Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises a bearing shell, a pressure-sensitive module, a module waterproof bracket, a sealing glue layer and a pressure-sensitive key, the bearing shell comprises a first surface, a second surface and a side face, the first surface and the second surface are oppositely arranged, the side face is connected with the first surface and the second surface, the first surface is provided with a containing groove extending towards the second surface, the side face is provided with an installation hole, and the installation hole is communicated with the containing groove. The pressure sensing module is arranged in the accommodating groove; the module waterproof bracket covers the opening of the accommodating groove; the sealing glue layer is arranged in a gap between the module waterproof bracket and the accommodating groove; the pressure-sensitive key is inserted into the mounting hole and abuts against the pressure-sensitive module. According to the electronic equipment provided by the embodiment of the invention, the structure of the module waterproof bracket is designed, and the sealing glue layer is combined, so that the waterproof performance of the pressure-sensitive module can be realized, and the electronic equipment has the characteristics of simple structure and easiness in assembly.

Description

Technical Field

[0001] The present application relates to the technical field of waterproof structures of pressure-sensitive buttons of electronic devices, and in particular to an electronic device. Background Art

[0002] With the development of electronic devices, electronic devices have begun to use pressure-sensitive buttons to achieve corresponding functions. The pressure-sensitive buttons in the related art have been able to achieve higher sensitivity and accuracy requirements. However, the pressure-sensitive buttons in the current technology have the problem of low waterproof level. Summary of the invention

[0003] An embodiment of the present application provides an electronic device, the electronic device comprising:

[0004] The bearing shell comprises a first surface, a second surface and a side surface connecting the first surface and the second surface, the first surface is provided with a receiving groove extending toward the second surface, the side surface is provided with a mounting hole, and the mounting hole is communicated with the receiving groove;

[0005] A pressure sensing module is disposed in the receiving groove;

[0006] A module waterproof bracket, covering the opening of the receiving groove;

[0007] A sealing adhesive layer, provided in the gap between the module waterproof support and the receiving groove;

[0008] The pressure-sensitive button is inserted into the mounting hole and abuts against the pressure-sensitive module.

[0009] The electronic device provided in the embodiment of the present application can achieve waterproofing of the pressure sensing module by designing a module waterproof bracket structure and combining it with a sealant layer, and has the characteristics of simple structure and easy assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 This is a schematic diagram of the partial structure of an electronic device according to an embodiment of the present application;

[0012] Figure 2 yes Figure 1 A schematic cross-sectional view of the structure of the electronic device at the position of the pressure sensing module in the embodiment;

[0013] Figure 3It is a partial structural schematic diagram of an embodiment of a load-bearing housing of the present application;

[0014] Figure 4 It is a structural schematic diagram of an embodiment of a pressure sensing module of the present application;

[0015] Figure 5 yes Figure 4 A schematic diagram of a partial structure of a pressure sensing module in an embodiment;

[0016] Figure 6 This is a schematic structural diagram of an embodiment of a module waterproof bracket of the present application;

[0017] Figure 7 is a schematic cross-sectional view of the structure of an electronic device in an embodiment of the present application;

[0018] Figure 8 is a schematic cross-sectional view of the structure of another position of the electronic device in an embodiment of the present application;

[0019] Fig. 9 This is a schematic diagram of the structure of an embodiment of a pressure-sensitive button of the present application;

[0020] Fig.10 It is a structural schematic diagram of an embodiment of the FPC bracket of the present application;

[0021] Fig.11 It is a schematic diagram of the structure of the FPC bracket and the opening of the load-bearing shell;

[0022] Fig.12 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0023] Fig.13 yes Fig.12 A schematic cross-sectional view of the structure of the electronic device at DD in the embodiment;

[0024] Fig.14 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0026] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0027] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0029] An embodiment of the present application provides an electronic device, which mainly introduces the structure related to the pressure sensing module of the electronic device.

