Touch display panel and electronic equipment
By providing a first conductive part on the boundary part of the packaging layer to connect the array substrate and the connection line, the problem of increasing the frame width caused by the conductive via in the prior art is solved, and the narrow frame effect of the touch display panel is achieved.
Patent Information
- Application Number
- CN202311001193.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-09
- Publication Date
- 2025-02-18
AI Technical Summary
Due to the spacing between the conductive vias and the packaging layer, the frame width increases, making it difficult to achieve the use of narrow frames.
A first conductive part is provided on the boundary part of the packaging layer, and the array substrate and the connection line are connected through the first conductive part, so that the array substrate and the touch electrode are electrically connected, thereby realizing touch operation.
The spacing between the conductive vias and the packaging layer is eliminated, and the influence of the layout position of the conductive vias on the narrow frame is achieved, so as to achieve the narrow frame effect of the touch display panel.
Smart Images

Figure CN119473035A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic device structures, and more particularly to a touch display panel and an electronic device. Background Art
[0002] Organic Light-Emitting Diode (OLED) displays have many advantages such as being thin and light, actively emitting light, fast response speed, large viewing angle, wide color gamut, high brightness and low power consumption, and have gradually become the third generation of display technology after liquid crystal displays. Touch panels provide a new human-computer interaction interface that is more direct and user-friendly. Integrating a touch screen with an OLED display to form a touch display panel can give the touch display panel a touch function, making the operation more intuitive and simple.
[0003] The commonly used touch display panels generally include an array substrate, a light-emitting layer, a packaging layer and a touch layer which are stacked in sequence, and the touch layer has a touch electrode. By setting a conductive via connecting the touch electrode and the array substrate outside the boundary of the packaging layer, the touch electrode and the array substrate can be electrically connected. However, since the conductive via is spaced apart from the packaging layer, the border width of the touch display panel is increased, which is not conducive to the use requirement of the touch display panel to achieve a narrow border. Summary of the invention
[0004] On the one hand, an embodiment of the present application provides a touch display panel, which includes: an array substrate, a light-emitting layer, a packaging layer, and a touch layer arranged on the array substrate; the packaging layer is arranged on a side of the light-emitting layer away from the array substrate; the touch layer is arranged on a side of the packaging layer away from the array substrate; the touch layer includes a touch area, and a binding area located on at least one side of the touch area, a touch electrode is arranged on the touch area, and a connecting line is arranged on the binding area; wherein the packaging layer has a boundary portion at least partially overlapping with the binding area, a first conductive portion is arranged on the boundary portion, one end of the connecting line is connected to the touch electrode, and the other end is connected to the first conductive portion, and the first conductive portion is electrically connected to the array substrate.
[0005] On the other hand, an embodiment of the present application further provides an electronic device, which includes a shell assembly and a touch display panel connected to one side of the shell assembly; wherein the touch display panel is the touch display panel described in the aforementioned embodiment.
[0006] The touch display panel and electronic device provided in the embodiment of the present application can realize touch operation by setting a first conductive part on the boundary of the packaging layer, connecting the array substrate and the connection line through the first conductive part, and then electrically connecting the array substrate and the touch electrode. Compared with the prior art of "setting a conductive via connecting the touch electrode and the array substrate outside the boundary of the packaging layer so that the touch electrode and the array substrate can be electrically connected", the spacing between the conductive via and the packaging layer can be omitted, that is, the influence of the layout position of the conductive via on the realization of the narrow frame of the touch display panel is eliminated, thereby realizing the narrow frame effect of the touch display panel. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0008] Figure 1 is a schematic diagram of the structure of an electronic device in some embodiments of the present application;
[0009] Figure 2 yes Figure 1 A schematic diagram of the structural disassembly of the electronic device in the embodiment;
[0010] Figure 3 is a schematic diagram of a stacked structure of a touch display panel in some embodiments of the present application;
[0011] Figure 4 is a schematic diagram of the structure of a touch display panel in some other embodiments of the present application;
[0012] Figure 5 yes Figure 4 A schematic diagram of a cross-sectional structure of a touch display panel along the AA direction in the embodiment;
[0013] Figure 6 is a schematic diagram of the cross-sectional structure of a touch display panel in some other embodiments of the present application;
[0014] Figure 7 It is a schematic diagram of the structural composition of mobile terminal devices in other embodiments of the present application. DETAILED DESCRIPTION
[0015] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0016] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0017] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.
