Wafer baking device

Abstract

A wafer baking device disclosed by the present invention comprises a shell, and a heating mechanism and an air volume adjusting mechanism arranged in the shell, the shell comprises a top, an exhaust space located between the top and the air volume adjusting mechanism, and a heating space located between the heating mechanism and the air volume adjusting mechanism, the air volume adjusting mechanism is used for communicating the air exhaust space with the heating space and adjusting the flow of air flowing from the heating space to the air exhaust space; the air volume adjusting mechanism is arranged in the shell and used for adjusting the air flow on one hand and facilitating the air in the heating space to evenly flow to the exhaust space on the other hand.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a wafer baking device. Background Art

[0002] In the prior art, wafers need to be baked when forming a base film, soft-baked after coating, baked after exposure, and hard-baked after development. Basically, baking is required in every step of the wafer manufacturing process. Although the purpose of baking is different, gas solvents need to be discharged during the baking process.

[0003] During the wafer baking process, photoresists with different viscosities produce different gas solvents, and the required ventilation volume is also different. Too much ventilation will result in poor curing effect, and too little ventilation will cause the solvent to not be removed in time, and even condense and drip to contaminate the product. In the prior art, the flow regulating mechanism is set at the exhaust port, and the exhaust volume is adjusted by adjusting the outlet flow of the exhaust port, but it has a great impact on the stability of the gas in the cavity, which in turn affects the temperature uniformity of the cavity. Summary of the invention

[0004] One of the purposes of the present invention is to provide a wafer-level packaging structure to solve the technical problem in the prior art that the stability of the gas in the cavity is affected when the exhaust volume is adjusted.

[0005] To achieve one of the above-mentioned purposes of the invention, one embodiment of the present invention provides a wafer baking device, comprising: a shell, a heating mechanism and an air volume regulating mechanism arranged in the shell, the shell comprising a top, an exhaust space between the top and the air volume regulating mechanism, and a heating space between the heating mechanism and the air volume regulating mechanism, the air volume regulating mechanism is used to connect the exhaust space and the heating space, and adjust the gas flow from the heating space to the exhaust space.

[0006] As a further improvement of an embodiment of the present invention, the air volume regulating mechanism includes a first wind shield and a second wind shield arranged along the height direction of the shell, the first wind shield is provided with a plurality of first ventilation holes, and the second wind shield is provided with a plurality of second ventilation holes; the air volume regulating mechanism is configured to: adjust the overlapping area of ​​the first ventilation holes and the second ventilation holes, and thereby adjust the gas flow rate from the heating space to the exhaust space.

[0007] As a further improvement of an embodiment of the present invention, at least the first wind deflector or the second wind deflector is rotatable around the central axis of the shell, so that the first ventilation hole and the second ventilation hole have overlapping areas of different sizes.

[0008] As a further improvement of an embodiment of the present invention, along the height direction of the shell, the first wind shield is located below the second wind shield, and the air volume adjustment mechanism includes a driving mechanism for driving the second wind shield to rotate.

[0009] As a further improvement of an embodiment of the present invention, the outer periphery of the second windshield plate is meshing teeth, the driving mechanism comprises a gear, and the meshing teeth of the gear cooperate with the meshing teeth of the second windshield plate.

[0010] As a further improvement of an embodiment of the present invention, the plurality of second ventilation holes are consistent with the plurality of first ventilation holes in shape, size and arrangement.

[0011] As a further improvement of one embodiment of the present invention, the shell includes a top wall, and an exhaust port is arranged at the center position of the top wall, and the exhaust port is connected to the exhaust space; the first wind shield includes at least two circles of first ventilation holes, and the center of each circle of the first ventilation holes is aligned with the exhaust port; the second wind shield includes at least two circles of second ventilation holes, and the center of each circle of the second ventilation holes is aligned with the exhaust port.

[0012] As a further improvement of one embodiment of the present invention, a plurality of first ventilation holes located in the same circle are spaced and evenly arranged, and the density of the first ventilation holes located in the outer circle is greater than the density of the first ventilation holes located in the inner circle; a plurality of second ventilation holes located in the same circle are spaced and evenly arranged, and the density of the second ventilation holes located in the outer circle is greater than the density of the second ventilation holes located in the inner circle.

[0013] As a further improvement of an embodiment of the present invention, the radial width of each of the first ventilation holes along the first wind shield is between 4-6 mm, and the radial width of each of the second ventilation holes along the second wind shield is between 4-6 mm.

[0014] As a further improvement of an embodiment of the present invention, the distance between the first wind shield plate and the second wind shield plate is 10 to 20 mm.

