A glass carrier-based CPO packaging structure

Abstract

The application relates to the technical field of photoelectric packaging, and discloses a CPO packaging structure based on a glass carrier plate, which comprises a glass carrier plate, an ASIC chip, a silicon optical chip, an electronic chip, a laser element, a positioning socket and a fiber array, the ASIC chip, the silicon optical chip and the positioning socket are all mounted on the glass carrier plate, and the electronic chip and the laser element are arranged on the silicon optical chip; the ASIC chip and the electronic chip are electrically connected with a rewiring layer of the glass carrier plate, and the laser element is optically connected with a waveguide layer of the silicon optical chip; the fiber array is also provided with a plug structure, the plug structure is detachably connected with the positioning socket; the fiber array is also provided with a protruding end, the protruding end is located on a side of the positioning socket away from a fiber body, a first coupling part is arranged on a lower part of the protruding end, the first coupling part is optically connected with the fiber body; a second coupling part is arranged on an upper part of a side of the silicon optical chip close to the positioning socket, the second coupling part is optically connected with the waveguide layer, and the first coupling part and the second coupling part are optically connected in a top-bottom opposite mode.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic packaging, and in particular to a CPO packaging structure based on a glass carrier. Background Art

[0002] Co-packaged optoelectronics (CPO), for short, refers to the co-packaging of switch chips and silicon photonic chips on the same motherboard. As a new optoelectronic integration technology, CPO is widely used in scenarios such as data centers and artificial intelligence, achieving high integration, low signal attenuation, and high transmission efficiency.

[0003] For example, the Chinese invention patent application with application publication number CN117250702A and application publication date 2023.12.19 discloses an optoelectronic co-packaging module and an optoelectronic co-packaging method, which specifically include an interposer, a photonic integrated chip, an electronic integrated chip and an optical fiber array; the interposer includes a mounting groove, a redistribution layer and a redistribution waveguide layer; the photonic integrated chip is installed in the mounting groove, and the photonic integrated chip includes at least one first electrical connection part and at least one optical connection part, and the optical connection part is coupled to the redistribution waveguide layer; the optical fiber array is connected to the redistribution waveguide layer by coupling packaging to realize optical packaging; the electronic integrated chip includes multiple second electrical connection parts, some of the second electrical connection parts are used to electrically connect to the first electrical connection parts, and another part of the second electrical connection parts are used to electrically connect to the redistribution layer to realize circuit packaging.

[0004] Existing optoelectronic co-packaged modules use a coupled packaging approach to connect the fiber array to the redistribution layer of an interposer. However, after the fiber array is coupled and packaged, the structures of the fiber array and the interposer are highly dependent on each other, making it difficult to flexibly swap in and out the fiber array. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that after the optical fiber array is coupled and packaged, the optical fiber array and the intermediate layer have a high degree of structural dependence, making it difficult to meet the requirement of flexible plugging and unplugging of the optical fiber array.

[0006] In order to solve the above technical problems, the present invention provides a technical solution of a CPO packaging structure based on a glass carrier:

[0007] The CPO packaging structure based on a glass carrier includes a glass carrier, an ASIC chip, a silicon photonic chip, an electronic chip, a laser element, a positioning socket, and an optical fiber array. The ASIC chip, the silicon photonic chip, and the positioning socket are all mounted on the glass carrier, and the electronic chip and the laser element are respectively arranged on the silicon photonic chip.

[0008] The glass carrier is provided with a redistribution layer, the ASIC chip and the electronic chip are electrically connected to the redistribution layer, a waveguide layer is provided inside the silicon photonic chip, and the laser element is optically connected to the waveguide layer; the optical fiber array is also equipped with a plug structure, which is detachably connected to the positioning socket;

[0009] The positioning socket is provided with a first guide portion and a first limit portion, and the plug structure is provided with a second guide portion and a second limit portion, the first guide portion and the second guide portion are guided and matched along the length direction of the optical fiber array, and the first limit portion and the second limit portion are limited and matched along the length direction of the optical fiber array;

[0010] The optical fiber array is also provided with a protruding end, which is located on the side of the positioning socket away from the optical fiber body. A first coupling portion is provided at the lower part of the protruding end, and the first coupling portion is optically connected to the optical fiber body; a second coupling portion is provided at the upper part of the side of the silicon photonic chip close to the positioning socket, and the second coupling portion is optically connected to the waveguide layer, and the first coupling portion and the second coupling portion are optically connected relative to each other from top to bottom.

