A heat sink for server memory and a method of mounting and dismounting the same

Abstract

The application relates to a heat dissipator for a server memory and a mounting and dismounting method thereof, which is applied to a memory bank. The heat dissipator comprises a uniform temperature plate, a clamp and a heat dissipation component. The uniform temperature plate is connected to the outer side of the memory bank. The clamp comprises a tongue piece and at least two clamping plates. The inner sides of the at least two clamping plates are respectively movably abutted to the outer sides of two sides of the uniform temperature plate. One side of the tongue piece is connected to the clamping plate. The tongue piece is arranged in a spaced mode with the uniform temperature plate. The heat dissipation component comprises a heat dissipation pipe and a heat dissipation fin. One end of the heat dissipation pipe is connected to the heat dissipation fin. The two sides of the end of the heat dissipation pipe, which is away from the heat dissipation fin, are respectively movably abutted to the uniform temperature plate and the tongue piece. The memory heat dissipator with the self-locking structure can realize self-locking of the heat pipe, balance the system air resistance and improve the heat dissipation effect.

Description

Technical Field

[0001] This invention relates to heat sinks for server memory and methods for their installation and removal, belonging to the field of servers. Background Technology

[0002] With the continuous upgrading of server and memory technologies, the power consumption and quantity of memory are increasing, making the need for heat dissipation solutions for high-power and high-density memory urgent. However, at present, because memory is generally installed vertically side by side on the motherboard, memory heat dissipation solutions suffer from problems such as limited heat dissipation space, high air resistance between memory modules, inability of heat pipes to be tightly attached to the heat source, and difficulty in fixing the heat sink.

[0003] With the iterative upgrades of servers, the number of memory modules installed is also increasing. However, the small gaps between memory modules make it impossible to directly design heatsinks, and fixing memory heatsinks is a major obstacle to heat dissipation. Furthermore, the standard height of memory modules is typically 31.25mm, which usually results in less fluid resistance above the memory module than the internal flow resistance, also contributing to heat dissipation. Therefore, memory heat dissipation design has become a key breakthrough for improving memory performance. Summary of the Invention

[0004] This invention provides a heat sink for server memory and a method for its installation and removal, aiming to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a heat sink for server memory and a method for its installation and removal, employing a memory heat sink with a self-locking structure to achieve self-locking heat pipes while balancing system airflow resistance and improving heat dissipation.

[0005] The technical solution of this invention relates, in one aspect, to a heat sink for server memory, applied to a memory module, comprising:

[0006] A heat spreader is connected to the outside of the memory module;

[0007] The clamp includes a tongue and at least two clamping plates, the inner sides of the at least two clamping plates being movably abutting against the outer sides of the two sides of the heat exchange plate; one side of the tongue is connected to the clamping plate, and the tongue and the heat exchange plate are spaced apart.

[0008] A heat dissipation assembly includes a heat dissipation pipe and a heat dissipation fin, with one end of the heat dissipation pipe connected to the heat dissipation fin; the two sides of the end of the heat dissipation pipe away from the heat dissipation fin are respectively movably abutting against the heat spreader and the tongue.

[0009] Furthermore, it also includes a heat-conducting sheet, which is disposed between the heat spreader and the memory module.

[0010] Furthermore, the clamp is provided with a connection port, the tongue is connected to the inner wall of the connection port, and the tongue covers the connection port.

[0011] Furthermore, the heat dissipation assembly also includes a substrate, the heat sink is disposed above the substrate, the heat dissipation pipe protrudes below the substrate, and the substrate is provided with a buckle for connecting the clamp.

[0012] Furthermore, the heat dissipation assembly also includes a pin, the tongue is provided with a tongue wing, and the pin is provided with a groove for accommodating the tongue wing.

[0013] Furthermore, the pin is provided with a pin head, and the clamp is provided with a slot for accommodating the pin head.

[0014] Furthermore, the temperature equalization plate is provided with a sliding buckle, and the clamping plate is provided with a crack-preventing opening for limiting the sliding buckle.

