Full-automatic wafer cleaning machine

Abstract

The invention relates to a full-automatic wafer cleaning machine which comprises a machine frame. The feeding unit is used for supplying wafers; the clamping unit comprises a plurality of clamping wheels distributed in the circumferential direction of the wafer and a power part; the cleaning unit comprises an upper scrubbing part and a lower scrubbing part which are respectively arranged above and below the wafer, and a spraying part used for spraying cleaning liquid to the upper surface and the lower surface of the wafer; the drying unit is used for drying the wafer; and the transfer manipulator is used for transferring the wafers one by one. On one hand, on the basis of cooperation of the first clamping wheel set and the second clamping wheel set, wafers of different specifications are clamped or loosened under equidistant movement, the structure is simple, the space utilization rate of equipment can be effectively increased, and meanwhile the wafer loading and unloading efficiency can be effectively improved; and on the other hand, the wafers clamped in any clamping area can be synchronously brushed through the movement of the upper brushing part and the lower brushing part, the brushing effect of the upper faces and the lower faces of the wafers is ensured, and the brushing requirements of the wafers of different specifications are met.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a full-automatic wafer cleaning machine. Background Art

[0002] Wafers are the chips used in the manufacture of semiconductor integrated circuits. They are also called wafers because of their round shape. By making various circuit structures on the surface of the wafer, it can be made into an electronic component with specific electrical functions. In the production and processing of wafers, it usually needs to go through process steps such as slicing, grinding, polishing and cleaning.

[0003] In the last cleaning step, both the front and back sides of the wafer need to be cleaned. The wafer brushing device used in the prior art generally includes a wafer clamping member, an upper brushing member arranged above the wafer, and a lower brushing member arranged below the wafer. Therefore, when the wafer is clamped and fixed by the clamping member, the upper and lower brushing members brush the front and back sides of the wafer respectively. After brushing is completed, the wafer is taken out for spin drying or drying.

[0004] However, in the actual production process, the prior art has the following technical defects:

[0005] 1. The existing upper and lower brushing parts generally rotate around the vertical axis or move linearly along the horizontal plane to adjust the brushing area on the wafer surface, but cannot be adjusted in the up and down directions. Therefore, the thickness of the brushing space formed between the upper and lower brushing parts cannot be adaptively adjusted according to the thickness of wafers of different specifications. When replacing wafers of different specifications, it is easy to cause the upper and lower brushing parts to have insufficient contact with the wafer or excessively squeeze the wafer, resulting in poor brushing effect or wafer damage;

[0006] 2. Existing clamping devices generally use multiple clamping wheels distributed around the circumference of the wafer, and clamp or release the wafer during the radial movement of the wafer. Therefore, not only is the required driving mechanism structure complex (each clamping wheel needs to control the radial movement separately), but also for wafers of different specifications, each clamping wheel needs to move a corresponding distance. In this way, sufficient space needs to be designed to meet the movement of the clamping wheels, resulting in low internal space utilization of the equipment and large equipment size. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an improved fully automatic wafer cleaning machine.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A fully automatic wafer cleaning machine, comprising:

[0010] frame;

[0011] A feeding unit, which is used to supply wafers;

[0012] A clamping unit, comprising a plurality of clamping wheels distributed around the wafer circumference and a power component;

[0013] A cleaning unit, comprising an upper brushing component and a lower brushing component respectively arranged above and below the wafer, and a spraying component for spraying cleaning liquid onto the upper surface and the lower surface of the wafer;

[0014] A drying unit, which is used for drying the wafer;

[0015] The transfer robot is used to transfer wafers one by one between the feeding unit, clamping unit, cleaning unit and drying unit.

