Embedded rolling bearing with source end parameter acquisition system and manufacturing method thereof

Abstract

The invention relates to an embedded rolling bearing with a source end parameter acquisition system and a manufacturing method of the embedded rolling bearing. The embedded rolling bearing comprises a bearing body, and a containing groove is formed in the peripheral face of the bearing body; the thin film sensor assembly is formed in the accommodating groove, and comprises a PDC-ITO (Poly (Propylene Diene Monomer-Indium Tin Oxide)) strain element, a PDC-Pt (Poly (Propylene Diene Monomer)-Pt) temperature element, a PDC-PZT (Poly (Poly (Propylene Diene Monomer)-PZT) piezoelectric thin film and a plurality of bonding pads which are respectively matched with the PDC-ITO strain element, the PDC-Pt temperature element and the PDC-PZT piezoelectric thin film; the acquisition microstructure is arranged in the accommodating groove and comprises a PCB (Printed Circuit Board) and a functional chip which is formed on the PCB and is electrically connected with the plurality of bonding pads through a plurality of electrical interconnection sockets; the heat insulation pouring sealant is poured into the accommodating groove; and a metal cover. Normal installation of the bearing is achieved to the maximum extent, and the defect that the appearance and the size of a traditional external sensor and a traditional collector are limited is overcome.

Description

Technical Field

[0001] The present invention belongs to the technical field of rolling bearing testing, and specifically relates to an embedded rolling bearing with a source-end parameter acquisition system and a manufacturing method thereof, and specifically relates to a rolling bearing with a thin film sensor and an acquisition microsystem module and a manufacturing method thereof. Background Art

[0002] When conducting bearing performance tests or assessment tests, large rolling bearings used in large engineering machinery need to be tested in real time on the bearing temperature, deformation and other physical quantities as close to the bearing body as possible due to large local loads, multiple operating modes, and large changes in internal mechanical and thermal states. However, most of the sensors (such as temperature and vibration sensors) installed on existing rolling bearing testers are located on the bearing seat or outside the outer ring of the bearing, and the signal acquisition capability is limited, making it difficult to obtain the temperature and deformation inside the bearing. How to improve the in-situ or as close to in-situ sensing test capability of the tested bearing in the rolling bearing test is currently a hot demand in the field of rolling bearing test technology.

[0003] Currently, rolling bearings with sensor monitoring functions (also known as smart bearings) are a hot research and development topic for many rolling bearing industry companies and related research institutions. Most of the existing smart bearing technical solutions or application products are external sensors or micro-nano sensor elements on the bearing end face, that is, rolling bearings with split sensors; there are also a few studies that embed sensors into the bearings (even embed signal collectors into the rolling bearing body structure, such as the inner and outer rings of large bearings or large-sized rolling elements). Since bearings with external sensor elements usually require additional installation space and interfere with conventional bearing seats or sealing structures; and the load-bearing method is also limited, this type of rolling bearing with external sensors can only be used in some specific scenarios.

[0004] The patents of rolling bearings with sensing and signal processing functions mainly include: CN106369058B (bearing sensor assembly with wireless temperature sensor), CN109141879B (track condition monitoring sensor and method for detecting track bearing condition), CN201310703303.5 (intelligent bearing monitoring system and method based on transient speed), CN106769039B (a mounting assembly suitable for monitoring rotating parts of rolling bearings), WO2018130217A1 (bearing condition online monitoring system and method based on optical fiber vibration sensing) and CN108138840B (sensor assembly for bearings and bearing devices), etc. The method for obtaining the parameters of the bearing source end in the above patents is based on an external sensor. The sensor measures the state parameters of the bearing outside, and the sensing signal can only enter the data acquisition and processing analysis link through signal transmission. There are many transmission links, low signal-to-noise ratio, large measurement errors, and even it is difficult to accurately test the actual operating state of the bearing.

