Wafer clamping and transporting device

Abstract

The present invention discloses a wafer clamping and handling device, and relates to the technical field of wafer clamping and handling; the present invention comprises a connecting plate, a clamping mechanism is arranged on the top of the connecting plate, and three groups of adjustment mechanisms are arranged on the top of the connecting plate. The present invention sets the adjustment mechanism so that the clamping member of the present application rotates on the way of resetting after the clamping is completed, so that the contact surface of the clamping member changes each time the clamping member clamps the wafer, and avoids that the contact surface of the clamping member clamping the wafer does not change all the time, which can greatly reduce the wear degree of the clamping member, reduce maintenance costs, ensure the stability of clamping, and improve the clamping effect of the clamping member; by setting the squeezing mechanism, the clamping member of the present application can change the angle of the clamping member when being squeezed, and can cope with wafers of different thicknesses, so that the angle of the clamping member can be adjusted according to the thickness of the wafer, and the clamping effect is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer clamping and transporting, and in particular to a wafer clamping and transporting device. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Wafer is the basic material for manufacturing semiconductor chips. The main raw material of semiconductor integrated circuits is silicon, so the corresponding one is silicon wafer. Wafers need to be transferred between different workstations or equipment on the production line, including the transfer from cutting equipment to grinding equipment, etching equipment, photolithography equipment, etc. During these transfer processes, wafers need to be clamped and transported to ensure that they are moved stably and accurately from one workstation to another. A clamping and transporting device is needed to clamp and transport the wafers;

[0003] When clamping wafers, current clamping and handling devices mostly use movable clamping parts to clamp and fix the outer wall of the wafer. The clamping parts are cylindrical, and the outer wall is provided with an annular groove in the shape of an isosceles triangle. Although the clamping parts are cylindrical, the contact surface of the clamping parts on the existing clamping and handling devices will not change each time the clamping parts clamp the wafer. Therefore, due to long-term clamping, only the contact surface of the clamping parts that contacts the wafer is worn, and the contact surface that does not contact the wafer remains intact. However, the wear of the clamping parts may cause the wafer to be unable to be clamped stably, and thus it may fall during transportation or processing, affecting the clamping effect, thereby requiring the clamping parts to be replaced, increasing maintenance costs. Secondly, when clamping the wafer, the clamping parts cannot adjust the angle of the annular groove of the clamping parts according to the thickness of the wafer to improve the clamping effect. Therefore, we propose a wafer clamping and handling device. Summary of the invention

[0004] In order to solve the problem that each time the clamping parts on the existing clamping and handling devices clamp the wafer, the contact surface does not change, thereby clamping for a long time, and only the contact surface of the clamping parts that contacts the wafer is worn, while the contact surface that does not contact the wafer remains intact, but the wear of the clamping parts may cause the wafer to be unable to be clamped stably, and thus it falls during transportation or processing, affecting the clamping effect; the purpose of the present invention is to provide a wafer clamping and handling device.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: a wafer clamping and transporting device, comprising a connection plate, a clamping mechanism is provided on the top of the connection plate, and three groups of adjustment mechanisms are provided on the top of the connection plate;

[0006] The adjustment mechanism includes a gear, a rack, a guide groove and a guide block. When clamping the wafer, the clamping mechanism drives the supporting sleeve to move. At this time, the guide block drives the clamping member to move along the guide groove and finally clamps the wafer. With the cooperation of the movable plate, the first telescopic rod and the first spring, the first rotating shaft can be lifted and lowered, so that the guide block can move up and down, and can drive the gear to move up and down, so that the clamping member clamps the wafer and resets the route differently. When the clamp is reset, the gear will contact the rack, so that the rotation of the gear drives the first rotating shaft and the second rotating shaft to rotate, and the second rotating shaft drives the rotation of the clamp. With the cooperation of the ratchet and the pawl, the second rotating shaft can be limited to ensure the stability of the clamp and change the contact surface between the clamp and the wafer.

