Method, device and system for controlling semiconductor manufacturing equipment

Abstract

The present invention discloses a method, device and system for controlling semiconductor manufacturing equipment, the method comprising: obtaining control authority of the semiconductor manufacturing equipment when it is determined that the current operating state of the semiconductor manufacturing equipment meets the preset state of the process setting SetUP; sending an alarm reset instruction to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, controlling the setting device of the semiconductor equipment to run to the preset position corresponding to the process setting SetUP; when it is determined that the setting device is in the preset position corresponding to the process setting SetUP, controlling the semiconductor manufacturing equipment to perform the process setting SetUP. In this way, the automatic SetUP of the semiconductor manufacturing equipment is realized, the efficiency of the SetUP of the semiconductor manufacturing equipment is improved, and the production efficiency and stability of the semiconductor manufacturing equipment are further improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method, device and system for controlling semiconductor manufacturing equipment. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the automation level of semiconductor manufacturing equipment has also become higher and higher, including: cleaning equipment, double-sided grinding and polishing equipment (Double Side Polishing, DSP), etching equipment, deposition equipment, etc. Among them, many semiconductor manufacturing equipment require process settings SetUP, for example: SetUP is a very important part of the DSP semiconductor production process. SetUP is used to check and set the gap value between the upper and lower grinding discs of DSP. SetUP can ensure the stability of DSP production of semiconductors such as wafers.

[0003] At present, semiconductor manufacturing equipment needs 1 to 2 SetUPs per day in the process of manufacturing semiconductors, and the process setting SetUP of the semiconductor equipment can usually be triggered by manually pressing buttons or modifying parameter settings. This not only wastes manpower and has low SetUP efficiency, but also the operator may forget to trigger the SetUP, resulting in the scrapping of the generated semiconductors, further wasting resources. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a method, device and system for controlling semiconductor manufacturing equipment. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0005] A first aspect of an embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, comprising:

[0006] When it is determined that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state, the control authority of the semiconductor manufacturing equipment is obtained;

[0007] Send an alarm reset command to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, control the setting device of the semiconductor equipment to run to a preset position corresponding to the process setting SetUP;

[0008] When it is determined that the setting device is in a preset position corresponding to the process setting SetUP, the semiconductor manufacturing equipment is controlled to perform the process setting SetUP.

[0009] A second aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, comprising:

[0010] An acquisition module is configured to acquire control authority of the semiconductor manufacturing equipment when it is determined that the current operation state of the semiconductor manufacturing equipment meets the process setting SetUP preset state;

[0011] The first control module is configured to send an alarm reset instruction to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, control the setting device of the semiconductor manufacturing equipment to run to a preset position corresponding to the process setting SetUP;

[0012] The second control module is configured to control the semiconductor manufacturing equipment to perform the process setting SetUP when it is determined that the setting device is in a preset position corresponding to the process setting SetUP.

[0013] A third aspect of an embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, the device comprising a processor and a memory storing program instructions, the processor being configured to execute the above-mentioned method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0014] A fourth aspect of an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor manufacturing equipment and control equipment, wherein the control equipment comprises: an equipment body; and the above-mentioned device for controlling semiconductor manufacturing equipment is installed on the equipment body.

[0015] Beneficial effects of the present invention:

[0016] In the semiconductor manufacturing process, when it is determined that the current operating state of the semiconductor manufacturing equipment meets the preset state of the process setting SetUP, the control authority of the semiconductor manufacturing equipment can be obtained, and then the setting device of the semiconductor equipment is controlled to run to the preset position corresponding to the process setting SetUP, and then the semiconductor manufacturing equipment is controlled to perform the process setting SetUP, thereby realizing automatic SetUP of the semiconductor manufacturing equipment, which not only improves the efficiency of the SetUP of the semiconductor manufacturing equipment, but also reduces the probability of scrapping semiconductor products due to untimely SetUP, and further improves the production efficiency and stability of the semiconductor manufacturing equipment.

[0017] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0018] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0020] Figure 1 A schematic diagram of a system structure for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0021] Figure 2 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of a system structure for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0023] Figure 4 A schematic flow chart of a method for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of the structure of a semiconductor manufacturing control device provided by an embodiment of the present invention;

[0025] Figure 6 A schematic structural diagram of a semiconductor manufacturing control device provided by an embodiment of the present invention.

