Protection method for welding cup of electric connector without tail cover

Abstract

A welding cup protection method for an electric connector without a tail cover comprises the following steps: coating silicone rubber on the surface of a welding cup of the electric connector by using a glue filling injector to cover the whole welding cup; standing for 24 hours in a room temperature environment to cure the silicon rubber on the surface of the welding cup; the electric connector is arranged in an encapsulation device and is bound and fixed by using a pressure-sensitive adhesive tape, and only an encapsulation opening is exposed; preparing a potting epoxy glue solution, placing the uniformly stirred and mixed glue solution in a vacuumizing box, and discharging redundant bubbles in the glue solution; pouring the prepared epoxy glue solution into a glue filling injector at a constant speed, removing excess air in a needle cylinder, and injecting the glue solution from the bottom of a welding cup of a potting port of the electric connector at a constant speed until the epoxy glue solution is flush with the upper surface of the potting port; standing in a room temperature environment for 24 hours or placing in a 60 DEG C drying oven for 4 hours to cure the epoxy glue solution; and removing the pressure-sensitive adhesive tape wound outside the encapsulation device, and separating the encapsulation device up and down to obtain the encapsulated electric connector. The encapsulating device is combined with the use of the elastic encapsulating material, so that the effective protection of the electric connection welding cup is realized.

Description

Technical Field

[0001] The invention relates to a method for protecting a solder cup of an electric connector without a tail cover, which is particularly suitable for the situation where a tail cover of the electric connector cannot be assembled and a potting process method is required to protect the solder cup of the electric connector, and belongs to the technical field of electric connector protection. Background Art

[0002] The main materials of traditional cable assemblies include: electrical connectors, tail accessories and wires. As electronic products develop towards miniaturization and lightweight, the space left for cable assemblies is increasingly limited, resulting in some electrical connectors being unable to be equipped with tail covers. The tail cover is crucial to the protection of the solder cup. Therefore, for electrical connectors that cannot be equipped with tail covers, the solder cup position needs to be potted to protect the solder cup from external interference and mechanical damage.

[0003] A patented epoxy encapsulation process for cables of electric connectors without tail covers (CN114211668B) is suitable for protecting solder cups of electric connectors without tail covers, but the process has the following three shortcomings:

[0004] (1) The epoxy glue encapsulated at the tail of the electrical connector directly acts on the solder cup, which is exposed to harsh mechanical environment for a long time, which can easily lead to stress concentration and increase the risk of solder joint failure;

[0005] (2) The raw material polylactic acid used in the potting device needs to be used in conjunction with mold release paint. The mold release paint configuration method is complicated and involves multiple steps and precision control. It places high demands on the operator and the processing time is too long.

[0006] (3) The potting device has a complex structural design, involving multiple nested levels. Precise calibration and adjustment are required during the installation process, and it relies on its own snap fastening. Its stability cannot be guaranteed during subsequent long-term use, which can easily cause wear and tear. Summary of the invention

[0007] The technical problem solved by the present invention is: to overcome the deficiencies of the prior art and provide a method for protecting the solder cup of a tailless electrical connector, by adopting an innovative potting device combined with the use of elastic potting materials to achieve effective protection of the electrical connection solder cup.

[0008] The technical solution of the present invention is: a method for protecting the solder cup of a tailless electrical connector, comprising:

[0009] Use a glue injection syringe to apply silicone rubber on the solder cup surface of the electrical connector to cover the entire solder cup;

[0010] Let it stand at room temperature for 24 hours to allow the silicone rubber on the surface of the solder cup to solidify;

[0011] Place the electrical connector in the potting device, and use pressure-sensitive tape to tie and fix it, leaving only the potting opening;

[0012] Prepare the potting epoxy glue, place the mixed glue evenly in a vacuum box to remove excess bubbles in the glue;

[0013] Pour the prepared epoxy glue into the glue injection syringe at a uniform speed, remove the excess air in the syringe, and inject the glue at a uniform speed from the root of the solder cup of the potting port of the electrical connector until the epoxy glue is flush with the upper surface of the potting port;

[0014] Leave it at room temperature for 24 hours, or place it in a 60℃ oven for 4 hours to allow the epoxy glue to solidify;

[0015] The pressure-sensitive adhesive tape wrapped around the potting device is removed, and the potting device is separated from top to bottom to obtain a potted electrical connector.

[0016] Preferably, the thickness of the silicone rubber coated on the surface of the solder cup of the electrical connector is 5-8 mm.

