Method for processing key with high and low clamping pins

Abstract

The invention discloses a key processing method with high and low clamping feet, which is used for processing keys in batches, and comprises the following steps: processing at least one groove group in a first side surface of a plate based on the distance between the two clamping feet of the key and the height of each clamping foot, the groove group comprising a deep groove and a shallow groove parallel to the deep groove; a plurality of key caps are machined in the area, corresponding to the space between the deep groove and the shallow groove, of the plate, the key caps are formed on the second side face, opposite to the first side face, of the plate, and the key caps are distributed in the length direction of the deep groove and the shallow groove at intervals; the length direction of each key cap is perpendicular to the length direction of the deep groove and the length direction of the shallow groove. Processing a low clamping pin connected to the key cap at the deep groove corresponding to each key cap, and processing a high clamping pin connected to the key cap at the shallow groove corresponding to each key cap; and cutting off wastes to obtain a key finished product.

Description

Technical Field

[0001] The invention relates to the technical field of product processing, and in particular to a method for processing a key with high and low clamping feet. Background Art

[0002] The button is an important component installed on the side wall of the electronic device, usually including the power button, volume button, etc., which is used to realize the interaction between the user and the electronic device. Its design feature is that it can be installed on the side wall along the thickness direction of the side wall and move into the inside of the electronic device. By pressing the internal button FPC switch to conduct the circuit, a specific button function is realized.

[0003] The key mainly includes a keycap, a plurality of (usually two) clamping feet arranged on the inner side of the keycap, and a pressing contact portion arranged on the inner side of the keycap. The pressing contact portion receives the pressing force from the keycap and transmits it to the switch of the key FPC, thereby making the circuit of the key FPC conductive.

[0004] Normally, the heights of the two pins of the button are designed to be consistent. The purpose of this design is to simplify the processing process, making the processing of the pins easier to control, and also facilitating the processing of the assembly part for assembling the button on the electronic device. However, in some embodiments, it may be necessary to design the heights of the pins to be inconsistent according to actual needs. Although this design can meet certain specific functional requirements, it also increases the processing complexity of the button and affects the processing time and defect rate. Since the height of each pin needs to be processed independently, the time of the entire processing process will be extended. At the same time, various factors in the processing process (such as processing accuracy, material properties, etc.) may cause errors in the height of the pins, thereby increasing the defect rate. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a method for processing buttons with high and low clamping feet in batches.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a method for processing buttons with high and low clamping feet, which is used for batch processing of buttons, comprising the following steps:

[0007] Based on the distance between the two pins of the key and the height of each pin, at least one set of grooves is processed on the first side of the plate, wherein the groove set includes a deep groove and a shallow groove parallel to the deep groove;

[0008] A plurality of key caps are processed in the area of ​​the plate corresponding to the area between the deep groove and the shallow groove, wherein the plurality of key caps are formed on a second side surface of the plate opposite to the first side surface, and the plurality of key caps are spaced apart along the length direction of the deep groove and the shallow groove, and the length direction of each key cap is perpendicular to the length direction of the deep groove and the shallow groove;

[0009] A low foot connected to the key cap is processed at the deep groove corresponding to each key cap, and a high foot connected to the key cap is processed at the shallow groove corresponding to each key cap;

[0010] The waste material is cut off to obtain the finished key product.

[0011] Furthermore, the step of processing a plurality of key caps in the area of ​​the plate corresponding to the deep groove and the shallow groove includes the following sub-steps:

[0012] An annular groove is processed on the second side surface of the plate corresponding to the area between the deep groove and the shallow groove, so that the area of ​​the plate located in the annular groove forms a boss area;

[0013] Processing a plurality of keycap blanks along the length direction of the boss area;

[0014] The keycap blank is contoured to form the keycap.

