A wafer chuck mechanism with lifting and rotating functions

Abstract

The present invention belongs to the technical field of semiconductor processing, and relates to a wafer chuck mechanism with lifting and rotating functions, which includes: a handling base, the handling base is movably connected to a handling connection plate; a lifting platform is slidably connected to the handling base; a lifting support column is further included, the lifting support column is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to a rotating unit, and the upper end of the lifting support column is connected to a vacuum chuck unit; the middle part of the lifting support column is rotatably connected to the handling base; a vacuum shaft mounting plate is movably penetrated through the upper part of the lifting support column, and a vacuum hollow shaft is connected to the vacuum shaft mounting plate; a vacuum shaft lifting unit is connected to the handling base. After adopting the above structure, the beneficial effects are: the wafer chuck can move left and right, lift up and down, and rotate 360°, and can better apply the wafer to different processes.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing, and more specifically, relates to a wafer chuck mechanism with lifting and rotating functions. Background Art

[0002] With the progress of semiconductor technology, the requirements for product performance are getting higher and higher, and new packaging processes are emerging continuously. When wafers come out of the wafer fabrication plant, they are relatively thick. Due to the requirements for packaging size, the wafers will be thinned during packaging to adapt to smaller packaging sizes. When thinning the wafers, in order to protect the circuit layer of the wafers, a film will be attached to the circuit layer of the wafers to protect the wafers from being scratched and contaminated during the thinning process. After the wafers are thinned, this protective film needs to be removed, and the wafers cannot be damaged during the removal process.

[0003] Before removing the film, the wafers need to be fixed. The existing wafer chucks can only move up and down, cannot move left and right or rotate 360°, and are not applicable to more processing procedures. Therefore, it is necessary to make improvements. Summary of the Invention

[0004] In order to solve the above problems of the prior art, the present invention provides a wafer chuck mechanism with lifting and rotating functions.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] As one aspect of the present invention, a wafer chuck mechanism with lifting and rotating functions is proposed, which includes: a handling base, the handling base is movably connected to a handling connecting plate; a lifting platform is slidably connected to the handling base;

[0007] It further includes a lifting support column, the lifting support column is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to a rotating unit, and the upper end of the lifting support column is connected to a vacuum chuck unit for adsorbing wafers; the middle part of the lifting support column is rotatably connected to the handling base, and the lifting support column can rotate relative to the handling base;

[0008] A vacuum shaft mounting plate is movably arranged through the upper part of the lifting support column, at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and a channel is provided inside the vacuum hollow shaft; one end of the vacuum hollow shaft is connected to a vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft sequentially passes through a chuck mounting block, a chuck mounting plate and a wafer chuck and is connected to a vacuum chuck;

[0009] A vacuum shaft lifting unit for driving the vacuum shaft mounting plate to lift is connected to the handling base.

[0010] Optionally, a lifting guide rail is connected to the handling base, a lifting slider is connected to the lifting guide rail, and the lifting platform is connected to the lifting slider; the lifting platform moves up and down on the handling base; a lifting screw rod is rotatably connected to the handling base, and both ends of the lifting screw rod are rotatably connected to the handling base through bearing seats; a lifting nut member is threadedly connected to the lifting screw rod, and the lifting platform is connected to the lifting nut member; one end of the lifting screw rod is connected to a lifting driven wheel, a lifting motor is connected to the handling base, a lifting driving wheel is connected to the movable end of the lifting motor, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel.

[0011] The rotating unit includes a rotating motor provided on the lifting platform, a rotating driving wheel is connected to the movable end of the rotating motor, a rotating driven wheel is connected to the lower end of the lifting support column, and the rotating driving wheel and the rotating driven wheel are connected by a rotating synchronous belt.

[0012] Optionally, the vacuum chuck unit includes a chuck mounting block connected to the upper end of the lifting support column, a chuck mounting plate is connected to the chuck mounting block, and a wafer chuck is connected to the chuck mounting plate; an adsorption layer is connected to the surface of the wafer chuck.

[0013] Optionally, the adsorption layer is made of a porous ceramic material.

[0014] Optionally, a heating groove is formed at the bottom of the chuck mounting plate, a heating coil is connected in the heating groove, and a heating coil baffle is provided at the bottom of the chuck mounting plate, and the heating coil baffle presses and fixes the heating coil.

[0015] Optionally, a stop ring for limiting the vacuum shaft mounting plate is provided on the lifting support column.

[0016] Optionally, an installation bushing is further included, the installation bushing is connected to the chuck mounting block, and the vacuum hollow shaft passes through the installation bushing movably.

