Microwave debugging probe and preparation method thereof

Abstract

The embodiment of the invention provides a microwave debugging probe and a preparation method thereof, and relates to the technical field of microwave debugging, the probe comprises a probe main body, the two ends of the probe main body are respectively provided with a ceramic needle; a debugging metal layer is attached to the top end of the ceramic needle. The debugging probe provided by the invention can realize verification debugging of microwave circuit performance parameters, predicts an optimization method of different compositions of a microwave assembly, and has the advantages of simple composition, mature preparation process, safety, no damage, wide application field, wide application range and the like.

Description

Technical Field

[0001] The present application relates to the field of microwave debugging technology, and in particular to a microwave debugging probe and a preparation method thereof. Background Art

[0002] For microwave products with complex functions, their constituent units are microwave components. In order to achieve normal operation of the product, each component is required to meet the corresponding technical index requirements. However, due to fluctuations in device performance, as well as design simulation and assembly deviations, there will be a certain gap between the measured values ​​and index requirements of various performance parameters of microwave components. Therefore, it is necessary to conduct verification debugging on physical quantities that affect the performance parameters of microwave components, such as the line width of microwave transmission lines (such as microstrip lines, coplanar waveguides), the effective physical length of the filter resonant unit, the resistance value of the equalizer equivalent circuit, the matching branches of different cascade structures, and the resistance value of the active device voltage divider module, so as to optimize the circuit structure of microwave components and improve component performance.

[0003] Therefore, there is an urgent need for a device suitable for verifying and debugging the performance parameters of microwave components. Summary of the invention

[0004] The embodiments of the present application provide a microwave debugging probe and a preparation method thereof, wherein the debugging probe can realize verification debugging of microwave circuit performance parameters and predict optimization methods of different components of microwave components.

[0005] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0006] According to a first aspect of an embodiment of the present application, a microwave debugging probe is provided, comprising:

[0007] A probe body, with ceramic needles installed at both ends of the probe body;

[0008] The top of the ceramic needle is provided with a debugging metal layer.

[0009] In some embodiments of the present application, based on the aforementioned solution, the probe body includes an upper body part and a lower body part;

[0010] Grooves are respectively arranged at both ends of the upper part of the main body and the lower part of the main body, and the ceramic needles are installed in the grooves.

[0011] In some embodiments of the present application, based on the aforementioned solution, the grooves at both ends of the probe body have different sizes.

[0012] In some embodiments of the present application, based on the aforementioned solution, the ceramic needles installed at both ends of the probe body have different sizes.

[0013] In some embodiments of the present application, based on the aforementioned solution, the top side wall of the ceramic needle is a smooth surface layer, and the smooth surface layer is formed by grinding the ridges of the top side wall.

[0014] In some embodiments of the present application, based on the aforementioned solution, the probe body outer shell is provided with a clamping protection structure.

[0015] In some embodiments of the present application, based on the aforementioned solution, the clamping protection structure is a heat shrink tube sleeved on the probe body.

[0016] According to a second aspect of an embodiment of the present application, a method for preparing a microwave debugging probe is provided, comprising the following steps:

[0017] Step S100: cutting the thin ceramic plate into ceramic strips of different sizes;

[0018] Step S200: grinding the top sidewall edge of one end of the ceramic strip smooth with sandpaper to form a smooth surface layer;

[0019] Step S300: grinding the ceramic thin strips to be smooth, coating the ends with conductive slurry, and sintering at high temperature to form a uniform debugging metal layer, thereby obtaining a ceramic needle;

[0020] Step S400: a probe body is manufactured by using a cavity opening-stacking-lamination-co-firing-cutting process, wherein the probe body is separated into an upper body part and a lower body part, and grooves are respectively provided at both ends of the upper body part and the lower body part;

[0021] Step S500: embed the ceramic needle into the groove of the lower half of the main body, and then align and press the upper half of the main body with the lower half of the main body;

[0022] Step S600: a clamping protection structure is disposed outside the probe body to fix the ceramic needle and the probe body to obtain a debugging probe.