[0017] Preferably, the potting device is made of polytetrafluoroethylene, and the shape of its inner cavity is adapted to the outer shape of the electric connector, and fits with the butt end face and flange of the electric connector without any gap.

[0018] Preferably, the height of the potting cavity of the potting device needs to be 10 mm greater than the height of the welding cup.

[0019] Preferably, the potting cavity of the potting device is trapezoidal, and the ratio of the short side to the long side is 2:3.

[0020] Preferably, the potting device comprises a lower potting device component and an upper potting device component, and positioning reference holes are provided at both ends of each component. After the electrical connector is placed in the potting device, the positioning reference holes on the lower potting device component and the upper potting device component can be aligned.

[0021] Preferably, after separating the potting device, it is necessary to observe the integrity of the glue after potting. If there are no holes or sharp edges on the surface of the glue, the potting is considered to be completed. If there are holes or sharp edges on the surface of the glue, new glue is used to fill the surface holes, and fine sandpaper is used to grind the sharp edges to make the surface flat and smooth.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] (1) The invention provides a method and a potting device for protecting the solder cup at the rear of an electrical connector. By using a process method of coating the solder cup with silicone rubber and combining it with the application of an innovative potting device, the invention effectively solves the problem of protecting the solder cup at the rear of an electrical connector where a tail cover cannot be installed. Compared with existing domestic solutions, this invention effectively reduces the stress risk caused by epoxy glue on the solder cup and significantly enhances the reliability of the product.

[0024] (2) The potting device of the present invention is not only simple to use, durable and stable, but also can save 10 hours of operation time for the same type of electrical connector compared with the existing domestic process methods, thereby improving production efficiency and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The operating process of the present invention;

[0026] Figure 2 It is a schematic diagram of the appearance of the electrical connector of the present invention;

[0027] Figure 3 It is a schematic diagram of the lower component of the potting device of the present invention;

[0028] Figure 4 It is a schematic diagram of the upper component of the potting device of the present invention;

[0029] Figure 5 It is a schematic diagram of the installation and sealing device of the present invention.

[0030] The accompanying drawings are marked as: 1-electric connector, 2-lower component of the potting device, 3-upper component of the potting device, 4-cable harness, 5-potting cavity, 6-positioning reference hole. DETAILED DESCRIPTION

[0031] The purpose of the present invention is to provide a process method for protecting the solder cup of an electrical connector when the rear cover cannot be installed. By adopting an innovative potting device and combining the use of elastic potting materials, the protective effect of the electrical connection solder cup is improved. The above two points can achieve effective protection of the electrical connection solder cup.

[0032] The inventive points of this scheme are as follows:

[0033] (1) In the present invention, the cable harness 4 is already welded to the solder cup position of the electrical connector 1 before the epoxy glue is poured; silicone rubber is coated on the solder cup of the electrical connector, and then the epoxy glue is poured. The silicone rubber itself is an elastomer with excellent flexibility, so as to reduce the direct force of the epoxy glue on the solder cup, thereby improving the protective effect of the electrical connection solder cup.

[0034] (2) The potting device used in the present invention is made of polytetrafluoroethylene, which has the characteristics of chemical corrosion resistance, water resistance, smooth surface, low friction coefficient and good self-lubrication, and is very easy to separate from the epoxy glue after curing, thereby reducing the generation of complex processes and shortening the production time.

[0035] (3) The potting device used in the present invention is composed of an upper and a lower assembly. When installing, the upper assembly 3 of the potting device and the lower assembly 2 of the potting device are aligned with the positioning reference holes, and then fixed with pressure-sensitive tape. The device has a simple structural design and an easy-to-use installation method. The pressure-sensitive tape binding improves the stability of long-term use and enhances the durability of the device.

[0036] According to the size of the electrical connector shell (such as Figure 2 The potting device is designed as shown in the figure. The potting device consists of upper and lower components (as shown in the figure). Figure 3 , 4 shown).

[0037] The following operation process (such as Figure 1 The present invention is described with reference to FIG.