[0030] Please also read Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the partial structure of an embodiment of the electronic device of the present application. Figure 2 yes Figure 1 A schematic cross-sectional view of the structure of the electronic device at the position of the pressure sensing module in the embodiment; it should be noted that the electronic device in the present application may include electronic devices with pressure sensing components such as mobile phones, tablet computers, laptops, and wearable devices. In this embodiment, only the structure related to the pressure sensing module of the electronic device is introduced, and other structures of the electronic device are within the scope of understanding of those skilled in the art and will not be repeated here.

[0031] The electronic device includes a housing 100, a pressure sensing module 200, a module waterproof bracket 300, a pressure sensing button 400 and a sealing adhesive layer 500. For details, please refer to Figure 2 and Figure 3 , Figure 3 1 is a partial structural diagram of an embodiment of a bearing housing of the present application, wherein the bearing housing 100 may be a middle frame of an electronic device. The bearing housing 100 includes a first surface 110, a second surface 120, and a side surface 130 connecting the first surface 110 and the second surface 120, the first surface 110 is provided with a receiving groove 140 extending toward the second surface 120, and the side surface 130 is provided with a mounting hole 131, which is connected to the receiving groove 140.

[0032] The pressure sensing module 200 is disposed in the receiving groove 140. Figure 4 and Figure 5 , Figure 4 is a structural diagram of an embodiment of a pressure sensing module of the present application, Figure 5 yes Figure 4 A schematic diagram of the partial structure of the pressure sensing module in the embodiment, wherein the pressure sensing module 200 includes a steel sheet assembly 210, a sensor 220 and an FPC 230, the sensor 220 is attached to the steel sheet assembly 210, the FPC 230 is connected to the sensor 220, the FPC 230 extends outside the receiving groove 140, and the other end of the FPC 230 is connected to the electrical connector 240.

[0033] Optionally, the steel sheet assembly 210 in this embodiment includes a supporting steel sheet 211, a connecting steel sheet 212, an elastic arm steel sheet 213 and a cavity steel sheet 214. The supporting steel sheet 211 is connected to the elastic arm steel sheet 213 via the connecting steel sheet 212. The elastic arm steel sheet 213 and the cavity steel sheet 214 cooperate to form an installation cavity 2100. The sensor 220 is disposed in the installation cavity 2100.

[0034] Among them, the sensor 220 can be a module FPC printed with pressure-sensitive ink. The sensor 220 is attached to the elastic arm steel sheet 213 through the hot pressing adhesive 201. The sensor 220 can sense the micro-deformation of the elastic arm steel sheet 213, and then generate a corresponding electrical signal to realize the feedback of the user's pressing; the cavity steel sheet 214 can be a C-shaped structure, which is welded to the elastic arm steel sheet 213 through the welding points 202 at the upper and lower ends; the elastic arm steel sheet 213 and the support steel sheet 211 are welded and fixed together through the connecting steel sheet 212 through the welding points 203, and the connecting steel sheet 212 is arranged on the opposite side of the FPC and located in the middle of the elastic arm steel sheet 213; deformation space 204 is arranged at both ends of the elastic arm steel sheet 213 (between the supporting steel sheet 211 and the elastic arm steel sheet 213), so that the elastic arm has a certain deformation space, but it will not deform too much to produce yielding and unable to rebound, and the deformation space 204 of the elastic arm steel sheet 213 mainly depends on the thickness of the connecting steel sheet 212.