[0015] Furthermore, the step of processing a plurality of keycap blanks along the length direction of the boss area includes the following sub-steps:

[0016] A keycap forming area is reserved in the boss area, and other areas except the keycap forming area on both sides of the boss area are narrowed to form narrowed side surfaces;

[0017] A plurality of grooves are machined at intervals along the length direction of the boss area, and the grooves penetrate the boss area along the width direction of the boss area, so that a keycap blank is formed between every two adjacent grooves, and two ends of the keycap blank protrude from the two narrowed side surfaces of the boss area along the width direction of the boss area.

[0018] Furthermore, in the process of performing shape processing on the keycap blank, the following steps are included:

[0019] Performing fine processing on the outer surface of the keycap rough blank to obtain the outer surface of the keycap;

[0020] Arc transition processing is performed at the intersection between the top surface and the outer facade of the key cap blank.

[0021] Furthermore, in the process of processing the shape of the keycap blank, it also includes:

[0022] The top surface of the key cap blank is processed to form a highlight arc groove.

[0023] Furthermore, before the step of performing shape processing on the keycap blank, the method further includes the following steps:

[0024] Inclined surfaces are processed on the two lateral side walls of the keycap blank close to the first side surface of the plate, and the two inclined surfaces are inclined toward the first side surface and in opposite directions, so that the lower end width of the keycap blank is gradually narrowed.

[0025] Furthermore, the step of processing a low foot connected to the keycap at the deep groove corresponding to each keycap, and processing a high foot connected to the keycap at the shallow groove corresponding to each keycap includes the following steps:

[0026] A low foot and a high foot forming area of ​​each keycap are reserved on the first side of the plate, and a thinning process is performed on the first side corresponding to each keycap area to form a low foot corresponding to the deep groove position and connected to the keycap and a high foot corresponding to the shallow groove position and connected to the keycap;

[0027] The groove is hollowed out in the thickness direction of the plate, so that a separation seam is formed at the groove, which penetrates the plate in the thickness direction, and the separation seam is used to separate each two adjacent keycaps and each two adjacent key feet, and each key is connected to the plate through a low foot and a high foot;

[0028] In the step of cutting off the waste material, the low card foot and the high card foot are separated from the plate to obtain a finished key product.

[0029] Furthermore, the step of leaving a low-foot molding area and a high-foot molding area of ​​each keycap on the first side of the plate and performing thinning processing on the first side corresponding to each keycap area also includes:

[0030] A pressing contact portion molding area is reserved at a position on the first side of the plate corresponding to the central area of ​​the keycap, and thinning is performed on areas other than the pressing contact portion molding area, the low-foot molding area and the high-foot molding area on the first side to process the low-foot, the high-foot and the pressing contact portion located on one side of the keycap.

[0031] Furthermore, before the step of separating the low foot and the high foot from the plate to obtain the finished key product, the following steps are also included:

[0032] Processing a receiving groove on a side of the pressing contact portion away from the key cap;

[0033] Adhesive is injected into the receiving groove, and an adhesive pad is bonded thereto.

[0034] Furthermore, the step of injecting adhesive into the receiving groove and bonding an adhesive pad specifically includes:

[0035] Integrating a plurality of rubber pads corresponding to the plurality of buttons one by one on a film;

[0036] Place the rubber pad downward and align the plurality of rubber pads with the receiving grooves of the plurality of keys one by one;

[0037] The plurality of rubber pads are pressed tightly into the containing groove by using a pressing structure.

[0038] Based on the above embodiments, the method for processing a key with high and low feet of the present invention has the following beneficial effects: at least one group of groove groups is processed on the plate, and the groove group is set based on the distance between the high foot and the low foot of the key, and the height of the high foot and the low foot, so that the groove group includes deep grooves and shallow grooves parallel to each other, and the processing depth of the deep groove is set according to the height of the low foot, and the processing depth of the shallow groove is set according to the height of the high foot; then a plurality of key caps are processed along the length direction of the groove group, the low foot of each key is processed at the deep groove, and the high foot of each key is processed at the shallow groove, so that the height of the high foot and the height of the low foot of the keys processed in batches are consistent, thereby improving the yield rate and improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0040] Figure 1a It is a structural schematic diagram of an embodiment of a key with high and low clamping feet according to the present invention.