[0026] Figure 7 A schematic diagram of a control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0028] With the development of science and technology, the automation level of semiconductor product manufacturing equipment, such as cleaning equipment, double-side grinding and polishing equipment (Double Side Polishing, DSP), etching equipment, deposition equipment, etc., is getting higher and higher. Among them, DSP, etching equipment, etc. all need to perform process setting SetUP. For example, SetUP in DSP can be used to check and set the gap value between the upper and lower grinding discs of DSP to ensure the stability of DSP production of semiconductors such as wafers. In an embodiment of the present invention, in the semiconductor manufacturing process, when it is determined that the current operating state of the semiconductor manufacturing equipment meets the preset state of the process setting SetUP, the control authority of the semiconductor manufacturing equipment can be obtained, and then the setting device of the semiconductor equipment is controlled to run to the preset position corresponding to the process setting SetUP, and then the semiconductor manufacturing equipment is controlled to perform the process setting SetUP, thereby realizing the automatic SetUP of the semiconductor manufacturing equipment, which not only improves the efficiency of the SetUP of the semiconductor manufacturing equipment, but also reduces the probability of semiconductor products being scrapped due to untimely SetUP, and further improves the production efficiency and stability of the semiconductor manufacturing equipment.

[0029] like Figure 1 As shown, a first aspect of an embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, including: semiconductor manufacturing equipment 100, and a control device 200.

[0030] The semiconductor manufacturing equipment 100 may be a DSP, an etching device, a deposition device, etc. The control device may be an Equipment Front End Module (EFEM) at the front end of the DSP, or other devices with control capabilities, such as a desktop computer, a handheld tablet computer, etc.

[0031] The semiconductor manufacturing equipment 100 and the control equipment 200 may be connected by wire or wirelessly and may perform data communication.

[0032] The semiconductor manufacturing equipment 100 can automatically run the corresponding functions, and can also perform the corresponding operations under the control of the control device 200. Since the semiconductor manufacturing equipment 100 can process semiconductor products, for example, the DSP can perform double-sided grinding and polishing on the wafer, in some embodiments, Figure 1 As shown, the system for controlling semiconductor manufacturing equipment may also include: manufacturing auxiliary equipment 300, which can be used to absorb and move semiconductors, and may include: a robotic arm or a robot, etc. Of course, it may also be other equipment used to assist semiconductor production, such as a visual device. The control device 200 may also be connected to the manufacturing auxiliary equipment 300 by wire or wireless, thereby performing data communication.

[0033] In the system for controlling semiconductor manufacturing equipment, the control device 200 can control the semiconductor manufacturing equipment 100, or control the semiconductor manufacturing equipment 100 and the manufacturing auxiliary equipment 300, and automatically implement the process setting SetUP of the semiconductor manufacturing equipment.

[0034] Combination Figure 1 The system for controlling semiconductor manufacturing equipment shown in the figure, the embodiment of the present invention provides a method for controlling semiconductor manufacturing equipment, such as Figure 2 As shown, the process of semiconductor manufacturing equipment control includes:

[0035] Step 201: When it is determined that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state, the control authority of the semiconductor manufacturing equipment is obtained.

[0036] In the process of manufacturing semiconductors, some semiconductor manufacturing equipment needs to be SetUP every day, or some semiconductor manufacturing equipment needs to be SetUP two or three times a day, or some semiconductor manufacturing equipment may need to be SetUP once every two or three days, that is, semiconductor manufacturing equipment needs to be SetUP regularly. Therefore, in some embodiments, the interval duration between each SetUP of the semiconductor manufacturing equipment can be recorded. In this way, when the current SetUP interval duration reaches the preset duration, it can be determined that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state. Alternatively, the current SetUP interval duration reaches the preset duration, which only satisfies a part of the process setting SetUP preset state, and it is necessary to continue to monitor the set process parameter value of the semiconductor manufacturing equipment. Only when the set process parameter value also satisfies the corresponding preset state can it be further determined according to the equipment state of the semiconductor manufacturing equipment that the current operating state of the semiconductor manufacturing equipment satisfies the process setting SetUP preset state, that is, determining that the current operating state of the semiconductor manufacturing equipment satisfies the process setting SetUP preset state includes: when the current SetUP interval duration reaches the preset duration, obtaining the first process parameter value of the semiconductor manufacturing equipment; when the first process parameter value is less than the set parameter value, if the semiconductor manufacturing equipment is in standby state, determining that the current operating state of the semiconductor manufacturing equipment satisfies the process setting SetUP preset state.

