Springback sample table for atomic cluster beam deposition

Abstract

The invention relates to a springback sample table for atomic cluster beam deposition, which is characterized by comprising a substrate, a clamping groove is formed in the top of the substrate, a sample piece is mounted in the clamping groove, a stainless steel pipe is mounted at the bottom of the substrate, a springback column is mounted at the bottom of the stainless steel pipe, a heat dissipation column is mounted on the springback column, and the sample piece is mounted in the clamping groove. The rebounding column penetrates through the heat dissipation column, a spring is arranged on the upper portion of the heat dissipation column in a sleeving mode, and a base is installed at the bottom of the heat dissipation column. In an experiment, if a sample piece needs to be attached, the spring between the stainless steel pipe and the heat dissipation column can be tightened, the substrate is completely attached and bears a certain force, a needed experiment result is obtained by stretching and retracting the stainless steel pipe, the 2 * 1 sample piece can be attached under the needed experiment requirement and can rebound, and the sample piece can be subjected to heat dissipation. And the sample is stressed without being damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of rebound sample stages, and in particular to a rebound sample stage for atomic cluster beam deposition. Background Art

[0002] In recent years, with the rapid development of atomic manufacturing, the demand for new materials and devices such as atomic clusters and single-atom and single-molecule devices has been growing. The preparation of atomic clusters using beam sources has become the primary means of meeting the demand for atomic manufacturing materials. For example, we can use magnetron sputtering to sputter atomic cluster atomic gas, condense the atomic gas into clusters through gas-phase condensation, and then focus the atomic clusters into a beam through ultrasonic expansion and ion optical systems. Existing technologies require the deposition of atomic clusters suitable for processing, and the bonding and rebound of 2*1 silicon wafers under the required experimental requirements, so that the sample is subjected to force but not damaged. Therefore, a rebound sample stage for atomic cluster beam deposition is needed to solve the above problems. Summary of the Invention

[0003] The purpose of the present invention is to provide a rebound sample stage for atomic cluster beam deposition.

[0004] In order to solve the above technical problems, the present invention provides a rebound sample stage for atomic cluster beam deposition, comprising: a substrate, a card slot is opened on the top of the substrate, a sample piece is installed inside the card slot, a stainless steel tube is installed at the bottom of the substrate, a rebound column is installed at the bottom of the stainless steel tube, a heat dissipation column is installed on the rebound column, the rebound column passes through the heat dissipation column, and a spring is sleeved on the upper position of the heat dissipation column, and a base is installed at the bottom of the heat dissipation column.

[0005] Furthermore, a rebound hole is provided inside the heat dissipation column, and a bottom column is provided at the bottom of the heat dissipation column.

[0006] Furthermore, a collar is fixed to one end of the rebound column, the interior of the rebound column is hollow, and a bottom plug is provided at the bottom of the rebound column.

[0007] Furthermore, the stainless steel tube is provided with a trapezoidal notch. The stainless steel tube is 40 mm long and made of hollow 304 stainless steel with a diameter of 8 mm. The inner diameter of the tube wall is 6 mm, the wall thickness is 1 mm, the cross-sectional depth of the trapezoidal notch is 3 mm, and the formal surface is a trapezoidal notch with a diameter of 7 mm, which is arranged in parallel as 3, and a total of 6 on the front and back sides.

[0008] Furthermore, the substrate is cut from a piece of 304 stainless steel, with a length of 30mm, a width of 14mm, and a thickness of 4.8mm. The middle card slot is 20mm long, 1mm high, and 0.5mm deep, and there are four threaded holes with a diameter of 1.6mm around the card slot.

[0009] Furthermore, a mounting hole is provided in the middle of the heat dissipation column, the diameter of the mounting hole is 6mm, the outer diameter of the four countersunk through holes around it is φ6mm, the inner diameter is φ3.6mm, the overall height is 14mm, and the height of the rear bottom column is 9.5mm.

[0010] Furthermore, a wire hole is opened on the upper right side of the base, a through hole is installed in the middle of the base, four support columns are fixed between the base and the heat dissipation column, the base is a cylinder with a height of 16 mm, and the base is made of polytetrafluoroethylene.