[0017] Optionally, the vacuum shaft lifting unit includes a vacuum shaft lifting part provided on the handling base; the movable end of the vacuum shaft lifting part is connected to a vacuum shaft lifting block, and the vacuum shaft lifting block is located below the vacuum shaft mounting plate.

[0018] Optionally, a handling guide rail is provided on the handling connecting plate, and a handling slider is slidably connected to the handling guide rail. The handling base is connected to the handling slider. The handling base can move relative to the handling connecting plate through the cooperation of the handling slider and the handling guide rail. A handling lead screw is rotatably connected to the handling connecting plate. Two ends of the handling lead screw are respectively rotatably connected to the handling connecting plate through handling bearing seats. One end of the handling lead screw is connected to the movable end of a handling motor provided on the handling connecting plate. A handling nut member is threadedly connected to the handling lead screw, and the handling base is connected to the handling nut member.

[0019] Optionally, the axial direction of the handling lead screw is parallel to the moving direction of the handling guide rail.

[0020] The wafer chuck mechanism with lifting and rotating functions of the present invention has the following beneficial effects: 1. The wafer chuck can move left and right, lift up and down, and rotate 360°, enabling better application of the wafer in different processes. 2. The adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, and effectively prevent the wafer from warping, improving the flatness of the wafer. 3. There is a heating coil below the wafer chuck, which can heat the wafer film to make the film soft, thus making it easier to peel off from the wafer surface, thereby improving the processing efficiency. Description of the Drawings

[0021] The specification drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0022] Figure 1 It is a three-dimensional structure diagram of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0023] Figure 2 It is a bottom view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0024] Figure 3 It is a front view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0025] Figure 4 It is a side view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0026] Figure 5 It is a rear view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0027] Figure 6 It is a sectional view of the structure of the wafer chuck mechanism with lifting and rotating functions of the present invention;

[0028] Figure 7Structural sectional view of the vacuum suction cup unit of the present invention;

[0029] Figure 8 Structural sectional view of the vacuum shaft lifting unit of the present invention. Specific embodiments

[0030] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

[0031] A wafer chuck mechanism with lifting and rotating functions according to an embodiment of the present application, as Figures 1-8 shown, includes: a handling base 41, the handling base 41 is connected to a handling connection plate 42; a handling guide rail 43 is provided on the handling connection plate 42, and a handling slider 44 is slidably connected to the handling guide rail 43, and the handling base 41 is connected to the handling slider 44; the handling base 41 can move relative to the handling connection plate 42 through the cooperation of the handling slider 44 and the handling guide rail 43; a handling lead screw 45 is rotatably connected to the handling connection plate 42, and the axial direction of the handling lead screw 45 is parallel to the moving direction of the handling guide rail 43; both ends of the handling lead screw 45 are respectively rotatably connected to the handling connection plate 42 through handling bearing seats 46; one end of the handling lead screw 45 is connected to the movable end of a handling motor 47 provided on the handling connection plate 42, a handling nut member 48 is threadedly connected to the handling lead screw 45, and the handling base 41 is connected to the handling nut member 48. When the handling motor 47 works, it drives the handling lead screw 45 to rotate relative to the handling connection plate 42, so that the handling nut member 48 moves on the handling lead screw 45, and further realizes the movement of the handling base 41 connected to the handling nut member 48 on the handling connection plate 42;

[0032] A lifting platform 49 is slidably connected to the handling base 41. A lifting guide rail 410 is connected to the handling base 41. A lifting slider 411 is connected to the lifting guide rail 410. The lifting platform 49 is connected to the lifting slider 411. The lifting platform 49 moves up and down on the handling base 41 through the cooperation of the lifting guide rail 410 and the lifting slider 411. A lifting screw rod 412 is rotatably connected to the handling base 41. Two ends of the lifting screw rod 412 are respectively rotatably connected to the handling base 41 through bearing seats. A lifting nut member 413 is threadedly connected to the lifting screw rod 412. The lifting platform 49 is connected to the lifting nut member 413. One end of the lifting screw rod 412 is connected to a lifting driven wheel 414. A lifting motor 415 is connected to the handling base 41. A lifting driving wheel 416 is connected to the movable end of the lifting motor 415. A lifting synchronous belt 417 is connected between the lifting driving wheel 416 and the lifting driven wheel 414. When the lifting motor 415 works, it drives the lifting driving wheel 416 to rotate. The lifting driving wheel 416 drives the lifting driven wheel 414 to work synchronously through the lifting synchronous belt 417. The lifting driven wheel 414 drives the lifting screw rod 412 to rotate. The lifting screw rod 412 drives the lifting nut member 413 to move, thereby realizing the up and down movement of the lifting platform 49 relative to the handling base 41.