[0015] Furthermore, the side of the clamp away from the heat dissipation component is tilted inward.

[0016] Another aspect of the technical solution of the present invention relates to an installation method for a heat sink for server memory, applicable to the heat sink for server memory described in the above embodiments; the installation method includes the following steps:

[0017] S110. Attach the heat spreader to both sides of the memory module;

[0018] S120. Insert the memory module with the heat spreader between the two clamps;

[0019] S130. Insert the heat pipe between the tongue and the heat spreader.

[0020] Another aspect of the technical solution of the present invention is a method for disassembling a heat sink for server memory, applied to the heat sink for server memory described in the above embodiments; the disassembly method includes the following steps:

[0021] S210. Apply force to pull the heat dissipation component away from the clamp to disengage it from the clamp.

[0022] S220. Apply force to pull the clamp away from the memory module to detach the clamp from the memory module;

[0023] S230, detach the heat spreader from the memory module.

[0024] The beneficial effects of this invention are as follows.

[0025] The present invention relates to a heat sink for server memory and its installation and disassembly method. In order to solve the problems of difficult heat dissipation of memory and the problem of heat pipes being in close contact with heat sources, a memory heat sink designed for high power consumption and high density memory is provided that can both self-lock heat pipes and balance system air resistance, thereby improving heat dissipation effect.

[0026] The heat sink for server memory of the present invention has a clamp that not only has a self-locking function for easy disassembly, but also plays a connecting role. The clamp, through the cooperation of the clamp plate and the tongue, allows the clamp to be detachably connected to the heat dissipation plate on both sides of the memory module, and to the heat dissipation component, so that the heat pipe is tightly attached to the heat dissipation plate. At the same time, the heat dissipation plate can be set on the outside of the memory module, so that for the tightly arranged memory modules, the heat sink of the present invention can be detachably fixed to the memory module and achieve a tight fit between the heat sink and the memory module. At the same time, it can make full use of the outer space of the memory module for heat dissipation, which solves the problems of limited heat dissipation space of existing memory modules, difficulty in fixing the heat sink, poor air circulation caused by narrow spacing between multiple memory modules, and the problem that the heat sink cannot be tightly attached to the memory module, and can effectively improve the heat dissipation effect of server memory modules. Attached Figure Description

[0027] Figure 1 This is a side view of a heat sink containing a memory module according to an embodiment of the present invention.

[0028] Figure 2 This is a side view of a heatsink without memory modules according to an embodiment of the present invention.

[0029] Figure 3 This is an exploded front view of a heat sink according to an embodiment of the present invention.

[0030] Figure 4 This is a front view of a heat sink according to an embodiment of the present invention.

[0031] Figure 5 This is a schematic diagram of the fixture according to an embodiment of the present invention.

[0032] Figure 6 This is a top view schematic diagram of the fixture according to an embodiment of the present invention.

[0033] Figure 7 This is a schematic diagram of the structure of a heat dissipation component according to an embodiment of the present invention.

[0034] Figure 8 This is a schematic diagram of the structure of a heat spreader according to an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Heat spreader; 110. Sliding clip; 120. Recess;

[0037] 200. Clamp; 210. Tongue; 211. Tongue wing; 212. Flat plate; 213. Arc; 220. Clamping plate; 221. Connecting port; 222. Clamping part; 223. Connecting part; 224. Slot; 225. Crack prevention opening; 230. Connecting plate; 231. Bayonet;

[0038] 300. Heat dissipation component; 310. Heat pipe; 320. Heat sink; 330. Base plate; 331. Clip; 340. Pin; 341. Pin body; 342. Pin head; 344. Groove;

[0039] 400, heat-conducting sheet; 500, memory module. Detailed Implementation

[0040] The following will provide a clear and complete description of the concept, specific structure, and technical effects of the present invention in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of the present invention. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0041] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," "right," "top," and "bottom" used in this invention are only relative to the relative positional relationships of the various components of the invention in the accompanying drawings.

[0042] Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and not for limiting the invention. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various elements, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from one another. For example, without departing from the scope of this disclosure, a first element may also be referred to as a second element, and similarly, a second element may also be referred to as a first element.