[0038] Step 1: Use a glue injection syringe to apply silicone rubber on the surface of the solder cup of the electrical connector 1, covering the entire solder cup with a thickness of about 5 to 8 mm, thereby removing the direct stress of the epoxy glue on the solder cup and reducing the risk of solder joint failure;

[0039] Step 2: Leave it at room temperature (temperature: 25°C) for 24 hours to allow the silicone rubber on the surface of the solder cup to solidify;

[0040] Step 3: Install the potting device outside the electrical connector (such as Figure 5 As shown), and tied and fixed with pressure-sensitive tape, only the potting port is exposed; the potting device is made of polytetrafluoroethylene, the inner cavity shape of which is adapted to the shape of the electrical connector, and fits with the butt end face and flange of the electrical connector without any gap;

[0041] Prepare encapsulating epoxy glue Dg-4, component A (transparent liquid) and component B (light yellow liquid), with a mass ratio of A:B = 2:1, use a stirring rod to stir and mix evenly, and place the mixed glue in a vacuum box to discharge excess bubbles in the glue;

[0042] Step 4: Pour the prepared epoxy glue from the glue cup into the glue injection syringe at a uniform speed, remove the excess air in the syringe, and inject the glue at a uniform speed from the root of the solder cup of the potting port of the electrical connector until the epoxy glue is flush with the upper surface of the potting port;

[0043] Step 5: Leave at room temperature (temperature: 25°C) for 24 hours, or place in a 60°C oven for 4 hours to cure the epoxy glue;

[0044] Step 6: Remove the pressure-sensitive tape wrapped around the outside of the potting device, separate the potting device from top to bottom, and observe the integrity of the glue after potting.

[0045] The height of the potting cavity 5 of the potting device must be 10mm greater than the height of the solder cup;

[0046] The potting cavity 5 of the potting device is trapezoidal in shape, and the ratio of the short side to the long side is 2:3;

[0047] The potting device comprises a lower potting device component 2 and an upper potting device component 3. Both ends of each component are provided with positioning reference holes 6. After the electrical connector is placed in the potting device, the positioning reference holes 6 on the lower potting device component 2 and the upper potting device component 3 can be aligned.

[0048] The epoxy glue liquid is simple to prepare and the potting method is simple, and there is no precise control process, which is very easy for operators to master; after potting, the glue liquid is transparent, and the quality of the internal welding cup can be directly observed; at the same time, the potting device of the present invention is easy to install and disassemble, and is not easy to wear and durable.

[0049] The contents not described in detail in the specification of the present invention belong to the prior art known to the professional and technical personnel in this field.

Claims

1. A method for protecting the solder cup of a non-tail cover electrical connector, characterized in that include: Use a glue injection syringe to apply silicone rubber on the solder cup surface of the electrical connector to cover the entire solder cup; Let it stand at room temperature for 24 hours to allow the silicone rubber on the surface of the solder cup to solidify; Place the electrical connector in the potting device, and use pressure-sensitive tape to tie and fix it, leaving only the potting opening; Prepare the potting epoxy glue, place the mixed glue evenly in a vacuum box to remove excess bubbles in the glue; Pour the prepared epoxy glue into the glue injection syringe at a uniform speed, remove the excess air in the syringe, and inject the glue from the root of the solder cup of the potting port of the electrical connector at a uniform speed until the epoxy glue is flush with the upper surface of the potting port; Leave it at room temperature for 24 hours, or place it in a 60℃ oven for 4 hours to allow the epoxy glue to solidify; The pressure-sensitive adhesive tape wrapped around the potting device is removed, and the potting device is separated from top to bottom to obtain a potted electrical connector.

2. A method for protecting the solder cup of a non-tail cover electrical connector according to claim 1, characterized in that: The thickness of the silicone rubber coated on the surface of the solder cup of the electrical connector is 5 to 8 mm.

3. A method for protecting the solder cup of a non-tail cover electrical connector according to claim 1, characterized in that: The potting device is made of polytetrafluoroethylene, and the shape of its inner cavity is adapted to the shape of the electric connector, and fits with the butt end face and flange of the electric connector without any gap.

4. A method for protecting a solder cup of a non-tail cover electrical connector according to claim 1, characterized in that: The height of the potting cavity of the potting device must be 10mm greater than the height of the solder cup.

5. A method for protecting the solder cup of a non-tail cover electrical connector according to claim 1, characterized in that: The potting cavity of the potting device is trapezoidal, and the length ratio of the short side to the long side is 2:

3.

6. A method for protecting the solder cup of a non-tail cover electrical connector according to claim 1, characterized in that: The potting device comprises a lower potting device component and an upper potting device component. Positioning reference holes are arranged at both ends of each component. After the electrical connector is placed in the potting device, the positioning reference holes on the lower potting device component and the upper potting device component can be aligned.

7. A method for protecting the solder cup of a non-tail cover electrical connector according to claim 1, characterized in that: After separating the potting device, it is necessary to observe the integrity of the glue after potting. If there are no holes or sharp edges on the surface of the glue, the potting is considered complete. If there are holes or sharp edges on the surface of the glue, use new glue to fill the holes on the surface and use fine sandpaper to grind the sharp edges to make the surface flat and smooth.

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