[0033] It further includes a lifting support column 418. The lifting support column 418 is rotatably connected to the lifting platform 49. The upper part of the lifting support column 418 movably passes through the handling base 41. The lower end of the lifting support column 418 is connected to a rotating unit 419. The upper end of the lifting support column 418 is connected to a vacuum chuck unit 420 for adsorbing a wafer. The middle part of the lifting support column 418 is rotatably connected to the handling base 41 through a bearing, and the lifting support column 418 can rotate relative to the handling base 41.

[0034] The rotating unit 419 includes a rotating motor 421 provided on the lifting platform 49. A rotating driving wheel 422 is connected to the movable end of the rotating motor 421. A rotating driven wheel 423 is connected to the lower end of the lifting support column 418. The rotating driving wheel 422 and the rotating driven wheel 423 are connected through a rotating synchronous belt 424. When the rotating motor 421 works, it drives the rotating driving wheel 422 to rotate. The rotating driving wheel 422 drives the rotating driven wheel 423 to work through the rotating synchronous belt 424, thereby realizing the rotation of the lifting support column 418 relative to the handling base 41.

[0035] Such as Figure 7As shown, the vacuum chuck unit 420 includes a chuck mounting block 425 connected to the upper end of the lifting support column 418. A chuck mounting plate 426 is connected to the chuck mounting block 425, and a wafer chuck 427 is connected to the chuck mounting plate 426. An adsorption layer 428 is connected to the surface of the wafer chuck 427. The adsorption layer 428 is made of a porous ceramic material. The porous ceramic material is distributed with dense pores, which can better adsorb the wafer and increase the adsorption force.

[0036] A heating groove is formed at the bottom of the chuck mounting plate 426, and a heating coil 429 is connected in the heating groove. A heating coil baffle 430 is provided at the bottom of the chuck mounting plate 426, and the heating coil baffle 430 presses and fixes the heating coil 429. After heating the wafer by the heating coil 429, it is more convenient to tear the wafer film.

[0037] A vacuum shaft mounting plate 431 is movably penetrated through the upper part of the lifting support column 418. At least one vacuum hollow shaft 432 is connected to the vacuum shaft mounting plate 431, and a channel is provided in the vacuum hollow shaft 432. One end of the vacuum hollow shaft 432 is connected to a vacuum generator through a vacuum joint. The other end of the vacuum hollow shaft 432 sequentially passes through the chuck mounting block 425, the chuck mounting plate 426, and the wafer chuck 427 and then is connected to a vacuum chuck 433. The adsorption port of the vacuum chuck 433 is slightly higher than the surface of the wafer chuck 427, which is convenient for adsorbing the wafer. A stop ring 434 for limiting the vacuum shaft mounting plate 431 is provided on the lifting support column 418 to prevent the vacuum shaft mounting plate 431 from falling onto the handling base 41.

[0038] It further includes a mounting bushing 435. The mounting bushing 435 is connected to the chuck mounting block 425, and the vacuum hollow shaft 432 movably passes through the mounting bushing 435. The mounting bushing 435 protects the vacuum hollow shaft 432 and makes the vacuum hollow shaft 432 more stable during the lifting process.

[0039] A vacuum shaft lifting unit 436 for driving the vacuum shaft mounting plate 431 to lift is connected to the handling base 41. As Figure 8 shown, the vacuum shaft lifting unit 436 includes a vacuum shaft lifting part 437 provided on the handling base 41. The vacuum shaft lifting part 437 is a motor or a cylinder, which will not be elaborated here. The movable end of the vacuum shaft lifting part 437 is connected to a vacuum shaft lifting block 438. The vacuum shaft lifting block 438 is located below the vacuum shaft mounting plate 431. When the vacuum shaft lifting part 437 operates, it drives the vacuum shaft lifting block 438 to rise or fall, so that the vacuum hollow shaft 432 rises or returns to the initial position relative to the wafer chuck 427. The vacuum chuck 433 is driven by the vacuum shaft lifting unit 436 to separate the adsorbed wafer from the wafer chuck 427, which is convenient for subsequent operations.

[0040] The handling robot unit transports the wafer to the wafer chuck 427 to adsorb the wafer and perform the film tearing operation.

[0041] The wafer chuck mechanism with lifting and rotating functions of the present application has the following beneficial effects: 1. The wafer chuck can move left and right, lift up and down, and rotate 360°, which can better apply the wafer to different processes. 2. The adsorption layer of the wafer chuck is made of porous ceramic material, which can better adsorb the wafer, increase the adsorption force, and effectively prevent the wafer from warping, improving the flatness of the wafer. 3. There is a heating coil under the wafer chuck, which can heat the wafer film to make the film soft, so that it is easier to peel off from the wafer surface, thereby improving the processing efficiency.