[0037] For example: the semiconductor manufacturing equipment is a DSP, which generally requires 1 to 2 SetUPs per day, so the preset duration can be 8, 10, 12, 16, or 18 hours, etc. In this way, the control device, such as the DSP EFEM, can monitor the duration of the DSP's execution of the SetUP interval, wherein the current moment corresponds to the current SetUP interval duration, so that when the current SetUP interval duration reaches 8, 10, 12, 16, or 18 hours, etc., that is, when the preset duration is reached, the DSP EFEM can obtain the current Recipe of the DSP, that is, obtain a process recipe parameter of the DSP, where the first process parameter value can be the current Recipe, if the current Recipe ≤ 40, then the DSP EFEM can continue to obtain the current device state of the semiconductor manufacturing equipment, if the current device state is the standby state, the DSP EFEM determines that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state. Of course, different semiconductor manufacturing equipment may have different setting parameter values, that is, the first process parameter value may also be other process parameters.

[0038] Among them, the preset duration and the set parameter value can be determined according to the performance of the semiconductor manufacturing equipment, the type of process parameters, etc., and can be set through human-computer interaction, data communication, etc. For example: manually set the set parameter value corresponding to the recipe through the touch screen of the DSP and the touch screen of the DSP EFEM. The preset duration can also be manually set through the touch screen of the DSP EFEM, so that after the DSP is started, or after the DSP completes the process setting SetUP each time, the DSP EFEM can start the timer, and the corresponding SetUP interval duration can be obtained through the timer.

[0039] Therefore, in some embodiments, after controlling the semiconductor manufacturing equipment to perform process setting SetUP, the process further includes: clearing the current SetUP interval duration. For example, after determining that the DSP completes the process setting SetUP, the DSP EFEM can clear the recorded current SetUP interval duration, that is, the timer restarts from zero.

[0040] The control device can communicate with the semiconductor manufacturing equipment, and therefore can obtain the current equipment status of the semiconductor manufacturing equipment, for example, the opening and closing status of the grinding disk on the DSP. Thus, the DSP EFEM can determine whether the DSP is in the standby state, that is, whether the current equipment state is the standby state, based on the current DSP wafer on-site status, the current opening and closing status of the grinding disk on the DSP, and the current operating logic state. Only when it is determined that the DSP is in the standby state can it be determined that the current operating state of the DSP meets the process setting SetUP preset state.

[0041] Semiconductor manufacturing equipment may also be an intelligent device that can perform multiple functions, for example, a DSP can control multiple components to operate. In the embodiment of the present invention, during the process setting SetUP, the control device needs to have the control authority of the semiconductor manufacturing equipment. Therefore, when it is determined that the current operating state of the semiconductor manufacturing equipment meets the preset state of the process setting SetUP, the control device obtains the control authority of the semiconductor manufacturing equipment.

[0042] In some embodiments, the DSP EFEM control authority signal output point is connected to the DSP control authority switching relay coil, so that the DSP EFEM sends a control authority acquisition signal to the DSP, and the DSP control authority switching relay coil is energized, so that the normally open point of the relay is closed and the normally closed point is opened, and the DSP control authority is switched to the DSP EFEM, and the DSP EFEM obtains the control authority of the semiconductor manufacturing equipment.

[0043] Step 202: Send an alarm reset instruction to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, control the setting device of the semiconductor manufacturing equipment to run to a preset position corresponding to the process setting SetUP.

[0044] After the control device obtains the control authority of the semiconductor manufacturing equipment, it needs to determine whether the semiconductor manufacturing equipment can operate safely. Therefore, an alarm reset instruction can be sent to the semiconductor manufacturing equipment. In this way, when it is determined that the semiconductor manufacturing equipment has no alarm information, the semiconductor manufacturing equipment can be controlled to perform preparatory operation corresponding to the process setting SetUP.

[0045] like Figure 1 In the system shown, manufacturing auxiliary equipment may also be involved in the semiconductor manufacturing equipment during the semiconductor processing operation. Therefore, determining whether the semiconductor manufacturing equipment can operate safely may also include: determining whether the manufacturing auxiliary equipment can also operate safely. Thus, in some embodiments, sending an alarm reset instruction to the semiconductor manufacturing equipment includes: obtaining current semiconductor presence information when it is determined that the manufacturing auxiliary equipment is away from the set area of ​​the semiconductor manufacturing equipment; and sending an alarm reset instruction to the semiconductor manufacturing equipment when the current semiconductor presence information includes information that there is no semiconductor in the set processing position.