[0023] The debugging probe of the present application has the advantages of simple structure, mature preparation process, safety and no damage, wide application field and wide application range.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0026] Figure 1 A schematic diagram of the structure of a microwave debugging probe according to an embodiment of the present application is shown;

[0027] Figure 2 A schematic diagram showing the top sidewall ridgeline of a ceramic strip after being polished according to an embodiment of the present application is shown;

[0028] Figure 3 A schematic diagram showing a ceramic needle made by forming a debugging metal layer on the top of a ceramic strip according to an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the upper and lower parts of a main body with a groove according to an embodiment of the present application is shown;

[0030] Figure 5 A schematic diagram of a ceramic needle embedded in a probe body according to an embodiment of the present application is shown;

[0031] Figure 6 A schematic diagram of a process of cutting a thin ceramic plate into ceramic strips according to an embodiment of the present application is shown;

[0032] Figure 7 A flow chart showing a method for preparing a microwave debugging probe according to an embodiment of the present application is shown;

[0033] Figure 8 A schematic diagram of the working application of a probe to debug the line width of a transmission line in a microwave component according to an embodiment of the present application is shown.

[0034] Description of Reference Numerals

[0035] 1-probe body, 2-ceramic needle, 3-groove, 4-heat shrink tube, 11-lower part of the body, 12-upper part of the body, 21-debugging metal layer, 22-ceramic strip, 5-debugging probe, 6-transmission line, 7-microwave component, 8-ceramic plate. DETAILED DESCRIPTION

[0036] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0037] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0038] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the objects used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those shown or described.

[0040] In order to make the purpose, technical solutions and advantages of the present invention more clearly explained, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Some embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0042] In order to solve the problems existing in the prior art, the present application embodiment provides a microwave debugging probe, including:

[0043] A probe body, with ceramic needles installed at both ends of the probe body;

[0044] The top of the ceramic needle is provided with a debugging metal layer.

[0045] It should be noted that the debugging metal layer at the top of the ceramic needle is used to contact different components in the microwave component under test during microwave testing.

[0046] It should be noted that by installing ceramic needles of different sizes at both ends of the probe body, the application compatibility of the probe is improved.

[0047] It should be noted that the debugging metal layer formed at the end of the ceramic needle through the coating-post-firing process has strong adhesion, wear resistance and good uniformity.

[0048] The entire debugging probe has a simple composition, is easy to assemble and disassemble, and is safe and efficient to use.

[0049] For example, Figure 1 As shown, a microwave debugging probe 5 is shown, comprising: a probe body 1 and two ceramic needles 2 of different sizes.

[0050] The two ceramic needles 2 are respectively embedded in the grooves 3 at the top and bottom ends of the probe body 1 and fixed by heating and shrinking a heat shrink tube 4 sleeved on the probe body 1 .

[0051] like Figure 2 As shown, the top sidewall ridge of the ceramic strip 22 is polished to prevent the ceramic needle from being damaged by excessive ridge indentation when it contacts the circuit structure; Figure 3 As shown, the top end of the ceramic thin strip 22 is formed with a debugging metal layer 21 for debugging by a coating-post-firing process, thereby obtaining a ceramic needle 2.

[0052] In some feasible embodiments, based on the above-mentioned solution, the ridgeline of the top side wall of the ceramic needle is polished to form a smooth surface layer.

[0053] For example, Figure 3 As shown, each of the top sidewall ridges of the top of the ceramic needle is polished smooth to reduce contact damage to the microwave component during use.

[0054] In some feasible embodiments, based on the above scheme, the probe body includes an upper body part and a lower body part;

[0055] Grooves are respectively arranged at both ends of the upper part of the main body and the lower part of the main body, and the ceramic needles are installed in the grooves.