[0041] Figure 1b It is a structural schematic diagram of another perspective of an embodiment of a key with high and low clamping feet of the present invention.

[0042] Figure 2 It is a flow chart of an embodiment of a method for processing a key with high and low pins according to the present invention.

[0043] Figure 2a It is a schematic diagram of the structure in which a groove group is processed on a plate.

[0044] Figure 3 yes Figure 2 Flowchart of the middle keycap processing.

[0045] Figure 3a It is a schematic diagram of the structure in which annular grooves and boss areas are machined on a plate.

[0046] Figure 4 yes Figure 3 Processing flow chart of the middle key cap rough blank.

[0047] Figure 4a It is a schematic diagram of the structure formed after narrowing the two lateral sides of the boss area.

[0048] Figure 4b yes Figure 4a Enlarged view of part A in the figure.

[0049] Figure 4c yes Figure 4a Sectional view of AA.

[0050] Figure 4d It is a schematic diagram of the structure formed after the plate undergoes S122 and S123 processing steps.

[0051] Figure 4e yes Figure 4d Schematic diagram of the structure from another perspective.

[0052] Figure 4f yes Figure 4e Enlarged view of part B in the middle.

[0053] Figure 5 yes Figure 3 Flow chart of the shape processing of the middle key cap rough blank.

[0054] Figure 6 yes Figure 2 Processing flow chart for medium-high and low clamping feet.

[0055] Figure 6a It is a schematic diagram of the structure of the key after it is processed and formed but not separated from the plate.

[0056] Figure 7 yes Figure 2 Flowchart of the middle rubber pad assembly.

[0057] Figure 7a It is a schematic diagram of the structure in which the rubber pad is integrated on the film.

[0058] Figure 7b It is a schematic diagram of the structure of the rubber pad being installed in the receiving groove.

[0059] The accompanying drawings in the specification are numeraled as follows:

[0060] Key 10; key cap 11; pressing contact portion 12; highlight arc groove 13; high card foot 14; card column 14a; card block 14b; low card foot 15; receiving groove 12a; rubber pad 12b; film 12c; second positioning hole 12d; third positioning hole 102;

[0061] Plate 100; first side surface 100a; second side surface 100b; first positioning hole 101; groove group 110; deep groove 111; shallow groove 112; inner groove wall 113; outer groove wall 114; processing area C1;

[0062] Annular groove 121; boss area 122; key cap molding area 1221; groove 1221a; inclined surface 1221b; reference plane 1221c; narrowed side surface 1222; low foot molding area C2; high foot molding area C3. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0064] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0066] See also Figure 1a and Figure 1b , Figure 1a and Figure 1b: is a schematic diagram of the structure of a key with high and low clamping feet of the present invention. The key 10 shown includes a keycap 11, two clamping feet arranged on the first side of the keycap 11, and a pressing contact portion 12 arranged on the first side of the keycap 11 and located between the two clamping feet, and the pressing contact portion 12 can be configured at the center of the keycap 11. The keycap 11 is in the shape of a long strip as a whole, and the connection between its various side surfaces is rounded so that the projection of the facade (peripheral surface) of the keycap 11 is similar to the shape of a runway. A highlight arc groove 13 can be configured on the second side of the keycap 11, and the second side is a side opposite to the first side. The two clamping feet are distributed at both ends of the keycap 11, one of which is higher in height and the other is lower in height. In the following, for the convenience of description, the clamping foot with a higher height is referred to as a high clamping foot 14, and the clamping foot with a lower height is referred to as a low clamping foot 15. The higher height and the lower height respectively refer to: the distance between the end surface of the high clamping foot 14 away from the keycap 11 and the keycap 11 is larger, and the distance between the end surface of the low clamping foot 15 away from the keycap 11 and the keycap 11 is smaller than the distance of the high clamping foot 14. The high clamping foot 14 and the low clamping foot 15 both include a clamping column 14a vertically connected to the keycap 11 and a clamping block 14b vertically connected to the end of the clamping column 14a away from the keycap 11. The pressing contact portion 12 is configured as a columnar structure, such as an elliptical columnar structure or a cylindrical structure, and a receiving groove 12a is provided at the end of the pressing contact portion 12 away from the keycap 11, and the receiving groove 12a is used to bond a rubber pad 12b (such as a silicone pad).

