Clamp and device for testing heat dissipation performance of micro-channel heat sink
通过设计一种包括夹具体、U型机架、夹紧块体和调节螺杆的微流道热沉散热性能测试夹具,解决了传统测试夹具松动和缺乏通用性的问题,实现了更高的测试 Accuracy and versatility.
Patent Information
- Application Number
- CN202411413075.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-02-18
AI Technical Summary
Traditional microflower heat sink heat dissipation performance testing fixtures are prone to loosening during the clamping process, which affects the accuracy of the test results and lacks versatility, making them unable to adapt to microflower heat sinks of different sizes and shapes.
A microflow channel heat sink heat dissipation performance test fixture including clamping, U-shaped frame, clamping block and adjusting screw is designed. The clamp can firmly clamp the microflow channel heat sink through adjustment screws and adjustable bolts and adapt to microflow channel heat sinks of different sizes and shapes.
It improves the stability and positioning accuracy of the microflower heat sink during the test process, reduces the risk of coolant leakage, enhances the accuracy of the test results and the versatility of the test device.
Smart Images

Figure CN119458173A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of heat dissipation testing technology, and in particular to a fixture and device for testing the heat dissipation performance of a microchannel heat sink. Background Art
[0002] With the rapid development of modern electronic devices, the integration and power density of electronic components continue to increase, especially in high-performance processors and high-frequency devices. Heat dissipation has become an important factor restricting the improvement of equipment performance. Microfluidic heat sinks have become a widely used cooling solution for high heat flux density equipment due to their efficient heat conduction and heat dissipation capabilities. In the design and development process of microfluidic heat sinks, heat dissipation performance testing is crucial. However, traditional test fixtures are prone to loosening during the clamping process, affecting the accuracy of the test results. In addition, traditional test fixtures lack versatility and cannot adapt to the testing needs of microfluidic heat sinks of different sizes, increasing the cost of processing specific test fixtures. Summary of the invention
[0003] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of the claims.
[0004] The embodiments of the present disclosure provide a microfluidic heat sink heat dissipation performance testing fixture and device, which can increase the stability of the clamped microfluidic heat sink, can adapt to microfluidic heat sinks of different sizes and shapes, has universality, and improves the positioning accuracy of the microfluidic heat sink, reducing the risk of coolant leakage of the microfluidic heat sink during testing.
[0005] In an embodiment of the first aspect of the present disclosure, a microchannel heat sink heat dissipation performance test fixture includes a fixture body, a U-shaped frame, a clamping block, and an adjusting screw;
[0006] The clamp body includes a first side wall, a second side wall, a third side wall, a fourth side wall, a bottom plate and an adjustable bolt. The bottom plate inside the clamp body is provided with a first groove, the first side wall is connected to the U-shaped frame, the first side wall is provided with an opening, and the clamping block is placed in the first groove through the opening. The side wall of the U-shaped frame is provided with a side wall hole, the adjusting screw passes through the side wall hole and is connected to the U-shaped frame and the clamping block, the clamping block is driven by the adjusting screw to move between the first groove and the inside of the U-shaped frame, and the adjustable bolts are respectively arranged on the third side wall and the fourth side wall.
[0007] According to certain embodiments of the first aspect of the present disclosure, the adjusting screw is connected to the U-shaped frame by a positioning flange and a hexagon socket head screw; and the first side wall is connected to the U-shaped frame by screws.
[0008] According to certain embodiments of the first aspect of the present disclosure, inside the matching hole of the clamping block, the clamping block and the adjusting screw are connected by a deep groove ball bearing.
[0009] According to certain embodiments of the first aspect of the present disclosure, the clamp body comprises a guide rail, which is used for the clamping block to move in the first groove.
[0010] According to certain embodiments of the first aspect of the present disclosure, the clamping block is L-shaped.
[0011] According to certain embodiments of the first aspect of the present disclosure, a water outlet channel is provided inside the second side wall for connecting to an external water outlet pipe; and a water inlet channel is provided inside the clamping block for connecting to an external water inlet pipe.
