Radiating fin and radiator

Abstract

The invention discloses a heat dissipation fin, and relates to the technical field of cooling and heat dissipation, a first cover plate is provided with a first groove and / or a second cover plate is provided with a second groove, the inner surface of the first groove and / or the inner surface of the second groove is provided with a rough area, the first cover plate and the second cover plate can be respectively provided with a groove, or one of the first cover plate and the second cover plate is provided with a groove. A rough area is arranged on the inner wall of the cavity, and the rough area is used for increasing the capillary force in the heat dissipation fins; the edge of the first cover plate and the edge of the second cover plate are mutually spliced and fixed, so that the first groove and / or the second groove form a cavity used for containing a phase change medium, and heat transfer is achieved through phase state changes of the phase change medium; when the phase change medium is condensed, the liquid medium can flow along the inner surface of the first groove and / or the inner surface of the second groove under the action of capillary force, the condensed liquid medium flows under the action of the capillary force, power for liquid flowing is formed, and the heat dissipation performance is improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and further to a heat dissipation fin and a heat sink. Background Art

[0002] Fins are usually set on the surface of heat exchange devices that need to transfer heat. By adding metal sheets with strong thermal conductivity, the heat transfer surface area of ​​the heat exchange device is increased. It is usually used in servers, power electronics industry, computers and other electronic products.

[0003] Phase change cooling is a technology that uses the property of a substance to absorb or release a large amount of heat when it changes phase to control temperature. The core of this technology lies in phase change materials (PCM), which undergo phase changes within a specific temperature range and are accompanied by the absorption or release of latent heat.

[0004] In the process of realizing the present invention, the inventors found that the prior art has at least the following problems: the radiators with phase change cooling fins currently on the market adopt a cavity design inside the fins. After the medium undergoes phase change and vaporizes, it flows upward. After the phase change medium condenses, it flows back to the position where the radiator contacts the heat source by gravity. The reflux of the phase change medium is greatly affected by the gravity factor. The performance of the radiator with phase change cooling fins cannot fully exert the heat transfer effect, thereby affecting the performance of the radiator.

[0005] For those skilled in the art, how to reduce the influence of gravity reflux on the phase change heat dissipation fins and improve the heat dissipation performance is a technical problem that needs to be solved at present. Summary of the invention

[0006] The core of the present invention is to provide a heat dissipation fin, which can reduce the influence of gravity reflux on the phase change heat dissipation fin and improve the heat dissipation performance. The specific scheme is as follows:

[0007] A heat dissipation fin comprises a first cover plate and a second cover plate, wherein the first cover plate is provided with a first groove and / or the second cover plate is provided with a second groove; a rough area is provided on the inner surface of the first groove and / or the inner surface of the second groove, and the rough area is used to increase the capillary force inside the heat dissipation fin;

[0008] The edge of the first cover plate and the edge of the second cover plate are spliced ​​and fixed to each other, so that the first groove and / or the second groove form a chamber for accommodating a phase change medium;

[0009] The liquid phase change medium can flow along the inner surface of the first groove and / or the inner surface of the second groove under the capillary force of the rough area.

[0010] Optionally, the inner surface of the first groove and the inner surface of the second groove are made by any one or more processes of metal powder sintering, metal mesh sintering, laser engraving, and metal cold spraying.

[0011] Optionally, the first groove and / or the second groove is configured in a honeycomb shape, a tic-tac-toe shape, a serpentine curve shape, a straight line shape, or a combination of two or more thereof.

[0012] Optionally, the first cover plate and the second cover plate are provided with a flat plate heat conduction area, and the flat plate heat conduction area is used to contact a heat source to achieve heat exchange.

[0013] Optionally, a first liquid inlet channel and a first liquid outlet channel are provided on the first cover plate; a second liquid inlet channel and a second liquid outlet channel are provided on the second cover plate;

[0014] The first liquid inlet channel and the second liquid inlet channel are spliced ​​to form a channel for liquid inlet, and the first liquid outlet channel and the second liquid outlet channel are spliced ​​to form a channel for liquid outlet.