[0067] See also Figure 2 , Figure 2 1 is a flow chart of an embodiment of a method for processing a key with high and low clamping feet of the present invention. The method for processing a key with high and low clamping feet shown can process keys 10 in batches, and includes the following steps:

[0068] S110, based on the distance between the two pins of the key 10 and the height of each pin, at least one set of groove groups 110 is processed on the first side 100a of the plate 100, wherein the groove group 110 includes a deep groove 111 and a shallow groove 112 parallel thereto.

[0069] See also Figure 2a Before this step, a plurality of first positioning holes 101 may be pre-processed at a plurality of corner positions of the plate 100 , and the first positioning holes 101 are used for positioning in subsequent processing.

[0070] The plate 100 may be rectangular, such as a rectangular plate 100 or a square plate 100, or may be other shapes, such as a circular plate 100, an elliptical plate 100, a polygonal plate 100, etc. For the convenience of description, the present embodiment is described by taking a rectangular plate 100 as an example.

[0071] Three groups of grooves 110 are processed on the first side surface 100a of the plate 100 along the length direction X of the plate 100. Each group of grooves 110 includes deep grooves 111 and shallow grooves 112 that are spaced apart. Each group of deep grooves 111 and shallow grooves 112 has inner groove walls 113 that are close to each other and outer groove walls 114 that are far away from each other. The distance between the deep grooves 111 and shallow grooves 112 of each group is adapted to the distance between the two clamping feet. The thickness of the plate 100 corresponding to the deep grooves 111 is less than the thickness corresponding to the shallow grooves 112, so that in the subsequent processing, a low clamping foot 15 with a lower height is processed at the deep grooves 111, and a high clamping foot 14 with a higher height is processed at the shallow grooves 112. In this embodiment, the high clamping feet 14 and the low clamping feet 15 of the buttons 10 that are subsequently processed and distributed along the length direction X of the deep grooves 111 and the shallow grooves 112 are the same in height.

[0072] In the three groups of groove sets 110, the length of each group of groove sets 110 is distributed along the width direction Y of the plate 100. That is, in each group of groove sets 110, the deep grooves 111 and the shallow grooves 112 are arranged in parallel and spaced apart along the length direction X of the plate 100, and the lengths of the deep grooves 111 and the shallow grooves 112 extend along the width direction Y of the plate 100. The area between the deep grooves 111 and the shallow grooves 112 of each group of groove sets 110 on the plate 100 (including the area between the deep grooves 111 and the shallow grooves 112 on the first side 100a of the plate 100 and the area between the deep grooves 111 and the shallow grooves 112 on the second side) forms a processing area C1 (shown in a dotted box in the figure) for processing a plurality of keys 10. Therefore, the three groove groups 110 form three processing areas C1, the lengths of the three processing areas C1 are distributed along the width direction Y of the plate 100, and the widths of the three processing areas C1 (i.e., the distance from the deep groove 111 to the shallow groove 112) are distributed along the length direction X of the plate 100.

