Front heat dissipation system of chip semiconductor

Abstract

The invention discloses a front heat dissipation system of a chip semiconductor, and relates to the technical field of chip heat dissipation. The front heat dissipation system of the chip semiconductor comprises a heat dissipation system and a semiconductor chip, and a temperature sensor, a detection unit, an alarm module and a heat dissipation module are arranged in an environment where the semiconductor chip is used. The heat dissipation system is composed of an over-temperature alarm unit, a temperature rise detection unit, a control unit and a temperature adjusting unit. The heat dissipation system is in signal transmission connection with the semiconductor chip, or the heat dissipation system can be input into the semiconductor chip in a programming mode. According to the front heat dissipation system of the chip semiconductor, when the temperature adjusting unit is started, the control unit automatically starts the heat dissipation module according to the set temperature, when the temperature reaches the designated temperature, the control unit controls the heat dissipation module to stop working, and the heat dissipation module is automatically started and closed according to the chip use environment temperature; therefore, the use environment of the chip is ensured to be the set temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a front heat dissipation system for a chip semiconductor. Background Art

[0002] In recent years, the key problem of thermal barrier of highly integrated computer chips has become one of the technical bottlenecks restricting its sustainable development. At present, the mainstream technical development direction to solve the high power consumption and high density heat dissipation of computer chips is to develop liquid cooling methods and use coolants to enhance the heat dissipation effect of chips. There have been a lot of research reports on water-based coolant technology and liquid metal heat dissipation technology, and certain progress has been made in chip cooling experimental research and trial application.

[0003] However, during the chip heat dissipation process, it is still impossible to make the ambient temperature of the chip work most closely match the chip according to the user's usage environment and usage requirements, and the chip heat dissipation structure cannot automatically start and stop according to different temperatures. Therefore, when heat dissipation is not required, the automatic operation of the heat dissipation device causes a large waste of resources. In view of this, a front heat dissipation system for chip semiconductors is proposed to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide a front heat dissipation system for a chip semiconductor, which can solve the problem that during the chip heat dissipation process, it is still impossible to make the ambient temperature of the chip work most closely matched with the chip according to the user's usage environment and usage requirements, and the chip heat dissipation structure cannot automatically start and stop according to different temperatures. Therefore, when heat dissipation is not required, the automatic operation of the heat dissipation device causes a large waste of resources.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a front heat dissipation system for a chip semiconductor, comprising a heat dissipation system and a semiconductor chip, wherein a temperature sensor, a detection unit, an alarm module, and a heat dissipation module are arranged in the environment in which the semiconductor chip is used;

[0006] The heat dissipation system consists of an over-temperature alarm unit, a temperature rise detection unit, a control unit and a temperature adjustment unit;

[0007] The heat dissipation system is connected to the semiconductor chip by signal transmission, or the heat dissipation system can be input into the semiconductor chip by programming, so as to realize automatic control of chip heat dissipation.

[0008] Preferably, the temperature sensor is connected to the over-temperature alarm unit, the temperature rise detection unit, and the temperature adjustment unit for signal transmission.

[0009] Preferably, the temperature alarm unit and the temperature rise detection unit are both set with an initial threshold, and the temperature adjustment unit is set with a range threshold;

[0010] The initial threshold of the over-temperature alarm unit may be eighty percent of the maximum temperature that the semiconductor chip can withstand.

[0011] Preferably, the range threshold of the temperature adjustment unit is between normal temperature and eighty percent of the maximum temperature that the chip can withstand.

[0012] Preferably, the initial threshold of the temperature rise detection unit is the temperature rise rate, and when the temperature rise rate per second exceeds the threshold, the temperature rise detection unit transmits a signal.

[0013] Preferably, the over-temperature alarm unit and the temperature rise detection unit are respectively connected to the alarm module for signal transmission.

[0014] Preferably, the control unit is connected to the heat dissipation module for signal transmission;

[0015] Among them, the heat dissipation module includes a heat dissipation fan, water cooling and heat exchanger installed in the chip usage environment.

