Liquid ejecting head and method of manufacturing the same
By designing an electrical connection structure with a lead wire with a raised shape and an additional portion in the electrical connection structure of the liquid ejection head, the problem of easy peeling of the anisotropic conductive film is solved, and the electrical reliability and stability are improved.
Patent Information
- Application Number
- CN202411061619.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-08
- Filing Date
- 2024-08-05
- Publication Date
- 2025-02-18
AI Technical Summary
In the electrical connection structure of the conventional liquid ejection head, the anisotropic conductive film is easily peeled off due to a misalignment, causing the liquid to come into contact with the electrical connection part, and reducing electrical reliability.
An electrical connection structure is designed in which a plurality of first and second leads are arranged along an edge portion of the electrical wiring member and electrically connected to each other by an anisotropic conductive film. The structure includes leads with a raised shape and additional portions to enhance adhesion of the conductive film and prevent peeling.
Through this electrical connection structure, the anisotropic conductive film is not easy to peel off, which improves the electrical reliability of the liquid ejection head and ensures the stability and reliability of the electrical connection.
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Figure CN119459133A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a liquid ejection head and a method of manufacturing the liquid ejection head. Background Art
[0002] A technique for electrically connecting electrical wiring members by using an anisotropic conductive film is known. The anisotropic conductive film is previously pasted to one of the electrical wiring members. Japanese Patent Laid-Open No. 2004-6632 describes arranging a dummy electrode next to an electrode to prevent the anisotropic conductive film from being peeled off from the electrode.
[0003] The dummy electrode described in Japanese Patent Laid-Open No. 2004-6632 has a gap between the dummy electrode and the electrode. Therefore, when the end portion of the anisotropic conductive film is arranged on the gap due to a pasting error of the anisotropic conductive film, the anisotropic conductive film is more likely to be peeled off from the end portion thereof. Specifically, in an electrical connection structure of a liquid ejection head using a liquid such as ink, if the anisotropic conductive film is peeled off, the liquid may contact the electrical connection portion, thereby reducing electrical reliability. Summary of the invention
[0004] The present disclosure provides a liquid ejection head having an electrical connection structure in which an anisotropic conductive film is not easily peeled off.
[0005] A liquid ejection head according to the present disclosure has an electrical connection structure, the electrical connection structure comprising: a plurality of first leads having a convex shape and arranged in one direction along an edge portion of a first electrical wiring member; a plurality of second leads arranged in the one direction along an edge portion of a second electrical wiring member and facing the corresponding first leads; and an anisotropic conductive film located between the plurality of first leads and the plurality of second leads and electrically connecting the plurality of first leads and the corresponding plurality of second leads to each other. The plurality of first leads include a first end lead located at one end portion in the one direction, and the first electrical wiring member includes a first additional portion having a convex shape, at least a portion of the first additional portion being in contact with the first end lead in the one direction.
[0006] Further features of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 is a perspective view showing a main part of a liquid ejection head according to an embodiment of the present disclosure.
[0008] Figure 2Ais a plan view showing a first electric wiring member to which an anisotropic conductive film has been attached, and Figure 2B is a plan view showing the second electric wiring member.
[0009] Figure 3A is a partial cross-sectional view of the first electrical wiring member and the second electrical wiring member before being coupled to each other, and Figure 3B is a partial cross-sectional view of the first electric wiring member and the second electric wiring member after being coupled to each other.
[0010] Figure 4 is a diagram showing a device for attaching an anisotropic conductive film to a first electric wiring member.
[0011] FIG. 5A to FIG. 5G is a diagram showing a process of attaching an anisotropic conductive film to a first electric wiring member.
[0012] FIG. 6A to FIG. 6C 1 is a diagram showing the pasting error of the anisotropic conductive film in the X direction.
[0013] FIG. 7A to FIG. 7C 1 is a diagram showing the pasting error of the anisotropic conductive film in the Y direction.
[0014] FIG. 8A to FIG. 8D is a side view showing a state of an end portion of the anisotropic conductive film.