[0073] S120. A plurality of keycaps 11 are processed in a processing area C1 of the plate 100 corresponding to between the deep groove 111 and the shallow groove 112, wherein the plurality of keycaps 11 are formed on a second side surface 100b of the plate 100 opposite to the first side surface 100a, and the plurality of keycaps 11 are spaced apart along the length direction of the deep groove 111 and the shallow groove 112, and the length direction of each keycap 11 is perpendicular to the length direction of the deep groove 111 and the shallow groove 112.

[0074] See also Figure 3 , this step includes the following sub-steps:

[0075] S121, see Figure 3aAn annular groove 121 is CNC-machined on the second side surface 100 b of the plate 100 corresponding to the area between the deep groove 111 and the shallow groove 112 , so that the area on the plate 100 located within the annular groove 121 forms a boss area 122 .

[0076] In this step, the three groove groups 110 mentioned above are used as an example. On the second side surface 100b, three annular grooves 121 surrounding the three processing areas C1 are processed at the three processing areas C1 between the deep grooves 111 and the shallow grooves 112 corresponding to the three groove groups 110. The three annular grooves 121 enable the three processing areas C1 to form three boss areas 122. Each of the annular grooves 121 has an inner annular wall, an outer annular wall, and an annular bottom wall formed between the inner annular wall and the outer annular wall.

[0077] S122, processing a plurality of keycap blanks along the length direction of the boss area 122. Figure 4 , this step includes the following sub-steps:

[0078] S1221, see Figure 4a and Figure 4b A key cap forming area 1221 is reserved in the boss area 122 , and other areas on both lateral sides of the boss area 122 except the key cap forming area 1221 are narrowed to form narrowed side surfaces 1222 .

[0079] The keycap forming area 1221 refers to a portion of the boss area 122 that is away from the first side surface 100a of the plate 100 and has a certain thickness (matching the thickness of the keycap 11). That is, in the accompanying drawings, the upper end of the boss area 122 is regarded as the keycap forming area 1221, and the lateral sides of the lower end of the boss area 122 need to be narrowed. When the lateral sides of the boss area 122 are narrowed, the cross section of the entire boss area 122 is T-shaped, wherein the wider portion is the keycap forming area 1221 that has not been narrowed.

[0080] See also Figure 4c When the lateral sides of the boss area 122 are narrowed, on the horizontal projection plane (the projection plane projected along the thickness direction of the plate 100), the two narrowed side surfaces 1222 fall into the deep groove 111 and the shallow groove 112 respectively, that is, the two narrowed side surfaces 1222 are respectively located between the inner groove wall 113 and the outer groove wall 114 of the deep groove 111 and the shallow groove 112, so as to leave a margin (low clamping foot forming area C2 and high clamping foot forming area C3) for subsequent processing of the low clamping foot 15 and the high clamping foot 14.

[0081] S1222, see Figure 4d and Figure 4eA plurality of spaced grooves 1221a are processed along the length direction of the boss area 122 (keycap molding area 1221), and the grooves 1221a penetrate the boss area 122 along the width direction of the boss area 122, so that a keycap blank (not shown in the figure) is formed between each two adjacent grooves 1221a, and the two ends of the keycap blank protrude from the two narrowed side surfaces 1222 of the boss area 122 along the width direction of the boss area 122.

[0082] S1223, see Figure 4f The inclined surfaces 1221b are processed on the two lateral side walls of the keycap blank near the lower end, and the two inclined surfaces 1221b are inclined toward the first side surface 100a (downward) of the plate 100 and in opposite directions, so that the width of the lower end of the keycap blank is gradually narrowed, thereby making the lateral width of one end of the keycap blank near the first side surface 100a form a gradually narrowing conical surface.

[0083] In this step, after the inclined surface 1221b is processed, a plane is also processed horizontally inward from the two lateral side walls of the keycap blank. The plane is located at the lower inclined end of the inclined surface 1221b and intersects with it. The plane is used as a reference plane 1221c for subsequent processing of the high clamping foot 14 and the low clamping foot 15. The reference plane 1221c is conducive to the molding of the inclined surface 1221b and the removal of processing residues.