[0007] Preferably, the clamping mechanism includes a fixed sleeve at the top of a connecting plate, a lifting plate slidably connected to the fixed sleeve, a bidirectional screw rod is arranged in the fixing sleeve, two ends of the bidirectional screw rod are respectively connected to bearings arranged on the inner side wall of the fixing sleeve, two sets of sliding blocks are sleeved on the outer wall of the bidirectional screw rod, the top of each sliding block is hingedly provided with a second connecting rod, one end of each of the two sets of the second connecting rods is hingedly connected to the bottom of the lifting plate, a driven bevel gear is sleeved and installed on the outer wall of the bidirectional screw rod, a motor is arranged on the inner side wall of the fixing sleeve, an active bevel gear meshing with the driven bevel gear is connected to the output end of the motor, three sets of lifting rods are arranged on the outer side wall of the lifting plate, three sets of supporting sleeves are slidably arranged on the top of the connecting plate, the bottom of the three sets of supporting sleeves are all provided with sliding tubes, one end of the sliding tube is provided with a supporting frame, a clamping member is arranged in the supporting frame, an extrusion mechanism is arranged on the outer side wall of the three sets of supporting sleeves, and the outer side walls of the three sets of supporting sleeves are all provided with connecting blocks, one end of each of the connecting blocks is hingedly provided with a first connecting rod, and one end of the first connecting rod is hinged to the lifting rod.

[0008] Preferably, the outer side wall of the fixed sleeve is provided with three sets of lifting grooves, and the lifting rod slides up and down in the lifting grooves.

[0009] Preferably, three groups of sliding grooves are provided on the top of the connecting plate, and the sliding tube slides in the sliding grooves.

[0010] Preferably, the adjusting mechanism comprises a vertical plate provided on the top of the connecting plate, a rack provided on the side wall of the vertical plate, a guide groove provided on the side wall of the vertical plate, a second rotating shaft rotatably provided inside the supporting sleeve, a locking mechanism provided inside the supporting sleeve, one end of the second rotating shaft is connected to one end of the clamping member, and the other end of the clamping member is provided with a third rotating shaft, a supporting plate is provided on the outside of the supporting frame, one end of the third rotating shaft is connected to a bearing provided on the side wall of the supporting plate, a cavity is provided inside the second rotating shaft, a movable plate is slidably connected in the cavity, a first telescopic rod is provided at the bottom of the cavity, and one end of the first telescopic rod is connected to the bottom of the movable plate The first telescopic rod is connected with the first spring, one end of the first spring is connected with the bottom of the movable plate, and the other end of the first spring is connected with the bottom of the cavity. A first rotating shaft is provided at the top of the movable plate, and a gear meshing with the rack is provided at one end of the first rotating shaft. A sleeve is installed on the outer wall of the first rotating shaft using bearing 2, a second telescopic rod is provided at the bottom of the sleeve, one end of the second telescopic rod is connected with the top of the supporting sleeve, a sliding plate is slidably connected in the sleeve, a second spring is provided on the right side wall of the sliding plate, one end of the second spring is connected to the right side wall inside the sleeve, and a guide block is provided on the left side wall of the sliding plate.

[0011] Preferably, the locking mechanism includes a ratchet provided on the inner wall of the supporting sleeve, a rotating seat is sleeved and installed on the outer wall of the second rotating shaft, two groups of openings are opened on the outer wall of the rotating seat, and the inner walls of the two groups of openings are hingedly provided with pawls, and the inner wall of the pawl is provided with a support spring, and one end of the support spring is connected to the inner wall of the opening.

[0012] Preferably, the extrusion mechanism includes a fixed plate provided on the outer side wall of the support frame, a vertical rod is provided on the top of the support frame, a sliding sleeve is provided on the outer side wall of the vertical rod, an extrusion rod is provided on the outer side wall of the sliding sleeve, one end of the extrusion rod is connected to the top of the support plate, a connecting frame is provided on the outer side wall of the sliding sleeve, a connecting plate is rotatably provided on the front side wall of the fixed plate, a guide block is provided on the front side wall of the connecting plate, the guide block slides in the connecting frame, a hinge shaft is provided on the front side wall of the fixed plate, a cylinder is rotatably provided on one end of the hinge shaft, and one end of the cylinder is hinged to the front side wall of the connecting plate.

[0013] Preferably, the vertical rod is arranged in a T shape, and the inner side wall of the sliding sleeve is arranged in a T shape.

