Harmonic temperature rise test method and device for direct-current voltage measuring device and medium

Abstract

The invention discloses a harmonic wave temperature rise test method and device of a direct current voltage measuring device and a medium. The method comprises the following steps: measuring a first capacitance and a first dielectric loss factor of a direct-current voltage measuring device sample at normal temperature; fixing temperature sensors at a plurality of preset structure positions of the direct-current voltage measuring device sample; a preset harmonic temperature rise test system is adopted to apply a preset highest harmonic withstand frequency and a corresponding withstand voltage to the direct-current voltage measurement device sample, and temperature rise data of a plurality of preset structure positions are measured through a temperature sensor; measuring a second capacitance and a second dielectric loss factor of the direct-current voltage measuring device sample after the temperature rise test of the direct-current voltage measuring device sample is finished; and according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance and the second dielectric loss factor, determining a temperature rise test result of the direct-current voltage measuring device sample.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature rise testing of a DC voltage measuring device, and more specifically, to a harmonic temperature rise testing method, device and medium of a DC voltage measuring device. Background Art

[0002] Flexible DC transmission technology, as an emerging technology in the field of power transmission, relies on voltage source converters (VSC) and advanced fully controlled devices such as insulated gate bipolar transistors (IGBT). This technology can not only efficiently transmit electric energy, but also flexibly regulate the voltage of the AC grid connected to it. Compared with traditional transmission methods, it has shown significant technical advantages in island power supply, expansion and transformation of urban distribution networks, interconnection of AC systems, and grid connection of large-scale wind farms.

[0003] Flexible DC transmission projects stand out for their excellent controllability, flexible operation mode and wide applicability. In addition, this technology significantly improves the grid connection efficiency and stability of new energy such as wind and solar energy, providing strong support for the large-scale development and utilization of new energy.

[0004] In recent years, China has made breakthrough progress in the field of flexible direct current transmission technology, transforming from a follower to a leader, and successfully solving a series of technical challenges such as flexible direct current networking, capacity expansion and reliability enhancement.

[0005] In flexible direct current projects, modular multilevel converter (MMC) technology is widely used. Taking the Zhangbei flexible direct current project as an example, the bipolar half-bridge MMC topology structure adopted by it is composed of multiple sub-modules in series through the setting of multiple levels. It can generate multiple voltage steps and synthesize an output voltage close to a sine wave. The voltage waveforms of the sub-modules are staggered in time, and the harmonic components are effectively reduced after being superimposed on each other. The energy storage capacitors in each sub-module can smooth the voltage waveform, reduce voltage fluctuations and ripples, and thus reduce the harmonic content. In addition, by optimizing the pulse width modulation (PWM) strategy, the output voltage waveform can be further adjusted to reduce harmonics of specific orders.

[0006] Although the academic and engineering communities generally believe that there is no harmonic leakage problem in flexible DC transmission projects, actual operating experience and field tests have revealed different situations. In flexible DC transmission systems, harmonics ranging from low frequencies such as 3rd and 6th to high frequencies such as 200th are leaking to the DC side, which may threaten the safe operation of capacitive equipment such as DC voltage measurement devices and bushings, and has caused multiple equipment damages.

[0007] The existing standards such as "GB T 20840.15-2022 Transformer Part 15: Supplementary Technical Requirements for DC Voltage Transformers" and "GB T 26217-2019 DC Voltage Measuring Devices for High Voltage Direct Current Transmission Systems" do not put forward requirements for temperature rise tests of DC voltage measuring devices under harmonics, which makes us lack effective basis for evaluating the working status of DC voltage measuring devices under harmonics. Summary of the invention

[0008] In view of the deficiencies in the prior art, the present invention provides a harmonic temperature rise test method, device and medium for a DC voltage measuring device.