[0012] According to certain embodiments of the first aspect of the present disclosure, a through hole is provided inside the outlet of the water outlet flow channel, and the through hole, the inlet of the water outlet flow channel, the outlet of the water inlet flow channel and the inlet of the water inlet flow channel are respectively provided with sealing rings.
[0013] According to certain embodiments of the first aspect of the present disclosure, temperature sensor interfaces are respectively provided beside the through hole, the inlet of the water outlet flow channel, the outlet of the water inlet flow channel, and the inlet of the water inlet flow channel.
[0014] According to certain embodiments of the first aspect of the present disclosure, a second groove is provided above the first groove, a cover plate is placed in the second groove, and the cover plate is sealed by screws.
[0015] The disclosed embodiment includes at least the following beneficial effects: a first groove is provided on the bottom plate inside the clamp body, the first side wall is connected to the U-shaped frame, an opening is provided on the first side wall, a clamping block is placed in the first groove through the opening, the first groove carries the microfluidic heat sink and the clamping block, a side wall hole is provided on the side wall of the U-shaped frame, an adjusting screw passes through the side wall hole and is connected to the U-shaped frame and the clamping block, the clamping block is driven by the adjusting screw to move between the first groove and the inside of the U-shaped frame, so that the clamping block and the second side wall jointly clamp the microfluidic heat sink in the first groove, and the adjustable bolts are respectively arranged on the third side wall and the fourth side wall The microfluidic heat sink is clamped in the first groove by an adjustable bolt, so that the microfluidic heat sink heat dissipation performance test fixture can clamp the microfluidic heat sink more firmly, reduce the risk of loosening of the microfluidic heat sink, thereby improving the accuracy of the microfluidic heat sink heat dissipation performance test results, and by adjusting the clamping block and the adjustable bolts, the microfluidic heat sink heat dissipation performance test fixture can adapt to microfluidic heat sinks of different sizes and shapes, and has universality, and by adjusting the clamping block and the adjustable bolts, the positioning accuracy of the microfluidic heat sink can be improved, the risk of coolant leakage of the microfluidic heat sink during the test process can be reduced, and the reliability of the test data can be improved.
[0016] An embodiment of the second aspect of the present disclosure is a microfluidic heat sink heat dissipation performance testing device, comprising the microfluidic heat sink heat dissipation performance testing fixture as described above, a heating sheet, and a temperature sensor; the heating sheet is sealed by thermal grease, and the heating sheet is adhered to the microfluidic heat sink above the microfluidic heat sink, and the heating sheet is used to heat the microfluidic heat sink.
[0017] The above-mentioned microfluidic heat sink heat dissipation performance testing device and microfluidic heat sink heat dissipation performance testing fixture are based on the same inventive concept, and therefore have the beneficial effects of the microfluidic heat sink heat dissipation performance testing fixture, and the heating plate is sealed by thermal conductive silicone grease, which can improve the thermal conductivity between the heating plate and the microfluidic heat sink and reduce the contact thermal resistance between the heating plate and the microfluidic heat sink.
[0018] Other features and advantages of the present disclosure will be set forth in the following description, and in part will be apparent from the description, or may be learned by practicing the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The accompanying drawings are used to provide further understanding of the technical solution of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the technical solution of the present disclosure and do not constitute a limitation on the technical solution of the present disclosure.