[0018] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of an electronic device 100 in some embodiments of the present application, Figure 2 yes Figure 1 Schematic diagram of the structural disassembly of the electronic device 100 in the embodiment.
[0019] The electronic device 100 provided in the embodiment of the present application may specifically be a mobile phone, a tablet computer, a laptop computer, and the like. The following description is given below with the electronic device 100 being a mobile phone. The electronic device 100 may include a housing assembly 10 and a touch display panel 20 connected to one side of the housing assembly 10. The housing assembly 10 is connected to the touch display panel 20, and together they enclose a housing space for the electronic device 100. The housing space of the electronic device 100 may be used to install electronic devices required by the electronic device 100, such as a battery, a sensor device, a circuit board, and a camera.
[0020] Specifically, the housing assembly 10 may include a middle frame 110 and a cover plate 120. The touch display panel 20 may be connected to one side of the middle frame 110, and the cover plate 120 may be connected to the other opposite side of the middle frame 110, that is, the touch display panel 20 and the cover plate 120 may be respectively disposed on opposite sides of the middle frame 110, thereby forming a housing space for the electronic device 100 together with the middle frame 110.
[0021] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0022] like Figure 2 As shown, the middle frame 110 may include a middle plate 111 of an integral structure and a frame 112 surrounding at least part of the outer periphery of the middle plate 111, and the two may be integrally formed by injection molding, stamping molding, heat absorption molding and other processes. Among them, the frame 112 may be formed by the side wall of the middle plate 111 extending in the thickness direction of the middle plate 111, so that the two sides of the middle frame 110 that are relatively arranged can form corresponding open structures. The touch display panel 20 and the cover plate 120 may be respectively covered on the open structures on the opposite sides of the middle frame 110, thereby forming a housing space for the electronic device 100 together with the middle frame 110. In some embodiments, the middle plate 111 and the frame 112 may also be two independent structural members, and the two may be connected by one of the assembly methods such as snap-on, bonding and welding and a combination thereof. Alternatively, the middle frame 110 may also include only the frame 112.
[0023] In addition, the material of the middle frame 110 can be glass, metal, hard plastic, etc., so that the middle frame 110 has a certain structural strength. Among them, since the middle frame 110 is generally directly exposed to the external environment, the middle frame 110 can also have certain wear-resistant, corrosion-resistant and scratch-resistant properties, or a layer of functional materials for wear-resistant, corrosion-resistant and scratch-resistant is coated on the outer surface of the middle frame 110 (that is, the outer surface of the electronic device 100). In addition, in some embodiments, a corresponding brand logo (LOGO) can also be provided on the middle frame 110 to beautify the appearance of the electronic device 100 and improve brand recognition. Further, the middle frame 110 is arranged between the touch display panel 20 and the cover plate 120, and is respectively connected to the touch display panel 20 and the cover plate 120 to form the overall structural frame of the electronic device 100. In the structural application of the electronic device 100, the middle frame 110 is generally used to carry or fix the internal components such as the circuit board, battery, camera or sensor device of the electronic device 100.
[0024] See also Figure 3 , Figure 3 1 is a schematic diagram of the stacked structure of the touch display panel 20 in some embodiments of the present application. The touch display panel 20 can be used to provide an image display function for the electronic device 100, and the touch display panel 20 can be covered on one side of the middle frame 110, and the two can be bonded and fixed by adhesive. Among them, the touch display panel 20 may include an array substrate 210, a light-emitting layer 220, an encapsulation layer 230 and a touch layer 240 stacked in sequence. Further, the light-emitting layer 220 and the array substrate 210 are electrically connected so that the light-emitting layer 220 can emit light to display the picture and can serve as an interactive interface to instruct the user to perform the above-mentioned touch operation. The touch layer 240 and the array substrate 210 are electrically connected so that the touch layer 240 can respond to the user's touch operation and convert the corresponding touch operation into an electrical signal to be transmitted to the processor of the electronic device 100, so that the electronic device 100 can respond to the user's touch operation accordingly.
[0025] The array substrate 210 may include a substrate 211, a buffer layer 212 disposed on the substrate 211, an active layer 213 disposed on the buffer layer 212, a first gate insulating layer 214 covering the active layer 213, a first gate 215 disposed on the first gate insulating layer 214, a second gate insulating layer 216 covering the first gate 215, a second gate 217 disposed on the second gate insulating layer 216, an interlayer insulating layer 218 covering the second gate 217, a source and drain 219 disposed on the interlayer insulating layer 218, and a planar layer 260 covering the source and drain 219.