[0035] Please also read Figure 2 as well as Figures 6 to 8 , Figure 6 This is a schematic diagram of the structure of an embodiment of the module waterproof bracket of the present application. Figure 7 is a schematic cross-sectional view of the structure of an electronic device in an embodiment of the present application, Figure 8 : is a schematic cross-sectional view of the structure of another position of the electronic device in the embodiment of the present application, wherein the module waterproof bracket 300 is covered at the opening of the receiving groove 140, and the module waterproof bracket 300 includes a support sheet 310 and a hard rubber part 320 and a soft rubber part 330 arranged on opposite sides of the support sheet 310. The support sheet 310 can be made of metal, and the hard rubber part 320 and the soft rubber part 330 can be integrally formed with the support sheet 310 by injection molding. The hard rubber part 320 is provided with a connecting block 321, and the connecting block 321 is provided with a module positioning column 322. The support steel sheet 211 is provided with a positioning hole 2110, and the module positioning column 322 is inserted into the positioning hole 2110.

[0036] The module waterproof bracket 300 is formed with a layer of silicone of reasonable thickness at the top by double-color injection molding to form a soft rubber part 330. A reasonable interference amount is set between the ribs around the soft rubber part 330 and the side walls around the module receiving groove 140 to prevent the glue (sealing glue layer 500) from flowing into the bottom and affecting the normal operation of the pressure sensing module; the glue (sealing glue layer 500) is applied around the module waterproof bracket 300, and the glue will fill the space between the module waterproof bracket 300 and the side wall of the installation groove and the space around the module FPC under the action of its own fluidity to achieve IPX8 waterproof requirements; the load-bearing shell 100 can also be provided with an overflow glue groove 144 on the left side of the pressure sensing FPC to facilitate the glue to flow to the side wall space of the FPC and the FPC avoidance groove 145 to ensure IPX8 waterproof requirements.

[0037] Optionally, in this embodiment, two positioning holes 2110 are provided at both ends of the supporting steel sheet 211, and two module positioning columns 322 are provided on the module waterproof bracket 300. The pressure sensing module 200 is assembled to the module waterproof bracket 300 through the gap between the positioning holes and the positioning columns, and is fixed by bonding with adhesive. Then, the pressure sensing module 200 and the module waterproof bracket 300 are assembled as a whole into the receiving groove 140 of the carrying shell 100, and the upper and lower ends of the module waterproof bracket 300 are pressed with a jig to press the module and the bracket as a whole into the bottom of the receiving groove 140 of the carrying shell 100, wherein the module waterproof bracket 300 can be bonded to the bottom of the receiving groove 140 by the module fixing adhesive 301. Among them, two positioning ribs can be set at the upper and lower ends of the module waterproof bracket 300 on the opposite sides of the supporting steel sheet 211, and a reasonable gap is set between the positioning ribs and the outer wall 141 of the accommodating groove 140, so that the module waterproof bracket 300 can squeeze the supporting steel sheet of the module to the inner wall 142 of the accommodating groove 140.

[0038] The two opposite ends of the hard rubber part 320 are provided with male buckles 323, and the two ends of the receiving groove 140 are provided with female buckles 143, and the male buckle 323 and the female buckle 143 are aligned and matched. The male buckle 323 of the module waterproof bracket 300 and the female buckle 143 of the receiving groove 140 are set with a reasonable buckling amount to prevent the bottom adhesive of the module waterproof bracket from loosening or falling after failure, resulting in poor waterproofing.

[0039] Optionally, see Figure 2 The sealant layer 500 is disposed in the gap between the module waterproof support 300 and the receiving groove 140. The sealant layer 500 may be formed by dispensing.

[0040] Please also read Figure 2 and Fig. 9 , Fig. 91 is a schematic diagram of the structure of an embodiment of a pressure-sensitive key of the present application, wherein the pressure-sensitive key 400 is inserted into the mounting hole 131 of the bearing housing and abuts against the pressure-sensitive module 200. Optionally, the pressure-sensitive key 400 includes a keycap 410 and a keycap silicone ring 420, and a keycap ring groove 411 is provided on the periphery of the keycap 410, and the keycap silicone ring 420 is arranged in the keycap ring groove 411. The keycap 410 can be bonded and fixed to the surface of the cavity steel sheet 214 of the pressure-sensitive module through the keycap backing glue 401.