[0020] Figure 1 A schematic diagram of the structure of a microchannel heat sink heat dissipation performance test fixture provided in an embodiment of the present disclosure;
[0021] Figure 2 A schematic structural diagram of a microchannel heat sink heat dissipation performance test fixture from another perspective provided in an embodiment of the present disclosure;
[0022] Figure 3 for Figure 2 A structural diagram of a second side wall in the structure shown from a perspective;
[0023] Figure 4 A schematic diagram of the structure of a device for testing the heat dissipation performance of a microchannel heat sink provided in an embodiment of the present disclosure;
[0024] Reference numerals:
[0025] Clamp body 100, U-shaped frame 200, clamping block 300, adjusting screw 400, first side wall 110, second side wall 111, third side wall 112, fourth side wall 113, bottom plate 114, adjustable bolt 115, first groove 116, second groove 117, positioning flange 210, hexagon socket head screw 211, guide rail 310, outlet 311 of water outlet flow channel, through hole 312, inlet 313 of water outlet flow channel, outlet 314 of water inlet flow channel, inlet 315 of water inlet flow channel, sealing ring 316, temperature sensor interface 317, heating sheet 500, microchannel heat sink 600, thermal grease 700. DETAILED DESCRIPTION
[0026] This section will describe in detail the specific embodiments of the present disclosure. The preferred embodiments of the present disclosure are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present disclosure, but it cannot be understood as a limitation on the scope of protection of the present disclosure.
[0027] In the description of the present disclosure, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.
[0028] In the description of the present disclosure, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0029] In the description of the present disclosure, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present disclosure based on the specific content of the technical solution.
[0030] The embodiments of the present disclosure are further described below in conjunction with the accompanying drawings.
[0031] Reference Figure 1-Figure 3 As shown, Figure 1 This is a schematic diagram of the structure of a microchannel heat sink heat dissipation performance test fixture provided in an embodiment of the present disclosure. Figure 2 This is a schematic structural diagram of another perspective of the microchannel heat sink heat dissipation performance test fixture provided by an embodiment of the present disclosure, Figure 3 for Figure 2 A perspective structural diagram of the second side wall in the structure shown, the microchannel heat sink heat dissipation performance test fixture includes a clamp body 100, a U-shaped frame 200, a clamping block 300 and an adjusting screw 400; the clamp body 100 includes a first side wall 110, a second side wall 111, a third side wall 112, a fourth side wall 113, a bottom plate 114 and an adjustable bolt 115, the bottom plate 114 inside the clamp body 100 is provided with a first groove 116, the first side wall 110 and the U-shaped frame 200 are connected to each other. The first side wall 110 is provided with an opening, and the clamping block 300 is placed in the first groove 116 through the opening. The side wall of the U-shaped frame 200 is provided with a side wall hole. The adjusting screw 400 passes through the side wall hole and is connected to the U-shaped frame 200 and the clamping block 300. The clamping block 300 is driven by the adjusting screw 400 to move between the first groove 116 and the inside of the U-shaped frame 200. The adjustable bolts 115 are respectively arranged on the third side wall 112 and the fourth side wall 113.
[0032] Specifically, the microfluidic heat sink is a cooling device composed of microfluidic channels, in which the coolant flows in the channels for heat exchange, taking away the heat of the heating element. The clamp is used to fix the microfluidic heat sink during the heat dissipation performance test of the microfluidic heat sink, so as to stably and accurately test the heat dissipation performance of the microfluidic heat sink. Among them, the first groove 116 is used to carry the microfluidic heat sink and the clamping block 300, and the clamping block 300 is driven by the adjusting screw 400, so that the clamping block 300 and the second side wall 111 jointly clamp the microfluidic heat sink in the first groove 116.
[0033] It can be understood that the position of the microfluidic heat sink in the first groove 116 is first adjusted. After determining the position of the microfluidic heat sink, the clamping block 300 is moved so that the clamping block 300 and the second side wall 111 jointly clamp the microfluidic heat sink, and then the adjusting screw 400 is turned for pre-tightening. Then the adjustable bolt 115 is adjusted, and the microfluidic heat sink is clamped using the adjustable bolt 115. The clamping block 300 and the second side wall 111 jointly clamp the microfluidic heat sink so that the microfluidic heat sink is firmly clamped by the microfluidic heat sink heat dissipation performance test fixture, and then the microfluidic heat sink is clamped using the adjustable bolt 115, so that the microfluidic heat sink heat dissipation performance test fixture clamps the microfluidic heat sink more firmly, thereby reducing the risk of loosening of the microfluidic heat sink and improving the accuracy of the microfluidic heat sink heat dissipation performance test results. Furthermore, by flexibly adjusting the clamping block 300 and the adjustable bolt 115, the microfluidic heat sink heat dissipation performance test fixture can adapt to microfluidic heat sinks of different sizes and shapes, and has universality, reducing the frequency of fixture production and replacement when testing the heat dissipation performance of microfluidic heat sinks of different sizes and shapes. Moreover, by adjusting the clamping block 300 and the adjustable bolt 115, the positioning accuracy of the microfluidic heat sink can be improved, the risk of coolant leakage of the microfluidic heat sink during the test process can be reduced, and the reliability of the test data can be improved. In addition, after the clamping block 300 and the second side wall 111 are used to clamp the microfluidic heat sink, the adjustable bolt 115 is used to reinforce the clamping of the microfluidic heat sink, so that under the high-pressure fluid test conditions, the microfluidic heat sink heat dissipation performance test fixture clamping the microfluidic heat sink remains stable, thereby improving the accuracy and reliability of the test results.