[0015] Optionally, the first liquid inlet channel and the first liquid outlet channel are arranged on the same side, and the second liquid inlet channel and the second liquid outlet channel are arranged on the same side.

[0016] Optionally, the channel for liquid inlet is located at the lower part of the side, and the channel for liquid outlet is located at the middle part of the side;

[0017] The cross-sectional area of ​​the channel for the inlet of the liquid is smaller than the cross-sectional area of ​​the channel for the outlet of the liquid.

[0018] Optionally, inner surfaces of the first liquid inlet channel, the first liquid outlet channel, the second liquid inlet channel, and the second liquid outlet channel are respectively provided with rough areas, and the rough areas are used to increase the capillary force inside the heat dissipation fins.

[0019] Optionally, the first cover plate and the second cover plate are flat plates.

[0020] Optionally, the first cover plate and the second cover plate are copper, aluminum, or alloy substrates.

[0021] The invention also provides a heat sink, comprising any of the heat dissipation fins described above.

[0022] Compared with the prior art, the present invention has at least the following beneficial effects:

[0023] The present invention provides a heat dissipation fin, wherein a first groove is arranged on a first cover plate and / or a second groove is arranged on a second cover plate, a rough area is arranged on the inner surface of the first groove and / or the inner surface of the second groove, the grooves can be arranged on the first cover plate and the second cover plate respectively, or a groove can be arranged on one of them, so as to form a cavity, and a rough area is arranged on the inner wall of the cavity, and the capillary force inside the heat dissipation fin is increased by using the rough area; the edge of the first cover plate and the edge of the second cover plate are spliced ​​and fixed to each other, so that the first groove and / or the second groove form a cavity for accommodating a phase change medium, and the phase change of the phase change medium is used to realize heat transfer; when the phase change medium is condensed, the liquid medium can flow along the inner surface of the first groove and / or the inner surface of the second groove under the action of the capillary force, and the power of the liquid flow is increased by means of the capillary force, thereby improving the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 An exploded view of the heat dissipation fin of the present invention;

[0026] Figure 2 is a front view of the first cover plate;

[0027] Figure 3 is a front view of the second cover plate;

[0028] Figure 4 It is a front view of another embodiment of the first cover plate.

[0029] The figure includes:

[0030] The first cover plate 1 , the first groove 11 , the first liquid inlet channel 12 , the first liquid outlet channel 13 , the second cover plate 2 , the second groove 21 , the second liquid inlet channel 22 , the second liquid outlet channel 23 , the flat heat transfer area 3 , and the metal mesh 4 . DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the heat dissipation fin of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0032] Combination Figure 1 , Figure 2 , Figure 3As shown, the present invention provides a heat dissipation fin, comprising a first cover plate 1 and a second cover plate 2, wherein the first cover plate 1 and the second cover plate 2 are spliced ​​together to form the entire heat dissipation fin.

[0033] The first cover plate 1 is provided with a first groove 11 and / or the second cover plate 2 is provided with a second groove 21. The first cover plate 1 and the second cover plate 2 can be provided with grooves at the same time, that is, the first cover plate 1 is provided with the first groove 11 and the second cover plate 2 is provided with the second groove 21; or a groove can be provided on one of the first cover plate 1 and the second cover plate 2, that is, the first cover plate 1 is provided with the first groove 11 or the second cover plate 2 is provided with the second groove 21. The first cover plate 1 and the second cover plate 2 both have at least one groove, so that after the first cover plate 1 and the second cover plate 2 are spliced, an internal hollow chamber is formed by the groove structure. When the first cover plate 1 is provided with the first groove 11, the first groove 11 forms a depression away from the second cover plate 2; when the second groove 21 is provided on the second cover plate 2, the second groove 21 forms a depression away from the first cover plate 1.

