Pick-up unit, mounting device, and pick-up method

Abstract

The invention provides a pick-up unit, a mounting device and a pick-up method, which can restrain bad conditions of chip parts when the chip parts are picked up from sheets. A pickup unit (30) according to an embodiment of the present invention comprises: a stage (35); a peeling mechanism (36) including a plurality of blocks (40) arranged concentrically inside an opening (35b) formed in the placement surface (35a); and a collet (37) that sucks and holds the semiconductor chip (101). A recessed portion (C1b) extending from a side portion (B11) of a front end surface (41a) is formed on an outer side surface (41b) of the first block (41). The recess (C1b) includes a bottom surface (S11) and a pair of side surfaces (S12, S13). The pair of side surfaces (S12, S13) extend in a direction inclined with respect to a plane perpendicular to the outer side surface (41b) such that the pair of side surfaces (S12, S13) move away from the outer side surface (41b) in the direction opposite to the direction in which the pair of side surfaces (S12, S13) face each other as the pair of side surfaces (S12, S13) approach the outer side surface (41b) from the bottom surface (S11) when the tip surface (41a) is viewed in the Z-axis direction.

Description

Technical Field

[0001] The invention relates to a picking unit, a mounting device and a picking method. Background Art

[0002] Semiconductor chips obtained by singulating semiconductor wafers are structural parts of electronic devices. In the manufacturing process of electronic devices, there is an operation of picking up semiconductor chips attached to a wafer sheet from a wafer sheet and arranging them on a circuit board. As methods for picking up semiconductor chips, for example, methods described in Patent Documents 1 to 3 are known. For example, in the method described in Patent Document 1, the back side of the wafer sheet surrounding the semiconductor chip is adsorbed on the surface of a carrier, and a plurality of lift pins arranged at the opening of the carrier are made to protrude upwards more than the surface of the carrier, thereby pushing the back side of the wafer sheet and lifting up the semiconductor chip on the wafer sheet. Thereafter, for example, by descending sequentially from the outermost lift pins, the semiconductor chip is peeled off from the wafer sheet and picked up.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2018-182278

[0006] [Patent Document 2] Japanese Patent Application Publication No. 2006-005030

[0007] [Patent Document 3] Japanese Patent Application Publication No. 2022-114399 Summary of the invention

[0008] [Problems to be solved by the invention]

[0009] In recent years, the thickness of semiconductor chips has gradually become thinner in response to the requirements of high integration. If such a thin semiconductor chip is to be peeled off from a wafer sheet, the semiconductor chip lifted up by the lift pins may deform significantly following the deformation of the wafer sheet. As a result, there is a possibility of causing damage to the semiconductor chip and other undesirable situations.

[0010] The present invention provides a picking unit, a mounting device and a picking method which can suppress possible bad situations of chip parts when picking up chip parts from sheets.

[0011] [Technical means to solve the problem]

[0012] The pick-up unit of one embodiment of the present invention is a pick-up unit for picking up chip parts attached to the surface of a sheet from the surface of a sheet, and the pick-up unit includes: a carrier, including a loading surface for loading chip parts through the sheet, and adsorbing the back side of the sheet; a peeling mechanism, including a plurality of blocks arranged concentrically inside an opening formed on the loading surface in a state capable of reciprocating along the normal direction of the loading surface, and the chip parts are peeled off from the surface of the sheet by the plurality of blocks protruding from the opening; and a chip holding portion, which picks up the chip parts from the surface of the sheet by adsorbing and holding the chip parts, and the plurality of blocks are respectively It includes: a front end face facing the back side of the sheet in the normal direction; and an outer side face extending from the front end face along the normal direction, a recess is formed on the outer side face of at least one of the multiple blocks, the recess extends from the edge connecting the adjacent corners in the front end face along the normal direction, the recess includes a bottom recessed from the outer side face, and a pair of side faces connecting the bottom and the outer side face, and the pair of side faces extend in a direction inclined relative to a surface perpendicular to the outer side face in a manner that, when the front end face is observed in the normal direction, they move away from each other in a direction opposite to the direction in which they face each other as they approach the outer side face from the bottom.

[0013] The pickup unit includes a plurality of blocks for pushing up the chip component. When the plurality of blocks push up the chip component, a tension in the tensile direction is applied to the sheet to which the chip component is attached. In the state, when the chip component is peeled off from the sheet, the corner of the chip component is likely to become the starting point of peeling, and stress concentration is likely to occur at the corner. In contrast, in the pickup unit, a recess extending from the edge of the front end surface along the normal direction is formed on the outer side surface of at least one of the plurality of blocks. In this case, since the starting point of peeling is also likely to be formed near the recess, it is possible to suppress the situation where a large stress is applied to the corner of the chip component. Furthermore, when the front end surface is observed in the normal direction, a pair of side surfaces of the recess extend in a direction inclined relative to a surface perpendicular to the outer side surface in a manner that they move away from each other in a direction opposite to the facing direction as they approach the outer side surface from the bottom. In this case, unlike the case where the pair of side surfaces of the recess extend along a surface perpendicular to the outer side surface, the stress acting on the starting point of peeling formed in the recess can be dispersed in the tensile direction perpendicular to the outer side surface and in the direction perpendicular to the tensile direction. Thus, the stress in the tensile direction applied to the vicinity of the recessed portion can be suppressed to be small. Therefore, in the pickup unit, when the chip component is peeled off from the surface of the sheet, the situation where a large stress acts locally on the chip component can be suppressed. Thus, the occurrence of undesirable situations such as damage to the chip component caused by stress concentration can be suppressed.

[0014] In the pickup unit, a plurality of blocks may include an outermost block located at the outermost position inside the opening, and a recess may be formed on the outer side surface of at least the outermost block among the plurality of blocks. When the chip component is pushed up by the plurality of blocks, the sheet material to which the chip component is attached is easily stretched significantly by the outermost block located at the outermost position. In this case, the sheet material is greatly acted upon by the tension brought by the outermost block. In the structure, since the recess is formed on the outer side surface of the outermost block, it is possible to suppress the situation where the large stress generated by the tension acts locally on the chip component. As a result, it is possible to effectively suppress the occurrence of adverse conditions such as damage to the chip component caused by stress concentration.

[0015] In the pickup unit, a recess may be formed on each outer side of the plurality of blocks. For example, after the chip parts are pushed up by the plurality of blocks, each block returns to its original position, and the chip parts are sometimes peeled off from the surface of the sheet. In the structure, since the recess is formed on each outer side of the plurality of blocks, even if any one of the blocks generates a large tension in the sheet, the large stress generated by the tension can be suppressed from acting locally on the chip parts. As a result, the occurrence of adverse conditions such as damage to chip parts caused by stress concentration can be effectively suppressed.

[0016] In the pickup unit, the plurality of blocks may each include a plurality of outer side surfaces extending from the front end surface along the normal direction, and a recess may be formed on each of the plurality of outer side surfaces. In this case, the stress applied to the chip components can be suppressed to a small value near the respective recesses of the plurality of outer side surfaces of the block, thereby effectively suppressing the occurrence of adverse conditions such as damage to the chip components caused by stress concentration.