[0026] Among them, the substrate 211 can be a flexible substrate, a glass substrate or a plastic substrate, etc., but not limited thereto. For example, the preparation material of the substrate 211 can be polyimide. The preparation material of the buffer layer 212 can be silicon nitride or silicon oxide, etc., but not limited thereto. The source and drain electrodes 219 can be electrically connected to the active layer 213 through the conductive portion. It can be understood that in some embodiments, the first gate insulating layer 214 and the second gate insulating layer 216 can be combined into one gate insulating layer, at which time, the first gate 215 and the second gate 217 can be combined into one gate. In other words, in some embodiments, the array substrate 210 may include a first gate insulating layer 214 and a first gate 215 disposed on the first gate insulating layer 214; or, the array substrate 210 may include a second gate insulating layer 216 and a second gate 217 disposed on the second gate insulating layer 216. The flat layer 260 may be a single-layer structure or a multi-layer structure. The flat layer 260 may be made of organic materials, such as: photoresist, acrylic polymer, silicon polymer and other materials.
[0027] It should be noted that the terms "first", "second", and "third" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0028] The light-emitting layer 220 includes an anode 221 disposed on the flat layer 260 of the array substrate 210, a pixel definition layer 222 disposed on the flat layer 260 and the anode 221, a light-emitting layer 223 disposed on the anode 221, and a cathode 224 disposed on the light-emitting layer 223 and the pixel definition layer 222. In other words, the anode 221 is disposed on the flat layer 260, the pixel definition layer 222 covers the flat layer 260 and has a pixel opening running through the flat layer 260, the anode 221 is at least partially located in the pixel opening, and the light-emitting layer 223 is located in the pixel opening. The pixel definition layer 222 surrounds a pixel opening above the anode 221 that can expose at least a portion of the anode 221, and the light-emitting layer 223 can be formed in the pixel opening by inkjet printing, and the pixel definition layer 222 surrounds the light-emitting layer 223 above the anode 221.
[0029] Among them, the anode 221 and the source and drain 219 can be connected by opening a via (such as a metal via) on the flat layer 260. The material of the anode 221 is a conductive metal oxide, and the thickness is generally 20-200nm. The material of the anode can be ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). The cathode layer 224 is made of a conductive material, and the thickness is generally 20nm-200nm. The material of the cathode layer includes but is not limited to one of Mg / Ag, Ca / Al, Mg / MgAg, Gd / Al, Al / Li, Sn / Al and Ag / Al alloys.
[0030] The encapsulation layer 230 may be disposed on a side of the light emitting layer 220 away from the array substrate 210. The encapsulation layer 230 may be a thin film encapsulation (TFE) layer structure, including an inorganic barrier layer 231 and an organic buffer layer 232 alternately stacked. The inorganic barrier layer 231 may be a stacked combination of one or more of a silicon oxide (SiOx) layer, a silicon nitride (SiNx) layer, and a silicon oxynitride (SiON) layer. The organic buffer layer 232 may be formed by inkjet printing, and its material includes at least one of acrylic acid, hexamethyldisiloxane, acrylates, polycarbonates, and polystyrene.
[0031] like Figure 3 As shown, the inorganic barrier layer 231 may have two layers, and the two inorganic barrier layers 231 are located on opposite sides of the organic buffer layer 232. Of course, in other embodiments, the inorganic barrier layer 231 and the organic buffer layer 232 may each have one or more layers, and are alternately stacked.
[0032] The touch layer 240 may include a first inorganic insulating layer 241 disposed on the encapsulation layer 230, a conductive bridge 242 disposed on the first inorganic insulating layer 241, a second inorganic insulating layer 243 disposed on the first inorganic insulating layer 241 and covering the conductive bridge 242, a touch electrode 244 disposed on the second inorganic insulating layer 243, and an organic protective layer 245 disposed on the second inorganic insulating layer 243 and covering the touch electrode 244. The material of the organic protective layer 245 may be the same as that of the organic buffer layer 232, so it may be manufactured by a process similar to that of the organic buffer layer 232 in the encapsulation layer 230 of the TFE structure, such as an inkjet printing process, thereby omitting a mask process. The material of the organic protective layer 245 includes at least one of acrylic acid, hexamethyldisiloxane, acrylates, polycarbonates, and polystyrene.
[0033] The first inorganic insulating layer 241 and the second inorganic insulating layer 243 may be respectively a stacked combination of one or more of a silicon oxide layer, a silicon nitride layer and a silicon oxynitride layer.