[0015] 9A to 9C 1 is a diagram showing a mechanism by which the end portion of the anisotropic conductive film is peeled off.
[0016] Fig. 10A and Fig. 10B 1 is a diagram showing a mechanism by which the end portion of the anisotropic conductive film is peeled off.
[0017] Fig.11A and Fig. 11B : is a diagram showing a sticking error of the first electric wiring member having the first additional portion.
[0018] Fig.12 is a diagram showing an electric wiring member according to a comparative example.
[0019] FIG. 13A to FIG. 13C is a diagram showing a modification. DETAILED DESCRIPTION
[0020] Will refer to Figures 1 to 12 An electrical connection structure 100 according to an embodiment of the present disclosure is described.
[0021] This embodiment is an example of the present disclosure and is not intended to limit the scope of the present disclosure. The following embodiment relates to an electrical connection structure of an inkjet head that ejects ink, but the present disclosure can also be applied to an electrical connection structure of a liquid ejection head that ejects liquids other than ink. In the following description and drawings, the X direction is the longitudinal direction of the anisotropic conductive film 50, and the Y direction is the width direction of the anisotropic conductive film 50 or a direction parallel to the film surface of the anisotropic conductive film 50 and orthogonal to the X direction. The direction orthogonal to the X direction and the Y direction is the Z direction.
[0022] Structure of liquid ejecting head
[0023] Figure 1 : is a perspective view showing the main parts of the liquid ejection head 1. The liquid ejection head 1 includes an element substrate 2 that ejects a single color ink (black ink) and an element substrate 3 that ejects a plurality of color inks (color inks). The liquid ejection head includes a support member 4 having an ink supply port (not shown) and supporting the element substrates 2 and 3. The element substrates 2 and 3 are fixed to the support member 4, and the corresponding ejection ports are aligned with the ink supply ports. The second electrical wiring member 20 is fixed to the support member 4. The element substrates 2 and 3 are electrically connected to the second electrical wiring member 20 by a technique such as wire bonding or inner wire bonding. The electrical connection portion between the element substrates 2 and 3 and the support member 4 is sealed with sealing materials 5 and 6. The second electrical wiring member 20 is a flexible wiring substrate. The second electrical wiring member 20 is electrically and physically connected to the first electrical wiring member 10 through an anisotropic conductive film (ACF) 50. The first electrical wiring member 10 is a printed circuit board, which is a rigid board.
[0024] Structure of electrical connection structure
[0025] Figure 2A is a plan view showing the first electric wiring member 10 and the anisotropic conductive film 50, and Figure 2B 1 is a partial plan view of the second electric wiring member 20 as viewed from the surface opposite to the surface of the second electric wiring member 20 in contact with the anisotropic conductive film 50 . Figure 3A 1 is a partial cross-sectional view of the first electric wiring member 10 and the second electric wiring member 20 separated from each other. Figure 3B is a partial cross-sectional view of an electrical connection structure 100 in which the first electric wiring member 10 and the second electric wiring member 20 have been adhered to each other via the anisotropic conductive film 50 .
[0026] The first electrical wiring member 10 includes a plurality of leads (hereinafter referred to as first leads 30) having a convex shape. The first leads 30 are in contact with the edge portion 15 of the first electrical wiring member 10 and are arranged in one direction (X direction) along the edge portion 15. Among the plurality of first leads 30, the first lead 30 located at one end portion in one direction (X direction) is referred to as a first end lead 35, and the first lead 30 located at the other end portion is referred to as a second end lead 37. The second electrical wiring member 20 includes a plurality of leads (hereinafter referred to as second leads 40) having a convex shape. The second lead 40 is in contact with the edge portion 25 of the second electrical wiring member 20 and is arranged in one direction (X direction) along the edge portion 25. The first electrical wiring member 10 also includes a first additional portion 60 and a second additional portion 80, which will be described later.