[0005] With the rapid development of micro-nano sensing technology, ultra-large-scale integrated circuits, and computer hardware technology, people have developed small, powerful thin-film sensors and high-performance, highly integrated signal acquisition microsystem hardware, and have achieved long-life and high-reliability applications. Embedding both thin-film sensors and acquisition microsystems into the body of large rolling bearing rings to form sensor-embedded integrated intelligent bearings can achieve in-situ testing of rolling bearings, greatly enhance signal acquisition capabilities, and effectively obtain the physical parameters of the internal operating state of the bearing during operation (including temperature and deformation parameters, etc.). However, how to prepare, arrange, wire connect, and reliably install and package sensors and acquisition microsystems in the small-sized slotted structure on the rolling bearing ring is a technical difficulty in this field. Summary of the invention

[0006] The purpose of the present invention is to address the gaps in existing testing technology and provide an embedded rolling bearing with a source-end parameter acquisition system to meet the online monitoring requirements of the rolling bearing test process with the functions of source-end perception of bearing in-situ sensing operating parameters and local data processing.

[0007] To achieve the above object, the technical solution adopted by the present invention is: an embedded rolling bearing with a source-end parameter acquisition system, comprising: A bearing, wherein an accommodating groove is provided on the outer peripheral surface of the bearing; A thin film sensor assembly, which is formed in the accommodating groove and includes a PDC-ITO strain element, a PDC-Pt temperature element, a PDC-PZT piezoelectric film, and a plurality of pads respectively matched with the PDC-ITO strain element, the PDC-Pt temperature element, and the PDC-PZT piezoelectric film; A collection microstructure, which is arranged in the accommodating groove and includes a PCB board and a functional chip formed on the PCB board and electrically connected to the plurality of pads through a plurality of electrical interconnection sockets; Thermal insulation potting glue, the thermal insulation potting glue is poured into the accommodating groove; A metal cover covers the surface of the heat-insulating potting compound and is sealed with the surface of the bearing.

[0008] Optimally, each of the electrical interconnection sockets includes an aluminum oxide disc with a through hole in the middle, a conductive microneedle fixed in the through hole, and a conductive sheet fixed on the surface of the aluminum oxide disc and in contact with the conductive microneedle.

[0009] Optimally, the PDC-PZT piezoelectric film has two sets of matched interdigital electrodes.

[0010] Optimally, the functional chip includes a matching MCU chip, an ADC conversion chip, an amplifier chip, a communication chip and four power supply chips, and a plurality of conductive through holes are arranged at intervals on the edges around the PCB board.

[0011] Optimally, the metal cover is a copper cover, which includes a copper plate and a plurality of current-leading through holes opened on the copper plate.

[0012] Another object of the present invention is to provide a method for manufacturing the above-mentioned embedded rolling bearing with a source-end parameter acquisition system, comprising the following steps: (a) providing a receiving groove on the outer peripheral surface of the bearing; (b) forming the thin film sensor component in the receiving groove by a liquid phase direct writing process; (c) integrating a functional chip on the PCB board to form the acquisition microstructure; and electrically connecting the thin film sensor assembly and the acquisition microstructure using the electrical interconnection socket; (d) pouring heat-insulating packaging glue into the accommodating groove; (e) The metal cover is installed on the thermal insulation packaging glue, and the edge of the metal cover is sealed using a laser cladding process.

[0013] Optimally, in step (b), a liquid phase direct writing device is used to deposit a precursor ceramic solution containing Pt, ITO and PZT powders respectively in the receiving groove to form the PDC-ITO strain element, PDC-Pt temperature element and PDC-PZT piezoelectric film respectively.

[0014] Furthermore, in step (b), the liquid phase direct writing device includes a working stage, a Y-axis movable guide rail installed on the upper surface of the working stage, a Y-axis control motor installed at the end of the Y-axis movable guide rail, an X-axis sliding guide rail movably installed on the Y-axis movable guide rail, an X-axis control motor installed at the end of the X-axis sliding guide rail, an adapter plate movably installed on the X-axis sliding guide rail, a slide plate slidably installed on the adapter plate through a slide rail, a Z-axis movable guide rail installed on the adapter plate and connected to the slide plate, and a direct writing nozzle installed on the slide plate.