[0015] Compared with the prior art, the present invention provides a wafer baking device, in which an air volume adjustment mechanism is arranged in a shell to connect the heating space and the exhaust space, adjust the gas flow from the heating space to the exhaust space, and ensure that the gas in the heating space flows evenly to the exhaust space. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of a wafer baking device according to one embodiment of the present invention.

[0017] Figure 2 It is a schematic diagram of the internal structure of a wafer baking device without hiding the shell in one embodiment of the present invention.

[0018] Figure 3 It is a schematic diagram of partial structural decomposition of a wafer baking device in one embodiment of the present invention.

[0019] Figure 4Schematic diagram of an air volume adjustment mechanism in one embodiment of the present invention.

[0020] Figure 5 Schematic diagram of an air volume adjustment mechanism in one state in one embodiment of the present invention.

[0021] Figure 6 Schematic diagram of the air volume adjustment mechanism in another state in one embodiment of the present invention. DETAILED DESCRIPTION

[0022] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0023] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.

[0025] See also Figure 1-2 , is a structural schematic diagram of a wafer baking device 100 provided in one embodiment of the present invention, which is used for performing a baking process on a wafer.

[0026] The wafer baking device 100 includes a shell 10 and a heating mechanism 20 arranged in the shell. The shell 10 is surrounded to form a cavity. The wafer is located in the cavity and is placed on the heating mechanism 20, and is heated and baked by the heating mechanism 20. The heating mechanism 20 is a heating plate structure. The colloid coated on the surface of the wafer evaporates into the air when heated to form a gas solvent. The gas solvent flows in the shell 10 and needs to be discharged in time.

[0027] In a specific embodiment, the housing 10 is configured as a circular cavity to adapt to the shape of the wafer, and a door 11 is provided on the side wall of the housing 10. The door 11 is opened to put in or take out the wafer, and after the door 11 is closed, the housing 10 forms a closed cavity. The housing 10 includes a top 12, which includes a top wall or a part of a side wall close to the top wall. The top 12 includes an exhaust port 121 connected to the outside world, and the exhaust port 121 is provided on the top wall or a part of a side wall close to the top wall, and is mainly used to discharge the gas solvent in the cavity through the exhaust port 121.

[0028] In the prior art, the wafer baking device 100 includes a flow valve disposed outside the housing 10 and connected to the exhaust port 121, which is used to adjust the air volume of the exhaust port. It is understandable that the diameter of the exhaust port 121 is not particularly large. When the flow valve increases or decreases the flow rate, it has a greater impact on the gas flow at the exhaust port 121, and even affects the stability of the gas solvent in the housing 10. The stability of the gas solvent will also affect the temperature uniformity in the housing 10.

[0029] In a preferred embodiment, the wafer baking device 100 includes an air volume regulating mechanism 30 disposed in a shell 10, and the shell 10 includes an exhaust space 102 located between the top 12 and the air volume regulating mechanism 30, and a heating space 101 located between the heating mechanism 20 and the air volume regulating mechanism 30. The air volume regulating mechanism 30 is used to connect the exhaust space 102 and the heating space 101, and to regulate the gas flow from the heating space 101 to the exhaust space 102.

[0030] In this way, the air volume adjustment mechanism 30 is arranged in the shell 10, which plays a role in uniformly adjusting the gas flow from the heating space 101 to the exhaust space 102, ensuring the stability of the gas flow from the heating space 101 to the exhaust space 102, thereby ensuring the uniform temperature in the heating space 101.

[0031] In other embodiments, other air volume regulating devices may be further provided at the air outlet 121 to further adjust the flow rate of gas discharged from the exhaust space 102 to the outside.

[0032] In a preferred embodiment, the air volume regulating mechanism 30 includes a first wind shield 31 and a second wind shield 32 arranged along the height direction of the shell 10, the first wind shield 31 is provided with a plurality of first ventilation holes 310, and the second wind shield 32 is provided with a plurality of second ventilation holes 320; the air volume regulating mechanism 30 is configured to: adjust the overlapping area of ​​the first ventilation holes 310 and the second ventilation holes 320, and thereby adjust the gas flow from the heating space 101 to the exhaust space 102.

[0033] It is understandable that, combined with Figure 3-4As shown, when the overlapping area of ​​the first ventilation hole 310 and the second ventilation hole 320 is large, more gas passes through in the same time, and the gas flow from the heating space 101 to the exhaust space 102 is large; when the overlapping area of ​​the first ventilation hole 310 and the second ventilation hole 320 is small, less gas passes through in the same time, and the gas flow from the heating space 101 to the exhaust space 102 is small.