[0044] See Figures 1 to 8The heat sink for server memory of the present invention is applied to memory module 500. The heat sink for server memory includes a heat spreader 100, a clamp 200 and a heat dissipation assembly 300. The heat spreader 100 is connected to the outside of the memory module 500. The clamp 200 includes a tongue 210 and at least two clamping plates 220. The inner sides of the at least two clamping plates 220 are movably abutting against the outer sides of the two sides of the heat spreader 100. One side of the tongue 210 is connected to the clamping plate 220. The tongue 210 is spaced apart from the heat spreader 100. The heat dissipation assembly 300 includes a heat pipe 310 and a heat sink 320. One end of the heat pipe 310 is connected to the heat sink 320. The two sides of the end of the heat pipe 310 away from the heat sink 320 are movably abutting against the heat spreader 100 and the tongue 210, respectively.

[0045] The heat sink for server memory of the present invention has a clamp 200 that not only has a self-locking function for easy disassembly, but also plays a connecting role. The clamp 200 cooperates with the clamp plate 220 and the tongue 210 to detachably connect the clamp 200 to the heat dissipation plates 100 on both sides of the memory module 500, and to the heat dissipation assembly 300. This allows the heat pipe 310 to be tightly attached to the heat dissipation plate 100. At the same time, the heat dissipation plate can be set on the outside of the memory module 500. Thus, for the tightly arranged memory modules 500, the heat sink of the present invention can be detachably fixed to the memory module 500, and a tight fit between the heat sink and the memory module 500 can be achieved. At the same time, it can make full use of the outer space of the memory module 500 for heat dissipation. This solves the problems of limited heat dissipation space of existing memory modules 500, difficulty in fixing the heat sink, poor air circulation caused by narrow spacing between multiple memory modules 500 leading to memory heat dissipation difficulties, and the problem that the heat sink cannot be tightly attached to the memory module 500. It can effectively improve the heat dissipation effect of the server memory module 500.

[0046] For example, see Figures 1 to 4The server's memory module 500 is inserted into the server motherboard from the bottom. In this embodiment, the heat sink clamps both sides of the memory module 500 using clamps 200, and dissipates heat from the memory module 500 through heat sinks 320 positioned above it and heat pipes 310 attached to both sides. Specifically, a vapor chamber 100 is first fixedly connected to the outside of the memory module 500. It is understood that multiple vapor chambers 100 can be provided, positioned on the front and rear sides of the memory module 500. Multiple clamping plates 220 are also positioned on the front and rear sides of the memory module 500, for example, two clamping plates 220. The upper sides of the two clamping plates 220 are connected, and the lower sides of the two clamping plates 220 form a clamping opening facing downwards. The memory module 500 can enter the two clamping plates 220 from below through the clamping opening. Between the two clamping plates 220, the inner sides of the clamps abut against the heat spreaders 100 on the front and rear sides of the memory module 500, respectively, so that the clamp 200 is clamped onto the memory module 500. At this time, the tongue 210 and the heat spreader 100 form a socket with the opening facing upward. The lower end of the heat pipe 310 can enter from above through the socket between the tongue 210 and the heat spreader 100. The tongue 210 and the heat spreader 100 abut against the opposite sides of the heat pipe 310, so that the heat dissipation assembly 300 is fixed above the memory module 500. It should be noted that the heat spreader 100 can be fixedly connected to the side of the memory module 500 by adhesive.

[0047] In some embodiments, a heat-conducting plate 400 is provided between the heat sink and the memory module 500. It is understood that multiple heat-conducting plates 400 may be provided, see [reference needed]. Figure 1 For example, two heat sinks 400 and two vapor chambers 100 are provided. The inner sides of the two heat sinks 400 are respectively located on the front and rear sides of the memory module 500, and the outer sides of the heat sinks 400 are connected to the inner sides of the vapor chambers. It should be noted that the heat sinks 400 and the vapor chambers 100 can be fixedly connected to the sides of the memory module 500 by adhesive. Furthermore, the heat sinks 400 can be made of thermally conductive material.