[0011] Furthermore, a first reflection surface is provided inside the protruding end, the first reflection surface is arranged at an angle relative to the length direction of the optical fiber array, and the first reflection surface and the first coupling part are spaced apart; a second reflection surface is also provided inside the silicon photonic chip, the second reflection surface is arranged at an angle relative to the waveguide layer, and the second reflection surface and the second coupling part are spaced apart.

[0012] Furthermore, the ASIC chip, the electronic chip and the positioning socket are respectively arranged on the upper side of the glass carrier, and the redistribution layer is arranged on the bottom side of the glass carrier;

[0013] The glass carrier is provided with glass through holes corresponding to the ASIC chip and the electronic chip respectively, and the silicon photonic chip is provided with silicon through holes corresponding to the electronic chip. The glass through holes and the silicon through holes are filled with conductors, and the conductors are electrically connected between the redistribution layer and the ASIC chip or the electronic chip.

[0014] Furthermore, the positioning socket is a glass structure, the positioning socket is mounted and fixed on the glass carrier, a through slot is provided in the middle of the positioning socket, and the first guide portion and the first limiting portion are respectively arranged on the inner walls of the through slot.

[0015] Furthermore, the through slot includes a first slot section and a second slot section connected along the length direction of the optical fiber array, and the opening width of the first slot section is greater than the opening width of the second slot section;

[0016] The first guide portion is a guide rib arranged on the inner wall of the first slot segment, the first limiting portion is a stop surface arranged between the first slot segment and the second slot segment, and the first limiting portion is arranged perpendicular to the length direction of the optical fiber array.

[0017] Furthermore, the plug structure is wrapped and fixed to the outside of the optical fiber array, the plug structure and the end of the optical fiber array form a convex structure, the second guide portion is a guide groove opened on the outside of the plug structure, and the guide rib is matched with the guide groove in a concave-convex manner;

[0018] The second limiting portion is an abutting surface provided on one end surface of the plug structure, and the abutting surface is arranged perpendicular to the length direction of the optical fiber array.

[0019] Furthermore, the opening width of the first slot section gradually increases in a direction away from the second slot section, and an inclined boss is further provided on the side wall of the first slot section corresponding to the opening width direction;

[0020] The plug structure is further provided with an elastic locking hook on the side wall in the width direction of the optical fiber array. In the plugged state, the elastic locking hook extends into the inner side of the inclined boss along the length direction of the optical fiber array, and the inclined boss is locked with the elastic locking hook.

[0021] Furthermore, a pressing block is installed between the inclined boss and the second groove section, and the pressing block is slidably arranged along the opening width direction of the first groove section. An operating handle is also hinged on the outer side of the plug structure, and the operating handle is connected to the pressing block. The pressing block is used to press and cooperate with the elastic lock hook when unlocking.

[0022] Furthermore, a third guide portion is provided on the inner wall of the second groove section corresponding to the width direction of the opening, and a fourth guide portion is provided on the outer side of the optical fiber array corresponding to the width direction. The third guide portion and the fourth guide portion cooperate to guide along the length direction of the optical fiber array.

[0023] Furthermore, a groove is provided on the glass carrier, and the silicon photonic chip is matched with the groove in a concave-convex manner. The silicon photonic chip also integrates a PD element and an MPD element. The PD element is arranged corresponding to the receiving waveguide of the waveguide layer, and the MPD element is arranged corresponding to the laser element.