[0056] For example, Figure 4 As shown, the probe body 1 is divided into a main body lower half 11 and a main body upper half 12. The top and bottom ends of the main body lower half 11 are provided with grooves 3 for embedding the ceramic needle 2. In addition, in order to match the main body lower half 11 and ensure that the ceramic needle 2 can be firmly fixed, the top and bottom ends of the main body upper half 12 are also correspondingly provided with grooves 3. After the ceramic needle 2 is embedded in the groove 3 of the main body lower half 11, the main body upper half 12 is aligned with the main body lower half 11 and then pressed, and the ceramic needle 2 can be installed on the probe body 1, as shown in FIG. Figure 5 shown.

[0057] In some feasible embodiments, based on the above-mentioned solution, the grooves at both ends of the probe body have different sizes.

[0058] In some feasible embodiments, based on the above-mentioned solution, the ceramic needles installed at both ends of the probe body have different sizes.

[0059] It can be understood that the grooves at both ends of the probe body are set to different sizes in order to cooperate with ceramic needles of different sizes.

[0060] It should be noted that the length and width of the top groove of the upper part of the main body and the top groove of the lower part of the main body are the same, and the depth dimensions may be different; similarly, the length and width of the bottom groove of the upper part of the main body and the bottom groove of the lower part of the main body are the same, and the depth dimensions may be different.

[0061] It should be noted that the ceramic needles installed at both ends of the probe body are of different sizes, so that the debugging probe can be used for precise debugging of microwave circuit structures of different sizes. For example, the narrower end can be used for debugging of fine line structures, and the wider end can be used for debugging of wide line structures.

[0062] In some feasible embodiments, based on the above-mentioned solution, the probe body is made of ceramic.

[0063] In some feasible embodiments, based on the above-mentioned solution, the clamping protection structure outside the probe body adopts a heat shrink tube.

[0064] It should be noted that heat shrink tubing refers to a plastic tube that shrinks when exposed to heat. It can tightly wrap separated pipes together through heat shrinkage to achieve fixed protection of the joints as an insulating material.

[0065] For example, Figure 1 As shown, after the upper part 12 of the main body is aligned and pressed with the lower part 11 of the main body, a heat shrink tube 4 is arranged outside the probe body 1. The heat shrink tube 4 shrinks when heated, and then fixes the ceramic needle 2 and the probe body 1, so that the overall structure is firm and has strong dimensional compatibility.

[0066] In some feasible embodiments, based on the above-mentioned solution, the heat shrink tube can be a common heat shrink tube, a heat shrink tube with hot melt adhesive, a double-wall heat shrink tube or a flame-retardant heat shrink tube.

[0067] Based on the same inventive concept, the present application also provides a method for preparing a microwave debugging probe, such as Figure 7 As shown, it includes steps S100 to S600.

[0068] Step S100, cutting the thin ceramic plate into ceramic strips of different sizes.

[0069] For example, a laser cutting method is used to cut a 60 mm*20 mm*1 mm ceramic plate 8 perpendicular to the surface into ceramic thin strips with sizes of 20 mm*1.5 mm*1 mm and 20 mm*1 mm*1 mm, respectively. Figure 6 shown.

[0070] Step S200, the top sidewall edge of one end of the ceramic strip is polished with sandpaper to form a smooth surface layer. The polished ceramic strip and its top are shown in the enlarged figure. Figure 2 shown.

[0071] Step S300, grinding the ceramic thin strips to be smooth, coating the ends with conductive metal slurry, and sintering at high temperature to form a uniform test metal layer, thereby obtaining a ceramic needle.

[0072] For example, the top of the ceramic strip is coated with conductive gold paste, and a 15μm to 30μm thick debugging gold layer is formed by high temperature sintering at 850°C to obtain a ceramic needle. Among them, small-sized ceramic needles can be used for fine line structure debugging, and large-sized ceramic needles can be used for wide line structure debugging, such as Figure 3 shown.

[0073] Step S400, a probe body is manufactured by using a cavity opening-stacking-lamination-co-firing-cutting process, wherein the probe body is divided into an upper body part and a lower body part, and grooves are respectively arranged at both ends of the upper body part and the lower body part.