[0016] The plurality of clamping wheels are divided into a first clamping wheel group and a second clamping wheel group located at opposite sides of the wafer, wherein the clamping wheels in the first clamping wheel group and the second clamping wheel group move synchronously and in the same direction respectively, and the first clamping wheel group and the second clamping wheel group can move towards or away from each other to form a first position for clamping the wafer or a second position for releasing the wafer, and when in the first position, a plurality of clamping areas distributed layer by layer from top to bottom are formed between the first clamping wheel group and the second clamping wheel group, wherein the diameters of the plurality of clamping areas are gradually reduced or increased from top to bottom, and wafers of different diameters can be synchronously clamped in the corresponding clamping areas;

[0017] The cleaning unit also includes a synchronization shaft connected between the upper brush component and the lower brush component and extending vertically, a rotating drive component driving the upper brush component and the lower brush component to rotate around the center line of the synchronization shaft, and a lifting drive component driving the upper brush component and / or the lower brush component to move up and down along the synchronization shaft. When any wafer is clamped in the corresponding clamping area, a brushing area matching the wafer is formed between the upper brush component and the lower brush component.

[0018] According to a specific implementation and preferred aspect of the present invention, the first clamping wheel group and the second clamping wheel group are symmetrically arranged about the center of the wafer, wherein the first clamping wheel group and the second clamping wheel group respectively move linearly along the horizontal direction and move in opposite directions, thereby improving the stability of wafer clamping.

[0019] Preferably, the first clamping wheel group and the second clamping wheel group are respectively provided with two clamping wheels arranged side by side and spaced apart, wherein the arrangement direction of the two clamping wheels is perpendicular to the movement direction, so that the clamping wheels can clamp the wafer synchronously to prevent the wafer from shifting, thereby improving the position accuracy of the wafer.

[0020] According to another specific implementation and preferred aspect of the present invention, the outer wall of each clamping wheel forms a plurality of wheel grooves distributed layer by layer from top to bottom, wherein the outer diameters of the plurality of wheel grooves are gradually increased from top to bottom, and a clamping area is formed between the plurality of wheel grooves of each layer, and when clamping, the wafer is abutted in the corresponding wheel groove from the edge; and / or the center lines of the plurality of clamping areas are overlapped. Here, the structure is simple, and it is easy to install and implement.

[0021] Preferably, each clamping wheel includes a first wheel body, a second wheel body and a third wheel body, the outer diameters of which increase step by step from top to bottom, wherein wheel grooves are formed between the first wheel body and the second wheel body, and between the second wheel body and the third wheel body respectively; the clamping unit also includes auxiliary wheels located on opposite sides of the wafer, wherein auxiliary wheel grooves flush with the wheel grooves located below are formed on each auxiliary wheel, and when the wafer is clamped in the clamping area located in the lower layer, the edge of the wafer is synchronously abutted in the auxiliary wheel grooves. This facilitates processing and use; at the same time, through the setting of the auxiliary wheels, the support and clamping stability of wafers with smaller diameters are improved, so that wafers of different specifications can be scrubbed at the same rotation speed, effectively improving efficiency.

[0022] According to another specific implementation and preferred aspect of the present invention, a transmission belt is respectively connected between each clamping wheel in the first clamping wheel group and the second clamping wheel group; the power component includes a first movable seat and a second movable seat located on opposite sides of the wafer, a first cylinder and a second cylinder driving the first movable seat and the second movable seat to move toward or away from each other, and a first motor and a second motor respectively arranged on the first movable seat and the second movable seat, wherein the first clamping wheel group and the second clamping wheel group are respectively arranged on the first movable seat and the second movable seat, the first motor and the second motor respectively drive any clamping wheel in the first clamping wheel group and the second clamping wheel group to rotate around the vertical center line, and the clamping wheel drives another clamping wheel in the same group to rotate through the above-mentioned transmission belt, so as to realize the rotation of the wafer around its own center line during the scrubbing process.

[0023] According to another specific implementation and preferred aspect of the present invention, the rotating driving component includes a rotating seat arranged to rotate around a vertical center line, a driving motor connected to the bottom of the rotating seat, wherein the synchronous shaft is fixedly connected to the top of the rotating seat from the bottom, and the upper brushing component and the lower brushing component are respectively arranged at the top and the middle of the synchronous shaft; and / or, the upper brushing component and the lower brushing component are arranged symmetrically up and down, and the upper brushing component includes a connecting arm perpendicular to the synchronous shaft, a brush and a two-fluid nozzle arranged at one end of the connecting arm away from the synchronous shaft, wherein the upper and lower brushes are synchronously driven by the same driving motor. Here, the brush and the nozzle spraying the two fluids are combined for brushing, which effectively improves the brushing efficiency and brushing quality of the wafer.