[0024] Compared with the prior art, the glass-based CPO packaging structure of the present invention has the following advantages: the glass-based CPO packaging structure adopts a design form of a glass carrier, an ASIC chip, a silicon photonic chip, an electronic chip, a laser element, a positioning socket, an optical fiber array, and a plug structure. The ASIC chip, the silicon photonic chip, and the positioning socket are all mounted on the glass carrier. The ASIC chip and the electronic chip are electrically connected to the redistribution layer of the glass carrier. The ASIC chip and the electronic chip send or receive electrical signals through the redistribution layer. The electronic chip and the laser element are respectively arranged on the silicon photonic chip. A waveguide layer is provided inside the silicon photonic chip. The laser element and the waveguide layer are optically connected. Optical signals are transmitted between the laser element and the optical fiber array through the waveguide layer. The silicon photonic chip can convert optical signals and electrical signals, achieving the purpose of high-speed transmission of photoelectric signal data.

[0025] The optical fiber array is also equipped with a plug structure, which is detachably connected to the positioning socket. The positioning socket is equipped with a first guide portion and a first stop portion, and the plug structure is equipped with a second guide portion and a second stop portion. The first and second guide portions cooperate to accurately install the plug structure in the positioning socket along the length of the optical fiber array. The first and second stop portions cooperate to effectively define the position of the plug structure relative to the positioning socket along the length of the optical fiber array. This not only meets the requirements for flexible insertion and removal between the plug structure and the positioning socket, but also ensures the precise positioning of the plug structure and the optical fiber array on the positioning socket.

[0026] In addition, the optical fiber array is provided with a protruding end, which is located on the side of the positioning socket away from the optical fiber body. A first coupling portion is provided at the bottom of the protruding end, and the first coupling portion is optically connected to the optical fiber body. Correspondingly, a second coupling portion is provided at the upper portion of the side of the silicon photonic chip near the positioning socket, and the second coupling portion is optically connected to the waveguide layer. The protruding end of the optical fiber array is located on the side of the positioning socket away from the optical fiber body, that is, the protruding end and the first coupling portion are cantilevered on the side of the positioning socket. The first coupling portion and the second coupling portion of the silicon photonic chip are vertically opposed and optically connected. The optical receiving path is formed from the optical fiber body, the first coupling portion, the second coupling portion, the waveguide layer, and the PD element. Conversely, the optical emitting path is formed from the laser element, the waveguide layer, the second coupling portion, the first coupling portion, and the optical fiber body. While ensuring the accuracy and reliability of the entire optical transceiver path, the optical fiber array's dependence on the carrier structure is reduced, thereby meeting the requirements for flexible insertion and replacement of the optical fiber array. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 3D schematic diagram of a CPO packaging structure based on a glass carrier in an embodiment of the present invention;

[0028] Figure 21 is a perspective schematic diagram of a positioning socket of a CPO packaging structure based on a glass carrier board according to an embodiment of the present invention;

[0029] Figure 3 2 is a schematic front view of a CPO packaging structure based on a glass carrier according to an embodiment of the present invention;

[0030] Figure 4 This is a schematic three-dimensional diagram of the assembly of the positioning socket and plug structure in an embodiment of the present invention;

[0031] Figure 5 1 is a planar schematic diagram of a waveguide layer of a silicon photonic chip according to an embodiment of the present invention;

[0032] Figure 6 Schematic diagram of the optical path between the optical fiber body of the optical fiber array and the waveguide layer of the silicon photonic chip in an embodiment of the present invention;

[0033] In the figure: 1-glass carrier, 10-rewiring layer, 2-ASIC chip, 3-silicon photonic chip, 30-waveguide layer, 31-second coupling part, 32-second reflection surface, 4-electronic chip, 40-laser element, 41-PD element, 42-MPD element, 5-positioning socket, 50-through groove, 501-first groove section, 502-second groove section, 51-first guide part, 52-first limiting part, 53-inclined boss, 54-top pressure block, 55-operating handle, 56-third guide part, 6-optical fiber array, 60-protruding end, 61-first coupling part, 62-first reflection surface, 7-plug structure, 71-second guide part, 72-second limiting part, 73-elastic locking hook, 74-fourth guide part. DETAILED DESCRIPTION