[0034] Further, the touch electrode 244 may include a plurality of first electrodes 2441 and a plurality of second electrodes 2442 interlaced with the plurality of first electrodes 2441. Each first electrode 2441 is disconnected relative to the second electrode 2442 at the interlaced position with the second electrode 2442 on the second inorganic insulating layer 243. The conductive bridge 242 may be provided below the plurality of positions corresponding to the interlaced positions of the first electrode 2441 and the second electrode 2442, and is used to connect the adjacent first electrodes 2441 on the same straight line. Optionally, two adjacent first electrodes 2441 on the same straight line may be connected to the two ends of the guide bridge 242 through the conductive portion, respectively. Among them, the material of the conductive bridge 242 and the touch electrode 244 may be a metal conductive material such as titanium, aluminum, molybdenum, or silver.
[0035] In some embodiments, the plurality of first electrodes 2441 and the plurality of second electrodes 2442 are staggered to form a plurality of metal meshes, so that the touch electrodes 244 can avoid the pixel opening area of the pixel definition layer 222 to avoid affecting the light emitting effect of the light emitting layer 220 .
[0036] It can be understood that the pixel openings of the pixel definition layer 222 can be distributed in an array, so that the light-emitting pixel areas of the light-emitting layer 223 are distributed in an array. Two adjacent light-emitting pixel areas are separated by the pixel definition layer 222, and the conductive bridge 242 and the touch electrode 244 are correspondingly located above the pixel definition layer 222, that is, correspondingly located above between the two adjacent light-emitting pixel areas.
[0037] The touch display panel provided in the embodiment of the present application has a touch layer adopting an electrode structure of a metal grid, and the conductive bridge and the touch electrode are correspondingly located above two adjacent light-emitting pixel areas. The touch layer as a whole adopts a structure in which an inorganic insulating layer and an organic protective layer are superimposed, which is similar to the material and structure of the encapsulation layer. Therefore, the touch layer also plays the role of an encapsulation layer, which is beneficial to further block the invasion of water and oxygen, reduce the risk of corrosion and damage to the touch display panel, and increase the life of the touch display panel device.
[0038] See also Figure 4 and Figure 5 , Figure 4 is a schematic diagram of the structure of the touch display panel 20 in other embodiments of the present application, Figure 5 yes Figure 4Schematic diagram of the cross-sectional structure of the touch display panel 20 along the AA direction in the embodiment. The touch display panel 20 may include an array substrate 210, a light emitting layer 220, an encapsulation layer 230, and a touch layer 240 stacked in sequence. The touch layer 240 may include a touch area 2401 and a binding area 2402 disposed on at least one side of the touch area 2401. In other words, the binding area 2402 may be located on at least one side of the touch area 2401; for example, the binding area 2402 may surround the outer edge of the touch area 2401.
[0039] The touch area 2401 can also be understood as the display area 101 (such as Figure 4 The binding area 2402 and the area on the side of the binding area 2402 away from the touch area 2401 together constitute the non-display area 102 of the touch display panel 20 (such as Figure 4 The area outside the rectangular box) is the border.
[0040] As mentioned above, the touch control area 2401 is provided with a touch control electrode 244, and the touch control electrode 244 may include a plurality of first electrodes 2441 and a plurality of second electrodes 2442 arranged alternately with the plurality of first electrodes 2441. The plurality of first electrodes 2441 and the plurality of second electrodes 2442 are arranged alternately to form a plurality of metal meshes, which may be divided into a plurality of columns of first touch control units 2443 and a plurality of rows of second touch control units 2444. The plurality of metal meshes in each column of the first touch control units 2443 are arranged in sequence along the longitudinal direction, and the plurality of metal meshes in each row of the second touch control units 2444 are arranged in sequence along the transverse direction. Further, two adjacent metal meshes in each column of the first touch control units 2443 are electrically connected on the side of the second inorganic insulating layer 243 away from the first inorganic insulating layer 241, and two adjacent metal meshes in each row of the second touch control units 2444 are electrically connected on the side of the second inorganic insulating layer 243 close to the first inorganic insulating layer 241 through the conductive bridge 242.
[0041] Of course, in other embodiments, two adjacent metal grids in each column of the first touch control unit 2443 can be electrically connected through the conductive bridge 242 on the side of the second inorganic insulating layer 243 close to the first inorganic insulating layer 241, and two adjacent metal grids in each row of the second touch control unit 2444 can be electrically connected on the side of the second inorganic insulating layer 243 away from the first inorganic insulating layer 241.