[0074] For example, the process of opening cavity-stacking-laminating-co-firing-cutting is adopted to obtain the upper and lower parts of the probe body with the size of 100mm*6mm*2mm, and the sizes of the grooves at the two ends are 10mm*1.6mm*0.45mm and 10mm*1.1mm*0.45mm respectively. The two ends of the probe body are adaptively narrowed, such as Figure 4 shown.

[0075] Step S500, embed the ceramic needle into the groove of the lower half of the main body, and then align and press the upper half of the main body with the lower half of the main body. Figure 5 shown.

[0076] Step S600, a clamping protection structure is provided on the outer cover of the probe body to fix the ceramic needle and the probe body to obtain a debugging probe, such as Figure 1 shown.

[0077] Exemplarily, a flame retardant heat shrink tube is provided outside the probe body, and the heat shrink tube is shrunk by heating at 200° C. with a hot air gun, so that the probe body and the ceramic needle are firmly fixed.

[0078] It should be noted that the cavity opening in this embodiment refers to the process of cutting off a part of the area on the green porcelain to form a cavity. The green porcelain refers to the dielectric material that has not been sintered.

[0079] It should be noted that the lamination in this embodiment refers to the process of arranging and pre-fixing each single layer of raw porcelain in a predetermined order.

[0080] It should be noted that the lamination in this embodiment refers to the process of heating and pressurizing the laminated green porcelain to combine them into a whole.

[0081] It should be noted that the co-firing in this embodiment refers to processing the laminated green ceramic blocks under a certain temperature and atmosphere to obtain a ceramic substrate with a dense structure and hard texture.

[0082] The following is an application process of using this microwave debugging probe to debug the performance of microwave components:

[0083] Hold the microwave debugging probe 5, make the debugging metal layer at the top of the ceramic needle contact different positions of the transmission line 6 in the microwave component 7, and observe the change trend of the signal curve on the test instrument, perform verification debugging to widen or narrow the transmission line width, and complete the optimization of the microwave circuit structure, such as Figure 8 shown.

[0084] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. It should be understood that the present application is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A microwave debugging probe, characterized in that: include: A probe body, with ceramic needles installed at both ends of the probe body; The top of the ceramic needle is provided with a debugging metal layer.

2. The microwave debugging probe according to claim 1, characterized in that: The probe body comprises an upper body part and a lower body part; Grooves are respectively arranged at both ends of the upper part of the main body and the lower part of the main body, and the ceramic needles are installed in the grooves.

3. The microwave debugging probe according to claim 2, characterized in that: The grooves at two ends of the probe body have different sizes.

4. The microwave debugging probe according to claim 2, characterized in that: The ceramic needles installed at both ends of the probe body have different sizes.

5. The microwave debugging probe according to claim 1, characterized in that: The top side wall of the ceramic needle is a smooth surface layer, and the smooth surface layer is formed by grinding the ridge line of the top side wall.

6. The microwave debugging probe according to claim 1, characterized in that: A clamping protection structure is sleeved on the probe body, and the end of the ceramic needle is located outside the clamping protection structure.

7. The microwave debugging probe according to claim 6, characterized in that: The clamping protection structure is a heat shrink tube sleeved on the probe body.

8. A method for preparing a microwave debugging probe, characterized in that: The steps include: Step S100: cutting the thin ceramic plate into ceramic strips of different sizes; Step S200: grinding the top sidewall edge of one end of the ceramic strip smooth with sandpaper to form a smooth surface layer; Step S300: grinding the ceramic thin strips to be smooth, coating the ends with conductive slurry, and sintering at high temperature to form a uniform debugging metal layer, thereby obtaining a ceramic needle; Step S400: a probe body is manufactured by using a cavity opening-stacking-lamination-co-firing-cutting process, wherein the probe body is separated into an upper body part and a lower body part, and grooves are respectively provided at both ends of the upper body part and the lower body part; Step S500: embed the ceramic needle into the groove of the lower half of the main body, and then align and press the upper half of the main body with the lower half of the main body; Step S600: a clamping protection structure is disposed outside the probe body to fix the ceramic needle and the probe body to obtain a debugging probe.

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