[0034] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0037] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; they may refer to direct connection or indirect connection through an intermediate medium; they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0038] like Figures 1 to 6 As shown, a CPO packaging structure based on a glass carrier according to an embodiment of the present invention includes a glass carrier 1, an ASIC chip 2, a silicon photonic chip 3, an electronic chip 4, a laser element 40, a positioning socket 5 and an optical fiber array 6. The ASIC chip 2, the silicon photonic chip 3 and the positioning socket 5 are all mounted on the glass carrier 1, and the electronic chip 4 and the laser element 40 are respectively arranged on the silicon photonic chip 3; the glass carrier 1 is provided with a redistribution layer 10, the ASIC chip 2 and the electronic chip 4 are electrically connected to the redistribution layer 10, the silicon photonic chip 3 is provided with a waveguide layer 30 inside, and the laser element 40 is optically conductive with the waveguide layer 30; the optical fiber array 6 is also provided with a plug structure 7, which is detachably connected to the positioning socket 5.

[0039] The positioning socket 5 is provided with a first guide portion 51 and a first limiting portion 52, and the plug structure 7 is provided with a second guide portion 71 and a second limiting portion 72. The first guide portion 51 and the second guide portion 71 guide and cooperate along the length direction of the optical fiber array 6, and the first limiting portion 52 and the second limiting portion 72 limit and cooperate along the length direction of the optical fiber array 6; the optical fiber array 6 is also provided with a protruding end 60, which is located on the side of the positioning socket 5 away from the optical fiber body, and the lower part of the protruding end 60 is provided with a first coupling portion 61, and the first coupling portion 61 is optically connected to the optical fiber body; the upper part of the side of the silicon photonic chip 3 close to the positioning socket 5 is provided with a second coupling portion 31, and the second coupling portion 31 is optically connected to the waveguide layer 30, and the first coupling portion 61 and the second coupling portion 31 are optically connected relative to each other up and down.

[0040] This glass-based CPO packaging structure utilizes a glass carrier 1, an ASIC chip 2, a silicon photonic chip 3, an electronic chip 4, a laser element 40, a positioning socket 5, an optical fiber array 6, and a plug structure 7. The ASIC chip 2, the silicon photonic chip 3, and the positioning socket 5 are all mounted on the glass carrier 1. The ASIC chip 2 and the electronic chip 4 are electrically connected to the redistribution layer 10 of the glass carrier 1. The ASIC chip 2 and the electronic chip 4 transmit or receive electrical signals through the redistribution layer 10. The electronic chip 4 and the laser element 40 are each mounted on the silicon photonic chip 3. A waveguide layer 30 is provided within the silicon photonic chip 3. The laser element 40 is optically conductive with the waveguide layer 30, and optical signals are transmitted between the laser element 40 and the optical fiber array 6 through the waveguide layer 30. The silicon photonic chip 3 can convert optical and electrical signals, achieving the purpose of high-speed transmission of optical and electrical signal data.

[0041] The optical fiber array 6 is also equipped with a plug structure 7, which is detachably connected to the positioning socket 5. The positioning socket 5 is provided with a first guide portion 51 and a first stop portion 52, and the plug structure 7 is provided with a second guide portion 71 and a second stop portion 72. The first guide portion 51 and the second guide portion 71 cooperate to accurately install the plug structure 7 in the positioning socket 5 along the length of the optical fiber array 6. The first stop portion 52 and the second stop portion 72 cooperate to effectively define the position of the plug structure 7 relative to the positioning socket 5 along the length of the optical fiber array 5. This not only meets the requirements for flexible insertion and removal between the plug structure 7 and the positioning socket 5, but also ensures the precise positioning of the plug structure 7 and the optical fiber array 6 on the positioning socket 5.

[0042] In addition, the optical fiber array 6 has a protruding end 60, which is located on the side of the positioning socket 5 away from the optical fiber body. A first coupling portion 61 is provided below the protruding end 60, and the first coupling portion 61 is optically connected to the optical fiber body. Correspondingly, a second coupling portion 31 is provided above the side of the silicon photonic chip 3 near the positioning socket 5, and the second coupling portion 31 is optically connected to the waveguide layer 30. The protruding end 60 of the optical fiber array 6 is located on the side of the positioning socket 5 away from the optical fiber body. That is, the protruding end 60 and the first coupling portion 61 are cantilevered from the side of the positioning socket 5. The first coupling portion 61 is vertically opposite the second coupling portion 31 of the silicon photonic chip 3, forming an optical connection. The optical fiber body, the first coupling part 61, the second coupling part 31, the waveguide layer 30 to the PD element 41 form a light receiving path in sequence. Conversely, the laser element 40, the waveguide layer 30, the second coupling part 31, the first coupling part 61 to the optical fiber body form a light emitting path. While ensuring the accuracy and reliability of the entire optical transceiver path, the dependence of the optical fiber array 6 on the carrier board structure is reduced, thereby meeting the requirements of flexible plugging and unplugging and replacing the optical fiber array 6.