[0034] In some embodiments, the adjusting screw rod 400 is connected to the U-shaped frame 200 by a positioning flange 210 and a hexagon socket head screw 211; and the first side wall 110 is connected to the U-shaped frame 200 by screws.
[0035] In some embodiments, inside the matching hole of the clamping block 300 , the clamping block 300 and the adjusting screw 400 are connected by a deep groove ball bearing.
[0036] Specifically, the side wall of the U-shaped frame 200 is provided with a side wall hole, and the adjusting screw 400 passes through the side wall hole to connect with the U-shaped frame 200, and the adjusting screw 400 is connected with the clamping block 300, wherein inside the matching hole of the clamping block 300, the clamping block 300 and the adjusting screw 400 are connected by a deep groove ball bearing, which is a rolling bearing that can reduce friction resistance and is durable. Among them, the adjusting screw 400 and the U-shaped frame 200 are connected by a positioning flange 210 and a hexagon socket head screw 211, and the use of the positioning flange 210 is simple to assemble, and easy to disassemble and replace. The first side wall 110 and the U-shaped frame 200 can be connected by a hexagon socket head screw, or by a hexagon socket countersunk screw, which is not specifically limited in the present disclosure.
[0037] In some embodiments, the clamp body 100 includes a guide rail 310, which is used for the clamp block 300 to move in the first groove 116. Specifically, the clamp block 300 uses the guide rail 310, so that the clamp block 300 can slide in the first groove 116, and the use of the clamp block 300 is easier and more convenient.
[0038] In a possible implementation, the clamping block 300 moves in the first groove 116 using a V-shaped sliding guide rail, the V-shaped sliding guide rail is arranged in the first groove 116 of the clamping body 100, and the positions on both sides of the clamping block 300 that move in contact with the first groove 116 are correspondingly arranged as structures that cooperate with the V-shaped sliding guide rail. The V-shaped sliding guide rail has good stability and positioning accuracy.
[0039] In another possible implementation, the clamping block 300 moves in the first groove 116 using a dovetail groove guide rail, which is disposed in the first groove 116 of the clamp body 100, and the positions on both sides of the clamping block 300 that move in contact with the first groove 116 are correspondingly configured as structures that cooperate with the dovetail groove guide rail. The dovetail groove guide rail has a self-aligning feature, and during installation and use, the dovetail groove guide rail has a self-aligning capability, which helps to maintain the positioning accuracy of the clamping block 300.
[0040] In some embodiments, the clamping block 300 is L-shaped. Specifically, if the L-shaped clamping block 300 is split, it can be understood that there is a larger long board on the top and a smaller long board on the bottom. The smaller long board is under the larger long board, and the clamping block 300 can be placed more stably in the microchannel heat sink heat dissipation performance test fixture and move stably in the microchannel heat sink heat dissipation performance test fixture. The smaller long board also acts as a baffle.
[0041] In some embodiments, a water outlet channel is provided inside the second side wall 111 for connecting to an external water outlet pipe; a water inlet channel is provided inside the clamping block 300 for connecting to an external water inlet pipe. Specifically, during the heat dissipation performance test of the microchannel heat sink, the coolant flows through the water inlet channel and enters the microchannel heat sink. After flowing in the flow channel of the microchannel heat sink for heat exchange, the coolant flows out of the microchannel heat sink and enters the water outlet channel.