[0009] According to one aspect of the present invention, a harmonic temperature rise test method for a DC voltage measuring device is provided, comprising:

[0010] Measuring the first capacitance and the first dielectric loss factor of the DC voltage measuring device sample at room temperature;

[0011] Fixing temperature sensors at a plurality of preset structural positions of the DC voltage measuring device test piece;

[0012] A preset harmonic temperature rise test system is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measuring device test piece, and the temperature rise data of multiple preset structural positions are measured by a temperature sensor;

[0013] After the temperature rise test of the DC voltage measuring device sample is completed, measuring the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample;

[0014] A temperature rise test result of the DC voltage measuring device sample is determined according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance, and the second dielectric loss factor.

[0015] Optionally, a preset harmonic temperature rise test system is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece, and the temperature rise data of multiple preset structural positions are measured by a temperature sensor, including:

[0016] A preset harmonic temperature rise test system is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measuring device test piece, and temperature data of multiple preset structural positions are measured by a temperature sensor;

[0017] When the temperature data of the plurality of preset structural positions are stable, the temperature rise data of the plurality of preset structural positions are measured.

[0018] Optionally, the multiple preset structural positions include: multiple fixed points on the outer surface of the DC voltage measuring device sample, multiple fixed points on the surface of the resistor tube of the DC voltage measuring device sample, and multiple fixed points on the surface of the capacitor tube of the DC voltage measuring device sample.

[0019] Optionally, after the temperature rise test of the DC voltage measuring device sample is completed, measuring a second capacitance and a second dielectric loss factor of the DC voltage measuring device sample includes:

[0020] After the temperature rise test of the DC voltage measuring device sample is completed and the temperature returns to normal temperature and stabilizes, the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample are measured.

[0021] Optionally, determining a temperature rise test result of a DC voltage measuring device sample according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance, and the second dielectric loss factor includes:

[0022] When the temperature rise data does not exceed the preset limit, and the first error of the first capacitance and the second capacitance and the second error of the first dielectric loss factor and the second dielectric loss factor do not exceed the preset value, it is determined that the temperature rise test of the DC voltage measuring device sample has passed; otherwise, the temperature rise test of the DC voltage measuring device sample has failed.

[0023] Optionally, the harmonic temperature rise test system includes: a harmonic power supply, a transformer, a capacitive voltage divider and a DC voltage measuring device test piece, wherein

[0024] The harmonic power supply, transformer, capacitive voltage divider and DC voltage measuring device test piece are connected in parallel through copper wires.

[0025] According to another aspect of the present invention, a harmonic temperature rise test device for a DC voltage measuring device is provided, comprising:

[0026] A first measuring module, used for measuring a first capacitance and a first dielectric loss factor of a DC voltage measuring device sample at room temperature;

[0027] A fixing module, used for fixing the temperature sensor at a plurality of preset structural positions of the DC voltage measuring device test piece;

[0028] A test module, used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to a DC voltage measuring device test piece using a preset harmonic temperature rise test system, and measure temperature rise data at multiple preset structural positions using a temperature sensor;

[0029] A second measuring module is used to measure a second capacitance and a second dielectric loss factor of the DC voltage measuring device sample after the temperature rise test of the DC voltage measuring device sample is completed;

[0030] The determination module is used to determine the temperature rise test result of the DC voltage measurement device test piece according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance and the second dielectric loss factor.

[0031] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the storage medium stores a computer program, and the computer program is used to execute the method described in any one of the above aspects of the present invention.

[0032] According to another aspect of the present invention, an electronic device is provided, comprising: a processor; a memory for storing instructions executable by the processor; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method described in any one of the above aspects of the present invention.

