Power module bridge, method for producing same, and use thereof in a vehicle

Abstract

The invention relates to a power module bridge comprising: one or more power modules, the one or more power modules having i. One or more circuit carriers, ii. One or more semiconductor switches, ii. One or more connection circuit boards iv. One or more flexible printed circuit boards v. One or more spacers, a gate printed circuit board frame having lateral boundaries and having an upwardly and / or downwardly exposed region, in which a volume surrounded by the frame, one or more connecting elements, are filled with a gel, the one or more circuit carriers, the one or more semiconductor switches, the one or more spacers and the one or more connection circuit boards are connected to one another by means of a sintered connection. The invention further relates to a method for producing a power module bridge according to the invention and to the use of one or more power module bridges in a vehicle.

Description

Technical Field

[0001] The invention relates to a power module bridge, in particular a power module bridge for converting direct current into alternating current, for example a power module B6 bridge. The invention also relates to one or more power modules without a molded body and the integration of the power modules into a power module bridge and the gelling of one or more power modules in the power module bridge. Background Art

[0002] In the prior art, power modules are additionally molded, which are installed, for example, in a power module bridge. During molding, the power modules are embedded in a solid protective housing, which is made, for example, of plastic (molded mass). The molded mass serves to encase and protect the interior of the power module. However, such encasement of the power module by the molded mass is not particularly resistant to cracks.

[0003] A power module is known from DE 11 2017 004 390 T5, which has the following features: an insulating substrate having a front side, on which a power semiconductor component is fastened; a base plate, which is connected to the back side of the insulating substrate; a housing, which is fastened to the base plate and surrounds the insulating substrate; a cover, which is fastened to the housing and forms a sealed area; and a silicone gel, which serves as a filling element, which fills the entire sealed area and has an internal stress, which serves as a compressive stress. Summary of the invention

[0004] According to the present invention, a power module bridge according to a first aspect is disclosed, such as a power module B2 bridge or a power module B6 bridge, the power module bridge comprising:

[0005] One or more power modules, wherein the one or more power modules have:

[0006] i. one or more circuit carriers, the circuit carrier comprising at least three material layers, wherein the middle circuit carrier layer comprises an insulating material, and the first outer circuit carrier layer and the second outer circuit carrier layer comprise an electrically conductive material, wherein the outer layers are designed as one or more conductor structures,

[0007] ii. one or more semiconductor switches,

[0008] iii. One or more connection circuit boards, the connection circuit board comprising at least three material layers, wherein the middle connection circuit board layer comprises an insulating material, and the first outer connection circuit board layer and the second outer connection circuit board layer comprise a conductive material; wherein the one or more connection circuit boards have one or more contact elements

[0009] iv. one or more flexible printed circuit boards and

[0010] v. one or more spacers,

[0011] Grid PCB,

[0012] a frame having lateral boundaries and having regions which are exposed upward and / or downward, wherein the volume surrounded by the frame is filled with gel,

[0013] one or more connection elements,

[0014] In this case, one or more circuit carriers, one or more semiconductor switches, one or more spacers and one or more connection circuit boards are connected to one another by a sintered connection.

[0015] The solution according to the invention shows a power module bridge. A power module bridge is an electronic circuit in which power electronics, such as power modules, are used. Power module bridges are used in various applications, such as motor control devices, converter circuits, switch network components and power inverters. The solution according to the invention is particularly suitable for use in power inverters in electric vehicles, for example. In this case, the power inverter converts direct current (DC) into alternating current (AC).

[0016] The circuit carrier is a component of the power module. The circuit carrier can include, for example, a plurality of material layers, wherein, for example, the outer layer includes a conductive layer and the inner layer includes a non-conductive material. The conductive layer can be used, for example, to electrically connect different power electronic components. In addition, effective thermal management of the power electronic device can be achieved, for example, by the integration of the non-conductive layer. By integrating the conductive layer and the non-conductive layer, a heat dissipation path for conducting heat from the power component can be achieved, for example. For example, the outer layer of the circuit carrier can be configured as a conductor structure, wherein the number and shape of the conductor structure can be different depending on the power module. The power structure includes a conductive material, which is applied to an insulating circuit carrier and is used to achieve a current flow between the components and ensure efficient energy transmission.