[0024] According to another specific implementation and preferred aspect of the present invention, the upper brushing component is fixedly arranged on the top of the synchronous shaft; an adjustment groove extending up and down is formed in the middle of the synchronous shaft, and the lower brushing component is inserted into the adjustment groove; the lifting drive component includes a lifting guide rail, a lifting seat which is slidable up and down on the lifting guide rail and connected to the rotating drive component, a driving electric cylinder for driving the lifting seat to slide up and down, and a driving cylinder for driving the lower brushing component to move up and down along the adjusting groove.

[0025] According to another specific implementation and preferred aspect of the present invention, a transfer chamber, a cleaning chamber and a drying chamber connected to the transfer chamber are formed on the frame, the feeding unit and the transfer manipulator are both arranged in the transfer chamber, and the cleaning unit and the drying unit are correspondingly arranged in the cleaning chamber and the drying chamber, so as to realize the integration and modularization of the equipment and facilitate the later maintenance.

[0026] In addition, the cleaning unit and the drying unit constitute a cleaning and spinning group, and there are one or more cleaning and spinning groups. When multiple cleaning and spinning groups are provided, multiple cleaning and spinning groups are arranged side by side, such as one, two, four, six, eight, etc.; and / or, there are multiple transfer robots.

[0027] Due to the implementation of the above technical solution, the present invention has the following advantages compared with the prior art:

[0028] The upper and lower brush parts in the prior art generally rotate around the vertical axis or move linearly along the horizontal plane to adjust the brushing area on the wafer surface, but cannot be adjusted in the up and down directions. Therefore, the thickness of the brushing space formed between the upper and lower brush parts cannot be adaptively adjusted according to the thickness of wafers of different specifications. When replacing wafers of different specifications, it is easy for the upper and lower brush parts to have insufficient contact with the wafer or excessive squeezing of the wafer, resulting in poor brushing effect or wafer damage. Moreover, the existing clamping parts generally use multiple clamping wheels distributed around the circumference of the wafer, and clamp or release the wafer during the radial movement of the wafer. Therefore, not only is the required driving mechanism structure complex (each clamping wheel needs to control the radial movement separately), but for wafers of different specifications, each clamping wheel needs to move a corresponding distance. In this way, it is necessary to design sufficient space to meet the movement of the clamping wheel, and there are problems of low internal space utilization and large equipment size. The present application makes an overall design of the structure of the fully automatic wafer cleaning machine, ingeniously solving the deficiencies and defects of the prior art. After adopting the fully automatic wafer cleaning machine, the wafers are supplied by the feeding unit, and firstly, the transfer robot grabs the wafers one by one and transfers them to the clamping unit, wherein the wafers are placed in the corresponding clamping area, and the first and second clamping wheel groups approach each other to clamp the wafers; secondly, the upper and lower brushing parts rotate synchronously around the synchronous axis to form a cleaning area that can cover the upper and lower surfaces of the wafer, and the upper and / or lower brushing parts are raised and lowered along the synchronous axis to form a brushing area matching the wafer between the upper and lower brushing parts; then the transfer robot transfers the wafers that have been brushed to the drying unit for drying; finally, the transfer robot takes out and unloads the dried wafers, grabs the next wafer and repeats the above steps. Therefore, compared with the prior art, the present invention is based on the cooperation of the first and second clamping wheel groups, and realizes the clamping or loosening of wafers of different specifications under equidistant movement. It has a simple structure and can effectively improve the space utilization of the equipment, while effectively improving the loading and unloading efficiency of the wafers. On the other hand, through the movement of the upper and lower brushing parts, the wafers clamped in any clamping area can be brushed synchronously, ensuring the brushing effect on the upper and lower sides of the wafers and meeting the brushing needs of wafers of different specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of the three-dimensional structure of a fully automatic wafer cleaning machine of this embodiment;