[0034] A rough area is provided on the inner surface of the first groove 11 and / or the inner surface of the second groove 21. When the first cover plate 1 is provided with the first groove 11, a rough area is provided on the inner surface of the first groove 11. When the second cover plate 2 is provided with the second groove 21, a rough area is provided on the inner surface of the second groove 21. The rough area forms a microporous structure on the inner surface of the first groove 11 and the inner surface of the second groove 21. The micropores in the rough area are used to increase the capillary force inside the heat sink fins, and when there is fluid inside, the liquid is subjected to capillary force and flows. The liquid molecules at the attachment layer (at the solid-liquid interface, a liquid layer with a thickness equal to the molecular gravity radius) and the molecules inside the liquid are subjected to different forces. The molecules inside the liquid are only subjected to the gravitational force of the liquid molecules, which offset each other symmetrically. However, the liquid molecules in the attachment layer are subjected to both the gravitational force of the liquid molecules and the gravitational force of the solid molecules, and the forces are unbalanced, so that the liquid forms a capillary force.

[0035] When the edge of the first cover plate 1 and the edge of the second cover plate 2 are spliced ​​and fixed to each other, the first groove 11 and / or the second groove 21 enclose a chamber for accommodating the phase change medium, and the chamber can be formed by the first groove 11 and the second groove 21 together, or by the first groove 11 and the surface of the second cover plate 2, or by the second groove 21 and the surface of the first cover plate 1. When the first groove 11 and the second groove 21 are set at the same time, the edge shapes of the first groove 11 and the second groove 21 are the same, and the entire chamber is completely formed by splicing the first groove 11 and the second groove 21. When the first groove 11 and the surface of the second cover plate 2 form a chamber, a rough area can be set at the position of the second cover plate 2 corresponding to the first groove 11; when the second groove 21 and the surface of the first cover plate 1 form a chamber, a rough area can be set at the position of the first cover plate 1 corresponding to the second groove 21. It is best to set the rough area at each position in the entire chamber.

[0036] When the phase change medium condenses, the condensed liquid medium can flow along the inner surface of the first groove 11 and / or the inner surface of the second groove 21 under the action of capillary force. Compared with the smooth surface, the rough surface causes the liquid medium to form a capillary force. The present invention not only increases the capillary force of the inner cavity of the heat sink fin by setting a rough surface in the chamber, but also can use the heat sink with phase change heat sink fins against gravity, so that the phase change medium in the inner cavity of the heat sink fin circulates faster and more efficiently, so that the performance of the heat sink with phase change heat sink fins can be fully utilized, thereby improving the performance of the heat sink.

[0037] In the heat sink fin of the present invention, the rough surface can be formed by processing in different ways. The inner surface of the first groove 11 and the inner surface of the second groove 21 are made by any one or more processes of metal powder sintering, metal mesh sintering, laser laser engraving, and metal cold spraying. When the inner surface of the first groove 11 and the inner surface of the second groove 21 are both set as rough surfaces, the two surfaces can use the same processing technology or different processing technologies. For example, the phase change heat sink fin can sinter the surfaces of the first cover plate 1 and the second cover plate 2 with metal powder or metal mesh, or a single cover plate can be sintered with metal powder or metal mesh, and the surface of the other cover plate can be processed by other methods. Specifically, the first cover plate 1 and the second cover plate 2 are both sintered with metal powder or metal mesh; the first cover plate 1 and the second cover plate 2 are both laser engraved to increase the roughness of the inner wall of the phase change heat sink fin, thereby increasing the capillary force of the phase change heat sink fin, thereby improving the performance of the radiator; the first cover plate 1 and the second cover plate 2 are both cold sprayed, and the metal powder is sprayed at high speed to spray the material powder onto the inner wall of the phase change heat sink fin, thereby increasing the roughness of the inner wall of the phase change heat sink fin and increasing the heat exchange area of ​​the inner wall of the fin, thereby increasing the capillary force of the phase change heat sink fin, thereby improving the performance of the radiator.

[0038] Combination Figure 1 As shown, two metal meshes 4 are shown, and the two metal meshes 4 correspond to the first groove 11 and the second groove 21 respectively. The two metal meshes 4 are fixed to the first groove 11 and the second groove 21 respectively, so that the inner cavity surfaces of the first groove 11 and the second groove 21 form rough areas.