[0014] Preferably, the clamping member includes a lower clamping sleeve provided at one end of the second rotating shaft, an upper clamping sleeve provided at one end of the third rotating shaft, a silicone ring provided at the bottom of the upper clamping sleeve, the top of the lower clamping sleeve is connected to the outer wall of the silicone ring, a guide rod is provided at the bottom of the lower clamping sleeve, and one end of the guide rod is connected to the top of the upper clamping sleeve.

[0015] Preferably, the upper clamping sleeve and the lower clamping sleeve are both arranged in a truncated cone shape, and the upper clamping sleeve and the lower clamping sleeve are both made of rubber material.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention provides an adjustment mechanism so that the clamping member of the present application rotates on the way to reset after clamping is completed, so that the contact surface of the clamping member changes each time the clamping member clamps the wafer, thereby preventing the contact surface of the clamping member clamping the wafer from always being unchanged, which can greatly reduce the degree of wear of the clamping member, reduce maintenance costs, ensure the stability of clamping, and improve the clamping effect of the clamping member;

[0018] 2. The present invention provides a squeezing mechanism so that the clamping member of the present application can change its angle when being squeezed, and can cope with wafers of different thicknesses, thereby adjusting the angle of the clamping member according to the thickness of the wafer, further improving the clamping effect;

[0019] 3. The present invention sets a locking mechanism so that when the second rotating shaft drives the clamping member to rotate, the rotating seat will rotate to drive the pawl to rotate on the outer wall of the ratchet. When the gear and the rack are separated and the second rotating shaft stops rotating, the pawl is stuck on the ratchet to prevent the second rotating shaft from rotating, thereby improving the stability of the clamping member.

[0020] 4. The clamping piece of the present invention is made of rubber and silicone, has high elasticity, can be deformed quickly when squeezed, and can quickly return to its original shape and size when not subject to external force. At the same time, the guide rod is used to make the upper clamping sleeve and the lower clamping sleeve more stable when squeezed, thereby improving the support of the overall clamping piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0023] Figure 2 It is a schematic diagram of the structure of the clamping mechanism of the present invention.

[0024] Figure 3 It is a schematic diagram of the structure of the regulating mechanism of the present invention.

[0025] Figure 4It is a schematic diagram of the vertical plate and guide groove structure of the present invention.

[0026] Figure 5 It is a schematic diagram of the internal structure of the support sleeve of the present invention.

[0027] Figure 6 It is a schematic diagram of the structure of the sliding tube, the sliding frame and the clamping member of the present invention.

[0028] Figure 7 It is a schematic diagram of the structure of the extrusion mechanism of the present invention.

[0029] Figure 8 It is a schematic diagram of the structure of the clamping member of the present invention.

[0030] Fig. 9 For the present invention Figure 2 A schematic diagram of the enlarged structure in the middle.

[0031] Fig.10 For the present invention Figure 3 Enlarged schematic diagram of the structure at point B in the middle.

[0032] Fig.11 For the present invention Figure 5 Enlarged schematic diagram of the structure at point C in the middle.

[0033] In the figure: 1, connecting plate; 2, adjusting mechanism; 200, gear; 201, sleeve; 202, first rotating shaft; 203, cavity; 204, movable plate; 205, first telescopic rod; 206, first spring; 207, second rotating shaft; 208, vertical plate; 209, rack; 210, guide groove; 211, guide block; 212, sliding plate; 213, second spring; 214, third rotating shaft; 215, support plate; 216, second telescopic rod; 3, clamping mechanism; 300, supporting sleeve; 301, sliding tube; 302, connecting block; 303, first connecting rod; 304, fixed sleeve; 305, lifting rod; 306, sliding groove; 307, lifting groove ;308, lifting plate;309, second connecting rod;310, motor;311, slider;312, bidirectional screw;313, driven bevel gear;314, driving bevel gear;315, support frame;4, extrusion mechanism;400, extrusion rod;401, vertical rod;402, sliding sleeve;403, guide block;404, connecting frame;405, connecting plate;406, fixed plate;407, cylinder;408, hinge shaft;5, locking mechanism;500, ratchet;501, rotating seat;502, pawl;503, opening;504, support spring;6, clamping member;600, upper clamping sleeve;601, silicone ring;602, lower clamping sleeve;603, guide rod. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example: Figure 1-11 As shown, the present invention provides a wafer clamping and transporting device, comprising a connection plate 1, a clamping mechanism 3 is provided on the top of the connection plate 1, and three groups of adjustment mechanisms 2 are provided on the top of the connection plate 1;