[0017] In the pickup unit, the bottom of the recess may extend from the center of the side along the normal direction. In this case, when the chip component is peeled off from the surface of the sheet, it is easy to continuously tear off from the corner of the chip component toward the center of the side, so the chip component can be peeled off smoothly.

[0018] In the pickup unit, when the front end face is viewed in the normal direction, a pair of side faces of the recessed portion may be arranged symmetrically with respect to a reference axis passing through the center of the bottom and perpendicular to the outer side face. In this case, since the stress acting near the recessed portion can be evenly dispersed, it is possible to effectively suppress the situation where a large stress acts locally on the chip component. As a result, it is possible to effectively suppress the occurrence of adverse conditions such as damage to the chip component caused by stress concentration.

[0019] In the pick-up unit, the plurality of blocks may include: a first block, which is arranged at the outermost position inside the opening; a second block, which is arranged at the innermost position than the first block; and a third block, which is arranged at the innermost position than the second block. The first block, the second block, and the third block are respectively configured to reciprocate between a standby position in which the front end surface does not protrude from the loading surface and a push-up position in which the front end surface protrudes from the loading surface and the chip component is pushed up. After the first block, the second block, and the third block are moved from the standby position to the push-up position to push up the chip component, the first block and the third block are simultaneously moved from the push-up position to the standby position while maintaining the second block in the push-up position. Thereafter, the second block is moved from the push-up position to the standby position. In this way, after the first block, the second block, and the third block are moved to the push-up position, the case in which the first block and the third block are simultaneously moved to the standby position can shorten the chip component peeling time based on the push-up action compared with the case in which the first block, the second block, and the third block are sequentially moved to the standby position. Furthermore, if the second block is skipped and the first block and the third block are moved to the standby position at the same time, more chip component peeling starting points can be formed compared to the case where the first block and the second block adjacent to each other are moved to the standby position at the same time, so that the situation where a large stress acts locally on the chip component can be effectively suppressed. As a result, the occurrence of undesirable situations such as damage to the chip component caused by stress concentration can be effectively suppressed.

[0020] The mounting device of one embodiment of the present invention comprises: any one of the above-mentioned pickup units; and a bonding unit for bonding the chip component picked up by the pickup unit to the substrate. Since the mounting device comprises any one of the above-mentioned pickup units, the above-mentioned effect can be achieved.

[0021] A picking method according to an embodiment of the present invention is a picking method implemented using any of the above-mentioned picking units, and the picking method includes the following steps: pushing up a chip component by moving a first block, a second block, and a third block, which are arranged at the outermost position inside an opening, from a standby position where the front end surface does not protrude from the loading surface to a push-up position where the front end surface protrudes from the loading surface; while maintaining the second block in the push-up position, simultaneously moving the first block and the third block from the push-up position to the standby position; and peeling the chip component from the surface of the sheet by moving the second block from the push-up position to the standby position. In this way, after the first block, the second block, and the third block are moved to the push-up position, the case where the first block and the third block are simultaneously moved to the standby position can shorten the peeling time of the chip component based on the push-up action compared with the case where the first block, the second block, and the third block are moved to the standby position in sequence. Furthermore, if the second block is skipped and the first block and the third block are moved to the standby position at the same time, more chip component peeling starting points can be formed compared to the case where the first block and the second block adjacent to each other are moved to the standby position at the same time, so that the situation where a large stress acts locally on the chip component can be effectively suppressed. As a result, the occurrence of undesirable situations such as damage to the chip component caused by stress concentration can be effectively suppressed.

[0022] [Effects of the Invention]

[0023] The present invention provides a pickup unit, a mounting device and a pickup method which can suppress possible defects of chip components when picking up chip components from a sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram showing a mounting device according to one embodiment.

[0025] Figure 2 Yes means Figure 1 Cross-sectional view of the pickup unit.

[0026] Figure 3 Yes means Figure 2 A stereogram of the block.

[0027] Figure 4 Yes means Figure 3 Floor plan of the block.

[0028] Figure 5 Yes Figure 4 A magnified view of a portion of the block.

[0029] Figure 6 Yes Figure 4 An enlarged view of another portion of the block zoomed in.

[0030] Figure 7 (a)~ Figure 7 (c) is a cross-sectional view showing the action of the block.

[0031] Figure 8 This is a diagram showing the distribution of stress acting on the chip component pushed up by the block.

[0032] Fig. 9 It is a perspective view showing a block of a comparative example.

[0033] Fig.10 It means acting on Fig. 9 A diagram showing the distribution of stress on chip parts pushed on the block.

[0034] [Explanation of Symbols]

[0035] 1: Install the device

[0036] 10: Joining unit

[0037] 12: Joining the stage

[0038] 13: Joint head

[0039] 14: Join the main body

[0040] 15: Joining tools

[0041] 20: Controller unit

[0042] 30: Pickup unit

[0043] 32: Pickup Department

[0044] 33: Pickup head

[0045] 34: Wafer holder

[0046] 35: Carrier

[0047] 35a: Loading surface

[0048] 35b: Opening

[0049] 35c: Adsorption tank

[0050] 36: Peeling mechanism

[0051] 37: Collet (chip holding part)

[0052] 40, 240, 241, 242, 243, 244: Block

[0053] 41: The first block

[0054] 41a, 42a, 43a, 44a: front end

[0055] 41b, 41c, 41d, 41e, 42b, 42c, 42d, 42e, 43b, 43c, 43d, 43e, 44b, 44c, 44d, 44e: Outer surface

[0056] 42: The second piece

[0057] 43: The third piece

[0058] 44: The fourth piece

[0059] 50: Driving unit

[0060] 60: Intermediate stage

[0061] 101: Semiconductor Chip

[0062] 101a: Main surface of chip

[0063] 102: Viscoelastic membrane

[0064] 110: Substrate

[0065] 120: Cutting sheet

[0066] 120a: Surface

[0067] 120b: Back

[0068] A11, A12, A13, A14: Corners

[0069] B11, B12, B13, B14: Edges

[0070] C1b, C1c, C1d, C1e, C2b, C2c, C2d, C2e, C3b, C3c, C3d, C3e, C4b, C4c, C4d, C4e: concave portion

[0071] d: Gap

[0072] D11, D12, D13: Distance

[0073] L: Center axis

[0074] L1, L2: Reference axis

[0075] F: Tension

[0076] P1: Standby position

[0077] P11a, P11b, P12a, P12b: End

[0078] P101a, P101b, P101c: Partial

[0079] P2: Push-up position

[0080] S11, S21: Bottom

[0081] S12, S13, S22, S23: Side

[0082] X, Y, Z: axis directions DETAILED DESCRIPTION

[0083] Hereinafter, embodiments for implementing the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same symbols are marked on the same components and repeated descriptions are omitted. In each figure, an XYZ orthogonal coordinate system is shown as needed. In the following description, the normal direction of the mounting surface 35a of the carrier 35 described later is defined as the Z-axis direction, and the surface direction along the mounting surface 35a is defined as the X-axis direction and the Y-axis direction. In addition, in the following, the positive direction of the Z-axis direction is sometimes referred to as "up", and the negative direction of the Z-axis direction is referred to as "down".

