing layer is provided on the foot pad. The second shock-absorbing layer greatly reduces the vibration transmitted from the machine tool to the outside world, so that the entire system achieves the expected shock-absorbing effect.

[0106] In some embodiments of the present application, Figure 1 As shown, there may be multiple grinding mechanisms 100, including: a first grinding mechanism 100a and a second grinding mechanism 100b, the grinding wheel 130 of the first grinding mechanism 100a is a rough grinding wheel, and the grinding wheel 130 of the second grinding mechanism 100b is a fine grinding wheel.

[0107] The fine grinding wheel can be arranged at the downstream section of the rough grinding wheel in the moving direction of the silicon rod, so that the part of the silicon rod ground by the rough grinding wheel can be further ground by the fine grinding wheel later. The rough grinding wheel and the fine grinding wheel can be arranged on one side of the silicon rod in the horizontal direction, and the rough grinding wheel and the fine grinding wheel can also be arranged on the other side of the silicon rod in the horizontal direction, thereby greatly improving the grinding efficiency of the silicon rod grinding device 1000.

[0108] The rough grinding wheel and the fine grinding wheel on both sides of the silicon rod in the horizontal direction can work at the same time. After the parts to be ground on the two opposite sides of the silicon rod in the horizontal direction are ground, the silicon rod can be rotated so that the parts to be ground on the two sides opposite to each other in the upper and lower directions of the silicon rod are rotated to relative positions in the horizontal direction, thereby facilitating the rough grinding wheel and the fine grinding wheel to grind the silicon rod.

[0109] In some embodiments of the present application, Figure 4 As shown, the silicon rod grinding device 1000 further includes a second driving member 500, which is disposed on the base 200 and connected to the clamping mechanism 300 to drive the clamping mechanism 300 to move in the first direction. The second driving member 500 can be connected to the clamping mechanism 300 through the intermediate feed slide 510, thereby ensuring that the clamping mechanism 300 can stably translate in the first direction.

[0110] When the rough grinding wheel is working, the moving speed of the clamping mechanism 300 in the first direction is 35mm / s-50mm / s, and when the fine grinding wheel is working, the moving speed of the clamping mechanism 300 in the first direction is 40mm / s-50mm / s. It should be noted that since the first chuck 310 and the second chuck 320 clamp the two ends of the silicon rod in the length direction, the first direction in the present application is the length direction of the silicon rod.

[0111] When the rough grinding wheel is working, the moving speed of the clamping mechanism 300 in the first direction can be 35 mm / s, 40 mm / s, 45 mm / s, or 50 mm / s. The embodiment of the present application does not limit the moving speed of the clamping mechanism 300 in the first direction when the rough grinding wheel is working, as long as the moving speed of the clamping mechanism 300 in the first direction meets the above conditions.

[0112] When the fine grinding wheel is working, the moving speed of the clamping mechanism 300 in the first direction can be 40 mm / s, 42 mm / s, 44 mm / s, 46 mm / s, 48 ​​mm / s, or 50 mm / s. The embodiment of the present application does not limit the moving speed of the clamping mechanism 300 in the first direction when the fine grinding wheel is working, as long as the moving speed of the clamping mechanism 300 in the first direction meets the above conditions.

[0113] The silicon rod grinding method according to the embodiment of the present application is described in detail below.

[0114] like Figure 5-Figure 6 As shown, the grinding method of the silicon rod according to the embodiment of the present application includes:

[0115] The silicon rod grinding device 1000 of the above embodiment is provided. The clamping mechanism 300 of the silicon rod grinding device 1000 is used to clamp a square silicon rod. The square silicon rod comprises: surfaces to be ground 103 connected in sequence in the circumferential direction and edges to be ground 102 connecting two adjacent surfaces to be ground 103;

[0116] The grinding wheel 130 of the grinding mechanism 100 is used to grind the edge 102 to be ground;

[0117] The surface to be ground 103 is ground using the grinding wheel 130 of the grinding mechanism 100 .

[0118] Since the silicon rod grinding method according to the embodiment of the present application adopts the above-mentioned silicon rod grinding equipment 1000, the grinding speed of the edge 102 to be ground of the square silicon rod is improved, and the grinding efficiency of the edge 102 to be ground is improved. At the same time, the grinding speed of the surface 103 to be ground of the square silicon rod is improved, and the grinding efficiency of the surface 103 to be ground is improved.