[0084] S123 , performing shape processing on the key cap blank to form the key cap 11 .

[0085] See also Figure 5 , this step includes the following sub-steps:

[0086] S1231, fine-processing the outer surface of the keycap blank to obtain the outer surface of the keycap 11;

[0087] S1232, performing arc transition processing at the intersection between the top surface (second side surface 100b) and the outer facade of the keycap blank.

[0088] S1233 , processing the top surface (the second side surface 100 b ) of the keycap blank to form a highlight arc groove 13 to form a keycap 11 .

[0089] S130, a low foot 15 connected to the keycap 11 is processed at the deep groove 111 corresponding to each keycap 11, and a high foot 14 connected to the keycap 11 is processed at the shallow groove 112 corresponding to each keycap 11. Figure 6 and Figure 6a , this step includes:

[0090] S131: In this step, a low-foot forming area C2 and a high-foot forming area C3 (see FIG. 1 ) of each key cap 11 are reserved on the plate 100. Figure 4c ), the area corresponding to each keycap 11 on the first side surface 100a is thinned to form a low foot 15 corresponding to the position of the deep groove 111 and connected to the keycap 11, and a high foot 14 corresponding to the position of the shallow groove 112 and connected to the keycap 11. Preferably, a pressing contact portion forming area (not shown) is reserved at the position of the first side surface 100a of the plate 100 corresponding to the central area of ​​the keycap 11, and the areas other than the pressing contact portion forming area, the low foot forming area C2 and the high foot forming area C3 on the first side surface 100a are all thinned to form the low foot 15, the high foot 14 and the pressing contact portion 12 located on one side of the keycap 11.

[0091] In this step, the inner groove wall 113 of the deep groove 111 is used as the reference surface of the inner vertical surface of the low clamping foot 15 (the side of the clamping column facing the high clamping foot 14), and the inner groove wall 113 of the shallow groove 112 is used as the reference surface of the inner vertical surface of the high clamping foot 14 (the side of the clamping column 14a facing the low clamping foot 15). Processing is performed along the thickness direction of the plate 100 and along the reference vertical surfaces, and the portion located between the two reference vertical surfaces on the first side surface 100a of the plate 100 is thinned to the position of the reference plane 1221c, so that the area between the two reference vertical surfaces is recessed, and the two reference vertical surfaces and their outer portions (the portions away from each other along the length direction of the keycap 11) are retained, thereby processing the low clamping foot 15 and the high clamping foot 14.

[0092] The outer side elevations of the high clamping foot 14 and the low clamping foot 15 (side elevations where the two clamping columns 14a are away from each other) are formed by the narrowed side surface 1222. The clamping blocks 14b of the low clamping foot 15 and the high clamping foot 14 are formed by the portion between the deep groove 111 and the annular groove 121, and the portion between the shallow groove 112 and the annular groove 121, respectively.

[0093] S132. Hollow out the groove 1221a in the thickness direction of the plate 100 so that a separation seam is formed at the groove 1221a and passes through the plate 100 in the thickness direction, and the separation seam is used to separate every two adjacent keys 10: separate the keycaps 11 of every two adjacent keys 10, separate the clamping feet of every two adjacent keys 10, separate the rest of each key 10 except the low clamping foot 15 and the high clamping foot 14 from the plate 100, and connect each key 10 to the plate 100 through the low clamping foot 15 and the high clamping foot 14.

[0094] S140, processing a receiving groove 12a on a side of the pressing contact portion 12 away from the key cap 11;

[0095] S150, injecting adhesive into the receiving groove 12a, and bonding the adhesive pad 12b.

[0096] See also Figure 7 , Figure 7a and Figure 7b , this step may include the following sub-steps:

[0097] S151, integrating a plurality of rubber pads 12b corresponding one-to-one to the plurality of buttons 10 on the film 12c.