[0042] In some embodiments, a through hole 312 is provided inside the outlet 311 of the water outlet flow channel, and a sealing ring 316 is provided at the through hole 312, the inlet 313 of the water outlet flow channel, the outlet 314 of the water inlet flow channel, and the inlet 315 of the water inlet flow channel. Among them, the through hole 312, the inlet 313 of the water outlet flow channel, the outlet 314 of the water inlet flow channel, and the inlet 315 of the water inlet flow channel have the same size. Specifically, a sealing ring 316 is provided at the through hole 312, the inlet 313 of the water outlet flow channel, the outlet 314 of the water inlet flow channel, and the inlet 315 of the water inlet flow channel, respectively, which can reduce the risk of coolant leakage of the microchannel heat sink during the heat dissipation performance test and improve the reliability of the test data.
[0043] In some embodiments, temperature sensor interfaces 317 are respectively provided beside the through hole 312, the inlet 313 of the outlet flow channel, the outlet 314 of the inlet flow channel, and the inlet 315 of the inlet flow channel. It can be understood that the temperature sensor interface 317 is provided in the microchannel heat sink heat dissipation performance test fixture, which can facilitate the measurement of the coolant temperature of the inlet flow channel and the outlet flow channel in the microchannel heat sink heat dissipation performance test.
[0044] In some embodiments, a second groove 117 is provided on the first groove 116, and the cover plate is placed in the second groove 117, and the cover plate is sealed by screws. The second groove 117 is provided to facilitate the placement of the cover plate for sealing. The cover plate can be sealed by a hexagon socket head screw or a flat head screw, which is not specifically limited in the present disclosure.
[0045] The microfluidic heat sink heat dissipation performance test fixture disclosed in the present invention can be quickly clamped and released, so that testers can easily complete the installation and removal of the microfluidic heat sink, simplifying the operation process, saving test time, and improving work efficiency.
[0046] Reference Figure 4 As shown, Figure 4 The schematic diagram of the structure of the microfluidic heat sink heat dissipation performance test device provided in the embodiment of the present disclosure includes the microfluidic heat sink heat dissipation performance test fixture of any of the above embodiments, as well as a heating plate 500 and a temperature sensor (not shown in the figure); the heating plate 500 is sealed by thermal conductive silicone grease 700, and the heating plate 500 is adhered to the microfluidic heat sink 600 above the microfluidic heat sink 600, and the heating plate 500 is used to heat the microfluidic heat sink 600. Among them, the temperature sensor is used to measure the coolant temperature of the water inlet flow channel and the water outlet flow channel.
[0047] The heating sheet 500 includes two leads of the heating sheet. The two leads of the heating sheet are used to connect an external adjustable DC power supply. By adjusting the voltage and current of the adjustable DC power supply, the heating power of the heating sheet 500 can be flexibly adjusted, so as to simulate a high heat flux density environment under real working conditions, so that the heat dissipation performance test of the microchannel heat sink 600 can be closer to the actual application scenario, and the test data can be more valuable for reference.
[0048] Specifically, the heating sheet 500 is sealed by thermal grease 700, which can improve the heat conduction effect between the heating sheet 500 and the microchannel heat sink 600 and reduce the contact thermal resistance between the heating sheet 500 and the microchannel heat sink 600. The temperature sensor can be a thermocouple or a thermal resistor, which is not specifically limited in the present disclosure.
[0049] In some embodiments, the temperature sensor may be a K-type thermocouple, an E-type thermocouple, or a T-type thermocouple, and may be flexibly adjusted and set according to the actual measured temperature range, which is not specifically limited in the present disclosure.