[0030] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure from another perspective (partially omitted);

[0031] Figure 3 for Figure 1 A top view schematic diagram of (partially omitted);

[0032] Figure 4It is a schematic diagram of the three-dimensional structure of the clamping unit and the cleaning unit of this embodiment;

[0033] Figure 5 for Figure 4 A schematic diagram of the structure from another perspective;

[0034] Figure 6 for Figure 4 A magnified schematic diagram of the local structure;

[0035] Among them: 1, frame; q1, transfer chamber; q2, cleaning chamber; q3, drying chamber;

[0036] 2. Feeding unit; 20. Storage rack;

[0037] 3. Clamping unit; 30. Clamping wheel; 301. First wheel body; 302. Second wheel body; 303. Third wheel body; c0. Wheel groove; q4. Clamping area; z1. First clamping wheel group; z2. Second clamping wheel group; 31. Power component; 311. First moving seat; 312. Second moving seat; 313. First cylinder; 314. Second cylinder; 315. First motor; 316. Second motor; 32. Auxiliary wheel; c1. Auxiliary wheel groove;

[0038] 4. Cleaning unit; 40. Upper brushing part; 41. Lower brushing part; a0. Connecting arm; a1. Brush; s. Driving motor; a2. Nozzle; 42. Spraying part; 43. Synchronous shaft; c2. Adjusting slot; 44. Rotating driving part; 440. Rotating seat; 441. Driving motor; 45. Lifting driving part; 450. Lifting guide rail; 451. Lifting seat; 452. Driving electric cylinder; 453. Driving cylinder;

[0039] 5. Drying unit;

[0040] 6. Transfer robot;

[0041] P1, 8-inch wafer; P2, 6-inch wafer. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0043] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0045] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] In the present application, unless otherwise clearly specified and limited, the first feature "above" or "below" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature. It should be noted that when an element is referred to as "fixed to" or "set on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0047] like Figures 1 to 6 As shown, a fully automatic wafer cleaning machine of this embodiment includes a frame 1, a feeding unit 2, a clamping unit 3, a cleaning unit 4, a drying unit 5, and a transfer robot 6.

[0048] Specifically, the frame 1 is formed with a transfer chamber q1, a cleaning chamber q2 and a drying chamber q3 connected to the transfer chamber q1, the feeding unit 2 and the transfer robot 6 are both arranged in the transfer chamber q1, and the cleaning unit 4 and the drying unit 5 are correspondingly arranged in the cleaning chamber q2 and the drying chamber q3, so as to realize the integration and modularization of the equipment and facilitate the later maintenance.

[0049] At the same time, the cleaning unit 4 and the drying unit 5 constitute a cleaning and drying group, and there are two cleaning and drying groups arranged side by side; the tops of the transfer chamber q1, the cleaning chamber q2 and the drying chamber q2 are all provided with air purification systems to optimize the air inside the equipment and avoid contaminating the wafer surface; in addition, the interior of the frame 1 of this embodiment is also provided with an electrical system and a piping system that cooperate with the clamping unit 3, the cleaning unit 4, the drying unit 5, and the transfer robot 6, which are all existing technologies and will not be elaborated here.

[0050] In this example, the feeding unit 2 is used to supply wafers, and includes a plurality of wafer storage racks 20 arranged side by side and spaced apart in the transfer chamber q1, wherein a portion of the storage racks 20 is used to store wafers to be cleaned, and another portion of the storage racks 20 is used to store wafers that have been cleaned and dried.