[0084] Figure 1 The mounting device 1 shown takes out a semiconductor chip 101 as an example of a chip component from a semiconductor wafer and mounts it on a substrate. The semiconductor wafer includes a plurality of cut semiconductor chips 101. The plurality of semiconductor chips 101 are attached to a surface 120a of a diced sheet 120 as an example of a sheet via a viscoelastic film 102. The thickness of each semiconductor chip 101 is, for example, about 20 μm. The thickness of the diced sheet 120 is, for example, about 100 μm.

[0085] The mounting device 1 peels and picks up each semiconductor chip 101 attached to the surface 120a of the dicing sheet 120 together with the viscoelastic film 102. Then, the mounting device 1 bonds the picked-up semiconductor chip 101 to a predetermined position of the substrate.

[0086] The mounting device 1 includes, for example, a bonding unit 10, a controller unit 20, and a pickup unit 30. The pickup unit 30 picks up a semiconductor chip 101. The chip main surface 101a of the semiconductor chip 101 is adsorbed by the pickup unit 30. Then, the pickup unit 30 temporarily places the picked-up semiconductor chip 101 on the intermediate stage 60. The intermediate stage 60 is, for example, arranged between the bonding unit 10 and the pickup unit 30. The intermediate stage 60 may also be a part of a rotating head chuck configured to be movable in the X-axis direction and the Y-axis direction by a driving mechanism such as a linear motor. The bonding unit 10 holds the semiconductor chip 101 on the intermediate stage 60 and bonds the semiconductor chip 101 to the substrate 110. In addition, the pickup unit 30 may also be a structure in which the semiconductor chip 101 is delivered to the bonding unit 10 by a so-called flip chip action.

[0087] The controller unit 20 controls the action of the joining unit 10 and the action of the pickup unit 30. The controller unit 20 outputs control signals to the joining unit 10 and the pickup unit 30. The controller unit 20 is a computer, which includes, for example, a central processing unit (CPU), a storage unit such as a read-only memory (ROM) and a random access memory (RAM), an input / output unit, and a driver. The controller unit 20 operates the input / output unit according to the control of the CPU. Furthermore, the controller unit 20 reads and writes data in the storage unit. Through these actions, control signals provided to the joining unit 10 and the pickup unit 30 are generated. The joining unit 10 and the pickup unit 30 perform various actions such as the joining action and the pickup action based on the control signals.

[0088] The bonding unit 10 includes, for example, a bonding stage 12 and a bonding head 13 .

[0089] The bonding stage 12 is a stage on which the supplied substrate 110 is placed, and serves as a stage on which the semiconductor chip 101 is mounted. The bonding stage 12 has, for example, suction holes, and suctions the substrate 110 to hold it from below.

[0090] The bonding head 13 includes a bonding body 14 and a bonding tool 15. The bonding body 14 is connected to a guide rail. The bonding body 14 reciprocates along the guide rail. The guide rail extends, for example, from the pickup unit 30 to the area where the bonding operation is performed. The bonding body 14 includes a motor for driving the bonding tool 15. The bonding tool 15 can hold the semiconductor chip 101 on the intermediate carrier 60 in a loading and unloading manner. For example, the bonding tool 15 has a vacuum adsorption mechanism as a loading and unloading mechanism. Furthermore, the bonding tool 15 bonds the semiconductor chip 101 to the substrate 110. For example, the bonding tool 15 may have a heater, etc., and can provide heat to the semiconductor chip 101.

[0091] The pickup unit 30 includes, for example, a pickup portion 32 and a pickup head 33 .

[0092] The pickup unit 32 assists the pickup operation. The pickup unit 32 includes, for example, a wafer holder 34, a stage 35, and a peeling mechanism 36. The wafer holder 34 holds the cut sheet 120. When the wafer holder 34 holds the cut sheet 120, a tension F (see below) acts from the center of the cut sheet 120 toward the periphery. Figure 4 ). The cutting sheet 120 is stretched by utilizing the tension F.

[0093] The stage 35 adjusts the relative position between the wafer holder 34 and the peeling mechanism 36. The stage 35, for example, translates the wafer holder 34 in the X-axis direction. The stage 35 can also rotate the wafer holder 34 around the Z-axis. Through the above-mentioned operation, the stage 35 moves the semiconductor chip 101 to be picked up onto the peeling mechanism 36.

[0094] The stripping mechanism 36 includes a plurality of blocks 40 that can reciprocate along the Z-axis direction. The power for the reciprocating movement is provided, for example, by a drive motor. The front end of the block 40 set to the standby position does not contact the back side 120b of the cut sheet 120. The front end of the block 40 set to the push-up position contacts the back side 120b of the cut sheet 120. In the push-up position, the front end of the block 40 protrudes upward more than the mounting surface 35a and pushes the back side 120b of the cut sheet 120, thereby the semiconductor chip 101 is lifted up in the upper direction (positive direction of the Z-axis direction).

[0095] In this way, the wafer holder 34 can move in the X-axis direction, and the block 40 can reciprocate in the Z-axis direction, whereby the pickup unit 32 can push up a desired semiconductor chip 101 .

[0096] The pickup head 33 includes, for example, a collet 37 (chip holding portion). The collet 37 is disposed at the front end of the pickup head 33. The collet 37 reciprocates along the guide rail. The guide rail extends from the area where the pickup operation is performed to the bonding unit 10. The collet 37 can detachably hold the semiconductor chip 101 pushed up by the peeling mechanism 36. That is, the collet 37 picks up the semiconductor chip 101. The collet 37 holds the semiconductor chip 101, for example, by vacuum adsorption. The pickup head 33 may include a mold motor that reciprocates the collet 37 in the Z-axis direction. The collet 37 places the picked-up semiconductor chip 101 on the intermediate stage 60. The semiconductor chip 101 placed on the intermediate stage 60 is held on the bonding unit 10.

[0097] Reference Figure 2 , the structure of the peeling mechanism 36 is described in more detail. Figure 2 The stage 35 shown has, for example, a cylindrical shape extending in the Z-axis direction. A mounting surface 35a is formed at the upper end of the stage 35 in the Z-axis direction on which the back surface 120b of the cut sheet 120 is mounted. The normal direction of the mounting surface 35a is along the Z-axis direction. An opening 35b connected to the inside of the stage 35 is formed in the center of the mounting surface 35a. The opening 35b is in a rectangular shape slightly larger than the semiconductor chip 101. A plurality of blocks 40 are arranged inside the opening 35b, which protrude upward from the mounting surface 35a and push up the back surface 120b of the cut sheet 120.