[0119] It should be noted that, before the square silicon rod is polished, the edges to be polished of the silicon rod are approximately right-angled edges. After being polished by the grinding wheel 130 , the edges of the silicon rod can be polished into rounded edges.

[0120] In some embodiments of the present application, the process of grinding the edge 102 to be ground using the grinding wheel 130 of the grinding mechanism 100 includes:

[0121] Rough machining is performed on the edge 102 to be ground of the square silicon rod;

[0122] The edge 102 to be ground of the square silicon rod is finely processed.

[0123] There may be multiple grinding mechanisms 100, the grinding wheels 130 of some grinding mechanisms 100 are coarse grinding wheels, and the grinding wheels 130 of some grinding mechanisms 100 are fine grinding wheels. The coarse grinding wheel can first perform rough processing on the edge 102 to be ground, and the part of the edge 102 to be ground that has been ground by the coarse grinding wheel can be ground again by the fine grinding wheel, so that the edge 102 to be ground of the square silicon rod meets the grinding requirements.

[0124] The rough processing of the edge 102 to be ground of the square silicon rod may include:

[0125] The square silicon rod is rotated to an initial position where a surface 103 to be ground is parallel to a horizontal plane;

[0126] Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in the second direction by a first angle to perform a first flat grinding on the edge 102 to be ground;

[0127] Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in a second direction by a second angle to perform a second flat grinding on the edge 102 to be ground;

[0128] Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in the second direction by a third angle to perform a third flat grinding on the edge 102 to be ground;

[0129] The first angle is greater than the second angle, and the first angle is smaller than the third angle.

[0130] After the first flat grinding of the edge 102 to be ground, the edge 102 to be ground will be ground into a plane, and thus two new edges will appear; the second flat grinding and the third flat grinding are respectively for grinding the two newly generated edges. Thus, by grinding the edge 102 of the square silicon rod at three angles, the edge 102 to be ground becomes smoother.

[0131] In some embodiments of the present application, the first angle is 40°-50°, the second angle is 17.5°-27.5°, and the third angle is 62.5°-72.5°. For example, the first angle may be 40°, 45°, 50°, the second angle may be 17.5°, 22.5°, 27.5°, and the third angle may be 62.5°, 67.5°, 72.5°. The embodiments of the present application do not specifically limit the first angle, the second angle, and the third angle, as long as the first angle, the second angle, and the third angle respectively meet the above corresponding ranges.

[0132] In some embodiments of the present application, fine grinding of the edge 102 to be ground of the square silicon rod includes: using the upper area of ​​the grinding wheel 130 of the grinding mechanism 100 to perform reciprocating swing grinding on the edge 102 to be ground. It should be noted that the area where the grinding wheel 130 can grind the silicon rod is an annular area, so the lifting mechanism 140 can be used to directly or indirectly drive the grinding wheel 130 to descend, so that the upper part of the annular area of ​​the grinding wheel 130 grinds the silicon rod, and the upper part of the annular area is longer in the length direction of the silicon rod, so that the grinding wheel 130 can grind more areas on the silicon rod at the same time, thereby improving the grinding speed of the silicon rod.

[0133] The finishing process of the to-be-grinded edge 102 of the square silicon rod includes: using a grinding wheel 130 (finishing grinding wheel) to grind each to-be-grinded edge 102 N1 times, where N1 is less than 3.

[0134] It should be noted that when the low-speed grinding wheel in the related art is used for fine grinding of the edge 102 to be ground, due to the low rotation speed of the grinding wheel, the edge 102 to be ground needs to be ground at least 3 times. The grinding wheel 130 in the embodiment of the present application can rotate at high speed under the drive of the first driving spindle 121, so that the high-speed grinding wheel 130 can significantly reduce the number of grinding times of the edge 102 to be ground, and improve the grinding efficiency of the edge 102 to be ground under the fine grinding condition.

[0135] In some embodiments of the present application, grinding the surface 103 using the grinding wheel 130 of the grinding mechanism 100 includes:

[0136] Performing rough grinding on the surface to be ground 103 of the square silicon rod;

[0137] The surface to be ground 103 of the square silicon rod is finely ground.