[0042] The first touch control unit 2443 may be one of a touch control driving electrode (Tx) and a touch control sensing electrode (Rx), and the second touch control unit 2444 may be the other of a touch control driving electrode and a touch control sensing electrode. Further, a connection line 2445 is provided on the binding area 2402, and the connection line 2445 is provided outside the edge of the grid pattern, that is, provided at the periphery of the touch control area 2401, so as to connect the touch control electrode 244 and the touch control display chip 250 provided on the array substrate 210. There may be a plurality of connection lines 2445, some of which connect the first touch control unit 2443 and the touch control display chip 250, and another part of which connects the second touch control unit 2444 and the touch control display chip 250.
[0043] like Figure 4 and Figure 5 As shown, the projection of the touch display chip 250 projected on the array substrate 210 and the projection of the touch layer 240 projected on the array substrate 210 are arranged at intervals. Among them, the touch display chip 250 may include a first edge 2501, a second edge 2502, a third edge 2503 and a fourth edge 2504 connected end to end. The first edge 2501 and the third edge 2503 are arranged opposite to each other, and the second edge 2502 and the fourth edge 2504 are arranged opposite to each other. Further, the first edge 2501 is located on the side of the third edge 2503 close to the touch layer 240. It can be understood that the touch display chip 250 can be a TDDI (Touch and Display Driver Integration) chip, that is, the touch chip and the display chip are integrated into a single chip.
[0044] In one embodiment, the touch display chip 250 may have a plurality of touch pins and a plurality of display pins, and the plurality of touch pins are configured to be electrically connected to the touch electrode 244 through a plurality of connection lines 2445 to realize touch operation. The plurality of display pins are configured to drive the light-emitting layer 230 to emit light to realize the display function. Among them, the plurality of touch pins may be arranged on the first side 2501, the second side 2502 and / or the fourth side 2504 of the touch display chip 250. The connection lines 2445 connected to the periphery of the touch electrode 244 gather from both sides of the touch area 2041 and extend in a direction close to the touch display chip 250 to realize connection with the touch display chip 250.
[0045] See again Figure 4 and Figure 5, the encapsulation layer 230 may have a boundary portion 2301 at least partially overlapping with the binding area 2402, the boundary portion 2301 is provided with a first conductive portion 201, one end of the connection line 2445 is connected to the touch electrode 244, and the other end is connected to the first conductive portion 201. Specifically, the touch pin of the touch display chip 250 may extend below the boundary portion 2301 to achieve electrical connection with the first conductive portion 201; or, the array substrate 210 may be provided with a contact point located below the first conductive portion 201 and electrically connected to the first conductive portion 201, and the touch pin of the touch display chip 250 may be connected to the contact point on the array substrate 210, so that the first conductive portion 201 and the touch pin of the touch display chip 250 are electrically connected through the contact point.
[0046] The first conductive portions 201 may be distributed on the boundary portion 2301 in an array.
[0047] Furthermore, the boundary portion 2301 may extend from the surface of the light emitting layer 220 away from the array substrate 210 to the array substrate 210. Specifically, the encapsulation layer 230 covers the light emitting layer 220 to prevent water vapor and the like from entering the light emitting layer 220. The boundary portion 2301 may be formed at the edge of the encapsulation layer 230 and bend to extend to the array substrate 210, so as to further encapsulate the peripheral side of the light emitting layer 220.
[0048] In one embodiment, a second conductive part 202 electrically connected to the first conductive part 201 is provided on the binding area 2402 of the touch layer 240, and one end of the second conductive part 202 facing away from the first conductive part 201 is electrically connected to the connecting line 2445. Among them, the first conductive part 201 and the second conductive part 202 can both be holes with conductive metal on the inner wall. Further, the aperture of the first conductive part 201 is greater than or equal to the aperture of the second conductive part 202 to ensure effective electrical connection between the first conductive part 201 and the second conductive part 202. Optionally, the first conductive part 201 and the second conductive part 202 are coaxially arranged. Of course, in other embodiments, the first conductive part 201 and the second conductive part 202 can be strip conductors or columnar conductors; the end surface area of the first conductive part 201 is greater than or equal to the end surface area of the second conductive part 202 to ensure effective electrical connection between the first conductive part 201 and the second conductive part 202. Optionally, the first conductive part 201 and the second conductive part 202 are coaxially arranged.