[0098] The plurality of blocks 40 are arranged concentrically with respect to a central axis L along the Z-axis direction. The central axis L can be, for example, an axis passing through the center of the rectangular opening 35b when viewed in the Z-axis direction. A gap d is formed between the inner surface of the opening 35b and the outer side surface of the plurality of blocks 40. An adsorption groove 35c for adsorbing the back side 120b of the cut sheet 120 is formed on the loading surface 35a around the opening 35b. The adsorption groove 35c is, for example, arranged in a manner surrounding the opening 35b. An adsorption hole connected to a vacuum pump is connected to the adsorption groove 35c. The air in the adsorption groove 35c is sucked out through the adsorption hole, whereby the back side 120b of the cut sheet 120 around the semiconductor chip 101 is adsorbed by the adsorption groove 35c.

[0099] The peeling mechanism 36 further includes a driving unit 50 that independently reciprocates the plurality of blocks 40 in the Z-axis direction. The driving unit 50 receives a control signal supplied from the controller unit 20 and moves each block 40 in the Z-axis direction.

[0100] like Figure 2 As shown, the plurality of blocks 40 include, for example, a first block 41, a second block 42, a third block 43, and a fourth block 44. The first block 41 is an outermost block disposed at the outermost position. That is, the first block 41 is disposed at a position farthest from the central axis L. The first block 41 has, for example, a rectangular cylindrical shape extending along the Z-axis direction.

[0101] like Figure 3 As shown, the first block 41 includes, for example, a front end face 41a, and four outer side faces 41b, 41c, 41d, and 41e. The front end face 41a is located at the upper end (front end) of the first block 41 in the Z-axis direction. When the semiconductor chip 101 is pushed up on the first block 41, the front end face 41a abuts against the back surface 120b of the cut sheet 120 in the Z-axis direction. The front end face 41a is, for example, a flat surface intersecting the Z-axis direction, and extending along the X-axis direction and the Y-axis direction. The front end face 41a is, for example, a rectangular ring shape when viewed in the Z-axis direction. The four outer side faces 41b, 41c, 41d, and 41e extend from the front end face 41a in the Z-axis direction. The two outer side faces 41b and 41c are arranged in the Y-axis direction and extend in the X-axis direction and the Z-axis direction. The other two outer side faces 41d and 41e are arranged in the X-axis direction and extend in the Y-axis direction and the Z-axis direction.

[0102] like Figure 4As shown, the rectangular front end face 41a includes: four corners A11, A12, A13, A14 and four sides B11, B12, B13, B14. The four corners A11, A12, A13, A14 of the front end face 41a correspond to the vicinity of the four corners of the semiconductor chip 101, and push up the vicinity of the four corners. The side B11 connects the two corners A11 and A12 adjacent to each other in the X-axis direction on one side of the front end face 41a in the Y-axis direction. The outer side 41b is connected to the side B11. The side B13 connects the two corners A13 and A14 adjacent to each other in the X-axis direction on the other side of the front end face 41a in the Y-axis direction. The outer side 41c is connected to the side B13. The side B12 connects the two corners A12 and A13 adjacent to each other in the Y-axis direction on one side of the front end face 41a in the X-axis direction. The outer side surface 41d is connected to the side portion B12. The side portion B14 connects two corner portions A11 and A14 adjacent to each other in the X-axis direction on the other side of the front end surface 41a in the X-axis direction. The outer side surface 41e is connected to the side portion B14.

[0103] The four outer side surfaces 41b, 41c, 41d, and 41e are respectively formed with recesses C1b, C1c, C1d, and C1e. The recess C1b formed on the outer side surface 41b extends linearly along the Z-axis direction from, for example, the center of the side B11 of the front end surface 41a in the X-axis direction. The recess C1b extends along the Z-axis direction to, for example, a position away from the center of the side B11 in the Z-axis direction by a predetermined distance (see Figure 3 ). The recess C1b is, for example, V-shaped and expands toward the outer side surface 41b when viewed in the Z-axis direction. The recess C1c formed on the outer side surface 41c is formed, for example, symmetrically with the recess C1b formed on the outer side surface 41b with respect to the central axis L. Therefore, the recess C1c corresponds to the recess C1b and extends linearly along the Z-axis direction to a position away from the center of the side B13 of the front end surface 41a in the X-axis direction in the Z-axis direction by a predetermined distance. The recess C1c is, for example, V-shaped and expands toward the outer side surface 41c when viewed in the Z-axis direction.

[0104] The recess C1d formed on the outer side surface 41d extends linearly along the Z-axis direction to a position away from the center of the side B12 of the front end surface 41a in the Y-axis direction by a predetermined distance in the Z-axis direction. The recess C1d is, for example, V-shaped when viewed in the Z-axis direction, which expands toward the outer side surface 41d. The recess C1e formed on the outer side surface 41e is formed, for example, symmetrically with the recess C1d formed on the outer side surface 41d with respect to the central axis L. Therefore, the recess C1e corresponds to the recess C1d and extends linearly along the Z-axis direction to a position away from the center of the side B14 of the front end surface 41a in the X-axis direction by a predetermined distance in the Z-axis direction. The recess C1e is, for example, V-shaped when viewed in the Z-axis direction, which expands toward the outer side surface 41e.

[0105] In addition, Figure 4 In the figure, the outer shape of the semiconductor chip 101 is indicated by a double-dashed line, and the edge of the opening 35b of the stage 35 is indicated by a dotted line. As described above, the dicing sheet 120 around the opening 35b is adsorbed by the adsorption groove 35c. As a result, when the semiconductor chip 101 is peeled off by the peeling mechanism 36, a large tension F acts on the dicing sheet 120 between the edge of the opening 35b and the semiconductor chip 101 in the direction from the central axis L toward the periphery.

[0106] The recess C1c has a symmetrical structure with the recess C1b, and the recess C1e has a symmetrical structure with the recess C1d. Therefore, the structure of the recess C1b is described in more detail below using the recess C1b and the recess C1c as representatives, and the structure of the recess C1d is described in more detail using the recess C1d and the recess C1e as representatives. Figure 5 The structure of the recess C1b will be described in more detail.

[0107] like Figure 5 As shown, the recess C1b includes, for example, a bottom surface S11 (bottom), and a pair of side surfaces S12 and S13. The bottom surface S11 is a flat surface that is recessed from the outer side surface 41b toward the Y-axis direction. The bottom surface S11 extends along the X-axis direction and the Z-axis direction. The bottom surface S11 extends, for example, in parallel with the outer side surface 41b. The bottom surface S11 extends, for example, from the center of the side B11 in the X-axis direction along the Z-axis direction. That is, when the front end surface 41a is observed in the Z-axis direction, if a reference axis L1 that passes through the center of the side B11 in the X-axis direction and extends along the Y-axis direction is defined, the bottom surface S11 is arranged at a position that intersects with the reference axis L1. The reference axis L1 intersects, for example, with the center of the bottom surface S11 in the X-axis direction. The distance D11 between the bottom surface S11 and the edge of the opening 35b in the Y-axis direction is, for example, longer than the distance D12 between the corner A12 and the corner of the opening 35b.