[0046] For example: the manufacturing auxiliary equipment corresponding to the DSP includes: robot 1 and robot 2. Therefore, the DSP EFEM determines whether robot 1 and robot 2 leave the set area of ​​the DSP, wherein robot 1 and robot 2 determine the position of the robot based on the current coordinate position detected by the position sensor. When robot 1 and robot 2 leave the coordinate position range corresponding to the set area of ​​the DSP, they will send safety signals of robot 1 and robot 2 leaving the DSP to the DSP EFEM respectively, so that the DSP EFEM can determine that robot 1 and robot 2 leave the set area of ​​the DSP.

[0047] The DSP EFEM can also record the DSP's wafer presence information in the memory. Similarly, the current moment corresponds to the current semiconductor presence information. Every time a wafer is placed on the DSP's lower grinding plate, the DSP EFEM will record the presence information of a wafer. Every time a wafer is taken from the DSP's lower grinding plate, the DSP EFEM will also delete the presence information of a wafer. Placing wafers on the DSP and taking wafers from the DSP can be executed by the DSP EFEM controlling the robot 1, that is, the control device can control the manufacturing auxiliary equipment to perform corresponding operations.

[0048] Therefore, if the current semiconductor presence information recorded by the control device includes information that there is no semiconductor at the set processing position, the control device can send an alarm reset instruction to the semiconductor manufacturing equipment.

[0049] Similarly, taking DSP as an example, the alarm reset instruction sent by DSP EFEM can be transmitted by the connecting line between the IO output point of DSP EFEM and the DSPIO input point; and through the connecting line between IO input point 1 of DSP EFEM and DSP IO output point 1, when no alarm information is received, the semiconductor manufacturing equipment can be controlled to perform preparatory operation corresponding to the process setting SetUP, including: controlling the setting device of the semiconductor manufacturing equipment to run to the preset position corresponding to the process setting SetUP.

[0050] Taking DSP as an example, DSP includes multiple devices, such as: upper grinding disk, lower grinding disk, etc. In some embodiments, controlling the setting device of the semiconductor manufacturing equipment to run to the preset position corresponding to the process setting SetUP includes: sending an upper grinding disk rotation instruction to the semiconductor manufacturing equipment, so that the upper grinding disk rotates until it reaches the first rotation position; upon receiving the rotation position information sent by the semiconductor manufacturing equipment, sending an upper grinding disk descending instruction to the semiconductor manufacturing equipment, so that the upper grinding disk descends until it reaches the first descending position.

[0051] DSP EFEM sends a command for rotating the upper grinding disk to DSP, and the command can be transmitted through the connection line between IO output point 2 of DSP EFEM and IO input point 2 of DSP EFEM. After DSP receives the command for rotating the upper grinding disk, the upper grinding disk of DSP starts to perform the rotating action and keeps executing it until the upper grinding disk of DSP is completely rotated back into place, that is, it reaches the first rotating position. After the upper grinding disk is rotated back into place, the upper grinding disk rotation back into place signal can be obtained through the rotation back into place sensor of DSP, and then it can be transmitted to DSP EFEM through the connection line between IO input point 3 of DSP EFEM and IO output point 3 of DSP EFEM. Thus, DSP EFEM sends a command for lowering the upper grinding disk, and the command can be transmitted through the connection line between IO output point 4 of DSP EFEM and IO input point 4 of DSP EFEM. After DSP receives the command for lowering the upper grinding disk, DSP starts to execute the action for lowering the upper grinding disk and keeps executing it until it is lowered into place, that is, it reaches the first lowering position.

[0052] Of course, different semiconductor manufacturing equipment has different preparatory operations corresponding to the process setting SetUP. That is, in this step, when it is determined that the semiconductor manufacturing equipment has no alarm information, the control device controls the setting device of the semiconductor manufacturing equipment to run to the preset position corresponding to the process setting SetUP, thereby completing the corresponding preparatory work.

[0053] Step 203: When it is determined that the setting device is in a preset position corresponding to the process setting SetUP, control the semiconductor manufacturing equipment to perform the process setting SetUP.

[0054] After the setting device of the semiconductor manufacturing equipment runs to the preset position corresponding to the process setting SetUP, it can send the arrival information to the control device, so that the control device can determine that the setting device is in the preset position corresponding to the process setting SetUP, and the semiconductor manufacturing equipment can perform the process setting SetUP.