[0039] The first groove 11 and / or the second groove 21 of the present invention are configured in a honeycomb shape, a tic-tac-toe shape, a serpentine curve, a straight line shape, or a combination of two or more thereof. Figure 1 , Figure 2 , Figure 3 In the structure shown therein, the first groove 11 and the second groove 21 are arranged in a honeycomb shape, that is, a hexagonal grid array. Figure 4 In the structure shown therein, the first grooves 11 are arranged in a tic-tac-toe grid array, or may be arranged in a serpentine curve or a straight line structure, and these specific configuration forms should all be included in the protection scope of the present invention.

[0040] Combination Figure 1 As shown, the present invention sets a flat plate heat conduction area 3 on the first cover plate 1 and the second cover plate 2. The flat plate heat conduction area 3 is not provided with a groove structure, and is a solid plate surface structure. The flat plate heat conduction area 3 is used to contact the heat source to achieve heat exchange. The flat plate heat conduction area 3 has the same shape as the heat source, ensuring the maximum contact area, thereby achieving a better heat conduction effect.

[0041] Figure 1 In the structure shown therein, the first cover plate 1 and the second cover plate 2 are respectively provided with a flat plate heat conduction area 3. The flat plate heat conduction area 3 is an area approximately in the shape of a triangle, and while ensuring the contact area with the heat source, a larger groove area is formed on the first cover plate 1 and the second cover plate 2 as much as possible to reserve a larger storage area for the phase change medium.

[0042] Combination Figure 1 As shown, the first cover plate 1 is provided with a first liquid inlet channel 12 and a first liquid outlet channel 13; the second cover plate 2 is provided with a second liquid inlet channel 22 and a second liquid outlet channel 23; the first liquid inlet channel 12 and the second liquid inlet channel 22 are positioned opposite to each other, and the first liquid inlet channel 12 and the second liquid inlet channel 22 are combined to form a channel for liquid inlet; the first liquid outlet channel 13 and the second liquid outlet channel 23 are positioned opposite to each other, and the first liquid outlet channel 13 and the second liquid outlet channel 23 are combined to form a channel for liquid outlet. The phase change medium enters the internal chamber from the liquid inlet channel and is discharged from the internal chamber from the liquid outlet channel.

[0043] Combination Figure 1As shown, the first liquid inlet channel 12 and the first liquid outlet channel 13 are arranged at different positions on the same side, and the second liquid inlet channel 22 and the second liquid outlet channel 23 are arranged at different positions on the same side. When the first cover plate 1 and the second cover plate 2 are spliced ​​together, the formed liquid inlet channel and liquid outlet channel are located on the same side.

[0044] Combination Figure 1 As shown, the bottom of the heat sink is the heat source, the top is the condensation point, the channel for liquid inlet is located at the lower part of the side of the heat sink, and the channel for liquid outlet is located in the middle part of the side of the heat sink; the cross-sectional area of ​​the channel for liquid inlet is smaller than the cross-sectional area of ​​the channel for liquid outlet. After the phase change medium enters the chamber inside the heat sink from the liquid inlet channel, it is heated and vaporized at the bottom and then flows upward. After being cooled and condensed at the top, it flows from top to bottom. With the help of the dual effects of capillary force and gravity, the condensed medium can quickly return to the bottom where the heat source is located.

[0045] Rough areas are respectively provided on the inner surfaces of the first liquid inlet channel 12, the first liquid outlet channel 13, the second liquid inlet channel 22, and the second liquid outlet channel 23. The rough areas are used to increase the capillary force inside the heat dissipation fins. Rough areas can be respectively provided at the liquid inlet channel and the liquid outlet channel to form capillary force in the liquid inlet channel and the liquid outlet channel.

[0046] Specifically, the first cover plate 1 and the second cover plate 2 in the present invention are flat plate-shaped. When the first cover plate 1 and the second cover plate 2 are integrated, a heat dissipation fin having a flat plate-shaped main body is formed.

[0047] The first cover plate 1 and the second cover plate 2 are copper, aluminum, or alloy substrates, and are made of materials with high thermal conductivity, which helps to achieve rapid heat conduction.