[0049] As mentioned above, the encapsulation layer 230 includes an inorganic barrier layer 231 and an organic buffer layer 232 which are stacked, and the boundary portion 2301 is formed at the edge of the inorganic barrier layer 231 and protrudes from the edge of the organic buffer layer 232. Specifically, the encapsulation layer 230 covers the cathode 224 of the light-emitting layer 220 and wraps around the circumference of the light-emitting layer 220 to achieve a waterproof and dustproof effect. Among them, the projection of the organic buffer layer 232 on the light-emitting layer 220 covers the light-emitting pixel area of the light-emitting layer 223, and the projection of the inorganic barrier layer 231 on the light-emitting layer 220 covers the projection of the organic buffer layer 232 on the light-emitting layer 220. Further, the outer edge of the inorganic barrier layer 231 protrudes relative to the outer edge of the organic buffer layer 232 to completely cover the organic buffer layer 232.
[0050] like Figure 5 As shown, the encapsulation layer 230 includes two inorganic barrier layers 231 and an organic buffer layer 232 arranged between the two inorganic barrier layers 231, the organic buffer layer 232 is arranged on the light-emitting layer 220, the edges of the two inorganic barrier layers 231 extend to the array substrate 210 to form the above-mentioned boundary portion 2301, and the first conductive portion 201 is penetrated or runs through the edges of the two inorganic barrier layers 231.
[0051] Of course, in other embodiments, the encapsulation layer 230 includes an organic buffer layer 232 disposed on the light-emitting layer 220 and an inorganic barrier layer 231 disposed on the side of the organic buffer layer 232 away from the light-emitting layer 220, and the edge of the inorganic barrier layer 231 extends to the array substrate 210 to form the above-mentioned boundary portion 2301, and the first conductive portion 201 is penetrated or runs through the edge of the inorganic barrier layer 231.
[0052] As mentioned above, the touch layer 240 may include a first inorganic insulating layer 241 disposed on the encapsulation layer 230, a conductive bridge 242 disposed on the first inorganic insulating layer 241, a second inorganic insulating layer 243 disposed on the first inorganic insulating layer 241 and covering the conductive bridge 242, a touch electrode 244 disposed on the second inorganic insulating layer 243, and an organic protective layer 245 disposed on the second inorganic insulating layer 243 and covering the touch electrode 244. The edges of the first inorganic insulating layer 241, the second inorganic insulating layer 243, and the organic protective layer 245 extend to the array substrate 210 and at least partially overlap with the boundary portion 2301. The second conductive portion 202 is sequentially disposed or penetrates the first inorganic insulating layer 241 and the second inorganic insulating layer 243 to achieve electrical connection with the first conductive portion 201.
[0053] Furthermore, the touch pins of the touch display chip 250 are electrically connected to the touch electrodes 244 through the first conductive portion 201 and the second conductive portion 202 .
[0054] In the manufacturing process of the touch display panel 20, a buffer layer 212, an active layer 213, a first gate insulating layer 214, a first gate 215, a second gate insulating layer 216, a second gate 217, an interlayer insulating layer 218, a source and drain electrode 219, and a planar layer 260 are first formed on a substrate 211 in sequence. Then, a light-emitting layer 220 is formed on the planar layer 260. Then, an inorganic barrier layer 231 is deposited on the light-emitting layer 220, and the edge of the inorganic barrier layer 231 protrudes from the light-emitting layer 220 to form a part of the boundary 2301; an organic buffer layer 232 is formed on the inorganic barrier layer 231 by inkjet printing, and then one side of the inorganic barrier layer 231 is deposited on the organic buffer layer 232, and the edge of the inorganic barrier layer 231 protrudes from the light-emitting layer 220 to form another part of the boundary 2301. A first conductive portion 201 is formed on the boundary portion 2301. For example, the first conductive portion 201 may be a metal conductive hole having a conductive metal on the inner wall. Finally, a first inorganic insulating layer 241 is deposited on the side of the inorganic barrier layer 231 away from the organic buffer layer 232, and the edge of the first inorganic insulating layer 241 protrudes from the light-emitting layer 220 to at least partially overlap with the boundary portion 2301. A conductive bridge 242 is deposited and patterned on the first inorganic insulating layer 241, and a second inorganic insulating layer 243 covering the conductive bridge 242 is deposited on the first inorganic insulating layer 241, and the edge of the second inorganic insulating layer 243 protrudes from the light-emitting layer 220 to at least partially overlap with the boundary portion 2301. The first inorganic insulating layer 241 and the second inorganic insulating layer 243 together constitute an inorganic insulating layer, and a second conductive portion 202 is formed on the portion where the inorganic insulating layer overlaps with the boundary portion. For example, the second conductive portion 202 can be a metal conductive hole with a conductive metal on the inner wall, which sequentially penetrates the first inorganic insulating layer 241 and the second inorganic insulating layer 243. The second conductive portion 202 is electrically connected to the first conductive portion 201. A touch electrode 244 and a connecting line 2445 corresponding to the upper portion between two adjacent pixel light-emitting regions are deposited and patterned on the second inorganic insulating layer 243, and one end of the connecting line 2445 is connected to the touch electrode 244, and the other end is connected to the second conductive portion 202. An organic protective layer 245 covering the touch electrode 244 and the connecting line 2445 is formed on the second inorganic insulating layer 43.