[0027] Method for manufacturing electrical connection structure 100
[0028] A method for manufacturing the electrical connection structure 100 will be described with reference to FIGS. 2 to 3. First, Figure 2A As shown, an anisotropic conductive film 50 having a substantially rectangular shape as viewed in the Z direction is attached to the first lead 30 so that one side of the anisotropic conductive film 50 is parallel to the edge portion 15 of the first electrical wiring member 10. Next, as shown in FIG. Figure 3A As shown, the second electrical wiring member 20 is arranged above the anisotropic conductive film 50 so that the second leads 40 face the corresponding first leads 30 to be connected to the second leads 40. Then, the second electrical wiring member 20 is lowered until the second leads 40 come into contact with the anisotropic conductive film 50.
[0029] Next, the anisotropic conductive film 50 is heated and pressurized from above the second electrical wiring member 20 by using a thermal compression tool (not shown). Figure 3B As shown, some parts of the anisotropic conductive film 50 at least partially fill the gap between the first lead 30 and the second lead 40. The thermosetting resin in the anisotropic conductive film 50 is hardened by heating. Through the above process, the anisotropic conductive film 50 physically connects the first electrical wiring member 10 and the second electrical wiring member 20 to each other, and also electrically connects the first lead 30 and the second lead 40 to each other.
[0030] Anisotropic conductive film 50 pasting device 200 and pasting method
[0031] Figure 41 is a conceptual diagram showing the structure of the pasting device 200 of the anisotropic conductive film 50. The pasting device 200 includes a half-cutting station 520, a half-cutting blade 530, a pasting head 500, a plurality of guide rollers 540, 550, 570, 590 and a peeling roller 580. The anisotropic conductive film 50 is connected to the separation film 600 to form a laminated film 605. The half-cutting blade 530 is arranged at a position facing the half-cutting station 520. The half-cutting blade 530 moves in the X direction to cut the entire anisotropic conductive film 50 in the width direction. The anisotropic conductive film 50 is cut through the entire film thickness, but the separation film 600 is not cut. In the figure, a half-cut portion 560 directly above the first electrical wiring member 10 is shown. The pasting head 500 can move in the Z direction. The pasting head 500 heats and pressurizes the laminate film 605 from above the separation film 600 to paste the anisotropic conductive film 50 to the first lead 30 .
[0032] A conveyor 620 that conveys the first electric wiring member 10 is provided below the sticking head 500. The guide rollers 540, 550, and 570 guide the laminate film 605 to a position just above the first electric wiring member 10 by moving the laminate film 605 in the directions indicated by arrows R1, R2, and R3. The peeling roller 580 cooperates with the guide roller 570 and peels the separation film 600 from the anisotropic conductive film 50 stuck to the first electric wiring member 10. The guide rollers 550, 570, and 590 guide the separation film 600 that has been separated from the anisotropic conductive film 50 in the directions indicated by arrows R3, R4, and R5.
[0033] 5, the process of attaching the anisotropic conductive film 50 to the first electrical wiring member 10 will be described. First, as shown in FIG. Figure 5A As shown, the portion to be pasted ( Figure 4 The first electrical wiring member 10 is transported by the conveyor 620 to the position below the pasting head 500 and remains stationary. Figure 5B As shown, the guide rollers 550 and 570 and the peeling roller 580 are moved downward by a driving device (not shown), and the anisotropic conductive film 50 is placed on the first lead line 30 .
[0034] Next, if Figure 5C As shown, the pasting head 500 moves downward until it contacts the separation film 600. Thereafter, the pasting head 500 heats and pressurizes the anisotropic conductive film 50 via the separation film 600. This adheres the anisotropic conductive film 50 to the first lead 30. The heating and pressurization may be performed for about one second. Thereafter, as shown in FIG. Figure 5D As shown, the sticking head 500 moves upward and is separated from the separation film 600 .