[0048] The present invention increases the capillary force of the phase-change heat sink fins through a structural design. The inner cavity of the phase-change heat sink fins changes the structure of the inner cavity of the heat sink fins through metal powder sintering or metal mesh sintering, laser laser engraving, and metal cold spraying processes, and changes the roughness of the inner wall of the fins. This not only increases the capillary force of the inner cavity of the heat sink fins, but also allows the heat sink with phase-change heat sink fins to be used against gravity, so that the phase-change medium in the inner cavity of the heat sink fins circulates faster and more efficiently, so that the performance of the heat sink with phase-change heat sink fins can be fully utilized, thereby improving the performance of the heat sink. When the chip on the electronic product is working, the efficiency of taking away heat is better, thereby reducing the core temperature of the chip when it is working, which not only improves the performance of the chip, but also extends the service life of the chip and increases the competitiveness of the product.

[0049] The present invention also provides a radiator, which includes the above-mentioned heat dissipation fins, so the radiator can have the above-mentioned technical effects. A radiator needs to be provided with multiple heat dissipation fins to increase the heat exchange area. The specific number, shape and position of the heat dissipation fins of the radiator can refer to the prior art, and the present invention will not repeat them here.

[0050] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation fin, characterized in that: Comprising a first cover plate (1) and a second cover plate (2), the first cover plate (1) being provided with a first groove (11) and / or the second cover plate (2) being provided with a second groove (21); a rough area being provided on the inner surface of the first groove (11) and / or the inner surface of the second groove (21), the rough area being used to increase the capillary force inside the heat dissipation fin; The edge of the first cover plate (1) and the edge of the second cover plate (2) are spliced ​​and fixed to each other, so that the first groove (11) and / or the second groove (21) form a chamber for accommodating a phase change medium; The liquid phase change medium can flow along the inner surface of the first groove (11) and / or the inner surface of the second groove (21) under the action of the capillary force of the rough area.

2. The heat dissipation fin according to claim 1, characterized in that: The inner surface of the first groove (11) and the inner surface of the second groove (21) are made by any one or more processes including metal powder sintering, metal mesh sintering, laser engraving, and metal cold spraying.

3. The heat dissipation fin according to claim 1, characterized in that: The first groove (11) and / or the second groove (21) are arranged in a honeycomb shape, a tic-tac-toe shape, a serpentine curve shape, a straight line shape, or a combination of two or more thereof.

4. The heat dissipation fin according to claim 1, characterized in that: The first cover plate (1) and the second cover plate (2) are provided with a flat plate heat conduction area (3), and the flat plate heat conduction area (3) is used to contact a heat source to achieve heat exchange.

5. The heat dissipation fin according to claim 1, characterized in that: The first cover plate (1) is provided with a first liquid inlet channel (12) and a first liquid outlet channel (13); the second cover plate (2) is provided with a second liquid inlet channel (22) and a second liquid outlet channel (23); The first liquid inlet channel (12) and the second liquid inlet channel (22) are spliced ​​together to form a channel for liquid inlet, and the first liquid outlet channel (13) and the second liquid outlet channel (23) are spliced ​​together to form a channel for liquid outlet.

6. The heat dissipation fin according to claim 5, characterized in that: The first liquid inlet channel (12) and the first liquid outlet channel (13) are arranged on the same side, and the second liquid inlet channel (22) and the second liquid outlet channel (23) are arranged on the same side.

7. The heat dissipation fin according to claim 6, characterized in that: The channel for liquid inlet is located at the lower part of the side, and the channel for liquid outlet is located at the middle part of the side; The cross-sectional area of ​​the channel for the inlet of the liquid is smaller than the cross-sectional area of ​​the channel for the outlet of the liquid.

8. The heat dissipation fin according to claim 6, characterized in that: The inner surfaces of the first liquid inlet channel (12), the first liquid outlet channel (13), the second liquid inlet channel (22), and the second liquid outlet channel (23) are respectively provided with rough areas, and the rough areas are used to increase the capillary force inside the heat dissipation fins.

9. The heat dissipation fin according to claim 6, characterized in that: The first cover plate (1) and the second cover plate (2) are flat plates.

10. The heat dissipation fin according to claim 6, characterized in that: The first cover plate (1) and the second cover plate (2) are copper, aluminum, or alloy substrates.

11. A radiator, characterized in that: The heat dissipation fin comprises the heat dissipation fin according to any one of claims 1 to 10.

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