[0051] In this example, the clamping unit 3 includes a plurality of clamping wheels 30 and a power component 31 distributed around the circumference of the wafer, wherein the plurality of clamping wheels 30 are divided into a first clamping wheel group z1 and a second clamping wheel group z2 located on opposite sides of the wafer, wherein the clamping wheels 30 in the first clamping wheel group z1 and the second clamping wheel group z2 move synchronously and in the same direction respectively, and the first clamping wheel group z1 and the second clamping wheel group z2 can move toward or away from each other to form a first position for clamping the wafer or a second position for releasing the wafer. When in the first position, a plurality of clamping areas q4 distributed layer by layer from top to bottom are formed between the first clamping wheel group z1 and the second clamping wheel group z2, wherein the diameters of the plurality of clamping areas are gradually reduced or increased from top to bottom, and wafers of different diameters can be clamped synchronously in the corresponding clamping area q4.

[0052] In some specific embodiments, the first clamping wheel group z1 and the second clamping wheel group z2 are symmetrically arranged about the center of the wafer, wherein the first clamping wheel group z1 and the second clamping wheel group z2 respectively move linearly along the horizontal direction, and the movement directions are opposite; the first clamping wheel group z1 and the second clamping wheel group z2 are respectively provided with two clamping wheels 30 arranged side by side and spaced apart, wherein the arrangement direction of the two clamping wheels 30 in the first clamping wheel group z1 and the second clamping wheel group z2 is perpendicular to the movement direction; the outer wall of each clamping wheel 30 forms a plurality of wheel grooves c0 distributed layer by layer from top to bottom, wherein the outer diameters of the plurality of wheel grooves c0 are gradually increased from top to bottom, and clamping areas q4 are formed between the plurality of wheel grooves c0 in each layer, and when clamped, the wafer is pressed against the corresponding wheel groove c0 from the edge; the center lines of the plurality of clamping areas q4 are arranged to overlap.

[0053] For the convenience of implementation, each clamping wheel 30 includes a first wheel body 301, a second wheel body 302 and a third wheel body 303, the outer diameters of which increase step by step from top to bottom, wherein wheel grooves c0 are formed between the first wheel body 301 and the second wheel body 302, and between the second wheel body 302 and the third wheel body 303 respectively; the clamping unit 3 also includes auxiliary wheels 32 located on opposite sides of the wafer, wherein an auxiliary wheel groove c1 is formed on each auxiliary wheel 32, which is flush with the wheel groove c0 located below, and when the wafer is clamped in the clamping area q4 located in the lower layer, the edge of the wafer is synchronously abutted in the auxiliary wheel groove c1; the clamping area q4 of the present application has two layers, wherein the clamping area q4 located in the upper layer matches the 8-inch wafer P1, and the clamping area q4 located in the lower layer matches the 6-inch wafer P2. Hereby, it is convenient for processing and use; at the same time, through the setting of the auxiliary wheels, the support and clamping stability of wafers with smaller diameters are improved, so that wafers of different specifications can be scrubbed at the same rotation speed, effectively improving efficiency.

[0054] At the same time, transmission belts are respectively connected between each clamping wheel 30 in the first clamping wheel group z1 and the second clamping wheel group z2; the power component 31 includes a first movable seat 311 and a second movable seat 312 located on opposite sides of the wafer, a first cylinder 313 and a second cylinder 314 for driving the first movable seat 311 and the second movable seat 312 to move toward or away from each other, and a first motor 315 and a second motor 316 respectively arranged on the first movable seat 311 and the second movable seat 312, wherein the first clamping wheel group z1 and the second clamping wheel group z2 are respectively arranged on the first movable seat 311 and the second movable seat 312, the first motor 315 and the second motor 316 respectively drive any clamping wheel 30 in the first clamping wheel group z1 and the second clamping wheel group z2 to rotate around the vertical center line, and the clamping wheel 30 drives another clamping wheel 30 in the same group to rotate through the above-mentioned transmission belt, so as to realize the rotation of the wafer around its own center line during the scrubbing process.