[0035] Next, if Figure 5E As shown, the guide roller 570 and the peeling roller 580 move in the direction opposite to the conveying direction of the laminate film 605 while holding the separation film 600 therebetween. This peels the separation film 600 from the anisotropic conductive film 50. Fig. 5F As shown, when the guide roller 570 and the peeling roller 580 have completed their movement, the separation film 600 is peeled off from the portion of the anisotropic conductive film 50 that has been pasted to the first lead 30 .
[0036] Next, if Figure 5G As shown, the guide roller 570 and the peeling roller 580 move in opposite directions to return to their original positions. Before or simultaneously with this operation, the guide rollers 550 and 570 and the peeling roller 580 move upward to lift the separation film 600. By performing the above process, the anisotropic conductive film 50 is attached to the first electrical wiring member 10. Thereafter, the process is repeated. FIG. 5A to FIG. 5G The process shown.
[0037] Pasting error of anisotropic conductive film
[0038] When passing FIG. 5A to FIG. 5G When the anisotropic conductive film 50 is pasted in the process shown, pasting errors in the X direction and pasting errors in the Y direction may occur. FIG. 6A to FIG. 6C 1 shows a pasting error in the X direction of the anisotropic conductive film 50. In the present embodiment, for example, a pasting error EX of 0.2 mm occurs in the X direction. Fig. 6A 2 shows a case where the anisotropic conductive film 50 is shifted to the right. Figure 6B shows the case where the pasting error is zero, and Figure 6C The case where the anisotropic conductive film 50 is shifted to the left is shown. FIG. 7A to FIG. 7C 1 shows a pasting error of the anisotropic conductive film 50 in the Y direction. In the present embodiment, for example, a pasting error EY of 0.15 mm occurs in the Y direction. Fig. 7A 4 shows the case where the anisotropic conductive film 50 is shifted forward. Figure 7B shows the case where the pasting error is zero, and Figure 7C However, since the length of the first lead 30 in the Y direction is generally greater than the width of the anisotropic conductive film 50 in the Y direction, the pasting error in the Y direction is not a significant problem.
[0039] Stripping of anisotropic conductive film
[0040] When the separation film 600 is peeled off, the anisotropic conductive film 50 that has been attached to the first electric wiring member 10 can be peeled off from the first electric wiring member 10 . FIG. 8A to FIG. 8D1 is a side view showing a state of an end portion of the anisotropic conductive film 50 . Fig. 8A and Figure 8B The case where the thickness t1 of the first lead 30 is about 40 μm is shown. Figure 8C and Fig.8D The case where the thickness t2 of the first lead 30 is about 80 μm is shown. Fig. 8A and Figure 8C Corresponds to Fig. 6A ,and Figure 8B and Fig.8D Corresponds to Figure 6C The thickness of the first lead 30 depends on the performance required of the liquid ejection head 1. In order to achieve high-precision and high-speed printing, a large amount of power is required, but an increase in the width of the first lead 30 affects the size of the liquid ejection head 1. Therefore, the thickness of the first lead 30 can be increased to support the increased power.
[0041] like Fig. 8A and Figure 8C As shown in FIG. 1 , when the end of the anisotropic conductive film 50 is present on the first lead 30 (not protruding from the first lead), the anisotropic conductive film 50 is less likely to be peeled off. Figure 8B and Fig.8D As shown, when the end portion of the anisotropic conductive film 50 protrudes from the first lead 30, the anisotropic conductive film 50 is likely to be peeled off from its end portion. When the thickness of the first lead 30 is small, the end portion of the anisotropic conductive film 50 sags from the first lead 30 and adheres to the first electrical wiring member 10. However, when the adhesion to the first electrical wiring member 10 is insufficient, the anisotropic conductive film 50 is likely to be peeled off from its end portion. When the thickness of the first lead 30 is large, the end portion of the anisotropic conductive film 50 sags from the first lead 30, but does not contact the first electrical wiring member 10, or if it contacts, the contact area is reduced. Therefore, the anisotropic conductive film 50 is more likely to be peeled off from its end portion. This problem is easy to occur when the thickness of the first lead 30 is greater than the thickness of the anisotropic conductive film 50, and is more likely to occur when the thickness of the first lead 30 is 1.2 times or more of the thickness of the anisotropic conductive film 50.