[0055] Different semiconductor manufacturing equipment has different corresponding process settings SetUP. For example, when DSP executes SetUP, DSP starts to initialize the position of the upper grinding disc of DSP, so that the gap value between the upper grinding disc and the lower grinding disc is the set standard value, and then calibrates the gap value between the upper grinding disc and the lower grinding disc. The gap between the upper grinding disc and the lower grinding disc maintained during DSP production is the gap value after SetUP.

[0056] It can be seen that in the embodiments of the present invention, in the semiconductor manufacturing process, when it is determined that the current operating state of the semiconductor manufacturing equipment satisfies the preset state of the process setting SetUP, the control authority of the semiconductor manufacturing equipment can be obtained, and then the setting device of the semiconductor equipment is controlled to run to the preset position corresponding to the process setting SetUP, and then the semiconductor manufacturing equipment is controlled to perform the process setting SetUP, thereby realizing automatic SetUP of the semiconductor manufacturing equipment, which not only improves the efficiency of the SetUP of the semiconductor manufacturing equipment, but also reduces the probability of scrapping semiconductor products due to untimely SetUP, and further improves the production efficiency and stability of the semiconductor manufacturing equipment.

[0057] Of course, after the semiconductor manufacturing equipment completes the SetUP, it can also send a corresponding execution completion signal to the control device. That is, in some embodiments, after controlling the semiconductor manufacturing equipment to perform the process setting SetUP, it also includes: upon receiving the SetUP execution completion signal sent by the semiconductor manufacturing equipment, sending a stop SetUP instruction to the semiconductor manufacturing equipment to control the setting device of the semiconductor equipment to run to the processing position.

[0058] Because the setting components of the semiconductor equipment may have moved to the first rotation position or the first descending position before the SetUP is performed, the positions of these setting components need to be restored after the semiconductor manufacturing equipment completes the SetUP.

[0059] In some embodiments, controlling the setting device of the semiconductor equipment to run to the processing position includes: sending a stop SetUP command to the semiconductor manufacturing equipment, so that the upper grinding disk moves up until it reaches the first processing position, and then rotates out until it reaches the second processing position; receiving the processing position recovery information sent by the semiconductor manufacturing equipment.

[0060] For example: after the DSP completes the SetUP execution, it will output a signal indicating that the SetUP execution is completed. This signal can be transmitted to the DSP EFEM through the connection line between the IO input point 5 of the DSPEFEM and the IO output point 5 of the DSP. As a result, the DSP EFEM sends a stop SetUP instruction, which is transmitted to the DSP through the connection line between the IO output point 6 of the DSP EFEM and the IO input point 6 of the DSP. Then, the grinding disc on the DSP rises and immediately rotates out after rising to the right position, that is, it first rises to the first processing position and then rotates out. After the upper grinding disc rotates out to the right position, that is, after reaching the second processing position, the DSP EFEM can receive the signal indicating that the upper grinding disc on the DSP rotates out to the right position, that is, it receives the processing position recovery information. As a result, the DSP EFEM ends the SetUP process.

[0061] To proceed to the next cycle of the SetUP control process, of course, in some embodiments, the current SetUP interval duration may also be cleared to zero, which may include: clearing a timer.

[0062] The following is an example of a specific process for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention.

[0063] like Figure 3 As shown, the system for controlling semiconductor manufacturing equipment may include: DSP310, DSP EFEM320, and a first robot 330 and a second robot 340, wherein the IO port of EFEM320 can be connected to the corresponding IO port of DSP310 respectively, and the IO port of EFEM320 can also be connected to the corresponding interface of the first robot 330 and the second robot 340.

[0064] That is, in this embodiment, the conductor manufacturing device is DSP310, the control device may be DSP EFEM320, and the manufacturing auxiliary device may be the first robot 330 and the second robot 340. The preset time may be 12 hours, and the set parameter value may be 40.

[0065] like Figure 4 As shown, the process of semiconductor manufacturing equipment control may include:

[0066] Step 401: DSP EFEM and DSP start running.

[0067] Step 402: DSP EFEM determines whether the current SetUP interval duration reaches 12 hours. If yes, execute step 403; otherwise, return to step 402.

[0068] Step 403: DSP EFEM determines whether the current Recipe of DSP ≤ 40 is established. If yes, execute step 404; otherwise, return to step 402.