[0036] The adjustment mechanism 2 includes a gear 200, a rack 209, a guide groove 210 and a guide block 211. When the wafer is clamped, the clamping mechanism 3 drives the support sleeve 300 to move. At this time, the guide block 211 drives the clamping member 6 to move along the guide groove 210 and finally clamps the wafer. Under the cooperation of the movable plate 204, the first telescopic rod 205 and the first spring 206, the first rotating shaft 202 can be lifted and lowered, so that the guide block 211 can move up and down, which can drive the gear 200 up and down. Move, so that the routes of the clamping member 6 for clamping the wafer and resetting are different. Therefore, when the clamping member 6 is reset, the gear 200 will contact the rack 209, so that the gear 200 rotates to drive the first rotating shaft 202 and the second rotating shaft 207 to rotate, and the second rotating shaft 207 drives the clamping member 6 to rotate 30 degrees. With the cooperation of the ratchet 500 and the pawl 502, the second rotating shaft 207 can be limited to ensure the stability of the clamping member 6, so that the contact surface between the clamping member 6 and the wafer changes.

[0037] The clamping mechanism 3 includes a fixed sleeve 304 at the top of the connecting disk 1, a lifting plate 308 is slidably connected in the fixed sleeve 304, a bidirectional screw rod 312 is arranged in the fixed sleeve 304, and the two ends of the bidirectional screw rod 312 are respectively connected to the bearings arranged on the inner wall of the fixed sleeve 304, and the outer wall of the bidirectional screw rod 312 is sleeved with two groups of sliders 311, and the top of the slider 311 is hinged with a second connecting rod 309, and one end of the two groups of second connecting rods 309 is hinged to the bottom of the lifting plate 308, and the outer wall of the bidirectional screw rod 312 is sleeved with a driven bevel gear 313, and the inner wall of the fixed sleeve 304 is provided with a motor 310, and the output end of the motor 310 is connected with an active bevel gear 314 meshing with the driven bevel gear 313, and the outer wall of the lifting plate 308 is provided with three groups of lifting rods 305, and the top of the connecting disk 1 is slidably provided with three A group of support sleeves 300 are provided, and a sliding tube 301 is provided at the bottom of the three groups of support sleeves 300. Three groups of sliding grooves 306 are opened on the top of the connecting plate 1. The sliding tube 301 slides in the sliding groove 306. Under the action of the sliding groove 306, the sliding tube 301 moves more stably. A support frame 315 is provided at one end of the sliding tube 301. A clamping member 6 is provided in the support frame 315. An extrusion mechanism 4 is provided on the outer wall of the support frame 315. A connecting block 302 is provided on the outer wall of the three groups of support sleeves 300. A first connecting rod 303 is hinged at one end of the connecting block 302. One end of the first connecting rod 303 is hinged to the lifting rod 305. Three groups of lifting grooves 307 are opened on the outer wall of the fixed sleeve 304. The lifting rod 305 slides up and down in the lifting groove 307. Under the action of the lifting groove 307, the lifting rod 305 moves up and down more stably.

[0038] By adopting the above technical solution, the clamping member 6 can be driven to move and clamp the wafer, and then the connecting plate 1 can be driven to move by an external robot arm, thereby realizing the transportation of the wafer.