[0055] It is understandable that in some embodiments, the order of the first conductive part 201 and the second conductive part 202 can be appropriately adjusted. For example, after forming the second inorganic insulating layer 243, a hole can be formed by etching, drilling, etc., which passes through the second inorganic insulating layer 243, the first inorganic insulating layer 241, and the inorganic barrier layer 231 in sequence, and then a metal conductor is formed on the inner wall of the hole to obtain the first conductive part 201 and the second conductive part 202 in the above embodiment.
[0056] See also Figure 6 , Figure 6 2 is a schematic diagram of a cross-sectional structure of a touch display panel 20 in some other embodiments of the present application, wherein the array substrate 210 may include a substrate 211, and a buffer layer 212, an active layer 213, a first gate insulating layer 214, a first gate 215, a second gate insulating layer 216, a second gate 217, an interlayer insulating layer 218, a source and drain electrode 219, and a flat layer 260 (the buffer layer 212, the active layer 213, the first gate insulating layer 214, the first gate 215, the second gate insulating layer 216, the second gate 217, the interlayer insulating layer 218, the source and drain electrode 219 are sequentially formed on the substrate 211). Figure 6 The substrate 211 and the light-emitting layer 220 are spaced apart, and the flat layer 260 is disposed between the substrate 211 and the light-emitting layer 220. Further, the flat layer 260 may have an edge disposed opposite to the binding area 2402, that is, the edge of the flat layer 260 may have an overlapping area with the binding area 2402.
[0057] In one embodiment, a third conductive part 203 may be provided on the edge of the flat layer 260, and the two ends of the third conductive part 203 are respectively connected to the touch display chip 250 and the first conductive part 201. Specifically, the overlapping area of the edge of the flat layer 260 and the binding area 2402 covers one end of the first conductive part 201, and the third conductive part 203 overlaps at least partially with the first conductive part 201. Among them, the third conductive part 203 can be a hole with a conductive metal on the inner wall. Optionally, the aperture of the third conductive part 203 is greater than or equal to the aperture of the first conductive part 201 to ensure the effective electrical connection between the third conductive part 203 and the first conductive part 201. Optionally, the third conductive part 203 and the first conductive part 201 are coaxially arranged. Of course, in other embodiments, the third conductive part 203 can be a strip conductor or a columnar conductor; the end surface area of the third conductive part 203 is greater than or equal to the end surface area of the first conductive part 201 to ensure the effective electrical connection between the third conductive part 203 and the first conductive part 201. Optionally, the third conductive portion 203 and the first conductive portion 201 are coaxially arranged.
[0058] The touch display panel and electronic device provided by the present application can realize touch operation by setting a first conductive part on the boundary of the packaging layer, connecting the array substrate and the connection line through the first conductive part, and then electrically connecting the array substrate and the touch electrode. Compared with the prior art of "setting a conductive via connecting the touch electrode and the array substrate outside the boundary of the packaging layer so that the touch electrode and the array substrate can be electrically connected", the spacing between the conductive via and the packaging layer can be omitted, that is, the influence of the layout position of the conductive via on the realization of the narrow frame of the touch display panel is eliminated, thereby realizing the narrow frame effect of the touch display panel.
[0059] Furthermore, in some other embodiments of the present application, a mobile terminal device 900 is provided. Figure 7 , Figure 7 It is a schematic diagram of the structure of a mobile terminal device in other embodiments of the present application. The mobile terminal device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the terminal device 900 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the touch display panel 20 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power supply 990. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire terminal device 900.