[0034] In a preferred embodiment, at least the first wind shield 31 or the second wind shield 32 is rotatably disposed around the central axis of the housing 10, so that the first ventilation hole 310 and the second ventilation hole 320 have overlapping areas of different sizes.

[0035] Specifically, as long as the first wind shield 31 and the second wind shield 32 can achieve relative rotation, they will drive the first ventilation hole 310 and the second ventilation hole 320 to rotate relative to each other in the circumferential direction, and then the overlapping area of ​​the first ventilation hole 310 and the second ventilation hole 320 in the circumferential direction will change.

[0036] In a preferred embodiment, along the height direction of the housing 10 , the first wind shield 31 is located below the second wind shield 32 , and the air volume adjustment mechanism 30 includes a driving mechanism 33 for driving the second wind shield 32 to rotate.

[0037] Reference Figure 4-5 The first windshield 31 and the second windshield 32 are both circular plates. The center of the first windshield 31 and the center of the second windshield 32 are connected by the same rotation axis, and the rotation axis overlaps with the central axis of the shell. The first windshield 31 is fixed to the side wall of the shell, and the second windshield 32 can rotate relatively. The first windshield 31 faces the heating space 101. The environment is complex and residual glue is easily accumulated. If the first windshield 31 is set to rotate, there is a risk of residual glue falling.

[0038] The outer periphery of the second windshield plate 32 is meshing teeth, and the driving mechanism 33 includes a gear 331, and the meshing teeth of the gear 331 cooperate with the meshing teeth of the second windshield plate 32. The driving mechanism 33 includes an engine that drives the gear 331 to rotate, and the engine drives the gear 331 to rotate, and the gear 331 drives the second windshield plate 32 to rotate relative to the first windshield plate 31 through the meshing teeth.

[0039] In a preferred embodiment, the shell 10 includes a top wall, and the exhaust port 121 is arranged at the center of the top wall, and the exhaust port 121 is connected to the exhaust space 102; the first wind shield 31 includes at least two circles of first ventilation holes 310, and the center of each circle of the first ventilation holes 310 is aligned with the exhaust port 102; the second wind shield 32 includes at least two circles of second ventilation holes 320, and the center of each circle of the second ventilation holes 320 is aligned with the exhaust port 102; each circle of first ventilation holes 310 is located on the same cylindrical surface as the corresponding circle of second ventilation holes 320 along the height direction of the shell, ensuring that the first ventilation holes 310 and the second ventilation holes 320 can be directly connected.

[0040] In a preferred embodiment, a plurality of first ventilation holes 310 located in the same circle are spaced apart and evenly arranged, and the density of the first ventilation holes 310 located in the outer circle is greater than the density of the first ventilation holes 310 located in the inner circle; a plurality of second ventilation holes 320 located in the same circle are spaced apart and evenly arranged, and the density of the second ventilation holes 320 located in the outer circle is greater than the density of the second ventilation holes 320 located in the inner circle.

[0041] The sizes of the first ventilation holes 310 are the same. The perimeter formed by the first ventilation holes 310 located in the outer circle is longer, so the number of the corresponding first ventilation holes 310 is greater; the same is true for the second ventilation holes 320.

[0042] The shapes, sizes and arrangement of the second ventilation holes 320 are consistent with those of the first ventilation holes 310. In this way, the second windshield plate 32 can adjust the gas flow rate by rotating within a smaller angle range, which is conducive to uniform and stable adjustment of the gas flow rate. In other words, when the gas flow rate is increased or decreased, the second rotating plate 32 rotates, and the overlapping areas of the first ventilation holes 310 and the second ventilation holes 320 will change at the same time, and the change amplitude is the same. The gas flow rate of the heating space 101 can still flow to the exhaust space 102 uniformly and stably, ensuring the uniform temperature of the heating space 101.

[0043] The radial width of each of the first ventilation holes 310 along the first wind shield 31 is between 4 and 6 mm, and the radial width of each of the second ventilation holes 320 along the second wind shield 32 is between 4 and 6 mm, so as to ensure a suitable ventilation area.

[0044] Combination Figure 6 As shown, when the first ventilation holes 310 and the second ventilation holes 320 are exactly opposite to each other in the height direction of the shell, a plurality of first ventilation holes 310 and a plurality of second ventilation holes 320 completely overlap in the circumferential direction. At this time, the gas flow from the heating space 101 to the exhaust space 102 is the largest; Figure 5As shown, the first ventilation hole 310 and the second ventilation hole 320 may be partially opposite to each other along the height direction of the shell. At this time, the first ventilation hole 310 and the second ventilation hole 320 partially overlap along the circumferential direction, and the gas flow from the heating space 101 to the exhaust space 102 is reduced.