[0011] The beneficial effects of the present invention are:

[0012] If the sample needs to be fitted during the experiment, the spring between the stainless steel tube and the heat dissipation column will be tightened to make the substrate fit completely and be subjected to a certain force. By stretching and contracting the stainless steel tube, the required experimental results can be obtained, so that the 2*1 sample can be fitted and rebounded under the required experimental requirements, so that the sample is subjected to force but not damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below with reference to the accompanying drawings and examples.

[0014] Figure 1 is a perspective view of a preferred embodiment of the present invention;

[0015] Figure 2 is a half-sectional view of a preferred embodiment of the present invention;

[0016] Figure 3 is a perspective view of a preferred embodiment of a heat dissipation column of the present invention;

[0017] Figure 4 is a perspective view of a preferred embodiment of a substrate of the present invention;

[0018] Figure 5 It is a three-dimensional diagram of a preferred embodiment of the base of the present invention.

[0019] In the picture:

[0020] 1. Substrate; 11. Card slot; 12. Sample piece; 13. Threaded hole;

[0021] 2. Stainless steel tube; 21. Rebound column; 22. Heat dissipation column; 23. Spring; 24. Rebound hole; 25. Bottom column; 26. Collar; 27. Bottom plug; 28. Trapezoidal notch; 29. ​​Mounting hole;

[0022] 3. Base; 31. Wire hole; 32. Through hole; 33. Support column. DETAILED DESCRIPTION

[0023] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0024] like Figure 1-5 As shown, a rebound sample stage for atomic cluster beam deposition of the present invention comprises: a substrate 1, a card slot 11 is provided on the top of the substrate 1, a sample piece 12 is installed inside the card slot 11, a stainless steel tube 2 is installed at the bottom of the substrate 1, a rebound column 21 is installed at the bottom of the stainless steel tube 2, a heat dissipation column 22 is installed on the rebound column 21, the rebound column 21 passes through the heat dissipation column 22, and a spring 23 is sleeved on the upper position of the heat dissipation column 22, and a base 3 is installed at the bottom of the heat dissipation column 22.

[0025] The substrate 1 is cut from a piece of 304 stainless steel, with a length of 30mm, a width of 14mm, and a thickness of 4.8mm. The middle slot 11 is 20mm long, 1mm high, and 0.5mm deep. Four threaded holes 13 with a diameter of 1.6mm are opened around the slot 11 for fixing the substrate 1. The substrate 1 needs to be chamfered around.

[0026] A rebound hole 24 is provided inside the heat dissipation column 22 , a bottom column 25 is provided at the bottom of the heat dissipation column 22 , a collar 26 is fixed to one end of the rebound column 21 , the interior of the rebound column 21 is hollow, and a bottom plug 27 is provided at the bottom of the rebound column 21 .

[0027] The heat dissipation column 22 and the bottom column 25 are both cylindrical. During installation, the spring 23 is placed on the rebound column 21, and the rebound column 21 is inserted into the heat dissipation column 22. The top of the spring 23 is then limited by the ring 26, and the bottom of the rebound column 21 is limited by the bottom plug 27. The diameter of the bottom plug 27 is larger than the inner diameter of the bottom of the rebound hole 24.

[0028] A trapezoidal notch 28 is provided on the stainless steel tube 2. The stainless steel tube 2 is 40 mm long and made of hollow 304 stainless steel with a diameter of 8 mm. The inner diameter of the tube wall is 6 mm and the wall thickness is 1 mm. The cross-sectional depth of the trapezoidal notch 28 is 3 mm. The formal surface has a trapezoidal notch 28 with a diameter of 7 mm, which is arranged in 3 parallel rows, and a total of 6 on both sides.

[0029] A hollowed-out tube of 304 stainless steel, 40mm long and φ8 in diameter, with an inner diameter of φ6 and a wall thickness of 1mm, is ground and polished. Three trapezoidal notches 28, each φ7mm deep and cut into the tube wall, are placed side by side, for a total of six on both sides. This device secures the substrate 1 and provides heat dissipation and insulation.