[0015] Furthermore, the direct writing nozzle includes a micro-pipe, a discharge micro-rotating shaft penetrating the micro-pipe and sealingly cooperating therewith, a supply pipe connected to the discharge micro-rotating shaft, and a driving motor connected to the upper end of the discharge micro-rotating shaft for driving it to work.

[0016] Optimally, in step (c), when the electrical interconnection socket comprises a conductive microneedle, an alumina disc and a conductive sheet, a conductive adhesive is applied between the conductive sheet and the pad for bonding; The conductive microneedle and the alumina disc are interference fit, In step (e), after edge sealing, the metal cover is also ground and polished to make the outer peripheral surface of the bearing smooth.

[0017] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention has an embedded rolling bearing with a source-end parameter acquisition system, which can realize the high integration of in-situ temperature, strain, vibration and other physical parameter sensing tests of large rolling bearings and form a complete heterogeneous material combination structure with the bearing, thereby maximizing the normal installation of the bearing, greatly reducing the need for modification of the surrounding structures, and avoiding the disadvantages of the shape and size constraints of traditional external sensors and collectors.

[0018] The present invention also lies in that the sensor can measure the internal operating state parameters of the bearing in situ as much as possible, reducing multiple links in signal transmission, improving the authenticity and signal-to-noise ratio of the test signal, and promoting the progress of bearing testing technology and intelligent bearing technology and products.

[0019] The present invention can realize the reasonable assembly and packaging of multiple components such as thin film sensors, collection microsystems, and wires, and the performance, function and overall structure are safe and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of an embedded rolling bearing with a source-end parameter acquisition system of the present invention; Figure 2It is a schematic structural diagram of a liquid phase direct writing device used in manufacturing an embedded rolling bearing with a source end parameter acquisition system of the present invention; Figure 3 It is a structural schematic diagram of a direct writing nozzle in a liquid phase direct writing device used in manufacturing an embedded rolling bearing with a source end parameter acquisition system of the present invention; Figure 4 It is a structural schematic diagram of a thin film sensor assembly in an embedded rolling bearing with a source-end parameter acquisition system of the present invention; Figure 5 It is a structural schematic diagram of an electrical interconnection socket in an embedded rolling bearing with a source-end parameter acquisition system of the present invention; Figure 6 It is a structural schematic diagram of collecting microstructures in an embedded rolling bearing with a source-end parameter collection system of the present invention; Figure 7 It is a schematic structural diagram of another perspective of collecting microstructures in an embedded rolling bearing with a source-end parameter collection system of the present invention; Figure 8 It is a structural schematic diagram of a metal cover in an embedded rolling bearing with a source-end parameter acquisition system according to the present invention. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the embodiments shown in the accompanying drawings.

[0022] like Figure 1 The embedded rolling bearing with source-end parameter acquisition system shown mainly includes a thin film sensor component 1, an electrical interconnection socket 2, an acquisition microstructure 3, a thermal insulation potting compound 4, a metal cover 5, a bearing 6 and other structures.

[0023] Among them, the bearing 6 is an existing conventional rolling bearing (which can be selected according to actual needs, for example, it can be large or medium); in order to install the thin film sensor component 1, the collection microstructure 3 and other structures, an accommodating groove is usually opened on the outer peripheral surface of the bearing 6.