[0138] It is understandable that the grinding wheel 130 for rough grinding the surface 103 to be ground in the above method may be a rough grinding wheel, and the grinding wheel for fine grinding the surface 103 to be ground may be a fine grinding wheel. Since the grinding mechanism 100 is used to grind the surface 103 of the square silicon rod, the grinding efficiency of the surface 103 to be ground is greatly improved, so that the processing time of the surface 103 to be ground is significantly reduced.

[0139] In some embodiments of the present application, the rough grinding of the surface to be ground 103 of the square silicon rod includes: using the grinding wheel 130 to grind each surface to be ground 103 N2 times, where N2 is less than 5.

[0140] It should be noted that when the low-speed grinding wheel in the related art performs rough grinding on the surface 103 to be grinded, due to the low rotation speed of the grinding wheel, the edge surface to be grinded needs to be grinded at least 5 times. The grinding wheel 130 in the embodiment of the present application can rotate at high speed under the drive of the first driving spindle 121, so that the high-speed grinding wheel 130 can significantly reduce the number of grinding times of the surface 103 to be grinded, and improve the grinding efficiency of the surface 103 to be grinded under rough grinding conditions.

[0141] In some embodiments of the present application, the fine grinding of the surface to be ground 103 of the square silicon rod includes: using the grinding wheel 130 to grind each surface to be ground N3 times, and N3 is less than 5. It should be noted that when the low-speed grinding wheel in the related art performs fine grinding on the surface to be ground 103, due to the low rotation speed of the grinding wheel, it is necessary to grind the surface to be ground 103 at least 5 times. The grinding wheel 130 in the embodiment of the present application can rotate at a high speed under the drive of the first driving spindle 121, so that the high-speed grinding wheel 130 can significantly reduce the number of grinding times of the surface to be ground 103, and improve the grinding efficiency of the surface to be ground 103 under the fine grinding condition.

[0142] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A grinding mechanism for silicon rod grinding, characterized in that: include: Support; A first driving member, the first driving member is disposed on the support, and the first driving member comprises a first driving spindle; A grinding wheel, which is arranged at the end of the first driving spindle to grind the silicon rod under the drive of the first driving spindle; Wherein, the rotation speed of the first driving spindle is 3500rpm-13000rpm.

2. The grinding mechanism for silicon rod grinding according to claim 1, characterized in that: The dynamic balancing accuracy grade of the first driving spindle is not greater than G1.

3. The grinding mechanism for silicon rod grinding according to claim 1, characterized in that: Also includes: A cooling member is configured to cool at least the first driving spindle.

4. The grinding mechanism for silicon rod grinding according to claim 3, characterized in that: The cooling member includes a cooling channel, which is disposed on the first driving spindle and is suitable for the flow of a coolant.

5. The grinding mechanism for silicon rod grinding according to claim 4, characterized in that: The first driving spindle is connected to the support via a first support bearing and a second support bearing; The cooling channel includes: a first cooling channel and a second cooling channel, the first cooling channel is close to the first support bearing, and the second cooling channel is close to the second support bearing.

6. The grinding mechanism for silicon rod grinding according to claim 5, characterized in that: The first driving member further comprises a driving motor, and the driving motor is arranged inside the first driving spindle; The cooling channel further includes: a third cooling channel, which is close to the drive motor and is suitable for cooling the drive motor.

7. The grinding mechanism for silicon rod grinding according to claim 1, characterized in that: The maximum linear speed of the grinding wheel is 100m / s-150m / s.

8. The grinding mechanism for silicon rod grinding according to claim 1, characterized in that: The grinding wheel is a rough grinding wheel, and the cutting depth of the rough grinding wheel is 0.5mm-0.8mm; or The grinding wheel is a fine grinding wheel, and the cutting depth of the fine grinding wheel is 0.05mm-0.08mm.

9. The grinding mechanism for silicon rod grinding according to claim 1, characterized in that: The grinding wheel is a rough grinding wheel, and the mesh number of the rough grinding wheel is 150-200; or The grinding wheel is configured as a fine grinding wheel, and the mesh number of the fine grinding wheel is 500-600.

10. A silicon rod grinding device, characterized in that: include: Base; A clamping mechanism, wherein the clamping mechanism is configured to clamp a silicon rod; The grinding mechanism according to any one of claims 1 to 9 is arranged on the base and is configured to grind the silicon rod clamped by the clamping mechanism.