[0048] In some embodiments, the clamp 220 is provided with a connection port 221, and the tongue 210 is connected to the inner wall of the connection port 221. See, for example... Figure 5 and Figure 6The clamp 200 includes a tongue 210, a connecting plate 230, and two clamping plates 220. The upper sides of the two clamping plates 220 are connected to the front and rear sides of the connecting plate 230, respectively, so that the clamp 200 forms a U-shaped structure. The lower sides of the two clamping plates 220 form a clamping opening. The connecting opening 221 is located on the upper side of the clamping plate 220, and the lower inner wall of the connecting opening 221 is connected to the lower side of the tongue 210. Specifically, the tongue 210 is provided with a flat plate portion 212 and an arc portion 212. The lower side of the arc portion 212 is connected to the lower inner wall of the connection port 221, and the lower side of the flat plate portion 212 is connected to the upper side of the arc portion 212. The upper part of the arc portion 212 extends away from the clamping plate 220, so that the flat plate portion 212 and the clamping plate 220 are not on the same plane. The flat plate portion 212 protrudes from the outside of the clamping plate 220, and the tongue 210 covers the outside of the connection port 221. Thus, when the memory module 500 with the heat spreader 100 is inserted between the two clamping plates 220, the two clamping plates 220 contact the two sides of the heat spreader 100, and there is a gap between the flat plate portion 212 and the heat spreader 100.

[0049] It is understood that multiple tongues 210 and multiple connection ports 221 are provided, and the number of tongues 210 and connection ports 221 are matched, with one tongue 210 covering the outer side of each connection port 221. Furthermore, multiple connection plates 230 are provided, see [reference needed]. Figure 5 and Figure 6 The clamping plate 220 is provided with a clamping part 222 and multiple connecting parts 223. The clamping part 222 is used to abut against the heat spreader 100. The lower side of the multiple connecting parts 223 is connected to the upper side of the clamping part 222. The connecting parts 223 are perpendicular to the clamping part 222. Two adjacent connecting parts 223 and the clamping part 222 form a connecting hole. The upper side of the connecting part 223 is connected to the connecting plate 230, so that multiple notches are formed on the upper side of the clamping fixture 200, thereby forming an upward-facing insertion port between the tongue 210 and the heat spreader 100. When the heat dissipation pipe 310 enters from the insertion port and is clamped between the tongue 210 and the heat spreader 100, the heat dissipation pipe 310 and the heat spreader 100 are tightly fitted, which is beneficial to improving the heat dissipation effect of the memory module 500.

[0050] In some embodiments, the side of the clamping plate 220 away from the heat dissipation assembly 300 is inclined inward. Specifically, the heat dissipation assembly 300 is disposed on the upper side of the clamping plate 220, and the lower side of the clamping plate 220 extends inward at an inward angle, such that the clamping plate 220 and the connecting plate 230 form an acute angle, that is, the lower side of the clamping plate 220 is inclined inward at a certain angle, for example, the lower side of the clamping plate 220 is inclined inward at 1 degree, so that the clamping plate 220 can clamp the memory module 500. It should be noted that the clamping plate 220 can be made of a rigid material, and through the rigid stress of the clamping plate 220, the clamp 200 can clamp the memory module 500 and the heat spreader 100.

[0051] In some embodiments, the heat dissipation assembly 300 further includes a substrate 330, a heat sink 320 disposed above the substrate 330, a heat dissipation pipe 310 protruding below the substrate 330, and a latch for connecting the clamp 200. See also Figure 7 The substrate 330 is a long strip. When the heat dissipation assembly 300 is inserted into the clamp 200, the substrate 330 is positioned above the connecting plate 230. Both the left and right sides of the clamp 220 connecting plates 230 are provided with slots 331, located on the outer side of the connecting plate 230. Two latches are provided, one on the left and one on the right side of the substrate 330. When the latches engage with the slots 331, the substrate 330 is secured to the connecting plate 230, thus fixing the heat dissipation assembly 300 to the clamp 200. Furthermore, multiple heat sinks 320 are provided. The heat sinks 320 have a U-shaped structure, and multiple heat sinks 320 are stacked vertically side-by-side above the substrate 330. Heat dissipation pipes 310 are vertically arranged, with their upper sides passing through the multiple heat sinks 320. It should be noted that there can be multiple heat dissipation pipes 310. Furthermore, the number of heat dissipation pipes 310 matches the number of tongues 210. One heat dissipation pipe 310 abuts against one tongue 210. It can be understood that one tongue 210 can also abut against multiple heat dissipation pipes 310.