[0041] Optionally, the keycap silicone ring 420 can be put on the keycap 410 by machine or manually, and a reasonable interference is set between the keycap silicone ring 420 and the side wall of the mounting hole 131 of the bearing shell 100 to prevent dust or foreign matter from entering the module mounting slot and affecting the module deformation and function; in addition, the keycap silicone ring 420 can also be provided with a dust storage groove 421, which is used to accommodate foreign matter from the outside entering the gap between the keycap 410 and the mounting hole 131. Optionally, two foolproof columns 412 can also be set on the keycap 410 to prevent the operator from assembling the keycap 410 upside down.

[0042] Optionally, see Figure 1 and Figure 3 The carrying shell 100 in the embodiment of the present application is provided with an opening 150 penetrating the first surface 110 and the second surface 120, and the FPC 230 is passed through the opening 150. The electronic device also includes an FPC bracket 600, which is buckled in the opening 150 for fixing the FPC 230. The connection area between the FPC bracket 600 and the opening 150 is sealed by glue 700.

[0043] Please also read Fig.10 and Fig.11 , Fig.10 This is a schematic diagram of the structure of an embodiment of the FPC bracket of the present application. Fig.11 It is a structural schematic diagram of the cooperation between the FPC bracket and the opening of the load-bearing shell, wherein the FPC bracket 600 in this embodiment includes a bracket buckle position 610 and a bracket hanging foot 620 of an integrated structure, the bracket hanging foot 620 is snapped into the second surface 120 (in the positioning groove 121), and the bracket buckle position 610 is buckled on the step surface 151 of the opening 150.

[0044] Among them, FPC230 passes through the opening 150 of the bearing shell 100 and extends to the other side of the shell to snap together with the small board BTB to achieve electrical connection. The opening 150 is fixed in position by the FPC bracket 600. The upper and lower ends of the FPC bracket 600 are provided with bracket buckles 610 to snap together with the step surface 151 of the opening 150 on the bearing shell 100 to prevent the FPC bracket from falling. A circle of glue 700 is applied around the FPC bracket 600. Under the action of its own fluidity, the glue will fill the space between the FPC bracket 600 and the opening 150 and the space around the FPC230 to achieve IPX8 waterproof requirements.

[0045] The pressure-sensitive key assembly structure of the electronic device in the embodiment of the present application transmits the user's pressing force to the pressure-sensitive module through the keycap, and the elastic arm steel sheet of the pressure-sensitive module is deformed. The pressure-sensitive ink (sensor) on the module FPC generates an electrical signal after sensing the deformation. The FPC is connected to the PCB board through the BTB and transmits the electrical signal to the processor to realize the recognition and grading of the user's pressing force, which then corresponds to different application scenarios and camera functions.

[0046] Among them, the pressure-sensing module is assembled and fixed to the module waterproof bracket through positioning holes and adhesive bonding; the waterproof bracket and the module as a whole are then fixed to the receiving groove of the supporting shell through adhesive bonding. A reasonable gap or interference amount is set between the positioning ribs at the upper and lower ends of the waterproof bracket and the outer wall of the receiving groove, so that the waterproof bracket can squeeze the supporting steel sheet to the inner wall of the receiving groove, so that the waterproof bracket can push the supporting steel sheet to a gap close to zero with the inner wall of the receiving groove, so that the module supporting steel sheet will not deform or shake when the user presses the keycap. This assembly sequence is reasonable and easy to operate, and the module, bracket and shell are fixed by adhesive and positioning ribs, so the supporting steel sheet is less deformed, and there is less virtual space when the user presses the keycap. The pressure-sensing key assembly structure is simple, easy to assemble, reliable, and has obvious cost advantages.