[0016] Preferably, the control unit also includes two modes: automatic control and manual control, so the heat dissipation module can be automatically or manually opened to dissipate heat for the chip according to usage requirements.

[0017] Preferably, the detection unit is a detection module for determining whether data transmission is stable during chip operation, so that whether the chip is operating normally or is damaged is determined based on the detection of the detection unit.

[0018] Preferably, the temperature regulating unit is connected to the control unit for signal transmission.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] (1) The front heat dissipation system of the chip semiconductor. When the system is running, the temperature sensor transmits the real-time temperature of the chip to the system. At this time, the over-temperature alarm unit and the temperature rise detection unit detect the temperature to check whether the temperature is normal. When the temperature exceeds the set threshold, the control unit automatically starts the heat dissipation module to dissipate the heat of the chip. The temperature adjustment unit can adjust the temperature range of the chip working environment according to the user's use environment. When the temperature adjustment unit is started, the control unit automatically starts the heat dissipation module according to the set temperature. When the specified temperature is reached, the control unit controls the heat dissipation module to stop working, and automatically starts and shuts down the heat dissipation module according to the chip use environment temperature, so as to ensure that the chip use environment is the set temperature.

[0021] (2) The front heat dissipation system of the chip semiconductor can transmit the heat generated by the semiconductor chip during use to the heat dissipation system in real time through the temperature sensor. Therefore, the preset threshold is used to determine whether the chip is overheating or heating up rapidly, and corresponding operations are performed according to the different temperature changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0023] Figure 1 This is a block diagram of a front heat dissipation system for a chip semiconductor of the present invention. DETAILED DESCRIPTION

[0024] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In the description of the present invention, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0027] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0028] See also Figure 1 ,The present invention provides a technical solution: a front heat dissipation system for a chip semiconductor, comprising a heat dissipation system and a semiconductor chip, wherein a temperature sensor, a detection unit, an alarm module, and a heat dissipation module are arranged in the environment in which the semiconductor chip is used;

[0029] The heat dissipation system consists of an over-temperature alarm unit, a temperature rise detection unit, a control unit and a temperature adjustment unit;

[0030] The heat dissipation system is connected to the semiconductor chip through signal transmission, or the heat dissipation system can be input into the semiconductor chip through programming to realize automatic control of chip heat dissipation;

[0031] Further, the temperature sensor is connected with the over-temperature alarm unit, the temperature rise detection unit, and the temperature adjustment unit for signal transmission;

[0032] Among them, the over-temperature alarm unit and the temperature rise detection unit are both set with initial thresholds, and the temperature adjustment unit is set with a range threshold;

[0033] The initial threshold of the over-temperature alarm unit may be 80% of the maximum temperature that the semiconductor chip can withstand;

[0034] The initial threshold of the temperature rise detection unit is the temperature rise rate. When the temperature rise rate per second exceeds the threshold, the temperature rise detection unit transmits a signal;

[0035] The range threshold of the temperature regulation unit is between normal temperature and 80% of the maximum temperature that the chip can withstand;

[0036] The heat generated by the semiconductor chip during use can be transmitted to the cooling system in real time through the temperature sensor, so as to judge whether the chip is overheating or heating up rapidly according to the preset threshold, and then make corresponding operations according to the different temperature changes;

[0037] Further, the over-temperature alarm unit and the temperature rise detection unit are respectively connected to the alarm module for signal transmission;

[0038] When the temperature exceeds the threshold of the over-temperature alarm unit and the temperature rise detection unit, the alarm module automatically starts, so it is convenient for outsiders to detect the chip to avoid over-temperature damage and prevent the temperature from rising too fast and exceeding the chip load;

[0039] Further, the control unit is connected with the heat dissipation module for signal transmission;

[0040] Among them, the heat dissipation module includes a heat dissipation fan, water cooling and heat exchanger installed in the chip use environment;

[0041] When the cooling system detects that the chip is overheated or the temperature rises abnormally and the chip needs to be cooled, the control unit controls the cooling device of the cooling module to cool itself;

[0042] The control unit also includes two modes: automatic control and manual control. Therefore, the heat dissipation module can be automatically or manually opened to dissipate heat for the chip according to the use requirements.