[0060] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941 (i.e., the touch display panel 20 in the above embodiment); the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the mobile terminal device. For the relevant technical features of the display module, please refer to the relevant description of the above display module embodiment, which will not be described in detail here.
[0061] The touch display panel, electronic device, and mobile terminal device provided in the embodiments of the present application can realize touch operation by setting a first conductive portion on the boundary of the packaging layer, connecting the array substrate and the connection circuit through the first conductive portion, and then electrically connecting the array substrate and the touch electrode. Compared with the technical solution of "setting a conductive via connecting the touch electrode and the array substrate outside the boundary of the packaging layer so that the touch electrode and the array substrate can be electrically connected", the spacing between the conductive via and the packaging layer can be omitted, that is, the influence of the layout position of the conductive via on the realization of the narrow frame of the touch display panel is eliminated, thereby realizing the narrow frame effect of the touch display panel.
[0062] It should be noted that the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.
[0063] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A touch display panel, characterized in that: The touch display panel comprises: An array substrate and a light-emitting layer disposed on the array substrate; an encapsulation layer, disposed on a side of the light-emitting layer away from the array substrate; and A touch layer is disposed on a side of the packaging layer away from the array substrate; the touch layer comprises a touch area and a binding area located at least on one side of the touch area, the touch area is provided with a touch electrode, and the binding area is provided with a connecting line; The packaging layer has a boundary portion that at least partially overlaps with the binding area, and a first conductive portion is provided on the boundary portion. One end of the connecting line is connected to the touch electrode and the other end is connected to the first conductive portion. The first conductive portion is electrically connected to the array substrate.
2. The touch display panel according to claim 1, characterized in that: The boundary portion extends from a surface of the light emitting layer away from the array substrate to the array substrate.
3. The touch display panel according to claim 2, characterized in that: A second conductive portion electrically connected to the first conductive portion is disposed on the binding region of the touch layer, and an end of the second conductive portion facing away from the first conductive portion is electrically connected to the connection circuit.
4. The touch display panel according to claim 3, characterized in that: The aperture of the first conductive portion is greater than or equal to the aperture of the second conductive portion.
5. The touch display panel according to claim 3, characterized in that: The encapsulation layer includes an inorganic barrier layer and an organic buffer layer which are stacked, and the boundary portion is formed at the edge of the inorganic barrier layer and protrudes from the edge of the organic buffer layer.
6. The touch display panel according to claim 3, characterized in that: The touch electrode includes a first electrode and a second electrode, and the first electrode and the second electrode are arranged alternately to form a grid pattern; wherein the connecting line is arranged outside the edge of the grid pattern.
7. The touch display panel according to claim 6, characterized in that: The touch layer includes: a first inorganic insulating layer disposed on the encapsulation layer, a conductive bridge disposed on the first inorganic insulating layer, a second inorganic insulating layer disposed on the first inorganic insulating layer and covering the conductive bridge, a touch electrode disposed on the second inorganic insulating layer, and an organic protective layer disposed on the second inorganic insulating layer and covering the touch electrode; The second conductive portion sequentially penetrates the first inorganic insulating layer and the second inorganic insulating layer, and the conductive bridge connects two adjacent first electrodes.
8. The touch display panel according to claim 6, characterized in that: The touch display panel also includes a touch display chip arranged on the array substrate, and a projection of the touch display chip on the array substrate is arranged at an interval with a projection of the touch layer on the array substrate; wherein the touch display chip is electrically connected to the touch electrode through the first conductive portion, the second conductive portion and the touch electrode.
9. The touch display panel according to claim 8, characterized in that: The touch display chip includes a first side, a second side, a third side and a fourth side connected in sequence end to end, the first side and the third side are arranged opposite to each other, and the first side is located on a side of the third side close to the touch layer; wherein the touch display chip has touch pins arranged on the first side, the second side and / or the fourth side, and the touch pins are electrically connected to the touch electrodes through the first conductive part, the second conductive part and the touch electrode.
10. The touch display panel according to claim 8, characterized in that: The array substrate includes: a base and a flat layer, the base is spaced apart from the light-emitting layer, and the flat layer is arranged between the base and the light-emitting layer; the flat layer has an edge arranged opposite to the binding area, a third conductive part is arranged on the edge of the flat layer, and two ends of the third conductive part are electrically connected to the touch display chip and the first conductive part respectively.
11. An electronic device, characterized in that: It comprises a shell component and a touch display panel connected to one side of the shell component; wherein the touch display panel is the touch display panel according to any one of claims 1-10.