[0033] Therefore, the present invention tests the temperature rise of various parts of the DC voltage measuring device sample under a harmonic voltage environment. The traditional detection method of the DC voltage measuring device does not assess the temperature rise of the DC voltage measuring device under a harmonic environment. In addition, compared with traditional thermocouples or infrared thermal imaging, the use of temperature sensors and optical fiber temperature measurement proposed in the present method can measure the temperature rise of various parts inside the DC voltage measuring device, and the assessment of the temperature rise of the DC voltage measuring device is more comprehensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] A more complete understanding of exemplary embodiments of the present invention may be obtained by referring to the following drawings:

[0035] Figure 1 It is a flow chart of a harmonic temperature rise test method of a DC voltage measuring device provided by an exemplary embodiment of the present invention;

[0036] Figure 2 is a schematic diagram of a harmonic temperature rise test system provided by an exemplary embodiment of the present invention;

[0037] Figure 3 is a schematic diagram of the fixing points of a temperature sensor provided by an exemplary embodiment of the present invention;

[0038] Figure 4 It is a schematic diagram of a temperature rise variation curve of measuring points 1 to 5 provided by an exemplary embodiment of the present invention;

[0039] Figure 5 It is a schematic diagram of a temperature rise variation curve of measuring points 6 to 10 provided by an exemplary embodiment of the present invention;

[0040] Figure 6 It is a schematic diagram of a temperature rise variation curve of measuring points 11 to 15 provided by an exemplary embodiment of the present invention;

[0041] Figure 7 It is a structural schematic diagram of a harmonic temperature rise test device of a DC voltage measurement device provided by an exemplary embodiment of the present invention;

[0042] Figure 8 This is a structure of an electronic device provided by an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0043] Below, the exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited to the exemplary embodiments described here.

[0044] It should be noted that the relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0045] Those skilled in the art can understand that the terms "first" and "second" in the embodiments of the present invention are only used to distinguish different steps, devices or modules, etc., and neither represent any specific technical meaning nor indicate the necessary logical order between them.

[0046] It should also be understood that, in the embodiments of the present invention, “plurality” may refer to two or more than two, and “at least one” may refer to one, two or more than two.

[0047] It should also be understood that any component, data or structure mentioned in the embodiments of the present invention can generally be understood as one or more, unless explicitly limited or otherwise indicated in the context.

[0048] In addition, the term "and / or" in the present invention is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present invention generally indicates that the associated objects before and after are in an "or" relationship.

[0049] It should also be understood that the description of the various embodiments of the present invention focuses on the differences between the various embodiments, and the same or similar aspects thereof can be referenced to each other, and for the sake of brevity, they will not be described one by one.

[0050] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0051] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0052] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0053] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0054] Embodiments of the present invention can be applied to electronic devices such as terminal devices, computer systems, servers, etc., which can operate with many other general or special computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments and / or configurations suitable for use with electronic devices such as terminal devices, computer systems, servers, etc. include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network personal computers, small computer systems, large computer systems, and distributed cloud computing technology environments including any of the above systems, etc.

[0055] Electronic devices such as terminal devices, computer systems, servers, etc. can be described in the general context of computer system executable instructions (such as program modules) executed by computer systems. Generally, program modules can include routines, programs, object programs, components, logic, data structures, etc., which perform specific tasks or implement specific abstract data types. Computer systems / servers can be implemented in a distributed cloud computing environment, where tasks are performed by remote processing devices linked through a communication network. In a distributed cloud computing environment, program modules can be located on local or remote computing system storage media including storage devices.

[0056] Exemplary Methods

[0057] Figure 1 1 is a flow chart of a harmonic temperature rise test method of a DC voltage measurement device provided by an exemplary embodiment of the present invention. This embodiment can be applied to electronic devices, such as Figure 1 As shown, the harmonic temperature rise test method 100 of a DC voltage measuring device includes the following steps:

[0058] Step 101, measuring a first capacitance and a first dielectric loss factor of a DC voltage measuring device sample at room temperature;

[0059] Step 102, fixing temperature sensors at a plurality of preset structural positions of the DC voltage measuring device test piece;

[0060] Step 103, using a preset harmonic temperature rise test system to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece, and measuring temperature rise data at multiple preset structural positions through a temperature sensor;

[0061] Step 104, after the temperature rise test of the DC voltage measuring device sample is completed, measuring the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample;

[0062] Step 105 , determining a temperature rise test result of the DC voltage measurement device sample according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance, and the second dielectric loss factor.