11. The silicon rod grinding device according to claim 10, characterized in that: The clamping mechanism comprises: a first clamp and a second clamp, wherein the first clamp and the second clamp can be relatively close to or far away from each other to selectively clamp the silicon rod; A first shock-absorbing layer is disposed on the clamping surface of the first clamping head and / or the clamping surface of the second clamping head.

12. The silicon rod grinding device according to claim 11, characterized in that: The first shock-absorbing layer is configured as a polyurethane layer.

13. The silicon rod grinding device according to claim 10, characterized in that: A foot pad is arranged on the base, and a second shock-absorbing layer is arranged on the foot pad.

14. The silicon rod grinding device according to claim 10, characterized in that: There are multiple grinding mechanisms, which include: a first grinding mechanism and a second grinding mechanism. The grinding wheel of the first grinding mechanism is a rough grinding wheel, and the grinding wheel of the second grinding mechanism is a fine grinding wheel.

15. The silicon rod grinding device according to claim 14, characterized in that: Also includes: a second driving member, the second driving member being disposed on the base and connected to the clamping mechanism to drive the clamping mechanism to move in a first direction; Wherein, when the rough grinding wheel is working, the moving speed of the clamping mechanism in the first direction is 35mm / s-50mm / s, and when the fine grinding wheel is working, the moving speed of the clamping mechanism in the first direction is 40mm / s-50mm / s.

16. A method for grinding a silicon rod, characterized in that: include: A silicon rod grinding device as claimed in claims 10 to 15 is provided, wherein the clamping mechanism of the silicon rod grinding device is used to clamp a square silicon rod, wherein the square silicon rod comprises: surfaces to be ground connected in sequence in the circumferential direction and edges to be ground connecting two adjacent surfaces to be ground; Using the grinding wheel of the grinding mechanism to grind the edge to be ground; The surface to be ground is ground using the grinding wheel of the grinding mechanism.

17. The method for grinding a silicon rod according to claim 16, characterized in that: The grinding process of the edge to be ground using the grinding wheel of the grinding mechanism comprises: Performing rough grinding on the edges to be ground of the square silicon rod; The edges to be ground of the square silicon rod are finely ground.

18. The method for grinding a silicon rod according to claim 17, characterized in that: The rough grinding of the edges to be ground of the square silicon rod comprises: Rotating the square silicon rod to an initial position where the surface to be ground is parallel to a horizontal plane; Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in a second direction by a first angle to perform a first flat grinding on the edge to be ground; Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in a second direction by a second angle to perform a second flat grinding on the edge to be ground; Taking the initial position of the square silicon rod as a reference, rotating the square silicon rod in the second direction by a third angle to perform a third flat grinding on the edge to be ground; The first angle is greater than the second angle, and the first angle is smaller than the third angle.

19. The method for grinding a silicon rod according to claim 18, characterized in that: The first angle is 40°-50°, the second angle is 17.5°-27.5°, and the third angle is 62.5°-72.5°.

20. The method for grinding a silicon rod according to claim 17, characterized in that: The fine grinding of the edge to be ground of the square silicon rod includes: using the upper area of ​​the grinding wheel of the grinding mechanism to perform reciprocating swing grinding on the edge to be ground.

21. The method for grinding a silicon rod according to claim 17, characterized in that: The fine grinding of the edges to be ground of the square silicon rod comprises: Each edge to be ground is ground N1 times using the grinding wheel, wherein N1 is less than 3.

22. The method for grinding a silicon rod according to claim 16, characterized in that: The grinding process of the surface to be ground using the grinding wheel of the grinding mechanism comprises: Performing rough grinding on the surface to be ground of the square silicon rod; The surface to be ground of the square silicon rod is finely ground.

23. The method for grinding a silicon rod according to claim 22, characterized in that: The rough grinding of the surface to be ground of the square silicon rod comprises: Each of the surfaces to be ground is ground N2 times using the grinding wheel, wherein N2 is less than 5.

24. The method for grinding a silicon rod according to claim 22, characterized in that: The fine grinding of the surface to be ground of the square silicon rod comprises: Each of the surfaces to be ground is ground N3 times using the grinding wheel, wherein N3 is less than 5.

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