[0039] The adjusting mechanism 2 includes a vertical plate 208 provided on the top of the connecting plate 1, a rack 209 provided on the side wall of the vertical plate 208, a second rotating shaft 207 rotatably provided inside the supporting sleeve 300, a locking mechanism 5 provided inside the supporting sleeve 300, one end of the second rotating shaft 207 is connected to one end of the clamping member 6, and the other end of the clamping member 6 is provided with a third rotating shaft 214, a supporting plate 215 is provided on the outside of the supporting frame 315, one end of the third rotating shaft 214 is connected to a bearing provided on the side wall of the supporting plate 215, a cavity 203 is opened inside the second rotating shaft 207, a movable plate 204 is slidably connected inside the cavity 203, a first telescopic rod 205 is provided at the bottom of the cavity 203, one end of the first telescopic rod 205 is connected to the bottom of the movable plate 204, and the first telescopic rod 205 is provided outside A first spring 206 is sleeved on the wall, one end of the first spring 206 is connected to the bottom of the movable plate 204, and the other end of the first spring 206 is connected to the bottom of the cavity 203. A first rotating shaft 202 is provided on the top of the movable plate 204, and a gear 200 meshing with the rack 209 is provided at one end of the first rotating shaft 202. A sleeve 201 is installed on the outer wall of the first rotating shaft 202 using a second bearing, a second telescopic rod 216 is provided at the bottom of the sleeve 201, and one end of the second telescopic rod 216 is connected to the top of the supporting sleeve 300. A sliding plate 212 is slidably connected in the sleeve 201, and a second spring 213 is provided on the right side wall of the sliding plate 212. One end of the second spring 213 is connected to the right side wall of the sleeve 201, and a guide block 211 is provided on the left side wall of the sliding plate 212.

[0040] By adopting the above technical solution, the clamping member 6 can be rotated after each wafer is clamped, so that the contact surface changes each time the wafer is clamped, which can greatly reduce the wear of the clamping member 6 and reduce maintenance costs.

[0041] A guide groove 210 is defined on the side wall of the vertical plate 208 .

[0042] By adopting the above technical solution, the guide groove 210 is composed of a horizontal section and two groups of inclined sections, and one group of inclined sections is processed with an inclined angle (this inclined section is shorter than the other group of inclined sections, so that when the clamping member 6 is reset, the guide block 211 will not move into the guide groove 210, so that the clamping member 6 clamps the wafer and resets the route is different), in the initial state, the guide block 211 is located in the guide groove 210 (the second spring 213 is in a compressed state), when the wafer is clamped, the guide block 211 can be driven to move in the guide groove 210 with the cooperation of the clamping mechanism 3, and finally move out of the guide groove 210, and then translates for a while, so that the wafer can be clamped and fixed. At this time, the gear 200 is reset and raised with the cooperation of the first telescopic rod 205 and the first spring 206. After the transportation is completed, the clamping member 6 will be reset. At this time, the gear 200 moves and contacts with the rack 209, so that the gear 200 rotates, and the gear drives the first rotating shaft 202 and the second rotating shaft 207 to rotate. At this time, the second rotating shaft 207 drives the clamping member 6 to rotate, each time it rotates 30 degrees, so as to adjust the contact surface of the clamping member 6. Each time the wafer is clamped, the contact surface will change, which can greatly reduce the wear of the clamping member 6.

[0043] The locking mechanism 5 includes a ratchet 500 provided on the inner wall of the supporting sleeve 300, a rotating seat 501 is sleeved and installed on the outer wall of the second rotating shaft 207, two groups of openings 503 are opened on the outer wall of the rotating seat 501, and the inner walls of the two groups of openings 503 are hinged with pawls 502, and the inner wall of the pawl 502 is provided with a supporting spring 504, and one end of the supporting spring 504 is connected to the inner wall of the opening 503.

[0044] By adopting the above technical solution, when the second rotating shaft 207 rotates, the rotating seat 501 will rotate to drive the pawl 502 to rotate on the outer wall of the ratchet 500. When the second rotating shaft 207 stops rotating, the pawl 502 is stuck on the ratchet 500 to prevent the second rotating shaft 207 from rotating.

[0045] The extrusion mechanism 4 includes a fixed plate 406 provided on the outer wall of the support frame 315, a vertical rod 401 is provided on the top of the support frame 315, a sliding sleeve 402 is sleeved on the outer wall of the vertical rod 401, the vertical rod 401 is arranged in a T shape, and the inner wall of the sliding sleeve 402 is arranged in a T shape. The T-shape arrangement makes it more stable for the sliding sleeve 402 to move up and down on the outer wall of the vertical rod 401, an extrusion rod 400 is provided on the outer wall of the sliding sleeve 402, one end of the extrusion rod 400 is connected to the top of the support plate 215, a connecting frame 404 is provided on the outer wall of the sliding sleeve 402, a connecting plate 405 is rotatably provided on the front side wall of the fixed plate 406, a guide block 403 is provided on the front side wall of the connecting plate 405, the guide block 403 slides in the connecting frame 404, a hinge shaft 408 is provided on the front side wall of the fixed plate 406, a cylinder 407 is rotatably provided on one end of the hinge shaft 408, and one end of the cylinder 407 is hinged to the front side wall of the connecting plate 405.