[0047] Furthermore, the present application also provides an electronic device. The electronic device in this embodiment may include a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. This embodiment is described by taking a mobile phone as an example. Fig.12 and Fig.13 , Fig.12 is a structural diagram of an embodiment of the electronic device of the present application, Fig.13 yes Fig.12 The electronic device in this embodiment is a schematic cross-sectional view of the structure at DD. The electronic device in this embodiment may include a display screen module 30, a carrying shell 100, a control circuit board 20 and a back cover 40. The carrying shell 100 may be the structure in the above embodiment.

[0048] Optionally, the display screen module 30 and the back cover 40 are respectively matched with the bearing housing 100 to form an accommodating space 1000, and the control circuit board 20 is disposed in the accommodating space 1000. The control circuit board 20 is electrically connected to the display screen module 30, and the control circuit board 20 is used to control the display screen module 30. The detailed technical features of the other parts of the electronic device are within the scope of understanding of those skilled in the art and will not be repeated here.

[0049] See also Fig.14 , Fig.14 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.

[0050] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0051] The electronic device in this embodiment can achieve waterproofing of the pressure sensing module by designing a module waterproof bracket structure and combining it with a sealant layer, and has the characteristics of simple structure and easy assembly.

[0052] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: The bearing shell comprises a first surface, a second surface and a side surface connecting the first surface and the second surface, the first surface is provided with a receiving groove extending toward the second surface, the side surface is provided with a mounting hole, and the mounting hole is communicated with the receiving groove; A pressure sensing module is disposed in the receiving groove; A module waterproof bracket, covering the opening of the receiving groove; A sealing adhesive layer, provided in the gap between the module waterproof support and the receiving groove; The pressure-sensitive button is inserted into the mounting hole and abuts against the pressure-sensitive module.

2. The electronic device according to claim 1, characterized in that: The pressure sensing module includes a steel sheet component, a sensor and an FPC. The sensor is attached to the steel sheet component. The FPC is connected to the sensor and extends out of the accommodating groove.

3. The electronic device according to claim 2, characterized in that: The steel sheet assembly includes a supporting steel sheet, a connecting steel sheet, an elastic arm steel sheet and a cavity steel sheet. The supporting steel sheet is connected to the elastic arm steel sheet through the connecting steel sheet. The elastic arm steel sheet cooperates with the cavity steel sheet to form an installation cavity. The sensor is arranged in the installation cavity.

4. The electronic device according to claim 3, characterized in that: A deformation space is formed between the supporting steel sheet and the elastic arm steel sheet.

5. The electronic device according to claim 3, characterized in that: The module waterproof bracket includes a support plate and a hard rubber part and a soft rubber part arranged on opposite sides of the support plate, the hard rubber part is provided with a connecting block, the connecting block is provided with a module positioning column, the support steel plate is provided with a positioning hole, and the module positioning column is inserted into the positioning hole.

6. The electronic device according to claim 5, characterized in that: The opposite ends of the hard rubber part are provided with male buckles, the receiving groove is provided with female buckles, and the male buckles are aligned and matched with the female buckles.

7. The electronic device according to claim 1, characterized in that: The pressure-sensitive key comprises a keycap and a keycap silicone ring. A keycap ring groove is arranged on the outer periphery of the keycap, and the keycap silicone ring is arranged in the keycap ring groove.

8. The electronic device according to claim 7, characterized in that: The keycap silicone ring is provided with an ash storage groove, and the ash storage groove is used to accommodate foreign matter that enters the gap between the keycap and the mounting hole from the outside.

9. The electronic device according to claim 2, characterized in that: The bearing shell is provided with an opening penetrating the first surface and the second surface, the FPC is passed through the opening, the electronic device further comprises an FPC bracket, the FPC bracket is buckled in the opening for fixing the FPC, and the connection area between the FPC bracket and the opening is sealed by glue.

10. The electronic device according to claim 9, characterized in that: The FPC bracket includes a bracket buckle position and a bracket hanging foot of an integrated structure, the bracket hanging foot is clamped on the second surface, and the bracket buckle position is buckled on the step surface of the opening.

Images