[0043] like Figure 6As shown, the protruding end 60 is internally provided with a first reflective surface 62, which is arranged at an angle relative to the length of the optical fiber array 6 and spaced apart from the first coupling portion 61. The silicon photonic chip 3 also internally provides a second reflective surface 32, which is arranged at an angle relative to the waveguide layer 30 and spaced apart from the second coupling portion 31. The optical signal emitted by the laser element 40 is transmitted through the waveguide layer 30 to the second emitting surface 32, where it is reflected and redirected, ensuring that it continues to travel upward through the second coupling portion 31. The optical signal from below is then directed toward the first coupling portion 61 of the protruding end 60 and reflected again by the first reflective surface 62, ensuring that it is accurately transmitted into the optical fiber body. Accordingly, the optical receiving path from the optical fiber body to the PD element 41 is opposite in direction to the aforementioned optical emitting path.

[0044] In this embodiment, the ASIC chip 2, electronic chip 4, and positioning socket 5 are respectively arranged on the upper side of the glass carrier 1, and the redistribution layer 10 is arranged on the bottom side of the glass carrier 1. Furthermore, through-glass vias (TGLs) are provided on the glass carrier 1 corresponding to the ASIC chip 2 and electronic chip 4, respectively, and a through-silicon via (TSV) is provided on the silicon photonic chip 3 corresponding to the electronic chip 4. The TGLs and TSVs are filled with conductors (not shown) that electrically connect the redistribution layer 10 to the ASIC chip 2 or electronic chip 4. The glass carrier 1 has excellent insulation and anti-warpage properties. Using TGLs and TSVs, vertical conductive connections are achieved between the ASIC chip 2, electronic chip 4, and the redistribution layer 10 on the bottom side of the glass carrier 1.

[0045] As a further preferred embodiment, the positioning socket 5 is constructed of glass and is mounted and fixed to the glass carrier 1. A through slot 50 is defined in the center of the positioning socket 5, and a first guide portion 51 and a first stop portion 52 are respectively disposed on the inner wall of the through slot 50. Specifically, the through slot 50 comprises a first slot section 501 and a second slot section 502 connected along the length of the optical fiber array 6, with the opening width of the first slot section 501 being greater than the opening width of the second slot section 502. The first guide portion 51 is a guide rib disposed on the inner wall of the first slot section 501, and the first stop portion 52 is a stop surface disposed between the first slot section 501 and the second slot section 502, and the first stop portion 52 is arranged perpendicular to the length of the optical fiber array 6.

[0046] Correspondingly, the plug structure 7 is wrapped and fixed outside the fiber optic array 6. The plug structure 7 and the end of the fiber optic array 6 form a convex-shaped structure. The second guiding portion 71 is a guiding groove opened on the outer side of the plug structure 7, and the guiding rib and the guiding groove are in concave-convex fit; the second limiting portion 72 is an abutting surface provided on one end face of the plug structure 7, and the abutting surface is arranged perpendicular to the length direction of the fiber optic array 6. By using the concave-convex fit between the end of the fiber optic array 6 and the second groove segment 502, and the concave-convex fit between the plug structure 7 and the second groove segment 502, the insertion matching degree between the fiber optic array 6 and the positioning socket 5 is improved. Moreover, the guiding rib and the guiding groove cooperate with each other, and the stopping surface of the through groove 50 and the abutting surface of the plug structure 7 cooperate with each other, thereby ensuring the insertion assembly accuracy of the fiber optic array 6.