[0046] By adopting the above technical solution, the clamping members 6 can be squeezed, so that the angle between the clamping members 6 can be changed, and the angle of the clamping members 6 can be adjusted according to the thickness of the wafer to improve the clamping effect.

[0047] The clamping member 6 includes a lower clamping sleeve 602 provided at one end of the second rotating shaft 207, an upper clamping sleeve 600 provided at one end of the third rotating shaft 214, a silicone ring 601 provided at the bottom of the upper clamping sleeve 600, the top of the lower clamping sleeve 602 is connected to the outer wall of the silicone ring 601, a guide rod 603 is provided at the bottom of the lower clamping sleeve 602, one end of the guide rod 603 is connected to the top of the upper clamping sleeve 600, the upper clamping sleeve 600 and the lower clamping sleeve 602 are both arranged in a truncated cone shape, and the upper clamping sleeve 600 and the lower clamping sleeve 602 are both made of rubber material.

[0048] By adopting the above technical solution, the rubber has better elasticity and can quickly return to its original shape and size when not subjected to external force. With the cooperation of the guide rod 603, the upper clamping sleeve 600 and the lower clamping sleeve 602 are more stable when squeezed.

[0049] Working principle: the connecting plate 1 is connected to the external robot arm through the connecting arm. In the initial state, the guide block 211 is located in the guide groove 210. When clamping the wafer, the robot arm drives the connecting plate 1 to move above the wafer, and then moves the connecting plate 1 downward. The motor 310 drives the active bevel gear 314 to rotate, and the active bevel gear 314 drives the driven bevel gear 313 to rotate. The driven bevel gear 313 drives the bidirectional screw rod 312 to rotate. With the cooperation of the lifting groove 307, the two sets of sliders 311 move relative to each other on the bidirectional screw rod 312. The second connecting rod 309 drives the lifting plate 308 and the lifting rod 305 to move upward. The lifting rod 305 drives the first connecting rod 303 and the connecting block 302 to move. The connecting block 302 drives the supporting sleeve 300 and the sliding tube 301 to move. The sliding tube 301 drives the supporting frame 315 and the clamping member 6 to move. Refer to Figure 3 and Figure 4At this time, the second rotating shaft 207 drives the sleeve 201 to move, and the sleeve 201 drives the guide block 211 to move in the guide groove 210, and finally moves out of the guide groove 210, and then translates for a period of time, and then the clamping member 6 can clamp and fix the wafer. At this time, under the cooperation of the second telescopic rod 216, the first telescopic rod 205 and the first spring 206, the gear 200 and the sleeve 201 rise, and the gear 200 and the rack 209 are on the same horizontal plane. At the same time, the second spring 213 is reset and drives the guide block 211 to abut against the vertical plate 208. After the clamping is completed, the robot arm carries the wafer, and then the clamping mechanism 3 is released to discharge the material, and the supporting sleeve 300 drives the second rotating shaft 207 to move, and the second rotating shaft 207 drives the first rotating shaft 202 and the gear The wheel 200 moves. When the gear 200 contacts and leaves the rack 209, the gear 200 drives the first rotating shaft 202 and the second rotating shaft 207 to rotate 30 degrees. The second rotating shaft 207 drives the clamping member 6 to rotate 30 degrees to adjust the contact surface of the clamping member 6. Each time the wafer is clamped, the contact surface will change. When the second rotating shaft 207 rotates, it will drive the rotating seat 501 to rotate. The rotating seat 501 drives the pawl 502 to rotate on the ratchet 500. When the gear 200 is separated from the rack 209, the support spring 504 can drive the pawl 502 to get stuck on the ratchet 500 to prevent the second rotating shaft 207 from rotating. When the guide block 211 moves into the guide groove 210 and stops moving, the clamping member 6 is reset.