[0063] Specifically, the purpose of the implementation of the present invention is to propose a test method for measuring the temperature rise of a DC voltage measuring device under harmonics. In view of the deficiencies in the existing standards, the present invention has formulated a detailed test method for the temperature rise of a DC voltage measuring device under harmonics to assess the temperature rise characteristics of the DC voltage measuring device under the action of high-order harmonics, which is used to verify the performance of the DC voltage measuring device in a harmonic environment.

[0064] The temperature rise test method of the DC voltage measuring device under harmonics proposed in this paper is as follows: Figure 2 As shown in the schematic diagram, a harmonic temperature rise test system is established using a harmonic power supply, transformer, capacitor voltage divider and DC voltage measuring device test piece. The harmonic power supply, transformer, capacitor voltage divider and test piece are all connected in parallel using copper wires. The capacitor voltage divider can be equivalent to two sets of capacitors in series. The test voltage is measured using the voltage division principle, and the test current is measured using the measuring impedance at the end of the test piece. A DC voltage measuring device is applied to measure the highest harmonic withstand frequency and corresponding withstand voltage of the test piece. A temperature sensor is fixed at Figure 3 The DC voltage measuring device shown in the figure has different structural points on the surface of the test piece, and then is connected to the computer end through temperature sensing optical fiber and acquisition unit to monitor the temperature of each structural point in real time. The test is ended when the temperature of each structure of the DC voltage measuring device is stable, and the temperature rise value of each structure of the DC voltage measuring device under the frequency harmonic voltage is measured.

[0065] The measurement process is as follows: (1) Conduct capacitance and dielectric loss factor measurement tests on the DC voltage measuring device sample at room temperature, and record the capacitance and dielectric loss factor of the sample before the temperature rise test; (2) Fix temperature sensors at different locations of the sample, such as Figure 2 As shown, 1 to 5 are fixed points on the outer surface of the DC voltage measuring device, 6 to 10 are fixed points on the surface of the resistor tube of the DC voltage measuring device, and 11 to 15 are fixed points on the surface of the capacitor tube of the DC voltage measuring device. The temperature of different parts of the test product is monitored on the computer using a sensing optical fiber; (3) Using Figure 1The harmonic temperature rise test system shown in the figure applies the highest harmonic withstand frequency and corresponding withstand voltage to the test piece; (4) when the temperature of each part of the test piece is stable, measure the temperature rise of each structure of the test piece; (5) after the temperature rise test is completed, when the temperature of the DC voltage measuring device returns to room temperature and stabilizes, measure the capacitance and dielectric loss factor of the DC voltage measuring device test piece.

[0066] If the temperature rise value of the DC voltage measuring device sample does not exceed the limit after the temperature of each part of the sample stabilizes, and the measurement results of the sample capacitance and dielectric loss factor before and after the test are within ±5%, the DC voltage measuring device sample is considered to have passed the test.

[0067] Aiming at the deficiency of existing standards in assessing the temperature rise of DC voltage measuring devices under harmonics, the present invention formulates a detailed method for assessing the temperature rise of DC voltage measuring devices under harmonics for the first time, and obtains the influence of harmonics on the temperature rise of DC voltage measuring devices, which is beneficial to optimizing product selection and reducing product failure rate.

[0068] In one embodiment of the present invention, in the harmonic temperature rise test system used in the present invention, the harmonic power supply can output a voltage of 0 to 500V, with a frequency range of 50 to 3000Hz. The transformer ratio is 120:1, and the rated output voltage is 60kV. Using the test method of the present invention, a ±100kV DC voltage measurement device test product is subjected to a temperature rise test under harmonics.

[0069] A DC voltage measuring device was selected as a test piece, and the capacitance and dielectric loss factor were measured. During the test, a multifunctional high-voltage capacitance bridge was used to measure at 10% of the rated voltage, i.e., 10kV. The capacitance of the test piece before the harmonic temperature rise test was recorded as 1420.96nF, and the dielectric loss factor was 2.33%.