[0024] The thin film sensor assembly 1 is formed in the accommodating groove, including a PDC (precursor polymer ceramic)-ITO (indium tin oxide) strain element 12 (preferably a half-bridge thin film strain sensor), a PDC-Pt temperature element 13 (preferably a four-wire thin film thermal resistor temperature sensitive element), a PDC-PZT (lead zirconate titanate) piezoelectric film 14 (i.e., a thin film piezoelectric element), and a plurality of pads 11 (the aforementioned elements can also be referred to as sensors, and the pads 11 are corresponding sensor pads) respectively matched with the PDC-ITO strain element 12, the PDC-Pt temperature element 13, and the PDC-PZT piezoelectric film 14. Figure 4The PDC-ITO strain element 12, the PDC-Pt temperature element 13 and the PDC-PZT piezoelectric film 14 are usually independent functional units (used for measuring temperature, strain and vibration physical parameters respectively), and are connected to the collection microstructure 3 through the corresponding pads 11 respectively. Specifically, three electrical interconnection sockets 2 (i.e., electrical interconnection sockets a, b, and c) are connected to the PDC-ITO strain element 12 (i.e., No. 1 half-bridge thin film strain sensor); four electrical interconnection sockets 2 (i.e., electrical interconnection sockets d, e, f, and g) are connected to the PDC-Pt temperature element 13 (i.e., No. 1 four-wire thin film thermal resistor temperature-sensitive element); two electrical interconnection sockets 2 (i.e., electrical interconnection sockets h and i) are connected to the PDC-PZT piezoelectric film 14; four electrical interconnection sockets 2 (i.e., electrical interconnection sockets j, k, l, and m) are connected to the PDC-Pt temperature element 13 (i.e., No. 2 four-wire thin film thermal resistor temperature-sensitive element); three electrical interconnection sockets 2 (i.e., electrical interconnection sockets n, o, and p) are connected to the PDC-ITO strain element 12 (i.e., No. 2 half-bridge thin film strain sensor).

[0025] The acquisition microstructure 3 is also arranged in the above-mentioned accommodation groove, including a PCB board and a functional chip formed on the PCB board and electrically connected to multiple pads 11 through multiple electrical interconnection sockets 2, so that the corresponding physical parameters are respectively collected by using the above-mentioned functional chips. The heat-insulating potting glue 4 is poured into the above-mentioned accommodation groove, which can isolate the heat generated by the movement of the internal rolling body of the bearing 6 or the heat transfer from the external environment, so that the electronic components (i.e., the functional chips) on the PCB board can work under the allowed temperature conditions (the thickness of the heat-insulating potting glue required for the safe temperature threshold required for the electronic components on the PCB can be calculated by the thermodynamic module of the finite element analysis software). The metal cover 5 covers the surface of the heat-insulating potting glue 4 and is sealed with the surface of the bearing 6, so as to realize the shell protection of the thin film sensor component 1 and the acquisition microstructure 3, and can realize the rapid outward heat conduction of the slotted area of ​​the bearing 6; the laser cladding technology can be used to seal the edges around the metal cover 5, which greatly reduces the modification requirements of the surrounding structure and avoids the shape and size constraints of traditional external sensors and collectors.

[0026] In this embodiment, each electrical interconnection socket 2, such as Figure 5As shown, it includes an aluminum oxide disc 22 with a through hole in the middle, a conductive microneedle 21 fixed in the through hole (the end of the conductive microneedle 21 away from the aluminum oxide disc 22 has a contact end surface, and its diameter gradually decreases in the outward direction), and a conductive sheet 23 fixed on the surface of the aluminum oxide disc 22 and in contact with the conductive microneedle 21. The conductive microneedle 21 and the aluminum oxide disc 22 are preferably fixed in an interference fit with the through hole (the aluminum oxide disc 22 is in contact with the corresponding pad 11, and the conductive microneedle 21 is inserted into the conductive hole of the PCB board). This can not only improve the conductive effect of the electrical interconnection socket 2, but also has excellent thermal conductivity, which is conducive to improving the reliability of the electrical connection between the thin film sensor component 1 and the collection microstructure 3. In this embodiment, the PDC-PZT piezoelectric film 14 has two sets of matching interdigital electrodes to improve the reliability of piezoelectric performance measurement.