[0050] When it is necessary to adjust the angle of the clamping piece 7 according to the thickness of the wafer, the cylinder 407 drives the connecting plate 405 to rotate, and the connecting plate 405 drives the guide block 403 to move in the connecting frame 404 and squeeze the connecting frame 404, and the connecting frame 404 drives the sliding sleeve 402 to move downward, and the sliding sleeve 402 drives the squeezing rod 400 to squeeze the supporting plate 215, and the supporting plate 215 drives the third rotating shaft 214 to squeeze the upper clamping sleeve 600 downward, and at the same time, the lower clamping sleeve 602 is also squeezed. With the cooperation of the silicone ring 601, the flexibility between the upper clamping sleeve 600 and the lower clamping sleeve 602 can be improved, so that the angle between the clamping pieces 6 can be changed, so that wafers of different thicknesses can be clamped, and the clamping effect is good.

[0051] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A wafer clamping and handling device, comprising a connection plate (1), characterized in that: A clamping mechanism (3) is provided on the top of the connection disk (1), and three sets of adjustment mechanisms (2) are provided on the top of the connection disk (1); The adjusting mechanism (2) comprises a gear (200), a rack (209), a guide groove (210) and a guide block (211). When clamping the wafer, the clamping mechanism (3) drives the supporting sleeve (300) to move. At this time, the guide block (211) drives the clamping member (6) to move along the guide groove (210) and finally clamps the wafer. With the cooperation of the movable plate (204), the first telescopic rod (205) and the first spring (206), the first rotating shaft (202) can be raised and lowered, so that the guide block (211) can move up and down, which can drive the gear (200) to move up and down. The clamping member (6) moves downward, so that the routes of clamping the wafer and resetting are different. When the clamping member (6) is reset, the gear (200) contacts the rack (209), so that the gear (200) rotates to drive the first rotating shaft (202) and the second rotating shaft (207) to rotate, and the second rotating shaft (207) drives the clamping member (6) to rotate 30 degrees. With the cooperation of the ratchet (500) and the pawl (502), the second rotating shaft (207) can be limited to ensure the stability of the clamping member (6), so that the contact surface between the clamping member (6) and the wafer changes.

2. A wafer clamping and transporting device as claimed in claim 1, characterized in that: The clamping mechanism (3) comprises a connection plate (1) having a fixed sleeve (304) at the top, a lifting plate (308) being slidably connected therein, a bidirectional screw rod (312) being provided therein, the two ends of the bidirectional screw rod (312) being respectively connected to bearings provided on the inner wall of the fixed sleeve (304), two groups of sliders (311) being sleeved on the outer wall of the bidirectional screw rod (312), the tops of the sliders (311) being hingedly provided with second connecting rods (309), one end of the two groups of the second connecting rods (309) being hingedly connected to the bottom of the lifting plate (308), a driven bevel gear (313) being sleeved and installed on the outer wall of the bidirectional screw rod (312), and a motor (310) being provided on the inner wall of the fixed sleeve (304). An output end (310) is connected to a driving bevel gear (314) meshing with a driven bevel gear (313); the outer wall of the lifting plate (308) is provided with three groups of lifting rods (305); the top of the connecting plate (1) is slidably provided with three groups of supporting sleeves (300); the bottoms of the three groups of supporting sleeves (300) are provided with sliding tubes (301); one end of the sliding tube (301) is provided with a supporting frame (315); a clamping member (6) is provided in the supporting frame (315); an extrusion mechanism (4) is provided on the outer wall of the supporting frame (315); the outer walls of the three groups of supporting sleeves (300) are provided with connecting blocks (302); one end of the connecting blocks (302) is hingedly provided with a first connecting rod (303); one end of the first connecting rod (303) is hingedly connected to the lifting rod (305).

3. A wafer clamping and transporting device as claimed in claim 2, characterized in that: The outer wall of the fixed sleeve (304) is provided with three groups of lifting grooves (307), and the lifting rod (305) slides up and down in the lifting grooves (307).

4. A wafer clamping and transporting device as claimed in claim 2, characterized in that: The top of the connection plate (1) is provided with three groups of sliding grooves (306), and the sliding tube (301) slides in the sliding grooves (306).