[0108] A pair of side surfaces S12 and S13 are connected to the bottom surface S11 and the outer side surface 41b. The spacing between the pair of side surfaces S12 and S13 in the X-axis direction increases as the distance from the bottom surface S11 to the outer side surface 41b increases. That is, the pair of side surfaces S12 and S13 extend in a direction inclined relative to a plane perpendicular to the outer side surface 41b in a manner of moving away from each other in a direction opposite to the direction in which they face each other. When the front end surface 41a is observed in the Z-axis direction, the pair of side surfaces S12 and S13 are inclined relative to both the X-axis direction and the Y-axis direction.

[0109] The pair of side surfaces S12 and S13 are formed symmetrically about the reference axis L1 passing through the center of the bottom surface S11, for example. The distance between the side surface S12 and the reference axis L1 in the X-axis direction increases as the distance from the bottom surface S11 to the outer side surface 41b increases. Similarly, the distance between the side surface S13 and the reference axis L1 in the X-axis direction increases as the distance from the bottom surface S11 to the outer side surface 41b increases. At each position along the Y-axis direction, the distance between the side surface S13 and the reference axis L1 in the X-axis direction is equal to the distance between the side surface S12 and the reference axis L1 in the X-axis direction.

[0110] In the present embodiment, the recess C1b is formed in the central portion of the outer side surface 41b in the X-axis direction, and is not formed at both ends of the outer side surface 41b in the X-axis direction. Both ends of the outer side surface 41b in the X-axis direction are connected to both ends P11a and P11b of the side B11. The end P11a of one of the sides B11 is a straight line connecting the corner A11 and the side S12 of one of the recesses C1b in the X-axis direction. The other end P11b of the side B11 is a straight line connecting the corner A12 and the side S13 of the other of the recesses C1b in the X-axis direction.

[0111] Next, refer to Figure 6 The structure of the concave portion C1d will be described in more detail. Figure 6 As shown, the recess C1d includes, for example, a bottom surface S21 (bottom) and a pair of side surfaces S22 and S23. The bottom surface S21 is a flat surface that is recessed from the outer side surface 41b toward the X-axis direction. The bottom surface S21 extends along the Y-axis direction and the Z-axis direction. The bottom surface S21 extends, for example, in parallel with the outer side surface 41d. The bottom surface S21 extends, for example, from the center of the side B12 in the Y-axis direction along the Z-axis direction. That is, when the front end surface 41a is observed in the Z-axis direction, if a reference axis L2 that passes through the center of the side B12 in the Y-axis direction and extends along the X-axis direction is defined, the bottom surface S21 is arranged at a position that intersects with the reference axis L2. The reference axis L2 intersects, for example, with the center of the bottom surface S21 in the Y-axis direction. The distance D13 between the bottom surface S21 and the edge of the opening 35b in the Y-axis direction is, for example, longer than the distance D12 between the corner A12 and the corner of the opening 35b.

[0112] A pair of side surfaces S22 and S23 are connected to the bottom surface S21 and the outer side surface 41d. The distance between the pair of side surfaces S22 and S23 in the X-axis direction increases as the distance from the bottom surface S21 to the outer side surface 41d increases. That is, the pair of side surfaces S22 and S23 extend in a direction inclined relative to a plane perpendicular to the outer side surface 41d in a manner that they are separated from each other in a direction opposite to the direction in which they face each other. When the front end surface 41a is observed in the Z-axis direction, the pair of side surfaces S22 and S23 are inclined relative to both the X-axis direction and the Y-axis direction.

[0113] A pair of side surfaces S22 and S23 are formed symmetrically about the reference axis L2 passing through the center of the bottom surface S21. The distance between the side surface S22 and the reference axis L2 in the Y-axis direction increases as the distance from the bottom surface S21 to the outer side surface 41d increases. Similarly, the distance between the side surface S23 and the reference axis L2 in the Y-axis direction increases as the distance from the bottom surface S21 to the outer side surface 41d increases. At each position along the X-axis direction, the distance between the side surface S23 and the reference axis L2 in the Y-axis direction is equal to the distance between the side surface S22 and the reference axis L2 in the Y-axis direction.

[0114] In the present embodiment, the recess C1d is formed in the central portion of the outer side surface 41d in the Y-axis direction, and is not formed at both ends of the outer side surface 41d in the Y-axis direction. Both ends of the outer side surface 41d in the Y-axis direction are connected to both ends P12a and P12b of the side B12. The end P12a of one of the sides B12 is a straight line connecting the corner A12 and the side S22 of one of the recesses C1d in the Y-axis direction. The end P12b of the other side B12 is a straight line connecting the corner A13 and the side S23 of the other recess C1d in the Y-axis direction.

[0115] Refer again Figure 3 The second block 42 is disposed inside the first block 41. That is, the second block 42 is surrounded by the first block 41. The second block 42 is in the shape of a rectangular tube extending along the Z-axis direction, similar to the first block 41. The second block 42 includes, for example, a front end face 42a and four outer side faces 42b, 42c, 42d, and 42e.

[0116] The front end face 42a is located at the upper end (front end) of the second block 42 in the Z-axis direction. When the second block 42 pushes up the semiconductor chip 101, the front end face 42a abuts against the back surface 120b of the cut sheet 120 in the Z-axis direction. The front end face 42a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The front end face 42a is, for example, in the shape of a rectangular ring when viewed in the Z-axis direction. Four outer side surfaces 42b, 42c, 42d, and 42e extend from the front end face 42a in the Z-axis direction. Two outer side surfaces 42b and 42c are arranged in the Y-axis direction and extend in the X-axis direction and the Z-axis direction. The other two outer side surfaces 42d and 42e are arranged in the X-axis direction and extend in the Y-axis direction and the Z-axis direction.

[0117] Recesses C2b, C2c, C2d, and C2e are formed on the four outer side surfaces 42b, 42c, 42d, and 42e, respectively. Recesses C2b, C2c, C2d, and C2e have the same structures as recesses C1b, C1c, C1d, and C1e of the first block 41, respectively. Therefore, recesses C2b, C2c, C2d, and C2e can be described in the same manner as recesses C1b, C1c, C1d, and C1e, respectively, and thus detailed descriptions of recesses C2b, C2c, C2d, and C2e are omitted.

[0118] The third block 43 is arranged inside the second block 42. That is, the third block 43 is surrounded by the second block 42. The third block 43 is in the shape of a rectangular tube extending along the Z-axis direction, similarly to the second block 42. The third block 43 includes, for example, a front end surface 43a and four outer side surfaces 43b, 43c, 43d, and 43e.

[0119] The front end face 43a is located at the upper end (front end) of the third block 43 in the Z-axis direction. When the third block 43 pushes up the semiconductor chip 101, the front end face 43a abuts against the back surface 120b of the cut sheet 120 in the Z-axis direction. The front end face 43a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The front end face 43a is, for example, in the shape of a rectangular ring when viewed in the Z-axis direction. Four outer side surfaces 43b, 43c, 43d, and 43e extend from the front end face 43a in the Z-axis direction. Two outer side surfaces 43b and 43c are arranged in the Y-axis direction and extend in the X-axis direction and the Z-axis direction. The other two outer side surfaces 43d and 43e are arranged in the X-axis direction and extend in the Y-axis direction and the Z-axis direction.