[0070] according to Figure 2 As shown, temperature sensors are fixed at different parts of the test piece, and these sensors are connected to the acquisition unit using sensing optical fibers, which then transmit the signals to the computer to monitor the temperature of different parts of the test piece in real time. Apply a 3kHz, 29kV harmonic voltage, keep the current flowing through the test piece at 0.77A, and start the harmonic temperature rise test of the DC voltage measuring device. Use the temperature monitoring software on the computer to read the temperature value of each sensor every 30 minutes to record the temperature changes in various parts of the test piece. In this test, the criterion for judging temperature stability is: within three consecutive measurement cycles, the temperature value of each sensor does not change by more than 1°C. When this condition is met, it can be considered that the temperature of each part of the test piece has stabilized, and the temperature rise of each structure of the test piece can be calculated. The test results are as follows Figures 4 to 6 shown.

[0071] It can be seen from the temperature rise curves of each measuring point that under the same test conditions, after the temperature of each measuring point stabilizes, the temperature rise of the measuring points on the surface of the DC voltage measuring device specimen is relatively low, among which the temperature rise of measuring point 5 is the lowest, which is 1.6K; the temperature rise of the surface of the capacitor tube is relatively high, among which the temperature rise of measuring point 11 is the highest, which is 24.2K. The temperature rise of each measuring point does not exceed the temperature rise limit of 45K of the specimen.

[0072] After the temperature of the test sample drops to room temperature and stabilizes, the multifunctional high-voltage capacitance bridge is used again to measure the capacitance and dielectric loss factor of the test sample at 10% of the rated voltage. The capacitance of the test sample after the harmonic temperature rise test is measured to be 1411.02nF, and the dielectric loss factor is 2.32%.

[0073] The test results are: after the temperature of the test piece stabilizes, the temperature rise value of each part does not exceed the limit value, and the capacitance and dielectric loss factor are not much different from the test results before the test. It is considered that the test piece has passed the test. The above is the temperature rise test method of the DC voltage measuring device under harmonics that we implemented. Through this method, the temperature rise characteristics of the DC voltage measuring device under high-order harmonics can be effectively evaluated, and its tolerance performance in the harmonic environment can be examined.

[0074] Therefore, the present invention tests the temperature rise of various parts of the DC voltage measuring device sample under a harmonic voltage environment. The traditional detection method of the DC voltage measuring device does not assess the temperature rise of the DC voltage measuring device under a harmonic environment. In addition, compared with traditional thermocouples or infrared thermal imaging, the use of temperature sensors and optical fiber temperature measurement proposed in the present method can measure the temperature rise of various parts inside the DC voltage measuring device, and the assessment of the temperature rise of the DC voltage measuring device is more comprehensive.

[0075] Exemplary Devices

[0076] Figure 7 1 is a schematic diagram of the structure of a harmonic temperature rise test device for a DC voltage measurement device provided by an exemplary embodiment of the present invention. Figure 7 As shown, the apparatus 700 includes:

[0077] The first measuring module 710 is used to measure the first capacitance and the first dielectric loss factor of the DC voltage measuring device sample at room temperature;

[0078] A fixing module 720, used for fixing the temperature sensor at a plurality of preset structural positions of the DC voltage measuring device test piece;

[0079] The test module 730 is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece using a preset harmonic temperature rise test system, and measure temperature rise data of multiple preset structural positions through a temperature sensor;

[0080] The second measuring module 740 is used to measure the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample after the temperature rise test of the DC voltage measuring device sample is completed;

[0081] The determination module 750 is used to determine the temperature rise test result of the DC voltage measurement device test piece according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance and the second dielectric loss factor.

[0082] Optionally, the test module 730 includes:

[0083] The first measurement submodule is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece using a preset harmonic temperature rise test system, and measure temperature data of multiple preset structural positions through a temperature sensor;

[0084] The second measurement submodule is used to measure the temperature rise data of the multiple preset structural positions when the temperature data of the multiple preset structural positions are stable.