[0098] Based on the number and distribution area of ​​the buttons 10 processed in each processing area C1 (three processing areas C1 in this embodiment, three columns of buttons 10 are processed, and each column is composed of a plurality of buttons 10), a film 12c adapted to the shape of the distribution area is processed, and the film 12c has a certain degree of adhesion to prevent the rubber pad 12b from falling off during the assembly process of the rubber pad 12b), and a plurality of rubber pads 12b corresponding to the positions of the receiving grooves 12a of the plurality of buttons 10 are attached to the film 12c. In order to facilitate the quick and accurate positioning of the film 12c and the rubber pad 12b, a plurality of second positioning holes 12d are provided at the edge of the film 12c, and a plurality of third positioning holes 102 (see FIG. 102 ) are processed to match the positioning of the buttons 10 during the processing process. Figure 6a ).

[0099] S152, place the rubber pads 12b downward and align the plurality of rubber pads 12b with the receiving grooves 12a of the plurality of keys 10 one by one, so that the plurality of rubber pads 12b enter the corresponding receiving grooves 12a. In this step, the second positioning hole 12d on the film 12c is coaxially aligned with the third positioning hole 102, so that the rubber pads 12b can accurately enter the corresponding receiving grooves 12a.

[0100] S153. Use a pressing structure (not shown) to press the plurality of rubber pads 12b into the accommodating groove 12a. The pressing structure is provided with a plurality of corresponding pressing plates, the shape of which matches the shape of the film 12c. The pressing plate is provided with a positioning guide column for passing through the second positioning hole 12d and the third positioning hole 102, so as to position the film 12c and the plate 100 during the process of pressing the rubber pads 12b downward.

[0101] S160, cutting off the waste material to obtain a finished key product: separating the low clamping foot 15 and the high clamping foot 14 from the plate 100 to obtain a finished key product.

[0102] Based on the above embodiments, the processing method of the key 10 with high and low feet 15 of the present invention has the following beneficial effects: at least one group of groove groups 110 is processed on the plate 100, and the groove group 110 is set based on the distance between the high foot 14 and the low foot 15 of the key 10 and the height of the high foot 14 and the low foot 15, so that the groove group 110 includes deep grooves 111 and shallow grooves 112 parallel to each other, and the processing depth of the deep groove 111 is set according to the height of the low foot 15, and the processing depth of the shallow groove 112 is set according to the height of the high foot 14; then, a plurality of keycaps 11 are processed along the length direction of the groove group 110, and the low foot 15 of each key 10 is processed at the deep groove 111, and the high foot 14 of each key 10 is processed at the shallow groove 112, so that the height of the high foot 14 and the height of the low foot 15 of the keys 10 processed in batches are consistent, thereby improving the yield rate and improving the processing efficiency.

[0103] The above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for processing buttons with high and low card feet, used for batch processing of buttons, characterized in that: The following steps are involved: Based on the distance between the two pins of the key and the height of each pin, at least one set of grooves is processed on the first side of the plate, wherein the groove set includes a deep groove and a shallow groove parallel to the deep groove; A plurality of key caps are processed in the area of ​​the plate corresponding to the area between the deep groove and the shallow groove, wherein the plurality of key caps are formed on a second side surface of the plate opposite to the first side surface, and the plurality of key caps are spaced apart along the length direction of the deep groove and the shallow groove, and the length direction of each key cap is perpendicular to the length direction of the deep groove and the shallow groove; A low foot connected to the key cap is processed at the deep groove corresponding to each key cap, and a high foot connected to the key cap is processed at the shallow groove corresponding to each key cap; The waste material is cut off to obtain the finished key product.

2. The method for processing a key having high and low clamping feet according to claim 1, characterized in that: The step of processing a plurality of key caps in the area of ​​the plate corresponding to the deep groove and the shallow groove includes the following sub-steps: An annular groove is processed on the second side surface of the plate corresponding to the area between the deep groove and the shallow groove, so that the area of ​​the plate located in the annular groove forms a boss area; Processing a plurality of keycap blanks along the length direction of the boss area; The keycap blank is contoured to form the keycap.