[0027] Functional chips, such as Figure 6 and Figure 7 As shown, it includes a matching MCU chip 31, an ADC conversion chip 32 (i.e., a static ADC chip), an amplifier chip 33, a communication chip 34, and four power chips (i.e., power chip 35, power chip 36, power chip 37, and power chip 38). A plurality of conductive through holes 39 are provided at intervals around the edges of the PCB board. The basic principle framework is as follows: an MCU chip 31 has a built-in 16-bit A / D conversion module, which is mainly used for data acquisition of thin film piezoelectric elements; the electrical interconnection sockets h and i signals of the thin film piezoelectric elements are introduced into the amplifier chip 33 for signal conditioning and then connected to the pins of the A / D conversion module in the MCU chip 31 (i.e., the amplifier chip 33 is respectively connected to the electrical interconnection sockets h and i and the MCU chip 31). The ADC conversion chip 32 (24 bits) uses ADS124S08, which is mainly used for data acquisition of the PDC-Pt temperature element 13 and the PDC-ITO strain element 12 (at this time, the ADC conversion chip 32 is correspondingly connected to the PDC-Pt temperature element 13 and the PDC-ITO strain element 12). The designed acquisition microstructure 3 provides ±5V input through the bearing seat (external power supply), which is converted to 3.3V through the power chip 35 as the digital power supply and reference voltage of the MCU chip 31; the 5V voltage is converted to +2.5V through the power chip 36 as the positive reference voltage of the ADC chip 32; the 2.5V voltage is converted to -2.5V through the power chip 37 as the negative reference voltage of the ADC chip 32; the 5V voltage is converted to -5V through the power chip 38 as the reference voltage of the amplifier chip 33. The communication module 34 is used to transmit the digital signal of the MCU chip 31 to the data acquisition device of the bearing seat, that is, the communication module 34 is also connected to the MCU chip 31 to receive the digital signal of the MCU chip 31 (it can be seen that the bearing seat has a built-in data acquisition device and can be connected to an external power supply).

[0028] In this embodiment, the metal cover 5 is preferably a copper cover, which includes a copper plate 51 and a plurality of current-carrying through holes 52 (such as Figure 8 As shown), it is beneficial to achieve rapid heat conduction in the bearing slot space to improve the heat dissipation effect of the metal cover 5.

[0029] The manufacturing method of the embedded rolling bearing with the source end parameter acquisition system comprises the following steps: (a) A receiving groove is formed on the outer peripheral surface of the bearing 6 (at a designated position of the outer peripheral surface) (the receiving groove is formed by combining conventional CNC milling, heat treatment and grinding).

[0030] (b) forming a thin film sensor component (1) in the receiving groove by a liquid phase direct writing process; In step (b), a liquid phase direct writing device 1' is used to deposit a precursor ceramic solution containing Pt, ITO and PZT powders respectively in the accommodating groove to form a PDC-ITO strain element 12, a PDC-Pt temperature element 13 and a PDC-PZT piezoelectric film 14. Specifically, Pt, ITO and PZT powders are added to the existing conventional precursor ceramic solution, and deposited in the bearing slot space by liquid phase direct writing technology to prepare temperature, strain and piezoelectric film sensors of precursor ceramic materials respectively (direct writing and printing are deposited between the electrode leads, and then the deposited precursor ceramics are quickly cross-linked and pyrolyzed by a laser module).

[0031] Liquid phase direct writing device 1 'such as Figure 2 As shown, it includes a working platform, a Y-direction movable guide rail 16' installed on the upper surface of the working platform, a Y-direction control motor 12' installed at the end of the Y-direction movable guide rail 16', an X-direction sliding guide rail 11' movably installed on the Y-direction movable guide rail 16' (when the Y-direction control motor 12' is working, it can drive the X-direction sliding guide rail 11' to move on the Y-direction movable guide rail 16'), an X-direction control motor 15' installed at the end of the X-direction sliding guide rail 11', an adapter plate movably installed on the X-direction sliding guide rail 11' (when the X-direction control motor 15' is working, it can drive the adapter plate to move on the X-direction sliding guide rail 11'), a slide plate slidably installed on the adapter plate through the slide rail, a Z-direction movable guide rail 13' installed on the adapter plate and connected to the slide plate (the Z-direction movable guide rail 13' has a Z-direction driving mechanism (such as a cylinder, a liquid cylinder or a motor, etc.), so that the slide plate can be driven to rise and fall on the slide rail) and a direct writing nozzle 14' installed on the slide plate. The sensor pattern is processed by the cooperation of the X-axis control motor 15', the Y-axis control motor 12' and the Z-axis moving guide rail 13'. Figure 3As shown, it includes a micro-channel 142', a discharge micro-shaft 143' that penetrates the micro-channel 142' and seals with the discharge micro-shaft 143', a supply channel 144' connected to the discharge micro-shaft 143', and a drive motor 141' connected to the upper end of the discharge micro-shaft 143' for driving the discharge micro-shaft 143' to work; in this way, the discharge micro-shaft 143' is rotated at a high speed by the drive motor 141', and the precursor solution stored in the micro-channel 142' is transported to the tip of the discharge micro-shaft 143' through the Weissenberg effect, and then is printed and deposited in the accommodating groove.