[0085] Optionally, the multiple preset structural positions include: multiple fixed points on the outer surface of the DC voltage measuring device sample, multiple fixed points on the surface of the resistor tube of the DC voltage measuring device sample, and multiple fixed points on the surface of the capacitor tube of the DC voltage measuring device sample.

[0086] Optionally, the second measurement module 740 includes:

[0087] The third measurement submodule is used to measure the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample after the temperature rise test of the DC voltage measuring device sample is completed and the temperature returns to normal temperature and stabilizes.

[0088] Optionally, the determination module 750 includes:

[0089] The determination submodule is used to determine that the temperature rise test of the DC voltage measuring device sample has passed when the temperature rise data does not exceed a preset limit value, and the first error of the first capacitance and the second capacitance and the second error of the first dielectric loss factor and the second dielectric loss factor do not exceed a preset value; otherwise, the temperature rise test of the DC voltage measuring device sample has failed.

[0090] Optionally, the harmonic temperature rise test system includes: a harmonic power supply, a transformer, a capacitive voltage divider and a DC voltage measuring device test piece, wherein

[0091] The harmonic power supply, transformer, capacitive voltage divider and DC voltage measuring device test piece are connected in parallel through copper wires.

[0092] Exemplary Electronic Devices

[0093] Figure 8 This is a structure of an electronic device provided by an exemplary embodiment of the present invention. Figure 8 As shown, the electronic device 80 includes one or more processors 81 and a memory 82 .

[0094] The processor 81 may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0095] The memory 82 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory (cache), etc. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 81 may run the program instructions to implement the methods of the software programs of the various embodiments of the present invention described above and / or other desired functions. In one example, the electronic device may also include: an input device 83 and an output device 84, which are interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0096] In addition, the input device 83 may also include, for example, a keyboard, a mouse, etc.

[0097] The output device 84 can output various information to the outside, and can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto.

[0098] Of course, to simplify, Figure 8 Only some of the components related to the present invention in the electronic device are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, the electronic device may further include any other appropriate components according to specific application conditions.

[0099] Exemplary computer program products and computer-readable storage media

[0100] In addition to the above-mentioned methods and devices, an embodiment of the present invention may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present invention described in the above-mentioned "Exemplary Method" section of this specification.

[0101] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the embodiments of the present invention, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0102] In addition, an embodiment of the present invention may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, enable the processor to execute the steps of the method according to various embodiments of the present invention described in the above “Exemplary Method” section of this specification.

[0103] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, system or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0104] The basic principle of the present invention is described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, strengths, effects, etc. mentioned in the present invention are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. must be possessed by each embodiment of the present invention. In addition, the specific details disclosed above are only for the purpose of illustration and facilitation of understanding, rather than limitation, and the above details do not limit the present invention to being implemented by adopting the above specific details.

[0105] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0106] The block diagrams of the devices, systems, equipment, and systems involved in the present invention are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, systems, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The word "such as" used here refers to the phrase "such as but not limited to", and can be used interchangeably with it.

[0107] The method and system of the present invention may be implemented in many ways. For example, the method and system of the present invention may be implemented by software, hardware, firmware or any combination of software, hardware, firmware. The above order of steps for the method is only for illustration, and the steps of the method of the present invention are not limited to the order specifically described above, unless otherwise specifically stated. In addition, in some embodiments, the present invention may also be implemented as a program recorded in a recording medium, which includes machine-readable instructions for implementing the method according to the present invention. Thus, the present invention also covers a recording medium storing a program for executing the method according to the present invention.

[0108] It should also be noted that in the system, device and method of the present invention, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent schemes of the present invention. The above description of the disclosed aspects is provided to enable any technician in the field to make or use the present invention. Various modifications to these aspects are very obvious to those skilled in the art, and the general principles defined here can be applied to other aspects without departing from the scope of the present invention. Therefore, the present invention is not intended to be limited to the aspects shown here, but in accordance with the widest range consistent with the principles and novel features disclosed here.