[0017] The connection circuit board is also a component of the power module. The connection circuit board can include, for example, a multilayer structure, wherein, for example, the outer layer includes a conductive layer and the inner layer includes a non-conductive material. The conductive layer can be used, for example, to electrically connect different power electronic components. In addition, by integrating the non-conductive layer, for example, effective thermal management of the power electronic device can be achieved. With the help of the integration of the conductive layer and the non-conductive layer, a heat dissipation path for dissipating heat from the power components can be achieved.

[0018] In the framework of the present invention, the power module includes one or more distance holders, which are arranged, for example, between a printed circuit board, a semiconductor switch and a circuit carrier. These distance holders may include insulating materials and may minimize electrical and technical problems. By integrating the distance holders into the power module, short circuits may be avoided. In addition, the integration of the distance holders provides efficient heat dissipation, which results in improved power and reliable function of the power module. In addition, for example, the distance holders are interconnected with the semiconductor switch, the printed circuit board and the circuit carrier by sintering. The advantage of sintering is, for example, that additional fastening elements, such as screws, adhesive materials or welds are omitted, thereby, for example, omitting weak points or sources of failure associated with the use of such fastening elements. In addition, sintering includes a uniform stress distribution on the components of the power module because the stress is evenly distributed over the entire joint surface. As a result, stress concentration can be reduced and the overall stability of the fastening can be improved.

[0019] In the sense of the present invention, the power module bridge comprises a gate printed circuit board. The gate printed circuit board is a component of the power module bridge and is, for example, a separate printed circuit board to which all components of the power module bridge are fastened. In the sense of the present invention, the power module bridge further comprises a frame, wherein the frame comprises a sturdy material, for example plastic. The frame according to the invention ensures a stable assembly and positioning of the power module on the gate printed circuit board and, in addition, provides a physical barrier in order to protect the components of the power module bridge from damage and to extend the service life of the power module. In addition to this, the frame according to the invention provides a surrounded volume which is filled with a gel mass.

[0020] According to the invention, the power module bridge comprises one or more flexible printed circuit boards. A flexible printed circuit board, also known as a Flex-PCB (Flexible Printed Circuit Board), is an electronic structural element which comprises a flexible substrate material which contains conductor circuits and electrical connections. For example, the substrate material consists of plastic, polyamide or another flexible material. Due to its flexibility and pliability, the flexible printed circuit board can be adapted to different shapes and surfaces and can be integrated in the power module bridge in a space-saving manner.

[0021] The solution according to the invention achieves a particularly advantageous design of a power module bridge, wherein the power modules installed in the power module bridge are not encased by a molded mass as in other designs realized according to the prior art, but are gel-cast without such an additional encapsulation.

[0022] In an advantageous extension of the power module bridge proposed according to the invention, a power module bridge is proposed, in which one or more conductor paths of one or more flexible printed circuit boards are fastened to contact elements, and a part of the flexible printed circuit board is fastened to one or more connecting circuit boards by means of a material-locked connection, and the remaining part of the flexible printed circuit board is oriented perpendicular to the fastened part of the flexible printed circuit board.

[0023] According to the invention, one or more flexible printed circuit boards include one or more conductor tracks, wherein the conductor tracks are connected to the contact elements of the power module. Subsequently, the part of the flexible printed circuit board adjacent to the contact elements is connected to the power module in a material-locking manner. The part of the flexible printed circuit board adjacent to the bonding site can be oriented vertically, for example, at 90° relative to the bonding site.

[0024] In one embodiment of the power module bridge according to the invention, it is provided that one or more power modules are positioned within the frame.