[0052] In some embodiments, the heat dissipation assembly 300 further includes a pin 340, a tongue 210 having a tongue wing 211, and a groove 344 for accommodating the tongue wing 211. When the heat dissipation assembly 300 is inserted into the clamp 200, the tongue wing 211 enters the groove 344 and abuts against the inner wall of the groove 344, allowing the tongue wing 210 to further clamp the heat dissipation pipe 310. See also Figure 4 , Figure 5 and Figure 7 The lower side of the tongue 210 is connected to the inner wall of the connection port 221. The tongue wing 211 is located on the left and / or right side of the tongue 210, and extends towards the inner side of the tongue 210, that is, the tongue wing 211 is recessed towards the inner side of the tongue 210. Specifically, the pin 340 is provided with a pin body 341 and a pin head 342. The upper side of the pin body 341 is connected to the base plate 330, and the lower side of the pin body 341 is connected to the pin head 342. It can be understood that the pin body 341 is thicker than the pin head 342. The groove 344 is provided on the pin body 341. The pins 340 on both sides of the memory module 500 are symmetrically arranged. When the tongue 211 enters the groove 344, the opening of the groove 344 faces the tongue 211, and the outer side of the tongue 211 abuts against the inner wall of the groove 344. It should be noted that the lower side of the clamping plate 220 extends inward, and the inner wall of the groove 344 that abuts against the tongue 211 is inclined inward from top to bottom, which can further improve the clamping of the heat dissipation assembly 300.

[0053] In some embodiments, the pin 340 is provided with a pin head 342, and the clamp 220 is provided with a slot 224 for receiving the pin head 342. When the heat dissipation assembly 300 is inserted into the clamp 200, the pin 340 enters into the slot 224. Specifically, see Figure 4 , Figure 5 and Figure 7 The slot 224 is located on the inner wall of the connector 221, and is positioned on the left and / or right side of the tongue 210. The opening of the slot 224 faces upward, and the thickness of the slot 224 matches that of the pin 342. When the pin 342 is inserted into the slot 224, the inner side of the slot 224 abuts against the outer side of the pin 342, while the tongue 211 abuts against the inner wall of the groove 344, allowing the tongue 210 to further clamp the heat sink 310. It should be noted that the lower side of the clamping plate 220 is inclined inward, and the inner wall of the slot 224 abutting against the pin 342 is inclined inward from top to bottom, which can further improve the clamping of the heat sink assembly 300.

[0054] In some embodiments, the temperature distribution plate 100 is provided with a sliding buckle 110, and the clamping plate 220 is provided with a crack-prevention opening 225 for limiting the sliding buckle 110. See also Figures 3 to 5 , Figure 8 The anti-crack opening 225 is located on the inner wall of the connection port 221 with its opening facing upwards. The anti-crack opening 225 is located on the left and / or right side of the tongue 210. The sliding buckle 110 is located on the outer side of the heat spreader 100, that is, the sliding buckle 110 protrudes from the outer side of the heat spreader 100. When the memory module 500 and the heat spreader 100 are inserted into the two clamping plates 220, the sliding buckle 110 pushes the clamping plates 220 outwards. When the heat spreader 100 continues to enter, when the sliding buckle 110 reaches the anti-crack opening 225, the clamping plates 220 on both sides move inwards and contact the heat spreader 100, making a sound to indicate that the memory module 500 has been inserted into place. Furthermore, the sliding buckle 110 has a triangular-like structure, and the upward-facing slope of the sliding buckle 110 extends outwards from top to bottom, making it easier for the sliding buckle 110 to snap into the clamping plate 220.