[0042] Fig.9A The mechanism of peeling the anisotropic conductive film 50 from the first electrical wiring member 10 at a position closer to the peeling start point of the separation film 600 is schematically shown. Figure 5D The state transitions to Figure 5E During the state of, when the separation film 600 is peeled off by the peeling roller 580 and the guide roller 570, the anisotropic conductive film 50 is pulled upward together with the separation film 600. Fig. 9BAs shown, the anisotropic conductive film 50 is peeled off from the first electrical wiring member 10. Fig. 9C As shown, as the peeling progresses, the anisotropic conductive film 50 may be peeled off from the plurality of first leads 30 .
[0043] Fig. 10A and Fig. 10B The mechanism of peeling the anisotropic conductive film 50 from the first electrical wiring member 10 at a position closer to the peeling end point of the separation film 600 is schematically shown. Fig. 5F The state transitions to Figure 5G During the state in , the portion of the anisotropic conductive film 50 that has been pasted to the first electric wiring member 10 is separated from the subsequent portion of the anisotropic conductive film 50 .
[0044] However, in Figure 5C During the heating and pressurizing process shown, the cut portion of the anisotropic conductive film 50 may be adhered again to the subsequent portion of the anisotropic conductive film 50. Fig. 10A As shown, the portion of the anisotropic conductive film 50 that has been adhered again to the subsequent portion of the anisotropic conductive film 50 in the half-cut portion 560 is conveyed to the left side together with the subsequent portion of the anisotropic conductive film 50 and peeled off from the first electrical wiring member 10. Fig. 10B As shown, as the separation film 600 is conveyed, the range in which the anisotropic conductive film 50 is peeled off from the first electric wiring member 10 increases.
[0045] Structure of the additional part
[0046] Fig.11A and Fig. 11Bis a partial plan view showing the first electrical wiring member 10. The first additional portion 60 is provided on a side closer to the starting point where the separation film 600 is peeled off. The first additional portion 60 includes a plurality of (three in the present embodiment) first branch portions 62. Each first branch portion 62 is a substantially rectangular parallelepiped member having a substantially rectangular shape when viewed from the Z direction. The first branch portion 62 extends substantially parallel to the X direction. The first branch portion 62 may be made of the same material as the first lead 30. This may easily form the first electrical wiring member 10. In the present embodiment, the first branch portion 62 is formed integrally with the first end lead 35. The thickness of the first additional portion 60 (first branch portion 62) may be equal to the thickness of the first end lead 35. More specifically, when the thickness of the first additional portion 60 (first branch portion 62) is not less than 80% of the thickness of the first end lead 35 and not more than 120% of the thickness of the first end lead 35, the effect of the present disclosure may be obtained. This improves the adhesion of the anisotropic conductive film 50 to the first additional portion 60 and the first end lead 35 , and therefore, the anisotropic conductive film 50 is less likely to be peeled off.
[0047] The second additional portion 80 is disposed on a side closer to the end point where the separation film 600 is peeled off. Figure 2A As shown in FIG. 1 , the second additional portion 80 includes a plurality of (three in this embodiment) third branch portions 83. The third branch portion 83 contacts the second end lead 37 in the X direction. The second additional portion 80 has a structure similar to that of the first additional portion 60 and is line symmetrical with the first additional portion 60 relative to the Y direction. For the specific structure, refer to the description of the first additional portion 60. It should be noted that in the example Figure 4 In the pasting device 200 shown with the peeling roller 580 on the left side, the second additional part 80 can be omitted because the anisotropic conductive film 50 is more easily peeled at a position closer to the peeling start point of the separation film 600. However, since the end portion where peeling is more likely to occur may depend on the pasting device, the first additional part 60 may also be omitted.