[0032] (c) Integrate a functional chip on the PCB board to form a collection microstructure 3; use the electrical interconnection socket 2 to electrically connect the thin film sensor component 1 and the collection microstructure 3; as mentioned above, the collection microstructure 3 includes a PCB board and a functional chip formed on the PCB board and electrically connected to multiple pads 11 through multiple electrical interconnection sockets 2. When the electrical interconnection socket 2 includes a conductive microneedle 21, an aluminum oxide disc 22 and a conductive sheet 23, a conductive glue is applied between the conductive sheet 23 and the pad 11 for bonding; the conductive microneedle 21 and the aluminum oxide disc 22 are interference fit.

[0033] The manufacturing process of the electrical interconnection socket 2 is as follows: using a CO2 laser to form an alumina ceramic disc (i.e., an alumina disc 22), and processing a through hole in the middle thereof; placing a conductive microneedle 21 in the through hole of the alumina ceramic and fixing it by interference fit; applying conductive glue on the back side of the conductive sheet 23 (the side away from the alumina disc 22) to increase the electrical lead area with the pad 11; applying conductive glue on the surface of the sensor pad, and bonding the above-mentioned alumina disc with conductive microneedles to the surface of the pad 11; designing a docking structure on the surface of the PCB board of the collection microstructure 3 that matches the conductive microneedle 21, thereby realizing leadless electrical interconnection between the collection microstructure 3 and the thin film sensor component 1.

[0034] (d) pouring heat-insulating encapsulating glue 4 into the accommodating groove to isolate the heat generated by the movement of the rolling elements inside the bearing 6 or the heat transferred from the external environment, so that the electronic components on the PCB board can work under the allowed temperature conditions; (e) A metal cover 5 is installed on the thermal insulation packaging glue 4 (to achieve rapid heat conduction in the bearing slot space), and the metal cover 5 is sealed by a laser cladding process; after sealing, the metal cover 5 is also ground and polished to make the outer peripheral surface of the bearing 6 smooth (to meet the geometric size and precision requirements of the bearing 6), thereby realizing the manufacturing of rolling bearings with source-end parameter sensing and data processing functions.

[0035] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An embedded rolling bearing with a source-end parameter acquisition system, characterized in that: include: A bearing (6), wherein an accommodating groove is provided on an outer peripheral surface of the bearing (6); A thin film sensor component (1), the thin film sensor component (1) being formed in the accommodating groove, comprising a PDC-ITO strain element (12), a PDC-Pt temperature element (13), a PDC-PZT piezoelectric film (14), and a plurality of pads (11) respectively matching the PDC-ITO strain element (12), the PDC-Pt temperature element (13), and the PDC-PZT piezoelectric film (14); A collection microstructure (3), the collection microstructure (3) being arranged in the accommodating groove, comprising a PCB board and a functional chip formed on the PCB board and electrically connected to the plurality of pads (11) via a plurality of electrical interconnection sockets (2); A heat-insulating potting glue (4), wherein the heat-insulating potting glue (4) is poured into the accommodating groove; A metal cover (5), the metal cover (5) covers the surface of the heat-insulating potting glue (4) and is sealed with the surface of the bearing (6).