[0055] See Figure 3 and Figure 4 Furthermore, two heat spreaders 100 are disposed on both sides of the memory module 500, with the upper side of the heat spreader 100 protruding from the memory module 500. When the heat dissipation assembly 300 is inserted into the clamp 200, the heat spreader 100 contacts the substrate 330, and the memory module 500 is spaced apart from the substrate 330, which helps to prevent damage to the memory module 500 during installation. Furthermore, the left and / or right sides of the heat spreader 100 protrude from the memory module 500. Furthermore, the upper side of the heat spreader 100 is provided with a recess 120 that matches the connecting plate 230. When the heat dissipation assembly 300 is inserted into the clamp 200, the connecting plate 230 enters the recess 120.

[0056] See Figures 1 to 8The installation method for a heat sink for server memory according to the technical solution of the present invention is applied to the heat sink for server memory in the embodiments of the present invention, and the installation method for the heat sink for server memory includes at least the following steps:

[0057] S110. The heat spreader 100 is attached to both sides of the memory module 500;

[0058] S120. Insert the memory module 500 with the heat spreader 100 between the two clamps 220.

[0059] S130. Insert the heat pipe 310 between the tongue 210 and the heat spreader 100.

[0060] Specifically, first, attach the heat-conducting pads 400 to the front and back sides of the memory module 500, and then attach the heat spreader 100 to the outside of the two heat-conducting pads 400. Then, insert the memory module 500 with the heat-conducting pads 400 and the heat spreader 100 into the lower clamp of the clamp 200, and apply force to move the memory module 500 inward toward the clamp 200 until the sliding buckle 110 reaches the anti-crack opening 225 and makes a sound, then stop applying force. At this time, the clamp 200 clamps the memory module 500. Finally, align the heat sink 310 with the clamp formed by the tongue 210 and the heat spreader 100, align the groove 344 of the pin 340 with the tongue 211, and align the pin head 342 with the slot 224. Apply force to make the heat sink 310 enter the clamp, the tongue 211 enter the groove 344, and the pin head 342 enter the slot 224. Continue applying force to move the heat sink assembly 300 toward the clamp 200 until the latch reaches the locking point 331 and makes a sound. Stop applying force at this point. The heat sink assembly 300 is now fixed on the clamp 200, completing the installation of the heat sink. See, for example, [reference needed]. Figure 1 The heat sink is located on the top of the 500 memory module.

[0061] See Figures 1 to 8 The method for disassembling a heat sink for server memory according to the technical solution of the present invention is applied to a heat sink for server memory in the embodiments of the present invention, and the method for disassembling a heat sink for server memory includes at least the following steps:

[0062] S210. Apply force to lift the heat dissipation component 300 in a direction away from the clamp 200 so that the heat dissipation component 300 is detached from the clamp 200;

[0063] S220, apply force to pull the clamp 200 away from the memory module 500 to disengage the clamp 200 from the memory module 500;

[0064] S230, detach the heat spreader 100 from the memory module 500.

[0065] Specifically, see Figure 1The heat dissipation component 300 is positioned on the upper side of the clamp 200, and the memory module 500 protrudes from the lower side of the clamp 200. First, pry open the clips on both sides of the heat dissipation component 300 outwards, causing the clips to disengage from the latch 331. Then, pull the heat dissipation component 300 upwards, causing the pin head 342 to disengage from the slot 224, the tongue wing 211 to disengage from the groove 344, and the heat pipe 310 to disengage from the clamp, thereby detaching the heat dissipation component 300 from the clamp 200. Next, when the memory module 500 is inserted into the server, apply upward force to the clamp 200, or when the memory module 500 is removed from the server, apply upward force to the clamp 200 while simultaneously applying downward force to the memory module 500, causing the sliding latch 110 to disengage from the anti-crack opening 225, thereby detaching the memory module 500 from the clamp 200. Finally, remove the heat spreader 100 and the heat conduction plate 400 from the memory module 500, thus completing the disassembly of the heatsink.