[0047] It should be noted that the opening width of the first groove segment 501 gradually increases in the direction away from the second groove segment 502, and the side wall of the first groove segment 501 corresponding to the opening width direction is further provided with an inclined boss 53; the plug structure 7 is further provided with an elastic locking hook 73 on the side wall in the width direction of the fiber optic array 6. In the insertion state, the elastic locking hook 73 extends into the inner side of the inclined boss 53 along the length direction of the fiber optic array 6, and the inclined boss 53 and the elastic locking hook 73 are in locking cooperation. The gradually increasing opening width of the first groove segment 501 forms a flared opening, which can guide the plug structure 7 to be smoothly inserted into the first groove segment 501. The elastic locking hook 73 of the plug structure 7 enters the inner side of the inclined boss 53, and the inclined boss 53 plays a locking role on the elastic locking hook 73, ensuring the connection reliability between the plug structure 7 and the fiber optic array 6.

[0048] Moreover, a pressing block 54 is installed between the inclined boss 53 and the second groove segment 502. The pressing block 54 is slidably arranged along the opening width direction of the first groove segment 501. An operating handle 55 is hinged on the outer side of the plug structure 7. The operating handle 55 is connected to the pressing block 54, and the pressing block 54 is used for pressing and cooperating with the elastic locking hook 73 when unlocking. Using the operating handle 55 can drive the pressing block 54 to move towards the inner side in the width direction of the fiber optic array 6. The pressing block 54 presses the elastic locking hook 73 to cause it to undergo compressive deformation, thereby ensuring that the elastic locking hook 73 smoothly disengages and unlocks relative to the inclined boss 53.

[0049] In this embodiment, the inner wall of the second groove segment 502 corresponding to the opening width direction is further provided with a third guiding portion 56, and the outer side of the fiber optic array 6 corresponding to the width direction is provided with a fourth guiding portion 74. The third guiding portion 56 and the fourth guiding portion 74 are in guiding cooperation along the length direction of the fiber optic array 6. On the basis of the first guiding portion 51 and the second guiding portion 71, combined with the third guiding portion 56 of the second groove segment 502 and the fourth guiding portion 74 of the fiber optic array 6, the accuracy of the insertion installation is further improved, thereby ensuring the optical signal coupling accuracy between the fiber optic array 6 and the waveguide layer 30.

[0050] In addition, a recessed groove is formed on the glass substrate 1, and the silicon photonic chip 3 is matched with the recessed groove. The silicon photonic chip 3 also integrates a PD element 41 and an MPD element 42. The PD element 41 is arranged corresponding to the receiving waveguide of the waveguide layer 30, and the MPD element 42 is arranged corresponding to the laser element 40. Accommodating and mounting the silicon photonic chip 3 in the recessed groove of the glass substrate 1 effectively reduces the thickness of the package structure. The silicon photonic chip 3 integrates the PD element 41 and the MPD element 42. The PD element 41, also known as a photodiode, is used to receive optical signals and convert them into electrical signals. The MPD element 42, combined with the laser element 40, is used to convert electrical signals into optical signals, achieving the purpose of high-speed transmission of optical and electrical signals.

[0051] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A CPO packaging structure based on a glass carrier, characterized in that: The device comprises a glass carrier, an ASIC chip, a silicon photonic chip, an electronic chip, a laser element, a positioning socket and an optical fiber array, wherein the ASIC chip, the silicon photonic chip and the positioning socket are all mounted on the glass carrier, and the electronic chip and the laser element are respectively arranged on the silicon photonic chip; The glass carrier is provided with a redistribution layer, the ASIC chip and the electronic chip are electrically connected to the redistribution layer, a waveguide layer is provided inside the silicon photonic chip, and the laser element is optically connected to the waveguide layer; the optical fiber array is also equipped with a plug structure, which is detachably connected to the positioning socket; The positioning socket is provided with a first guide portion and a first limit portion, and the plug structure is provided with a second guide portion and a second limit portion, the first guide portion and the second guide portion are guided and matched along the length direction of the optical fiber array, and the first limit portion and the second limit portion are limited and matched along the length direction of the optical fiber array; The optical fiber array is also provided with a protruding end, which is located on the side of the positioning socket away from the optical fiber body. A first coupling portion is provided at the lower part of the protruding end, and the first coupling portion is optically connected to the optical fiber body; a second coupling portion is provided at the upper part of the side of the silicon photonic chip close to the positioning socket, and the second coupling portion is optically connected to the waveguide layer, and the first coupling portion and the second coupling portion are optically connected relative to each other from top to bottom.