5. The wafer holding and transporting device according to claim 2, characterized in that: The adjusting mechanism (2) comprises a vertical plate (208) provided on the top of the connecting plate (1), a rack (209) provided on the side wall of the vertical plate (208), a guide groove (210) provided on the side wall of the vertical plate (208), a second rotating shaft (207) rotatably provided inside the supporting sleeve (300), a locking mechanism (5) provided inside the supporting sleeve (300), one end of the second rotating shaft (207) being connected to one end of a clamping member (6), and the other end of the clamping member (6) being provided A third rotating shaft (214), a supporting plate (215) is provided on the outside of the supporting frame (315), one end of the third rotating shaft (214) is connected to a bearing provided on the side wall of the supporting plate (215), a cavity (203) is provided inside the second rotating shaft (207), a movable plate (204) is slidably connected inside the cavity (203), a first telescopic rod (205) is provided at the bottom of the cavity (203), one end of the first telescopic rod (205) is connected to the bottom of the movable plate (204), The first telescopic rod (205) is connected to the outer wall of the first telescopic rod (205), and one end of the first spring (206) is connected to the bottom of the movable plate (204), and the other end of the first spring (206) is connected to the bottom of the cavity (203). The top of the movable plate (204) is provided with a first rotating shaft (202), and one end of the first rotating shaft (202) is provided with a gear (200) meshing with a rack (209). The outer wall of the first rotating shaft (202) is mounted by means of a bearing. A sleeve (201) is provided, a second telescopic rod (216) is provided at the bottom of the sleeve (201), one end of the second telescopic rod (216) is connected to the top of the supporting sleeve (300), a sliding plate (212) is slidably connected inside the sleeve (201), a second spring (213) is provided on the right side wall of the sliding plate (212), one end of the second spring (213) is connected to the right side wall inside the sleeve (201), and a guide block (211) is provided on the left side wall of the sliding plate (212).

6. A wafer clamping and transporting device as claimed in claim 5, characterized in that: The locking mechanism (5) comprises a ratchet (500) provided on the inner wall of the supporting sleeve (300); a rotating seat (501) is sleeved and mounted on the outer wall of the second rotating shaft (207); two groups of openings (503) are provided on the outer wall of the rotating seat (501); ratchets (502) are hingedly provided on the inner walls of the two groups of openings (503); a supporting spring (504) is provided on the inner wall of the ratchet (502); one end of the supporting spring (504) is connected to the inner wall of the opening (503).

7. The wafer holding and transporting device according to claim 2, characterized in that: The extrusion mechanism (4) comprises a fixed plate (406) provided on the outer side wall of a support frame (315); a vertical rod (401) is provided on the top of the support frame (315); a sliding sleeve (402) is sleeved on the outer side wall of the vertical rod (401); an extrusion rod (400) is provided on the outer side wall of the sliding sleeve (402); one end of the extrusion rod (400) is connected to the top of the support plate (215); a connecting frame (404) is provided on the outer side wall of the sliding sleeve (402); a connecting plate (405) is rotatably provided on the front side wall of the fixed plate (406); a guide block (403) is provided on the front side wall of the connecting plate (405); the guide block (403) slides in the connecting frame (404); a hinge shaft (408) is provided on the front side wall of the fixed plate (406); a cylinder (407) is rotatably provided on one end of the hinge shaft (408); one end of the cylinder (407) is hinged to the front side wall of the connecting plate (405).

8. The wafer holding and transporting device according to claim 7, characterized in that: The vertical rod (401) is arranged in a T shape, and the inner side wall of the sliding sleeve (402) is arranged in a T shape.

9. The wafer holding and transporting device according to claim 5, characterized in that: The clamping member (6) comprises a lower clamping sleeve (602) provided at one end of the second rotating shaft (207), an upper clamping sleeve (600) provided at one end of the third rotating shaft (214), a silicone ring (601) provided at the bottom of the upper clamping sleeve (600), a top of the lower clamping sleeve (602) connected to the outer wall of the silicone ring (601), a guide rod (603) provided at the inner bottom of the lower clamping sleeve (602), and one end of the guide rod (603) connected to the inner top of the upper clamping sleeve (600).

10. The wafer holding and transporting device according to claim 9, characterized in that: The upper clamping sleeve (600) and the lower clamping sleeve (602) are both arranged in a truncated cone shape, and the upper clamping sleeve (600) and the lower clamping sleeve (602) are both made of rubber material.

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