[0025] In a development of the power module bridge proposed according to the invention, a power module bridge is proposed, wherein the frame has a variable frame height, wherein the variable frame height is 12 mm, preferably 2 mm to 7 mm, particularly preferably 4 mm to 5 mm.

[0026] According to the invention, a variable frame height is proposed, wherein the frame height depends on the height of the power module inserted into the frame, since the frame height forms a surrounding volume for the gel to be filled in. According to the proposed solution, the frame height is higher than the power module and the components connected to the power module, such as bonding wires and semiconductor circuits.

[0027] In a development of the power module bridge according to the invention, a power module bridge is provided in which the volume surrounded by the frame is filled with gel in such a way that one or more power modules are completely covered by the gel.

[0028] The enclosed volume of the frame refers to the area of ​​the frame that is confined by the structure. The enclosed volume includes the space limited by the outer dimensions of the frame, including the surface of the power module, connecting elements, bonding wires and other electronic components of the power module. The enclosed volume includes at least one open side.

[0029] In a development of the power module bridge according to the invention, a power module bridge is provided, in which the gel is a silicone gel.

[0030] Silicone gel is a semi-solid material comprising a silicone polymer network suspended in a liquid or viscous medium. In the context of the use of the power module bridge according to the invention, silicone gel has excellent temperature resistance, which tolerates thermal stresses at increased temperatures very well without damaging the structural strength or deforming. In particular, compared to the molded mass, the silicone gel has high elasticity and flexibility and is therefore able to absorb and distribute thermal stresses without tearing or forming cracks. In addition, silicone gel has a low thermal conductivity, which improves the insulation and limitation of local temperature differences.

[0031] According to the present invention, a method for producing a power module bridge according to the present invention is provided, wherein the power module bridge comprises one or more power modules, a gate printed circuit board, a frame, a gel and one or more connecting elements according to one of the above-mentioned configurations of the power module bridge according to the present invention, wherein the method comprises the following steps:

[0032] a. Provide one or more power modules,

[0033] b. fastening one or more flexible printed circuit boards to one or more power modules,

[0034] c. Assembling one or more power modules onto the gate printed circuit board,

[0035] d. Assembling the frame around one or more power modules on the gate printed circuit board,

[0036] e. mounting one or more connecting elements on one or more power modules, wherein the one or more connecting elements are mounted so that each connecting element is also fastened to the gate printed circuit board via the frame;

[0037] f. Fill the interior area of ​​the frame with gel.

[0038] The proposed method makes it possible to integrate a power module bridge into various embodiments, for example electric vehicles. In addition, a particularly advantageous design of a power module bridge is achieved by the method, wherein the power module bridge is designed in such a way that the thermomechanical stresses of the components of the power module bridge are reduced by not encapsulating the power modules by means of a molding mass and by gelling the electronic components located in the frame. This reduces, for example, the occurrence of material aging and / or crack formation, which leads to a longer service life of the power module bridge. In addition, for example, by targeted use of cooling measures, the temperature differences that occur can be reduced, which leads to an improvement in the structural integrity and service life.

[0039] For example, the method according to the invention is particularly well suited for efficient heat removal, because the gel mass has good thermal properties, which enable efficient heat removal of the encapsulated components. Thus, the operating temperature of the power module bridge can be optimally maintained, for example. In addition, the application of the gel provides an effective protective layer for the encapsulated power module components to prevent harmful environmental influences, such as moisture, dust, dirt or chemicals. In addition, the gel mass can have an impact damping and vibration damping effect, in that the gel mass acts like a filler and protects the encapsulated power module components from mechanical loads. This is particularly advantageous in applications where electronic components are subjected to vibrations or shocks, such as in the automotive industry. Compared with rigid encapsulation materials, the gel mass also provides higher flexibility and adaptability to the shape and size of the encapsulated power module components. In addition, it is more cost-effective to use the gel mass instead of the rigid encapsulation due to the smaller material requirement and less laborious processing steps.