[0050] In some embodiments, temperature sensor interfaces 317 are provided beside the through hole 312, the inlet 313 of the outlet flow channel, the outlet 314 of the inlet flow channel, and the inlet 315 of the inlet flow channel. Specifically, the temperature sensor interface 317 is used to connect an external thermocouple, and the temperature measuring line of the thermocouple is connected from the temperature sensor interface 317 beside the inlet 315 of the inlet flow channel, and extends from the temperature sensor interface 317 beside the outlet 314 of the inlet flow channel, so that the temperature measuring line of the thermocouple contacts the microchannel heat sink 600, thereby measuring the coolant temperature of the inlet flow channel. The temperature measuring line of the thermocouple is connected from the temperature sensor interface 317 beside the through hole 312, and extends from the temperature sensor interface 317 beside the inlet 313 of the outlet flow channel, so that the temperature measuring line of the thermocouple contacts the microchannel heat sink 600, thereby measuring the coolant temperature of the outlet flow channel.
[0051] It should be understood that the various implementations provided in the embodiments of the present disclosure can be combined arbitrarily to achieve different technical effects.
[0052] The above is a specific description of the preferred implementation of the present disclosure, but the present disclosure is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present disclosure. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present disclosure.
Claims
1. Microchannel heat sink heat dissipation performance test fixture, characterized by: It includes a clamping body, a U-shaped frame, a clamping block and an adjusting screw; The clamp body includes a first side wall, a second side wall, a third side wall, a fourth side wall, a bottom plate and an adjustable bolt. The bottom plate inside the clamp body is provided with a first groove, the first side wall is connected to the U-shaped frame, the first side wall is provided with an opening, and the clamping block is placed in the first groove through the opening. The side wall of the U-shaped frame is provided with a side wall hole, the adjusting screw passes through the side wall hole and is connected to the U-shaped frame and the clamping block, the clamping block is driven by the adjusting screw to move between the first groove and the inside of the U-shaped frame, and the adjustable bolts are respectively arranged on the third side wall and the fourth side wall.
2. The microchannel heat sink heat dissipation performance test fixture according to claim 1, characterized in that: The adjusting screw is connected to the U-shaped frame by a positioning flange and a hexagon socket head screw; the first side wall is connected to the U-shaped frame by screws.
3. The microchannel heat sink heat dissipation performance test fixture according to claim 1, characterized in that: Inside the matching hole of the clamping block, the clamping block and the adjusting screw are connected by a deep groove ball bearing.
4. The microchannel heat sink heat dissipation performance test fixture according to claim 1, characterized in that: The clamp body includes a guide rail, and the guide rail is used for the clamping block to move in the first groove.
5. The microchannel heat sink heat dissipation performance test fixture according to claim 1, characterized in that: The clamping block is L-shaped.
6. The microchannel heat sink heat dissipation performance test fixture according to claim 1, characterized in that: A water outlet channel is provided inside the second side wall for connecting to an external water outlet pipe; a water inlet channel is provided inside the clamping block for connecting to an external water inlet pipe.
7. The microchannel heat sink heat dissipation performance test fixture according to claim 6, characterized in that: A through hole is provided inside the outlet of the water outlet flow channel, and sealing rings are provided at the through hole, the inlet of the water outlet flow channel, the outlet of the water inlet flow channel and the inlet of the water inlet flow channel respectively.
8. The microchannel heat sink heat dissipation performance test fixture according to claim 7, characterized in that: Temperature sensor interfaces are respectively provided beside the through hole, the inlet of the water outlet flow channel, the outlet of the water inlet flow channel and the inlet of the water inlet flow channel.
9. The microchannel heat sink heat dissipation performance test fixture according to claim 1, characterized in that: A second groove is arranged on the first groove, a cover plate is placed in the second groove, and the cover plate is sealed by screws.
10. Microchannel heat sink heat dissipation performance testing device, characterized in that: It comprises a microfluidic heat sink heat dissipation performance test fixture as described in any one of claims 1 to 9, a heating sheet, and a temperature sensor; the heating sheet is sealed by thermal grease, and the heating sheet is adhered to the microfluidic heat sink above the microfluidic heat sink, and the heating sheet is used to heat the microfluidic heat sink.
Citation Information
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