[0043] Furthermore, the detection unit is a detection module for determining whether data transmission is stable during chip operation, so whether the chip is operating normally or is damaged is determined based on the detection of the detection unit;

[0044] Further, the temperature adjustment unit is connected with the control unit for signal transmission;

[0045] Therefore, when the temperature adjustment unit sets a specified temperature or a range of temperatures, the control unit controls the heat dissipation module to turn on and off, thereby achieving automatic adjustment of the chip use environment temperature;

[0046] Working principle: When the system is running, the temperature sensor transmits the real-time temperature of the chip to the system. At this time, the over-temperature alarm unit and the temperature rise detection unit detect the temperature to check whether the temperature is normal. When the temperature exceeds the set threshold, the control unit automatically starts the heat dissipation module to dissipate the chip. The temperature adjustment unit can adjust the temperature range of the chip working environment according to the user's usage environment. When the temperature adjustment unit is started, the control unit automatically starts the heat dissipation module according to the set temperature. When the specified temperature is reached, the control unit controls the heat dissipation module to stop working, and automatically starts and shuts down the heat dissipation module according to the chip usage environment temperature, so as to ensure that the chip usage environment is the set temperature.

[0047] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A front heat dissipation system for a chip semiconductor, comprising a heat dissipation system and a semiconductor chip, characterized in that: The semiconductor chip is used in an environment provided with a temperature sensor, a detection unit, an alarm module, and a heat dissipation module; The heat dissipation system consists of an over-temperature alarm unit, a temperature rise detection unit, a control unit and a temperature adjustment unit; The heat dissipation system is connected to the semiconductor chip by signal transmission, or the heat dissipation system can be input into the semiconductor chip by programming, so as to realize automatic control of chip heat dissipation.

2. The front heat dissipation system of a chip semiconductor according to claim 1, characterized in that: The temperature sensor is connected with the over-temperature alarm unit, the temperature rise detection unit and the temperature adjustment unit for signal transmission.

3. The front heat dissipation system of a chip semiconductor according to claim 2, characterized in that: The temperature alarm unit and the temperature rise detection unit are both set with initial thresholds, and the temperature adjustment unit is set with a range threshold; The initial threshold of the over-temperature alarm unit may be eighty percent of the maximum temperature that the semiconductor chip can withstand.

4. The front heat dissipation system of a chip semiconductor according to claim 3, characterized in that: The range threshold of the temperature adjustment unit is between normal temperature and eighty percent of the maximum temperature that the chip can withstand.

5. The front heat dissipation system of a chip semiconductor according to claim 3, characterized in that: The initial threshold of the temperature rise detection unit is the temperature rise rate. When the temperature rise rate per second exceeds the threshold, the temperature rise detection unit transmits a signal.

6. The front heat dissipation system of a chip semiconductor according to claim 1, characterized in that: The over-temperature alarm unit and the temperature rise detection unit are respectively connected to the alarm module for signal transmission.

7. The front heat dissipation system of a chip semiconductor according to claim 1, characterized in that: The control unit is connected to the heat dissipation module for signal transmission; Among them, the heat dissipation module includes a heat dissipation fan, water cooling and heat exchanger installed in the chip usage environment.

8. The front heat dissipation system of a chip semiconductor according to claim 1, characterized in that: The control unit also includes two modes: automatic control and manual control, so the heat dissipation module can be automatically or manually opened to dissipate heat for the chip according to usage requirements.

9. The front heat dissipation system of a chip semiconductor according to claim 1, characterized in that: The detection unit is a detection module for whether the data transmission is stable during the operation of the chip. Therefore, the detection of the detection unit is used to determine whether the chip is working normally or is damaged.

10. The front heat dissipation system of a chip semiconductor according to claim 1, characterized in that: The temperature regulating unit is connected with the control unit for signal transmission.

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