[0040] In an advantageous embodiment of the method according to the invention for producing a power module bridge, it is provided that one or more power modules are fastened to the gate circuit board by means of a material-bonded connection.

[0041] In a further advantageous embodiment of the method according to the invention for producing a power module bridge, it is provided that the frame is fastened to the gate circuit board by adhesive bonding or welding.

[0042] In a further advantageous embodiment of the method according to the invention for producing a power module bridge, it is provided that after the frame has been mounted on the gate printed circuit board, one or more flexible printed circuit boards are fastened.

[0043] In a further advantageous embodiment of the method according to the invention for producing a power module bridge, it is provided that the power module bridge is fastened to a cooling element.

[0044] According to the invention, a use according to a third aspect for producing a power module bridge in a vehicle is disclosed, wherein the power module bridge is used for current conversion from direct current to alternating current.

[0045] Advantages of the present invention

[0046] The solution according to the invention is distinguished by the fact that effective insensitivity to thermomechanical loads is achieved by gelling the power modules installed in the power module bridge. In addition, by omitting molding of the power modules, the risk of cracks is completely circumvented.

[0047] The solution according to the invention is distinguished by an uncomplicated method which enables integration into existing power module bridges without changing the interfaces, wherein the necessary molding of the power modules is omitted. Furthermore, by omitting the molding of the power modules, costs can be saved.

[0048] Furthermore, the solution according to the invention is advantageously distinguished in that, in contrast to cast power modules which are constructed in a power module bridge, in the proposed solution no or only minimal mechanical stress is exerted on the power electronics of the power module. This is achieved by omitting the encapsulation by molding the power modules and by their gelling. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Embodiments of the present invention are explained in more detail with reference to the drawings and the following description.

[0050] The accompanying drawings show:

[0051] Figure 1 A schematic top view showing an embodiment of a power module according to the present invention is shown,

[0052] Figure 1.1 Schematic diagram showing the power module in the Z direction

[0053] Figure 2 A schematic top view of an embodiment of a power module according to the invention is shown, which has a flexible printed circuit board.

[0054] Figure 3 A schematic perspective view showing a power module bridge,

[0055] Figure 3.1 A schematic top view showing a gate printed circuit board with a frame,

[0056] Figure 4 A schematic perspective view of a power module bridge with connecting elements is shown,

[0057] Figure 5 shows a schematic cross-sectional view of a power module bridge,

[0058] Figure 6 A schematic diagram shows a method for producing a power module bridge. DETAILED DESCRIPTION

[0059] In the following description of embodiments of the invention, identical or similar elements are denoted by the same reference numerals, wherein a repeated description of these elements is omitted in individual cases. The figures merely schematically illustrate the subject matter of the invention.

[0060] In accordance with Figure 1In the schematic diagram of FIG. 1 , an embodiment of a power module 100 according to the present invention comprises a circuit carrier 102 having an insulating layer 116 on which a first conductor structure 104, a second conductor structure 105, a third conductor structure 106 and a fourth conductor structure 107 are arranged, wherein all conductor structures 104, 105, 106 and 107 have a conductor shape. The conductor structures 104 and 105 each have at least two semiconductor switches 110, and the third conductor structure 106 has four semiconductor switches 110. Figure 1 As shown in FIG. 1 , the power module 100 includes two connecting circuit boards 120, wherein the connecting circuit boards 120 have a plurality of contact elements 118. Figure 1 1 shows a power connection 112 of the semiconductor switch 110 and the connecting circuit board 120 via a power bonding wire 112.1. For example, the power connection 112 via the power bonding wire 112.1 can be established by a material-locked connection, in particular by welding. The power bonding wire 112.1 includes a wire made of gold, aluminum or copper, for example. In addition, Figure 1 Includes a directional arrow pointing in the Z direction.