[0120] Recesses C3b, C3c, C3d, and C3e are formed on the four outer side surfaces 43b, 43c, 43d, and 43e, respectively. Recesses C3b, C3c, C3d, and C3e have structures corresponding to recesses C1b, C1c, C1d, and C1e of the first block 41, respectively. Therefore, recesses C3b, C3c, C3d, and C3e can be described in the same manner as recesses C1b, C1c, C1d, and C1e, respectively, and thus detailed descriptions of recesses C3b, C3c, C3d, and C3e are omitted.

[0121] The fourth block 44 is arranged inside the third block 43. That is, the fourth block 44 is surrounded by the third block 43. The fourth block 44 is the innermost block arranged at the innermost side. That is, the fourth block 44 is arranged at a position closest to the central axis L. The fourth block 44 is arranged on the central axis L. The fourth block 44 is, for example, in the shape of a rectangular column centered on the central axis L and extending along the Z-axis direction. The fourth block 44 includes, for example, a front end face 44a and four outer side faces 44b, 44c, 44d, and 44e.

[0122] The front end face 44a is located at the upper end (front end) of the fourth block 44 in the Z-axis direction. When the fourth block 44 pushes up the semiconductor chip 101, the front end face 44a abuts against the back side 120b of the cut sheet 120 in the Z-axis direction. The front end face 44a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The front end face 44a is, for example, in the shape of a rectangular ring when viewed in the Z-axis direction. Four outer side faces 44b, 44c, 44d, and 44e extend from the front end face 44a in the Z-axis direction. Two outer side faces 44b and 44c are arranged in the Y-axis direction and extend along the X-axis direction and the Z-axis direction. The other two outer side faces 44d and 44e are arranged in the X-axis direction and extend along the Y-axis direction and the Z-axis direction.

[0123] Recesses C4b and C4c are formed on the two outer side surfaces 44b and 44c, respectively. Recesses C4b and C4c have structures corresponding to recesses C1b and C1c of the first block 41, respectively. Therefore, recesses C4b and C4c can be described in the same way as recesses C1b and C1c, respectively, and thus detailed descriptions of recesses C4b and C4c are omitted. In addition, recesses corresponding to recesses C1d and C1e, respectively, can also be formed on the other two outer side surfaces 44d and 44e.

[0124] As described above, the first block 41, the second block 42, the third block 43, and the fourth block 44 described above are configured to be able to reciprocate independently along the Z-axis direction. In the following, when the first block 41, the second block 42, the third block 43, and the fourth block 44 are described without distinguishing them, the first block 41, the second block 42, the third block 43, and the fourth block 44 are simply referred to as "blocks 40" for description.

[0125] like Figure 2 As shown, the peeling mechanism 36 switches between a state where the block 40 is at the standby position P1 and a state where the block 40 is at the push-up position P2. The state switching is performed by the operation of the driving unit 50 based on the control signal supplied from the controller unit 20.

[0126] The state in which the block 40 is in the standby position P1 refers to a state in which the front end of the block 40 (specifically, the front end face 41a, the front end face 42a, the front end face 43a, and the front end face 44a) is in the same plane with respect to the mounting surface 35a of the carrier 35, or a state in which the front end of the block 40 is located below the mounting surface 35a. When the block 40 is in the standby position, the semiconductor chip 101 is maintained to be placed on the mounting surface 35a. On the other hand, the state in which the block 40 is in the push-up position P2 refers to a state in which the front end of the block 40 is located above the mounting surface 35a of the carrier 35. In the above state, the front end of the block 40 pushes the back surface 120b of the cut sheet 120 to push up the semiconductor chip 101.

[0127] Below, refer to Figure 7 (a) Figure 7 (b) and Figure 7 (c) will be used to describe the picking-up operation of the semiconductor chip 101 by the picking-up unit 30. At the same time, the picking-up method of this embodiment will be described. The picking-up method of this embodiment is performed using the picking-up unit 30.

[0128] exist Figure 7 In (a), first, the controller unit 20 moves the semiconductor chip 101 to be picked up to the top of the peeling mechanism 36. Then, the controller unit 20 moves all the blocks 40 from the standby position P1 to the push-up position P2 along the positive Z-axis direction. Thus, the first block 41, the second block 42, the third block 43, and the fourth block 44 rise from the standby position P1 to the push-up position P2.

[0129] Through the above-mentioned actions, the first block 41, the second block 42, the third block 43, and the fourth block 44 push the back surface 120b of the cut sheet 120 to push up the semiconductor chip 101. As a result, the semiconductor chip 101 approaches the pickup head 33. Next, the controller unit 20 moves the collet 37 in the negative Z-axis direction. Then, the controller unit 20 activates the adsorption mechanism. As a result, the pickup head 33 adsorbs the semiconductor chip 101.

[0130] Then, if Figure 7 As shown in (b), the controller unit 20 moves the plurality of blocks 40 from the push-up position P2 to the standby position P1 along the negative Z-axis direction. The controller unit 20, for example, skips the second block 42 and moves the first block 41 and the third block 43 from the push-up position P2 to the standby position P1 at the same time. As a result, the first block 41 and the third block 43 are simultaneously lowered from the push-up position P2 to the standby position P1 while the second block 42 and the fourth block 44 are maintained at the push-up position P2.

[0131] Then, if Figure 7 As shown in (c), the controller unit 20 moves the remaining blocks 40 from the push-up position P2 to the standby position P1 along the negative Z-axis direction. For example, the controller unit 20 moves the second block 42 and the fourth block 44 maintained at the push-up position P2 from the push-up position P2 to the standby position P1 at the same time. As a result, the first block 41, the second block 42, the third block 43 and the fourth block 44 all return to the standby position P1. In addition, the controller unit 20 moves the collet 37 along the positive Z-axis direction. Through the above actions, the semiconductor chip 101 is peeled off from the surface 120a of the cut sheet 120, and the semiconductor chip 101 is picked up by the pickup head 33.

[0132] Thereafter, the controller unit 20 moves the pickup head 33 toward the intermediate stage 60 (see Figure 1 ). The controller unit 20 moves the bonding head 13 toward the intermediate stage 60 in parallel with the above-mentioned operation. Then, the semiconductor chip 101 is transferred from the intermediate stage 60 to the bonding head 13 , and the bonding head 13 bonds the semiconductor chip 101 to the substrate 110 .

[0133] The effects of the pickup unit 30 , the mounting device 1 , and the pickup method described above will be described together with the problems of the comparative example.

[0134] Fig. 9 The plurality of blocks 240 shown include, for example, a block 241, a block 242, a block 243, and a block 244. Each of the blocks 241, 242, 243, and 244 has four flat side surfaces. The plurality of blocks 240 differs from the present embodiment in that the four side surfaces of each of the blocks 241, 242, 243, and 244 do not have a structure corresponding to the recess of the present embodiment.