[0042] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0043] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0044] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present application; the orientation words "inner, outer" refer to the inside and outside relative to the contour of each component itself.

[0045] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figure for the device. For example, if the device in the attached drawing is inverted, the device described as "above or over other devices or structures" will then be positioned "below or under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0046] In addition, it should be noted that the use of words such as "first", "second" etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above words have no special meanings, and thus should not be construed as limiting the scope of protection of this application.

[0047] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, terms such as "installed", "provided with", "connected" etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] The above are only the preferred embodiments of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope covered by the present invention.

Claims

1. A wafer chuck mechanism with lifting and rotating functions, characterized in that: It includes: A transport base, the transport base is movably connected to the transport connecting plate; a lifting platform is slidably connected to the transport base; It also includes a lifting support column, which is rotatably connected to the lifting platform; the upper part of the lifting support column movably passes through the handling base; the lower end of the lifting support column is connected to the rotating unit, and the upper end of the lifting support column is connected to a vacuum suction cup unit for adsorbing wafers; the middle part of the lifting support column is rotatably connected to the handling base, and the lifting support column can rotate relative to the handling base; A vacuum shaft mounting plate is movably provided on the upper part of the lifting support column, and at least one vacuum hollow shaft is connected to the vacuum shaft mounting plate, and a channel is provided in the vacuum hollow shaft; one end of the vacuum hollow shaft is connected to the vacuum generator through a vacuum joint, and the other end of the vacuum hollow shaft is movably passed through the suction cup mounting block, the chuck mounting plate and the wafer chuck in sequence, and then connected to the vacuum suction cup of the vacuum suction cup unit; The transport base is connected with a vacuum shaft lifting unit for driving the vacuum shaft mounting plate to rise and fall; The transport base is connected with a lifting guide rail, the lifting guide rail is connected with a lifting slider, and the lifting platform is connected to the lifting slider; the lifting platform is lifted up and down on the transport base; a lifting screw is rotatably connected to the transport base, and both ends of the lifting screw are rotatably connected to the transport base through bearing seats; a lifting nut is threadedly connected to the lifting screw, and the lifting platform is connected to the lifting nut; one end of the lifting screw is connected to a lifting driven wheel, the transport base is connected with a lifting motor, the movable end of the lifting motor is connected to a lifting driving wheel, and a lifting synchronous belt is connected between the lifting driving wheel and the lifting driven wheel; The rotating unit comprises a rotating motor arranged on the lifting platform, the movable end of the rotating motor is connected to a rotating driving wheel, the lower end of the lifting support column is connected to a rotating driven wheel, and the rotating driving wheel and the rotating driven wheel are connected by a rotating synchronous belt; The vacuum shaft lifting unit comprises a vacuum shaft lifting part arranged on a handling base; a movable end of the vacuum shaft lifting part is connected with a vacuum shaft lifting block, and the vacuum shaft lifting block is located below a vacuum shaft mounting plate.

2. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The vacuum suction cup unit comprises a suction cup mounting block connected to the upper end of the lifting support column, the suction cup mounting block is connected to a chuck mounting plate, the chuck mounting plate is connected to a wafer chuck; and an adsorption layer is connected to the surface of the wafer chuck.

3. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 2, characterized in that: The adsorption layer is made of porous ceramic material.

4. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 2, characterized in that: A heating groove is provided at the bottom of the chuck mounting plate, a heating ring is connected in the heating groove, and a heating ring baffle is provided at the bottom of the chuck mounting plate, which presses and fixes the heating ring.

5. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The lifting support column is provided with a stop ring for limiting the position of the vacuum shaft mounting plate.

6. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: It also includes a mounting bushing, which is connected to the suction cup mounting block, and the vacuum hollow shaft movably passes through the mounting bushing.

7. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 1, characterized in that: The transport connecting plate is provided with a transport guide rail, and a transport slider is slidably connected to the transport guide rail, and the transport base is connected to the transport slider; the transport base can move relative to the transport connecting plate through the cooperation of the transport slider and the transport guide rail; a transport screw is rotatably connected to the transport connecting plate, and both ends of the transport screw are rotatably connected to the transport connecting plate through a transport bearing seat; one end of the transport screw is connected to the movable end of the transport motor provided on the transport connecting plate, a transport nut is threadedly connected to the transport screw, and the transport base is connected to the transport nut.

8. The wafer chuck mechanism with lifting and rotating functions as claimed in claim 7, characterized in that: The axial direction of the conveying lead screw is parallel to the moving direction of the conveying guide rail.

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