[0061] In accordance with Figure 1.1 In the schematic diagram, the embodiment includes Figure 1 Schematic diagram of the power module 100 in the Z direction 100.1. In addition, Figure 1.1 The circuit carrier 102 is comprised of three material layers 101, which are composed of a first outer circuit carrier layer 103.1, a middle circuit carrier layer 103.2, and a second outer circuit carrier layer 103.3. Figure 1.1 The invention comprises a connection circuit board 120, wherein the connection circuit board 120 comprises three material layers 101, the three material layers comprising a first outer connection circuit board layer 120.1, a middle connection circuit board layer 120.2, and a second outer connection circuit board layer 120.3. Figure 1.1 1 and 108 . 2 are shown, wherein the outer spacer 108 . 1 is formed above the semiconductor switch 110 and the spacer 108 . 2 is shown between the circuit carrier 102 and the connecting circuit board 120 .

[0062] In the case of a heat-induced heating of, for example, one or more components of the power module 100 (for example, the semiconductor switch 110, the connecting circuit board 120 and the circuit carrier 102), the thermal load of these components is effectively dissipated by the spacers 108.1 and 108.2. For example, the spacers 108.1 and 108.2 can be made of ceramic, plastic or also of metal. The type of spacers 108.1 and 108.2 in the power module 100 can be changed, for example, depending on the size, power and environment. For example, the spacers 108.1 and 108.2 are connected to the power module components, for example, the semiconductor switch 110, the connecting circuit board 120 and the circuit carrier 102, by sintering. In addition, the semiconductor switch 110 and the circuit carrier 102 are connected to each other by sintering.

[0063] In accordance with Figure 2 In the schematic diagram of FIG. 1 , an embodiment of a power module 100 according to the invention comprises a circuit carrier 102 having an insulating layer 116 on which a first conductor structure 104, a second conductor structure 105, a third conductor structure 106 and a fourth conductor structure 107 are arranged, wherein all conductor structures 104, 105, 106 and 107 have a conductor shape. Figure 2 As shown in FIG. 1 , the power module 100 includes two connecting circuit boards 120, wherein the connecting circuit boards 120 have a plurality of contact elements 118. Figure 2 1 shows the power connection 112 of the semiconductor switch 110 to the connecting circuit board 120 via the power bonding wire 112.1. Figure 2 2 shows a flexible printed circuit board 204 having fourteen conductor tracks 205 , wherein in each case seven conductor tracks 205 on a connection circuit board 120 are connected to contact elements 118 of a connection circuit board 120 , for example via solder connections.

[0064] Alternatively, the flexible printed circuit board 204 and the connecting circuit board 120 can be connected to each other via electrical contacts of a solder connection, an adhesive connection, or a plug connection. Alternatively, the contact element 118 of a connecting circuit board 120 can also be configured as a socket or a plug.

[0065] Figure 3 A schematic perspective view of a power module bridge 300 is shown, which has a gate printed circuit board 306 , a frame 302 , which is made of plastic, for example, and three power modules 100 , which each have a flexible printed circuit board 204 fastened thereto and positioned within the frame 302 . Figure 3An exemplary orientation of the unfastened portion of the flexible printed circuit board 204 is shown, wherein the unfastened portion of the flexible printed circuit board 204 is oriented horizontally or at 90° relative to the fastened portion of the flexible printed circuit board 204 or relative to the power module 100 .

[0066] Alternatively, the orientation of the flexible printed circuit board 204 can be adapted to the environment. Figure 3 The area 304 to be filled with gel 502 is shown. The area 304 to be filled with gel 502 is within the volume 310 surrounded by the frame 302.

[0067] For example, the enclosed volume 310 may be influenced by the dimensions of the frame 302, for example by determining the length, width and depth dimensions of the power module 100 to be mounted within the frame 302. Preferably, the frame 302 comprises a frame height that is greater than the total height of the power module 100 and its electronic components, such as the connecting circuit board 120 and the power bonding wires 112.1.