[0030] A mounting hole 29 is provided in the middle of the heat dissipation column 22 with a diameter of 6 mm. The outer diameter of the four countersunk through holes around it is φ6 mm, the inner diameter is φ3.6 mm, the overall height is 14 mm, and the height of the rear bottom column 25 is 9.5 mm. The heat dissipation column 22 is mainly used to fix the stainless steel pipe 2.

[0031] A wire hole 31 is opened on the upper right side of the base 3, a through hole 32 is installed in the middle of the base 3, four support columns 33 are fixed between the base 3 and the heat dissipation column 22, the base 3 is a cylinder with a height of 16mm, and the base 3 is made of polytetrafluoroethylene.

[0032] The base 3 made of polytetrafluoroethylene can provide insulation and heat insulation, and the wire holes 31 are provided for installing electrodes and line channels.

[0033] If the sample piece 12 needs to be fitted during the experiment, the spring 23 between the stainless steel tube 2 and the heat dissipation column 22 will be tightened to make the substrate 1 completely fit and be subjected to a certain force. By expanding and contracting the stainless steel tube 2, the required experimental results can be obtained, so that the 2*1 sample piece 12 can be fitted and rebounded under the required experimental requirements, so that the sample is subjected to force but not damaged.

[0034] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A rebound sample stage for atomic cluster beam deposition, characterized in that: include: A substrate (1), wherein a card slot (11) is provided at the top of the substrate (1), a sample piece (12) is installed inside the card slot (11), a stainless steel tube (2) is installed at the bottom of the substrate (1), a rebound column (21) is installed at the bottom of the stainless steel tube (2), a heat dissipation column (22) is installed on the rebound column (21), the rebound column (21) passes through the heat dissipation column (22), and a spring (23) is sleeved at a position above the heat dissipation column (22), and a base (3) is installed at the bottom of the heat dissipation column (22).

2. A rebound sample stage for atomic cluster beam deposition according to claim 1, characterized in that: A rebound hole (24) is provided inside the heat dissipation column (22), and a bottom column (25) is provided at the bottom of the heat dissipation column (22).

3. A rebound sample stage for atomic cluster beam deposition as claimed in claim 2, characterized in that: A collar (26) is fixed to one end of the resilient column (21); the interior of the resilient column (21) is hollow; and a bottom plug (27) is provided at the bottom of the resilient column (21).

4. A rebound sample stage for atomic cluster beam deposition as claimed in claim 3, characterized in that: The stainless steel tube (2) is provided with a trapezoidal notch (28). The stainless steel tube (2) is 40 mm long and made of hollow 304 stainless steel with a diameter of 8 mm. The inner diameter of the tube wall is 6 mm and the wall thickness is 1 mm. The cross-sectional depth of the trapezoidal notch (28) is 3 mm. The formal surface is a trapezoidal notch (28) with a diameter of 7 mm, which is arranged in parallel in three pieces, and a total of six are provided on the front and back surfaces.

5. A rebound sample stage for atomic cluster beam deposition as claimed in claim 4, characterized in that: The substrate (1) is cut from a piece of 304 stainless steel and has a length of 30 mm, a width of 14 mm and a thickness of 4.8 mm. The middle card slot (11) has a length of 20 mm, a height of 1 mm and a depth of 0.5 mm. Four threaded holes (13) with a diameter of 1.6 mm are provided around the card slot (11).

6. A rebound sample stage for atomic cluster beam deposition according to claim 5, characterized in that: A mounting hole (29) is provided in the middle of the heat dissipation column (22), the mounting hole (29) has a diameter of 6 mm, the four countersunk through holes around it have an outer diameter of φ6 mm, an inner diameter of φ3.6 mm, an overall height of 14 mm, and a rear bottom column (25) with a height of 9.5 mm.

7. A rebound sample stage for atomic cluster beam deposition according to claim 6, characterized in that: A wire hole (31) is provided at the upper right corner of the base (3); a through hole (32) is installed in the middle of the base (3); four support columns (33) are fixed between the base (3) and the heat dissipation column (22); the base (3) is a cylinder with a height of 16 mm, and the base (3) is made of polytetrafluoroethylene.

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