3. The method for processing a key having high and low clamping feet according to claim 2, characterized in that: The step of machining a plurality of keycap blanks along the length direction of the boss area includes the following sub-steps: A keycap forming area is reserved in the boss area, and other areas except the keycap forming area on both sides of the boss area are narrowed to form narrowed side surfaces; A plurality of grooves are machined at intervals along the length direction of the boss area, and the grooves penetrate the boss area along the width direction of the boss area, so that a keycap blank is formed between every two adjacent grooves, and two ends of the keycap blank protrude from the two narrowed side surfaces of the boss area along the width direction of the boss area.

4. The method for processing a key having high and low clamping feet according to claim 2, characterized in that: The process of performing shape processing on the keycap blank includes: Performing fine processing on the outer surface of the keycap rough blank to obtain the outer surface of the keycap; Arc transition processing is performed at the intersection between the top surface and the outer facade of the key cap blank.

5. The method for processing a key having high and low clamping feet according to claim 4, characterized in that: The process of processing the shape of the keycap blank also includes: The top surface of the key cap blank is processed to form a highlight arc groove.

6. The method for processing a key having high and low clamping feet according to claim 2, characterized in that: Before the step of performing shape processing on the keycap blank, the following steps are also included: Inclined surfaces are processed on the two lateral side walls of the keycap blank close to the first side surface of the plate, and the two inclined surfaces are inclined toward the first side surface and in opposite directions, so that the lower end width of the keycap blank is gradually narrowed.

7. The method for processing a key having high and low clamping feet according to claim 3, characterized in that: The step of processing a low foot connected to the keycap at the deep groove corresponding to each keycap, and processing a high foot connected to the keycap at the shallow groove corresponding to each keycap includes the following steps: A low foot and a high foot forming area of ​​each keycap are reserved on the first side of the plate, and a thinning process is performed on the first side corresponding to each keycap area to form a low foot corresponding to the deep groove position and connected to the keycap and a high foot corresponding to the shallow groove position and connected to the keycap; The groove is hollowed out in the thickness direction of the plate, so that a separation seam is formed at the groove, which penetrates the plate in the thickness direction, and the separation seam is used to separate each two adjacent keycaps and each two adjacent key feet, and each key is connected to the plate through a low foot and a high foot; In the step of cutting off the waste material, the low card foot and the high card foot are separated from the plate to obtain a finished key product.

8. The method for processing a key having high and low clamping feet according to claim 7, characterized in that: The step of leaving a low-foot molding area and a high-foot molding area of ​​each keycap on the first side of the plate, and performing thinning processing on the first side corresponding to each keycap area, further includes: A pressing contact portion molding area is reserved at a position on the first side of the plate corresponding to the central area of ​​the keycap, and thinning is performed on areas other than the pressing contact portion molding area, the low-foot molding area and the high-foot molding area on the first side to process the low-foot, the high-foot and the pressing contact portion located on one side of the keycap.

9. The method for processing a key having high and low clamping feet according to claim 8, characterized in that: Before the step of separating the low foot and the high foot from the plate to obtain the finished key product, the following steps are also included: Processing a receiving groove on a side of the pressing contact portion away from the key cap; Adhesive is injected into the receiving groove, and an adhesive pad is bonded thereto.

10. The method for processing a key having high and low clamping feet according to claim 9, characterized in that: The step of injecting adhesive into the receiving groove and bonding an adhesive pad specifically includes: Integrating a plurality of rubber pads corresponding to the plurality of buttons one by one on a film; Place the rubber pad downward and align the plurality of rubber pads with the receiving grooves of the plurality of keys one by one; The plurality of rubber pads are pressed tightly into the containing groove by using a pressing structure.

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