[0069] Step 404: DSP EFEM determines whether the current device state of DSP is the standby state. If yes, execute step 405; otherwise, return to step 402.

[0070] The current device status of the DSP can be determined based on the wafer status, the opening and closing status of the grinding disk on the DSP, the logical status of the DSP EFEM program, etc.

[0071] Step 405: The DSP EFEM obtains the control authority of the DSP.

[0072] Among them, the DSP EFEM control authority signal output point is connected to the DSP control authority switching relay coil, so that the DSP EFEM sends a control authority acquisition signal to the DSP, and the DSP control authority switching relay coil can be energized, so that the normally open point of the relay is closed and the normally closed point is opened, and the DSP control authority is switched to the DSP EFEM, and the DSP EFEM obtains the control authority of the semiconductor manufacturing equipment.

[0073] Step 406: The DSP EFEM determines whether it has received the safety signal information sent by the first robot and the second robot. If so, execute step 407; otherwise, return to step 402.

[0074] Step 407: The DSP EFEM determines whether the current wafer presence information includes that there is no wafer on the DSP lower grinding plate. If yes, execute step 408; otherwise, return to step 402.

[0075] Step 408: DSP EFEM sends an alarm reset instruction to DSP.

[0076] Step 409: Does the DSP EFEM receive the alarm information sent by the DSP? If so, return to step 408; otherwise, execute step 410.

[0077] If DSP EFEM receives alarm information sent by DSP, it can perform corresponding processing manually. After the processing is completed, DSP EFEM sends an alarm reset instruction to DSP, and then DSP EFEM will not receive alarm information sent by DSP.

[0078] Step 410: DSP EFEM sends an upper grinding disc rotation instruction to DSP, so that the upper grinding disc rotates until it reaches the first rotation position.

[0079] Step 411: upon receiving the rotation-back-to-position information sent by the DSP, the DSP EFEM sends an upper grinding disc descending instruction to the DSP, so that the upper grinding disc descends until it reaches the first descending position.

[0080] Step 412: After the DSP EFEM receives the drop-in-place information sent by the DSP, the DSP is enabled to execute SetUP.

[0081] DSP starts to initialize the position of the upper grinding disc of DSP, making the gap value between the upper grinding disc and the lower grinding disc the set standard value, and then calibrates the gap value between the upper grinding disc and the lower grinding disc. The gap between the upper grinding disc and the lower grinding disc maintained during DSP production is the gap value after SetUP.

[0082] Step 413: DSP EFEM determines whether it has received the SetUP execution completion signal sent by DSP. If so, execute step 414; otherwise, return to step 413.

[0083] After DSP completes SetUP, it sends a SetUP execution completion signal to DSP EFEM.

[0084] Step 414: DSP EFEM sends a stop SetUP instruction to DSP, so that the upper grinding disc of DSP performs an ascending operation until it reaches the first processing position and then performs a rotating operation.

[0085] Step 415: DSP EFEM determines whether it has received the rotation-out-to-position signal sent by DSP. If so, execute step 416; otherwise, return to step 415.

[0086] Step 416 : DSP EFEM clears the current SetUP interval duration and returns to step 402 .

[0087] It can be seen that in this embodiment, during the wafer manufacturing process, when it is determined that the current operating state of the DSP satisfies the preset state of the process setting SetUP, the DSP EFEM can obtain the control authority of the DSP, and then control the setting device of the DSP to run to the preset position corresponding to the process setting SetUP, and then control the DSP to perform the process setting SetUP, thereby realizing automatic SetUP of the DSP, which not only improves the efficiency of the SetUP of the DSP, but also reduces the probability of wafer scrapping due to untimely SetUP, and further improves the production efficiency and stability of the DSP.

[0088] According to the above-mentioned process of semiconductor manufacturing control, a device for controlling semiconductor manufacturing equipment can be constructed. Figure 5 A device for controlling semiconductor manufacturing equipment provided by an embodiment of the present invention can be applied to a control device for a semiconductor manufacturing equipment control system, such as Figure 5 As shown, the device 500 includes: an acquisition module 510 , a first control module 520 and a second control module 530 .

[0089] The acquisition module 510 is configured to acquire the control authority of the semiconductor manufacturing equipment when it is determined that the current operation state of the semiconductor manufacturing equipment meets the preset state of the process setting SetUP.

[0090] The first control module 520 is configured to send an alarm reset instruction to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, control the setting device of the semiconductor manufacturing equipment to run to a preset position corresponding to the process setting SetUP.