[0055] In this example, the cleaning unit 4 includes an upper brush component 40 and a lower brush component 41 respectively arranged above and below the wafer, a spray component 42 for spraying cleaning liquid onto the upper and lower surfaces of the wafer, a synchronization shaft 43 connected between the upper brush component 40 and the lower brush component 41 and extending vertically, a rotating drive component 44 for driving the upper brush component 40 and the lower brush component 41 to rotate around the center line of the synchronization shaft 43, and a lifting drive component 45 for driving the upper brush component 40 and / or the lower brush component 41 to move up and down along the synchronization shaft 43, wherein when any wafer is clamped in the corresponding clamping area q4, a brushing area matching the wafer is formed between the upper brush component 40 and the lower brush component 41.

[0056] In some specific embodiments, the upper brushing component 40 and the lower brushing component 41 have the same function or are symmetrically arranged up and down, and both the upper brushing component 40 and the lower brushing component 41 include a connecting arm a0 perpendicular to the synchronous shaft 43, a brush a1 and a two-fluid nozzle a2 arranged at one end of the connecting arm a0 away from the synchronous shaft 43, wherein the upper and lower brushes a1 are synchronously driven by the same driving motor s, and the upper and lower brushes a1 and the two-fluid nozzle a2 are aligned up and down. Here, brushing is performed by combining a brush and a nozzle for spraying two fluids, which effectively improves the brushing efficiency and brushing quality of the wafer.

[0057] The spray component 42 includes a plurality of spray heads, wherein the angle of each spray head can be adjusted according to the position of the wafer to ensure that the cleaning liquid is sprayed onto the upper and lower surfaces of the wafer.

[0058] The upper brush component 40 is fixedly arranged on the top of the synchronous shaft 43; an adjustment groove c2 extending up and down is formed in the middle of the synchronous shaft 43, and the connecting arm a0 in the lower brush component 41 is inserted into the adjustment groove c2 from one end; that is, under the constraint of the adjustment groove c2, the synchronous shaft 43 can drive the lower brush component 41 to rotate synchronously with the upper brush component 40, and at the same time, the lower brush component 41 can also move up and down along the extension direction of the adjustment groove c2.

[0059] The rotating driving component 44 includes a rotating seat 440 that is arranged to rotate around a vertical center line, and a driving motor 441 connected to the bottom of the rotating seat 440, wherein the synchronous shaft 43 is fixedly connected to the top of the rotating seat 440 from the bottom end, and the upper brushing component 40 and the lower brushing component 41 are respectively arranged at the top and the middle of the synchronous shaft 43.

[0060] The lifting drive component 45 includes a lifting guide rail 450, a lifting seat 451 that is slidably arranged on the lifting guide rail 450 and connected to the rotating drive component 44, a driving electric cylinder 452 for driving the lifting seat 451 to slide up and down, and a driving cylinder 453 for driving the lower brushing component 41 to move up and down along the adjustment groove c2, wherein the driving motor 441 is fixedly connected to the lifting seat 451, and realizes the synchronous lifting movement of the upper brushing component 40 and the lower brushing component 41 during the lifting and lowering of the lifting seat 451. In order to further facilitate the implementation, the lifting drive component 45 also includes a connecting module that is sleeved on the outer periphery of the synchronous shaft 4 and fixedly connected to the lower brushing component 41, and the telescopic end of the driving cylinder 453 is fixedly connected to the connecting module, and the driving cylinder 453 drives the connecting module to move up and down along the synchronous shaft 4, and the lower brushing component 41 moves up and down synchronously.

[0061] In this example, the drying unit 5 uses a spin drying method to dry the wafer after scrubbing, which can be any conventional spin drying mechanism, which is a prior art and can be implemented without further description. In some specific embodiments, the cleaning unit 4 and the drying unit 5 constitute a cleaning and drying group, and there are one or more cleaning and drying groups. When multiple cleaning and drying groups are provided, multiple cleaning and drying groups are arranged side by side, such as one, two, four, six, eight, etc.

[0062] In addition, the transfer robot 6 is used to transfer wafers one by one between the feeding unit 2, the clamping unit 3, the cleaning unit 4 and the drying unit 5, wherein the transfer robot 6 can be a wafer transfer robot of any conventional structure, capable of grabbing wafers and performing lifting and rotating actions, which is a prior art and will not be described here. At the same time, in this embodiment, there are three transfer robots 6 and they are distributed up and down in sequence to pick up and put down materials at each position respectively.