[0135] Fig.10 The simulation results show the distribution of stress on the dicing sheet 120 around the semiconductor chip 101 when the block 240 is used to press the dicing sheet 120 and push up the semiconductor chip 101. Fig.10 In the embodiment, the magnitude of stress around the semiconductor chip 101 is represented by the density of dots. That is, the higher the density of dots, the greater the stress, and the lower the density of dots, the smaller the stress.

[0136] When the block 240 pushes up the semiconductor chip 101, a tension F in the tensile direction is applied to the dicing sheet 120 to which the semiconductor chip 101 is attached (see Figure 4 ). When the semiconductor chip 101 is subjected to such tension F and peeled off from the dicing sheet 120, the corner of the semiconductor chip 101 is likely to become the starting point of peeling, and the stress concentration caused by the tension F is likely to occur at the corner. Fig.10 As shown, it can be seen that large stress acts on the portions P101a, P101b, and P101c corresponding to the corners of the semiconductor chip 101. If such stress acts on the semiconductor chip 101, there is a possibility that the semiconductor chip 101 may be damaged or other problems may occur.

[0137] In contrast, in the present embodiment, recesses C1b, C1c, C1d, and C1e are formed on the outer side surface 41b, 41c, 41d, and 41e of the first block 41, respectively. Similarly, recesses C2b, C2c, C2d, and C2e are formed on the outer side surface 42b, 42c, 42d, and 42e of the second block 42, respectively. Similarly, recesses C3b, C3c, C3d, and C3e are formed on the outer side surface 43b, 43c, 43d, and 43e of the third block 43, respectively. Similarly, recesses C4b, C4c, C4d, and C4e are formed on the outer side surface 44b, 44c, 44d, and 44e of the fourth block 44, respectively. In this case, since the starting point of peeling is easily formed near each recessed portion, it is possible to suppress the application of a large stress locally to the corner portion of the semiconductor chip 101 .

[0138] Furthermore, if one focuses on the recess C1b among these recesses, for example, the pair of side surfaces S12 and S13 of the recess C1b extend in a direction inclined relative to a plane perpendicular to the outer side surface 41b so as to move away from each other in a direction opposite to the direction in which they face each other as they approach the outer side surface 41b from the bottom surface S11 when the front end surface 41a is viewed in the Z-axis direction (see FIG. Figure 5). In this case, unlike the case where the pair of side surfaces S12 and S13 of the recess C1b extend along a surface perpendicular to the outer side surface 41b, the stress acting on the starting point of peeling formed in the recess C1b can be dispersed in the tensile direction perpendicular to the outer side surface 41b and in the direction perpendicular to the tensile direction. Thus, the stress in the tensile direction applied to the vicinity of the recess C1b when the semiconductor chip 101 is peeled from the dicing sheet 120 can be suppressed to be small. The other recesses can also be described in the same way.

[0139] Figure 8 The simulation results show the distribution of stress on the dicing sheet 120 around the semiconductor chip 101 when the dicing sheet 120 is pressed by the plurality of blocks 40 to push up the semiconductor chip 101. Figure 8 In the embodiment, the magnitude of stress around the semiconductor chip 101 is represented by the density of dots. That is, the higher the density of dots, the greater the stress, and the lower the density of dots, the smaller the stress. Figure 8 As shown, it can be seen that Fig.10 Compared with the simulation results of FIG. 1 , the stresses acting on the portions P101a, P101b, and P101c corresponding to the corners of the semiconductor chip 101 are small. Thus, in the present embodiment, when the semiconductor chip 101 is peeled off from the dicing sheet 120, it is possible to suppress the situation where a large stress acts locally on the semiconductor chip 101. Thus, it is possible to suppress the occurrence of undesirable situations such as damage to the semiconductor chip 101 caused by stress concentration.

[0140] As in the present embodiment, the bottom surface S11 of the recess C1b may extend from the center of the side B11 along the Z-axis direction. In this case, when the semiconductor chip 101 is peeled off from the surface 120a of the dicing sheet 120, it is easy to peel off continuously from the corners A11 and A12 of the semiconductor chip 101 toward the center of the side B11, so the semiconductor chip 101 can be peeled off smoothly.

[0141] As in the present embodiment, when the front end surface 41a is viewed in the Z-axis direction, the pair of side surfaces S12 and S13 of the recess C1b can be arranged symmetrically with respect to the reference axis L1 passing through the center of the bottom surface S11 and perpendicular to the outer side surface 41b. In this case, since the stress acting near the recess C1b can be evenly dispersed, it is possible to effectively suppress the situation where a large stress locally acts on the semiconductor chip 101. As a result, it is possible to effectively suppress the occurrence of undesirable situations such as damage to the semiconductor chip 101 caused by stress concentration.

[0142] As shown in this embodiment, after the semiconductor chip 101 is pushed up by the first block 41, the second block 42, and the third block 43 moving from the standby position P1 to the push-up position P2, the first block 41 and the third block 43 are simultaneously moved from the push-up position P2 to the standby position P1 while the second block 42 is maintained at the push-up position P2, and then the second block 42 is moved from the push-up position P2 to the standby position P1. In this way, after the first block 41, the second block 42, and the third block 43 are moved to the push-up position P2, the first block 41 and the third block 43 are simultaneously moved to the standby position P1, compared with the case where the first block 41, the second block 42, and the third block 43 are sequentially moved to the standby position P1, the time for peeling the semiconductor chip 101 based on the push-up operation can be shortened. Furthermore, if the second block 42 is skipped and the first block 41 and the third block 43 are simultaneously moved to the standby position P1, more starting points for peeling of the semiconductor chip 101 can be formed compared to the case where the first block 41 and the second block 42 adjacent to each other are simultaneously moved to the standby position P1, so that it is possible to effectively suppress the situation where a large stress locally acts on the semiconductor chip 101. As a result, it is possible to effectively suppress the occurrence of inconveniences such as damage to the semiconductor chip 101 caused by stress concentration.

[0143] The present invention has been described in detail based on its embodiment. However, the present invention is not limited to the embodiment described above. The present invention can be modified in various ways without departing from the gist of the present invention.

[0144] For example, in the embodiment, the case where the stripping mechanism 36 includes four blocks 40 is described. However, the number of blocks is not limited, and two, three, five or more blocks may be used. In addition, the shape of the block is not necessarily a rectangular tube or a rectangular column, and may be other shapes. In the embodiment, the case where a recess is formed on all four blocks 40 is described. However, a recess may be formed on any one of the four blocks 40. In addition, the recess may not be formed on all of the four outer side surfaces of a block 40, and may be formed on any one of the four outer side surfaces.

[0145] The present disclosure includes the following structures.

[0146] Regarding the present disclosure, [1] is “a picking unit for picking up a chip component attached to a surface of a sheet from a surface of the sheet, the picking unit comprising:

[0147] A carrier, including a mounting surface for mounting the chip component via the sheet and adsorbing the back surface of the sheet;

[0148] a peeling mechanism comprising a plurality of blocks arranged concentrically inside an opening formed on the mounting surface so as to be reciprocally movable along a normal direction of the mounting surface, and the chip component is peeled off from the surface of the sheet by the plurality of blocks protruding from the opening; and

[0149] The chip holding portion picks up the chip component from the surface of the sheet by adsorbing and holding the chip component.