[0068] exist Figure 3.1 In the schematic diagram in FIG. 3 , a top view of the gate printed circuit board 306 and the frame 302 is shown. Figure 4 304 to be filled with gel 502 or the surrounded volume 310 (in a top view) is shown. For example, the frame 302 can be mounted in any position on the gate printed circuit board 306, wherein the positioning is implemented in a variable manner depending on the requirements of the application, for example, the requirements of the application in an electric vehicle. For example, the frame 302 is connected to the gate printed circuit board 306 by material locking. Alternatively, the frame 302 can be connected to the gate printed circuit board 306 by screwing, bolting, by a clip or by a retaining clip. Depending on the size and shape of the frame 302, the mechanical load, the required stability and the assembly method, the assembly alternatives can be adjusted. Depending on the requirements of the application, the thickness of the frame 302 can also be changed.

[0069] Figure 4 A schematic perspective view of a power module bridge 300 is shown, which has a gate printed circuit board 306, a connecting element 402, a frame 302, and three power modules 100, wherein the frame 302 is made of plastic, for example, and the power modules each have a flexible printed circuit board 204 fastened thereto and positioned within the frame 302. Figure 4 An exemplary orientation of the unfastened portion of the flexible printed circuit board 204 is shown, wherein the unfastened portion of the flexible printed circuit board 204 is oriented horizontally or at 90° relative to the fastened portion of the flexible printed circuit board 204 or relative to the power module 100 .

[0070] Alternatively, the orientation of the flexible printed circuit board 204 can be adapted to the environment. Figure 3 The area 304 to be filled with gel 502 is shown. The area 304 to be filled with gel 502 is located in a volume 310 surrounded by the frame 302. The connecting element 402 is connected to the conductor structure 104, 105, 106 via the frame 302. The connecting element 402 is, for example, a conductor rail, which in particular comprises a material with high electrical conductivity and has a large cross section, so that the current flow is facilitated and the resistance is minimized.

[0071] exist Figure 5 In the schematic diagram in FIG. 5 , a cross-sectional view of a power module bridge 300 is shown on a cooling element 504. The cross-sectional view shows sections of a gate printed circuit board 306, a frame 302, a connecting element 402, a power module 100 and a flexible printed circuit board 204, wherein the frame 302 has a frame height 506. In addition, the area 304 to be filled with gel 502 can be seen in this cross-sectional view. Figure 5 It can be seen that the gel 502 filled into the frame 302 completely surrounds all electronic components. In addition, the orientation of the flexible printed circuit board 204 is shown in the cross section of the power module bridge 300, wherein it can be seen that the part of the flexible printed circuit board 204 fastened to the power module 100 is completely surrounded by the gel 502.

[0072] like Figure 6 As shown in , the illustrated embodiment of the method 600 for manufacturing a power module bridge 300 according to the present invention includes a first step of providing 602 one or more power modules 100, a second step of fastening 604 one or more flexible printed circuit boards 204 to the one or more power modules 100, a third step of assembling 606 the one or more power modules 100 on a gate printed circuit board 306, a fourth step of assembling 608 a frame 302 on the gate printed circuit board 306 around the one or more power modules 100, a fifth step of installing 610 one or more connecting elements 402 on the one or more power modules 100, and a sixth step of filling 612 the surrounded area 304 of the frame 302 with gel 502.

[0073] For example, one or more power modules 100 may be fastened to the cooling element 504 by welding, and then the frame 302 may be fastened around the one or more power modules 100 by gluing.

[0074] The invention is not limited to the embodiments described herein and the aspects emphasized therein. On the contrary, numerous modifications within the scope of a person skilled in the art can be realized within the scope given by the claims.