[0091] The second control module 530 is configured to control the semiconductor manufacturing equipment to perform the process setting SetUP when it is determined that the setting device is in a preset position corresponding to the process setting SetUP.

[0092] In some embodiments, the apparatus further comprises:

[0093] The state determination module is configured to obtain the first process parameter value of the semiconductor manufacturing equipment when the current SetUP interval duration reaches a preset duration; when the first process parameter value is less than the set parameter value, if the semiconductor manufacturing equipment is in standby state, determine that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state.

[0094] In some embodiments, the first control module 520 includes:

[0095] an auxiliary determination unit configured to obtain current semiconductor presence information when determining that the manufacturing auxiliary equipment is in a set area away from the semiconductor manufacturing equipment;

[0096] The reset sending unit is configured to send an alarm reset instruction to the semiconductor manufacturing equipment when the current semiconductor presence information includes information that there is no semiconductor at the set processing position.

[0097] In some embodiments, the first control module 520 includes:

[0098] The rotation control unit is configured to send an upper grinding disc rotation instruction to the semiconductor manufacturing equipment, so that the upper grinding disc rotates until it reaches a first rotation position.

[0099] The descent control unit is configured to send an upper grinding disc descent instruction to the semiconductor manufacturing equipment upon receiving the rotation back into position information sent by the semiconductor manufacturing equipment, so that the upper grinding disc descends until it reaches the first descending position.

[0100] In some embodiments, it also includes:

[0101] The third control module is configured to send a SetUP stop instruction to the semiconductor manufacturing equipment when receiving a SetUP execution completion signal sent by the semiconductor manufacturing equipment, so as to control the setting device of the semiconductor equipment to run to the processing position.

[0102] In some embodiments, the third control module is specifically configured to send a stop SetUP command to the semiconductor manufacturing equipment, so that the upper grinding disc moves upward until it reaches the first processing position, and then rotates out until it reaches the second processing position; and receives the processing position recovery information sent by the semiconductor manufacturing equipment.

[0103] In some embodiments, it also includes:

[0104] A clearing module is configured to clear the current SetUP interval duration to zero.

[0105] It can be seen that in the embodiment of the present invention, in the semiconductor manufacturing process, when it is determined that the current operating state of the semiconductor manufacturing equipment satisfies the preset state of the process setting SetUP, the device for controlling the semiconductor manufacturing equipment can obtain the control authority of the semiconductor manufacturing equipment, and then control the setting device of the semiconductor equipment to run to the preset position corresponding to the process setting SetUP, and then control the semiconductor manufacturing equipment to perform the process setting SetUP, thereby realizing automatic SetUP of the semiconductor manufacturing equipment, which not only improves the efficiency of the SetUP of the semiconductor manufacturing equipment, but also reduces the probability of scrapping semiconductor products due to untimely SetUP, and further improves the production efficiency and stability of the semiconductor manufacturing equipment.

[0106] Combination Figure 6 , an embodiment of the present invention provides a device 600 for controlling semiconductor manufacturing equipment, comprising:

[0107] The processor 1000 and the memory 1001 may also include a communication interface 1002 and a bus 1003. The processor 1000, the communication interface 1002, and the memory 1001 may communicate with each other through the bus 1003. The communication interface 1002 may be used for information transmission. The processor 1000 may call the logic instructions in the memory 1001 to execute the method for controlling semiconductor manufacturing equipment of the above embodiment.

[0108] In addition, the logic instructions in the above-mentioned memory 1001 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0109] The memory 1001 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present invention. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, implements the method for controlling semiconductor manufacturing equipment in the above method embodiment.

[0110] The memory 1001 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include a high-speed random access memory and may also include a non-volatile memory.

[0111] An embodiment of the present invention provides an apparatus for controlling semiconductor manufacturing equipment, comprising: a processor and a memory storing program instructions, wherein the processor is configured to execute a method for controlling semiconductor manufacturing equipment when executing the program instructions.

[0112] An embodiment of the present invention provides a storage medium storing program instructions, which, when run, execute the above-mentioned method for controlling semiconductor manufacturing equipment.