[0150] The plurality of blocks respectively include: a front end face facing the back end of the sheet in the normal direction; and an outer side face extending from the front end face along the normal direction.

[0151] A recess is formed on the outer surface of at least one of the plurality of blocks, the recess extending along the normal direction from a side connecting mutually adjacent corners of the front end surface.

[0152] The recess includes a bottom recessed from the outer side surface and a pair of side surfaces connecting the bottom and the outer side surface.

[0153] The pair of side surfaces extend in a direction inclined relative to a plane perpendicular to the outer side surface so as to move away from the bottom portion toward the outer side surface as the pair of side surfaces approach the outer side surface when the front end surface is viewed in the normal direction.

[0154] Regarding the present disclosure, [2] is “a pickup unit according to [1], wherein the plurality of blocks include an outermost block located at the outermost side inside the opening,

[0155] The recess is formed on the outer side surface of at least the outermost block among the plurality of blocks.

[0156] Regarding the present disclosure, [3] is “the pickup unit according to [1], wherein the recess is formed on the outer side surface of each of the plurality of blocks.”

[0157] Regarding the present disclosure, [4] is “a pickup unit according to any one of [1] to [3], wherein the plurality of blocks respectively include a plurality of outer side surfaces extending from the front end surface along the normal direction,

[0158] The recessed portions are respectively formed on the plurality of outer side surfaces.

[0159] Regarding the present disclosure, [5] is “a pickup unit according to any one of [1] to [4], wherein the bottom of the recess extends from the center of the side along the normal direction.”

[0160] Regarding the present disclosure, [6] is "a pickup unit according to any one of [1] to [5], wherein, when the front end face is observed in the normal direction, the pair of side faces of the recess are arranged symmetrically with respect to each other with respect to a reference axis passing through the center of the bottom and perpendicular to the outer side face."

[0161] Regarding the present disclosure, [7] is “a pickup unit according to any one of [1] to [6], wherein the plurality of blocks include:

[0162] A first block is disposed at the outermost side of the opening;

[0163] a second block disposed further inward than the first block; and

[0164] The third block is arranged further inward than the second block,

[0165] The first block, the second block and the third block are respectively configured to reciprocate between a standby position where the front end surface does not protrude from the mounting surface and a push-up position where the front end surface protrudes from the mounting surface to push up the chip component.

[0166] After the chip component is pushed up by the first block, the second block, and the third block moving from the standby position to the push-up position, the first block and the third block are simultaneously moved from the push-up position to the standby position while maintaining the second block in the push-up position, and thereafter, the second block moves from the push-up position to the standby position.

[0167] Regarding the present disclosure, [8] is “a mounting device, comprising: a pickup unit according to any one of [1] to [7]; and

[0168] The bonding unit bonds the chip component picked up by the pickup unit to a substrate.

[0169] Regarding the present disclosure, [9] is “a picking method, implemented using the picking unit according to any one of [1] to [7], the picking method comprising the following steps:

[0170] The chip component is pushed up by moving a first block disposed at the outermost side inside the opening, a second block disposed at the inner side than the first block, and a third block disposed at the inner side than the second block from a standby position where the front end surface does not protrude from the mounting surface to a push-up position where the front end surface protrudes from the mounting surface;

[0171] while maintaining the second block at the pushed-up position, causing the first block and the third block to simultaneously move from the pushed-up position to the standby position; and

[0172] The chip component is peeled off from the surface of the sheet by moving the second block from the push-up position to the standby position.

Claims

1. A picking unit for picking up chip parts attached to the surface of a sheet from the surface of the sheet, the picking unit comprising: A carrier, including a mounting surface for mounting the chip component via the sheet and adsorbing the back surface of the sheet; a peeling mechanism comprising a plurality of blocks arranged concentrically inside an opening formed on the mounting surface so as to be reciprocally movable along a normal direction of the mounting surface, and the chip component is peeled off from the surface of the sheet by the plurality of blocks protruding from the opening; as well as The chip holding portion picks up the chip component from the surface of the sheet by adsorbing and holding the chip component. The plurality of blocks respectively include: a front end face facing the back face of the sheet in the normal direction; and an outer side surface extending from the front end surface along the normal direction, A recess is formed on the outer surface of at least one of the plurality of blocks, the recess extending along the normal direction from a side connecting mutually adjacent corners of the front end surface. The recess includes a bottom recessed from the outer side surface and a pair of side surfaces connecting the bottom and the outer side surface. The pair of side surfaces extend in a direction inclined with respect to a plane perpendicular to the outer side surface so as to be separated from each other in a direction opposite to the direction in which they face each other as they approach the outer side surface from the bottom when the front end surface is viewed in the normal direction.

2. The pickup unit according to claim 1, wherein: The plurality of blocks include an outermost block located at the outermost side inside the opening, The recessed portion is formed on the outer side surface of at least the outermost block among the plurality of blocks.

3. The pickup unit according to claim 1, wherein: The recessed portion is formed on the outer side surface of each of the plurality of blocks.

4. The pickup unit according to claim 1, wherein: The plurality of blocks respectively include a plurality of outer side surfaces extending from the front end surface along the normal direction, The recessed portions are respectively formed on the plurality of outer surfaces.

5. The pickup unit according to claim 1, wherein: The bottom of the recessed portion extends from the center of the side portion along the normal direction.

6. The pickup unit according to claim 1, wherein: When the front end surface is viewed in the normal direction, the pair of side surfaces of the recessed portion are arranged symmetrically with respect to a reference axis that passes through the center of the bottom portion and is perpendicular to the outer side surface.

7. The pickup unit according to claim 1, wherein: The plurality of blocks include: A first block is disposed at the outermost side of the opening; a second block disposed further inward than the first block; and The third block is arranged further inward than the second block, The first block, the second block and the third block are respectively configured to reciprocate between a standby position where the front end surface does not protrude from the mounting surface and a push-up position where the front end surface protrudes from the mounting surface to push up the chip component. After the chip component is pushed up by moving the first block, the second block and the third block from the standby position to the push-up position, the first block and the third block are simultaneously moved from the push-up position to the standby position so as to maintain the second block in the push-up position, and then the second block is moved from the push-up position to the standby position.

8. A mounting device, comprising: A pick-up unit according to any one of claims 1 to 7; as well as The bonding unit bonds the chip component picked up by the pickup unit to a substrate.

9. A picking method, implemented using the picking unit according to any one of claims 1 to 7, the picking method comprising the following steps: The chip component is pushed up by moving a first block disposed at the outermost side inside the opening, a second block disposed at the inner side than the first block, and a third block disposed at the inner side than the second block from a standby position where the front end surface does not protrude from the mounting surface to a push-up position where the front end surface protrudes from the mounting surface; The second block is maintained at the pushed-up position, and the first block and the third block are simultaneously moved from the pushed-up position to the standby position; as well as The chip components are peeled from the surface of the sheet by moving the second block from the push-up position to the standby position.

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