[0045] In one embodiment, the distance between adjacent first ventilation holes 310 is smaller than the arc length of each second ventilation hole 320, so the second ventilation holes 320 cannot be completely staggered with the first ventilation holes 310. In other embodiments, the distance between adjacent first ventilation holes 310 is longer, and the arc length of the second ventilation holes 320 is shorter, so that the second ventilation holes 320 are exactly located between the adjacent first ventilation holes 310, that is, the first ventilation holes 310 and the second ventilation holes 320 are completely staggered along the circumferential direction.

[0046] In a preferred embodiment, the first wind shield 31 and the second wind shield 32 are spaced 10 to 20 mm apart to prevent friction when the two rotate relative to each other, and to provide a circulation space for the gas aerosol to prevent the heating space 101 from being completely sealed.

[0047] It can be understood that there is a spacing between the first wind shield 31 and the second wind shield 32. Even if the first ventilation hole 310 and the second ventilation hole 320 are completely staggered in the circumferential direction, the gas solvent in the heating space 101 can also flow to the exhaust space 102 through the second ventilation hole 320, the spacing between the first wind shield 31 and the second wind shield 32, and the first ventilation hole 310.

[0048] The beneficial effects of the present invention are as follows: the air volume regulating mechanism 30 is arranged in the shell 10 to regulate the gas flow from the heating space 101 to the exhaust space 102 and ensure that the gas in the heating space 101 flows evenly to the exhaust space 102; the second wind shield plate 32 is rotatably arranged relative to the first wind shield plate 31 to adjust the overlapping area of ​​the second ventilation hole 320 and the first ventilation hole 310, which occupies a small space, has a simple structure, and is convenient for adjustment; the second ventilation hole 320 and the first ventilation hole 310 maintain the same size and arrangement, which is conducive to the uniformity of adjustment.

[0049] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.

[0050] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0051] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer baking device, characterized in that: include: A shell, a heating mechanism and an air volume regulating mechanism arranged in the shell, the shell includes a top, an exhaust space between the top and the air volume regulating mechanism, and a heating space between the heating mechanism and the air volume regulating mechanism, the air volume regulating mechanism is used to connect the exhaust space and the heating space, and regulate the gas flow from the heating space to the exhaust space.

2. The wafer baking device according to claim 1, characterized in that: The air volume regulating mechanism includes a first wind shield and a second wind shield arranged along the height direction of the shell, the first wind shield is provided with a plurality of first ventilation holes, and the second wind shield is provided with a plurality of second ventilation holes; the air volume regulating mechanism is configured to: adjust the overlapping area of ​​the first ventilation holes and the second ventilation holes, and thereby adjust the gas flow from the heating space to the exhaust space.

3. The wafer baking device according to claim 2, characterized in that: At least the first wind deflector or the second wind deflector is rotatably arranged around the central axis of the housing, so that the first ventilation hole and the second ventilation hole have overlapping areas of different sizes.

4. The wafer baking device according to claim 3, characterized in that: Along the height direction of the shell, the first wind shield is located below the second wind shield, and the air volume adjustment mechanism includes a driving mechanism for driving the second wind shield to rotate.

5. The wafer baking device according to claim 4, characterized in that: The outer periphery of the second windshield is meshing teeth, and the driving mechanism comprises a gear, and the meshing teeth of the gear cooperate with the meshing teeth of the second windshield.

6. The wafer baking device according to claim 2, characterized in that: The second ventilation holes are consistent with the first ventilation holes in shape, size and arrangement.

7. The wafer baking device according to claim 2, characterized in that: The shell includes a top wall and an exhaust port arranged at the center of the top wall, wherein the exhaust port is connected to the exhaust space; the first wind shield includes at least two circles of first ventilation holes, and the center of each circle of the first ventilation holes is aligned with the exhaust port; the second wind shield includes at least two circles of second ventilation holes, and the center of each circle of the second ventilation holes is aligned with the exhaust port.

8. The wafer baking device according to claim 7, characterized in that: A plurality of first ventilation holes located in the same circle are spaced apart and evenly arranged, and the density of the first ventilation holes located in the outer circle is greater than the density of the first ventilation holes located in the inner circle; a plurality of second ventilation holes located in the same circle are spaced apart and evenly arranged, and the density of the second ventilation holes located in the outer circle is greater than the density of the second ventilation holes located in the inner circle.

9. The wafer baking device according to claim 2, characterized in that: The radial width of each of the first ventilation holes along the first wind shield is between 4-6 mm, and the radial width of each of the second ventilation holes along the second wind shield is between 4-6 mm.

10. The wafer baking device according to claim 2, characterized in that: The distance between the first wind shield plate and the second wind shield plate is 10-20 mm.

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