[0063] In summary, after adopting the fully automatic wafer cleaning machine, the wafers are supplied by the feeding unit, and firstly, the transfer robot grabs the wafers one by one and transfers them to the clamping unit, wherein the wafers are placed in the corresponding clamping areas, and the first and second clamping wheel groups approach each other to clamp the wafers; secondly, the upper and lower brushing parts rotate synchronously around the synchronous axis to form a cleaning area that can cover the upper and lower surfaces of the wafer, and the upper and / or lower brushing parts are adjusted up and down along the synchronous axis so that the upper and lower brushing areas are symmetrical about the wafer; then the transfer robot transfers the wafers that have been brushed to the drying unit for drying; finally, the transfer robot takes out and unloads the wafers that have been dried, grabs the next wafer and repeats the above steps. Therefore, compared with the prior art, the present invention, on the one hand, is based on the cooperation of the first and second clamping wheel groups, and realizes the clamping or loosening of wafers of different specifications under equidistant movement. It has a simple structure, can effectively improve the space utilization rate of the equipment, and can effectively improve the loading and unloading efficiency of the wafers; on the other hand, through the movement of the upper and lower brushing parts, the wafers clamped in any clamping area can be synchronously brushed to ensure the brushing effect on the upper and lower sides of the wafer, and meet the brushing needs of wafers of different specifications; thirdly, the layout of the first and second clamping wheel groups of the present application is adopted, which is convenient for each clamping wheel to clamp the wafer synchronously to prevent the wafer from being offset, thereby improving the positioning accuracy of the wafer; fourthly, through the setting of auxiliary wheels, the support and clamping stability of wafers with smaller diameters are improved, so that wafers of different specifications can be brushed at the same rotation speed, effectively improving efficiency; fifthly, a brush and a nozzle for spraying two fluids are used in combination for brushing, which effectively improves the brushing efficiency and brushing quality of the wafer; sixthly, the integration and modularization of the equipment are realized, which is convenient for later repair and maintenance.

[0064] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic wafer cleaning machine, comprising: frame; A feeding unit, which is used to supply wafers; A clamping unit, comprising a plurality of clamping wheels distributed around the wafer circumference and a power component; A cleaning unit, comprising an upper brushing component and a lower brushing component respectively arranged above and below the wafer, and a spraying component for spraying a cleaning liquid onto the upper surface and the lower surface of the wafer; A drying unit, which is used for drying the wafer; A transfer robot is used to transfer wafers one by one between the feeding unit, the clamping unit, the cleaning unit and the drying unit. The invention is characterized in that the multiple clamping wheels are divided into a first clamping wheel group and a second clamping wheel group located on opposite sides of the wafer, wherein the clamping wheels in the first clamping wheel group and the second clamping wheel group move synchronously and in the same direction respectively, and the first clamping wheel group and the second clamping wheel group can move towards or away from each other to form a first position for clamping the wafer or a second position for releasing the wafer, and when in the first position, a plurality of clamping areas distributed layer by layer from top to bottom are formed between the first clamping wheel group and the second clamping wheel group, wherein the diameters of the plurality of clamping areas are gradually reduced or increased from top to bottom, and wafers of different diameters can be synchronously clamped in the corresponding clamping areas; The cleaning unit also includes a synchronization shaft connected between the upper brush component and the lower brush component and extending vertically, a rotating drive component driving the upper brush component and the lower brush component to rotate around the center line of the synchronization shaft, and a lifting drive component driving the upper brush component and / or the lower brush component to move up and down along the synchronization shaft. When any wafer is clamped in the corresponding clamping area, a brushing area matching the wafer is formed between the upper brush component and the lower brush component.

2. The fully automatic wafer cleaning machine according to claim 1, characterized in that: The first clamping wheel group and the second clamping wheel group are symmetrically arranged about the center of the wafer, wherein the first clamping wheel group and the second clamping wheel group respectively move linearly along the horizontal direction and move in opposite directions.