[0048] The first additional portion 60 and the second additional portion 80 have a size in the X direction (0.2 mm in the present embodiment) that is at least equal to the pasting error. Fig.11A The anisotropic conductive film 50 is shown as being shifted to the right, and Fig. 11BThe case where the anisotropic conductive film 50 is shifted to the left is shown. Furthermore, in the embodiment, the first additional portion 60 contacts the first end lead 35 in the X direction, and the second additional portion 80 contacts the second end lead 37 in the X direction. Therefore, regardless of the position of the end portion of the anisotropic conductive film 50 within the range of the pasting error in the X direction, one end portion of the anisotropic conductive film 50 exists above the first additional portion 60, and the other end portion exists above the second additional portion 80. In other words, a situation where the end portion of the anisotropic conductive film 50 floats in the air over its entire width can be avoided.
[0049] Fig.12 A comparative example is shown in which a dummy lead 65 is provided beside the first lead 30 as described in Japanese Patent Laid-Open No. 2004-6632. The dummy lead 65 is spaced apart from the first lead 30.
[0050] Therefore, when the end portion of the anisotropic conductive film 50 is located between the dummy lead 65 and the first lead 30 as shown in the figure, the end portion of the anisotropic conductive film 50 floats in the air over its entire width and is easily peeled off from the first electric wiring member 10. It should be noted that since the dummy lead 65 has a lattice shape as viewed in the Z direction, when the second electric wiring member 20 is heated and bonded, the air trapped inside the lattice may expand and may affect the bonding of the second electric wiring member 20. Since the first additional portion 60 and the second additional portion 80 according to the present embodiment have no sealing portion, such a problem is less likely to occur.
[0051] Variants
[0052] The shapes of the first additional part 60 and the second additional part 80 are not limited to those in the first embodiment. A modification of the first additional part 60 will be described below, but this also applies to the second additional part 80. In addition, the components and effects not described are the same as those in the first embodiment. Fig.13A The additional portion 60 includes a plurality of (six in this embodiment) first branch portions 62, which are substantially parallelogram-shaped when viewed from the Z direction. The plurality of first branch portions 62 extend in a direction inclined relative to the X direction.
[0053] The direction in which the first branch portion 62 is inclined with respect to the X direction is not limited to Fig.13A Instead, it may be from the connection portion connected to the first end lead 35 toward the lower left.
[0054] refer to Fig. 13B, the first additional part 60 includes a first auxiliary additional part 110 located on the side opposite to the first end lead 35, wherein the first branch part 62 is located between the first end lead 35 and the first auxiliary additional part 110. The first auxiliary additional part 110 includes a main part 120 extending parallel to the first end lead 35 and a plurality of second branch parts 140 in contact with the main part 120. The plurality of first branch parts 62 and the plurality of second branch parts 140 are alternately arranged in the Y direction and partially overlap with each other when viewed from the Y direction. Therefore, regardless of the position of the end part of the anisotropic conductive film 50 within the range of the pasting error in the X direction, the end part of the anisotropic conductive film 50 is in contact with the first additional part 60. Although not shown, an auxiliary additional part having the same shape as the first auxiliary additional part 110 may also be provided on the second end lead 37 side. Reference Fig. 13C , the first branch portion 62 and the second branch portion 140 are substantially triangular, and the remaining structure is similar to Fig. 13B The variants shown are identical.
[0055] According to the present disclosure, it is possible to provide an electrical connection structure in which an anisotropic conductive film is less likely to be peeled off.
[0056] Although the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the present disclosure is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims
1. A liquid ejection head having an electrical connection structure, the electrical connection structure comprising: a plurality of first leads having a convex shape and arranged in one direction along an edge portion of the first electrical wiring member; a plurality of second leads arranged along an edge portion of a second electrical wiring member in the one direction, the second leads facing the corresponding first leads; as well as an anisotropic conductive film, the anisotropic conductive film being located between the plurality of first leads and the plurality of second leads, the anisotropic conductive film electrically connecting the plurality of first leads and the corresponding plurality of second leads to each other, wherein the plurality of first leads include a first end lead located at one end portion in the one direction, and The first electric wiring member includes a first additional portion having a convex shape, at least a portion of the first additional portion being in contact with the first end lead in the one direction.