Claims

1. A power module bridge (300), the power module bridge comprising: - one or more power modules (100), wherein the one or more power modules (100) have: i. one or more circuit carriers (102), the circuit carrier comprising at least three material layers (101), wherein the middle circuit carrier layer (103.2) comprises an insulating material, the first outer circuit carrier layer (103.1) and the second outer circuit carrier layer (103.3) comprise an electrically conductive material, wherein the outer layers are constructed as one or more conductor structures (104, 105、106)， ii. one or more semiconductor switches (110), iii. one or more connecting circuit boards (120), the connecting circuit boards comprising at least three material layers (101), wherein the middle connecting circuit board layer (120.2) comprises insulating material, the first outer connecting circuit board layer (120.1) and the second outer connecting circuit board layer (120.3) comprise conductive material, wherein the one or more connecting circuit boards (120) comprise one or more contact elements (118), iv. one or more flexible printed circuit boards (204) and v. one or more spacers (108.1, 108.2), - Grid printed circuit board (306) a frame (302) having lateral boundaries and having upwardly and / or downwardly exposed regions (304), wherein the volume (320) surrounded by the frame (302) is filled with gel (502), - one or more connecting elements (402), One or more circuit carriers (102), one or more semiconductor switches (110), one or more spacers (108.1, 108.2) and one or more connection circuit boards (120) are connected to one another via a sintered connection.

2. The power module bridge (300) according to claim 1, wherein: One or more conductor tracks (205) of the one or more flexible printed circuit boards (204) are fastened to the contact element (118), and a portion of the flexible printed circuit board (204) is fastened to one or more connecting circuit boards (120) by means of a material-locked connection, and the remaining portion of the flexible printed circuit board (204) is positioned perpendicular to the fastened portion of the flexible printed circuit board (204).

3. The power module bridge (300) according to any one of the preceding claims, wherein: The one or more power modules (100) are positioned within the frame (302).

4. The power module bridge (300) according to any one of the preceding claims, wherein: The frame (302) has a variable frame height (506), wherein the variable frame height (506) is 12 mm, preferably between 2 mm and 7 mm, particularly preferably between 4 mm and 5 mm.

5. The power module bridge (300) according to any one of the preceding claims, wherein: The volume (320) surrounded by the frame (302) is filled with gel (502) in such a way that one or more power modules (100) are completely covered by the gel (502).

6. The power module bridge (300) according to any one of the preceding claims, wherein: The gel (502) is silicone gel.

7. A method (600) for manufacturing a power module bridge (300) according to any one of claims 1 to 6, the power module bridge comprising one or more power modules (100), a gate printed circuit board (306), a frame (302), a gel (502) and one or more connecting elements (402), wherein: The method comprises the following steps: a. providing (602) one or more power modules (100), b. fastening (604) the one or more flexible printed circuit boards (204) to the one or more power modules (100), c. assembling (606) the one or more power modules (100) onto the gate printed circuit board (306), d. assembling (608) a frame (302) around the one or more power modules (100) on the gate printed circuit board (306), e. mounting (610) the one or more connecting elements (402) on the one or more power modules (100), wherein the one or more connecting elements (402) are mounted such that each connecting element (402) is also fastened to the gate printed circuit board (306) via the frame (302); f. Filling (612) the surrounded area (304) of the frame (302) with gel (502).

8. The method (600) for producing a power module bridge (300) according to claim 7, wherein: The one or more power modules (100) are fastened to a gate printed circuit board (306) by a material-locked connection.

9. The method (600) for producing a power module bridge (300) according to claim 7, wherein: The frame (302) is fastened to the gate printed circuit board (306) by gluing or welding.

10. The method (600) for producing a power module bridge (300) according to any one of claims 7 to 9, wherein: After mounting (608) the frame (302) on the gate printed circuit board (306), the one or more flexible printed circuit boards (204) are fastened (604).

11. The method (600) for producing a power module bridge (300) according to any one of claims 7 to 10, wherein: The power module bridge (300) is fastened to a cooling element (504).

12. Use of one or more power module bridges (300) in a vehicle, wherein: The power module bridge (300) is used for current conversion from direct current to alternating current.

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