[0066] The heat sink for server memory of the present invention can be installed by first inserting the memory module 500 into the clamp 200 and then directly inserting the heat sink component 300 into the clamp 200. During disassembly, it is only necessary to pull out the heat sink component 300 and the clamp 200 in sequence. With the help of the tongue 210, the pin 340 and the bayonet 331, it is easy to install and disassemble, and at the same time, it allows the heat sink 310 to be closely attached to the heat spreader 100.

[0067] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the above-described embodiments. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this disclosure, as long as they achieve the same technical effects, should be included within the scope of protection of this disclosure and fall under the protection scope of the present invention. Within the protection scope of the present invention, the technical solutions and / or implementation methods can have various modifications and variations.

Claims

1. A heat sink for server memory, applied to a memory bank (500), characterized in that, The application relates to a heat-dissipating device for a memory of a server. The heat-dissipating device comprises a uniform temperature plate (100) connected to the outer side of the memory strip (500), a clamp (200) comprising a tongue (210) and at least two clamping plates (220), the inner sides of the at least two clamping plates (220) being movably abutted to the outer sides of the two sides of the uniform temperature plate (100), one side of the tongue (210) being connected to the clamping plates (220), the tongue (210) being arranged in a spaced manner with the uniform temperature plate (100), the tongue (210) and the uniform temperature plate (100) forming a socket, and the opening of the socket being upwardly directed, a heat-dissipating assembly (300) comprising a heat-dissipating pipe (310) and a heat-dissipating fin (320), one end of the heat-dissipating pipe (310) being connected to the heat-dissipating fin (320), and the two sides of the end of the heat-dissipating pipe (310) away from the heat-dissipating fin (320) being movably abutted to the uniform temperature plate (100) and the tongue (210) respectively. The heat-dissipating assembly (300) further comprises a plug (340), the tongue (210) is provided with a tongue wing (211), the plug (340) is provided with a groove (344) for accommodating the tongue wing (211), the plug (340) is provided with a plug head (342), and the clamping plate (220) is provided with a slot (224) for accommodating the plug head (342). The heat-dissipating assembly (300) further comprises a base plate (330), the heat-dissipating fin (320) is arranged above the base plate (330), the heat-dissipating pipe (310) protrudes below the base plate (330), and the base plate (330) is provided with a buckle for connecting the clamp (200). The uniform temperature plate (100) is provided with a sliding buckle (110), and the clamping plate (220) is provided with a crack-limiting opening (225) for limiting the sliding buckle (110). The side of the clamping plate (220) away from the heat-dissipating assembly (300) is inwardly inclined. The heat-dissipating device further comprises a heat-conducting sheet (400) arranged between the uniform temperature plate (100) and the memory strip (500). The clamping plate (220) is provided with a connecting opening (221), the tongue (210) is connected to the inner wall of the connecting opening (221), and the tongue (210) covers the connecting opening (221).

2. The heat sink for server memory of claim 1, wherein, 4. A mounting method of a heat-dissipating device for a memory of a server, applied to the heat-dissipating device for the memory of the server in any one of claims 1 to 3, the mounting method comprising the following steps:

3. The heat sink for server memory of claim 1, wherein, S110, pasting the uniform temperature plate (100) to the two sides of the memory strip (500); S120, inserting the memory strip (500) with the uniform temperature plate (100) between the two clamping plates (220); S130, inserting the heat-dissipating pipe (310) between the tongue (210) and the uniform temperature plate (100).

5. A dismounting method of a heat-dissipating device for a memory of a server, applied to the heat-dissipating device for the memory of the server in any one of claims 1 to 3, the dismounting method comprising the following steps: ​ ​ S210, pulling the heat dissipation assembly (300) in a direction away from the clamp (200) to make the heat dissipation assembly (300) separate from the clamp (200); S220, pulling the clamp (200) in a direction away from the memory bank (500) to make the clamp (200) separate from the memory bank (500); S230, making the uniform temperature plate (100) separate from the memory bank (500).

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