3. The fully automatic wafer cleaning machine according to claim 2, characterized in that: The first clamping wheel group and the second clamping wheel group are respectively provided with two clamping wheels arranged side by side and spaced apart, wherein the arrangement direction of the two clamping wheels is perpendicular to the movement direction.

4. The fully automatic wafer cleaning machine according to claim 1, 2 or 3, characterized in that: The outer wall of each clamping wheel forms a plurality of wheel grooves distributed layer by layer from top to bottom, wherein the outer diameters of the plurality of wheel grooves gradually increase from top to bottom, and the clamping area is formed between the plurality of wheel grooves in each layer, and when clamped, the wafer is pressed against the corresponding wheel groove from the edge; the center lines of the plurality of clamping areas are arranged to overlap.

5. The fully automatic wafer cleaning machine according to claim 4, characterized in that: Each of the clamping wheels includes a first wheel body, a second wheel body and a third wheel body, the outer diameters of which increase step by step from top to bottom, wherein the wheel grooves are respectively formed between the first wheel body and the second wheel body and between the second wheel body and the third wheel body; the clamping unit also includes auxiliary wheels located on opposite sides of the wafer, wherein an auxiliary wheel groove flush with the wheel groove located below is formed on each of the auxiliary wheels, and when the wafer is clamped in the clamping area located in the lower layer, the edge of the wafer synchronously contacts the auxiliary wheel groove.

6. The fully automatic wafer cleaning machine according to claim 1, characterized in that: A transmission belt is respectively connected between each of the clamping wheels in the first clamping wheel group and the second clamping wheel group; the power component includes a first movable seat and a second movable seat located on opposite sides of the wafer, a first cylinder and a second cylinder for driving the first movable seat and the second movable seat to move toward or away from each other, and a first motor and a second motor respectively arranged on the first movable seat and the second movable seat, wherein the first clamping wheel group and the second clamping wheel group are respectively arranged on the first movable seat and the second movable seat, and the first motor and the second motor respectively drive any of the clamping wheels in the first clamping wheel group and the second clamping wheel group to rotate around the vertical center line.

7. The fully automatic wafer cleaning machine according to claim 1, characterized in that: The rotating drive component includes a rotating seat that is rotatable around a vertical center line and a driving motor connected to the bottom of the rotating seat, wherein the synchronous shaft is fixedly connected to the top of the rotating seat from the bottom end, and the upper brush component and the lower brush component are respectively arranged at the top and the middle of the synchronous shaft; and / or, the upper brush component and the lower brush component are symmetrically arranged up and down, and the upper brush component includes a connecting arm perpendicular to the synchronous shaft, a brush and a two-fluid nozzle arranged at one end of the connecting arm away from the synchronous shaft, wherein the upper and lower brushes are synchronously driven by the same driving motor.

8. The fully automatic wafer cleaning machine according to claim 1, characterized in that: The upper brush component is fixedly arranged on the top of the synchronous shaft; an adjustment groove extending up and down is formed in the middle of the synchronous shaft, and the lower brush component is inserted into the adjustment groove; the lifting drive component includes a lifting guide rail, a lifting seat that is slidable up and down on the lifting guide rail and connected to the rotating drive component, a driving electric cylinder for driving the lifting seat to slide up and down, and a driving cylinder for driving the lower brush component to move up and down along the adjustment groove.

9. The fully automatic wafer cleaning machine according to claim 1, characterized in that: The frame is formed with a transfer chamber, a cleaning chamber and a drying chamber connected to the transfer chamber, the feeding unit and the transfer robot are both arranged in the transfer chamber, and the cleaning unit and the drying unit are correspondingly arranged in the cleaning chamber and the drying chamber.

10. The fully automatic wafer cleaning machine according to claim 1, characterized in that: The cleaning unit and the drying unit constitute a cleaning and drying group, and there are one or more cleaning and drying groups. When multiple cleaning and drying groups are provided, multiple cleaning and drying groups are arranged side by side; and / or, there are multiple transfer robots.

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