[0113] The embodiment of the present invention provides a system for controlling semiconductor manufacturing equipment, comprising: semiconductor manufacturing equipment and control equipment, Figure 7 , the control device includes: an equipment body 700; and the above-mentioned device 500 (600) for controlling semiconductor manufacturing equipment. The device 500 (600) for controlling semiconductor manufacturing equipment is installed in the equipment body. The installation relationship described here is not limited to placement inside the product, but also includes installation connections with other components of the product, including but not limited to physical connections, electrical connections or signal transmission connections. It can be understood by those skilled in the art that the device 500 (600) for controlling semiconductor manufacturing equipment can be adapted to a feasible equipment body, thereby realizing other feasible embodiments.

[0114] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0115] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0116] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0117] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for controlling semiconductor manufacturing equipment, characterized in that: include: When it is determined that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state, the control authority of the semiconductor manufacturing equipment is obtained; Send an alarm reset command to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, control the setting device of the semiconductor manufacturing equipment to run to a preset position corresponding to the process setting SetUP; When it is determined that the setting device is in a preset position corresponding to the process setting SetUP, controlling the semiconductor manufacturing equipment to perform the process setting SetUP; Wherein, determining that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state includes: When the current SetUP interval duration reaches a preset duration, obtaining a first process parameter value of the semiconductor manufacturing equipment; In the case where the first process parameter value is less than the set parameter value, if the semiconductor manufacturing equipment is in a standby state, it is determined that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state.

2. The method according to claim 1, characterized in that After the semiconductor manufacturing equipment is controlled to perform process setting SetUP, the method further includes: Clears the current SetUP interval duration to zero.

3. The method according to claim 1, characterized in that The sending of an alarm reset instruction to the semiconductor manufacturing equipment comprises: When it is determined that the manufacturing auxiliary equipment is in a set area away from the semiconductor manufacturing equipment, obtaining current semiconductor presence information; When the current semiconductor presence information includes information that there is no semiconductor at the set processing position, an alarm reset instruction is sent to the semiconductor manufacturing equipment.

4. The method according to claim 1, characterized in that The control device for controlling the semiconductor manufacturing equipment to run to a preset position corresponding to the process setting SetUP includes: Sending an upper grinding disc rotation instruction to the semiconductor manufacturing equipment so that the upper grinding disc rotates until it reaches a first rotation position; When receiving the rotation-back-to-position information sent by the semiconductor manufacturing equipment, an upper grinding disc descending instruction is sent to the semiconductor manufacturing equipment, so that the upper grinding disc descends until it reaches the first descending position.

5. The method according to any one of claims 1 to 4, characterized in that: After the semiconductor manufacturing equipment is controlled to perform process setting SetUP, the method further includes: When a SetUP execution completion signal is received from the semiconductor manufacturing equipment, a SetUP stop instruction is sent to the semiconductor manufacturing equipment to control the setting device of the semiconductor equipment to run to the processing position.

6. The method according to claim 5, characterized in that The controlling device of the semiconductor device to move to the processing position comprises: Sending a stop SetUP command to the semiconductor manufacturing equipment, so that the upper grinding disc is moved upward until it reaches the first processing position, and then rotated out until it reaches the second processing position; Receive processing position recovery information sent by semiconductor manufacturing equipment.

7. A device for controlling semiconductor manufacturing equipment, characterized in that: include: An acquisition module is configured to acquire control authority of the semiconductor manufacturing equipment when it is determined that the current operation state of the semiconductor manufacturing equipment meets the process setting SetUP preset state; The first control module is configured to send an alarm reset instruction to the semiconductor manufacturing equipment, and when it is determined that the semiconductor manufacturing equipment has no alarm information, control the setting device of the semiconductor manufacturing equipment to run to a preset position corresponding to the process setting SetUP; A second control module is configured to control the semiconductor manufacturing equipment to perform the process setting SetUP when determining that the setting device is in a preset position corresponding to the process setting SetUP; It also includes: a state determination module configured to obtain a first process parameter value of the semiconductor manufacturing equipment when the current SetUP interval duration reaches a preset duration; In the case where the first process parameter value is less than the set parameter value, if the semiconductor manufacturing equipment is in a standby state, it is determined that the current operating state of the semiconductor manufacturing equipment meets the process setting SetUP preset state.

8. A device for controlling semiconductor manufacturing equipment, the device comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to perform the method for controlling semiconductor manufacturing equipment according to claims 1-6 when executing the program instructions.

9. A system for controlling semiconductor manufacturing equipment, characterized in that: include: Semiconductor manufacturing equipment and control equipment, wherein the control equipment includes: Equipment body; The device for controlling semiconductor manufacturing equipment according to claim 7 or 8 is installed in the equipment body.

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