2. The embedded rolling bearing with source-end parameter acquisition system according to claim 1, characterized in that: Each of the electrical interconnection sockets (2) comprises an aluminum oxide disc (22) with a through hole in the middle, a conductive microneedle (21) fixed in the through hole, and a conductive sheet (23) fixed on the surface of the aluminum oxide disc (22) and in contact with the conductive microneedle (21).

3. The embedded rolling bearing with source-end parameter acquisition system according to claim 1, characterized in that: The PDC-PZT piezoelectric film (14) has two sets of matched interdigital electrodes.

4. The embedded rolling bearing with source-end parameter acquisition system according to claim 1, characterized in that: The functional chip comprises a matching MCU chip (31), an ADC conversion chip (32), an amplifier chip (33), a communication chip (34) and four power supply chips (35, 36, 37, 38); and a plurality of conductive through holes (39) arranged at intervals are provided at the edges around the PCB board.

5. The embedded rolling bearing with source-end parameter acquisition system according to claim 1, characterized in that: The metal cover (5) is a copper cover, comprising a copper plate (51) and a plurality of current-conducting through holes (52) formed on the copper plate (51).

6. The method for manufacturing an embedded rolling bearing with a source end parameter acquisition system as claimed in any one of claims 1 to 5, characterized in that: The following steps are involved: (a) providing a receiving groove on the outer peripheral surface of the bearing (6); (b) forming the thin film sensor component (1) in the receiving groove by a liquid phase direct writing process; (c) integrating a functional chip on the PCB board to form the collection microstructure (3); and utilizing the electrical interconnection socket (2) to electrically connect the thin film sensor component (1) and the collection microstructure (3); (d) pouring heat-insulating packaging glue (4) into the accommodating groove; (e) The metal cover (5) is mounted on the heat-insulating packaging adhesive (4), and the metal cover (5) is sealed by using a laser cladding process.

7. The method for manufacturing an embedded rolling bearing with a source-end parameter acquisition system according to claim 6, characterized in that: In step (b), a liquid phase direct writing device (1') is used to deposit a precursor ceramic solution containing Pt, ITO and PZT powders respectively in the accommodating groove to form the PDC-ITO strain element (12), the PDC-Pt temperature element (13) and the PDC-PZT piezoelectric film (14) respectively.

8. The method for manufacturing an embedded rolling bearing with a source-end parameter acquisition system according to claim 7, characterized in that: In step (b), the liquid phase direct writing device (1') comprises a working platform, a Y-direction movable guide rail (16') mounted on the upper surface of the working platform, a Y-direction control motor (12') mounted at the end of the Y-direction movable guide rail (16'), an X-direction sliding guide rail (11') movably mounted on the Y-direction movable guide rail (16'), an X-direction control motor (15') mounted at the end of the X-direction sliding guide rail (11'), an adapter plate movably mounted on the X-direction sliding guide rail (11'), a slide plate slidably mounted on the adapter plate via a slide rail, a Z-direction movable guide rail (13') mounted on the adapter plate and connected to the slide plate, and a direct writing nozzle (14') mounted on the slide plate.

9. The method for manufacturing an embedded rolling bearing with a source-end parameter acquisition system according to claim 8, characterized in that: The direct writing nozzle (14') comprises a micro-pipe (142'), a discharge micro-rotating shaft (143') penetrating the micro-pipe (142') and sealingly cooperating therewith, a supply pipe (144') connected to the discharge micro-rotating shaft (143'), and a driving motor (141') connected to the upper end of the discharge micro-rotating shaft (143') for driving the discharge micro-rotating shaft (143') to work.

10. The method for manufacturing an embedded rolling bearing with a source-end parameter acquisition system according to claim 6, characterized in that: In step (c), when the electrical interconnection socket (2) comprises a conductive microneedle (21), an alumina disc (22) and a conductive sheet (23), a conductive adhesive is applied between the conductive sheet (23) and the pad (11) for bonding; The conductive microneedle (21) and the alumina disc (22) are interference-fitted. In step (e), after edge sealing, the metal cover (5) is also ground and polished to make the outer peripheral surface of the bearing (6) smooth.

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