2. The liquid ejecting head according to claim 1, in, The thickness of the first additional portion is not less than 80% and not more than 120% of the thickness of the first end lead.
3. The liquid ejecting head according to claim 1, in, The first additional portion and the plurality of first leads are made of the same material.
4. The liquid ejecting head according to claim 1, in, The first additional portion includes a plurality of first branch portions contacting the first end leads.
5. The liquid ejecting head according to claim 4, in, The plurality of first branch portions extend substantially parallel to the one direction.
6. The liquid ejecting head according to claim 4, in, The plurality of first branch portions extend in a direction inclined to the one direction.
7. The liquid ejecting head according to claim 4, in, The first branch portion is substantially rectangular as viewed from a direction orthogonal to a surface of the first electric wiring member on which the plurality of first lead wires are arranged.
8. The liquid ejecting head according to claim 4, in, The first branch portion has a substantially triangular shape as viewed from a direction orthogonal to a surface of the first electric wiring member on which the first lead wire is arranged.
9. The liquid ejecting head according to claim 4, in, The first additional portion includes a first auxiliary additional portion located on a side opposite to the first terminal lead, wherein the first branch portion is located between the first terminal lead and the first auxiliary additional portion, and The first auxiliary additional part includes a main part extending parallel to the first end lead and a plurality of second branch parts in contact with the main part, and when viewed from a direction orthogonal to the one direction and parallel to the anisotropic conductive film, the plurality of first branch parts and the plurality of second branch parts are alternately arranged and partially overlap with each other.
10. The liquid ejecting head according to claim 1, in, The plurality of first leads include a second end lead at an end portion on a side opposite to the first end lead, and The first electric wiring member includes a second additional portion having a convex shape, at least a portion of the second additional portion being in contact with the second end lead in the one direction.
11. The liquid ejecting head according to claim 1, in, The first electric wiring member is a printed circuit board, and the second electric wiring member is a flexible wiring board.
12. The liquid ejecting head according to claim 1, in, The thickness of the first lead is greater than the thickness of the anisotropic conductive film.
13. A method for manufacturing a liquid ejection head, comprising: placing a laminate film including an anisotropic conductive film and a separation film laminated together on a first electric wiring member so that the anisotropic conductive film is in contact with the first electric wiring member; peeling the separation film from the anisotropic conductive film placed on the first electric wiring member; as well as placing a second electric wiring member on the anisotropic conductive film from which the separation film has been peeled off, wherein the liquid ejecting head has an electrical connection structure, the electrical connection structure comprising: a plurality of first leads having a convex shape, the plurality of first leads being arranged in one direction along an edge portion of the first electrical wiring member; a plurality of second leads having a convex shape, the plurality of second leads being arranged in the one direction along an edge portion of the second electrical wiring member, and the second electrical wiring member being arranged such that the plurality of first leads face the corresponding second leads, The plurality of first leads include a first end lead located at one end portion in the one direction, and the first electrical wiring member includes a first additional portion having a convex shape, at least a portion of the first additional portion being in contact with the first end lead in the one direction, and The anisotropic conductive film has the one end portion in the one direction located on the first additional portion.
14. The method for manufacturing a liquid ejecting head according to claim 13, in, The anisotropic conductive film of the laminate film is substantially rectangular, and the laminate film is placed on the first electric wiring member so that one side of the anisotropic conductive film is substantially parallel to the edge portion of the first electric wiring member.
15. The method for manufacturing a liquid ejection head according to claim 13, further comprising: The first additional portion is disposed on a side closer to a starting point from which the separation film is peeled off.
16. The method for manufacturing a liquid ejecting head according to claim 13, in, The first electric wiring member is a printed circuit board, and the second electric wiring member is a flexible wiring board.
Citation Information
Patent Citations
Connection structure as well as forming method for circuit board and indicating device having connection structure for circuit board
JP2004006632A