[0109] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present invention to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A harmonic temperature rise test method for a DC voltage measuring device, characterized in that: include: Measuring the first capacitance and the first dielectric loss factor of the DC voltage measuring device sample at room temperature; Fixing temperature sensors at a plurality of preset structural positions of the DC voltage measuring device test piece; Using a preset harmonic temperature rise test system to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece, and measuring the temperature rise data of the plurality of preset structural positions by using the temperature sensor; After the temperature rise test of the DC voltage measuring device sample is completed, measuring the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample; A temperature rise test result of the DC voltage measuring device sample is determined according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance, and the second dielectric loss factor.

2. The method according to claim 1, characterized in that A preset harmonic temperature rise test system is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece, and the temperature rise data of the plurality of preset structural positions are measured by the temperature sensor, including: Using a preset harmonic temperature rise test system to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece, and measuring the temperature data of the plurality of preset structural positions through the temperature sensor; The temperature rise data of the plurality of preset structural positions are measured when the temperature data of the plurality of preset structural positions are stable.

3. The method according to claim 1, characterized in that The multiple preset structural positions include: multiple fixed points on the outer surface of the DC voltage measuring device sample, multiple fixed points on the surface of the resistor tube of the DC voltage measuring device sample, and multiple fixed points on the surface of the capacitor tube of the DC voltage measuring device sample.

4. The method according to claim 1, characterized in that: After the temperature rise test of the DC voltage measuring device sample is completed, measuring the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample includes: After the temperature rise test of the DC voltage measuring device sample is completed and the temperature returns to normal temperature and stabilizes, the second capacitance and the second dielectric loss factor of the DC voltage measuring device sample are measured.

5. The method according to claim 1, characterized in that Determining a temperature rise test result of the DC voltage measurement device sample according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance, and the second dielectric loss factor, including: When the temperature rise data does not exceed the preset limit, and the first error of the first capacitance and the second capacitance and the second error of the first dielectric loss factor and the second dielectric loss factor do not exceed the preset value, it is determined that the temperature rise test of the DC voltage measuring device sample has passed; otherwise, the temperature rise test of the DC voltage measuring device sample has failed.

6. The method according to claim 1, characterized in that The harmonic temperature rise test system includes: a harmonic power supply, a transformer, a capacitor voltage divider and a DC voltage measuring device test piece, wherein The harmonic power supply, the transformer, the capacitive voltage divider and the DC voltage measuring device sample are connected in parallel via copper wires.

7. A harmonic temperature rise test device for a DC voltage measuring device, characterized in that: include: A first measuring module, used for measuring a first capacitance and a first dielectric loss factor of a DC voltage measuring device sample at room temperature; A fixing module, used for fixing the temperature sensor at a plurality of preset structural positions of the DC voltage measuring device test piece; A test module, used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece using a preset harmonic temperature rise test system, and measure the temperature rise data of the plurality of preset structural positions through the temperature sensor; A second measuring module is used to measure a second capacitance and a second dielectric loss factor of the DC voltage measuring device sample after the temperature rise test of the DC voltage measuring device sample is completed; A determination module is used to determine a temperature rise test result of the DC voltage measurement device test piece according to the temperature rise data, the first capacitance, the first dielectric loss factor, the second capacitance, and the second dielectric loss factor.

8. The device according to claim 7, characterized in that Test modules include: A first measurement submodule is used to apply a preset maximum harmonic withstand frequency and a corresponding withstand voltage to the DC voltage measurement device test piece using a preset harmonic temperature rise test system, and measure the temperature data of the plurality of preset structural positions through the temperature sensor; The second measurement submodule is used to measure the temperature rise data of the multiple preset structural positions when the temperature data of the multiple preset structural positions are stable.

9. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and the computer program is used to execute the method according to any one of claims 1 to 6.

10. An electronic device, characterized in that: The electronic device comprises: processor; a memory for storing instructions executable by the processor; The processor is used to read the executable instructions from the memory and execute the instructions to implement the method described in any one of claims 1 to 6.

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