2. The CPO packaging structure based on a glass carrier according to claim 1, characterized in that: A first reflecting surface is provided inside the protruding end, the first reflecting surface is arranged obliquely relative to the length direction of the optical fiber array, and the first reflecting surface and the first coupling part are spaced apart; a second reflecting surface is also provided inside the silicon photonic chip, the second reflecting surface is arranged obliquely relative to the waveguide layer, and the second reflecting surface and the second coupling part are spaced apart.

3. The CPO packaging structure based on a glass carrier according to claim 2, characterized in that: The ASIC chip, the electronic chip and the positioning socket are respectively arranged on the upper side of the glass carrier, and the redistribution layer is arranged on the bottom side of the glass carrier; The glass carrier is provided with glass through holes corresponding to the ASIC chip and the electronic chip respectively, and the silicon photonic chip is provided with silicon through holes corresponding to the electronic chip. The glass through holes and the silicon through holes are filled with conductors, and the conductors are electrically connected between the redistribution layer and the ASIC chip or the electronic chip.

4. The CPO packaging structure based on a glass carrier according to claim 1, characterized in that: The positioning socket is a glass structure and is mounted and fixed on the glass carrier. A through slot is provided in the middle of the positioning socket, and the first guide portion and the first limiting portion are respectively arranged on the inner wall of the through slot.

5. The CPO packaging structure based on a glass carrier according to claim 4, characterized in that: The through slot includes a first slot section and a second slot section connected along the length direction of the optical fiber array, and the opening width of the first slot section is greater than the opening width of the second slot section; The first guide portion is a guide rib arranged on the inner wall of the first slot segment, the first limiting portion is a stop surface arranged between the first slot segment and the second slot segment, and the first limiting portion is arranged perpendicular to the length direction of the optical fiber array.

6. The CPO packaging structure based on a glass carrier according to claim 5, characterized in that: The plug structure is wrapped and fixed to the outside of the optical fiber array, and the plug structure and the end of the optical fiber array form a convex structure. The second guide portion is a guide groove opened on the outside of the plug structure, and the guide rib is matched with the guide groove in a concave-convex manner. The second limiting portion is an abutting surface provided on one end surface of the plug structure, and the abutting surface is arranged perpendicular to the length direction of the optical fiber array.

7. The CPO packaging structure based on a glass carrier according to claim 6, characterized in that: The opening width of the first slot section gradually increases in a direction away from the second slot section, and the side wall of the first slot section corresponding to the opening width direction is further provided with an inclined boss; The plug structure is further provided with an elastic locking hook on the side wall in the width direction of the optical fiber array. In the plugged state, the elastic locking hook extends into the inner side of the inclined boss along the length direction of the optical fiber array, and the inclined boss is locked with the elastic locking hook.

8. The CPO packaging structure based on a glass carrier according to claim 7, characterized in that: A pressing block is also installed between the inclined boss and the second groove section. The pressing block is slidably arranged along the opening width direction of the first groove section. An operating handle is also hinged on the outer side of the plug structure. The operating handle is connected to the pressing block. The pressing block is used to press and cooperate with the elastic lock hook when unlocking.

9. The CPO packaging structure based on a glass carrier according to claim 5, characterized in that: The inner wall of the second groove section corresponding to the width direction of the opening is further provided with a third guide portion, and the outer side of the optical fiber array corresponding to the width direction is provided with a fourth guide portion, and the third guide portion and the fourth guide portion cooperate with each other in guiding along the length direction of the optical fiber array.

10. The CPO packaging structure based on a glass carrier according to claim 1, characterized in that: A groove is provided on the glass carrier, and the silicon photonic chip is matched with the groove in a concave-convex manner. The silicon photonic chip is also integrated with a PD element and an MPD element. The PD element is arranged corresponding to the receiving waveguide of the waveguide layer, and the MPD element is arranged corresponding to the laser element.

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